IPC CHECKLIST

for Producing Printed Board Assemblies

n
io
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vi
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23
20
 Table of Contents
IPC Offices....................................................................................................................2
Production Cycle...........................................................................................................3
Classification.................................................................................................................4
Producibility Levels........................................................................................................5
Standards Checklist..................................................................................................... 6
IPC Reference Standards..............................................................................................7
IPC Standards — Everything You Need from Start to Finish.........................................15
Phenomena in Cross Section of Plated Through Holes................................................16
CAD Text Standards — Design....................................................................................17
PCB with IPC Standards.............................................................................................18
PCBA with IPC Standards — Soldering and Assembly................................................19
Cleaning and Coating with IPC Standards...................................................................20
Lab — Board/Assembly Quality Check........................................................................21
Notes..........................................................................................................................22
 IPC Offices
IPC HQ Office IPC Europe
3000 Lakeside Drive, 105 N IPC Europe HQ
Bannockburn, IL 60015
Tel: + 1 847-615-7100
IPC Electronics Europe Gmbh
Herzogspitalstrasse 24
[Link]
D-80331 Munich
Germany
IPC Atlanta Office Tel: + 49 151 15518587
333 North Point Center East
[Link]/europe
Suite 260
Alpharetta, GA 30022
Tel: + 1 847-615-7100
[Link] IPC India
IPC India HQ
IPC Washington, D.C. Office Old No. 269, (New No. 35)
1331 Pennsylvania Avenue, NW 2nd floor
Suite 625 South 5th Mani, 4th Block,
Washington, D.C. 20004 Jayanagar, Bangalore, 560011
Tel: + 1 202-661-8090 Tel: + 91 80 26532211
[Link] [Link]/ipc-india

IPC China
IPC China HQ
Room 510
Modern Logistic Building
#448 Hongcao Rd.
Xuhui District
Shanghai, 200233. PRC
Tel: + 86 400 6219 610
[Link]

2
 Production Cycle
MARKET DEMAND

DESIGN
Taking a concept and creating the drawings and
documentation for an electronic product including
stackup, component layout, and routing; Bill of
Materials (BOM), fabrication and assembly notes, and
more. Signal integrity and other simulations typically
also occur during the design phase.
SUPPORTED
BY
IPC STANDARDS
IPC
PRINTED BOARD FABRICATION STANDARDS
Laminates, surface finish, plating process, thermal
stress methodology and engineering documentation
required by drawing

ASSEMBLY
Materials, components and engineering documentation
required by drawing

END PRODUCT

Engineering Documentation Drawings, specifications, technical illustrations and other

documents, prepared and released by the design activity in any form of media, that establish
the design and design requirements.

3
 Classification
IPC Product/Performance Classes
Three general product/performance classes are established to reflect progressive increases in
sophistication, functional performance requirements and testing/inspection frequency. There may be
an overlap of product/performance classes in complex multi-unit electronic systems.

Class 1
General Electronic Products
Includes products suitable for applications where the major requirement is function of the completed
assembly.

Class 2
Dedicated Service Electronic Products
Includes products where continued performance and extended life is required, and for which
uninterrupted service is desired but not critical. Typically, the end-use environment would not cause
failures.

Class 3
High Performance/Harsh Environment Electronic Products
Includes products where continued high performance or performance-on-demand is critical,
equipment downtime cannot be tolerated, end-use environment may be uncommonly harsh, and the
equipment must function when required, such as life support or other critical systems.

The Use of Addendums

An addendum is written to a specific revision of a base document. Addendums are industry segment
specific and are not standalone documents. They must be used with a base document.

4
 Producibility Levels
IPC design standards, including the IPC-2220 series and the IPC-7352, provide design producibility levels of
features, tolerances and measurements within the printed board manufacturing process. These are intended to
reflect increases in the sophistication of tooling and processing and therefore, progressive increases in fabrication
cost.

These levels are:

Level A: General Design Producibility — Preferred
Level B: Moderate Design Producibility — Standard
Level C: High Design Producibility — Reduced

The producibility levels are not to be interpreted as a design requirement but rather as a method of communicating
the degree of difficulty of a feature between the design authority and manufacturing. The use of one level for a
specific feature does not mean that other features must be of the same level, and selection should recognize
precision, performance, pattern density, equipment and assembly/testing requirements. The specific requirement
for any feature shall be as specified in the procurement documentation.

5
 Standards Checklist
Note: The decisions made using this checklist are dependent upon the type of assembly, i.e. rigid,
rigid flex, etc. and the operating environment of the completed product.

