3D AOI SOT Algorithm

明锐理想科技
MagicRay Technology

Date: 11st March 2024

Unauthorized distribution is prohibited.

The content of the information is accurate during the time of presentation. 1
However, MagicRay reserves the right to alter the content of the information if they deem fit.
 01 Searching Window

02 Component Height

CONTENT
03 Component Searching

04 Pad Searching

05 Component Inspection

06 Solder Inspection
2
 Searching Window

Size and Orientation of Searching Window

20 ~ 30 pixels bigger than the solder pad
Purpose of Searching Window is to create a region to
search for the component and positioning of windows
inside

Size of Searching Window: Usually set to 20-30 pixels

larger than the solder pad as shown in figure.

Orientation of Searching Window: Follow the

orientation of the component in CAD
Searching Orientation follow the CAD
Window

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 Searching Window Size and Orientation of Body Window
Purpose of Body Window is to define the size of the
Body Window component body that the software should search for, within
the searching window.

Size of Body Window: Follow actual size of the component

body in image.

Orientation of Body Window: Follow the orientation of the

• Size of Body Window follows actual image
component in CAD
• Orientation follows the CAD
Size and Orientation of Solder Pad Window
Purpose of Solder Pad Window is to define the size of the
Solder Pad Window solder pad that the software should search for, within the
searching window.

Size of Solder Pad Window: Follow actual size of the solder

pad in image. Solder Pad Window should cover from the end
of component body until the end of the pad
Insert Window
Size of Insert Window: Follow actual size of the pin in image
• Size of solder pad follows actual image
• Start from inner end of electrode until outer end of solder pad Orientation of Solder Pad Window and Insert Window:
• Orientation always point out from component
Should always pointing out from the component 4
 01 Searching Window

02 Component Height

CONTENT
03 Component Searching

04 Pad Searching

05 Component Inspection

06 Solder Inspection
5
Component Height
Component Height

Definition of Height = distance from PCB surface to the

top of the component.
Height

1. Height: Manually input the height of the component

tested. Click on the icon below, draw a box on the
component, the corresponding height will pop up,
enter the appropriate height and click ‘SET’

Enter the height of the component

obtained and click ‘SET’

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 01 Searching Window

02 Component Height

CONTENT
03 Component Searching

04 Pad Searching

05 Component Inspection

06 Solder Inspection
7
 Component Searching
Body Searching (3D) – Color Area

Body Searching Height:

i. Component height is 100% when component height =
1270um (as defined in ‘Height’ section)
ii. Cross section A1 is created at 70% of the component
height = 889um. The area that exceeds 889um at
cross section A1 will appear in Green

Color Area: Taking the body window area (A) as 100%, if

A1/A ≥ 45% set value then its result is OK and the body
Component Height (1270 μm) window will retrieve that as the position of the body;
otherwise, it is NG (Missing)

cross section A1
(70% Height)

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 Component Searching
Body Searching (3D) – Outline

Body Searching Height:

i. Component height is 100% when component height =
1270um (as defined in ‘Height’ section)
ii. Cross section A1 is created at 70% of the component
height = 889um. The area that exceeds 889um at
cross section A1 will appear in Green

Outline: Taking the edge of the component body to

perform deflection inspection. If the component slants
Component Height (1270 μm) more than the defined value, reports as NG ‘skewing’

cross section A1
(70% Height)

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Component Searching Body Searching – Color Comparison Searching (2D)

Before
After
Searching
Searching

1. Create the size of the body window following the

actual size of the component
2. Extract the colour of the body
3. Set the ‘Color Ratio’: The ratio of the detected body
color in the searching window to the body window
size. If the ratio reaches the set value, this will be
used as the body position. Otherwise, it will report
as searching error

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Component Searching Body Searching – Edge Searching (2D)

1. Create the size of the body window following the

actual size of the component.
2. Extract the color of the body
3. Set the ‘Body Slant Range’ so that searching will be
performed within this range. If the deflection angle
is greater than the set value, a search error will be
reported
4. If ‘Deflection Inspection’ is checked, component will
be reported as “Skewing” if it is slanted more than
the set value
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 01 Searching Window

