EC3203

Electronic System Design

Department of ECE
NIT Rourkela
 EC3203: Electronic System Design: Syllabus
L-T-P : 2-0-0
Syllabus:
Module 1: Introduction to Electronic System Design
Module 2: Design with Analog and Digital Subsystems
 Definition and classification of electronic systems  Interfacing analog and digital blocks
(analog, digital, mixed-signal, embedded),  Signal conditioning circuits (filters, amplifiers, converters)
 Hierarchical design methodology: Top-down vs. bottom-  Sampling, quantization, and ADC/DAC concepts
up,
 A/D and D/A converter integration and design
 System-level design flow and abstraction levels
(behavioral, RTL, gate level, transistor level), considerations
 Circuit Design Approach: Simulation - behavioral, RTL,  Clock generation and synchronization
gate level, transistor level, AC, DC, Transient, Hardware  Understanding of specification and selection of
- Breadboard, veroboard, PCB, FPGA, components: resistor, capacitor, inductor, ICs: Amplifiers,
 Circuit simulation tools: LTspice, Multisim, Proteus ADCs/DACs, Embedded Hardware, FPGA, Sensors.
 Functional and timing simulation  Types of sensors: temperature, pressure, proximity, IR,
ultrasonic
 Case studies: Simple embedded systems, consumer  Interfacing sensors with microcontrollers
electronics.  Motor drivers and actuators (DC, stepper, servo)
 Syllabus
Module 3: Embedded System Components Module X: Case Studies and Mini Projects (Internal
 Microcontrollers / Microprocessors architecture Assesment)
 Selection of Microcontrollers / Microprocessors  Design of a data acquisition system
 Memory interfacing (EEPROM, Flash, SRAM)  Sensor-based automation system
 Communication Interfaces: UART, SPI, I2C, RS-232, USB,  Power supply unit design
CAN, Bluetooth, Zigbee, Wi-Fi,  Communication interface project (e.g., RS232 to USB
 Serial vs. parallel communication converter)
 Power supply and regulation  Hands-on circuit and PCB design
 Schematic creation and simulation
Module 4: PCB Design and Layout
 Microcontroller-based system design
 Schematic design and simulation tools (e.g.,
 FPGA-based system design
KiCad, Eagle, Altium)
 PCB layout guidelines
o Grounding and decoupling
o Trace routing
o Thermal management
 Fabrication and assembly overview
 Course Outcomes and Descriptions:
CO1: Understand and classify different types of electronic systems and design methodologies.
Students will be able to describe analog, digital, mixed-signal, and embedded systems, and differentiate between hierarchical design
approaches like top-down and bottom-up.

CO2: Design and integrate analog and digital subsystems including ADC/DAC and signal conditioning circuits.
Students will design basic interfacing circuits, implement ADC/DAC integration, and select appropriate analog/digital components and signal
conditioning methods.

CO3: Interface sensors, actuators, and embedded components for specific application-based system design.
Students will interface various sensors and actuators with microcontrollers, considering real-world applications like consumer electronics and
control systems.

CO4: Evaluate and select embedded system components including microcontrollers, memory, and communication interfaces.
Students will analyze architectural differences of microcontrollers/microprocessors, choose appropriate ones for design needs, and integrate
communication protocols.

CO5: Apply PCB design principles to create schematic and layout designs.
Students will be able to design printed circuit boards ensuring proper grounding, trace routing, and thermal considerations for reliable system
performance.
Module 1: Introduction to Electronic System Design

• Definition and classification of electronic systems (analog, digital, mixed-signal, embedded),

• Hierarchical design methodology: Top-down vs. bottom-up,

• System-level design flow and abstraction levels (behavioral, RTL, gate level, transistor level),

• Circuit Design Approach: Simulation - behavioral, RTL, gate level, transistor level, AC, DC, Transient, Hardware -

Breadboard, veroboard, PCB, ASIC, FPGA

• Circuit simulation tools: LTspice, Multisim, Proteus

• Functional and timing simulation

• Case studies: Simple embedded systems, consumer electronics.

