Pillai College of Engineering

Department of Mechanical and

Automobile Engineering

Nano Manufacturing
Techniques and Micro-
Machining
MODULE 4
Dr. Richa
Conte
nt
Nano Manufacturing techniques and micro-
machining: High speed machining and
hot machining. Introduction to
microfabrication for MEMS, bulk
micromachining of silicon, surface
micromachining of MEMS, wafer bonding
for MEMS, LIGA process, micromachining
of polymeric MEMS devices, 3D
microfabrication.
Introducti
onMicro machining is used to create parts of size in
◻

the order on 10-6 meters.

◻
Material removal from workpiece in microns
is also considered as micromachining.
◻
It is used to create Micro Electro-mechanical
systems (MEMSs Devices), Integrated circuits
etc.
◻
Micromachining includes modified traditional
machining process such as turning, milling,
laser machining etc.
◻
Unit metal removal and equipment precision are
the key
factors for micromachining.
◻
Used for fabricating micro-channels, drug delivery
systems and micro-probes in biotechnology
applications.
Classification of Micro
machining
Nano
Fabrication
◻
Sub micro (1µm - 100nµ) and nanostructures (100-1
nm range)
◻
For studying the electrical, magnetic, optical,
thermal and mechanical properties of matter at the
nanometer scale.
◻
Quantum-mechanical phenomena (eg.
Conductancequantization, bandgap modification,
coulomb blockade, etc.)
◻
Improvements in the performance of
electronic/optical
devices and sensors.
◻
Nm-sized transistors
◻
Optical sources and detectors having nm-size
dimensions exhibit lower threshold current,
improved dynamic behavior and improved emission
line width in quantum dot lasers).
◻
Nano
Fabrication
Top-down approach - starts with a bulk or
thin-film material and removes selective
region to fabricate nanostructures (similar to
micromachining techniques).