(x) Typical Process Steps for a Printed Board Assembly IPC Standard(s)
Select component package IPC-222X, IPC-7352, IPC-7093, IPC-7095
Select surface finish on components IPC J-STD-002
Data transfer and electronic product documentation needs PC-2581, IPC-2610
CAD according to Class 1, 2 or 3 IPC-2221, IPC-2222 and IPC-2223
CAD according to Producibility Level A, B or C IPC-2221, IPC-2222 and IPC-2223
Footprint/land according to Producibility Level A, B or C IPC-7351 and IPC-7352
Printed board internal/external thermal management IPC-2221 and IPC-2152
Design/CAD of QFN IPC-7093
Design/CAD of BGA/CSP IPC-7095
Design/CAD of stencils IPC-7525
Placement of components IPC-222X, IPC-7352, IPC-7093, IPC-7095
Select printed board base material IPC-4101
Select printed board base material Cu foil IPC-4562
Select printed board solder mask IPC-SM-840
IPC-4552, IPC-4553, IPC-4554, IPC-4555
Select printed board surface finish
or IPC-4556
Select printed board handling and storage IPC-1602
Solderability of printed board IPC J-STD-003
IPC-6011, IPC-6012, IPC-6013, IPC-6017
Printed board process requirements at supplier
or IPC-6018
Stencil/printing options IPC-7526 and IPC-7527
Printed board assembly requirements Class 1, 2 or 3 IPC J-STD-001
Printed board assembly acceptability Class 1, 2 or 3 IPC-A-610
Solder paste/bar/wire options IPC J-STD-005 and IPC J-STD-006
Flux with solder paste/bar/wire options IPC J-STD-004
Reflow/vapor phase/wave/selective/hand options IPC-2221
Select soldering environments (O2 free, N2 or Air) IPC-2221, IPC-7525
IPC-2221, IPC-WP-012,
Select Pb or Pb-free process
IPC-WP-014 and IPC/PERM-2901
Select moisture sensitive level (MSL) IPC J-STD-033
Select cleaning method IPC-CH-65, IPC-5702, IPC-5703
Conformal coating IPC-CC-830 and IPC J-STD-001
Printed board assembly rework, modification and repair IPC-7711/21
Printed board assembly requirements/acceptability for electronic enclo-
IPC-A-630
sures
Printed board assembly requirements/acceptability for cable IPC/WHMA-A-620

6
 IPC Reference Standards
IPC’s robust library of standards and guidelines help electronics manufacturers build electronics better. The following
documents are available from [Link].

For a complete list, including obsolete, superseded, retired, and other documents published before 2010, please visit https://
[Link]/ipc-document-revision-table.

Interested in helping develop or create an IPC document? You join a committee for FREE by visiting
[Link] and referencing the committee code below.w

DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

J-STD-001 Requirements for Soldered Electrical and Electronic 5-22a J-STD-001 Task Group Assembly Processes
Assemblies

J-STD-001xA/ Automotive Addendum to IPC J-STD-001 5-22a J-STD-001 Task Group Assembly Processes
A-610xA Requirements for Soldered Electrical and Electronic
Automotive Assemblies and IPC-A-610 Acceptability of
Addendum Electronic Assemblies
J-STD- Space Applications Electronic Hardware Addendum 5-22as Space and Military Assembly Processes
001xS Space for J-STD-001 Electronic Assemblies Task
Hardware Group
Addendum
IPC- Handbook and Guide to the Requirements for 5-22f IPC-HDBK-001 Task Group Assembly Processes
HDBK-001 Soldered Electrical and Electronic Assemblies

J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic B-10a Plastic Chip Carrier Quality, Reliability,
Surface Mount Devices Cracking Task Group Test, & Inspection

IPC/PERM- Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow 8-81f PERM Self-Mitigation of Tin Assembly Processes
WP-022 - Results of an Industry Round-Robin - Final Report by SMT Task Group for Lead-Free and
Tin-Lead
IPC-WP-023 IPC Technology Solutions White Paper on V-TSL Technology Solutions Supply Chain &
Performance-Based Printed Board OEM Committee Business Issues
Acceptance: Via Chain Continuity Reflow Test: The
Hidden Reliability Threat – Weak Microvia Interface
IPC-WP-024 Smart Textiles Reliability Following Laundering D-70 E-Textiles Committee E-Textiles

IPC-WP-025 A Framework for the Engineering and Design of D-70 E-Textiles Committee E-Textiles
E-Textiles

IPC-WP-026 IPC Technology Solutions White Paper on V-TSL Technology Solutions Supply Chain &
Blockchain and the Electronics Industry: A review Committee Business Issues
of the current state of the blockchain technology
and its potential applications in electronics
manufacturing
J-STD-030 Selection and Application of Board Level Underfill 5-24f Underfill Materials Task Assembly Processes
Materials Group

J-STD-033 Handling, Packing, Shipping and Use of Moisture, B-10a Plastic Chip Carrier Quality, Reliability,
Reflow, and Process Sensitive Devices Cracking Task Group Test, & Inspection

J-STD-046 Customer Notification Standard for Product/Process 2-15f Obsolete and Discontinued Supply Chain &
Changes by Electronic Product Suppliers (revision Product Task Group Business Issues
of JESD46D)
J-STD-048 Notification Standard for Product Discontinuance 2-15f Obsolete and Discontinued Supply Chain &
Product Task Group Business Issues

IPC-T-50 Terms and Definitions for Interconnecting and 2-30 Terms and Definitions PCB Fabrication and
Packaging Electronic Circuits Committee Materials

7
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-T-51 Terms and Definitions for Design and Manufacture D-64a Printed Electronics Terms PCB Fabrication and
of Printed Electronics and Definitions Task Group Materials

IPC-CH-65 Guidelines for Cleaning of Printed Boards and 5-31d Cleaning Handbook Task Cleaning/Coating/
Assemblies Group Contamination

IPC-WP-113 Guidance for the Development and Implementation 7-31k & Wire Harness Design Task Quality, Reliability,
of a Red Plague Control Plan (RPCP) 7-31h Group & IPC-HDBK-620 Test, & Inspection
Handbook Task Group
IPC-WP-114 Guidance for the Development and Implementation 7-31k & Wire Harness Design Task Quality, Reliability,
of a White Plague Control Plan (WPCP) 7-31h Group & IPC-HDBK-620 Test, & Inspection
Handbook Task Group
IPC-WP-116 Guidance for the Development and Implementation 7-31k & Wire Harness Design Task Quality, Reliability,
of a Foreign Object Debris (FOD) Control Plan 7-31h Group & IPC-HDBK-620 Test, & Inspection
Handbook Task Group
IPC-FC-234 Pressure Sensitive Adhesive (PSA) Assembly D-13 Flexible Circuits Base Assembly Processes
Guidelines for Flexible, Rigid or Rigid-Flex Printed Materials Subcommittee
Boards
IPC-D-325 Documentation Requirements for Printed Boards, 2-40 Electronic Documentation Design
Assemblies and Support Drawings Technology Committee

