ACKNOWLEDGEMENT
The satisfaction and euphoria that accompany the successful completion of any task would remain
incomplete without acknowledging the people who made it possible. I take this opportunity to express
my sincere gratitude to the following individuals, whose unwavering belief in my capabilities, moral
support, and guidance played a pivotal role in every step of this endeavor.
First and foremost, I pay my humble pranams to His Holiness Jagadguru Sri Shivarthri
Deshikendra Mahaswamiji, the 24th Pontiff of Suttur Math and President of JSS Mahavidyapeetha,
Mysuru, for providing me the opportunity to pursue my postgraduate studies at JSS Science and
Technology University, Mysuru.
I wish to express my sincere gratitude to Dr. C. Nataraju, Principal (i/c) SJCE, Mysuru,and
Dean ( Engineering and Technology), JSS STU, Mysuru for his constant support towards my
academic endeavors.
I am deeply thankful to my guide Dr. U. B. Mahadevaswamy, Head of the Department of
Electronics and Communication Engineering, and my co-guide Prof. Rohith M. N., Assistant
Professor, Department of Electronics and Communication Engineering, for their timely suggestions,
valuable encouragement, and consistent support throughout the course of this project. I would also like
to express my sincere thanks to the PG Coordinator, Prof. Vinay Prasad M S., Assistant Professor,
Department of Electronics and Communication Engineering, JSSSTU, Mysuru, for his continuous
support and guidance.
My heartfelt thanks to the panel member Prof. Chandrashekar Murthy B. N. for their
constructive suggestions, continuous encouragement, and valuable guidance during every phase of this
project.
Finally, I am thankful to all the teaching and non-teaching faculty of the Department of Electronics
and Communication Engineering, SJCE, Mysuru, for their kind support and assistance.
I
ABSTRACT
This internship report presents a comprehensive study and practical exposure to industrial Printed
Circuit Board (PCB) design and manufacturing processes carried out at Circuitronica. The primary
objective of the internship was to understand the complete PCB development lifecycle, including
schematic capture, component library management, PCB layout design, routing methodologies,
Design for Manufacturability (DFM), Design for Assembly (DFA), and adherence to IPC
standards. The work involved designing single-layer, double-layer, and multilayer PCBs using
industry-standard Electronic Design Automation (EDA) tools, followed by Gerber file generation
and verification to ensure manufacturing accuracy.
The internship also provided hands-on exposure to fabrication processes such as photolithography,
CNC drilling, copper plating, solder mask application, and inspection techniques including
Automated Optical Inspection (AOI) and electrical testing. Emphasis was placed on signal
integrity, thermal management, cost optimization, and quality assurance practices followed in
industrial environments. This experience significantly enhanced technical competency, analytical
skills, and understanding of real-world engineering constraints, bridging the gap between
academic knowledge and practical implementation in modern electronics design.
Keywords: Printed Circuit Board (PCB), PCB Layout Design, Multilayer PCB, DFM/DFA,
IPC Standards, Gerber Files, PCB Fabrication, Signal Integrity.
II
CONTENT
Chapter No. Title / Section Page Numbers
Chapter 1 Introduction 1–5
1.1 Evolution of PCB 1
1.2 Company Profile 2
1.3 Internship Role Description 3
1.4 Internship Objectives 4
1.5 Organization of the Report 5
Chapter 2 Literature Review 6 – 12
2.1 Overview of PCB Design Concepts 6
2.2 PCB Manufacturing Standards 8
2.3 Design Tools and Technologies 11
Chapter 3 Internship Activities and Work Description 13 – 28
3.1 Week-wise Work Breakdown 13
3.2 Project Assigned 18
3.3 Workflow Details 21
3.4 Manufacturing Process Exposure 24
Chapter 4 Tools, Technologies and Standards Used 29 – 30
4.1 Software Tools 29
4.2 DFM and DFA Tools 29
4.3 Gerber Viewers 30
4.4 Simulation Tools 30
Chapter 5 Outcomes of Internship 31 – 33
5.1 Technical Skills Gained 31
5.2 Analytical and Problem-Solving Skills 33
5.3 Soft Skills Development 33
Chapter 6 Conclusion and Future Scope 34 – 36
6.1 Learning Experience 34
6.2 Future Scope 35
6.3 Career Prospects 35
References 37
III
LIST OF FIGURES
Figure No. Title of the Figure Page No.
Fig. 2.1 Generic PCB Design 9
Fig. 2.2 Land Pattern Design 10
Fig. 2.3 PCB without Copper Balance 10
Fig. 2.4 PCB with Copper Balance 11
Fig. 2.5 Gerber File Format 12
Fig. 3.1 Schematic Symbols 13
Fig. 3.2 PCB Footprint Creation 14
Fig. 3.3 PCB Layout Design 14
Fig. 3.4 Routing of PCB Boards 15
Fig. 3.5 Photolithography Process 24
Fig. 3.6 CNC Drilling Process 25
IV
LIST OF ACRONYMS
1. AOI – Automated Optical Inspection
2. AXI – Automated X-ray Inspection
3. BGA – Ball Grid Array
4. BOM – Bill of Materials
5. CAD – Computer-Aided Design
6. CNC – Computer Numerical Control
7. DFM – Design for Manufacturability
8. DFA – Design for Assembly
9. DRC – Design Rule Check
10. EDA – Electronic Design Automation
11. EMC – Electromagnetic Compatibility
12. EMI – Electromagnetic Interference
13. ERC – Electrical Rule Check
14. HDI – High-Density Interconnect
15. ICT – In-Circuit Testing
16. IPC – Institute for Printed Circuits (Association Connecting Electronics Industries)
17. IoT – Internet of Things
18. LVDS – Low-Voltage Differential Signalling
19. PCB – Printed Circuit Board
20. PDN – Power Distribution Network
21. PI – Power Integrity
22. QFN – Quad Flat No-leads
23. RF – Radio Frequency
24. SI – Signal Integrity
25. SMT – Surface Mount Technology
26. SMD – Surface Mount Device
27. THT – Through-Hole Technology
28. UV – Ultraviolet