Amkor Confidential 1

Introduction Basic Reliability

Leomer Niviar| ATP Reliability Engineering

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 Introduction
• Quality is a measure of the device performing its specified function
when it is first used. It is a time zero measure (T=0)

• Reliability is the probability that a device will continue to perform its

specified function over time. It deals with time after installation (T>0)

• Used for
Quality
 Risk Assessment 0~1 yr
 Qualification
 Evaluation Reliability
 Monitoring 15yrs~

Reliability is a tool to ensure our customers that our product is on

top quality and passes industry standards*

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How to measure reliability of a device?
▶ By simulating the environment the device will undergo to. But how!?
▷ Main factors that are being controlled to do environmental stress test simulation
⨠ Temperature – introduce thermomechanical stress and accelerate chemical reaction
– Coefficient of Thermal Expansion ( CTE ) – degree change of dimensions after exposure to heat
– Material degradation / aging – wearing down / disintegration of material after exposure to heat

⨠ Humidity – introduce moisture ( water ) that promote electro-chemical reaction ( Oxidation / corrosion )
Note: Electrical bias also
promotes electro-chemical
reaction in combination with
moisture

Note: Pressure is another factor that represent an environment for a

device lifecycle but is seldom used depending on device application

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 Device life cycle
( On/Off ) Hot / Cold Temp
Board
Factory Shipment Mounting

High Moisture
Environment
 IC’s after assembly are shipped and Electronic
experience different environment before Device
unpacking then mounted to the electronic
device for actual use to go through its
lifecycle
RELIABILITY
Aging

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 MSL Detailed

MRT ( Moisture Resistance Test )

This test is performed to simulate environment from Dry packing, unpacking to PCB (Printed Circuit Note: Also called as MSL (
Purpose Board) Mounting. Moisture Sensitivity Level ) or
Preconditioning
Delamination Checking
Exposure to series of stress including baking( 125C - 24hrs ) to reset the moisture > TH Soaking to
Description
control moisture going inside the device to > multiple reflow to simulate board mounting process.
JEDEC MRT Level
MSL Standard Accelerated
Floor Life
Level Soak Requirement Soak Equivalent
MSL1 85C/85%RH - 168Hrs N/A Unlimited Note: Typical Readout
MSL2 85C/60%RH - 168Hrs N/A 1 Yr • SAT ( Delam checking )
MSL2A 30C/60%RH - 696Hrs 60C/60%RH - 120Hrs 4 weeks • Visual Inspection
MSL3 30C/60%RH - 192Hrs 60C/60%RH - 40Hrs 168Hrs • Electrical
MSL4 30C/60%RH - 96Hrs 60C/60%RH - 20Hrs 72Hrs
TH Soak MSL5 30C/60%RH - 72Hrs 60C/60%RH - 15Hrs 48Hrs
Test Conditions MSL5A 30C/60%RH - 48Hrs 60C/60%RH - 10Hrs 24Hrs
MSL6 30C/60%RH - Xhrs N/A X
EIAJ MRT Level
MSL Standard Accelerated
Floor Life
Level Soak Requirement Soak Equivalent
1J 85C/85%RH - 168Hrs N/A Unlimited Note: Some Accelerated
2J 85C/65%RH - 168Hrs N/A 1 Yr condition by customer are also
85C/30%RH-168Hrs + being done like MSL3A acc
3J N/A 1 week
30C/70%RH - 168Hrs Reflow Oven
Sn-Pb based Solder Reflow Defects / Failure mechanism seen after MSL
Thickness <350 mm3 = 350mm3
<2.5 mm 240°C 225°C ▷ Die crack
= 2.5 mm 225°C 225°C
▷ Package Crack / Popcorn effect
Pb free Solder Reflow
Thickness <350 mm3 350-2000 mm3 >2000 mm3 ▷ Interconnect ( wirebond, solder bump, etc. )
Reflow Condition <1.6 mm 260°C 260°C 260°C damage
1.6 - 2.5 mm 260°C 250°C 245°C
>2.5 mm 250°C 245°C 245°C ▷ Solder bridging
LTS ( Low Temp. Solder ) based reflow ▷ Open-short / electrical failure
Reference Documents:
All package thickness or volume 190°C ▷ Delamination JEDEC: J-STD-020
AWW Spec: 001 - 2531