IPC-A-600 Acceptability of Printed Boards 7-31a & IPC-A-600 Task Group PCB Fabrication and
D-33a & Rigid Printed Board Materials
Performance Specifications
Task Group
IPC-A-610 Acceptability of Electronic Assemblies 7-31b IPC-A-610 Task Group Assembly Processes

IPC-A-610G-R Rail Transit Addendum to IPC-A-610G Acceptability 7-31br IPC-A-610 Addendum for Assembly Processes
of Electronic Assemblies High Speed Railway Task
Group
IPC-A-610xC IPC-A-610xC Telecom Addendum 7-31bc A-610 Telecom Addendum Assembly Processes
Task Group

IPC-D-620 Design and Critical Process Requirements for Cable 7-31k Wire Harness Design Task Quality, Reliability,
and Wiring Harnesses Group Test, & Inspection

IPC/ Acceptability of Electronic Wire Harnesses and 7-31f IPC WHMA-A-620 Task Design
WHMA-A-620 Cables Group

IPC/ Space Applications Electronic Hardware Addendum 7-31fs IPC WHMA-A-620 Space Design
WHMA-A-620 for IPC/WHMA-A-620. The addendum MUST be and Military Electronic
Space used with the same version of the standard; e.g. Assemblies Addendum
Hardware 620CS with 620C Task Group
Addendum
IPC/WHMA- Rail Transit Addendum to IPC/WHMA-A-620C 7-31fr 7-31FR: IPC WHMA-A-620 Design
A-620CR Addendum for High Speed
Railway Task Group
IPC- Handbook and Guide to IPC-D-620 and 7-31h & IPC-HDBK-620 Handbook Design
HDBK-620 IPC/WHMA-A-620 7-31k Task Group & Wire Harness
Design Task Group
IPC-A-630 Acceptability Standard for Manufacture, Inspection 7-31j Electronic Box Assemblies Assembly Processes
and Testing of Electronic Enclosures Task Group

IPC- Guidelines for Design, Manufacture, Inspection, and 7-31j Electronic Box Assemblies Assembly Processes
HDBK-630 Testing of Electronic Enclosures Task Group

IPC-A-640 Acceptance Requirements for Optical Fiber, Optical 7-31m Fiber Optic Cable Quality, Reliability,
Cable, and Hybrid Wiring Harness Assemblies Acceptability Task Group Test, & Inspection

8
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-D-640 Design and Critical Process Requirements for 7-31m Fiber Optic Cable Design
Optical Fiber, Optical Cable and Hybrid Wiring Acceptability Task Group
Harness Assemblies
IPC-SM-817 General Requirements for Dielectric Surface 5-21k IPC-SM-817 SMT Adhesive Assembly Processes
Mounting Adhesives Task Group

IPC-AJ-820 Assembly and Joining Handbook 7-35 Assembly and Joining Assembly Processes
Handbook Subcommittee

IPC-CC-830 Qualification and Performance of Electrical 5-33a Conformal Coating Task Cleaning/Coating/
Insulating Compound for Printed Wiring Assemblies Group Contamination

IPC- Guidelines for Design, Selection and Application of 5-33c Conformal Coating Cleaning/Coating/
HDBK-830 Conformal Coatings Handbook Task Group Contamination

IPC-SM-840 Qualification and Performance Specification of 5-33b Solder Mask Performance Quality, Reliability,
Permanent Solder Mask and Flexible Cover Task Group Test, & Inspection
Materials
IPC-1401 Corporate Social Responsibility 4-35cn Corporate Social Supply Chain &
Responsibility and Business Issues
Sustainability in the Supply
Chain in China
IPC-1602 Standard for Printed Board Handling and Storage D-35 Printed Board Storage and PCB Fabrication and
Handling Subcommittee Materials

IPC-1751 Generic Requirements for Declaration Process E-31a Generic Requirements Supply Chain &
Management for Declaration Process Business Issues
Management Task Group
IPC-1752 Materials Declaration Management E-31b Materials Declaration Task Supply Chain &
Group Business Issues

IPC-1753 Laboratory Report Standard E-31j Lab Report Task Group Supply Chain &
Business Issues

IPC-1754 Materials and Substances Declaration for E-31k Materials and Substances Supply Chain &
Aerospace and Defense and Other Industries Declaration for the Business Issues
Aerospace, Defense, and
Other Industries
IPC-1755 Conflict Minerals Data Exchange Standard E-31h Conflict Minerals Data Supply Chain &
Exchange Task Group Business Issues

IPC-1756 Manufacturing Process Data Management 2-18a Manufacturing Process Supply Chain &
Declaration Task Group Business Issues

IPC-1758 Declaration Requirements for Shipping, Pack and 2-18 Supplier Declaration Supply Chain &
Packing Materials Subcommittee Business Issues

IPC-1782 Standard for Manufacturing and Supply Chain 2-19a Critical Components Supply Chain &
Traceability of Electronic Products Traceability Task Group Business Issues

IPC-1791 Trusted Electronic Designer, Manufacturer, and 2-19b Trusted Supplier Task Supply Chain &
Assembler Requirements Group Business Issues

IPC-1792 Standard for Cybersecurity Management in the 2-12c Cybersecurity Protection Supply Chain &
Manufacturing Industry Supply Chain Standard Task Group Business Issues

IPC-2221 Generic Standard on Printed Board Design D-31b IPC-2221 2222 Task Group Design

IPC-2222 Sectional Design Standard for Rigid Organic Printed D-31b IPC-2221 2222 Task Group Design
Boards

9
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-2223 Sectional Design Standard for Flexible Printed D-11 Flexible Circuits Design Design
Boards Subcommittee

IPC-2226 Sectional Design Standard for High Density D-31b IPC-2221 2222 Task Group Design
Interconnect (HDI) Printed Boards

IPC-2228 Sectional Design Standard for High Frequency (RF/ D-21 High Speed/High Design
Microwave) Printed Boards Frequency Design
Subcommittee
IPC-2231 DFX Guidelines 1-14 DFX Subcommittee Design

IPC/JPCA- Design Guideline for Printed Electronics D-61 Printed Electronics Design Design
2291 Subcommittee

IPC-2292 Design Standard for Printed Electronics on Flexible D-61 Printed Electronics Design Design
Substrates Subcommittee

IPC-2551 International Standard for Digital Twins 2-12a Generic Requirements for Design
Digital Twin Task Group

IPC/DAC- General Electronic Components Model Based 2-12b Model Based Definition Design
2552 Definition (MBD) Standard (MBD) for Digital Twins Task
Group
IPC-2581 Generic Requirements for Printed Board Assembly 2-16 Digital Product Model Design
Products Manufacturing Description Data and Exchange (DPMX)
Transfer Methodology Subcommittee
IPC-2591 Connected Factory Exchange (CFX) 2-17 Connected Factory Initiative PCB Fabrication and
Subcommittee Materials, Assembly
Processes
IPC-2611 Generic Requirements for Electronic Product 2-40 Electronic Documentation Design
Documentation Technology Committee

IPC-2612 Sectional Requirements for Electronic Diagramming 2-40 Electronic Documentation Design
Documentation (Schematic and Logic Descriptions) Technology Committee

IPC-2612-1 Sectional Requirements for Electronic Diagramming 2-40 Electronic Documentation Design
Symbol Generation Methodology Technology Committee

IPC-2614 Sectional Requirements for Board Fabrication 2-40 Electronic Documentation Design
Documentation Technology Committee

IPC-2615 Printed Board Dimensions and Tolerances 1-10a Dimensioning and Design
Tolerancing Task Group

IPC/PERM- Pb-free Design & Assembly Implementation Guide 8-81D Research Coordination and Assembly Processes
2901 Technical Guidance Task for Lead-Free and
Group Tin-Lead
IPC-4101 Specification for Base Materials for Rigid and 3-11 Laminate Prepreg Materials PCB Fabrication and
Multilayer Printed Boards Subcommittee Materials

IPC-4103 Specification for Base Materials for High Speed/ D-23 High Speed High PCB Fabrication and
High Frequency Applications Frequency Base Materials Materials
Subcommittee
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed D-13 Flexible Circuits Base PCB Fabrication and
Wiring Materials Subcommittee Materials

IPC-4203 Adhesive Coated Dielectric Films for Use as Cover D-13 Flexible Circuits Base PCB Fabrication and
Sheets Materials Subcommittee Materials

10
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-4412 Specification for Finished Fabric Woven form “E” 3-12d Woven Glass PCB Fabrication and
Glass for Printed Boards Reinforcement Task Group Materials

IPC-4552 Specification for Electroless Nickel/Immersion Gold 4-14 Plating Processes PCB Fabrication and
(ENIG) Plating for Printed Circuit Boards Subcommittee Materials

IPC-4554 Specification for Immersion Tin Plating for Printed 4-14 Plating Processes PCB Fabrication and
Circuit Boards Subcommittee Materials

IPC-4555 Performance Specification for High Temperature 4-14e Final Finishes for Printed PCB Fabrication and
Organic Solderability Preservatives (OSP) for Printed Boards - OSP Task Group Materials
Boards
IPC-4556 Specification for Electroless Nickel/Electroless 4-14 Plating Processes PCB Fabrication and
Palladium/Immersion Gold (ENEPIG) Plating for Subcommittee Materials
Printed Circuit Boards
IPC-4562 Metal Foil for Printed Wiring Applications 3-12a Metallic Foil Task Group PCB Fabrication and
Materials

IPC/JPCA- Requirements for Printed Electronics Functional D-63 Printed Electronics PCB Fabrication and
4591 Conductive Materials Functional Materials Materials
Subcommittee
IPC-4592 Requirements for Printed Electronics Functional D-63a Printed Electronics PCB Fabrication and
Dielectric Materials Functional Dielectric Materials
Materials Task Group
IPC- Handbook on Adhesive Bonding in Electronic 5-11c Electronic Assembly PCB Fabrication and
HDBK-4691 Assembly Operations Adhesives Task Group Materials

IPC-4821 Specification for Embedded Passive Device D-52 Embedded Component PCB Fabrication and
Capacitor Materials for Rigid and Multilayer Printed Materials Subcommittee Materials
Boards
IPC-4921 Requirements for Printed Electronics Base Materials D-62 Printed Electronics Base PCB Fabrication and
Materials Substrates Materials
Subcommittee
IPC-5262 Design, Critical Process and Acceptance 5-24g Polymerics Standard Task PCB Fabrication and
Requirements for Polymeric Applications Group Materials

IPC-5703 Cleanliness Guidelines for Printed Board Fabricators 5-32c Bare Board Cleanliness Cleaning/Coating/
Assessment Task Group Contamination

IPC-6012 Qualification and Performance Specification for D-33a Rigid Printed Board PCB Fabrication and
Rigid Printed Boards Performance Specifications Materials
Task Group
IPC-6012xA Automotive Applications Addendum to IPC-6012 D-33aa IPC-6012 Automotive PCB Fabrication and
Qualification and Performance Specification for Addendum Task Group Materials
Rigid Printed Boards
IPC-6012xS Space and Military Applications Addendum to IPC- D-33as IPC-6012 Aerospace PCB Fabrication and
6012 Qualification and Performance Specification Addendum Task Group Materials
for Rigid Printed Boards
IPC-6012xM Medical Applications Addendum to IPC-6012 D-33am IPC-6012 Medical PCB Fabrication and
Qualification and Performance Specification for Addendum Task Group Materials
Rigid Printed Boards
IPC-6013 Qualification and Performance Specification for D-12 Flexible Circuits PCB Fabrication and
Flexible Printed Boards Specifications Materials
Subcommittee

11
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-6013xM Medical Applications Addendum to IPC-6013 D-33am IPC-6012 Medical PCB Fabrication and
Qualification and Performance Specification for Addendum Task Group Materials
Flexible/Rigid-Flexible Printed Electronics. The
addendum MUST be used with the same revision of
the standard.
IPC-6017 Qualification and Performance Specification for D-53 Embedded Devices PCB Fabrication and
Printed Boards Containing Embedded Passive Performance Subcommittee Materials
Devices
IPC-6018 Qualification and Performance Specification for D-22 High Speed High Frequency PCB Fabrication and
High Frequency (Microwave) Printed Boards Board Performance Sub- Materials
committee
IPC-6018xS Space and Military Avionics Applications Addendum D-22 High Speed High Frequency PCB Fabrication and
to IPC-6018, Qualification and Performance Board Performance Sub- Materials
Specification for High Frequency (Microwave) committee
Printed Boards. The addendum MUST be used with
the same revision of the standard.
IPC/JPCA- Application Categories for Printed Electronics D-64a Printed Electronics Terms PCB Fabrication and
6901 and Definitions Task Group Materials

IPC-6902 Qualification and Performance Specification for D-64 Printed Electronics Final Assembly Processes
Printed Electronics on Flexible Substrates Assembly Subcommittee

IPC-6903 Terms and Definitions for the Design and D-64a Printed Electronics Terms PCB Fabrication and
Manufacture of Printed Electronics (Additive and Definitions Task Group Materials
Circuitry)
IPC-7091 Design and Assembly Process Implementation of B-11a 3-D Electronic Packages Design, Assembly
3D Components Subcommittee Processes

IPC-7092 Design and Assembly Process Implementation for D-55 Embedded Devices Quality, Reliability,
Embedded Components Process Implementation Test,
Subcommittee & Inspection
IPC-7093 Design and Assembly Process Implementation for 5-21h Bottom Termination Design, Assembly
Bottom Termination SMT Components Components (BTC) Task Processes
Group
IPC-7094 Design and Assembly Process Implementation for 5-21g Flip Chip Mounting Task Design, Assembly
Flip Chip and Die Size Components Group Processes

IPC-7095 Design and Assembly Process Implementation for 5-21f Ball Grid Array Task Group Design, Assembly
BGAs Processes

IPC-7352 Generic Guideline for Land Pattern Design 1-14 DFX Standards Design
Subcommittee

IPC-7525 Guidelines for Stencil Design 5-21e Solder Stencil Task Group PCB Fabrication and
Materials

IPC-7526 Stencil and Misprinted Board Cleaning Handbook 5-31g Flip Chip Mounting Task Design, Assembly
Group Processes

IPC-7527 Requirements for Solder Paste Printing 5-21jnd Solder Paste Printing Task PCB Fabrication and
Group Materials

IPC-7530 Guidelines for Temperature Profiling for Mass 5-22h Thermal Profiling Guide PCB Fabrication and
Soldering Processes (Wave and Reflow) Task Group Materials

IPC-7535 Solder Dross Reduction in Wave Soldering Process 5-22jcn Solder Dross Reduction Assembly Processes
Chemical Task Group -
China

12
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-7621 Guideline for Design, Material Selection and 5-33g Low Pressure Molding Task Assembly Processes
General Application of Encapsulation of Electronic Group
Circuit Assembly by Low Pressure Molding with
Thermoplastics
IPC-7711/21 Rework, Modification and Repair of Electronic 7-34 Repairability Subcommittee PCB Fabrication and
Assemblies Materials

IPC-7801 Reflow Oven Process Control Standard 5-45 Reflow Oven Process PCB Fabrication and
Control Subcommittee Materials

IPC-8701 Final Acceptance Criteria Standard for PV Modules- E-15 Visual Acceptance Assembly Processes
Final Module Assembly Criteria for Solar Panel-
Final Module Assembly
Subcommittee
IPC-8921 Requirements for Woven and Knitted Electronic D-72 E-Textiles Materials E-Textiles
Textiles (E-Textiles) Integrated with Conductive Subcommittee
Fibers, Conductive Yarns and/or Wires
IPC-8952 Design Standard for Printed Electronics on Coated D-73a E-Textiles Printed E-Textiles
or Treated Textiles and E-Textiles Electronics Design
Standard Task Group
IPC-8971 Requirements for Electrical Testing of Printed D-74a Printed Electronics E-Textiles
Electronics on E-Textiles E-Textiles Electrical Test
Task Group
IPC-9111 Troubleshooting for Printed Board Assembly 7-23 Assembly Process Effects Assembly Processes
Processes Handbook Subcommittee

IPC-9121 Troubleshooting for Printed Board Fabrication 7-24 Printed Board Fabrication PCB Fabrication and
Processes and Assembly Process Materials, Assembly
Effects Subcommittee Processes
IPC-9202 Material and Process Characterization/Qualification 5-32b SIR and Electrochemical Cleaning/Coating/
Test Protocol for Assessing Electrochemical Migration Task Group Contamination
Performance
IPC-9203 Users Guide to IPC-9202 and the IPC-B-52 5-32b SIR and Electrochemical Cleaning/Coating/
Standard Test Vehicle Migration Task Group Contamination

IPC-9241 Guidelines for Microsection Preparation 7-12 Microsection Subcommittee Quality, Reliability,
Test, & Inspection

IPC-9252 Requirements for Electrical Testing of Unpopulated 7-32c Electrical Continuity Testing Quality, Reliability,
Printed Boards Task Group Test, & Inspection

IPC-9262 Specification for Characterization and Verification 7-32cn Automatic Optical Quality, Reliability,
of Assembly Level Automatic Optical Inspection Inspection Characterization Test, & Inspection
Equipment and Verification
Subcommittee`
IPC/ Numerical Analysis Guidelines for Microelectronics 6-10d SMT Attachment Reliability Assembly Processes
JEDEC-9301 Packaging Design and Reliability Test Methods Task Group

IPC-9505 Guideline Methodology for Assessing Component 5-31j Cleaning Compatibility Task Cleaning/Coating/
and Cleaning Materials Compatibility Group Contamination

IPC-9631 User Guide for IPC-TM-650, Method 2.6.27, D-32 Thermal Stress Quality, Reliability,
Thermal Stress, Convection Reflow Assembly Test Methodology Test, & Inspection
Simulation Subcommittee
IPC-9641 High Temperature Printed Board Flatness Guideline 6-11 Printed Board Coplanarity Quality, Reliability,
Subcommittee Test, & Inspection

13
 IPC Reference Standards
DOCUMENT NUMBER DOCUMENT TITLE COMMITTEE CODE COMMITTEE TITLE MEETING FOCUS AREA

IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, 5-32e Conductive Anodic PCB Fabrication and
Conductive Anodic Filament (CAF) Resistance Test Filament (CAF) Task Group Materials
(Electrochemical Migration Testing)
IPC-9701 Qualification and Performance Test Methods for 6-10d SMT Attachment Reliability Assembly Processes
Surface Mount Solder Attachments Test Methods Task Group

IPC/ Monotonic Bend Characterization of Board-Level 6-10d SMT Attachment Reliability Assembly Processes
JEDEC-9702 Interconnects Test Methods Task Group

IPC/ Printed Circuit Assembly Strain Gage Test Guideline 6-10d SMT Attachment Reliability Assembly Processes
JEDEC-9704 Test Methods Task Group

IPC/ Mechanical Shock In-situ Electrical Metrology Test 6-10d SMT Attachment Reliability Assembly Processes
JEDEC-9706 Guidelines for FCBGA SMT Component Solder Test Methods Task Group
Crack and Pad Crater/Trace Crack Detection
IPC/ Spherical Bend Test Method for Characterization of 6-10d SMT Attachment Reliability Assembly Processes
JEDEC-9707 Board Level Interconnects Test Methods Task Group

IPC-9708 Test Methods for Characterization of Printed Board 6-10d SMT Attachment Reliability Assembly Processes
Assembly Pad Cratering Test Methods Task Group

IPC-9709 Test Guidelines for Acoustic Emission Measurement 6-10d SMT Attachment Reliability Assembly Processes
during Mechanical Test Test Methods Task Group

IPC-9797 Press-fit Standard for Automotive Requirements and 5-21m Cold Joining Press-fit Task Assembly Processes
other High-Reliability Applications Group

IPC- Handbook for Press-fit Standard for Automotive 5-21n Cold Joining Press-fit Assembly Processes
HDBK-9798 Requirements and Other High-Reliability Handbook Task Group
Applications
IPC-9850 Surface Mount Equipment Performance 5-41 SMT Component Assembly Processes
Characterization Placement Equipment
Subcommittee
IPC- The Global Standard for Machine-to-Machine Hermes The Hermes Standard PCB Fabrication and
HERMES- Communication in SMT Assembly Initiative Initiative Materials, Assembly
9852 Processes
IPC-TM-650 Test Methods Manual Various Various Quality, Reliability,
Test, & Inspection

IPC-QRG-PTH Through-Hole Solder Joint Evaluation Desk IPC Education Quality, Reliability,
Reference Manual Test, & Inspection

IPC-QRG- Surface Mount Solder Joint Evaluation Desk IPC Education Quality, Reliability,
SMT Reference Manual Test, & Inspection

IPC-DRM- Wire Preparation & Crimping IPC Education Quality, Reliability,

WHA Test, & Inspection

IPC-DRM-18 Component Identification Desk Reference Manual IPC Education Quality, Reliability,
Test, & Inspection

Italicized document titles refer to industry-specific document addendums that must be used with the same
revision of their respective document. For more information on IPC’s library, please contact answers@[Link].

14
IPC Standards — Everything You Need from
Start to Finish IPC STANDARDS —
®
EVERYTHING YOU NEED FROM START TO FINISH

End-Product Advanced
Packaging
IPC J-STD-030
Acceptability Standard for
IPC-7091
Manufacture, Inspection, & Testing of
SMT Reliability IPC-7092
Electronic Enclosures
IPC-9701–IPC-9704 IPC-7093
IPC-A-630, IPC-HDBK-630
IPC-9706–IPC-9709 IPC-7094
IPC-7095
Repair Requirements and Acceptance for
Cable and Wire Harness Assemblies Storage & Handling
IPC-7711/21
IPC/WHMA-A-620, IPC-D-620, IPC-HDBK-620 IPC J-STD-020
Solderability IPC J-STD-033
IPC J-STD-002 IPC J-STD-075
IPC J-STD-003 Acceptability of IPC-1602
Electronic Assemblies
IPC-A-610
Stencil Design
Test Methods
Guidelines
IPC-TM-650
IPC-7525 Requirements for Soldered IPC-9241
IPC-7526 Electronic Assemblies IPC-9631
IPC-7527 IPC J-STD-001, IPC-HDBK-001, IPC-AJ-820 IPC-9691

Assembly Electrical Test

Materials Acceptability of Printed Boards IPC-9252
IPC J-STD-004 IPC-A-600
IPC J-STD-005 Surface Finishes
IPC-HDBK-005 IPC-4552
IPC J-STD-006 Qualifications for Printed Boards
I PC-6011, 6012, 6013, 6017, 6018 IPC-4553
IPC-SM-817 IPC-4554
IPC-CC-830 IPC-4555
HDBK-830 IPC-4556
Base Materials for Printed Boards
HDBK-850
IPC-4101, 4103, 4104, 4202, 4203, & 4204
High Speed/
Solder Mask Frequency
IPC-SM-840
IPC-2141
Design & Land Patterns
IPC-2251
Copper Foils IPC-2221, 2222, 2223, 2226 & 2228 + 7352
IPC-4562 Materials
Declaration
Data Transfer and Electronic
IPC-1751
Product Documentation
IPC-1752
IPC-2581 Series, IPC-2610 Series
IPC-1755
IPC Terms and Definitions
IPC-T-50, IPC-T-51
Learn about IPC standards at [Link]/standards
June 2023

15
 Phenomena in Cross Section of Plated
Through Holes
enomena in Cross Section of Plated Through Ho
C
32
A 6 33
1 20
B
20 Burr Push
34 21 Glass Fib
10 21 22 Innerlaye
7 23 Wicking
ering 2 11 24 Over Plat
22
id 12 25 (Positive)
mination 23 26 Barrel Cr
ng 13 24 36 27 Shadowin
Crack 3 28 Nodule
14 25 29 Resin Sm
cement 26 35 30 Copper &
“Pink Ring” 27 31 Burned P
chback
15
37 32 Copper F
16 38 33 Lifted Lan
Void
8 28 34 Resin Cra
35 Crazing
Void 4 29 37 36 Foreign I
e Void 30 37 Prepreg V
back 9 40 38 Copper C
g 17 39 39 Measling

Phenomena
on of Plated in18Cross
5 Through Holes Section of Plated Throu
ar/Wicking 40 Resin Re
ull Away 41 Glass-We
k 31 42 Glass-We
stering 41 42
19
C Originally Designed b
32 32 Viasystems Momme
33 A 6 33
1 20
20 B
Reviewed by BTT-PT
Atotech Deutschland
A Undercut 20 Burr Pushed Into Hole
B34Outgrowth 21 Glass Fiber Protrusion 34 Updated to Industry
21 C Overhang 22 Innerlayer (Post) Separation 10 21 ©IPC 2010, 3000 Lake

23 Wicking
7 Suite 309 S, Bannoc
Tel. 847 615-7100 •
1 (Resin) Blistering 2Over Plating Resist Void 11
22 24 22 [Link] • e-mai
2 Laminate Void 25 (Positive) Etchback 12
23 3 (Resin) Delamination 26 Barrel Crack
23
24 4 Pad Cratering 36 27 Shadowing 13 24 36
All rights reserved under both
Any copying, scanning or ther
5 Lifted Land Crack 3
25 6 Burr
28 Nodule
14 25 written consent of the copyrig
infringement under the Copyri
29 Resin Smear P-MICRO

26 7 35
Bond Enhancement 30 Copper & Over Plate Void 26 35
removed — “Pink Ring” 27
27 8 Negative Etchback
31 Burned Plating 15
37 32 Copper Foil Contamination 37
9 Foil Crack
3810 Hole Plating Void
33 Lifted Land 16 28 38
28 34 8
Resin Crack Delamination
11 Wedge Void 35 Crazing
29 12 Glass Fiber37Void 436 29 37
Foreign Inclusion
30 13 Glass Bundle Void 37 Prepreg Void 30
14 Severe Etchback 38
9
Copper Clad Laminate Void 40
40 15 Nail Heading39 17 39
39 Measling
16 Drill Wall Tear/Wicking 40 Resin Recession
17 Hole Wall Pull Away 18
41 5
Glass-Weave Texture
31 18 Corner Crack 42 Glass-Weave Exposure
31
19 41
(Copper) Blistering 42 41 42
19
Originally Designed by
Viasystems Mommers BV. Netherlands

Reviewed by BTT-PTH
Atotech Deutschland GmbH. Berlin
16
Updated to Industry Standard Terminology
©IPC 2010, 3000 Lakeside Drive,
Suite 309 S, Bannockburn, IL 60015-1249
 Project Leader Purchasing

Product specification
Electronic Design

Component data CAD

Gerber files on all copper layer

Electronic scheme Gerber files on solder mask CAM

Routing Gerber files on legend print
Drill file & Drill information
Bare Board Specification
Mechanical drawing
Net list
Coordinates for SMD assembly
BOM
Gerber file for solder

17
paste stencil
IPC standard
Footprints
1 IPC-2141
2 IPC-2251 Program for:
3 IPC-2152 • Laser plotter
Component placement • Drilling
4 J-STD-002 • Routing
• AOI
5 IPC-7092 • Electrical test
To Bare Board
6 IPC-7093 Production
7 IPC-7094 IPC standard
8 IPC-7095 1 IPC-2221 IPC-2223
9 J-STD-609 2 IPC-2222 IPC-2226
IPC standard
10 IPC-1752 3 IPC-2152 IPC-2228
1 IPC-2581
CAD Text Standards — Design

11 IPC-2610(15) 4 IPC-7352
5 IPC-7525 IPC-7527
IPC
AM rev 03/17
 IPC-9691 IPC-4562 IPC-4563 IPC-4121
CB Rigid BT
Epoxy Laser
IPC-4101 ? plotter
PTFE Direct imaging Exposure
Laser Exposure
FR4 Fr4 IL DATA from
FR4 Drilling
High Tg BFR Free CAM
FR4 Mylar removal

Developing PTH OUT

Stacking
Chemical
Etch Cu
Plating
Drilling Cu 2-3µm
Waste water & Chemicals treatment Stripping
Lamination

Hole
plugging

Inspect Stripping
Sn resist
El Test Probe El Plating
Pressing Cu 25µm
El Plating
Sn 4-5µm

Stripping
Etch Cu AOI

18
Lay-up &
registration
Optical
with welding of IL
Black- registration
oxide
Scoring
Routing
Inspect Soldermask
Etch & application
Delivery Flux
Legend printing
H2O wash IPC-SM-840
IPC-1602

Exposure

IPC standard 1. HASL SnPb 1-40 µm

2. HASL SnCu 1-40 µm
IPC-6011
IPC-6012 3. ENIG
4. Immersion Ag Developing
IPC-A-600
5. Immersion Sn
PCB with IPC Standards

IPC-SM-840 6. OSP
7. ASIG Cure
J-STD-003
Copyright IPC 8. ENEPIG
PCB Rigid rev 11/17 9. Nano

IPC-4552 IPC-4553 IPC-4554 IPC-4555 IPC-4556

dering and Assembling J-STD-003
IPC-A-600 IPC-2221/2222 IPC-840
IPC-7352 IPC-4552 Selective Soldering
J-STD-075 IPC-4101 IPC-4553
IPC-7525 J-STD-020 IPC-4562 IPC-4554 Control of
J-STD-033 Sn bath
IPC-7526 IPC-6012 IPC-4555 Wave Soldering
IPC-7527 J-STD-002 IPC-1602 IPC-4556
L
Components AOI
TOGE
CINOR
Manual Assy
Unload
J-STD-004 Dryer
IPC-A-620
321
7 654
PCB
00 98
J-STD-005 Reflow
J-STD-006
IPC-2581 Stencil Paste
IPC-7711/21

@ Pick & Place Unload

IPC-7526
Cleaning of stencil IPC-7527
L
Digital Data Screen print

19
L
OGE
ORT
CIN
SPI
321
654
987
00
IPC-7095

Vapor
Phase

X-Ray
Pick & Place
and Assembly

J-STD-002 Repair
Loading of BGA
J-STD-003
Pick & Place
Soldability tester
IPC-A-610 J-STD-001
IPC-7093 J-STD-002
Jet printer
IPC-7095 J-STD-003
IPC-AJ-820 IPC-7711/21 J-STD-004
Loading
IPC-HDBK-001 IPC-A-620 J-STD-005
IPC-HDBK-005 J-STD-006
Copyright IPC IPC-HDBK-830
AST Rigid rev 11/17
PCBA with IPC Standards —Soldering
leaning & Conformal Coating
Conformal Coating Visual Inspection
IPC-6012 IPC-5701 IPC-CC-830
acc to
J-STD-001 IPC-5702 IPC-HDBK-830 IPC-A-610
IPC-AJ-8 20 IPC-5703 Test
IPC-TM-650 IPC-5704 Ionic Contamination

Solvent

Batch cleaning Process Ionic

Alcohol Contamination Testing
(PICT)

Manual

Conformal Coating

Semi aqueous

Batch cleaning
Conformal Coating

20
Batch cleaning
Visual Inspection
acc to
IPC-A-610

Aqueous
IPC Standards

IPC-CH-65 IPC-9201
Inline IPC-8497-1 IPC-9202
J-STD-001 IPC-9203
IPC-HDBK-001
IPC-AJ-820
IPC-TM-650
Cleaning and Coating with

Copyright IPC
IPC-PE-740
Cleaning rev 11/17
IPC-A-610
 SEM = Scanning Electronic Microscope

EDX= Energy-dispersive X-ray spectroscopy Micro Section PCB

oard/Assembly Quality Check
In PTH? Microscopy PCB
Inspection? Micro Section
Analysis &
On SMT pads? Documentation

SF thickness
Solderability test

ENIG, HAL, IM Ag/Sn

SEM/EDX
TMA = Thermal Mechanical Analysis

XRF = X-ray Fluorescense SF composition?

XRF
TG? Micro Section
SF = Surface Finish Checking
Part of
Delamination CTE?
TMA test coupon
288ºC in 10 sec
Part of
Annular ring? test coupon Micro Section
Stress test

Cu defects?
Part of
test coupon Electrical
(SIR) Test
X-ray Surface Isolation
Bow and Twist
Resistance
ROSE

Test coupon

21
PICT: Process Ionic
Contamination Test

Documentation
(IC) Ion
(FTIR) Fourier Transform Chromatography
Infrared Spectroscopy
X-ray

PCB
Plating integrity? Impedance?

Cu layer? High Voltage?

Dielectric layer? Isolation?

Inspection?

Many Labs in Europe are MIT

Copyright IPC
Board/Assembly rev 11/17
PCBA
Quality Check
Lab — Board/Assembly Quality Check
Notes

22
Notes

23
Association Connecting Electronics Industries

3000 Lakeside Drive, Suite 105 N

Bannockburn, IL 60015
847-615-7100 tel
847-615-7105 fax
[Link]