3D AOI Pin Algorithm
明锐理想科技
MagicRay Technology
Date: 15th March 2024
Unauthorized distribution is prohibited.
The content of the information is accurate during the time of presentation. 1
However, MagicRay reserves the right to alter the content of the information if they deem fit.
01 Types of Defects
02 Searching Window
CONTENT
03 Pad Searching
04 Pin Inspection
05 Solder Inspection
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Types of Defects Types of Defects for Pin Components
Exposed Pad No Pin Insert Solder Ball
Non-Stick Solder Insufficient Solder Icicle
Solder Defect Open Solder Solder Bridging
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Types of Defects
Types of Defects for Pin Components
Inspection Inspection
Category OK NG Category OK NG
Missing Pin Missing Solder
Pin Bending
Excessive Solder
Missing Pin
Solder Bridging
Open Solder Icicle
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01 Types of Defects
02 Windows Setup
CONTENT
03 Pad Searching
04 Pin Inspection
05 Solder Inspection
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Windows Setup Pin Component Windows Setup
Bridge Window
Bridge Window
Bridge Window
Insert Window
Solder Pad
Window
Bridge Window
Side View of Pin Component Top View of Pin Component Pin Searching Window
i. Pin Searching Window: Function of searching window is to define the area search range for the solder
pad of the pin component and set the search conditions
ii. Solder Pad Window: Function of this window is to retrieve the position of the pad. It also inspects the
solder joint of the pin components such as insufficient solder, open solder etc.
iii. Insert Window: Defines the size of the pin, without specific settings needed
iv. Bridge Window: Function of bridge window is to detects whether there is short circuit between current
pad and other component/pads
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01 Types of Defects
02 Searching Window
CONTENT
03 Pad Searching
04 Pin Inspection
05 Solder Inspection
7
Pad Searching
Pad Searching
Insert Window
Solder Pad
Window 1. Set the size of the solder pad window to be same as
the actual pad size
Search Window 2. Extract the color (R,G,B) and brightness of the pad.
When extracting the color, avoid extracting other
color outside of the pad.
3. If the pad is round shape, select the circle inspection
Insert Window and set the circle similarity %. If the pad is square,
select square inspection
Solder Pad
4. Calculate the pad color detected in the search
Window window to the size of the solder pad window. If the
pad color ratio and circle similarity is greater than set
Search Window
value for color ratio, the position will be used as the
pad final position. Otherwise, error will be reported
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01 Types of Defects
02 Searching Window
CONTENT
03 Pad Searching
04 Pin Inspection
05 Solder Inspection
9
Pin Inspection
Pin Check (Straight Pin)
100%
Horizontal
Width
Exclude Pin Area
50% Horizontal
Normal Width
50% Vertical Length Inspection Area
Characteristics: The ratio of red color is high when the pin
100% Vertical Length is missing
1. Extract the red and green color with its brightness
2. Inspection Area: Define the size of the inspection
100% area
Horizontal Inspection Area
Width 3. Exclude Pin Area: If the option is checked, the area of
the insert window will be excluded from the
Missing 50% Horizontal
inspection area
Width
Pin 4. Color ratio: In the inspection area, If the detected
ratio is less than the set value, the result is OK.
50% Vertical Length
Otherwise, error missing pin will be reported
100% Vertical Length
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Pin Inspection
Pin Check (Oblique Pin)
Horizontal
Inspection Area
Normal
Horizontal
+ 20 pixel
Hor Vertical
Characteristics: The pin is extended out of the pad and represented by
blue color
Ver Vertical + 20 pixel
1. Extended Detection Region: Taking the original solder pad window
Horizontal length as L and width as w, extend the detection area by the set
Inspection Area value of 20 pixels. Therefore the outer border of the inspection area
will be at L+20 pixel and w+20 pixel
Horizontal 2. Pin Length: Within the inspection area must detect an area of the
Missing + 20 pixel extracted pin color, with vertical length of more than the set value
Pin 3. Pin Width: Same as above, the detected area must have horizontal
width of more than the set value
Vertical 4. Color Ratio: If test 2 and 3 passes, the area detected with the pin
color will be surrounded by a rectangle generated. The proportion
of pin color within the rectangle is then calculated. The results is OK
Vertical + 20 pixel if the color ratio detected is more than the set value
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Pin Inspection Alternative: Pin Check (Oblique Pin) using
Combination Window
Random Window 1
Normal Random Window 2
Random Window 3
Combination Window
In addition to the above algorithms for creating oblique pin missing
inspection, we can also use combination windows method for inspection.
Here, combination windows are used to test for missing oblique pins.
Three custom windows are added within the combination window:
Random Window 1
i. Random Window (1) is used for color ratio detection of the
Missing Random Window 2 protrusion of the pin outside the solder pad;
ii. Random Window (2) is used for color ratio detection of the solder
Pin color below the pin;
iii. Random Window (3) is used for gravity offset for inspection on
Random Window 3 solder distribution.
Combination Window The combination logic is 1+2+3.