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 TC Detailed

Temperature Cycle
This test is performed to simulate repeated high and cold environment experienced by the
Purpose
device throughout its life cycle.
Exposure to repeated change in temperature from hot to cold and vice-versa promoting
Note: Uses air-to-air
Description material expansion and contraction. The promotion of thermomechanical stress on each
as medium for heat
material will measure the individual and combined stregnth through its life cycle transfer
JEDEC TC conditionins
Condition - Temp ( ⁰C ) + Temp ( ⁰C ) CPH *Cycles per Hr.
A -55 85 2-3
B -55 125 2-3
C -65 150 2
G -40 125 <1 - 2
Note: Duration depends on TC Chamber TC Chamber
H -55 150 2 Elevator type Single Chamber type
application requirements and
Test Conditions I -40 115 1-3 from customer to customer
J 0 100 1-3
K 0 125 1-3 None Destructive
TC Condition
equivalent ( JEDEC )
L -55 110 1-3
M -40 150 1-3 C 10cyc
N -40 85 1-3 H 12cyc
R -25 125 1-2 B 20cyc
T -40 100 1-2 N 88cyc Die Crack Delamination Bondpad crack
Die crack
Package/ceramic crack Note: Typical Readout
Bond pad crack/damage • SAT ( Delam checking )
Ball/Stitch wire bond damages • Visual Inspection
Defect modes Lifted ball/stitch bonds • Electrical
• WPT ( Wire pull Test )
Solder Ball/Bump Crack • BST ( Ball Shear Test )
Delamination due to CTE mismatch • SPT ( Stitch Pull Test ) Reference Documents:
Open/short or electrical failure Only for Auto Cu JEDEC: JESD22-A104
Substrate/die metal shifts Stitch Crack Solder bump Crack AWW Spec: 001 - 3627

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Thermal Shock
This test is performed to simulate repeated sudden change of high and cold environment
Purpose
experienced by the device throughout its life cycle.

Note: Same as TC but

The device will be exposed to liquid-to-liquid temp. cycle testing that will simulate the rapid uses liquid-to-liquid
Description
change in temperature "Shock" as medium for heat
transfer

JEDEC Thermal Shock conditions

Note: Duration depends on
Condition - Temp ( ⁰C ) + Temp ( ⁰C ) application requirements and
from customer to customer
A -40 85
Thermal Shock Chamber
Test Conditions
B 0 100 ATV not capable
C -55 125
D -65 150
Die crack
Package/ceramic crack
Bond pad crack/damage Die Crack Delamination
Ball/Stitch wire bond damages
Defect modes
Lifted ball/stitch bonds
Delamination due to CTE mismatch
Open/short or electrical failure
Substrate/die metal shifts Reference Documents:
JEDEC: JESD22-A106
Internal Cracks AWW Spec: 001 - 3532
Stitch Crack Solder bump Crack

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 TH Detailed

Temperature Humidity ( TH )
This test is performed to simulate high moisture environment promoting Note: Same TH
Purpose soaking machine used
electrochemical reactions during MSL

The device will be exposed to controlled temperature and humidity.

Description Note: Typical Readout
Electrical bias on sample will accelerate/promote metal ion migration • Visual Inspection
• Electrical
JEDEC TH Condition • WPT ( Wire pull Test )
• BST ( Ball Shear Test )
Relative • SPT ( Stitch Pull Test ) Bias board for THB
Temperature Biased/ Only for Auto Cu
Humidity Remarks
( ⁰C ) Un-biased
( %RH )
Note: Duration depends on
85 85 Un-biased HTHH / Non-OPHS application requirements and Temp. Humidity Chamber
from customer to customer
Test Conditions 85 85 Biased THB / OPHS ( Type 1 )

85 15 Biased THB / OPHS ( Type 2 )

65 85 Biased THB / OPHS ( Type 2 )

Metal Ion migration
Bondpad / metallization corrosion
Mobile ionic contamination
EOS ( Electrical Over Stress )
Metal ion migration During biased testing
Defect modes
Open/Short Failure
Delamination due to contamination
Electrical Over Stress ( EOS ) Reference Documents:
Metal Ion migration
JEDEC: JESD22-A106
AWW Spec: 001 - 3532

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Highly Accelerated Stress Test ( HAST )
This test is performed to accelerate simulation of high moisture environment
Purpose promoting electrochemical reactions

The device will be exposed to controlled temperature ( above 100C - water Note: Having a
temperature over water
Description boiling point ) and humidity. boiling point accelerates
Electrical bias on sample will accelerate/promote metal ion migration chemical reaction making
the surface corrosion
JEDEC TH Condition faster

Relative
Temperature Biased/
Humidity Remarks
( ⁰C ) Un-biased Note: Duration depends on
( %RH ) application requirements and HAST Chamber
from customer to customer
Test Conditions Un-biased Leadframe
130 85
Biased based packages
Un-biased Substrate
110 85
Biased based packages
Bondpad / metallization corrosion Metal Ion migration
Mobile ionic contamination
Metal ion migration
Defect modes
Open/Short Failure
Delamination due to contamination Metallization Corrosion

Electrical Over Stress ( EOS ) Metal Ion migration

Reference Documents:
JEDEC: JESD22-A118
AWW Spec: 001 - 3626

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Pressure Cooker Test ( PCT ) / AutoClave Test
Moisture based stress test like TH and HAST but are used for Note: ATV uses the same
chamber as HAST
Purpose devices with special pressure and moisture environment
application

The device will be exposed to maximum humidity, controlled

Description
temperature and pressure.

Note: Standard duration is 96hrs

JEDEC PCT Condition or 192hrs HAST Chamber
No biased test to ensure
Relative higher pressure condition
Test Temperature
Humidity Pressure
Conditions ( ⁰C )
( %RH )

121 100 2 atm

Bondpad / metallization corrosion
Metal Ion migration Delamination
Mobile ionic contamination
Defect
modes Metal ion migration
Open/Short Failure
Delamination
Reference Documents:
Metal Ion migration
JEDEC: JESD22-A102
AWW Spec: 001 - 3009

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 HTS Details

High Temperature Storage ( HTS )

This test is performed to accelerate the aging process of each material in
Purpose the package
Note: Use same Oven for
The device will be exposed to higher temperature compared to just baking
Description
baking.
As a minimum the following items should be
JEDEC HTS Conditions taken into consideration:
Note: Duration depends on
application requirements and
Condition - Temp ( ⁰C ) 1) Melting point of metals present, especially
solder. Degradation of metals including
from customer to customer

A 125 metallurgical interfaces.

2) Package degradation. For example: glass
Note: Typical Readout
• Visual Inspection
• Electrical
Test
B 150 transition temperature and thermal stability (in
air) of any polymeric materials. • Cross Section
Oven

3) Moisture rating of package (per J-STD-020).

Conditions C 175 4) Temperature limitations of silicon devices.
For example: charge loss in nonvolatile
D 200 memories.
5) Test conditions (temperature, time) should
E 250 be selected to cover the acceleration of the
corresponding failure mechanism and the
F 300 anticipated lifetime (operational time) of the
device
Die crack
Excessive Inter-Metallic growth Excessive IMC Growth Die-Electric Breakdown Material Degradation
( EMC )
Oxidation
Bondpad / metallization corrosion
Defect modes
Die-electric Breakdown
Material degredation
Open/Short Failure Brittle break mode due
Delamination due to corrosion to corrosion Reference Documents:
Wire Corrosion JEDEC: JESD22-A103
Special case: Sulfur Corrosion on bare Cu wire AWW Spec: 001 - 2536

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Device life cycle
Board
Factory Shipment Mounting ( On/Off ) Hot / Cold Temp

1. Susceptibility to delamination and any

other early stage defects MSL High Moisture
Environment
Electronic
2. Material strength over time TC Device

TH/HAST
3. Susceptibility to moisture based corrosion /PCT

4. Susceptibility to material degradation HTS RELIABILITY

Aging

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Drop vs. Mechanical Shock Test Note: Typical Readout
• Visual Inspection
• Electrical

Drop Test Mechanical Shock Test

This test simulates free fall or dropping of device to determine weakpoint of the product This test simulates different kind of mechanical drop force that could happen on the package
Purpose Purpose

Using different tools to replicate different kind of mechanical force, the device will be dropped on different
Description The device will be dropped in a certain height with a guide to ensure impact position. Description
axis

Dimensions:
±X, ±Y, ±Z
Test Setup

Test Setup

Impact
Programmer

Impact Surface Acceleration

vs. Time Graph
Vinyl Concrete Steel
Plywood
(on top of concrete )

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Vibration Test
Vibration Test

Purpose This test to simulate vibrations from different vehicles from land, sea, and air.

Description The device will be subjected to different vibration durations for all dimensions

Test Setup

Simulation

Truck Air Sea Sinosoidal Random

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Force Test
Force Testing
This test simulates different kind of mechanical force ( compression, tensile, shear, bend, peel, etc. ) on the
Purpose
unit

Using different kind of fixture/tool, the equipment can replicate different mechanical environment the device
Description
will undergo to.

Test Setup

Simulation

Peeling Bending Compression Tensile

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Thank You

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 MSL main
Board Mounting Environment
Unpacking to Board Mounting Environment

Packed samples Unpacking Board mounting Delamination / Crack

( moisture = 0 ) ( moisture > 0 ) ( moisture = 0 )

MSL / MRT / Precondition Process.

Delamination

Bake TH Soaking 3x Reflow Post Test

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 MSL main

MSL Test Flow

Visual Inspection & Electrical test
Optional .
SAT Imaging Tests .
TC cycling Shipment Environment simulation

It is always an option to bake the package

Bake 125C 24hrs Moisture level reset prior board mounting to reset moisture level
2 hrs
within the package*

Soaking Moisture Level

( MSL level ) Factors that affect MSL level
4 hrs • Package Size
Reflow 3x • Package Construction
5 min Board mounting simulation
interval • Material Capability
( destructive )
Yes
EVI & Electrical w/ delam? Rel Assessment
No Window time ( 96 hrs can be extended to 288hrs )
SAT Imaging Reference Documents:
Next Stress Test
J-STD-020E

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 MSL main
Reference Documents:
Reflow J-STD-020F

3x Reflow – Simulates Board mounting environment.

– 1x Pass ( Initial board mounting )
– 2x Pass rework ( de-solder )
– 3x Pass rework ( re-solder )

Factors that affect Reflow peak temp

• Package Size
• Package Construction
• Material Capability
 Sn-Pb melting point – 183 °C
 Pb free solders melting point - 217 °C
 LTS melting point – 138 °C

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 MSL main
SAT ( Scanning Acoustic Tomography ) /
SAM ( Scanning Acoustic Microscopy )

Acoustic Micro-Imaging – nondestructive technique that uses varying transmission / reflection of acoustic signals
( sound waves ) over changes on density of a material
– used for detecting obvious defects like package crack, delamination, voids, etc.

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 MSL main

Pass or Fail Criteria Reference Documents:

J-STD-020E

Defects / Failure mechanism seen after MSL

• Die crack
• Package Crack
• Open-short / electrical failure
• Delamination ( will be further discussed on SAT Imaging )

Since solder melts during reflow,

delamination on components surface
could cause solder bridging

Recommended rel-assessment test by ATP is TC 500cyc to

apply mechanical stress on wire with delaminated area to check
for OS, package crack or wire tearing on stitch/downbond*

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 MSL main

MSL FAQs
▶ MSL1 means we can do board mounting whenever we can?
▷ No. Floor life is not equal to shelf life ( how long can we store units ).
▷ Shelf life for Amkor products is only 1yr.

▶ When do we suggest doing MSL?

▷ We suggest doing MSL to simulate delamination. Assess possible walking wounded
units from our assembly line.

▶ Why don’t we always do accelerated equivalent for MSL?

▷ Even though there are suggested accelerated levels. Study is still needed to support if
MSL level has equivalent impact on specific device
▷ Some customer propose to do just the destructive part ( 3x reflow ) and have a parallel
MSL for validation

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 TC Main

TC ( Temperature Cycling )
– Difference on ( CTE ) Coefficient of Thermal Expansion per material would promote
mechanical stress per material known as CTE mismatch

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 TC Main

TC ( Temperature Cycling )
Condition - Temp + Temp ΔT Defects / Failure mechanism seen after TC
• Die crack
A -55 85 140 • Package crack
B -55 125 180 • Bond pad crack/damage
• Ball/Stitch wire bond damages
C -65 150 215 • Lifted ball/stitch bonds
G -40 125 165 • Delamination due to CTE mismatch
• Open/short or electrical failure
H -55 150 205
ATP Standard TC condition
I -40 115 155 • TC C ( -65C/150C ) – lead frame packages
J 0 100 100 • TC H ( -55C/150C ) – for automotive application
– w/ longer duration
K 0 125 125 • TC B ( -55/125C ) recommended for substrate packages
L -55 110 165 • TC N ( -40/85 ) for devices that have sensitive temp.
M -40 150 190
N -40 85 125
R -25 125 150
T -40 100 140

