FSC-BT986 Datasheet

FSC-BT986
5.0 Dual Mode
Bluetooth Module
Version 1.3

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 FSC-BT986 Datasheet

Copyright © 2013-2021 Feasycom Technology. All Rights Reserved.

Feasycom Technology reserves the right to make corrections, modifications, and other changes to its
products, documentation and services at anytime. Customers should obtain the newest relevant
information before placing orders. To minimize customer product risks, customers should provide
adequate design and operating safeguards. Without written permission from Feasycom Technology,
reproduction, transfer, distribution or storage of part or all of the contents in this document in any form
is prohibited.

Revision History
Version Data Notes
1.0 2021/04/21 Initial Version Fish
1.1 2021/06/03 Update module picture Fish
1.2 2021/06/08 Update transmit power Fish
1.3 2021/08/25 Update transmit power Devin Wan

Contact Us
Shenzhen Feasycom Technology Co.,LTD

Email: sales@[Link]

Address: Rm 508, Building A, Fenghuang Zhigu, No.50, Tiezai Road, Xixiang, Baoan District, Shenzhen, 518102, China
Tel: 86-755-27924639, 86-755-23062695

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 FSC-BT986 Datasheet

Contents
1. INTRODUCTION ............................................................................................................................................................... 4

2. GENERAL SPECIFICATION ................................................................................................................................................. 5

3. HARDWARE SPECIFICATION .......................................................................................................................................... 6

3.1 BLOCK DIAGRAM AND PIN DIAGRAM ......................................................................................................................................... 6

3.2 PIN DEFINITION DESCRIPTIONS ................................................................................................................................................. 7

4. PHYSICAL INTERFACE ....................................................................................................................................................... 8

4.1 POWER SUPPLY....................................................................................................................................................................... 8

4.2 RF INTERFACE ........................................................................................................................................................................ 9
4.3 SERIAL INTERFACES .................................................................................................................................................................. 9
4.3.1 UART........................................................................................................................................................................... 9
4.3.2 I2C Interface ............................................................................................................................................................. 10
4.3.3 USB Device Controller............................................................................................................................................... 10

5. ELECTRICAL CHARACTERISTICS ...................................................................................................................................... 11

5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................... 11

5.2 RECOMMENDED OPERATING CONDITIONS ................................................................................................................................. 11
5.3 RF CHARACTERISTICS ............................................................................................................................................................. 11

6. MSL & ESD..................................................................................................................................................................... 12

7. RECOMMENDED TEMPERATURE REFLOW PROFILE ........................................................................................................ 12

8. MECHANICAL DETAILS ................................................................................................................................................... 14

8.1 MECHANICAL DETAILS............................................................................................................................................................ 14

8.2 HOST PCB LAND PATTERN AND ANTENNA KEEP-OUT FOR FSC-BT986 ........................................................................................... 15

9. HARDWARE INTEGRATION SUGGESTIONS ..................................................................................................................... 15

9.1 SOLDERING RECOMMENDATIONS ............................................................................................................................................. 15

9.2 LAYOUT GUIDELINES(INTERNAL ANTENNA)................................................................................................................................. 16
9.3 LAYOUT GUIDELINES(EXTERNAL ANTENNA) ................................................................................................................................ 16
9.3.1 Antenna Connection and Grounding Plane Design .................................................................................................. 17

10. PRODUCT PACKAGING INFORMATION ......................................................................................................................... 18

10.1 DEFAULT PACKING ............................................................................................................................................................... 18

10.2 PACKING BOX(OPTIONAL) ................................................................................................................................................... 19

11. APPLICATION SCHEMATIC ............................................................................................................................................ 20

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 FSC-BT986 Datasheet

1. INTRODUCTION

Overview Working current is 5mA

Support External Antenna
FSC-BT986 is a high-performance, highly integrated
Bluetooth 5.0 BR/EDR/BLE, designed to operate on the RoHS compliant
2400MHz to 2480Mhz ISM frequency band.

Abundant peripherals, power-on reset (POR) and

Application
I2C/USB, arithmetic accelerators further reduce the cost
and size of the entire system. Health Thermometer
Heart Rate
By default, Feasycom standard firmware is built-in, and
customized firmware is also [Link]-BT986 is a Blood Pressure
suitable product for designers who want to add wireless Proximity
functions to their products.