02 Component Height

CONTENT
03 Component Searching

04 Pad Searching

05 Component Inspection

06 Solder Inspection
12
 Recommended Color:
Pad Searching Color Item 0: R 33~100，W 50~255
Pad Window (2D) Color Item 1: G 33~100，W 160~255
Color Item 2: B 33~100, W 50~255

After Searching
Before Searching

1. Create the size of the solder pad window following the

actual size of the solder pad
2. Extract color of the solder pad (R, G, B). Avoid extracting
color outside of the solder pad
3. Set the ‘Pad Color Ratio’: The proportion of pad color
detected in the searching window to the pad window size.
If the pad color ratio detected is greater than set value,
this will be used as the pad final position. Otherwise,
‘Missing’ error will be reported

Extract colour of solder pad

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 01 Searching Window

02 Component Height

CONTENT
03 Component Searching

04 Pad Searching

05 Component Inspection

06 Solder Inspection
14
Component Inspection Horizontal and Vertical Shift (2D)
Figure 1 Figure 2
Before Positioning After Positioning

Horizontal
Horizontal Width (H)
Shift (𝐻1)

Vertical Shift (∆L) Vertical Length (L)

20~33%
20~33%
Vertical Shift Explanation:
Horizontal Shift Explanation:
As shown in Figure 2, take the length L in the direction of the
As shown in Figure 1, take the length H in the horizontal solder pad arrow as 100% vertical length (L), and take the
direction of the pin as 100% horizontal width, and take the distance between the two centers in the vertical direction
distance beyond the horizontal direction of the solder pad before and after positioning as the vertical shift △L; if △L/L
as the horizontal shift H1; if H1/H ≤ 33% of the set value, ≤ 33% of the set value, then it is OK; otherwise, it is
then it is OK; otherwise, it is considered offset. considered offset.

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Component Inspection

Missing Component (3D)

OK
1. Inspection Area: Define the area of inspection. Take the
area of body window as 100%

2. Average Height: The average height in the inspection

area should be more than 80% of the component
height set. Otherwise, report as ‘Missing’

Missing

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Component Inspection
Missing Window (2D)

40~60

OK 40~60

1. Create Missing Windows and place on the body of the component

2. Select the algorithm:
i. Detecting Body Color: Define the color of the body. If color
ratio less than set value, reports NG
ii. Detecting PCB Color: Define actual bare board / PCB
background color. If PCB color detected more than set
Missing value, reports NG
iii. Height: Define the average height that should be detected
in the missing window. If the height detected is less than
Recommended Color for Green PCB Board: set value, reports NG
Color Item 0: G 40~100
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 Component Inspection
Polarity Window (2D)
1. Create Polarity Windows and place on the component polarity
identification area
2. Extract the color for polarity recognition, usually white/black
3. Color ratio setting steps:
i. Place the polarity window in the polarity identification
area. Note down the actual measured value

OK

ii. Place the polarity window in the reversed area for

detection (may rotate the component by 180 degree). Note
down the actual measured value

iii. Set the color ratio as (46 + 2) / 2 = 24

Wrong Direction

iv. During inspection, if the detected color ratio in the polarity

window reaches the set value, then OK. Otherwise, it will
reports NG ‘wrong direction’
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 Component Inspection

Sign Window (2D)

Bridge Window

Bridge Window
Sign window needs
OCV Sign Window algorithm explanation:
Bridge Window OCR Sign Window algorithm explanation: to be drawn larger
1. Create sign window. Size needs to be drawn larger 1. OCR recognize the characters by their outline. It can than body window
than body window. Direction set to be same as the differentiate characters such as 0 and O.
wordings 2. OCR can be used independently, tick on ‘OCR’ to use
2. Click login to save template 3. Click ‘Learn’ to automatically detect the characters
3. Adjust the red box to frame over the characters to be inside the sign window
read 4. Click ‘+’ to add several more target characters.
4. If needed, select theWindow
Bridge colour ‘Channel’ and adjust the Maximum target allowed is 5
‘Max’ section to bring out clear display of the 5. Tick ‘Reverse Allowed’ if the character has no polarity
characters (usually used for chip components)
5. Tick on ‘Reverse Allowed’ if the component has no
polarity Note: If both OCV and OCR are activated, ‘OCR’ will only
6. ‘New OCV’ is a stricter algorithm of OCV. It is able to be used after ‘OCV’ fails. If OCV NG but OCR OK, the result
differentiate characters such as 8 and B. ‘Identity’ is is OK (‘OR’ relationship)
usually set to 65% 19
Component Inspection
Bridge Window (2D)
Bridge Window Bridge Window
Bridge Window

