MEMS?
M ICRO
E LECTRO
M ECHANICAL
S YSTEMS
Components Size: 0.1~100µm Device Size: 20µ~1mm
Device size after packaging: Few centimeters.
For NEMS (NanoElectroMechanicalSystems):
Size: 0.1nm – 100nm
1
HISTORICAL BACKGROUND
December 26,1959: “There is plenty of room at the
bottom”-Famous statement of Richard Feynman.
1969, Harvey C. Nathanson invented the “Resonant Gate
Transistor”-The First MEMS Device in History
1970s, Bulk-etched silicon wafers used as pressure
sensors
1970,First silicon accelerometer demonstrated by Kulite
1989, Lateral comb drive by Prof. Howe,Tang, Nguyen
In early 1990s, Government agencies like AFOSR(UK),
DARPA(USA) start large MEMS support programs.
1993, First surface micromachined accelerometer sold
These are some of the most important historical events on which
our current
development of MEMS is based on.
WHY MEMS?
PRIMARY ADVANTAGES:
Miniaturization Of existing devices
System Integration
Self Test Feature/On-Chip Test
Low noise
Microelectronics vs MEMS
Microelectronics MEMS
Few variety of device Large variety of device
structures structures
Huge no. of electrical signal System Integration of small
based elements no. of both electrical and
mechanical energy signal
based elements
Structures are generally solid
and compact Structures have
holes/cavities ,membranes,ca
ntilevers etc
Basic materials used are silicon
and metal along with some
dopants Al,B,Petc Besides Silicon and metals,
glass, quartz, polymers etc
MEMS STRUCTURAL
DOMAIN
MEMS/Micro-
systems
Sensors Electronic Signal
processing
circuits
Actuators
ENERGY CONVERSIONS:
Based on Energy Conversion, MEMS can be
classified into three primary categories:
I. Electrical to Mechanical Energy conversion. eg MEMS
Switches
II. Mechanical to Electrical Energy conversion. eg Inertial
Sensors(accelerometers)
III. Electrical Mechanical Energy conversion. eg
MEMS Resonators.
MEMS APPLICATIONS
Mechanical
Accelerometer
Biological/ Gyroscope
Storage
Bio- Micro Gears Devices of
chemical
Lab on a chip Display Technology Micro Gripper 4Tb/[Link]
Endoscopy Digital Micro Mirror Pressure Sensors
capsule Device(DMD)
Micro Lens Space
Drug delivery
Microthrusters for
DNA
analysis Micro-satellites/Nano-
Gas Sensors satellites
Wireless
Printing Communication
Inkjet Printer RF Switches
Head Filters
Power
sensors
Phase
shifters
DEVICE STRUCTURES
MEMS ACCELEROMETERS
Devices measuring acceleration are known as Accelerometers.
Types Of Accelerometers:
Piezoresistive Accelerometer
Capacitive Accelerometer
Tunneling Accelerometer
Piezoelectric Accelerometer
Optical Accelerometer
CAPACITIVE
ACCELEROMETER
In bulk micromachined
capacitive accelerometers,
the sensing element
typically comprises of a
proof mass which can move
freely between two fixed
electrodes.
The fixed electrode forms
a capacitor with the seismic
mass which acts as a
common centre electrode
Capacitive accelerometers continued………….
The differential change in
capacitance between the
capacitors is proportional to the
deflection of the seismic mass
from the centre position.
In the structure,C1 is the
capacitance formed between the Cantiliver structure
upper electrode and the seismic
mass. C 2 is the capacitance
between the lower electrode and
the seismic mass.
Capacitive accelerometers continued……
Different Structures:
Capacitive accelerometers
continued…………
ADVANTAGES:
• Very Low Temperature Sensitivity
• High Output Levels
• High Linearity
CHALLENGES:
To Reduce The Sensitivity related to the Parasitic
Capacitances and Electromagnetic Interference.
To Reduce The Complexity of the Signal Processing
Electronics
BIOMEMS
(MEMS APPLIED TO BIOMEDICAL
APPLICATIONS)
RECENT IMPORTANT RESEARCH AND DEVELOPMENTS:
ENDOSCOPY WITH “LAB ON A PILL”
Photography
Swallowed like any normal pill
Transmit meaningful data like temperature, pH levels etc wirelessly
to a data card attached to the wrist of the individual
Entire view of small intestine
biomems continued……….