Features Module picture as below showing

Bluetooth 5.0 Classical/BLE Proprietary double-mode
RF SOC
UART programming and data interface (baudrate can
up to 921600bps)
I2C/USB interfaces
Digital Peripherals
 Two-wire Master (I2C compatible) , up to
400kbps
 LED drive capability
Figure 1: FSC-BT986 Picture
 AES256 HW encryption
 USB2.0 fullspeed,4Eps, support host mode
Dual Core Digital Architecture
 ARM Cortex-M0 Core for application
 CPU clock speed up to 192Mhz
2.4GHz Transceiver
 Single-end RFIO
 -95dBm in BLE mode
 Support 250kbps, 1/2/3 Mbps data rates
 Tx Power 0dBm
Postage stamp sized form factor

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2. General Specification
Table 1: General Specifications
Categories Features Implementation
Bluetooth Version Bluetooth v5.0 Dual mode
Frequency 2.400 - 2.480 GHz
Wireless Transmit Power 5dBm (Maximum)
Specification Receive Sensitivity -95 dBm@0.1%BER (BLE mode)
Modulation GFSK, π/4 DQPSK, 8DPSK
Raw Data Rates (Air) 3 Mbps
TX, RX,
Supports Automatic Flow Control (CTS and RTS lines).
General Purpose I/O
UART Interface
Host Interface and Default 115200,N,8,1
Peripherals Baudrate support from 1200 to 921600
5, 6, 7, 8 data bit character
GPIO 8 (maximum – configurable) lines
I2C Interface 1 (configurable from GPIO total). Up to 400 kbps
Classic Bluetooth Support
Profiles
Bluetooth Low Energy Support
Maximum Classic Bluetooth 1 Clients
Connections Bluetooth Low Energy 1 Clients
FW upgrade Jlink
Supply Voltage Supply 2.2V ~ 5.5V
Power Consumption Working current 5mA
Physical Dimensions 13mm X 26.9mm X 2.4mm; Pad Pitch 1.5mm
Operating -20°C to +85°C
Environmental
Storage -30°C to +95°C
Lead Free Lead-free and RoHS compliant
Miscellaneous
Warranty One Year
Humidity 10% ~ 90% non-condensing
MSL grade: MSL 3
Human Body Model: Class-2
ESD grade:
Machine Model: Class-B

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3. HARDWARE SPECIFICATION
3.1 Block Diagram and PIN Diagram

ANT 24MHZ UART

Crystal

I 2C
5.0 dual mode
BT controller
PIO/AIO
ART
DFU

ARM DDD
USB/LED
Cortex-M0

RESET

3.3V GND

Figure 2: Block Diagram

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 FSC-BT986 Datasheet

EXT_ANT 36
GND 35
1 UART_TX UART_RTS/PIO5 34
2 UART_RX PIO3 33
3 UART_CTS/PIO6 PIO4 32
4 UART_RTS/PIO5 PIO2 31
5 NC PIO3 30
6 NC PIO2 29
7 NC NC 28
8 NC RESET 27
9 TRAN/USB_DP/PIO1 NC 26
10 DISC/USB_DM/PIO0 NC 25
11 RESET TRAN/USB_DP/PIO1 24
12 VDD_3V3 DISC/USB_DM/PIO0 23
13 GND GND 22
SWDIO
SWCLK

GND
NC
NC
NC

NC
NC

14 15 16 17 18 19 20 21

Figure 3: FSC-BT986 PIN Diagram(Top View)

3.2 PIN Definition Descriptions

Table 2: Pin definition
Pin Pin Name Type Pin Descriptions
1 UART_TX I/O UART Data output
2 UART_RX I/O UART Data input
3 UART_CTS/PIO6 I/O UART Clear to Send (active low)
Alternative Function: Programmable input/output line
4,34 UART_RTS/PIO5 I/O UART Request to Send (active low)
Alternative Function: Programmable input/output line
5 NC
6 NC
7 NC
8 NC
9,24 Tran/USB_DP/PIO1 I/O Host MCU change UART transmission mode. (Default)
H = instruction mode
L = throughput mode
Alternative Function: Programmable input/output line
Alternative Function: USB_DP
10,23 Disc/USB_DM/PIO0 I/O Host MCU disconnect bluetooth. (Default)
Alternative Function: Programmable input/output line

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Alternative Function: USB_DM

