LMK03200

[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

LMK03200 Family Precision 0-Delay Clock Conditioner with Integrated VCO

Check for Samples: LMK03200

1 Introduction
1.1
12
Features
• Integrated VCO with Very Low Phase Noise • Dedicated Divider and Delay Blocks on Each
Floor Clock Output
• Integrated Integer-N PLL with Outstanding • 0-delay Outputs
Normalized Phase Noise Contribution of -224 • Internal or External Feedback of Output Clock
dBc/Hz • Delay Blocks on N and R Phase Detector Inputs
• VCO Divider Values of 2 to 8 (All Divides) for Lead/Lag Global Skew Adjust
– Bypassable with VCO Mux When Not in 0- • Pin Compatible Family of Clocking Devices
delay Mode • 3.15 to 3.45 V Operation
• Channel Divider Values of 1, 2 to 510 (Even • Package: 48 Pin WQFN (7.0 x 7.0 x 0.8 mm)
Divides)
• 200 fs RMS Clock Generator Performance (10
• LVDS and LVPECL Clock Outputs Hz to 20 MHz) with a clean input clock
• Partially Integrated Loop Filter

1.2 Target Applications

• Data Converter Clocking VCO
• Networking, SONET/SDH, DSLAM Device Outputs Tuning Range RMS Jitter
(MHz) (fs)
• Wireless Infrastructure
3 LVDS
• Medical LMK03200 1185 - 1296 800
5 LVPECL
• Test and Measurement
• Military / Aerospace

Recovered CLKout0
³GLUW\´ FORFN RU LMK03200 Serializer/
clean clock CLKout1
Family Deserializer
OSCin CLKout4
Precision Clock
Conditioner LMX2531
CLKout7
PLL+VCO FPGA
Fout

> 1 Gsps
0XOWLSOH ³FOHDQ´ FORFNV DW
ADC DAC different frequencies

1.3 Description
The LMK03200 family of precision clock conditioners combine the functions of jitter
cleaning/reconditioning, multiplication, and 0-delay distribution of a reference clock. The devices integrate
a Voltage Controlled Oscillator (VCO), a high performance Integer-N Phase Locked Loop (PLL), a partially
integrated loop filter, and up to eight outputs in various LVDS and LVPECL combinations.
The VCO output is optionally accessible on the Fout port. Internally, the VCO output goes through a VCO
divider to feed the various clock distribution blocks.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to Copyright © 2009–2013, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Each clock distribution block includes a programmable divider, a phase synchronization circuit, a
programmable delay, a clock output mux, and an LVDS or LVPECL output buffer. The PLL also features
delay blocks to permit global phase adjustment of clock output phase. This allows multiple integer-related
and phase-adjusted copies of the reference to be distributed to eight system components.
The clock conditioners come in a 48-pin WQFN package and are footprint compatible with other clocking
devices in the same family.

1 Introduction .............................................. 1 5.14 0-DELAY MODE .................................... 18

1.1 Features ............................................. 1 6 General Programming Information ................ 19
1.2 Target Applications .................................. 1 6.1 Recommended Programming Sequence, without 0-
1.3 Description ........................................... 1 Delay Mode ......................................... 19
6.2 Recommended Programing Sequence, with 0-Delay
2 Device Information ...................................... 3
Mode ................................................ 19
2.1 Functional Block Diagram ........................... 3
6.3 Recommended Programming Sequence, bypassing
2.2 Connection Diagram ................................. 3 VCO divider ......................................... 23
3 Electrical Specifications ............................... 5 6.4 Register R0 to R7.................................. 28
3.1 Absolute Maximum Ratings .......................... 5 6.5 .........................................
Register R8 32
3.2 Recommended Operating Conditions ............... 5 6.6 Register R9 ......................................... 32
3.3 Package Thermal Resistance ....................... 5 6.7 Register R11 ........................................ 32
3.4 Electrical Characteristics ............................ 6 6.8 Register R13 ........................................ 33
3.5 Serial Data Timing Diagram ........................ 10 6.9 Register R14 ........................................ 34
3.6 Charge Pump Current Specification Definitions .... 11 6.10 REGISTER R15 .................................... 37
4 Typical Performance Characteristics ............. 12 7 Application Information .............................. 39
5 Functional Description ............................... 14 7.1 SYSTEM LEVEL DIAGRAM ........................ 39
5.1 BIAS PIN ........................................... 14 7.2 BIAS PIN ........................................... 39
5.2 LDO BYPASS ...................................... 14 7.3 LDO BYPASS ...................................... 39
5.3 OSCILLATOR INPUT PORT (OSCin, OSCin*) .... 14 7.4 LOOP FILTER ......................................
40
5.4 LOW NOISE, FULLY INTEGRATED VCO ......... 14 7.5 CURRENT CONSUMPTION / POWER
5.5 LVDS/LVPECL OUTPUTS ......................... 15 DISSIPATION CALCULATIONS ................... 41
5.6 GLOBAL CLOCK OUTPUT SYNCHRONIZATION 15 7.6 THERMAL MANAGEMENT ........................ 42
5.7 CLKout OUTPUT STATES ......................... 16 7.7 TERMINATION AND USE OF CLOCK OUTPUTS
(DRIVERS) ......................................... 43
5.8 GLOBAL OUTPUT ENABLE AND LOCK DETECT 16
7.8 OSCin INPUT ...................................... 46
5.9 POWER ON RESET ............................... 16
7.9 MORE THAN EIGHT OUTPUTS WITH AN
5.10 DIGITAL LOCK DETECT ........................... 17
LMK03200 FAMILY DEVICE ....................... 47
5.11 CLKout DELAYS ................................... 17 7.10 DIFFERENTIAL VOLTAGE MEASUREMENT
5.12 GLOBAL DELAYS .................................. 17 TERMINOLOGY .................................... 47
5.13 VCO DIVIDER BYPASS MODE .................... 18 Revision History ............................................ 48

2 Contents Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

2 Device Information

2.1 Functional Block Diagram

Partially

CPout
Integrated Internal
Loop Filter VCO
OSCin R Divider R Delay
OSCin* Phase
Detector
Fout
N Divider N Delay

Distribution Path VCO

Ndiv Mux VCO
Mux Divider
FBCLKin
FB
Mux
FBCLKin*

CLKout0 CLKout4
Mux Divider Divider Mux
CLKout0* Delay Delay CLKout4*

CLKout1 CLKout5
Mux Divider Divider Mux
CLKout1* Delay Delay CLKout5*

CLKout2 CLKout6
Mux Divider Divider Mux
CLKout2* Delay Delay CLKout6*

CLKout3 CLKout7
Mux Divider Divider Mux
CLKout3* Delay Delay CLKout7*

Low Clock Buffers

High Clock Buffers
CLK
PWire Control
GOE Device
LD
DATA Port Registers Control
SYNC*
LE

2.2 Connection Diagram

CLKout7*

CLKout6*

CLKout5*

CLKout4*
CLKout7

CLKout6

CLKout5

CLKout4
Vcc14

Vcc13

Vcc12

Vcc11

48 47 46 45 44 43 42 41 40 39 38 37

GND 1 36 Bias

Fout 2 35 FBCLKin*

Vcc1 3 34 FBCLKin

CLKuWire 4 33 Vcc10

DATAuWire 5 32 CPout

LEuWire 6 31 Vcc9
Top Down View
NC 7 30 Vcc8

Vcc2 8 29 OSCin*

LDObyp1 9 28 OSCin

LDObyp2 10 27 SYNC*

GOE 11
DAP 26 Vcc7

LD 12 25 GND

13 14 15 16 17 18 19 20 21 22 23 24
Vcc3

CLKout0

CLKout0*

Vcc4

CLKout1

CLKout1*

Vcc5

CLKout2

CLKout2*

Vcc6

CLKout3

CLKout3*

Figure 2-1. 48-Pin WQFN Package

Copyright © 2009–2013, Texas Instruments Incorporated Device Information 3
Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Table 2-1. PIN DESCRIPTIONS

Pin # Pin Name I/O Description
1, 25 GND - Ground
2 Fout O Internal VCO Frequency Output
3, 8, 13, 16, 19, 22,
Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7, Vcc8, Vcc9, Vcc10,
26, 30, 31, 33, 37, - Power Supply
Vcc11, Vcc12, Vcc13, Vcc14
40, 43, 46
4 CLKuWire I MICROWIRE Clock Input
5 DATAuWire I MICROWIRE Data Input
6 LEuWire I MICROWIRE Latch Enable Input
7 NC - No Connection to these pins
9, 10 LDObyp1, LDObyp2 - LDO Bypass
11 GOE I Global Output Enable
12 LD O Lock Detect and Test Output
14, 15 CLKout0, CLKout0* O LVDS Clock Output 0
17, 18 CLKout1, CLKout1* O LVDS Clock Output 1
20, 21 CLKout2, CLKout2* O LVDS Clock Output 2
23, 24 CLKout3, CLKout3* O LVPECL Clock Output 3
27 SYNC* I Global Clock Output Synchronization
Oscillator Clock Input; Should be AC
28, 29 OSCin, OSCin* I
coupled
32 CPout O Charge Pump Output
External Feedback Clock Input for 0-delay
34, 35 FBCLKin, FBCLKin* I
mode
36 Bias I Bias Bypass
38, 39 CLKout4, CLKout4* O LVPECL Clock Output 4
41, 42 CLKout5, CLKout5* O LVPECL Clock Output 5
44, 45 CLKout6, CLKout6* O LVPECL Clock Output 6
47, 48 CLKout7, CLKout7* O LVPECL Clock Output 7
DAP DAP - Die Attach Pad is Ground

4 Device Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

3 Electrical Specifications

3.1 Absolute Maximum Ratings (1) (2) (3)

Parameter Symbol Ratings Units
Power Supply Voltage VCC -0.3 to 3.6 V
Input Voltage VIN -0.3 to (VCC + 0.3) V
Storage Temperature Range TSTG -65 to 150 °C
Lead Temperature (solder 4 s) TL +260 °C
Junction Temperature TJ 125 °C
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD
protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.

3.2 Recommended Operating Conditions

Parameter Symbol Min Typ Max Units
Ambient Temperature TA -40 25 85 °C
Power Supply Voltage VCC 3.15 3.3 3.45 V

3.3 Package Thermal Resistance

Package θJA θJ-PAD (Thermal Pad)
(1)
48-Lead WQFN 27.4° C/W 5.8° C/W
(1) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These
vias play a key role in improving the thermal performance of the WQFN. It is recommended that the maximum number of vias be used in
the board layout.

Copyright © 2009–2013, Texas Instruments Incorporated Electrical Specifications 5

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

(1)
3.4 Electrical Characteristics
(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values
represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the
time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
Current Consumption
Entire device; one LVDS and one
LVPECL clock enabled; no divide; no 161.8
Power Supply Current delay.
ICC (2) mA
Entire device; All Outputs Off (no
86
emitter resistors placed)
ICCPD Power Down Current POWERDOWN = 1 5 mA
Reference Oscillator Input
Reference Oscillator Input Frequency
fOSCin 1 200 MHz
Range
Reference Oscillator Differential Input
VIDOSCin AC coupled 0.2 1.6 V
Voltage (3) (4)
Reference Oscillator Single-ended Input AC coupled; Unused pin AC coupled to
VOSCin 0.2 2.0 Vpp
Voltage (4) GND
(4)
SLEWOSCin Reference Oscillator Input Slew Rate 20% to 80%; For each input pin 0.15 0.5 V/ns
External Feedback Clock Input
External Feedback Clock Input Frequency
fFBCLKin 1 800 MHz
Range
External Feedback Clock Differential Input
VIDFBCLKin AC coupled 0.2 1.6 V
Voltage (3) (4)
External Feedback Clock Single-ended AC coupled; Unused pin AC coupled to
VFBCLKin 0.2 2.0 Vpp
Input Voltage (4) GND
External Feedback Clock Input Slew Rate
SLEWFBCLKin (4) 20% to 80%; For each input pin 0.15 0.5 V/ns

(1) The Electrical Characteristics table lists ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) See Section Section 7.5 for more information.
(3) See Section Section 7.10 for more information.
(4) Specification is ensured by characterization and is not tested in production.

6 Electrical Specifications Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

Electrical Characteristics (1) (continued)

(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values
represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the
time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
PLL
fPD Phase Detector Frequency 40 MHz
VCPout = Vcc/2, PLL_CP_GAIN = 1x 100
VCPout = Vcc/2, PLL_CP_GAIN = 4x 400
ISRCECPout Charge Pump Source Current µA
VCPout = Vcc/2, PLL_CP_GAIN = 16x 1600
VCPout = Vcc/2, PLL_CP_GAIN = 32x 3200
VCPout = Vcc/2, PLL_CP_GAIN = 1x -100
VCPout = Vcc/2, PLL_CP_GAIN = 4x -400
ISINKCPout Charge Pump Sink Current μA
VCPout = Vcc/2, PLL_CP_GAIN = 16x -1600
VCPout = Vcc/2, PLL_CP_GAIN = 32x -3200
ICPoutTRI Charge Pump TRI-STATE Current 0.5 V < VCPout < Vcc - 0.5 V 2 10 nA
Magnitude of Charge Pump VCPout = Vcc / 2
ICPout%MIS 3 %
Sink vs. Source Current Mismatch TA = 25°C
Magnitude of Charge Pump 0.5 V < VCPout < Vcc - 0.5 V
ICPoutVTUNE 4 %
Current vs. Charge Pump Voltage Variation TA = 25°C
Magnitude of Charge Pump Current vs.
ICPoutTEMP 4 %
Temperature Variation
PLL 1/f Noise at 10 kHz Offset (1) PLL_CP_GAIN = 1x -117
PN10kHz dBc/Hz
Normalized to 1 GHz Output Frequency PLL_CP_GAIN = 32x -122
Normalized Phase Noise Contribution PLL_CP_GAIN = 1x -219
PN1Hz (2) dBc/Hz
PLL_CP_GAIN = 32x -224
(1) A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker
noise has a 10 dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10
kHz) - 20log(Fout / 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's contribution to total noise,
L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high compare frequency and a clean
crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can be masked by the reference
oscillator performance if a low power or noisy source is used. The total PLL in-band phase noise performance is the sum of LPLL_flicker(f)
and LPLL_flat(f).
(2) A specification in modeling PLL in-band phase noise is the Normalized Phase Noise Contribution, LPLL_flat(f), of the PLL and is defined
as PN1Hz = LPLL_flat(f) – 20log(N) – 10log(fCOMP). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a
1 Hz Bandwidth and fCOMP is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f). To measure
LPLL_flat(f) the offset frequency, f, must be chosen sufficiently smaller then the loop bandwidth of the PLL, and yet large enough to avoid
a substantial noise contribution from the reference and flicker noise. LPLL_flat(f) can be masked by the reference oscillator performance if
a low power or noisy source is used.

Copyright © 2009–2013, Texas Instruments Incorporated Electrical Specifications 7

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Electrical Characteristics (1) (continued)

(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values
represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the
time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
VCO
fFout VCO Tuning Range LMK03200 1185 1296 MHz
After programming R15 for lock, only
changes 0_DELAY_MODE and PLL_N
Allowable Temperature Drift for Continuous
|ΔTCL| for the purpose of enabling 0-delay 125 °C
Lock
mode permitted to ensure continuous
lock. (1)
Output Power to a 50 Ω load driven by Fout
pFout (2) LMK03200; TA = 25 °C 3.3 dBm
(3)
KVCO Fine Tuning Sensitivity LMK03200 7 to 9 MHz/V
Fout RMS Period Jitter
JRMSFout LMK03200 800 fs
(12 kHz to 20 MHz bandwidth)
Clock Skew and Delay
Equal loading and identical clock
(4)
tSKEWLVDS CLKoutX to CLKoutY configuration -30 ±4 30 ps
RL = 100 Ω
Equal loading and identical clock
tSKEWLVPEC (4)
CLKoutX to CLKoutY configuration -30 ±3 30 ps
L
RL = 100 Ω
0-Delay mode active; PLL_N_DLY = 0;
PLL_R_DLY = 0; FB_MUX = 0 -300 -65 300
(CLKout5)
0-Delay mode active; PLL_N_DLY = 0;
PLL_R_DLY = 0; FB_MUX = 2 -300 35 300
(4)
(CLKout6)
td0-DELAY OSCin to CLKoutX delay ps
0-Delay mode active; PLL_N_DLY = 0;
PLL_R_DLY = 0; FB_MUX = 1 -700 -400 -100
(FBCLKin)
0-Delay mode active; PLL_N_DLY = 0;
PLL_R_DLY = 3; FB_MUX = 1 -400 35 400
(FBCLKin)
(1) Allowable Temperature Drift for Continuous Lock is how far the temperature can drift in either direction and stay in lock from the ambient
temperature and programmed state at which the device was when the frequency calibration routine was run. The action of programming
the R15 register, even to the same value, when 0_DELAY_MODE = 0 activates a frequency calibration routine. This implies that the
device will work over the entire frequency range, but if the temperature drifts more than the maximum allowable drift for continuous lock,
then it will be necessary to reprogram the R15 register while 0_DELAY_MODE = 0 to ensure that the device stays in lock. Regardless of
what temperature the device was initially programmed at, the ambient temperature can never drift outside the range of -40 °C ≤ TA ≤ 85
°C without violating specifications. For this specification to be valid, the programmed state of the device must not change after R15 is
programmed except for 0_DELAY_MODE and PLL_N for the purpose of enabling 0-delay mode.
(2) Output power varies as a function of frequency. When a range is shown, the higher output power applies to the lower frequency and the
lower output power applies to the higher frequency.
(3) The lower sensitivity indicates the typical sensitivity at the lower end of the tuning range, the higher sensitivity at the higher end of the
tuning range
(4) Specification is ensured by characterization and is not tested in production.

8 Electrical Specifications Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

Electrical Characteristics (1) (continued)

(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values
represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the
time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
Clock Distribution Section - LVDS Clock Outputs (1)
CLKoutX_MUX =
Bypass (no 20
RL = 100 Ω divide or delay)
Distribution Path =
JitterADD Additive RMS Jitter (1)
765 MHz CLKoutX_MUX = fs
Bandwidth = Divided (no
12 kHz to 20 MHz delay) 75
CLKoutX_DIV =
4
VOD Differential Output Voltage RL = 100 Ω 250 350 450 mV
Change in magnitude of VOD for
ΔVOD RL = 100 Ω -50 50 mV
complementary output states
VOS Output Offset Voltage RL = 100 Ω 1.070 1.25 1.370 V
Change in magnitude of VOS for
ΔVOS RL = 100 Ω -35 35 mV
complementary output states
ISA Clock Output Short Circuit Current
Single-ended outputs shorted to GND -24 24 mA
ISB single-ended
Clock Output Short Circuit Current
ISAB Complementary outputs tied together -12 12 mA
differential
(1)
Clock Distribution Section - LVPECL Clock Outputs
CLKoutX_MUX =
Bypass (no 20
RL = 100 Ω divide or delay)
Distribution Path =
JitterADD Additive RMS Jitter (1)
765 MHz CLKoutX_MUX = fs
Bandwidth = Divided (no
12 kHz to 20 MHz delay) 75
CLKoutX_DIV =
4
Vcc -
VOH Output High Voltage V
0.98
Termination = 50 Ω to Vcc - 2 V
Vcc -
VOL Output Low Voltage V
1.8
VOD Differential Output Voltage RL = 100 Ω 660 810 965 mV
(2)
Digital LVTTL Interfaces
VIH High-Level Input Voltage 2.0 Vcc V
VIL Low-Level Input Voltage 0.8 V
IIH High-Level Input Current VIH = Vcc -5.0 5.0 µA
IIL Low-Level Input Current VIL = 0 -40.0 5.0 µA
Vcc -
VOH High-Level Output Voltage IOH = +500 µA V
0.4
VOL Low-Level Output Voltage IOL = -500 µA 0.4 V
(3)
Digital MICROWIRE Interfaces
VIH High-Level Input Voltage 1.6 Vcc V
VIL Low-Level Input Voltage 0.4 V
IIH High-Level Input Current VIH = Vcc -5.0 5.0 µA
IIL Low-Level Input Current VIL = 0 -5.0 5.0 µA
(1) The Clock Distribution Section includes all parts of the device except the PLL and VCO sections. Typical Additive Jitter specifications
apply to the clock distribution section only and this adds in an RMS fashion to the shaped jitter of the PLL and the VCO.
(2) Applies to GOE, LD, and SYNC*.
(3) Applies to CLKuWire, DATAuWire, and LEuWire.

Copyright © 2009–2013, Texas Instruments Incorporated Electrical Specifications 9

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Electrical Characteristics (1) (continued)

(3.15 V ≤ Vcc ≤ 3.45 V, -40 °C ≤ TA ≤ 85 °C, Differential Inputs/Outputs; Vboost=0; except as specified. Typical values
represent most likely parametric norms at Vcc = 3.3 V, TA = 25 °C, and at the Recommended Operation Conditions at the
time of product characterization and are not guaranteed).
Symbol Parameter Conditions Min Typ Max Units
MICROWIRE Timing
tCS Data to Clock Set Up Time See Data Input Timing 25 ns
tCH Data to Clock Hold Time See Data Input Timing 8 ns
tCWH Clock Pulse Width High See Data Input Timing 25 ns
tCWL Clock Pulse Width Low See Data Input Timing 25 ns
tES Clock to Enable Set Up Time See Data Input Timing 25 ns
tCES Enable to Clock Set Up Time See Data Input Timing 25 ns
tEWH Enable Pulse Width High See Data Input Timing 25 ns

3.5 Serial Data Timing Diagram

MSB LSB

DATAuWire D27 D26 D25 D24 D23 D0 A3 A2 A1 A0

CLKuWire

tCS tCWH
tCES tCH tES
tCWL

LEuWire

tEWH

Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of
the CLKuWire signal. On the rising edge of the LEuWire signal, the data is sent from the shift register to
the addressed register determined by the LSB bits. After the programming is complete the CLKuWire,
DATAuWire, and LEuWire signals should be returned to a low state. It is recommended that the slew rate
of CLKuWire, DATAuWire, and LEuWire should be at least 30 V/μs.

10 Electrical Specifications Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

3.6 Charge Pump Current Specification Definitions

I1 = Charge Pump Sink Current at VCPout = Vcc - ΔV

I2 = Charge Pump Sink Current at VCPout = Vcc/2
I3 = Charge Pump Sink Current at VCPout = ΔV
I4 = Charge Pump Source Current at VCPout = Vcc - ΔV
I5 = Charge Pump Source Current at VCPout = Vcc/2
I6 = Charge Pump Source Current at VCPout = ΔV
ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.

Charge Pump Output Current Magnitude Variation vs. Charge Pump Output Voltage

Charge Pump Sink Current vs. Charge Pump Output Source Current Mismatch

Charge Pump Output Current Magnitude Variation vs. Temperature

Copyright © 2009–2013, Texas Instruments Incorporated Electrical Specifications 11

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

4 Typical Performance Characteristics

NOTE
These plots show performance at frequencies beyond what the part is ensured to operate at to give
the user an idea of the capabilities of the part, but they do not imply any sort of ensured
specification.

1000 1000
Single-Ended Peak to Peak Voltage (mV)

900 900 Vboost = 1

800 800
700 700 Vboost = 0
600 600

VOD (mV)
Vboost = 1
500 500

400 400
300 300
Vboost = 0
200 200
100 100
0 0
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 1200 1400 1600 1800 2000

FREQUENCY (MHz) FREQUENCY (MHz)

Figure 4-1. LVDS Vod Figure 4-2. LVPECL Vod

-146 -146

-148 -148

Vboost = 0 Vboost = 0
Noise Floor (dBc/Hz)

Noise Floor (dBc/Hz)

-150 -150

-152 -152

-154 -154

-156 -156
Vboost = 1
-158 -158
Vboost = 1

-160 -160
0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 1200 1400 1600 1800 2000

FREQUENCY (MHz) FREQUENCY (MHz)

To estimate this noise, only the output frequency is required. Divide To estimate this noise, only the output frequency is required. Divide
value and input frequency are not integral. value and input frequency are not integral.
Figure 4-3. LVDS Output Buffer Noise Floor Figure 4-4. LVPECL Output Buffer Noise Floor

12 Typical Performance Characteristics Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

-135
Delay = 2250 ps
Delay=1800 ps
-140
Delay = 900 ps

NOISE FLOOR (dBc/Hz)

-145

-150

-155

Delay = 450 ps
-160
Delay = 0 ps

-165

-170
10 100 1000

FREQUENCY (MHz)
To estimate this noise, only the output frequency is required. Divide value and input frequency are not integral.
The noise of the delay block is independent of output type and only applies if the delay is enabled. The noise floor due to the distribution
section accounting for the delay noise can be calculated as: Total Output Noise = 10 × log(10Output Buffer Noise/10 + 10Delay Noise Floor/10).
Figure 4-5. Delay Noise Floor

Copyright © 2009–2013, Texas Instruments Incorporated Typical Performance Characteristics 13

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

5 Functional Description
The LMK03200 family of precision clock conditioners combine the functions of jitter
cleaning/reconditioning, multiplication, and 0-delay distribution of a reference clock. The devices integrate
a Voltage Controlled Oscillator (VCO), a high performance Integer-N Phase Locked Loop (PLL), a partially
integrated loop filter, three LVDS, and five LVPECL clock output distribution blocks.
The devices include internal 3rd and 4th order poles to simplify loop filter design and improve spurious
performance. The 1st and 2nd order poles are off-chip to provide flexibility for the design of various loop
filter bandwidths.
The VCO output is optionally accessible on the Fout port. Internally, the VCO output goes through a VCO
divider to feed the various clock distribution blocks.
Each clock distribution block includes a programmable divider, a phase synchronization circuit, a
programmable delay, a clock output mux, and an LVDS or LVPECL output buffer. This allows multiple
integer-related and phase-adjusted copies of the reference to be distributed to eight system components.
The clock conditioners come in a 48-pin WQFN package and are footprint compatible with other clocking
devices in the same family.

5.1 BIAS PIN

To properly use the device, bypass Bias (pin 36) with a low leakage 1 µF capacitor connected to Vcc. This
is important for low noise performance.

5.2 LDO BYPASS

To properly use the device, bypass LDObyp1 (pin 9) with a 10 µF capacitor and LDObyp2 (pin 10) with a
0.1 µF capacitor.

5.3 OSCILLATOR INPUT PORT (OSCin, OSCin*)

The purpose of OSCin is to provide the PLL with a reference signal. Due to an internal DC bias the OSCin
port should be AC coupled, refer to the Section 7.1 in the Section 7 section. The OSCin port may be
driven single-endedly by AC grounding OSCin* with a 0.1 µF capacitor.

5.4 LOW NOISE, FULLY INTEGRATED VCO

The LMK03200 family of devices contain a fully integrated VCO. For proper operation the VCO uses a
frequency calibration routine. The frequency calibration routine is activated any time that the R15 register
is programmed and 0_DELAY_MODE = 0. Once the frequency calibration routine is run the temperature
may not drift more than the maximum allowable drift for continuous lock, ΔTCL, or else the VCO is not
ensured to stay in lock.
The status of the frequency calibration routine can be monitored. See section Section 6.2
For the frequency calibration routine to work properly OSCin must be driven by a valid signal and
VCO_MUX = 0, otherwise the resulting state is unknown.
Refer to Figure 5-1 for a visual representation of what happens when R15 is programmed.

Register R15 is YES Valid OSCin YES YES Activate Frequency

programmed 0_DELAY_MODE = 0 VCO_MUX = 0
signal? Calibration Routine

NO NO NO

No
Invalid
Calibration

Figure 5-1. Frequency Calibration Routine Flowchart

14 Functional Description Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

5.5 LVDS/LVPECL OUTPUTS

By default all the clock outputs are disabled until programmed.
Each LVDS or LVPECL output may be disabled individually by programming the CLKoutX_EN bits. All the
outputs may be disabled simultaneously by pulling the GOE pin low or programming EN_CLKout_Global
to 0.
The duty cycle of the LVDS and LVPECL clock outputs are shown in the table below.
VCO_DIV CLKoutX_MUX Duty Cycle
Any Divided, or Divided and Delayed 50%
2, 4, 6, 8 Any 50%
3 Bypassed, or Delayed 33%
5 Bypassed, or Delayed 40%
7 Bypassed, or Delayed 43%

5.6 GLOBAL CLOCK OUTPUT SYNCHRONIZATION

The SYNC* pin synchronizes the clock outputs. SYNC* is not used in VCO bypass mode. When the
SYNC* pin is held in a logic low state, the divided outputs are also held in a logic low state. The bypassed
outputs will continue to operate normally. Shortly after the SYNC* pin goes high, the divided clock outputs
are activated and will all transition to a high state simultaneously. All the outputs, divided and bypassed,
will now be synchronized. Clocks in the bypassed state are not affected by SYNC* and are always
synchronized with the divided outputs.
The SYNC* pin must be held low for greater than one clock cycle of the output of the VCO divider, also
known as the distribution path. Once this low event has been registered, the outputs will not reflect the low
state for four more cycles. This means that the outputs will be low on the fifth rising edge of the
distribution path. Similarly once the SYNC* pin becomes high, the outputs will not simultaneously
transition high until four more distribution path clock cycles have passed, which is the fifth rising edge of
the distribution path. See the timing diagram in Figure 5-2 for further detail. The clocks are programmed
as CLKout0_MUX = Bypassed, CLKout1_MUX = Divided, CLKout1_DIV = 2, CLKout2_MUX = Divided,
and CLKout2_DIV = 4. To synchronize the outputs, after the low SYNC* event has been registered, it is
not required to wait for the outputs to go low before SYNC* is set high.

Distribution
Path

SYNC*

CLKout0

CLKout1

CLKout2

Figure 5-2. SYNC* Timing Diagram

The SYNC* pin provides an internal pull-up resistor as shown on the functional block diagram. If the
SYNC* pin is not terminated externally the clock outputs will operate normally. If the SYNC* function is not
used, clock output synchronization is not ensured. To ensure 0-delay to reference see section Section 6.2.

Copyright © 2009–2013, Texas Instruments Incorporated Functional Description 15

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

5.7 CLKout OUTPUT STATES

Each clock output may be individually enabled with the CLKoutX_EN bits. Each individual output enable
control bit is gated with the Global Output Enable input pin (GOE) and the Global Output Enable bit
(EN_CLKout_Global).
All clock outputs can be disabled simultaneously if the GOE pin is pulled low by an external signal or
EN_CLKout_Global is set to 0.
CLKoutX EN_CLKout CLKoutX Output State
GOE pin
_EN bit _Global bit
1 1 Low Low
Don't care 0 Don't care Off
0 Don't care Don't care Off
1 1 High / No Connect Enabled

When an LVDS output is in the Off state, the outputs are at a voltage of approximately 1.5 volts. When an
LVPECL output is in the Off state, the outputs are at a voltage of approximately 1 volt.

5.8 GLOBAL OUTPUT ENABLE AND LOCK DETECT

The GOE pin provides an internal pull-up resistor as shown on the functional block diagram. If it is not
terminated externally, the clock output states are determined by the Clock Output Enable bits
(CLKoutX_EN) and the EN_CLKout_Global bit.
By programming the PLL_MUX register to Digital Lock Detect Active High, the Lock Detect (LD) pin can
be connected to the GOE pin in which case all outputs are set low automatically if the synthesizer is not
locked.

5.9 POWER ON RESET

When supply voltage to the device increases monotonically from ground to Vcc, the power on reset circuit
sets all registers to their default values, see the Section 6 section for more information on default register
values. Voltage should be applied to all Vcc pins simultaneously.

16 Functional Description Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

5.10 DIGITAL LOCK DETECT

The PLL digital lock detect circuitry compares the difference between the phase of the inputs of the phase
detector to a RC generated delay of ε. To indicate a locked state the phase error must be less than the ε
RC delay for 5 consecutive reference cycles. Once in lock, the RC delay is changed to approximately δ.
To indicate an out of lock state, the phase error must become greater δ. The values of ε and δ are shown
in the table below:

ε δ
10 ns 20 ns

To utilize the digital lock detect feature, PLL_MUX must be programmed for "Digital Lock Detect (Active
High)" or "Digital Lock Detect (Active Low)." When one of these modes is programmed the state of the LD
pin will be set high or low as determined by the description above as shown in Figure 5-3.
When the device is in power down mode and the LD pin is programmed for a digital lock detect function,
LD will show a "no lock detected" condition which is low or high given active high or active low circuitry
respectively.
The accuracy of this circuit degrades at higher comparison frequencies. To compensate for this, the DIV4
word should be set to one if the comparison frequency exceeds 20 MHz. The function of this word is to
divide the comparison frequency presented to the lock detect circuit by 4.

NO NO

Lock Detected = YES YES

START Phase Error < g Phase Error < g
False

NO NO NO YES

YES YES YES Lock Detected =

Phase Error < g Phase Error < g Phase Error < g Phase Error > *
True

NO

Figure 5-3. Digital Lock Detect Flowchart

5.11 CLKout DELAYS

Each individual clock output includes a delay adjustment. Clock output delay registers (CLKoutX_DLY)
support a 150 ps step size and range from 0 to 2250 ps of total delay.

5.12 GLOBAL DELAYS

After the N divider and R divider are two delays PLL_N_DLY and PLL_R_DLY. They support a 150 ps
step size and range from 0 to 2250 ps of total delay. When using the 0-delay mode, these delays can be
used to cause the clock outputs to lead or lag the clock input phase. Figure 5-4 illustrates the use of the
global delays. Note, it is possible to use the individual delays on each clock output (CLKoutX_DLY) to
further alter the phase of the various clock outputs. This is not shown in Figure 5-4. Note that Figure 5-4
illustrates use of PLL_N_DLY and PLL_R_DLY to shift clock outputs to lead or lag the reference input
phase. It doesn't reflect exact timing or account for delays in buffers internal to the device, meaning the
clock output is not ensured to have 0 phase delay from the reference input to a clock output as shown at
the pins of the device.

Copyright © 2009–2013, Texas Instruments Incorporated Functional Description 17

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Reference Input OSCin

Case 1 ± Global Delay

PLL_R_DLY = 0 ps
PLL_N_DLY = 0 ps
CLKout0...7
Case 2 ± Global Lag
PLL_R_DLY = 300 ps
PLL_N_DLY = 0 ps
CLKout0...7
Case 3 ± Global Lead
PLL_R_DLY = 0 ps
PLL_N_DLY = 450 ps
CLKout0...7

Time = -450 ps Time = 0 Time = +300 ps

Figure 5-4. Global Lead and Lag

5.13 VCO DIVIDER BYPASS MODE

Once the LMK03200 is locked, the VCO divider may be bypassed to allow a higher frequency at the
channel divider inputs, which can be used to generate output frequencies not allowable otherwise. The
VCO_DIV bypass mode does not work with 0-delay mode. See programming information in sections
Section 6.3 and Section 6.4.5. SYNC* is not used when in VCO divider bypass mode.

5.14 0-DELAY MODE

The LMK03200 family can feedback an output to the phase detector either internally using CLKout5 or
CLKout6, or externally by routing any clock output back to the FBCLKin/FBCLKin* input port to be
synchronized with the reference clock for 0-delay output.
To ensure 0-delay for all the outputs, the lowest frequency output must be feed back to the PLL. This
requirement forces the maximum phase detector frequency ≤ the minimum clock output frequency.
When CLKout5 or CLKout6 is used for feedback internally, CLKout5 or CLKout6 are still valid for regular
clocking applications. If CLKout5 or CLKout6 are unused, they do not need to be externally terminated, by
not terminating the output power consumption is reduced.
To engage the 0-delay mode, refer to programming instructions in section Section 6.2.
Figure 5-5 illustrates the 0-delay mode programming sequence. More detail is in section Section 6.2

Power Stabilizes to Programming Step 1 Frequency Calibration Programming Step 2

(R0: 0_DELAY_MODE = 1) End
Device (R0: 0_DELAY_MODE = 0) Routine Completes

Figure 5-5. Outline of 0-delay mode programming sequence

The 0-delay mode may not be used together with the VCO_DIV bypass except for the purpose of being
temporarily enabled to re-program the PLL_N to keep the PLL in lock. See Section 6.3 for more
information.

18 Functional Description Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

6 General Programming Information

The LMK03200 family of devices are programmed using several 32-bit registers which control the device's
operation. The registers consist of a data field and an address field. The last 4 register bits, ADDR [3:0]
form the address field. The remaining 28 bits form the data field DATA [27:0].
During programming, LEuWire is low and serial data is clocked in on the rising edge of CLKuWire (MSB
first). When LE goes high, data is transferred to the register bank selected by the address field. Only
registers R0 to R8, R11, and R13 to R15 need to be programmed for proper device operation.
For the frequency calibration routine to work properly OSCin must be driven by a valid signal when R15 is
programmed. Any changes to the PLL_R divider or OSCin require R15 to be programmed again while
0_DELAY_MODE = 0 to activate the frequency calibration routine.

6.1 Recommended Programming Sequence, without 0-Delay Mode

The recommended programming sequence involves programming R0 with the reset bit set (RESET = 1) to
ensure the device is in a default state. It is not necessary to program R0 again, but if R0 is programmed
again, the reset bit is programmed clear (RESET = 0). Registers are programmed in order with R15 being
the last register programmed. An example programming sequence is shown below.
• Program R0 with the reset bit set (RESET = 1). This ensures the device is in a default state. When the
reset bit is set in R0, the other R0 bits are ignored.
– If R0 is programmed again, the reset bit is programmed clear (RESET = 0).
• Program R0 to R7 as necessary with desired clocks with appropriate enable, mux, divider, and delay
settings.
• Program R8 for optimum phase noise performance.
• Program R9 with Vboost setting if necessary.
• Program R11 with DIV4 setting if necessary.
• Program R13 with oscillator input frequency and internal loop filter values.
• Program R14 with Fout enable bit, global clock output bit, power down setting, PLL mux setting, and
PLL_R divider.
• Program R15 with PLL charge pump gain, VCO divider, and PLL N divider. The frequency calibration
routine starts.

6.2 Recommended Programing Sequence, with 0-Delay Mode

The lock procedure when using the 0-delay mode has two steps. The first is to complete the frequency
calibration routine for the target frequency while not in 0-delay mode. The second step is to activate 0-
delay mode and re-program the PLL_N divider to accommodate the additional divide in the clock output
path so that phase lock can be achieved with the reference input clock.
Global_CLK_EN and each output being used should be enabled in step 1. If the user desires for no output
from the clock outputs during frequency lock, the GOE pin should be held low.
Step 1
• GOE pin is held low to keep outputs from toggling. Disabling the clock output with MICROWIRE should
not be used so that when more than one clock output is used, they will all be synchronized together
when using 0_DELAY_MODE. Otherwise a separate SYNC* is required ensure all outputs are
synchronized together after all steps are completed.
• Program R0 with the reset bit set (RESET = 1). This ensures the device is in a default state. When the
reset bit is set in R0, the other R0 bits are ignored.
– If R0 is programmed again, the reset bit is programmed clear (RESET = 0).

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 19

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

• Program R0 to R7 as necessary with desired clocks with appropriate enable, mux, divider, and delay
settings. Outputs being used should be enabled.
– R0: DLD_MODE2 = 1 (Digital Lock Detect is now Frequency Calibration Routine Complete)
– R0: 0_DELAY_MODE = 0
– R0: FB_MUX = desired feedback path for 0-delay mode.
– RX: CLKoutX_EN = 1 for used clock outputs.
• Program R8 for optimum phase noise performance.
• Program R9 with Vboost setting if necessary.
• Program R11 with DIV4 setting if necessary.
• Program R13 with oscillator input frequency and internal loop filter values.
• Program R14 with Fout enable bit, global clock output bit, power down setting, PLL mux setting,
PLL_R divider, and global PLL R delay.
– R14: EN_CLKout_Global = 1
– R14: PLL_MUX = 3 or 4 for frequency calibration routine complete signal.
• Program R15 with PLL charge pump gain, VCO divider, PLL N divider, and global PLL N delay. The
frequency calibration routine starts.
Now the LD pin should be monitored for the frequency calibration routine completed signal to be asserted
if PLL_MUX was set to 3 or 4 and DLD_MODE2 = 1. Otherwise wait 2 ms for the frequency calibration
routine to complete. Once the frequency calibration routine is completed step 2 may be executed to
achieve 0-delay mode. With the addition of the clock output divide in the feedback path, the total N
feedback divide will change and the device will need to be programmed in this step to accommodate this
extra divide.
Step 2
• Program R0 with the same settings as in step 1 except:
– 0_DELAY_MODE = 1 to activate 0-delay mode.
• The output being used for feedback must be enabled for the device to lock. This means that...
– GOE pin is high. (set high if low from step 1).
– SYNC* pin is high.
– CLKoutX_EN bit is 1. (For all clocks being used)
– EN_CLKout_Global bit is 1.
• Special feedback cases:
– When CLKout 5 is used for feedback, CLKout 6 must also be enabled (CLKout6_EN = 1). The
configuration of the channel does not matter.
– When FBCLKin/FBCLKin* is used for feedback, CLKout 5 and CLKout 6 must be enabled
(CLKout5_EN = 1 and CLKout6_EN = 1). The configuration of the channels does not matter, except
when CLKout 5 or CLKout 6 is the source channel which drives FBCLKin/FBCLKin*.
• Program R15 with new PLL_N value.
The device will now synchronize clock outputs with reference input. As soon as the device is settled the
LD pin will be asserted active high or low depending on PLL_MUX value to indicate the device is phase
locked. 0_DELAY_MODE = 1 reverts the LD pin back to digital lock detect.
The device is now phase locked and synchronized with the reference clock. Since step 2 requires GOE
high for feedback, it is possible that the clock outputs will be momentarily slightly off frequency while the
dividers and or feedback paths are being changed. Also when GOE is set high, it is possible for a runt
pulse to occur since GOE is an asynchronous input. If there is no concern for off frequency clock cycles
then it is allowable to leave GOE high for the entire programming procedure.
Before 0-delay mode the VCO frequency equation is: VCO Frequency = Reference OSCin Frequency /
PLL R Divider * PLL N Divider * VCO divider.

20 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

After 0-delay mode the VCO frequency equation is: VCO Frequency = Reference OSCin Frequency / PLL
R Divider * PLL N Divider * VCO divider * CLKoutX_DIV. Where CLKoutX_DIV is the divide value of the
clock used for feedback. If the clock is from FBCLKin, any external divides must also be accounted for.

6.2.1 0-Delay Mode Example 1

In this example assume the user requirements are: an input reference of 10 MHz and a clock output of 30
MHz with the clock output synchronized to the reference input clock. CLKout5 is chosen as the output
clock because it allows internal feedback for the 0-delay mode.
Registers which are not explicitly programmed are set to default values.
Step 1
• GOE pin is set low.
• Program Register 0 (reset device)
– RESET = 1
– Other values don't matter
• Program Register 0 again.
– RESET = 0
– DLD_MODE2 = 1 (Digital Lock detect will be used for monitoring frequency calibration routine
complete)
– FB_MUX = 0 (CLKout5 feedback)
• Program Register 5 (30 MHz, used for feedback)
– CLKout5_EN = 1 (turn output on)
– CLKout5_MUX = 1 (divided)
– CLKout5_DIV = 10 (divide by 20)
• Program Register 6 (Must be enabled when using CLKout5 for feedback)
– CLKout6_EN = 1 (turn output on)
• Program Register 8
• Program Register 14
– PLL_R = 1 (Phase detector frequency = 10 MHz)
– PLL_MUX = 3 (DLD Active High)
• Program Register 15 (VCO Frequency = 1200 MHz)
– PLL_N = 60
– VCO_DIV = 2
– PLL_CP_GAIN = Loop filter dependant
• Begin monitoring LD pin for frequency calibration routine complete signal.
The device now begins the frequency calibration routine, when it completes the LD pin will go high since
PLL_MUX was programmed with the active high option for the frequency calibration routine complete
signal. When the LD pin goes high, step 2 is executed.
Step 2
• Set GOE pin high.
• Program Register 0
– RESET = 0
– 0_DELAY_MODE = 1 (activate 0-delay mode)
– DLD_MODE2 = 1 (same, don't care)
– FB_MUX = 0 (same)

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 21

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

• Program Register 15 (VCO Frequency = 1200 MHz)

– PLL_N = 3 (updated value)
– VCO_DIV = 2 (same)
– PLL_CP_GAIN = Loop filter dependant
The device will now synchronize. As soon as the device is settled the LD pin will go high to indicate the
device is phase locked (0_DELAY_MODE = 1 reverts the LD pin back to digital lock detect mode). Now
the device's VCO will be locked to 1200 MHz with an output clock of 30 MHz.

6.2.2 0-Delay Mode Example 2

In this example assume the user requirements are: an input reference of 61.44 MHz and clock outputs of
12.288 MHz (CLKout6), 30.72 MHz (CLKout3), and 61.44 MHz (CLKout4) with the clock outputs
synchronized to the reference input clock. CLKout6 is chosen for feedback since the 12.288 MHz clock is
the lowest frequency required to be synchronized (0-delay) with the reference and therefore must be fed
back to the PLL N divider, note this also limits the phase detector frequency to 12.288 MHz so the input
reference must be divided down to 12.288 MHz. If the 12.288 MHz clock wasn't required to be in
synchronization (0-delay) with the reference, the 30.72 MHz clock could have been fed back instead
rasing the maximum allowable phase detector frequency to 30.72 MHz.
Registers which are not explicitly programmed are set to default values.
Step 1
• GOE pin is set low.
• Program Register 0 (reset device)
– RESET = 1
– Other values don't matter
• Program Register 0 again.
– RESET = 0
– DLD_MODE2 = 1 (Digital Lock detect will be used for monitoring frequency calibration routine
complete)
– FB_MUX = 2 (CLKout6 feedback)
• Program Register 3 (30.72 MHz)
– CLKout3_EN = 1 (turn output on)
– CLKout3_MUX = 1 (divided)
– CLKout3_DIV = 10 (divide by 20)
• Program Register 4 (61.44 MHz)
– CLKout4_EN = 1 (turn output on)
– CLKout4_MUX = 1 (divided)
– CLKout4_DIV = 5 (divide by 10)
• Program Register 6 (12.288 MHz, used for feedback)
– CLKout6_EN = 1 (turn output on)
– CLKout6_MUX = 1 (divided)
– CLKout6_DIV = 25 (divide by 50)
• Program Register 8
• Program Register 14
– PLL_R = 5 (Phase detector frequency = 12.288 MHz)
– PLL_MUX = 3 (DLD Active High)
• Program Register 15 (VCO Frequency = 1228.8 MHz)
– PLL_N = 50
– VCO_DIV = 2
– PLL_CP_GAIN = Loop filter dependant
22 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

• Begin monitoring LD pin for frequency calibration routine complete signal.

The device now begins the frequency calibration routine, when it completes the LD pin will go high since
PLL_MUX was programmed with the active high option for the frequency calibration routine complete
signal. When the LD pin goes high, step 2 is executed.
Step 2
• GOE pin is set high.
• Program Register 0
– RESET = 0
– 0_DELAY_MODE = 1 (activate 0-delay mode)
– DLD_MODE2 = 1 (same, don't care)
– FB_MUX = 2 (CLKout6 feedback)
• Program Register 15 (VCO Frequency = 1228.8 MHz)
– PLL_N = 1 (updated value)
– VCO_DIV = 2 (don't care)
– PLL_CP_GAIN = Loop filter dependant
The device will now synchronize. As soon as the device is settled the LD pin will go high to indicate the
device is phase locked (0_DELAY_MODE = 1 reverts the LD pin back to digital lock detect). Now the
device's VCO will be locked to 1228.8 MHz with the output clocks of 12.288, 30.72, and 61.44 MHz.

6.3 Recommended Programming Sequence, bypassing VCO divider

The programming procedure when using the VCO mux to bypass the VCO divider has two steps. The first
step runs the frequency calibration routine with the VCO divider in the feedback path. The second step
bypasses the VCO divider and locks the PLL.
Step 1
• Program R0 with the reset bit set (RESET = 1). This ensures the device is in a default state. When the
reset bit is set in R0, the other R0 bits are ignored.
– If R0 is programmed again, the reset bit is programmed clear (RESET = 0).
• Program R0 to R7 as necessary with desired clocks with appropriate enable, mux, divider, and delay
settings.
– The outputs should be programmed with divider values which achieve desired output frequencies
after the VCO divider has been bypassed.
– R0: DLD_MODE2 = 1 (Digital Lock Detect is now Frequency Calibration Routine Complete)
– R7: VCO_MUX = 0 (VCO divider output, default)
• Program R8 for optimum phase noise performance.
• Program R9 with Vboost setting if necessary.
• Program R11 with DIV4 setting if necessary.
• Program R13 with oscillator input frequency and internal loop filter values.
• Program R14 with Fout enable bit, global clock output bit, power down setting, PLL mux setting, and
PLL_R divider.
– R14: PLL_MUX = 3 or 4 for frequency calibration routine complete signal.
• Program R15 with PLL charge pump gain, VCO divider, and PLL N divider. The frequency calibration
routine starts.
Now the LD pin should be monitored for the frequency calibration routine completed signal to be asserted
if PLL_MUX was set to 3 or 4 and DLD_MODE2 = 1. Otherwise wait 2 ms for the frequency calibration
routine to complete. Once the frequency calibration routine is completed step 2 may be executed to
bypass the VCO divider.
Step 2

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 23

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

• Program R0 with the same settings as step 1 except:

– DLD_MODE2 = 0 (Digital lock detect is normal)
– 0_DELAY_MODE = 1 (temporarily enable 0-delay mode)
• 0_DELAY_MODE is not to be used in VCO divider bypass mode. It is only activated briefly to
prevent the frequency calibration routine from running when R15 is programmed while the VCO
Mux is selecting the VCO Output directly.
• Program R7
– VCO_MUX = 2 (VCO output)
• Program R14 with PLL_MUX as desired, or PLL_MUX = 3 or 4 for Lock Detect.
• Program R15 with the updated PLL_N value since the VCO divider is no longer in the feedback path.
The updated value of PLL_N = Old PLL_N * VCO_Divider value. This programs the VCO to the same
frequency as step 1. The VCO must be programmed for the same frequency as step 1.
• Program R0 with the same settings except:
– 0_DELAY_MODE = 0 (disable 0-delay mode)
After a short settling time, the VCO will be locked and the clock outputs will be at the desired frequency.
The LD pin will indicate when the PLL is locked if PLL_MUX is programmed to a digital lock detect mode.

6.3.1 VCO divider bypass example

In this example assume the user requirements are: an input reference of 61.44 MHz and clock output
frequencies of 614.4 MHz on CLKout0 and CLKout1, and 307.2 MHz on CLKout2. The VCO is
programmed to 1228.8 MHz.
Registers not explicitly programmed are set to default values.
Step 1
• GOE pin is set high
• Program Register 0 (reset device)
– RESET = 1
– Other values don't matter
• Program Register 0 again (614.4 MHz)
– DLD_MODE2 = 1 (Digital Lock detect will be used for monitoring frequency calibration routine
complete)
– CLKout0_EN = 1 (turn output on)
– CLKout0_MUX = 0 (bypassed)
• Program Register 1 (614.4 MHz)
– CLKout1_EN = 1 (turn output on)
– CLKout1_MUX = 0 (bypassed)
• Program Register 2 (307.2 MHz)
– CLKout2_EN = 2 (turn output on)
– CLKout2_MUX = 1 (divide)
– CLKout2_DIV = 1 (divide by 2)
• Program Register 8
• Program Register 14
– PLL_R = 2 (Phase detector frequency = 30.72 MHz)
– PLL_MUX = 3 (DLD Active High, now frequency calibration routine complete)
– Program Register 15 (VCO Frequency = 1228.8 MHz)
– PLL_N = 20
– VCO_DIV = 2
– PLL_CP_GAIN = Loop filter dependant

24 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

• Begin monitoring LD pin lock detect.

The device now beings the frequency calibration routine, when it completes the LD pin will go high since
PLL_MUX was programmed with the active high option for lock detect and DLD_MODE2 = 1. When the
LD pin goes high, or after 2 ms have passed (the time for frequency calibration routine to complete), step
2 is executed. Note that VCO_DIV = 0 was not programmed to select VCO Divider since that is the default
mode.
At this time the clock output frequency will be half the final value because VCO_DIV = 2. If VCO_DIV was
= 3, the clock output frequencies would be a third the final value, etc.
Step 2
• Program Register 0
– DLD_MODE2 = 0 (Digital lock detect is normal)
– 0_DELAY_MODE = 1 (active 0-delay mode so that programming R15 won't start frequency
calibration routine)
– CLKout0_EN = 1 (keep same programming)
– CLKout0_MUX = 0 (keep same programming)
• Program Register 7
– VCO_MUX = 2 (bypass VCO divider)
• Program Register 15 (VCO Frequency = 1228.8 MHz)
– PLL_N = 40 (VCO_DIV bypassed, must update PLL_N)
• Program Register 0
– 0_DELAY_MODE = 0
– CLKout0_EN = 1 (keep same programming)
– CLKout0_MUX = 0 (keep same programming)
When R7 is updated to bypass the VCO divider the PLL will loose lock until R15 can be updated again
with the updated PLL_N divider value.
Once the LD pin goes high again, the clock outputs will be locked at 614.4 MHz and 307.2 MHz.

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 25

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Table 6-1. Register Map

Register 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Data [27:0] A3 A2 A1 A0

0_DELAY_MODE
DLD_MODE2

CLKout0_EN
RESET

CLKout0
FB_MUX CLKout0_DIV CLKout0_DLY
R0 0 0 0 0 0 0 0 0 _MUX 0 0 0 0
[1:0] [7:0] [3:0]
[1:0]

CLKout6_EN CLKout5_EN CLKout4_EN CLKout3_EN CLKout2_EN CLKout1_EN

CLKout1
CLKout1_DIV CLKout1_DLY
R1 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX 0 0 0 1
[7:0] [3:0]
[1:0]

CLKout2
CLKout2_DIV CLKout2_DLY
R2 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX 0 0 1 0
[7:0] [3:0]
[1:0]

CLKout3
CLKout3_DIV CLKout3_DLY
R3 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX 0 0 1 1
[7:0] [3:0]
[1:0]

CLKout4
CLKout4_DIV CLKout4_DLY
R4 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX 0 1 0 0
[7:0] [3:0]
[1:0]

CLKout5
CLKout5_DIV CLKout5_DLY
R5 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX 0 1 0 1
[7:0] [3:0]
[1:0]

CLKout6
CLKout6_DIV CLKout6_DLY
R6 0 0 0 0 0 0 0 0 0 0 0 0 0 _MUX 0 1 1 0
[7:0] [3:0]
[1:0]

26 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

Table 6-1. Register Map (continued)

Register 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0

CLKout7_EN
VCO CLKout7
CLKout7_DIV CLKout7_DLY
R7 0 0 0 0 0 _MUX 0 0 0 0 0 0 _MUX 0 1 1 1
[7:0] [3:0]
[1:0] [1:0]

R8 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 0 0 0 1 0 0 0

Vboost
R9 1 0 1 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 0 1 0 1 0 0 0 0 0 1 0 0 1

DI
R11 0 0 0 0 0 0 0 0 1 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 1
V4
VCO_ VCO_ VCO_
OSCin_FREQ
R13 0 0 0 0 0 0 1 0 1 0 R4_LF R3_LF C3_C4_LF 1 1 0 1
[7:0]
[2:0] [2:0] [3:0]
EN_CLKout_Global

POWERDOWN
EN_Fout

PLL_MUX PLL_R PLL_R_DLY

R14 0 0 0 0 0 1 1 1 0
[3:0] [11:0] [3:0]

PLL_
CP_ VCO_DIV PLL_N PLL_N_DLY
R15 1 1 1 1
GAIN [3:0] [17:0] [3:0]
[1:0]

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 27

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

6.4 Register R0 to R7
Registers R0 through R7 control the eight clock outputs. Register R0 controls CLKout0, Register R1
controls CLKout1, and so on. There are some additional bit in register R0 called RESET, DLD_MODE2,
0_DELAY_MODE, and FB_MUX. Aside from these, the functions of these bits in registers R0 through R7
are identical. The X in CLKoutX_MUX, CLKoutX_DIV, CLKoutX_DLY, and CLKoutX_EN denote the actual
clock output which may be from 0 to 7.

Table 6-2. Default Register Settings after Power on Reset

Default Bit
Bit Name Bit State Bit Description Register
Bit Value Location
RESET 0 No reset, normal operation Reset to power on defaults 31
DLD_MODE2 0 Disabled Digital Lock Detect Mode2 is disabled 28
R0
0_DELAY_MODE 0 Disabled Not 0-delay mode 27
FB_MUX 0 CLKout5 0-delay mode feedback 26:25
CLKoutX_MUX 0 Bypassed CLKoutX mux mode 18:17
CLKoutX_EN 0 Disabled CLKoutX enable 16
R0 to R7
CLKoutX_DIV 1 Divide by 2 CLKoutX clock divide 15:8
CLKoutX_DLY 0 0 ps CLKoutX clock delay 7:4
VCO_MUX 0 Use VCO divider VCO divider bypassed mode R7 26:25
Vboost 0 Normal Mode Output Power Control R9 16
DIV4 0 PDF ≤ 20 MHz Phase Detector Frequency R11 15
OSCin_FREQ 10 10 MHz OSCin OSCin Frequency in MHz 21:14
VCO_R4_LF 0 Low (~200 Ω) R4 internal loop filter values 13:11
R13
VCO_R3_LF 0 Low (~600 Ω) R3 internal loop filter values 10:8
VCO_C3_C4_LF 0 C3 = 0 pF, C4 = 10 pF C3 and C4 internal loop filter values 7:4
EN_Fout 0 Fout disabled Fout enable 28
EN_CLKout_Global 1 Normal - CLKouts normal Global clock output enable 27
POWERDOWN 0 Normal - Device active Device power down 26
R14
PLL_MUX 0 Disabled Multiplexer control for LD pin 23:20
PLL_R 10 R divider = 10 PLL R divide value 19:8
PLL_R_DLY 0 0 ps PLL R delay value (lag) 7:4
PLL_CP_GAIN 0 100 µA Charge pump current 31:30
VCO_DIV 2 Divide by 2 VCO divide value 29:26
R15
PLL_N 760 N divider = 760 PLL N divide value 25:8
PLL_N_DLY 0 0 ps PLL N delay value (lead) 7:4

6.4.1 Reset bit -- Reset device to power on defaults

This bit is only in register R0. The use of this bit is optional and it should be set to '0' if not used. Setting
this bit to a '1' forces all registers to their power on reset condition and therefore automatically clears this
bit. If this bit is set, all other R0 bits are ignored and R0 needs to be programmed again if used with its
proper values and RESET = 0.

28 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

6.4.2 DLD_MODE2 bit -- Digital Lock Detect Mode 2

This bit is only in register R0. The output of the LD pin is defined by register PLL_MUX (See
Section 6.9.2). When a Digital Lock Detect output is selected, setting this bit overrides the default
functionality allowing the user to determine when the frequency calibration routine is done. When using 0-
delay mode this informs the user when the 0-delay mode can be activated. See section Section 6.2 for
more information.
DLD_MODE2 0_DELAY_MODE LD Output
0 (default) X Digital Lock Detect
1 0 Digital Calibration Complete
1 1 Digital Lock Detect

6.4.3 0_DELAY_MODE bit -- Activate 0-Delay Mode

This bit is only in register R0 and is used for activating the 0-delay mode. Once the frequency calibration
routine is complete - as determined by monitoring the LD output in DLD_MODE2 or waiting 2 ms after
programming R15, this bit may be set to activate 0-delay mode. Setting this bit sets the N divider mux to
use the feedback mux for input and prevents the frequency calibration routine from activating when
register R15 is programmed. Once this bit is set and the 0-delay path is completed, the PLL_N divider in
register R15 will need to be reprogrammed for final phase lock. See section Section 6.2 for more
information. Also refer to Section 6.4.4 for more information on proper configuration of the device for
feedback of the selected signal.
0_DELAY_MODE Frequency Calibration N divider mux
Routine (Ndiv Mux)
0 (default) Enabled VCO Divider
1 Disabled Feedback Mux (FB_MUX)

6.4.4 FB_MUX [1:0] -- Feedback Mux

This bit is only in register R0 and is for use with the 0-delay mode.
FB_MUX [1:0] Mode
0 CLKout5 (default)
1 FBCLKin/FBCLKin* Input
2 CLKout6
3 Reserved

When using CLKout5 and FBCLKin/FBCLKin* for feedback for 0-delay mode, the proper clock outputs
must be enabled to pass the feedback signal back to the N divider. Refer to the table below for more
details. The only requirement given by the table below is that the clock output must be enabled with
CLKoutX_EN bits, if the clock is only used for feedback, the clock does not need to be terminated which
saves power. The simplest feedback path to use is CLKout6 since it does not require another CLKout to
be enabled.
Clock Feedback Source CLKout5_EN (See CLKoutX_EN bit) CLKout6_EN (See CLKoutX_EN bit)
CLKout 5 1 1
FBCLKin/FBCLKin* 1 1
CLKout 6 Don't care 1

The electrical specification td0-DELAY is given with the condition FB_MUX = 0 (CLKout5). If FB_MUX = 2
(CLKout6), then td0-DELAY, OSCin to CLKoutX 0-delay, increases 100 ps.

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 29

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

6.4.5 VCO_MUX [1:0] -- VCO Mux

This bit is only in register R7 and is used to select either the VCO divider output or the VCO output for the
clock distribution path. By selecting the VCO output (VCO_MUX=2), the VCO divider is bypassed allowing
a higher frequency at the channel divider inputs, which can be used to generate output frequencies not
allowable otherwise.
Important: The VCO calibration routine requires that the VCO divider (VCO_MUX = 0) is selected when
programming R15.
The VCO divider (VCO_MUX=0) must be selected for the VCO calibration routine to operate properly.
Important: When bypassing the VCO divider (VCO_MUX=2), 0-delay mode may not be used. However
0_DELAY_MODE is set to 1 when re-programming PLL_N after the VCO divider has been bypassed to
prevent the frequency calibration routine from running. The new PLL_N value = Old PLL_N * VCO divider.
Once PLL_N is re-programmed 0_DELAY_MODE is set back to 0. See the programming section,
Section 6.3, for more information.
VCO_MUX [1:0] Mode
0 VCO Divider (default)
1 Reserved
2 VCO
3 Reserved

6.4.6 CLKoutX_MUX [1:0] -- Clock Output Multiplexers

These bits control the Clock Output Multiplexer for each clock output. Changing between the different
modes changes the blocks in the signal path and therefore incurs a delay relative to the bypass mode.
The different MUX modes and associated delays are listed below.
CLKoutX_MUX [1:0] Mode Added Delay Relative to Bypass Mode
0 Bypassed (default) 0 ps
1 Divided 100 ps
400 ps
2 Delayed
(In addition to the programmed delay)
500 ps
3 Divided and Delayed
(In addition to the programmed delay)

30 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

6.4.7 CLKoutX_DIV [7:0] -- Clock Output Dividers

These bits control the clock output divider value. In order for these dividers to be active, the respective
CLKoutX_MUX bit must be set to either "Divided" or "Divided and Delayed" mode. After all the dividers are
programed, the SYNC* pin must be used to ensure that all edges of the clock outputs are aligned. The
Clock Output Dividers follow the VCO Divider so the final clock divide for an output is VCO Divider × Clock
Output Divider. By adding the divider block to the output path a fixed delay of approximately 100 ps is
incurred.
The actual Clock Output Divide value is twice the binary value programmed as listed in the table below.
CLKoutX_DIV [7:0] Clock Output Divider value
0 0 0 0 0 0 0 0 Invalid
0 0 0 0 0 0 0 1 2 (default)
0 0 0 0 0 0 1 0 4
0 0 0 0 0 0 1 1 6
0 0 0 0 0 1 0 0 8
0 0 0 0 0 1 0 1 10
. . . . . . . . ...
1 1 1 1 1 1 1 1 510

6.4.8 CLKoutX_DLY [3:0] -- Clock Output Delays

These bits control the delay stages for each clock output. In order for these delays to be active, the
respective CLKoutX_MUX bit must be set to either "Delayed" or "Divided and Delayed" mode. By adding
the delay block to the output path a fixed delay of approximately 400 ps is incurred in addition to the delay
shown in the table below.
CLKoutX_DLY [3:0] Delay (ps)
0 0 (default)
1 150
2 300
3 450
4 600
5 750
6 900
7 1050
8 1200
9 1350
10 1500
11 1650
12 1800
13 1950
14 2100
15 2250

6.4.9 CLKoutX_EN bit -- Clock Output Enables

These bits control whether an individual clock output is enabled or not. If the EN_CLKout_Global bit is set
to zero or if GOE pin is held low, all CLKoutX_EN bit states will be ignored and all clock outputs will be
disabled.
CLKoutX_EN bit Conditions CLKoutX State
0 EN_CLKout_Global bit = 1 Disabled (default)
GOE pin = High / No Connect
1 Enabled

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 31

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

6.5 Register R8
There are no user programmable bits in register R8. Register R8 is programmed as shown in the section
for optimum phase noise performance.

6.6 Register R9
The programming of register R9 is optional. If it is not programmed the bit Vboost will be defaulted to 0,
which is the test condition for all electrical characteristics.

6.6.1 Vboost bit -- Voltage Boost

By enabling this bit, the voltage output levels for all clock outputs is increased. Also, the noise floor is
improved
Vboost Typical LVDS Voltage Output (mV) Typical LVPECL Voltage Output (mV)
0 350 810
1 390 865

6.7 Register R11

This register only has one bit and only needs to be programmed in the case that the phase detector
frequency is greater than 20 MHz and digital lock detect is used. Otherwise, it is automatically defaulted to
the correct values.

6.7.1 DIV4 -- High Phase Detector Frequencies and Lock Detect

This bit divides the frequency presented to the digital lock detect circuitry by 4. It is necessary to get a
reliable output from the digital lock detect output in the case of a phase detector frequency greater than 20
MHz.
DIV4 Digital Lock Detect Circuitry Mode
Not divided
0
Phase Detector Frequency ≤ 20 MHz (default)
Divided by 4
1
Phase Detector Frequency > 20 MHz

32 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

6.8 Register R13

6.8.1 VCO_C3_C4_LF [3:0] -- Value for Internal Loop Filter Capacitors C3 and C4
These bits control the capacitor values for C3 and C4 in the internal loop filter.
Loop Filter Capacitors
VCO_C3_C4_LF [3:0] C3 (pF) C4 (pF)
0 0 (default) 10 (default)
1 0 60
2 50 10
3 0 110
4 50 110
5 100 110
6 0 160
7 50 160
8 100 10
9 100 60
10 150 110
11 150 60
12 to 15 Invalid

6.8.2 VCO_R3_LF [2:0] -- Value for Internal Loop Filter Resistor R3

These bits control the R3 resistor value in the internal loop filter. The recommended setting for
VCO_R3_LF[2:0] = 0 for optimum phase noise and jitter.
VCO_R3_LF[2:0] R3 Value (kΩ)
0 Low (~600 Ω) (default)
1 10
2 20
3 30
4 40
5 to 7 Invalid

6.8.3 VCO_R4_LF [2:0] -- Value for Internal Loop Filter Resistor R4

These bits control the R4 resistor value in the internal loop filter. The recommended setting for
VCO_R4_LF[2:0] = 0 for optimum phase noise and jitter.
VCO_R4_LF[2:0] R4 Value (kΩ)
0 Low (~200 Ω) (default)
1 10
2 20
3 30
4 40
5 to 7 Invalid

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 33

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

6.8.4 OSCin_FREQ [7:0] -- Oscillator Input Calibration Adjustment

These bits are to be programmed to the OSCin frequency. If the OSCin frequency is not an integral
multiple of 1 MHz, then round to the closest value.
OSCin_FREQ [7:0] OSCin Frequency
1 1 MHz
2 2 MHz
... ...
10 10 MHz (default)
... ...
200 200 MHz
201 to 255 Invalid

6.9 Register R14

6.9.1 PLL_R [11:0] -- R Divider Value

These bits program the PLL R Divider and are programmed in binary fashion. Any changes to PLL_R
require R15 to be programmed again while 0_DELAY_MODE = 0 to active the frequency calibration
routine.
PLL_R [11:0] PLL R Divide Value
0 0 0 0 0 0 0 0 0 0 0 0 Invalid
0 0 0 0 0 0 0 0 0 0 0 1 1
0 0 0 0 0 0 0 0 0 0 1 0 2
. . . . . . . . . . . . ...
0 0 0 0 0 0 0 0 1 0 1 0 10 (default)
. . . . . . . . . . . . ...
1 1 1 1 1 1 1 1 1 1 1 1 4095

34 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

6.9.2 PLL_MUX[3:0] -- Multiplexer Control for LD Pin

These bits set the output mode of the LD pin. The table below lists several different modes. Note that
PLL_MUX = 3 and PLL_MUX = 4 have alternate functionality if DLD_MODE2 (section Section 6.4.2) is
set.
PLL_MUX [3:0] Output Type LD Pin Function
0 Hi-Z Disabled (default)
1 Push-Pull Logic High
2 Push-Pull Logic Low
Digital Lock Detect (Active High)
3 Push-Pull (1)

Digital Lock Detect (Active Low)

4 Push-Pull (2)

5 Push-Pull Analog Lock Detect

Open Drain
6 Analog Lock Detect
NMOS
Open Drain
7 Analog Lock Detect
PMOS
8 Invalid
9 Push-Pull N Divider Output/2 (50% Duty Cycle)
10 Invalid
11 Push-Pull R Divider Output/2 (50% Duty Cycle)
12 to 15 Invalid
(1) If DLD_MODE2 is set, this functionality is redefined to "Frequency Calibration Routine Complete (Active High)." See Section 6.4.2 for
more information.
(2) If DLD_MODE2 is set, this functionality is redefined to "Frequency Calibration Routine Complete (Active Low)." See Section 6.4.2 for
more information.

Analog Lock Detect outputs the state of the charge pump on the LD pin. While the charge pump is on, the
LD pin is low. While the charge pump is off, the LD pin is high. By using two resistors, a capacitor, diode,
and comparator a lock detect circuit may be constructed. (For more information on lock detect circuits, see
chapter 32 of PLL Performance, Simulation and Design Handbook, Fourth Edition by Dean Banerjee.)
When in lock the charge pump will only turn on momentarily once every period of the phase detector
frequency. "N Divider Output/2" and "R Divider Output/2" output half the frequency of the phase detector
on the LD pin. When the device is locked, these frequencies should be the same. These options are
useful for debugging.

6.9.3 POWERDOWN bit -- Device Power Down

This bit can power down the device. Enabling this bit powers down the entire device and all blocks,
regardless of the state of any of the other bits or pins.
POWERDOWN bit Mode
0 Normal Operation (default)
1 Entire Device Powered Down

6.9.4 EN_CLKout_Global bit -- Global Clock Output Enable

This bit overrides the individual CLKoutX_EN bits. When this bit is set to 0, all clock outputs are disabled,
regardless of the state of any of the other bits or pins.
EN_CLKout_Global bit Clock Outputs
0 All Off
1 Normal Operation (default)

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 35

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

6.9.5 EN_Fout bit -- Fout port enable

This bit enables the Fout pin.
EN_Fout bit Fout Pin Status
0 Disabled (default)
1 Enabled

6.9.6 PLL_R_DLY [3:0] - Global Skew Adjust, Lag

These bits control the delay stage in front of the R input of the phase detector. The affect of adjusting this
delay is to lag the phase of the clock outputs uniformly from the clock input phase by the specified
amount.
PLL_R_DLY[3:0] Delay (ps)
0 0 (default)
1 150
2 300
3 450
4 600
5 750
6 900
7 1050
8 1200
9 1350
10 1500
11 1650
12 1800
13 1950
14 2100
15 2250

36 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

6.10 REGISTER R15

Programming R15 also activates the frequency calibration routine while 0_DELAY_MODE = 0.
Programming R15 also causes a global synchronization operation. See sections Section 6.4.3 and
Section 5.6 respectively for more information.

6.10.1 PLL_N [17:0] -- PLL N Divider

These bits program the divide value for the PLL N Divider. The PLL N Divider follows the VCO Divider and
precedes the PLL phase detector. Since the VCO Divider is also in the feedback path from the VCO to the
PLL Phase Detector, the total N divide value, NTotal, is also influenced by the VCO Divider value. NTotal =
PLL N Divider × VCO Divider. The VCO frequency is calculated as, fVCO = fOSCin × PLL N Divider × VCO
Divider / PLL R Divider. Since the PLL N divider is a pure binary counter there are no illegal divide values
for PLL_N [17:0] except for 0.
PLL_N [17:0] PLL N Divider Value
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Invalid
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1
. . . . . . . . . . . . . . . . . . ...
0 0 0 0 0 0 0 0 1 0 1 1 1 1 1 0 0 0 760 (default)
. . . . . . . . . . . . . . . . . . ...
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 262143

6.10.2 VCO_DIV [3:0] -- VCO Divider

These bits program the divide value for the VCO Divider. The VCO Divider follows the VCO output and
precedes the clock distribution blocks. Since the VCO Divider is in the feedback path from the VCO to the
PLL phase detector the VCO Divider contributes to the total N divide value, NTotal. NTotal = PLL N Divider ×
VCO Divider. The VCO Divider can not be bypassed. See Section 6.10.1 for more information on setting
the VCO frequency.
VCO_DIV [3:0] VCO Divider Value
0 0 0 0 Invalid
0 0 0 1 Invalid
0 0 1 0 2 (default)
0 0 1 1 3
0 1 0 0 4
0 1 0 1 5
0 1 1 0 6
0 1 1 1 7
1 0 0 0 8
1 0 0 1 Invalid
. . . . ...
1 1 1 1 Invalid

Copyright © 2009–2013, Texas Instruments Incorporated General Programming Information 37

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

6.10.3 PLL_CP_GAIN [1:0] -- PLL Charge Pump Gain

These bits set the charge pump gain of the PLL.
PLL_CP_GAIN [1:0] Charge Pump Gain
0 1x (default)
1 4x
2 16x
3 32x

6.10.4 PLL_N_DLY [3:0] - Global Skew Adjust, Lead

These bits control the delay stage in front of the N input of the phase detector. The affect of adjusting this
delay is to lead the phase of the clock outputs uniformly from the clock input phase by the specified
amount.
PLL_N_DLY [3:0] Delay (ps)
0 0 (default)
1 150
2 300
3 450
4 600
5 750
6 900
7 1050
8 1200
9 1350
10 1500
11 1650
12 1800
13 1950
14 2100
15 2250

38 General Programming Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

7 Application Information

7.1 SYSTEM LEVEL DIAGRAM

Vcc

1 PF

CPout

Bias
0.1 PF
OSCin CLKout0
CLKout0*
100Ö
CLKout1
OSCin*
CLKout1*
0.1 PF
CLKout2
CLKout2*
LEuWire
CLKuWire CLKout3
DATAuWire CLKout3*

CLKout4
To System
To Host SYNC* CLKout4*
LMK03200
CLKout5
LD
Family CLKout5*
(optional) GOE CLKout6
CLKout6*
Optional external FBCLKin
feedback from CLKout7
CLKoutX/X* FBCLKin*
for 0-delay mode CLKout7*
LDObyp1
LDObyp2

10 PF 0.1 PF

Figure 7-1. Typical Application

Figure 7-1 shows an LMK03200 family device used in a typical application. In this setup the clock may be
multiplied, reconditioned, and redistributed. Both the OSCin/OSCin* and CLKoutX/CLKoutX* pins can be
used in a single-ended or a differential fashion, which is discussed later in this datasheet. The GOE pin
needs to be high for the outputs to operate. One technique sometimes used is to take the output of the LD
(Lock Detect) pin and use this as an input to the GOE pin. If this is done, then the outputs will turn off if
lock detect circuit detects that the PLL is out of lock. The loop filter actually consists of seven components,
but four of these components that for the third and fourth poles of the loop filter are integrated in the chip.
The first and second pole of the loop filter are external.

7.2 BIAS PIN

See section Section 5.1 for more information.

7.3 LDO BYPASS

See section Section 5.2 for more information.

Copyright © 2009–2013, Texas Instruments Incorporated Application Information 39

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

7.4 LOOP FILTER

LMK03200 Family

R3 R4
Phase
Detector

C3 C4

Internal Loop Filter

C2

C1 External Loop Filter

R2

Figure 7-2. Loop Filter

The internal charge pump is directly connected to the integrated loop filter components. The first and
second pole of the loop filter are externally attached as shown in Figure 7-2. When the loop filter is
designed, it must be stable over the entire frequency band, meaning that the changes in KVtune from the
low to high band specification will not make the loop filter unstable. The design of the loop filter is
application specific and can be rather involved, but is discussed in depth in the Clock Conditioner Owner's
Manual provided by Texas Instruments. When designing with the integrated loop filter of the LMK03200
family, considerations for minimum resistor thermal noise often lead one to the decision to design for the
minimum value for integrated resistors, R3 and R4. Both the integrated loop filter resistors and capacitors
(C3 and C4) also restrict how wide the loop bandwidth the PLL can have. However, these integrated
components do have the advantage that they are closer to the VCO and can therefore filter out some
noise and spurs better than external components. For this reason, a common strategy is to minimize the
internal loop filter resistors and then design for the largest internal capacitor values that permit a wide
enough loop bandwidth. In some situations where spurs requirements are very stringent and there is
margin on phase noise, it might make sense to design for a loop filter with integrated resistor values that
are larger than their minimum value.

40 Application Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

7.5 CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS

Due to the myriad of possible configurations the following table serves to provide enough information to
allow the user to calculate estimated current consumption of the device. Unless otherwise noted Vcc = 3.3
V, TA = 25 °C.

Table 7-1. Block Current Consumption

Power
Current Power
Dissipated in
Block Condition Consumption at Dissipated in
LVPECL emitter
3.3 V (mA) device (mW)
resistors (mW)
Entire device, All outputs off; No LVPECL emitter resistors connected
86.0 283.8 -
core current
Low clock buffer The low clock buffer is enabled anytime one of CLKout0
9 29.7 -
(internal) through CLKout3 are enabled
High clock buffer The high clock buffer is enabled anytime one of the
9 29.7 -
(internal) CLKout4 through CLKout7 are enabled
Fout buffer, EN_Fout = 1 14.5 47.8 -
LVDS output, Bypassed mode 17.8 58.7 -
LVPECL output, Bypassed mode (includes 120 Ω emitter
40 72 60
resistors)
Output buffers
LVPECL output, disabled mode (includes 120 Ω emitter
17.4 38.3 19.1
resistors)
LVPECL output, disabled mode. No emitter resistors
0 0 -
placed; open outputs
Divide circuitry Divide enabled, divide = 2 5.3 17.5 -
per output Divide enabled, divide > 2 8.5 28.0 -
Delay circuitry per Delay enabled, delay < 8 5.8 19.1 -
output,
PLL_R_DLY, or Delay enabled, delay > 7 9.9 32.7 -
PLL_N_DLY
Entire device CLKout0 & CLKout4 enabled in Bypassed mode 161.8 474 60

From Table 3.5 the current consumption can be calculated in any configuration. For example, the current
for the entire device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) output in Bypassed mode can be
calculated by adding up the following blocks: core current, low clock buffer, high clock buffer, one LVDS
output buffer current, and one LVPECL output buffer current. There will also be one LVPECL output
drawing emitter current, but some of the power from the current draw is dissipated in the external 120 Ω
resistors which doesn't add to the power dissipation budget for the device. If delays or divides are
switched in, then the additional current for these stages needs to be added as well.
For power dissipated by the device, the total current entering the device is multiplied by the voltage at the
device minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no
emitter resistors are connected to the LVPECL outputs, this power will be 0 watts. For example, in the
case of 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) operating at 3.3 volts, we calculate 3.3 V × (86 + 9 + 9
+ 17.8 + 40) mA = 3.3 V × 161.8 mA = 533.9 mW. Because the LVPECL output (CLKout4) has the emitter
resistors hooked up and the power dissipated by these resistors is 60 mW, the total device power
dissipation is 533.9 mW - 60 mW = 473.9 mW.
When the LVPECL output is active, ~1.9 V is the average voltage on each output as calculated from the
LVPECL Voh & Vol typical specification. Therefore the power dissipated in each emitter resistor is
approximately (1.9 V)2 / 120 Ω = 30 mW. When the LVPECL output is disabled, the emitter resistor
voltage is ~1.07 V. Therefore the power dissipated in each emitter resistor is approximately (1.07 V)2 / 120
Ω = 9.5 mW.

Copyright © 2009–2013, Texas Instruments Incorporated Application Information 41

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

7.6 THERMAL MANAGEMENT

Power consumption of the LMK03200 family of devices can be high enough to require attention to thermal
management. For reliability and performance reasons the die temperature should be limited to a maximum
of 125 °C. That is, as an estimate, TA (ambient temperature) plus device power consumption times θJA
should not exceed 125 °C.
The package of the device has an exposed pad that provides the primary heat removal path as well as
excellent electrical grounding to the printed circuit board. To maximize the removal of heat from the
package a thermal land pattern including multiple vias to a ground plane must be incorporated on the PCB
within the footprint of the package. The exposed pad must be soldered down to ensure adequate heat
conduction out of the package. A recommended land and via pattern can be downloaded from TI's
packaging website. See WQFN footprint gerbers at: [Link]
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the
ground plane layer is not exposed). This is done by including a copper area of about 2 square inches on
the opposite side of the PCB from the device. This copper area may be plated or solder coated to prevent
corrosion but should not have conformal coating (if possible), which could provide thermal insulation. The
vias should top and bottom copper layers to the ground layer. These vias act as “heat pipes” to carry the
thermal energy away from the device side of the board to where it can be more effectively dissipated.

42 Application Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

7.7 TERMINATION AND USE OF CLOCK OUTPUTS (DRIVERS)

When terminating clock drivers keep in mind these guidelines for optimum phase noise and jitter
performance:
• Transmission line theory should be followed for good impedance matching to prevent reflections.
• Clock drivers should be presented with the proper loads. For example:
– LVDS drivers are current drivers and require a closed current loop.
– LVPECL drivers are open emitter and require a DC path to ground.
• Receivers should be presented with a signal biased to their specified DC bias level (common mode
voltage) for proper operation. Some receivers have self-biasing inputs that automatically bias to the
proper voltage level. In this case, the signal should normally be AC coupled.
It is possible to drive a non-LVPECL or non-LVDS receiver with a LVDS or LVPECL driver as long as the
above guidelines are followed. Check the datasheet of the receiver or input being driven to determine the
best termination and coupling method to be sure that the receiver is biased at its optimum DC voltage
(common mode voltage). For example, when driving the OSCin/OSCin* input of the LMK03200 family,
OSCin/OSCin* should be AC coupled because OSCin/OSCin* biases the signal to the proper DC level,
see Figure 7-1. This is only slightly different from the AC coupled cases described in Section 7.7.2
because the DC blocking capacitors are placed between the termination and the OSCin/OSCin* pins, but
the concept remains the same, which is the receiver (OSCin/OSCin*) set the input to the optimum DC bias
voltage (common mode voltage), not the driver.

7.7.1 Termination for DC Coupled Differential Operation

For DC coupled operation of an LVDS driver, terminate with 100 Ω as close as possible to the LVDS
receiver as shown in Figure 7-3. The LVDS driver will provide the DC bias level for the LVDS receiver.

CLKoutX
100:

LVDS 100: Trace LVDS

Driver (Differential) Receiver

CLKoutX*

Figure 7-3. Differential LVDS Operation, DC Coupling

For DC coupled operation of an LVPECL driver, terminate with 50 Ω to Vcc - 2 V as shown in Figure 7-4.
Alternatively terminate with a Thevenin equivalent circuit (120 Ω resistor connected to Vcc and an 82 Ω
resistor connected to ground with the driver connected to the junction of the 120 Ω and 82 Ω resistors) as
shown in Figure 7-5 for Vcc = 3.3 V.