Introduction to Electronic System Design
Overview of Electronic Systems
An Electronic System is a physical interconnection of
components, or parts, that gathers various amounts of
information together

• Definition and classification: Analog, Digital,

Mixed-Signal, Embedded
• Real-world examples (Consumer Electronics,
Automotive, Industrial Process, Medical
System, IoT)
• Evolution of systems: from discrete
components to SoCs
Open Loop Vs Closed Loop System

Electric Clothes Dryer Motor Controller Circuit

Example of Electronic Systems

Digital Multimeter Block Diagram

Overview of Electronic Systems
•Definition and classification: Analog, Digital, Mixed-Signal, Embedded
• Analog Systems:
These systems operate on continuous signals. They process information represented by varying voltage or current levels.
Common examples include amplifiers, analog radio receivers.
• Digital Systems:
Digital systems work with discrete binary signals (0s and 1s). They are widely used in computing and control applications.
Examples include microcontrollers, digital clocks, and digital communication devices.
• Mixed-Signal Systems:
These systems incorporate both analog and digital components. For instance, analog signals from sensors might be converted to
digital form for processing and then converted back. Examples include data acquisition systems and modern audio processing
circuits.
• Embedded Systems:
These are specialized electronic systems designed for dedicated functions, often within a larger system. They typically include
analog, digital, microcontroller or processor along with memory, I/O interfaces, and software. Examples include automotive
control systems, home appliances, and medical devices.
Give example
• Analog Intelligent System
• Digital Intelligent System
• Mixed-signal Intelligent System
• Embedded Intelligent System
Overview of Electronic Systems: Analog Intelligent system
• Mixer/Grinder: Analog Washing Machine:

• A mechanical timer, a motor, various valves and pumps to control the washing
process.
• Electromechanical control systems.
• Timers, cams or gears , switches, and relays Built control logic

Timer:
• Electric Iron
• A mechanical timer, often a rotating dial, would control the sequence of events
in a wash cycle. It would turn on the motor for agitation, activate the water inlet
valve, control the spin cycle, and shut off the machine at the end.

• Attached cams or gears triggered switches at specific times to control each stage
(wash, rinse, spin).
Overview of Electronic Systems: Digital Intelligent system
• Simple calculators: Used only logic gates for their arithmetic operations and displays.
• Digital clocks: Rely on counters and decoders, which are examples of combinational circuits, to keep and display
time.
• Remote controls for appliances: Simple IR remote controls often use encoder ICs (integrated circuits) to convert
button presses into unique digital signals. These signals are then decoded by the receiving device to control
functions.
• Light-sensing night lights: Light-Dependent Resistor (LDR) and a logic circuit to switch a light on or off depending
on ambient light levels.
• Logic-controlled fan: Automatically switches on when a person is present using sensors like IR LEDs and
photodiodes along with a 555 timer IC
Overview of Electronic Systems Mixed-Signal Intelligent system

• Real-world examples (Consumer electronics, Industrial process automotive, IoT)

• Basic washing machines:

• Utilize electromechanical timers (analog/digital) and water level sensors to
control washing cycles and water fill levels without a complex microcontroller.
Overview of Electronic Systems: Embedded Intelligent system
• Present day Washing machines:

NXP’s Washing Machine Block

Diagram
Milecki, Andrzej, and Roman Regulski. "Washing Machine Controller with a New Programming Method" Acta Mechanica et Automatica, vol. 11, no. 4, Sciendo, 2017, pp. 328-
332. [Link] [Link]
Overview of Electronic Systems: Embedded Intelligent system

Present day Washing machines:

ST-Microelectronics
[Link]
e-and-professional-appliances/washing-
[Link]#overview
 Hierarchical Decomposition
Node 0
(System Architecture) I/O equations