11,27 RESET I External reset input: Active LOW.
Set this pin low reset to initial state
12 VDD_3V3 Vdd Power supply voltage 3.3V
13 GND Vss Power Ground
14 NC
15 SWDIO I/O Debugging through the data line
16 SWCLK I/O Debugging through the clk line
17 NC
18 NC
19 NC
20 NC
21 GND Vss Power Ground
22 GND Vss Power Ground
25 NC
26 NC
28 NC
29,31 PIO2 Programmable input/output line
Alternative Function: I2C_SCL
30,33 PIO3 I/O BT Status(Default)
Connected: High ; Not connected: low
Alternative Function: Programmable input/output line
Alternative Function: I2C_DAT
32 PIO4/LED I/O Programmable input/output line
Alternative Function: LED(Default)
Power On: Light Slow Shinning ; Connected: Steady Lighting.
35 GND Vss Power Ground
36 EXT_ANT O RF signal output .
If you need to use an external antenna, you can shield the onboard
antenna by modifying the module on the 0R resistor. Or contact
Feasycom to modify.

4. PHYSICAL INTERFACE
4.1 Power Supply
The transient response of the regulator is important. If the power rails of the module are supplied from an external
voltage source, the transient response of any regulator used should be 20μs or less. It is essential that the power rail
recovers quickly.

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4.2 RF Interface
For this module, the default mode of the antenna is internal antenna.

The user can connect the 50 ohm antenna directly to the RF port.

2402–2480 MHz
TX output power of +5dBm.
Receiver to achieve maximum sensitivity -95dBm @ 0.1% BLE

4.3 Serial Interfaces

4.3.1 UART
FSC-BT986 provides one channels of Universal Asynchronous Receiver/Transmitters(UART)(Full-duplex asynchronous
communications). The UART Controller performs a serial-to-parallel conversion on data received from the peripheral
and a parallel-to-serial conversion on data transmitted from the CPU. Each UART Controller channel supports ten types
of interrupts.

This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple
mechanism for communicating with other serial devices using the RS232 protocol.

When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two
devices.

This module output is at 3.3V CMOS logic levels (tracks VCC). Level conversion must be added to interface with an
RS-232 level compliant interface.

Table 3: Possible UART Settings

Parameter Possible Values
Minimum 1200 baud (≤2%Error)
Baudrate Standard 115200bps(≤1%Error)
Maximum 921600bps(≤1%Error)
Flow control Supports Automatic Flow Control (CTS and
RTS lines)
Parity None, Odd or Even
Number of stop bits 1 /1.5/2
Bits per channel 5/6/7/8

When connecting the module to a host, please make sure to follow .

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 FSC-BT986 Datasheet

TX RX
RX TX

RTS CTS
Module CTS RTS Host

GND GND

Figure 4: UART Connection

4.3.2 I2C Interface

I2C is a two-wire, bi-directional serial bus that provides a simple and efficient method of data exchange between
devices. The I2C standard is a true multi-master bus including collision detection and arbitration that prevents data
corruption if two or more masters attempt to control the bus simultaneously.

FSC-BT986 has I2C master which supports 100Kbps and 400Kbps.

Data is transferred between a Master and a Slave synchronously to SCL on the SDA line on a byte-by-byte basis. Each
data byte is 8-bit long. There is one SCL clock pulse for each data bit with the MSB being transmitted first. An
acknowledge bit follows each transferred byte. Each bit is sampled during the high period of SCL; therefore, the SDA
line may be changed only during the low period of SCL and must be held stable during the high period of SCL. A
transition on the SDA line while SCL is high is interpreted as a command (START or STOP). Please refer to the following
figure for more details about I2C Bus Timing.

Figure 5: I2C Bus Timing

The device on-chip I2C logic provides the serial interface that meets the I2C bus standard mode specification. The I2C
port handles byte transfers autonomously. The I2C H/W interfaces to the I2C bus via two pins: SDA and SCL. Pull up
resistor is needed for I2C operation as these are open drain pins. When the I/O pins are used as I2C port, user must set
the pins function to I2C in advance.

4.3.3 USB Device Controller

USB2.0 fullspeed,4Eps, support host mode.

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5. ELECTRICAL CHARACTERISTICS
5.1 Absolute Maximum Ratings
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below.
Exceeding these values causes permanent damage.