Vcc - 2 V
50:

CLKoutX

LVPECL 100: Trace LVPECL

Driver (Differential) Receiver

CLKoutX*
50:

Vcc - 2 V

Figure 7-4. Differential LVPECL Operation, DC Coupling

Copyright © 2009–2013, Texas Instruments Incorporated Application Information 43

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Vcc

120:

82:
CLKoutX

LVPECL 100: Trace LVPECL

Driver (Differential) Receiver

CLKoutX*

120:

82:
Vcc

Figure 7-5. Differential LVPECL Operation, DC Coupling, Thevenin Equivalent

7.7.2 Termination for AC Coupled Differential Operation

AC coupling allows for shifting the DC bias level (common mode voltage) when driving different receiver
standards. Since AC coupling prevents the driver from providing a DC bias voltage at the receiver it is
important to ensure the receiver is biased to its ideal DC level.
When driving LVDS receivers with an LVDS driver, the signal may be AC coupled by adding DC blocking
capacitors, however the proper DC bias point needs to be established at the receiver. One way to do this
is with the termination circuitry in Figure 7-6.

0.1 PF 100: Trace

CLKoutX
50:

(Differential)

LVDS LVDS
Vbias
Driver Receiver
50:

CLKoutX*
0.1 PF

Figure 7-6. Differential LVDS Operation, AC Coupling

LVPECL drivers require a DC path to ground. When AC coupling an LVPECL signal use 120 Ω emitter
resistors close to the LVPECL driver to provide a DC path to ground as shown in Figure 7-7. For proper
receiver operation, the signal should be biased to the DC bias level (common mode voltage) specified by
the receiver. The typical DC bias voltage (common mode voltage) for LVPECL receivers is 2 V. A
Thevenin equivalent circuit (82 Ω resistor connected to Vcc and a 120 Ω resistor connected to ground with
the driver connected to the junction of the 82 Ω and 120 Ω resistors) is a valid termination as shown in
Figure 7-7 for Vcc = 3.3 V. Note this Thevenin circuit is different from the DC coupled example in Figure 7-
5.

Vcc
120:
82:
120:

CLKoutX

0.1 PF 100: Trace

LVPECL LVPECL
Driver 0.1 PF (Differential) Reciever

CLKoutX*
120:

120:
82:

Vcc

Figure 7-7. Differential LVPECL Operation, AC Coupling, Thevenin Equivalent

44 Application Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

7.7.3 Termination for Single-Ended Operation

A balun can be used with either LVDS or LVPECL drivers to convert the balanced, differential signal into
an unbalanced, single-ended signal.
It is possible to use an LVPECL driver as one or two separate 800 mV p-p signals. When DC coupling one
of the LMK03200 family clock LVPECL drivers, the termination should still be 50 ohms to Vcc - 2 V as
shown in Figure 7-8. Again the Thevenin equivalent circuit (120 Ω resistor connected to Vcc and an 82 Ω
resistor connected to ground with the driver connected to the junction of the 120 Ω and 82 Ω resistors) is a
valid termination as shown in Figure 7-9 for Vcc = 3.3 V.

Vcc - 2V

50:
CLKoutX

50: Trace
LVPECL
Driver Vcc - 2V Load

CLKoutX* 50:

Figure 7-8. Single-Ended LVPECL Operation, DC Coupling

Vcc

120:
CLKoutX
Vcc
50: Trace

82:
LVPECL
120:

Driver

CLKoutX* Load
82:

Figure 7-9. Single-Ended LVPECL Operation, DC Coupling, Thevenin Equivalent

When AC coupling an LVPECL driver use a 120 Ω emitter resistor to provide a DC path to ground and
ensure a 50 ohm termination with the proper DC bias level for the receiver. The typical DC bias voltage for
LVPECL receivers is 2 V (See Section 7.7.2). If the other driver is not used it should be terminated with
either a proper AC or DC termination. This latter example of AC coupling a single-ended LVPECL signal
can be used to measure single-ended LVPECL performance using a spectrum analyzer or phase noise
analyzer. When using most RF test equipment no DC bias point (0 V DC) is expected for safe and proper
operation. The internal 50 ohm termination the test equipment correctly terminates the LVPECL driver
being measured as shown in Figure 7-10. When using only one LVPECL driver of a CLKoutX/CLKoutX*
pair, be sure to properly terminated the unused driver.
120:

CLKoutX

0.1 PF 50: Trace

50:

LVPECL
Driver 0.1 PF

CLKoutX*
120:

50:

Load

Figure 7-10. Single-Ended LVPECL Operation, AC Coupling

Copyright © 2009–2013, Texas Instruments Incorporated Application Information 45

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

7.7.4 Conversion to LVCMOS Outputs

To drive an LVCMOS input with an LMK03200 family LVDS or LVPECL output, an LVPECL/LVDS to
LVCMOS converter such as TI's DS90LV018A, DS90LV028A, DS90LV048A, etc. is required. For best
noise performance, LVPECL provides a higher voltage swing into input of the converter.

7.8 OSCin INPUT

In addition to LVDS and LVPECL inputs, OSCin can also be driven with a sine wave. The OSCin input can
be driven single-ended or differentially with sine waves. The configurations for these are shown in
Figure 7-11 and Figure 7-12.

0.1 PF
50: Trace

50:
LMK
Clock Source Input

0.1 PF

Figure 7-11. Single-Ended Sine Wave Input

0.1 PF
100:

100: Trace LMK

(Differential) 0.1 PF Input

Clock Source

Figure 7-12. Differential Sine Wave Input

Figure 7-13 shows the recommended power level for sine wave operation for both differential and single-
ended sources over frequency. The part will operate at power levels below the recommended power level,
but as power decreases the PLL noise performance will degrade. The VCO noise performance will remain
constant. At the recommended power level the PLL phase noise degradation from full power operation (8
dBm) is less than 2 dB.

10

5
Minimum Recommended
Power for Single-Ended
Operation
0
POWER (dBm)

-5
Minimum Recommended
Power for Differential
Operation
-10

-15

-20
10 20 30 40 50 60 70 80 90 100
FREQUENCY (MHz)

Figure 7-13. Recommended OSCin Power for Operation with a Sine Wave Input

46 Application Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 LMK03200
[Link] SNAS478C – JULY 2009 – REVISED APRIL 2013

7.9 MORE THAN EIGHT OUTPUTS WITH AN LMK03200 FAMILY DEVICE

The LMK03200 family devices include eight outputs. When more than 8 outputs are required the footprint
compatible LMK01000 family may be used for clock distribution. By using an LMK03200 device with eight
LMK01000 family devices up to 64 clocks may be distributed in many different LVDS / LVPECL
combinations. It's possible to distribute more than 64 clocks by adding more LMK01000 family devices.
Refer to AN-1864 (literature number SNAA060) for more details.

7.10 DIFFERENTIAL VOLTAGE MEASUREMENT TERMINOLOGY

The differential voltage of a differential signal can be described by two different definitions causing
confusion when reading datasheets or communicating with other engineers. This section will address the
measurement and description of a differential signal so that the reader will be able to understand and
discern between the two different definitions when used.
The first definition used to describe a differential signal is the absolute value of the voltage potential
between the inverting and non-inverting signal. The symbol for this first measurement is typically VID or
VOD depending on if an input or output voltage is being described.
The second definition used to describe a differential signal is to measure the potential of the non-inverting
signal with respect to the inverting signal. The symbol for this second measurement is VSS and is a
calculated parameter. Nowhere in the IC does this signal exist with respect to ground, it only exists in
reference to its differential pair. VSS can be measured directly by oscilloscopes with floating references,
otherwise this value can be calculated as twice the value of VOD as described in the first description.
Figure 7-14 and Figure 7-15 illustrate the two different definitions side-by-side for inputs and outputs
respectively. The VID and VOD definitions show VA and VB DC levels that the non-inverting and inverting
signals toggle between with respect to ground. VSS input and output definitions show that if the inverting
signal is considered the reference, the non-inverting signal voltage potential is now increasing and
decreasing above and below the non-inverting reference. Thus the peak-to-peak voltage of the differential
signal can be measured. Hence VID and VOD are often defined as volts (V) and VSS is often defined as
volts peak-to-peak (VPP).
Refer to application note AN-912 Common Data Transmission Parameters and their Definitions (literature
number SNLA036) for more information.

VID Definition VSS Definition for Input

Non-Inverting Clock
VA
VID 2· VID
VB
Inverting Clock
VID = | VA - VB | VSS = 2· VID

GND

Figure 7-14. Two Different Definitions for Differential Input Signals

VOD Definition VSS Definition for Output

Non-Inverting Clock
VA
VOD 2· VOD
VB
Inverting Clock
VOD = | VA - VB | VSS = 2· VOD

GND

Figure 7-15. Two Different Definitions for Differential Output Signals

Copyright © 2009–2013, Texas Instruments Incorporated Application Information 47

Submit Documentation Feedback
Product Folder Links: LMK03200
LMK03200
SNAS478C – JULY 2009 – REVISED APRIL 2013 [Link]

Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (April 2013) to Revision C Page

• Changed layout of National Data Sheet to TI format .......................................................................... 47

48 Application Information Copyright © 2009–2013, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: LMK03200
 PACKAGE OPTION ADDENDUM

[Link] 23-May-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LMK03200ISQ/NOPB Active Production WQFN (RHS) | 48 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 K03200 I
LMK03200ISQ/NOPB.A Active Production WQFN (RHS) | 48 1000 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 K03200 I
LMK03200ISQE/NOPB Active Production WQFN (RHS) | 48 250 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 K03200 I
LMK03200ISQE/NOPB.A Active Production WQFN (RHS) | 48 250 | SMALL T&R Yes SN Level-3-260C-168 HR -40 to 85 K03200 I
LMK03200ISQX/NOPB Active Production WQFN (RHS) | 48 2500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 85 K03200 I
LMK03200ISQX/NOPB.A Active Production WQFN (RHS) | 48 2500 | LARGE T&R Yes SN Level-3-260C-168 HR -40 to 85 K03200 I

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

[Link] 23-May-2025

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

[Link] 25-Sep-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMK03200ISQ/NOPB WQFN RHS 48 1000 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK03200ISQE/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK03200ISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

[Link] 25-Sep-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMK03200ISQ/NOPB WQFN RHS 48 1000 356.0 356.0 36.0
LMK03200ISQE/NOPB WQFN RHS 48 250 208.0 191.0 35.0
LMK03200ISQX/NOPB WQFN RHS 48 2500 356.0 356.0 36.0

Pack Materials-Page 2
 PACKAGE OUTLINE
RHS0048A SCALE 1.800
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

7.15 B
A
6.85

PIN 1 INDEX AREA 0.5

0.3
7.15
6.85

0.30
0.18

DETAIL
OPTIONAL TERMINAL
TYPICAL

0.8
0.7
C

SEATING PLANE DIM A

OPT 1 OPT 2
0.05
0.00 0.08 C (0.1) (0.2)

2X 5.5
(0.2)
5.1 0.1
(A) TYP
44X 0.5 13 24

12
25
EXPOSED
THERMAL PAD

2X 49 SYMM
5.5

SEE TERMINAL
DETAIL

1 36
0.30
48X
48 37 0.18
PIN 1 ID SYMM
0.5 0.1 C A B
(OPTIONAL) 48X
0.3 0.05

4214990/B 04/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

[Link]
 EXAMPLE BOARD LAYOUT
RHS0048A WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

( 5.1)

SYMM

48X (0.6) 48 37

1
36

48X (0.25)
(1.05) TYP
44X (0.5)

(1.25) TYP
49
SYMM
(6.8)

(R0.05)
TYP

( 0.2) TYP
VIA

12 25

13 24
(1.25) (1.05)
TYP TYP
(6.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:12X

0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND

METAL EDGE SOLDER MASK

OPENING

EXPOSED
METAL SOLDER MASK EXPOSED METAL UNDER
OPENING METAL SOLDER MASK

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214990/B 04/2018
NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 ([Link]/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.

[Link]
 EXAMPLE STENCIL DESIGN
RHS0048A WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD

(0.625) TYP (1.25)

TYP
48 37
48X (0.6)

1
49 36

48X (0.25)

44X (0.5)
(1.25)
TYP

(0.625) TYP
SYMM
(6.8)

(R0.05) TYP

METAL
TYP

12 25

13 16X 24
SYMM
( 1.05)

(6.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 49
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X

4214990/B 04/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

[Link]
 IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on [Link] or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2025, Texas Instruments Incorporated