1. Create Bridge Window and place around the component at

Bridge Window
Bridge Window
Bridge Window
locations that solder bridging is likely to occur
2. Extract color of solder (R, G, B). The solder bridge must penetrate
Bridging through the bridging window then only it will be reported as NG
3. Across The Width: Solder bridge is to be ignored even if it
Bridge Window Bridge Window penetrates through the bridging window, given that its width is
less than the set value (pixel). In other words, If a solder bridge
penetrates through the bridge window, its width will be judged, if
the width exceeds the set value, then it will be reported as short
Bridge Window
circuit NG

Bridge Window Bridge Window

Recommended Color:
Color Item 0: W 50~255
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 Component Inspection Planeness Window (3D)

Vertical Directional
Bridge Window
Parallel Directional

Inspection area Inspection area

Planeness Window
Function of planeness window is to check the height difference of the
component within the window
Bridge Window

• Parallel Directional: Check the height difference across horizontal width

within the window
• Vertical Directional: Check the height difference across vertical length
within the window
Height Difference
Bridge Window • Four corners: Check the height difference across 4 corners within the
window

i. Inspection Area: Define the size of the inspection area, taking size
Bridge Window of the planeness window as 100%
ii. Area Height Difference: Maximum height difference detected
within the inspection area must be less or more than the set value
iii. Reported Error Type: Select the error type to display if NG occurs
iv. Object Following: Positioning method for the window 21
Component Inspection Height Window (3D)

Bridge Window
Inspection area

Height Window

Bridge Window

Function of height window is to check the height of the item within

Overlapped / Extra the window. Potential use on detecting missing / lifted / extra
Component component

i. Area Height: The height detected within the height window

must be either lower or greater than the set value (depend on
Bridge Window
selection). Otherwise, report as NG
ii. Reported Error Type: Error type to display when NG occurs
iii. Test Method: Calculation method for the area height
Bridge Window
iv. Object Following: Positioning method for the height window
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 01 Searching Window

02 Component Height

CONTENT
03 Component Searching

04 Pad Searching

05 Component Inspection

06 Solder Inspection
23
 Solder Inspection
Fillet (2D)

Inspection Inspection
Fillet function is to inspect the presence and amount of solder
Area Area

1. Inspection Area: The inspection range from the end of pin to

Insufficient certain location of the pad, depending on the pixel value
defined
Normal Solder 2. Each Row Qualified Width: The proportion of !R colour in each
horizontal row must be equal or more than the defined % to
fulfil
3. Continuous Qualified Length: Consecutive fulfilled row must be
equal or more than defined pixels to be considered as OK

Recommended Color: Test result of 2 and 3 must both be fulfilled then only report as OK.
Color Item 0 = R: 0~ 33 Otherwise, report as insufficient solder
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 Solder Inspection Side Fillet (2D)

Inspection Area
Length of Insert Window = 100%

Excluded
Width
Side Fillet function is usually used on wide solder pad to inspect
Inspection Area 80% presence and amount of solder

1. Inspection Area: The inspection range at side of pins, from the

outer end of insert window towards inner end, taking full
length of insert window as 100%
Insufficient 2. Excluded Width: The horizontal width of the inspection area
Normal Solder 3. Each Row Qualified Width: The proportion of !R colour in each
horizontal row must be equal or more than the defined % to
fulfil
4. Continuous Qualified Length: Consecutive fulfilled row must be
equal or more than defined pixels to be considered as OK

Test result of 3 and 4 must both be fulfilled then only report as OK.
Recommended Color: Otherwise, report as insufficient solder
Color Item 0 = R: 0~ 33
Note: Relationship between ‘Fillet’ and ‘Side Fillet’ is OR logic 25
 Solder Inspection Open Solder : 1. Entire Pad (2D)

Excluded Ratio 20% Excluded Ratio 20%

Open Solder Characteristics: Large amount of red colour at region

close to the pin
Inspection Area Inspection Area
Entire Pad: Inspection area is at the fillet area close to the pin

i. Excluded Ratio: Excluded inspection region, taking 100% as the

full solder pad length
ii. Color Ratio: Detected open solder color ratio must be less than
Open
the set value. Otherwise reported as ‘Open Solder’
Normal Solder
Recommended Color:
Color Item 0: R 33~100，W 50~255
Color Item 1: G 38~100，W 120~255
Color Item 2: !B 0~33, W 120~255

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 Solder Inspection
Open Solder: 2. Pad Center (2D)

20% Excluded Ratio 20% Excluded Ratio

20% 20%
Excluded Excluded
Ratio Ratio
Open Solder Characteristics: Large amount of red colour at
region close to the pin

Pad Center: Inspection area is at the fillet area close to the pin
Inspection Area Inspection Area (center part of it)

i. Excluded Ratio: Excluded inspection region, taking 100% as

the full solder pad length
ii. Color Ratio: Detected open solder color ratio must be less
Open than the set value. Otherwise reported as ‘Open Solder’
Normal
Solder
Recommended Color:
Color Item 0: R 33~100，W 50~255
Color Item 1: G 38~100，W 80~255
Color Item 2: !B 0~33, W 50~255

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 Solder Inspection Open Solder: 2. Pad Center (3D)

20% Excluded Ratio 20% Excluded Ratio

20% 20%
Excluded Excluded
Ratio Ratio

Open Solder Characteristics: Center part of the solder

Inspection Area Inspection Area
will have greater average height if open solder occurs

Pad Center: Inspection area is at the fillet area close to

the pin (center part of it)

Open i. Excluded Ratio: Excluded inspection region, taking

Normal 100% as the full solder pad length
Solder
ii. Average Height: Detected solder average height
within the inspection area must be less than the set
value. Otherwise reported as NG ‘Open Solder’

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 Solder Inspection Open Solder: 3. Entire Pad Tip (2D)

25% Inspection Area 25% Inspection Area

Open Solder Characteristics: Large amount of blue colour at

region near the outer end of the pad (usually use for long
solder pad)

Inspection Area Inspection Area Entire Pad Tip: Inspection area on outer end of pad where
solder should be flatter

i. Inspection Area: Create inspection region from outer

end of the pad
Open
Normal ii. Color Ratio: Detected color ratio must be more than the
Solder
set value. Otherwise reported as ‘Open Solder’
Recommended Color:
Color Item 0: R 33~100，W 50~255

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 Solder Inspection Open Solder: 4. Side Pad Inspection (2D)

Condition to fail
Insert Window =
100% Length as ‘Open Solder’

Excluded Excluded
Width Width Open Solder Characteristics: Large amount of red colour at the
80% Area Length 80% Area Length
both sides of electrode (usually used for wide solder pad)

Side Pad Inspection: Inspection area on the both sides of each

electrode

i. Area Length: Vertical Length of the inspection area, taking

electrode length as 100%
Open ii. Excluded Width: Excluded number of pixels from outer
Normal
Solder end of the inspection area
iii. Each Row Qualified Width: Each row qualified color pixel
more than 40% to fulfil the condition as ‘open solder’
iv. Continuous Qualified Length: Row (in pixel) fulfilling the
color condition (R and G) should less than the defined
pixel. Otherwise, report as NG ‘open solder’

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 Solder Inspection Open Solder: 5. Pad Tip Corners (2D)

25% Vertical Length 25% Vertical Length

25% 25%
Horizontal Horizontal
Width Width

Open Solder Characteristics: Large amount of blue colour at 4

corners at the outer end of the pad (usually used for short
solder pad)
Inspection Area Inspection Area
4 Pad Tip Corners: Inspection area on 4 corners at outer end
of pad where solder should be flatter

i. Inspection Area: Create inspection regions at 4 corners

at outer end of the pad
Open
Normal ii. Color Ratio: Detected color ratio must be more than the
Solder
set value. Otherwise reported as ‘Open Solder’