Sub-system level Behavioral Model

Node 1,1 Node 1,2 … Node 1,n
Macro-model
… Block level

Node 2,1,1 Node 2,1,2 … Node 2,1,m … Node 1,2 …

W/L Value, Bias,

… R-C Parameter
…

Cell level

Node N,…,1,1 … Node N,…,1,p … Node 2,1,m … Node 1,2 …

Number of levels depends on the complexity of the

Leaf Node “System Architecture”
At any level of abstraction, realization of building blocks need not be at the same level.
Hierarchical decomposition of Pipeline-ADC
 Hierarchical decomposition of Pipeline-ADC
System level
Pipeline ADC

Sub-system level

MDAC

Block
level
MDAC

Cell
level
Device
level
Sub-ADC
 Top-Down Design Model
• In the top-down model, an overview of the system is formulated without going into detail for any part
of it. Each part of it then refined into more details, defining it in yet more details until the entire
specification is detailed enough to validate the model.
• The Top-Down approach works by:
 Breaking the problem into major components,
 Refining each component into smaller subcomponents
 We Continue this process until every part is simple enough to implement.

• This approach is particularly useful for solving complex problems.

• Advantages of the Top-Down Design Model
 Simplifies Complex Problems: Breaking problems into smaller parts help us to identify what needs to be done.
 Easy to Identify Requirements: Each step of refinement, new parts will become less complex and so easy to solve.
 Promotes Reusability: Parts of the solution may turn out to be reusable.
 Collaboration-Friendly: Breaking problems into parts allows more than one person to solve the problem.

[Link]
 Top-Down Design Model
1. Top-down approach
 Starts with: Defining the overall system functionality and architecture at a high level.
 Breaks down into: Smaller, more detailed components and subsystems.
 Focus: Overall system requirements and functionality.

Example: Designing a digital signal processing (DSP) system

1. Define System Specifications: Start by outlining the required functionalities like sampling
rate, filtering characteristics (passband, stopband, attenuation), and dynamic signal range.
2. Architectural Design: Design the overall system architecture, including major components
such as analog-to-digital converters (ADCs), digital signal processors, memory, and
communication interfaces.
3. Detailed Design: Focus on the design of individual components, for example, a digital filter.
This involves determining the transfer function, selecting a suitable algorithm, and then
breaking down the filter into smaller functional blocks like adders, multipliers, and delay
elements.
4. Implementation: Implement each functional block at a lower level, e.g., using logic gates or
transistors.
5. Verification and Testing: Verify each component's functionality and then test the integrated
system to ensure it meets the initial specifications.
Bottom-Up Design Model
• Bottom-Up Design Model is started by defining the system's individual parts first. Once the
individual components are detailed, they are integrated into larger modules. This process is
continued till the system is fully integrated.
• Bottom-Up approach works by:
 Identifying and specifying the smaller components (or objects).
 Linking these smaller parts together to form larger components.
 Continuously integrating them to complete the system.

• Advantages of the Bottom-Up Design Model

 Reusability of Low-Level Components: Decisions about reusable low-level utilities are made early in the
design.
 Focused Problem-Solving: Developers can focus on solving smaller and more isolated problems first.
 Increased Modularity: The modular approach makes it easier to update individual components without
affecting the entire system.

[Link]
 Bottom-UP Design Model
2. Bottom-up approach
 Starts with: Designing and testing the smallest, fundamental components.
 Builds up into: Larger and more complex subsystems and ultimately the complete system.
 Focus: Modularity, reusability, and efficient implementation of individual blocks.

Example: Designing a digital counter

1. Design Basic Building Blocks: Start with the design of elementary logic gates (AND, OR, NOT)
and flip-flops (D flip-flop) using transistors or other fundamental components.
2. Create Intermediate Modules: Combine these basic blocks to form larger modules, such as
T flip-flops, which can then be used to create counters.
3. Integrate and Construct: Use the T flip-flops to build a 4-bit ripple carry counter by
connecting them in a cascade fashion.
4. Testing and Refinement: Test the individual components (flip-flops) and modules (counter)
to ensure they function correctly and meet the required specifications before integrating them
into the final design.
 Hybrid Approach
3. Hybrid approach