Bottom-up approach - relies on molecular

recognition and self-assembly to fabricate
nanostructures out of smaller building blocks
(molecules, colloids and clusters similar to
standard lithography and micromachining
techniques, chemical engineering and
material science)
Need of Micro Machining and
Nano Fabrication
For high tech, fast progressing industries
◻
Complex 3D components (Turbine Blades)
◻
Micro Scale Features (filters having sieve
size of few microns and high in number)
◻
Superior properties of materials (High
strength, corrosion resistant, High heat
resistance, high hardness, etc)
◻
Nano and micro level surface finish
(turbulated cooling holes in a engine,
dies and turbine blades)
◻
Microfluidic Channels (glass, quartz &
ceramics)
Challenge
s
◻
High cost processes equipments
used for research only.
◻
Highly sensitive to environmental
conditions.
◻
For uniform and mass production
strict standardization is required.
◻
Characterization of micro and nano-
materials in metrology is highly
expensive.
◻
Micro tool holders and tool manu
manufacturing is expensive.
Hot
machining
◻
Hot machining is the procedure that is
used for easy machining and to reduce
the issues of low cutting rates, feeds and
heavy loads on the machine.
◻
This issue emerges when the machining
process is being done on new and hard
materials.
◻
The hot machining is done on the surface
of the workpiece, is preheated to a
temperature near the recrystallization
temperature, to improve the cutting rates,
feeds and to reduce heavy loads on the
machine.
◻
By heating, the shear resistance of the
work
Hot
machining
Hot
machining
Advantages of Hot Machining
◻
Easy Chip Formation
◻
Reduced Vibration to the tools
◻
Better surface finish of the
workpiece
Disadvantages of Hot Machining
◻
Micro Structure of the workpiece
may get disturbed to localised
heating.
Precaution
◻
Heat generated should be localized
◻
Hot
machining
Conditions to be satisfied by heating
arrangement
◻
It must be easy to setup and
control
◻
Heat input rate must be very high such
that the workpiece gets heated up
instantly.
◻
The heat generated should heat only
near the
machining zone as in case if heat
penetrates to more depths then more
heat affected zone will come into
existence.
◻
Hot
machining
Methods of heat generation
◻
Flame heating
◻
DC arc welding
◻
Plasma arc welding
◻
Furnace heating
◻
Radio frequency resistance
heating
◻
Induction heating.
High Speed Machining
(HSM)
◻
HSM is an advanced and emerging
machining technique employed
universally to machine complex parts
with high productivity, improved
quality, sustainability, and economy.
◻
Initially, HSM was developed to
machine missile and aircraft
components made up of aluminum
and its alloys.
◻
HSM can be defined as using cutting
velocity that is notably higher than
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those utilized in conventional
High Speed Machining
(HSM)
Advantages:
◻ Higher productivity and metal removal rate (MRR)
◻ HSM has low manufacturing cost
◻ Dimensional accuracy and precision
◻ Excellent Surface finish and quality
◻ Eliminates the unnecessary steps such as assembly, finishing
and
polishing operation required earlier to meet the desired
requirements
◻ Microscale and precision manufacturing
◻ Eco-friendly process: HSM eliminates the need for
cutting fluids and
prefer dry
cutting.
◻ Versatility applications
High Speed Machining
(HSM)
Advantages:
◻ Low cutting forces and stress-free components: Due to the
shallow
depth of cut, there is reduction in damaged layer of the
machined
and
part can generate virtually stress-free
components.
◻ Improved tool life: Due to very low temperature of the
workpiece and
tool, short engagement time of cutting edge due to higher
cutting speed
and shallow depth of cut. Therefore, very less time for heat
propagation
results in improved
tool life.
◻ Lower tool deflection: Due to short engagement time of
cutting edge
and less impulse force on the
tool
MEMS
Micro-ElectroMechanical
Systems
 AM -
MEMS
The application of AM techniques to
MEMS requires higher accuracy than
what is normally achievable with
commercial RP equipment.
◻
Laminated object manufacturing
(LOM), fused deposition modeling
(FDM), and selective laser
sintering (SLS) all must be
excluded as microfabrication
candidates on that basis.
◻
Only stereolithography has the
potential to achieve the
fabrication tolerances required to
qualify as a MEMS tool.
◻
Latest enhancements that have
Photolithograp
hy
The purpose of photolithography is to
create small structures or features on
a silicon wafer using photoresist.
Features are made out of photoresist
by etching with UV light.
Photolithography uses this general
process:
◻
Wafer priming
◻
Spincoating
◻
Prebaking
◻
Exposure
◻
Development
Photolithograp
hy
Requires
◻
Excellent understanding of the
intended application
◻
Different manufacturing options
◻
Materials Properties and
◻
Scaling Laws
3D structures includes
◻
Sensors
◻
Actuators
◻
Microcomponents
◻
Microsystems
 Photolithograp
◻
hy
An oxidized wafer (A)
is coated with a 1µm
thick negative
photoresist layer (B).
◻
After exposure (C), the
wafer is rinsed in a
developing solution or
sprayed with a spray
developer, which
removes the unexposed
areas of photoresist and
leaves a pattern of bare
and photoresist-coated
oxide on the wafer
surface (D).
◻
The photoresist
pattern is the
negative image of the
 Photolithograp
◻
hy
The wafer is placed in a
solution of HF or HF +
NH4F, meant to attack the
oxide but not the
photoresist or the
underlying silicon (E).
◻
The photoresist protects the
oxide area it covers.
◻
Once the exposed oxide has
been etched away, the
remaining photoresist can
be stripped off with a strong
acid such as H2SO4 or an
acid oxidant combination
such as H2SO4- Cr2O3,
attacking the photoresist
but not the oxide or the
silicon (F).
◻
Photoresi
st
The stencil used to repeatedly generate a desired pattern
on resist- coated wafers is called a mask.
There are two types of photoresist:
• Positive: Exposure to UV light removes resist
• Negative: Exposure to UV light maintains resist

Mask

Positive Negative
Resist Resist
Photoresi
stThe stencil used to repeatedly generate a desired
•

pattern on resist-coated wafers is called a mask.