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Pin Inspection Alternative: Pin Check (Oblique Pin) using
Combination Window: Random Window 1
Normal
Random Window 1
1. Insert Random Window 1 on the body of the oblique
pin. The whole random window will serve as the
inspection area
Missing 2. Set the value for color ratio. Usually extract the color
of oblique pin (normally is blue in color)
Pin
3. Select the Reported Error Type as ‘MissingPin’
4. Select the Object Following as ‘Pad Following’
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Pin Inspection Alternative: Pin Check (Oblique Pin) using
Combination Window: Random Window 2
Normal
Random Window 2
1. Insert Random Window 2 near the starting point of
the pin on the solder pad . The whole random
window will serve as the inspection area
Missing 2. Set the value for color ratio. Usually extract the
Pin color of solder (normally is dark blue in color)
3. Select the Reported Error Type as ‘MissingPin’
4. Select the Object Following as ‘Pad Following’
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Pin Inspection Alternative: Pin Check (Oblique Pin) using
Combination Window: Random Window 3
Random
Red Color Window 3
Gravity Gravity
Normal Gravity Offset
of two points
> 30%
1. Insert Random Window 3 covering the whole solder pad.
The whole random window will serve as the inspection area
Random 2. Set the value for Gravity Offset Ratio. Only extract the red
Window 3 color of solder (if choose offset ratio ≥) or blue of solder (if
Gravity choose offset ratio ≤)
Missing Red Color Gravity Offset
3. Select the Reported Error Type as ‘MissingPin’
of two points
Pin Gravity = 0% 4. Select the Object Following as ‘Pad Following’
5. Taking the gravity of random window 3 as 0%, both
extreme ends of random window 3 as 100%. Detects the
gravity of red / blue and calculate its Gravity offset Ratio
from 0% position. If the offset value is more than the set
value, the result will be OK 15
01 Types of Defects
02 Searching Window
CONTENT
03 Pad Searching
04 Pin Inspection
05 Solder Inspection
16
Solder Inspection Alternative: Pin Check (Oblique Pin) using
Combination Window: Random Window 2
Inner Side
80% Excluded
Normal 100% Tip Excluded
20% Inspection Area
80%
100%
Characteristics: The ratio of black color is very high with blow holes / pores.
Inspection Area
1. Extract the color of blow holes (dark color)
2. Exclude Pin Area: If exclude pin area is enabled, inspection area will
be formed outside of insert window to the solder pad window
Missing 3. Vertical Length: If the vertical length of rectangle generated is less
Pin than the set value. The results is OK
4. Horizontal Width: If the horizontal width of rectangle generated is
less than the set value. The results is OK
Within the inspection area, generate some 5. Color Ratio: If the color ratio of blow holes detected in the generated
rectangles to surround the detected blow holes. rectangle is less than the set value, the results is OK
Then compare the actual vertical length,
horizontal width and color ratio of the rectangles Note: If any one from test 3,4,5 are OK, the test result is OK
with the set value If all of them are NG, then only report as NG Blow Holes
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Solder Inspection
Fillet
80%
100%
Normal
Inspection Area
80%
Characteristics: Good fillet will have high blue areas (not red)
100%
1. Extract the color of blue and green (not red)
2. Quartering Pad: if this option is enabled, taking the direction of
Inspection Area
the search window as vertical axis and the transverse direction
80%
as horizontal axis. Based on the centre of the aligned pad, divide
the inspection area into 4 parts. Treat this 4 parts as separate
Insufficient 100% inspection area and inspect respectively. All 4 parts needs to
Solder pass the color ratio test then the result is OK. The actual test
value is the part with lowest color ratio detected
80%
3. Color Ratio: Within the inspection area, if the detected color
ratio is more than the set value, the results is OK. Otherwise
100% report NG insufficient solder.
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Solder Inspection
Open Solder: 1. Pad Center
50%
Normal
100%
50% Inspection Area Characteristics: The ratio of red color is very high when open
solder
100%
1. Extract the red and green color with its brightness
2. If ‘Exclude Pin Area’ is enabled, the insert window will be
excluded from inspection area
50%
Inspection Area 3. Within the inspection area, if the detected color ratio is
Open lower than the set value, the results is OK. Otherwise,
Solder 100% report as NG
50%
100%
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Solder Inspection
Open Solder: 2. Gravity Offset
Solder Pad
Red Color Window
Gravity Gravity
Normal
Gravity Offset
of two points
> 30%
1. Define the Inspection Area, taking the area of solder pad =
100%
2. Set the value for Gravity Offset Ratio. Extract red color and
green color with its brightness.
3. Taking the gravity of solder pad window as 0%, both
Solder Pad extreme ends of solder pad window as 100%. Detects the
Window gravity of red and green, then calculate its Gravity Offset
Gravity Ratio from 0% position. If the offset value is more than the
Open Gravity Offset
Red Color set value, the result will be OK
Solder Gravity
of two points
= 0%
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Solder Inspection
Open Solder Algorithm Combination
• General Pin Inspection Algorithm: 1 + 2
Note:
➢‘*’ is AND logic, all conditions need to be passed
➢ ‘+’ is OR logic, either one condition passes consider passed
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Solder Inspection Exposed Pad
100% Tip Excluded
80%
Normal
Inspection Area
Inner Side 80%
Excluded
1. Extract the color of exposed pad red color
100%
2. Define the size of inspection area by entering ‘Inner
100% Tip Excluded Side Excluded’ and ‘Tip Excluded’
3. Select ‘Exclude Pin Area’ if the insert window is to be
80% Inspection Area excluded from inspection area
4. Set value for the color ratio. If red color detected in the
Exposed inspection area is less than the set value, the result is
Pad OK. Otherwise, report as NG exposed pad
80%
Inner Side
Excluded
100%
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Solder Inspection
Bridge Window
Bridge Window
1. Extract the color of solder (R,G,B) and its brightness
Bridge Window
2. Across the Width: Ignore the solder bridge if its width
Bridge Window
is below the set value of pixels (even if it had already
penetrated the window)
Bridge Window
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Solder Inspection Random Window
Note: Either one of the criteria is OK, the test result is OK
4 Random windows for blowhole detection All needs to be failed for the test results to be NG
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Solder Inspection Solderball Window
Solderball Window
Solderball Window
Solderball Window
Solderball Window
Note: Either one of the criteria is OK, the test result is OK
4 solderball windows for solderball detection All needs to be failed for the test results to be NG
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THANK YOU
明锐理想科技
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