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Stain Rework Procedure Instructions

The document discusses stain on wafers that cannot be cleaned using wet bench cleaning alone. There are different types of stains that require specific scrubbing methods based on the stain type. Scrubbing is done either at the P1 scrubbing station manually for light stains or at the lapping station using lapping for hard stains. The proposed scrubbing time is a minimum of 10 seconds per wafer, and production will allocate two people for scrubbing duties. Quality control will inspect the wafers after scrubbing.

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Vijay Rajaindran
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71 views4 pages

Stain Rework Procedure Instructions

The document discusses stain on wafers that cannot be cleaned using wet bench cleaning alone. There are different types of stains that require specific scrubbing methods based on the stain type. Scrubbing is done either at the P1 scrubbing station manually for light stains or at the lapping station using lapping for hard stains. The proposed scrubbing time is a minimum of 10 seconds per wafer, and production will allocate two people for scrubbing duties. Quality control will inspect the wafers after scrubbing.

Uploaded by

Vijay Rajaindran
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PPTX, PDF, TXT or read online on Scribd

Stain

1) Stain is the defect that can’t be clean using Wet bench cleaning alone
2) We need to use scrubbing method to clean the stain on the wafers
3) However, there is few types of the stain and the scrubbing must be done base
on the types of the stain

White spot
Whitish Dual Tone
Scrubbing
Location :
a) P1 scrubbing station – Manual and rework light stain
b) Lapping Station – Lapping and rework hard stain

Material :
Rework hard stain - Boron carbide scrubbing
Rework light stain - Detergent scrubbing

Time proposed : Min 10sec per wafers

Man : Production will allocates 2 person for scrubbing

Inspection : QC
Rework Flow

Light Stain (Post P2) Hard Stain (Post Anneal)

Detergent Scrubbing Boron carbide Scrubbing

WD1 WD0

Inspect Inspect

P2 Rework Annealing

Tropel
Scrubbing Time – 10sec

P2 rework
Process Flow

Lapping Polishing Demount

Scrubbing + WD0 QC WD1 + WD3

QC WD0 QC

EG Annealing

WD0 QC

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