LAB-ON-A-CHIP (MICROFLUIDIC)
Integrate single/multiple laboratory
functions on a single chip
Capable of handling microfluids (extremely
small fluidic volumes)
biomems continued………………………
Diagnostic kit for
Tuberculosis
ANTIGEN 85
PIEZO RESISTIVE MATERIAL
ANTIBODY
CANTILEVER
GOLD COATING
BRIDGE
CIRCUIT DISPLAY
The biorecognition element i.e. antibody is highly specific to the target species
Increase in the adsorbed mass of antigen 85 complex causes the bending of the
microcantilevers
biomems continued…….
MICROFABRICATED NEEDLES – DRUG DELIVERY WITHOUT
PAIN
MEMS enables hundreds of
hollow microneedles to be
fabricated on a single patch of
area
Drug is delivered to the body
using micropumps
MEMS CAD TOOLS
COVENTORWARE
ANSYS MULTIPHYSICS
COMSOL MULTIPHYSICS
INTELLISUITE
FABRICATION TECHNOLOGY
BASIC FABRICATION TECHNOLOGIES FOR MEMS:
Photolithography
Generally used for
Deposition Microelectronics
fabrication
Etching Process
Surface Micromachining
Bulk Micromachining
DRIE Micromachining Micromachining
LIGA
Wafer Bonding (Bulk + Surface)
SURFACE MICROMACHINING
The technology is based on depositing and etching Sacrificial and
Structural films.
Important steps:
a) Sacrificial Layer is deposited
b) Masking using Photoresist/Photolithography
c) Structural layer deposited
d) Etching and release
BULK MICROMACHINING
Bulk micromachining defines structures by selectively etching
inside a substrate. Whereas surface micromachining creates
structures on top of a substrate, bulk micromachining produces
structures inside a substrate.
Two types:
1. Isotropic
2. Anisotropic
Bulk micromachining continued……………..
Isotropic: Vertical and Lateral etch
rates are almost equal
Isotropic
Anisotropic: Only Vertical etching
but no lateral etching.
Degree Of anisotropy:
Af = 1- (Rl/Rv)
Rl Lateral etch rate
Rv Vertical etch
Anisotropic
DRIE/LIGA/WAFER BONDING
DRIE: ( Deep Reactive Ion Etching)
Share features from both Surface and Bulk micromachining
Uses high density Plasma
Much more Complex Structures built
LIGA: (X-ray Lithographic Galvanoformung Abformung )
Word derived from German acronym
It means X-ray Lithography,Electrodeposition and Molding
Technology developed in 1982 for fabrication of micro-sized
separation nozzles for nuclear power production
WAFER BONDING:
Assembly technique where two or more precisely aligned wafers
are bonded together to create multi-level devices
Three types: a) Fusion Bonding(Si-Si)
b)Anodic Bonding(Si-Glass)
c)Eutectic Bonding(Si-Gold)
LIGA FOR HARMEMS
LIGA is used for High Aspect Ratio(>100) MEMS (HARMEMS) upto 1000µm ta
Very expensive Synchroton Radiation Source for X-Ray Beam
LIGA continued……………
LIGA continued……………
MEMS PACKAGING
Packaging is the protective
housing with an enclosure to hold
the MEMS chip
Beside shielding, it also provides
necessary electrical and fluidic
connectivity with the external Packaged mems
accelerometer
world
Mems packaging continued………..
mems packaging continued……….
Three categories of materials:
CERAMIC:
Hard and Brittle non-metallic eg.
Al 2O3
Completely customizable for fluid
based MEMS
Expensive
METAL:
Robust and easy to assemble
Satisfy the Pin-Count requirements
Prototyped into relatively smaller
volumes
Most expensive
MOLDED PLASTIC:
Unlike ceramic/metal, it is not Hermetic
Very Less Expensive
Two approaches:-
a) Pre-molding: The chip is attached to a supporting metal sheet
over which plastic was previously molded
b) Post-molding: The plastic is molded after chip is attached to a
metal sheet
Mems packaging continued……….
Materials used for various components: