3D AOI IC Algorithm

明锐理想科技
MagicRay Technology

Date: 13th May 2024

Unauthorized distribution is prohibited.

The content of the information is accurate during the time of presentation. 1
However, MagicRay reserves the right to alter the content of the information if they deem fit.
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
2
Searching Window

Size and Orientation of Searching Window

Purpose of Searching Window is to create a region to

20-30 pixels search for the component and positioning of windows
larger inside

Size of Searching Window: Usually set to 20-30 pixels

larger than the IC (including pin) as shown in figure.

Orientation of Searching Window: Follow the

Orientation of Searching Window orientation of the component in CAD
same as CAD

20-30 pixels larger

3
 Searching Window
Size and Orientation of Body Window

Size of Body Window: No strict requirement for IC Body

Window as there is no body searching for IC. User may follow
actual size of the component body in image.

Orientation of Body Window: Follow the orientation of the

searching window
Orientation of Searching Window
same as CAD and searching window
Size and Orientation of IC Searching Window
Purpose of IC Searching Window is to define the position and
size of IC pins and solder pad that the software should search
for, within the searching window.

Size of IC Searching Size of IC Searching Window: Slightly larger than the size
Window larger than
enough to cover all Orientation of IC
enough to cover all the IC pins (with some overlapping region
pins, with some Searching Window with the IC Body)
overlapping region points outward of
with IC body component
Size of Pin Sampling Window: Follow actual size of IC pin in
image
Size of Pin Sampling
Window follow its
actual size in image
Orientation of Solder Pad Window: Should always pointing
out from the component 4
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
5
 Height Setting

Height Setting

Height
Definition of Height = distance from PCB surface to the
top of the object (component body / pin outer region)

1. Component Height: Enter the height of the IC body

Enter the height of the component
and its pin outer region obtained
2. Pin Outer Height: Enter the height of the pin outer
region

Pin Outer Region Height

Component Height

6
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
7
 IC Pin Setting
IC Pin Pitch and Quantity
Function of the IC searching window is to correct the positions
of the pad and the component, mainly to correspond to the
deviation caused by local deformation of PCB. The deviation is
automatically corrected after aligning with the pad

Pin Pitch 1270um

i. Pin [Link]: The pin numbering is clockwise and is in

increasing mode by default (ie: 1,2,3) When ‘Pin [Link] ’ is
checked, the pin numbering will be in decreasing mode (ie: 3,2,1)
ii. Pin [Link]: Refers to the first pin number. For example, 1
means the first pin number starts with 1
iii. Pin pitch: Refers to spacing or distance between the centres of
two pins
iv. Total Qty of Pin: Only the set number of pins can be detected in
Hor. this IC searching window. If it is not activated, the maximum
number of pins that can be generated in the IC Searching Window
Ver. will be automatically calculated based on the set pin pitch and the
size of the IC Searching Window

Note: IC standard pin pitch: 0.3mm, 0.4mm, 0.5mm, 0.635mm, 0.65mm,

0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.27mm, 1.44mm. 8
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
9
IC Pin Searching
Pin Vertical Position Searching – Component Edge Searching (3D)

100%
70% Component
Search Height
Height

Figure 1 Figure 1: Taking the set component height as 100%, a

cross-section A is obtained at 70%.

Figure 2: The component is cut out by the 70% cross-

Direction 70% Height
cross section
section and displayed in black. The search direction is
from inside to outside. When the black area disappears, it
is considered as the body edge.

Figure 2
10
IC Pin Searching
Pin Vertical Position Searching – Component Edge Searching (2D)

i. Each Row Qualified Ratio: Extract the colour of

the IC body. Search direction from inside row to
outside. When the detected colour of body
disappears and less than 50% pixel at the row, it
is considered as the component body edge and
the starting point of pin inner end

Searching ii. Continuous Qualified Length: Consecutive row

Direction
(in pixel) detected with the colour of the
component body must more than the set value.
Otherwise, reported as searching error

11
 IC Pin Searching
Pin Vertical Position Searching – Pin Inner Side Searching (2D)

1. Extract the colour (usually red) and brightness of the inner end of
the pin
2. Taking the pin window horizontal length*number of pins as 100%,
search the inner end of the pin in the IC searching window. Using
the retrieved inner end as the starting position of the pin and move
all generated pins vertically so that the inner end of all the pin
windows is at the actual inner end of the pins in image

i. Each Row Qualified Ratio: Each row detected with the colour
Hor. of inner end must be more than the defined % to fulfil
ii. Continuous Qualified Length: Define the minimum number
Ver. of consecutive rows (in pixel) must fulfil the set value in ‘Each
Row Qualified Ratio’

Note: Test i and ii must both be fulfilled to be OK

12
 IC Pin Searching
Pin Horizontal Position Searching (2D)

1. Extract the colour (red, blue) and brightness of the pin / colour
of the outer end of the pin (red)
2. If the ‘Pin External Part Searching’ is checked, the horizontal
position search will be based on the pin outer end. If not
checked, the entire pin will be used for horizontal positioning by
default.

i. Horizontal Searching of Color Ratio: if the detected colour

ratio meets the set value, the retrieved horizontal position
Hor. will be used. Otherwise, the result will be NG

Ver.

13
IC Pin Searching
Pin Outer End Searching (3D)
Figure 1
80% pin outer
end height
cross section

100% pin outer

end height

80% pin outer

end height i. Allow Extension Length: As shown in Figure 2, the maximum
elongation of pixels should be ≤ 20 pixels set value. The
Figure 2 specific elongation amount is determined by the actual
situation, but it must not exceed the set value.
ii. Height: As shown in Figure 1, take the pin outer height set as
Direction
80% cross section 100%, and obtain a cross-section at 80% of the height as
shown in Figure 2.
iii. Width: As shown in Figure 2, take the drawn pin width as
100% width. Within the cross-section at 80% pin height, if the
Allow width (matched color pixel) of the pin outer end obtained is ≥
Extension
Length
60%, it will automatically extend.

100% Width 14
 IC Pin Searching
Pin Outer End Searching (2D)

i. Allowed Extension Length: The maximum number of pixels

that can be elongated from the drawn pin length. Therefore
② the maximum pin length = drawn pin length + allowed
extension length

ii. Each Row Qualified Ratio: Extract the red color of the pin end
Hor. and its brightness. If the set value is met, the pin window
③ automatically extends to the location and that is seen as the
real outer end of the pin.
Ver.

15
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
16
 Pad Searching
Pad Searching (2D)

100% Pin Width

150% of Pin Width
(= Pad Horizontal Width)
i. Pad Horizontal Width: Taking the width of the pin as 100%,
define the horizontal width of the pad (≥ 100%)
ii. Each Row Qualified Ratio: The pad color detected for each
row must be more than the set value % to fulfil, taking the
width of the pad as 100%
iii. Continuous Qualified Length: There must be more than
the set number of consecutive rows meeting the ‘Each Row
Qualified Ratio’ to fulfil
Hor. iv. Color Ratio: Once the position of the pad is retrieved,
calculate the percentage of the pad color detected inside
the window generated for the pad
Ver.

17
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
18
 Component Inspection Vertical and Horizontal Shifting
Target Value Actual Value

i. Pin Vertical Position:

Calculate the distance between the outer end of pin to the outer
end of the pad. If the length is greater than the set value then it is
Distance between the outer OK. If it is less than the set value, it will be reported as NG vertical
end of pin to outer end of pad
offset error

Set Value: Range between one-third or half of the actual test value

ii. Horizontal Shift:

Distance between the outer
end of pin to outer end of pad Take the horizontal width of the pin as 100%. Checks whether the
Hor. pin exceeds both sides of the pad. If any side exceeds, calculate
100% Pin Horizontal Width
the ratio of exceeded part of the pin to the pin width. If the value
Hor. is greater than the set value, it will be reported as NG horizontal
Ver. offset error
Distance of Pin Shifted
Ver. from the Pad Set Value: 33% of Pin Horizontal Width
19
 Component Inspection

OK Missing Window (2D and 3D)

40~60

40~60

1. Create Missing Windows and place on the body of the component

2. Select the algorithm:
i. Detecting Body Color: Define the color of the body. If color
ratio less than set value, reports NG
ii. Detecting PCB Color: Define actual bare board / PCB
background color. If PCB color detected more than set
Missing value, reports NG
iii. Height: Define the average height that should be detected
Recommended Color for Green PCB Board: in the missing window. If the height detected is less than
Color Item 0: G 40~100 set value, reports NG

20
Component Inspection
Polarity Window (2D)
1. Create Polarity Windows and place on the component polarity
identification area
2. Extract the color for polarity recognition, usually white/black
3. Color ratio setting steps:
i. Place the polarity window in the polarity identification
area. Note down the actual measured value

OK ii. Place the polarity window in the reversed area for

detection (may rotate the component by 180 degree). Note
down the actual measured value

iii. Set the color ratio as (46 + 2) / 2 = 24

Wrong Direction
iv. During inspection, if the detected color ratio in the polarity
window reaches the set value, then OK. Otherwise, it will
reports NG ‘wrong direction’
21
 Component Inspection

Sign Window (2D)

Bridge Window

Bridge Window
Sign window needs
OCV Sign Window algorithm explanation:
Bridge Window OCR Sign Window algorithm explanation: to be drawn larger
1. Create sign window. Size needs to be drawn larger 1. OCR recognize the characters by their outline. It can than body window
than body window. Direction set to be same as the differentiate characters such as 0 and O.
wordings 2. OCR can be used independently, tick on ‘OCR’ to use
2. Click login to save template 3. Click ‘Learn’ to automatically detect the characters
3. Adjust the red box to frame over the characters to be inside the sign window
read 4. Click ‘+’ to add several more target characters.
4. If needed, select theWindow
Bridge colour ‘Channel’ and adjust the Maximum target allowed is 5
‘Max’ section to bring out clear display of the 5. Tick ‘Reverse Allowed’ if the character has no polarity
characters (usually used for chip components)
5. Tick on ‘Reverse Allowed’ if the component has no
polarity Note: If both OCV and OCR are activated, ‘OCR’ will only
6. ‘New OCV’ is a stricter algorithm of OCV. It is able to be used after ‘OCV’ fails. If OCV NG but OCR OK, the result
differentiate characters such as 8 and B. ‘Identity’ is is OK (‘OR’ relationship)
usually set to 65% 22
 Component Inspection
Bridge Window (2D)

Outer Edge Searching

From Beginning Side

80% Distance
between Pads
1. When the ‘Bridge Inspection’ is checked, bridge window will be
automatically generated between two pins.
i. Inner Excluded Area: Refers to the set pixel length from the inner
end of the pin to be excluded from the bridging detection area
ii. Outer Excluded Area: Refers to the set pixel length from the outer
0% Inner
0% Outer Excluded Area
end of the pad to be excluded from the bridging detection area
Excluded iii. Horizontal Width: Percentage ratio of the width of the bridge
Area 100% Distance window to the distance between the two pads
between Pads iv. Outer Edge Searching From Beginning Side: Tick if you wish to put
a bridge window before the first pin
Hor. v. Outer Edge Searching Till Ending: Tick if you wish to put a bridge
window after the last pin
Ver. Outer Edge Searching Till
Ending Side 2. Extract the color (R, G, B) and its brightness for solder bridging detection
3. If the detected color penetrates through the bridging window, it will be a
NG call ‘Short Circuit’ error 23
 Component Inspection
Pin Bending Detection (2D)

Extract the color of the pin (R, G, B) and its brightness

i. Horizontal Width: Taking the distance between the pads

as 100%, define the horizontal width of the pin bending
inspection area
ii. Vertical length: Define the vertical length of the
inspection area, starting from the outer end of pin
towards inner
iii. Each Row Qualified Width: The color of pin detected
each row within the inspection area must be lower than
Vertical the set value %. Taking the horizontal width of the
Length inspection area as 100%
Horizontal
Width

24
 Component Inspection Planeness Window (3D)

Vertical Directional
Bridge Window
Parallel Directional

Inspection area Inspection area

Planeness Window
Function of planeness window is to check the height difference of the
component within the window
Bridge Window

• Parallel Directional: Check the height difference across horizontal width

within the window
• Vertical Directional: Check the height difference across vertical length
within the window
Height Difference
Bridge Window • Four corners: Check the height difference across 4 corners within the
window

i. Inspection Area: Define the size of the inspection area, taking size
Bridge Window of the planeness window as 100%
ii. Area Height Difference: Maximum height difference detected
within the inspection area must be less or more than the set value
iii. Reported Error Type: Select the error type to display if NG occurs
iv. Object Following: Positioning method for the window 25
Component Inspection Height Window (3D)

Bridge Window
Inspection area

Height Window

Bridge Window

Function of height window is to check the height of the item within

Overlapped / Extra the window. Potential use on detecting missing / lifted / extra
Component component

i. Area Height: The height detected within the height window

must be either lower or greater than the set value (depend on
Bridge Window
selection). Otherwise, report as NG
ii. Reported Error Type: Error type to display when NG occurs
iii. Test Method: Calculation method for the area height
Bridge Window
iv. Object Following: Positioning method for the height window
26
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Settings

08 Solder Inspection
27
IC Inner and Outer Part Setting
IC Pin Inner and Outer Part Settings

1. Take the vertical length of the pin sampling window as

100%; the pin inner part ratio refers to the proportion
of the inner segment of the pin to the length of the pin
sample window; the pin external part ratio refers to
the proportion of the outer segment of the pin to the
length of the pin sample window.
Inner Middle Outer
Part Part Part 2. Select the pin sampling window and set the inner and
external part ratios. Two light blue lines will appear on
the pin sample window. Position the light blue lines at
the red-blue boundary as shown in figure.

28
 01 Searching Window

02 Height Setting

03 IC Pin Setting
CONTENT

04 IC Pin Searching

05 Pad Searching

06 Component Inspection

07 IC Inner and Outer Part Setting

08 Solder Inspection
29
Solder Inspection Fillet (2D)

Normal

i. Inspection Area: Define the vertical length of the

Inspection Area inspection area from the end of the pin. The width is
by default the width of the pad

Insuf. ii. Each Row Qualified Ratio: The proportion of !R color

Solder detected in each row of the inspection area must
more than 40% to fulfil

iii. Continuous Qualified Length: Define the minimum

number of consecutive rows that must fulfil the
Insuf. ‘Each Row Qualified length’ for the result to be OK.
Hor. Solder Otherwise, report as NG Insufficient solder.

Ver. Recommended Color:

Inspection Area Color Item 0: R 0~33

30
 Solder Inspection Fillet (2D) – Side Fillet

Pin Length = 100%

Area Length 35%
Excluded
Widthwise
Normal Inspection Area

Area Length 35%

i. Area Length: Taking the pin vertical length as 100%, define
Pin Length = 100%
the length of the inspection area
ii. Excluded Widthwise: Define the width of the inspection
Insuf. area. Maximum width is from the side of pin to the side of
Solder pad
iii. Each Row Qualified Ratio: The proportion of !R color
detected in each row of the inspection area must more than
Pin Length = 100% 40% to fulfil
Area Length 35%
Excluded iv. Continuous Qualified Length: Define the minimum number
Widthwise
Insuf. of consecutive rows that must fulfil the ‘Each Row Qualified
Inspection Area
Hor. Solder length’ for the result to be OK. Otherwise, report as NG
Insufficient solder
Area Length 35%
Ver. Pin Length = 100%
Note: Relationship between front fillet and side fillet is ‘OR’ logic

Recommended Color:
31
Color Item 0: R 0~33
 Solder Inspection Open Solder : 1. Pin Warp (3D)
Figure 1

Inspection Area i. Pin Outer Remove: As shown in Figure 1, take the pin width as 100% width, and
remove 10% set value from each side, leaving the remaining green area in the
middle as the inspection area.
10% Pin Outer
ii. Pin Outer Height ≤: As shown in Figure 2, take the set value of the pin outer
Remove height (at height setting) as the standard pin height. Conduct height detection
100% Width for each pin, and if the height of any one pin is ≥ standard height + 150um set
value, it will be marked as NG.
iii. Pin Outer Height: As shown in Figure 2, conduct height testing for all pins, and if
Figure 2
the difference between the highest and lowest heights is ≤ 100um set value, it
will be OK; otherwise, it will be marked as NG.

Note (For 3rd inspection item – Pin Outer Height):

1. Firstly, determine whether the height of the pin outer end is less than half of the
standard pin outer end height. If it is less than, then the pin is considered to have
abnormal height, directly report the actual value, and no longer compare the
Height
Difference
height difference.
Standard 2. After confirming that the pin outer end height meets more than half of the
Pin Height standard pin outer segment height, then compare the height difference between
this pin and other qualified pins (with lowest height)
32
 Solder Inspection Open Solder : 2. Pin Extension (2D)

Normal Horizontal Width

(pad width = 100%)

Inspection Area
Vertical
Excluded Length Length

i. Excluded Length: Starting from the end of pin, the ignored length = 3
Open pixels set value.
Solder ii. Vertical Length: Setting for the length of the inspection area, as
shown in the diagram, the length of the rectangle = 10 pixels set
value.
iii. Horizontal Width: Taking the solder pad width as 100%, the width of
the rectangular inspection area = 40% set value.
iv. Each Row Qualified Ratio: Within the generated rectangular
inspection window, scan in vertical direction row by row. The
Open Horizontal Width proportion of red in each row should less than 50% to fulfil
Solder (pin width = 100%) v. Continuous Qualified Length: Number of consecutive rows fulfilling
Hor. within the inspection area should be less than ≤ 5 pixels set value,
Inspection Area then it's marked as OK; otherwise, it's marked as NG.
Vertical
Excluded Length
Ver. Length Recommended Color:
Color Item 0: R 35~100 ，W 50~255 33
 Solder Inspection Open Solder : 2. Pin Extension (3D)

Vertical Length
Normal
(pad width = 100%)

Inspection Area
Parallel
Length
i. Parallel Length: Setting for the length of the inspection area, as
shown in the diagram, the length of the rectangle = 20 pixels set
value.
Open
ii. Vertical Length: Taking the solder pad width as 100%, the width of
Solder
the rectangular inspection area = 30% set value.
iii. Height: Taking the set pin outer height (in height setting) as 100%,
define the inspection height within the inspection area. If object
exceeding height defined in the inspection area, it will appear
green, showing that pin is extended
iv. Pin Stretch Width: Within the generated rectangular inspection
window, scan in vertical direction row by row. The proportion of
Open Vertical Length green pixel in each row should less than 60% to fulfil
Solder (pin width = 100%)
v. Stretch Length: Number of consecutive rows fulfilling within the
Hor. inspection area should be less than ≤ 10 pixels set value, then it's
Inspection Area
Parallel marked as OK; otherwise, it's marked as NG.
Ver. Length
34
 Solder Inspection Open Solder : 3. Solder Outer Edge (2D) – Entire Pad Tip

Normal

Pad Length = 100%

Inspection Area
i. Inspection Area: Generate an inspection area
from the outer end of the solder pad to inspect
Open the outer end of the solder pad. Taking the pad
Solder length as 100%

ii. Color Ratio: The blue color within the detection

area should not exceed the set value. Usually set
at 40%.
Open
Solder Recommended Color:
Hor. Color Item 0: B 33~100，W 50~255
Pad Length = 100%
Ver. Inspection Area
35
 Open Solder : 3. Solder Outer Edge (2D) – Dome Tip
Solder Inspection

Recommended Color:
Color Item 0: B 33~100，W 50~255

Normal

Pad Vertical Length = 100%

70% Position Set Value
X% Actual Test Value
20% Inspection Area Inspection Method:
(search inwards 20% from the X% Actual Test)
Open 1. During inspection, start searching inward from the outer end row of
Solder the solder pad. It looks for solder outer edge (blue border areas) that
have more than 50% blue color in the row (Each Row Qualified Ratio).
This detected border is noted as X% actual test value.

2. Then it compares the detected solder outer edge (X% actual test
value) with the 70% position set to be the solder outer edge (when
Open open solder does not occur). If the found solder outer end is within
Solder the position, it is considered as not open soldered. Otherwise, it is
Hor. considered as open solder.
Pad Vertical Length = 100%
Ver. 70% Position 3. At same time, from the X% actual test value border, it will search
Distance between Actual Test Color
inwards by the 20% inspection area defined. The color ratio within
20% Inspection Area the inspection area must be less than 40% to be OK
Border Line to pin edge X% (search inwards 20% from the
(Search inwards from outer end of pad) X% Actual Test) 36
Note: Relationship between Dome Tip and Tip Area test result is ‘OR’
 Solder Inspection
Open Solder : 4. Pin Tip (2D)

Normal Horizontal Width

Excluded Length Vertical Length

Inspection Area
i. Excluded Length: Starting from the beginning of the solder
pad, ignore a length of 3 pixels.
Open ii. Vertical Length: Setting for the length of the inspection
Solder area, as shown in the diagram, the length of the rectangle =
10 pixels set value.
iii. Horizontal Width: Taking the solder pad width as 100%,
the width of the rectangular detection area = 40% set
value.
iv. Color Ratio: Within the inspection area, if the extracted
Open
Solder
Horizontal Width blue and green (B, G) color area ratio is ≥ 40% set value,
Hor. then it's marked as OK; otherwise, it's marked as NG
Excluded Length Vertical Length
Ver. Inspection Area

37
 Solder Inspection Open Solder : 5. Pin Side (2D)

Pin Length = 100%

Excluded Vertical Length
Horizontal

Normal Inspection Area

Excluded
Horizontal

Pin Length = 100%

i. Vertical Length: Take the pin length as 100%, extend inward from
the pin end by 40% set value.
ii. Excluded Horizontal: Excluded number of pixels in inspection
Open area from the both side of the pad
Solder iii. Each Row Qualified Ratio: The proportion of red and green
detected in the inspection area must more than the 50% set
value to report NG
iv. Continuous Qualified Length: Number of consecutive rows
Pin Length = 100% fulfilling the ‘Each Row Qualified Ratio’ must be less than the 8
Excluded Vertical Length
pixel set value. Otherwise, report as NG open solder
Horizontal
Open
Inspection Area Note: Both test iii and iv must be exceeded then only NG will be
Solder
Hor. Excluded
reported. Otherwise, the results is OK
Horizontal
Ver. Recommended Color:
Pin Length = 100% Color Item 0: R 35~100 ，W 50~255
Color Item 1: G 35~100,W 80~255
38
 Solder Inspection
Open Solder : 6. Pin External Part Area (2D)

Normal

i. Inspection Area: The set pin external part

Inspection Area
for Inspection
ii. Edit Color: the red color of the solder pad
Open segment.
Solder iii. Color Ratio: The blue color within the
inspection area should not be lower than
the set

Recommended Color:
Open Color Item 0: R 33~100, W 50~255
Solder
Hor.

Ver. Inspection Area

39
Solder Inspection
Recommended Color: Open Solder : 7. Pad Center (2D)
Color Item 0: R 33~100

Normal

Pad Tip Area Ratio

The inspection area is fixed from 4/8 to 6/8 of solder pad
Inspection Area

Open i. Color Ratio in Middle Side: If the actual test value is

Solder more than the set value, the result is OK
ii. Continuous Length: If the detected continuous length
of red color in the inspection area is greater than the
Inspection Area
set value, the result is OK
Pad Tip Area Ratio iii. Pad Tip Area Ratio: Create a pad tip inspection area. If
the actual color test value in the area is more than the
Open set value, the result is OK
Solder
Hor. Note: The relationship between test 1,2 and 3 is 1*2 + 3.
Ver. Test 1 and 2 must both OK to be OK. If test 1 and 2 is NG
while test 3 is OK, the result is OK
40
 Solder Inspection
Open Solder : 7. Pad Center (3D)

Normal Open Solder

The inspection area is fixed from 4/8 to 6/8 of solder pad

i. Average Height: The average height detected in the

inspection area should not exceeds the set value to be
OK. Otherwise, report as NG

Lower Average Height Higher Average Height

41
Solder Inspection
Open Solder : 8. Pin Centre Part Area (2D)

Normal

Inspection Area The inspection area is at the center part of the pin

Color ratio: If the actual blue color ratio detected at

Open the pin center part area is less than the set value,
Solder reports as NG

Recommended Color:
Color Item 0: B 33~100
Open
Solder
Hor.
Ver. Inspection Area
42
Solder Inspection

Open Solder Algorithm Combination

• General IC Inspection Algorithm: 1 + 2*5 / 2*4*5*7

• Long Solder Pad: (1 + 2)*6
• Wide Solder Pad: 1 + 2*5 + 3 + 6
• Large Amount of Solder Paste: 1 + 2 + 6 / 3 + 4 + 8

Note:
➢‘*’ is AND logic, all conditions need to be passed
➢ ‘+’ is OR logic, either one condition passes consider passed

43
Solder Inspection
Pin Bending Detection (2D)
Horizontal Vertical Length
Width

Normal Inspection
Area

Horizontal Vertical Length

Width
Inspection Area: Inspect both sides of the solder pad.
Pin
Bending
Color Ratio: The red color within the detection area
should not exceed the set value
Horizontal Vertical Length
Width
Pin Recommended Color:
Bending Color Item 0: R 33~100 ，W 50~255
Hor.

Ver.
44
Solder Inspection
Pin Bending Detection 2D (Side Fillet)

Vertical Length
Horizontal Width

Normal Inspection
Area

Vertical Length
Vertical Length
Inspection Area: Inspect both sides of the pin
Pin
Bending Color Ratio: The red color within the detection area
should not exceed the set value
Vertical Length

Note: The relationship of pin bending detection and side

Vertical Length fillet is ‘AND’ logic

Pin
Hor. Bending
Recommended Color:
Ver. Color Item 0: R 33~100 ，W 50~255
Vertical Length

45
 Recommended Color:
Solder Inspection Normal Inspection Area: Broken Tin Detection (2D)
Color Item 0: R 35~100 ，W 50~255
Pin External Part Detection:
Color Item 0: G 35~100 ，W 50~255
Color Item 1: B 35~100 ，W 50~255
Pin Part
Area Length
A Solder Pad Outer Part
Solder Pad Horizontal Width = 100%

Normal

B
Inner Side Excluded Inspection
Tip
Area
Excluded Part A:
1. Extract the red color of exposed pad and its brightness
2. Set the value for inner side excluded and tip excluded
Broken 3. Within the inspection area, if the continuous qualified
Solder length is lower than the set value then it is OK

Part B:
Area Length 1. Extract the blue and green color of solder and its brightness
2. From the ending line of inspection area in part A, extend
the ‘Area Length’ for pin external part detection area based
Broken on the set value
Solder 3. Within the area, if the actual test color ratio less than set
Hor. value then it is OK

Ver. Inner Side Excluded

Tip
Note: Normally used for long solder pad. Relationship of part A
Excluded
and B is ‘OR’ logic. Part B will only be tested if part A is NG
46
Solder Inspection
Solder Quantitative Inspection (3D)
Figure 1

ℎ
𝐹𝑖𝑙𝑙𝑖𝑛𝑔 𝐻𝑒𝑖𝑔ℎ𝑡 = × 100%
𝐻

i. Filling Height (%): The calculation method is as shown in

the diagram 1. The example image depicts a cross-section,
with the black rectangle representing the example of the
Figure 2 body (chip) /pin (IC), and the blue arc representing the
solder. H represents the height of the component
electrode part/body/pin, depending on solder in contact
with which part for different component, and h represents
𝐶
Weld Width= × 100% the height of the solder contact point with the body/pin.
𝑊
ii. Filling Height (um): Same as filling height (%) except that
the inspection unit is in um
iii. Weld Width: As shown in the figure 2, calculate the
Hor. percentage of solder connection width to the width of the
component electrode (SOT and IC represent the width of
Ver. the pin), which is represented as C/W*100%. IPC Standard
– grade 3: 75% for weld width
47
 Solder Inspection
Solder Quantitative Inspection (3D) (Continued)

Figure 1

Calculation method (Wetting Contact Angle):

Figure 2 Point A is the highest contact point between the solder and
Wetting Contact Angle the component electrode (the end of the electrode for Chip,
pin for SOT and IC), and point B is the endpoint where the
solder extends on the solder pad, which can be considered as
a position where the thickness is below a certain value, as
shown in Figure 1.

Connect a line between points A and B. This line is used to

calculate the wetting contact angle between this line and the
Hor. horizontal plane, as shown in the figure 2.
Ver.
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 Solder Inspection Exposed Pad (2D)

Exposed Pad Characteristics: Large amount of dark red

color on most of the pad area due to insufficient /
missing solder
Inspection Area Inspection Area
i. Inspection Area: Starting from the outer end of the
pad towards inner, depending on number of pixels
Open defined
Normal
Solder
i. Color Ratio: Exposed pad color (R) detected within
the inspection area must be lower than the set value
% to be OK. Otherwise, report as NG ‘Exposed Pad’

Recommended Color:
Color Item 0: R 40~100，W 100~255

49
 Solder Inspection Excessive Adhesive (2D)

Excessive Adhesive Characteristics: Large amount of red

color on pad center close to pin (only applicable for red
glue process)
Inspection Area Inspection Area
i. Inspection Area: Starting from pin end towards
outer area of pad, depending on number of pixels
Excessive defined
Normal
Adhesive
i. Color Ratio: Adhesive color (R) detected within the
inspection area must be lower than the set value %
to be OK. Otherwise, report as NG

Recommended Color:
Color Item 0: R 40~100

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THANK YOU
明锐理想科技

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