In many real-world designs, especially for complex systems, a hybrid approach combining
elements of both top-down and bottom-up design is employed. For instance, a system might
be initially conceptualized and partitioned using a top-down approach, while the
implementation and integration of individual modules might follow a bottom-up
methodology.
Top-Down Design & Bottom-Up Design

# Top-Down Approach Bottom-Up Approach

1. Problem is broken down into smaller parts. So, The smaller problems are solved. Composition
decomposition approach is used here. approach is used here.
2. It is generally used with documentation of module It is generally used in testing modules.
and debugging code.
3. It does not require communication between It requires relatively more communication
modules. between modules.
4. It contains redundant information. It does not contain redundant information.
5. The implementation depends on the programming Data encapsulation and data hiding is
language and platform. implemented in this approach.
6. Performance of system design can be check at Performance of system design can be check only
every level after all the blocks have been design
It is generally used with object oriented
7. It is generally used by structured programming
languages such as C, COBOL, FORTRAN, etc. programming paradigm such as C++, Java,
Python, etc.
Multiple abstraction of Building Blocks
Behavioral Level of a Full Added RTL Level of a Full Added
RTL (Register Transfer Level) design describes how data is
transferred and processed within the circuit, typically using
registers and combinational logic.

library ieee;
use ieee.std_logic_1164.all;
entity full_adder is
port (
a_in : in std_logic;
b_in : in std_logic;
c_in : in std_logic;
sum_out : out std_logic;
carry_out : out std_logic);
end entity;

architecture rtl of full_adder is

begin
sum_out <= a_in xor b_in xor c_in;
carry_out <= (a_in and b_in) or (a_in and c_in) or (b_in and c_in);
end architecture;
Multiple abstraction of Building Blocks
Gate Level of a Full Added Transistor level of a Full Adder

2 input AND

3 input XOR

3 input OR gate
 Multiple abstraction of Building Blocks
Multiple abstraction helps for fast verification of the system performance to check the
design concept, functionality, and integrity….

Trade-off of simulation
time and accuracy of
performance prediction
Analog Circuit Design: DC, AC, Transient
•DC Analysis (Bias Conditions): This determines the circuit's operating point in the steady state, essentially what
happens when you turn it on without any signal input.
• It helps set the proper bias conditions for active components like transistors, ensuring they operate in the
desired region (e.g., active region for amplifiers).
• This analysis establishes foundation for further AC and transient analyses by defining the quiescent state of
the circuit.

•AC Analysis (Small Signal Analysis): Once the DC operating point is established, AC analysis evaluates the
circuit's response to small, well-behaved AC signals.
• It provides crucial information like voltage gain, input and output impedance, and frequency response, which
are essential for applications like amplifiers and filters.
• AC analysis linearizes circuit around the DC operating point, simplifying the analysis of frequency-
dependent behavior.

•Transient Analysis: This analysis investigates the circuit's behavior over time, particularly its response to sudden
changes, switching events, or non-ideal signals.
• It helps determine the circuit's stability, settling time, overshoot, and other time-domain characteristics,
which are vital for ensuring proper operation under dynamic conditions.
• Transient analysis helps identify potential issues like oscillations or ringing, allowing for optimization and
troubleshooting before physical implementation
Analog Circuit Design: DC, AC, Transient
Necessity and relationships
• The DC operating point determined by the DC analysis is a crucial prerequisite for accurate AC and transient
analyses.
• AC analysis utilizes the linearized small-signal models of devices derived from the DC operating point to study
frequency-dependent characteristics.
• Transient analysis often uses the DC operating point as the initial condition for simulating the circuit's response
to time-varying signals.