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 TC Main
TC ( Temperature Cycling Computation )

where m=4
Using Coffin Maison’s equation:

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 TC Main

Temp. Cycling FAQs

▶ When to recommend use of TC?
▷ We recommend TC for mechanical related issue ( eg. Die crack, delamination, lifted wire
bond, interlayer shifts, etc )
▶ When do we use different TC condition?
▷ We could convert a TC condition to a more strict level and use an accelerated equivalent
▷ Note: Not recommended to have a temperature above +125C for laminate/substrate
packages
▶ Above TC 10cyc is already destructive, can we stack more?
▷ Some customer have different non-destructive equivalent until TC200 for some customer.
So we suggest check on respective customer.
None Destructive
TC Condition
equivalent ( JEDEC )
C 10cyc
H 12cyc
B 20cyc
N 88cyc

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 TH Main

Moisture Based Stress Tests

Biased Testing
Comparison Dendritic growth formation
Surface Corrosion is a galvanic process by
which metals deteriorate through oxidation—
usually but not always to their oxides.
Reduction-Oxidation is a reaction in which
the metal is being oxidized by its
surroundings, often the oxygen in air. This
reaction is both spontaneous and
electrochemically favored.
Moisture slowly attacking
weak IMC layer

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 TH Main

Moisture Based Stress Tests

Moisture based stress tests are environmental simulations that introduce Moisture ( % Relative humidity ) to
promote surface corrosion

• HAST ( Highly Accelerated Stress Test )

– Conditions: 130C/85%RH or 110C/85%RH
• PCT ( Pressure Cooker Test ) / AC ( Auto Clave )
– Conditions: 121C/100%RH/2atm ATP Spec#: 001-3009
• TH ( Temperature and Humidity ) soaking
– Conditions: 85C/85%RH
Defects / Failure mechanism seen after HAST
• Bondpad / metallization corrosion
• Mobile ionic/moisture contamination
• Metal ion migration
• Open/Short Failure
• Delamination due ionic contamination

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 TH Main

Moisture Based Stress Tests

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 TH Main

Moisture based stress tests FAQs

▶ When do we use TH soak, HAST and PCT?
▷ TH soak are moisture based stress test that is usually used for laminates/substrate since
laminate/substrates are not recommended to undergo more than +125C
▷ PCT / AutoClave test are used on devices with controlled/higher pressure environment application
▷ HAST are the most commonly used due to its shorter loading time compared to TH soak
▶ Is it normal to have discolored leads after a moisture based rel test?
▷ Yes lead/ball/contact dulling is normal but please be careful with unusual discoloration cases.
▷ Leads/ball contact dulling usually cause problem for Test team, cleaning of leads/balls is
sometimes advised for contact problem
▶ When do we suggest moisture based stress test?
▷ Moisture and temperature accelerate chemical reaction on metal surface, so we usually recommend
HAST on contamination issues and discoloration issues

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 HTS Main

HTS ( High Temperature Storage )

– High temperature storage simulation to evaluate package and die sensitivity to heat, material degradation, ionic
contamination and bond integrity

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 HTS Main

HTS ( High Temperature Storage )

Copper bondpad corrosion
( possible on wafer fab or staging on production line )
Copper corrosion despite nickel plating protective layer

Stitch/wedge Cu Corrosion

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 HTS Main

HTS ( High Temperature Storage )

Intermetallic is the combination of 2 metal layers.
 Too little intermetallic means less adhesion between 2 metals
 Too much intermetallic could cause kirkendall voids and produce open failure in the long run

Au-Al IMC

Cu-Al IMC
Ag-Al IMC

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 HTS Main

HTS ( High Temperature Storage )

Kirkendall voids are holes caused by difference in diffusion rates of 2 metal atoms

Solder ball Cu – Sn IMC

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 HTS Main

HTS ( High Temperature Storage ) HTS Conversion

Calculator

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 HTS Main

HTS ( High Temperature Storage )

