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VLSI Design: MOS Transistor Non-Ideal Effects

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0% found this document useful (0 votes)
14 views14 pages

VLSI Design: MOS Transistor Non-Ideal Effects

Uploaded by

manansakhiya3112
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as PPTX, PDF, TXT or read online on Scribd

ECE 3002- VLSI Design

Module 1 – MOS Transistor Theory


Non Ideal Effects

Dr. S. Umadevi
Associate Professor,
SENSE, VIT Chennai
Introduction
 The saturation current increases less than quadratically with
increasing Vgs
 Velocity saturation
 Mobility degradation
 Channel length modulation
 Body Effect
 Leakage currents
 Sub-threshold conduction
 Junction leakage
 Tunneling
 Temperature Dependence

2
Channel Length Modulation
 The reverse biased p-n junction between
the drain and the body forms a depletion
region with length L’ that increases with
Vdb. The depletion region effectively
shorten the channel length to: Leff = L – L’

 Assuming the source voltage is close to


the body votage Vdb ~ Vds. Hence,
increasing Vds decrease the effective
channel length.

 Shorter channel length results in higher


current
3
Velocity Saturation
• Carriers in semiconductors typically move in response to an applied electric field.
• Carrier velocity is proportional to an applied electric field
• Velocity = mobility x electric field
• At very high electric fields this relationship ceases to be accurate
• The carrier velocity stops increasing (or saturates) in a one micrometer channel
length device with one volt across in the electric field is 104 V/cm.

5
Mobility degradation
Body Effect
 The potential difference between source and body Vsb <
0V -> leaves –ve ions -> increases channel width -> which
forces to increases the threshold voltage of the device.

 Threshold voltage depends on:
 Vsb
 Process
 Doping
 Temperature

7
Threshold Voltage
Vt
• increases with the source voltage,
• decreases with the body voltage,
• decreases with the drain voltage, and
• increases with channel length

8
Leakage Current

9
Subthreshold Conduction
 The ideal transistor I-V model assumes current only flows from
source to drain when Vgs > Vt.
 In real transistors, current doesn’t abruptly cut off below threshold,
but rather drop off exponentially
 This leakage current when the transistor is nominally OFF depends
on:
 process (eox, tox)
 doping levels (NA, or ND)
 device geometry (W, L)
 temperature (T)
 ( Subthreshold voltage (Vt) )

10
Junction Leakage
 The p-n junctions between diffusion and the substrate or well for
diodes.
 The well-to-substrate is another diode
 Substrate and well are tied to GND and VDD to ensure these diodes
remain reverse biased
 But, reverse biased diodes still conduct a small amount of current
that depends on:
 Doping levels
 Area and perimeter of the diffusion region
 The diode voltage

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Tunneling
 There is a finite probability that carriers will tunnel though the gate
oxide. This result in gate leakage current flowing into the gate
 The probability drops off exponentially with tox
 For oxides thinner than
15-20 Å, tunneling becomes a factor

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Temperature dependence

 Transistor characteristics are influenced by temperature


 m decreases with T
 Vt decreases linearly with T
 Ileakage increases with T
 ON current decreases with T
OFF current increases with T
 Thus, circuit performances are worst at high temperature

13
Thank You

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