The average PIO pin output current is defined as the average current value flowing through any one of the
corresponding pins for a 100mS period. The total average PIO pin output current is defined as the average current
value flowing through all of the corresponding pins for a 100mS period. The maximum output current is defined as the
value of the peak current flowing through any one of the corresponding pins.

Table 4: Absolute Maximum Rating

Parameter Min Max Unit
VDD_3V3 DC Power Supply -0.3 +5.5 V
TA - Operating Temperature -20 +85 °C
TST - Storage Temperature -30 +95 °C

5.2 Recommended Operating Conditions

Table 5: Recommended Operating Conditions
Parameter Min Type Max Unit
VDD_3V3 DC Power Supply 2.2 3.3 5.5 V
TA - Operating Temperature -20 25 +85 °C
TST - Storage Temperature -30 25 +95 °C
VIH High Level VDD_3V3-0.3 VDD_3V3+0.3 V
VIL Low Level VSS VSS+0.3 V
VOH High Level VDD_3V3-0.3 VDD_3V3+0.3 V
VOL Low Level VSS VSS+0.3 V

5.3 RF characteristics
Table 6: Transmitter Characteristics
Parameter Min Type Max Unit
Operating Frequency 2400 2480 MHz
RF output power -20 0 5 dBm
Out of band emission 2 MHz (GFSK) -40 dBm
Out of band emission 3 MHz(GFSK) -48 dBm
20dB bandwidth 0.9 MHz

Table 7: BLE Receiver Characteristics

Parameter Min Type Max Unit
High Gain mode, Sensitivity @0.1% -95 dBm
Standard Gain mode, Sensitivity @0.1% -92 dBm
Maximum Input Power 0 dBm

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Co-channel C/I, Basic Rate, GFSK 7 dB

ACS C/I 1MHz, Basic Rate, GFSK 5.5 7 dB
ACS C/I 2MHz, Basic Rate, GFSK -36 -34 dB
ACS C/I 3MHz, Basic Rate, GFSK -43 dB
ACS C/I Image channel, Basic Rate, GFSK -34 dB
C/I 1 MHz adjacent to image channel, Basic Rate, GFSK -28 dB

Table 8: BT Receiver Characteristics

Parameter Min Type Max Unit
Basic Rate, GFSK, BER<0.1%, Dirty Tx on -92 dBm
EDR, π/4 DQPSK, BER<0.01%, Dirty Tx on -93 dBm
EDR, 8PSK, BER<0.01%, Dirty Tx on -83 dBm
Maximum Input Power 0 dBm
Co-channel C/I, EDR, π/4 DQPSK 10.5 dB
ACS C/I 1MHz, EDR, π/4 DQPSK -8 dB
ACS C/I 2MHz, EDR, π/4 DQPSK dB
ACS C/I 3MHz, EDR, π/4 DQPSK -54 dB
ACS C/I Image channel, EDR, π/4 DQPSK -27 dB
C/I 1 MHz adjacent to image channel, EDR, π/4 DQPSK -43 dB
Co-channel C/I, EDR, 8PSK 20 dB
ACS C/I 1MHz, EDR, 8PSK 0 dB
ACS C/I 2MHz, EDR, 8PSK -20 dB
ACS C/I 3MHz, EDR, 8PSK -45 dB
ACS C/I Image channel, EDR, 8PSK -18 dB
C/I 1 MHz adjacent to image channel, EDR, 8PSK -33 dB

6. MSL & ESD

Table 9: MSL and ESD
Parameter Value
MSL grade: MSL 3
Human Body Model: Class-2
ESD grade:
Machine Model: Class-B

7. RECOMMENDED TEMPERATURE REFLOW PROFILE

Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages
contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and
shipment. If directed to bake units on the card, please check the below next table and follow instructions specified by
IPC/JEDEC J-STD-033.
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in the
below next table, the modules must be removed from the shipping tray.

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Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new
humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment
30°C/60%RH.

Table 10: Recommended baking times and temperatures

125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp.
Saturated @ Floor Life Limit Saturated @ Floor Life Limit Saturated @ Floor Life Limit
MSL
30°C/85% + 72 hours @ 30°C/85% + 72 hours @ 30°C/85% + 72 hours @
30°C/60% 30°C/60% 30°C/60%
3 9 hours 7 hours 33 hours 23 hours 13 days 9 days

Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to
J-STD-020D1 standards for reflow temperatures.
The soldering profile depends on various parameters necessitating a set up for each application. The data here is
given only for guidance on solder reflow.

