Program 2025 Symposium on
VLSI Technology
Short Course 1 and Circuits
Key VLSI Technologies in the AI Era
Monday, June 9, 8:25-16:35
Chairpersons: S. Fujii, KIOXIA Corp.
A. Veloso, Imec
8:25
Opening
8:30
CMOS Scaling Exploration: Technology Trends and System-Level
Perspectives
L. Yang, TSMC Main Menu
9:20 Tech. Sessions
2D Materials and Their Application Space - Recent Insights Gained -
J. Appenzeller, Purdue Univ. Circ. Sessions
10:10
Author Index
Break
10:25
Heterogenous System Partitioning, the 2.5D and 3D Integration Landscape
and Roadmap
E. Beyne, imec
Program 2025 Symposium on
VLSI Technology
11:15 and Circuits
Etch and Materials Innovations for Advanced Logic and Memory Applications
T. Lill, Lam Research
12:05
Lunch
12:55
DRAM History and Challenges
Y. Matsumoto, Micron
13:45
Current Landscape and Future Outlook of Emerging Memory Technologies
S. G. Kim, SK hynix Main Menu
14:35
Tech. Sessions
Break
14:50 Circ. Sessions
DTCO/STCO for Multi-Objective Optimization from Device to System
H.-O. Kim, Samsung Author Index
15:40
Heterogeneous Integration Technologies for 3D Integrated CMOS Image
Sensors
Y. Kagawa, Sony
Program 2025 Symposium on
VLSI Technology
16:30 and Circuits
Closing
Short Course 2
Circuits and Systems for AI and Computing
Monday, June 9, 8:25-17:25
Chairpersons: T. Nezuka, MIRISE Technologies Corp.
V. Chen, Carnegie Mellon Univ.
Organizers: K. Nii, TSMC Design Technology Japan, Inc
Y. Li, Western Digital Corp.
Main Menu
8:25 Tech. Sessions
Opening
Circ. Sessions
8:30
Hardware Accelerator Design for AI: Enabling Efficient Generative Models
L. Chang, IBM
Author Index
9:20
Architecture Trends for AI Hardware Platforms
N. James, AMD
Program 2025 Symposium on
VLSI Technology
10:10 and Circuits
Break
10:25
Modular Chiplet Approaches for Scalable and Efficient Machine Learning
Z. Zhang, Univ. of Michigan
11:25
AI for EDA: Challenges and Opportunities
I. Markov, Synopsys
12:05
Lunch
Main Menu
12:55
Connectivity Technologies to Accelerate AI
Tech. Sessions
T. C. Carusone, Univ. of Toronto Alphawave Semi
13:45 Circ. Sessions
3D Optical Interconnect Design
F. Lee, TSMC Author Index
14:35
Break
Program 2025 Symposium on
VLSI Technology
14:50 and Circuits
HBM for AI Computing
J. Lee, SK hynix
15:40
Semiconductor Storage for Further Evolution of Generative AI
J. Deguchi, KIOXIA Corp.
16:30
Advancements in Power Architectures for AI Computing: The Role of
Intermediate Bus Converters and Hybrid Power Systems
K.-H. Chen, National Yang Ming Chiao Tung Univ.
Main Menu
Tech. Sessions
Circ. Sessions
Author Index