Defects / Failure mechanism seen after HTS
• Die crack
• Excessive Inter-Metallic growth
• Oxidation
• Bondpad / metallization corrosion
• Die-electric Breakdown
• Material degredation
• Open/Short Failure
• Delamination due to corrosion

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 HTS Main

High Temperature Stress Tests FAQs

▶ When do we use different condition for HTS?
▷ We could convert lower condition HTS to an accelerated condition.
▷ Note: Activation energy differ for every material. Material degradation for EMC might not be
equal to the degradation for the wire or the substrate, etc. It is good to know the performance
of each material prior deciding for the HTS temp condition
▶ Why is it not required to do MSL before HTS?
▷ HTS test degrade the materials and is not affected by delamination produced during MSL
▶ How do intermetallic form?
▷ Intermetallic normally form between two metals. Metal atoms diffusion.

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Usual on T0 samples prior Rel test due assembly/test line

defect escapee or die crack issues

- Usually possible to occurs after Reliability Tests with

Die crack
mechanical aspects like TC, MSL, Reflow

- Seldom possible to occur on HTS due to too much

Temperature over long period of time.

- Usually possible to occurs after Reliability Tests with

mechanical aspects like TC, MSL, Reflow

- Seldom possible to occur due to too much Temperature

Package crack over long period of time ( Material capability ). Rel tests like
HTS ( more specificaly die-electric cracks from outside EMC
due to disintegration of resin with fillers )

- Usually also occurs after test handler process

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Usual on T0 samples prior Rel test due assembly/test line

defect escapee or Bondpad crack issues
Bond pad crack/damage
- Usually possible to occurs after Reliability Tests with
mechanical aspects like TC, MSL, Reflow

- Usually possible to occurs after Reliability Tests with

Ball/Stitch wire bond damages
mechanical aspects like TC, MSL, Reflow

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Usual on T0 samples prior Rel test due assembly/test line

defect escapee or solder bridging issue
Solder Bridging
- Usually possible to occurs after MSL ( Reflow ) process
due to melting of solder material

Since solder melts during reflow,

delamination on components surface
could cause solder bridging

- Usually possible to occurs after Reliability Tests with

Solder Ball/Bump Crack
mechanical aspects like TC, MSL, Reflow

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Usual on T0 samples prior Rel test due assembly/test line

defect escapee or NSOP/NSOL issues ( NSOP/L = Non stick
on pad/leads

- Usually possible to occurs after Reliability Tests with

mechanical aspects like TC, MSL, Reflow ( due to NSOP/L
issues )
Lifted ball/stitch bonds
- Seldom possible to occurs after moisture biased tests like
HAST and THB ( due to mobile-ion contamination/migration
)

- Sometimes after HTS due to already present

contamination

- Usual on T0 samples prior Rel test due assembly line

defect escapee

- Usually possible to occurs after Reliability Tests with

Delamination mechanical aspects like TC, MSL, Reflow ( due to BOM CTE
mismatch )

- Seldom possible to occurs after HAST or HTS ( due to

contamination issue / chemical reaction)

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Possible on all kinds of Rel test due to mechanical,

thermomechanical or chemical reasons
Open/short or electrical failure
- Usual on T0 samples prior Rel test due assembly/test line
defect escapee

- Possible on T0 samples prior Rel test due assembly/test line

defect escapee or due per process staging reasons ( not seen
visually )
Bondpad / metallization corrosion
- Usually possible to occurs after HTS and is observed on bare
die or unmolded samples due to contamination

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

Mobile ionic/moisture contamination - Possible on biased Rel tests like HAST or THB

Metal ion migration - Possible on biased Rel tests like HAST or THB

Delamination due contamination or

- Possible on HAST or HTS due to contamination oxidation
corrosion

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Usually possible on HTS due to long exposure to high heat

Excessive Intermetallic Growth
w/ kirkendall voids

- Usually possible on HTS due to long exposure to high heat

w/ kirkendall voids
Oxidation / Corrosion
- Possible on T0 samples prior Rel test due assembly/test
line defect escapee or due per process staging reasons ( not
seen visually )

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Possible Reliability Related Defects
Post Rel Defects Image Reference Remarks ( Usual Rel Rel test where defects occur )

- Possible on HTS due to long exposure to high heat ( Material

Dielectric breakdown capability )

- Possible on HTS due to long exposure to high heat ( Material

Material Degredation / Oxidation capability )

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