250

217
210

25 A B C D E

0 1 2 3 4 5 6 min

Figure 6: Typical Lead-free Re-flow

Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this
zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat
uniformly to the PCB board and completely remove solvent to reduce the heat shock to components.
Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread
over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux,
each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and
PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone.
Equilibrium Zone 2 (C) (optional) — In order to resolve the upright component issue, it is recommended to keep the
temperature in 210 – 217  for about 20 to 30 second.
Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free
solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component
discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The
recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the

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temperature is above 217 C.

Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint.
Typical cooling rate should be 4 C.

8. MECHANICAL DETAILS
8.1 Mechanical Details
 Dimension: 13mm(W) x 26.9mm(L) x 2.0mm(H) Tolerance: ±0.1mm
 Module size: 13mm X 26.9mm Tolerance: ±0.2mm
 Pad size: 1mmX0.8mm Tolerance: ±0.2mm
 Pad pitch: 1.5mm Tolerance: ±0.1mm

2.4mm(Max.)

Figure 7: FSC-BT986 footprint

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8.2 Host PCB Land Pattern and Antenna Keep-out for FSC-BT986

Please check the picture below for Pad Structure and Keep Out Area:

Figure 8: Host PCB-Top View

9. HARDWARE INTEGRATION SUGGESTIONS

9.1 Soldering Recommendations
FSC-BT986 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent
on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder
paste used. Consult the datasheet of particular solder paste for profile configurations.
Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of
the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be
studied case by case. Thus following recommendation should be taken as a starting point guide.

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9.2 Layout Guidelines(Internal Antenna)

It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or
any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the
antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias
separated max 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an
unintentional resonator. Use GND vias all around the PCB edges.
The mother board should have no bare conductors or vias in this restricted area, because it is not covered by stop mask
print. Also no copper (planes, traces or vias) are allowed in this area, because of mismatching the on-board antenna.

26.9

20
5
Max.0.5
43.5

Max.0.5

13
18

no bare copper(exept solder pads for module)

no copper and components on any layer

10

no components on any layer

do not place any conductive parts in this area

Applic. PCB
20 10

Provide solid ground plane(s) as large as possible around area

Figure 9: FSC-BT986 Restricted Area

Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the
following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following
list is aimed to avoid EMC problems caused by RF part of the module. Use good consideration to avoid problems arising
from digital signals in the design.
Ensure that signal lines have return paths as short as possible. For example if a signal goes to an inner layer through a
via, always use ground vias around it. Locate them tightly and symmetrically around the signal vias. Routing of any
sensitive signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and
under the line. If this is not possible, make sure that the return path is short by other means (for example using a
ground line next to the signal line).

9.3 Layout Guidelines(External Antenna)

Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs.
The trace from the antenna port of the module to an external antenna should be 50 and must be as short as possible
to avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of
the module should be kept away from any noise sources and digital traces. A matching network might be needed in
between the external antenna and RF-IN port to better match the impedance to minimize the return loss.

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As indicated in below, RF critical circuits of the module should be clearly separated from any digital circuits on the
system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this
way that module digital part towards your digital section of the system PCB.

Antenna
Antenna
RF & heat
enmitting
Non enmitting
Non enmitting circuits
circuits
circuits
Digital Part

RF & heat
enmitting
RF_IN circuits
RF_IN

Digital Part

Digital & Analog Circuits

Digital & Analog Circuits

PCB
PCB

Figure 10: Placement the Module on a System Board

9.3.1 Antenna Connection and Grounding Plane Design

Matching
Antenna RF_IN
Network
5mm

Figure 11: Leave 5mm Clearance Space from the Antenna

General design recommendations are:

The length of the trace or connection line should be kept as short as possible.
Distance between connection and ground area on the top layer should at least be as large as the dielectric
thickness.
Routing the RF close to digital sections of the system board should be avoided.
To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or
fillets are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree
routing.

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Antenna
Antenna
Antenna

PCB PCB PCB

Wrong Better Best

Figure 12: Recommended Trace Connects Antenna and the Module

Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the
ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance
of this part of the trace cannot be controlled.
Use as many vias as possible to connect the ground planes.