•
A photomask-a nearly optically flat glass (transparent to
near ultraviolet (UV]) or quartz plate (transparent to
deep UV) with an absorber pattern metal (e.g., an 800-
À-thick chromium layer) is placed in direct contact with
the photoresist-coated surface, and the wafer is
exposed to UV radiation.
•
The absorber pattern on the photomask is opaque to
UV light,
whereas glass and quartz are transparent.
•
The absorber pattern on the mask is generated by e-
beam lithography, a technique that produces higher
resolution than photolithography.
•
A light field or dark field image, known as mask
polarity is then
transferred to the semiconductor surface.
•
This procedure results in a 1:1 image of the entire mask
MEMS
Micromachining
Surface
Micromachining
 Surface
Micromachining
◻
Structural and sacrificial layers are
deposited, patterned and etched on
top of a substrate
sacrificial layers provide between structural layers to provide
spacing
◻
Structures have low aspect ratios (short
& wide)
◻
Based on CMOS manufacturing
(CMOS - complementary metal oxide semiconductor)
◻
A micromechanical part is formed
out of deposited thin films
Surface
Micromachining
◻
A sacrificial layer, also called a spacer layer or base, is
deposited on a silicon substrate coated with a dielectric
layer a buffer/isolation layer
◻
Phosphosilicate glass (PSG) deposited by LPCVD stands out
as the best material for pine sacrificial layer, because it
etches even more rapidly in HF than SiO2.
◻
To obtain a uniform etch rate, the PSG film must be
densified by heating the wafer to 950 to 1100°C in a
furnace or a rapid thermal annealer (RIA).
◻
Windows are opened up in the sacrificial layer, and a
microstructural thin film (whether consisting of polysilicon,
metal, alloy, or a dielectric material) is conformably
deposited over the patterned sacrificial layer.
◻
Furnace annealing, in the case of polysilicon at 1050°C in
nitrogen for one hour, reduces stress stemming from
thermal expansion coefficient mismatch and nucleation
and growth of the film.
Surface
Micromachining
◻
Rapid thermal annealing has been found
effective for reducing stress in polysilicon as
well.
◻
With a second mask, the microstructure layer is
patterned, usually by dry etching in a CF4 + O2, or
a CF3C1 + Cl2 plasma.
◻
Finally, selective wet etching of the sacrificial layer,
say in 49% HE, leaves a freestanding
micromechanical structure.
◻
The surface micromachining technique is applicable
to combinations of thin films and lateral
dimensions where the sacrificial layer can be
etched without significant etching or attack of the
microstructure, the dielectric, or the substrate.
◻
Typically, a surface micromachining stack may
contain a total of four to five structural and
sacrificial layers, but more are possible.
Bulk
Micromachining
◻
Removes the
“bulk” of a
material
◻
Subtractive
process
◻
Micro-
machined
structures
formed into
the wafer
substrate
◻
Bulk
Micromachining
◻
3D MEMS device within substrate
◻
Selective anisotropic etch
◻
High volume manufacturing such as
sensors
◻
Bulk micromachined devices typically
◻
Etch high aspect ratios
have Pressure
Sensor
□
structural layers
□
sacrificial layers
◻
Bulk dry or wet
etching of
relatively large
amounts of
silicon substrate Microfluidic
Surface Micromachining & Bulk
Micromachining
◻ Surface micromachining uses a succession of
thin film and selective etching whereas bulk
deposition
micromachining
defines structures by selectively etching inside a
substrate.
◻ Surface micromachining creates structures on
top of a whereas bulk micromachining produces
substrate
structures
inside a
substrate.
◻ Components made by SM have aspect ratio 10:1
whereas
by BM can that
have aspect ratio
100:1

Bulk Surface
Surface Micromachining &
Bulk Micromachining
Surface Micromachining & Bulk
Micromachining
 LIG
A
◻
German acronym for Lithgraphie (lithography) ,
Galvanoformung (electroforming) , Abformung
(molding)
◻
It involves a thick layer of resist (from micrometers to
centimeters), high-energy x-ray radiation, and
development to make a resist mold.
◻
By applying galvanizing techniques, the mold is filled with a
metal.
◻
The resist structure is removed, and metal products result.
◻
Alternatively, the metal part
itself can serve as a mold for
precision plastic injection
molding.
◻
LIGA enables new building
materials and a wider dynamic
range of dimensions and possible
shapes.
◻
 LIG
A
◻ Additive process
◻ HARMST - High Aspect Ratio Microstructure
technology
◻ Structures have good precise dimensions and good
surface roughness.
CMP - Chemical Mechanical Polishing
PMMA - Poly(methyl methacrylate Plexiglas and acrylic.
LIG
A

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