Recommended Color:
Color Item 0: R 33~100，W 50~255

31
 Solder Inspection Open Solder: 6. Pad Tip Center (2D)

15% vertical length 15% vertical length

15% 15%
horizontal horizontal
width width Open Solder Characteristics: Large amount of blue colour at
the centre area of the outer end of the pad (more often used
for circular solder pad)

Inspection Area Inspection Area Pad Tip Center: Inspection area on center area of the outer
end of pad where solder should be flatter

i. Inspection Area: From outer end of the pad inwards, to

inspect center of the outer end
Open
Normal ii. Color Ratio: Detected color ratio must be more than the
Solder
set value. Otherwise reported as ‘Open Solder’

Recommended Color:
Color Item 0: R 33~100，W 50~255
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 Solder Inspection Open Solder: 7. Pad Tip Center (2D)

Length of Insert Window = 100% Length of Insert Window = 100%

Open Solder Characteristics: Open solder due to pin bending

upwards causing it to be comparatively flatter therefore red in
Inspection color in image
Area
Inspection Area 80 % Pin Portion: Inspection area on pin. From outer end of pin
towards inner, taking full length of pin as 100%

i. Inspection Area: From outer end of the pin going

Open inwards, to inspect the area of the pin
Normal Solder
ii. Color Ratio: Detected color ratio must be less than the
set value. Otherwise reported as ‘Open Solder’

Recommended Color:
Color Item 0: R 33~100，W 50~255

33
 Solder Inspection Open Solder: 7. Pad Tip Center (3D)

Length of Insert Window = 100% Length of Insert Window = 100%

Open Solder Characteristics: Open solder due to pin bending

upwards causing it to have higher average height
Inspection
Area Pin Portion: Inspection area on pin. From outer end of pin
Inspection Area 80 % towards inner, taking full length of pin as 100%

i. Inspection Area: From outer end of the pad going

inwards, to inspect the area of the pin
Open
Normal Solder ii. Average Height: Detected average height in the
inspection area must be lower than the set value.
Higher
Otherwise reported as ‘Open Solder’
average
height

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Solder Inspection

Open Solder Algorithm Combination

• Normal Transistor (1+2+4+6) (Exposed Pad test optional)

• Transistor Paste Heap (1+2+6+7) (Exposed Pad test optional)
• High-Power Transistor (1+2+4+6) (Exposed Pad test optional)
• Array Resistor/Capacitor (1*2+3) (Exposed Pad test optional)
• Diode (1+3+6) (Exposed Pad test optional)

Note:
➢‘*’ is AND logic, all conditions need to be passed
➢ ‘+’ is OR logic, either one condition passes consider passed

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 Solder Inspection Exposed Pad (2D)

Exposed Pad Characteristics: Large amount of dark red

color on most of the pad area due to insufficient /
missing solder
Inspection Area Inspection Area
i. Inspection Area: Starting from the outer end of the
pad towards inner, depending on number of pixels
Open defined
Normal
Solder
i. Color Ratio: Exposed pad color (R) detected within
the inspection area must be lower than the set value
% to be OK. Otherwise, report as NG ‘Exposed Pad’

Recommended Color:
Color Item 0: R 40~100，W 100~255

36
 Solder Inspection Excessive Adhesive (2D)

Excessive Adhesive Characteristics: Large amount of red

color on pad center close to pin (only applicable for red
glue process)
Inspection Area Inspection Area
i. Inspection Area: Starting from pin end towards
outer area of pad, depending on number of pixels
Excessive defined
Normal
Adhesive
i. Color Ratio: Adhesive color (R) detected within the
inspection area must be lower than the set value %
to be OK. Otherwise, report as NG

Recommended Color:
Color Item 0: R 40~100

37
 Solder Inspection
Pin Offset (2D)

30% OK 30%
Horizontal Horizontal
Width Width

Width of
Insert
Window =
100%

30% 30%
Pin Bending Characteristics: Pins are deflected therefore
Horizontal
Width
Horizontal
Width
pin color (R) appears outside of the pad. Normally if the
pins are not offset, these areas should be the PCB color

i. Detection Area Length: The horizontal width of

Pin Offset inspection area.

i. Color Ratio: Color ratio of pin detected should be

lower than defined %. Otherwise, report as NG ‘pin
offset’

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THANK YOU
明锐理想科技

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