10. PRODUCT PACKAGING INFORMATION

10.1 Default Packing
a, Tray vacuum
b, Tray Dimension: 180mm * 195mm

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Figure 13: Tray vacuum

10.2 Packing box(Optional)

* If require any other packing, must be confirmed with customer

* Package: 1000PCS Per Carton (Min Carton Package)

Figure 14: Packing Box

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11. APPLICATION SCHEMATIC

NOTE: FCC Warning

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01

2.2 List of applicable FCC rules

FCC Part 15.247

2.3 Specific operational use conditions

This transmitter/module and its antenna(s) must not be co-located or operating in conjunction with any transmitter. This
information also extends to the host manufacturer’s instruction manual.

2.4 Limited module procedures

Not applicable

2.5 Trace antenna designs

It is “not applicable” as trace antenna which is not used on the module.

2.6 RF exposure considerations

This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.

2.7 Antennas
PCB Antenna; 2dBi; 2.402 GHz～2.480GHz

2.8 Label and compliance information

The end product must carry a physical label or shall use e-labeling followed KDB784748D01 and KDB 784748
stating “Contains Transmitter Module FCC ID: 2AMWOFSC-BT986”.

2.9 Information on test modes and additional testing requirements

For more information on testing, please contact the manufacturer.

2.10 Additional testing, Part 15 Subpart B disclaimer

The modular transmitter is only FCC authorized for the specific rule parts (FCC Part 15.247) listed on the grant, and
that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not
covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B
compliance testing with the modular transmitter installed when contains digital circuity.

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FCC Statements

(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B
(§15.107 and if applicable §15.109) compliance, the host manufacturer is required to show compliance with 15
while the module is installed and operating.

Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional
emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate
equipment authorization (e.g. Verification) for the new host device per definition in §15.101.

Integrator is reminded to assure that these installation instructions will not be made available to the end-user of
the final host device.

The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating
the FCC ID of the RF Module, such as "Contains FCC ID: 2AMWOFSC-BT986

"This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions:
(1)this device may not cause harmful interference, and
(2)this device must accept any interference received, including interference that may cause undesired
operation."

"Changes or modifications to this unit not expressly approved by the party responsible for compliance could
void the user’s authority to operate the equipment."

The Integrator will be responsible to satisfy SAR/ RF Exposure requirements, when the module integrated into
the host device.

Module statement

The single-modular transmitter is a self-contained, physically delineated, component for which compliance can
be demonstrated independent of the host operating conditions, and which complies with all eight requirements
of § 15.212(a)(1) as summarized below.

1) The radio elements have the radio frequency circuitry shielded.

2) The module has buffered modulation/data inputs to ensure that the device will complywith Part 15
requirements with any type of input signal.
3) The module contains power supply regulation on the module.
4) The module contains a permanently attached antenna.
5) The module demonstrates compliance in a stand-alone configuration.
6) The module is labeled with its permanently affixed FCC ID label.
7) The module complies with all specific rules applicable to the transmitter, including all the conditions provided

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 FSC-BT986 Datasheet

in the integration instructions by the grantee.

8) The module complies with RF exposure requirements.

NOTE: This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to
try to correct the interference by one or more of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.
-Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
-Consult the dealer or an experienced radio/TV technician for help

IC Statements

The final host device, into which this RF Module is integrated" has to be labeled with an auxiliary label stating
the IC of the RF Module, such as" Contains transmitter module IC: 23872-FSCBT986
Le périphériquehôte final, danslequelce module RF estintégré "doitêtreétiqueté avec
uneétiquetteauxiliaireindiquant le CI du module RF, tel que" Contient le module émetteur IC: 23872-FSCBT986

This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and
Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:
(1) This device may not cause interference.
(2) This device must accept any interference, including interference that may cause undesired operation of the
device.

L’émetteur/récepteur exempt de licencecontenudans le présentappareilestconforme aux CNR d’Innovation,

Sciences et Développementéconomique Canada applicables aux appareils radio exempts de licence.
L’exploitationestautorisée aux deux conditions suivantes :

(1) L' appareil ne doit pas produire de brouillage;

(2) L' appareildoit accepter tout brouillageradioélectriquesubi, mêmesi le brouillageest susceptible d'
encompromettre le fonctionnement.

Shenzhen Feasycom Technology Co., Ltd -22- [Link]