Example: Amplifier design

• DC Analysis: Setting the bias conditions for the transistors to operate in the active region to amplify the input
signal.
• AC Analysis: Determining the amplifier's gain, bandwidth, input/output impedance, and frequency response.
• Transient Analysis: Evaluating the amplifier's response to varying input signals, ensuring stability, minimizing
distortion, and avoiding issues like slew limiting.
Hardware - Breadboard, veroboard, PCB, ASIC and FPGA

Veroboard

Breadboard

PCB

XILINX Zynq-7000 SoC FPGA Development ASIC

Board XC7Z020 XC7Z020
Hardware - Breadboard, veroboard, PCB, ASIC and FPGA
• Breadboard: Limitations: Not suitable for high-frequency or high-current applications due to parasitic capacitance and
relatively unreliable connections. Not designed for surface-mount technology (SMT) components.

• Veroboard: Applications: Suitable for simple circuits, testing before full PCB fabrication, and creating functional prototypes
that require more durability than breadboard prototypes. Often used by hobbyists and for low-volume production.
• Limitations: Lacks the complexity and routing options of custom PCBs. Requires manual soldering. Not ideal for high-frequency
applications or surface-mount components.

• Printed circuit board (PCB)

• A PCB is a fundamental component of modern electronics, providing a platform for assembling and connecting electronic
components to create functional circuits. They direct electrical signals through a network of copper pathways.
• Applications: All electronic devices, from simple like digital clocks to complex systems like computers and smartphones.
• Manufacturing Process: Involves several steps, including design, film generation, printing, etching, lamination, drilling, plating,
solder mask application, surface finish, silkscreen, and electrical testing.
• Advantages over Breadboards/Veroboards: Offer greater reliability, better signal integrity (especially at high frequencies), more
compact designs, and are suitable for mass production.
Hardware - Breadboard, veroboard, PCB, ASIC and FPGA
ASIC (Application-Specific Integrated Circuit): ASICs are custom-designed for a specific application with fixed
functionality once manufactured.

Advantages:
• Performance: Optimized for speed, power, and efficiency, achieving higher clock frequencies and lower latencies.
• Power Consumption: Generally consume less power.
• Size and Cost (at Scale): Offer excellent space optimization and lower unit costs in high-volume production.
• Security: Can be designed with enhanced security features.

Disadvantages:
• High Initial Cost: Significant Non-Recurring Engineering (NRE) costs.
• Long Development Cycle: Complex and time-consuming design process.
• No Flexibility: Cannot be modified or reprogrammed after fabrication.

Applications:
ASICs are ideal for high-volume production and applications requiring optimal performance and fixed functionality,
such as consumer electronics, data centers, cryptocurrency mining, automotive, and telecommunications.
Hardware - Breadboard, veroboard, PCB, ASIC and FPGA
FPGA (Field Programmable Gate Array): FPGAs are reconfigurable integrated circuits that can be programmed after
manufacturing using configurable logic blocks and programmable interconnects.

Advantages:
• Flexibility & Re-programmability: Reprogrammed multiple times for prototyping and applications requiring updates.
• Faster Time-to-Market: Shorter development process than ASICs.
• Lower Initial Cost: More cost-effective for small production runs.
• Parallel Processing: Excel in hardware-level parallelism for applications like image processing and AI.

Disadvantages:
• Lower Performance (compared to ASIC): Do not match ASIC performance due to programmable nature overhead.
• Higher Power Consumption: Typically consume more power.
• Higher Unit Cost (at Scale): Individual units are more expensive in large quantities.
• Limited Analog Capabilities: Performance in analog functions may not match specialized ASICs.

Applications:
FPGAs are suited for applications where flexibility, rapid prototyping, and adaptability are critical, including ASIC prototyping,
AI/Machine Learning, Aerospace and Defense, embedded systems, and telecommunications.
Deciding between ASIC and FPGA

Factor FPGA ASIC

Flexibility High (reprogrammable) Low (fixed functionality)

Performance Moderate (lower than ASIC) High (optimized)

Power Consumption Higher than ASIC Optimized for low power

Time-to-Market Faster Longer

Initial Cost (NRE) Lower Higher

Unit Cost (in Volume) Higher Lower

Ideal Production Volume Low to medium High
Circuit simulation tools: LTspice, Multisim, Proteus
• LTspice: Free and powerful SPICE simulator: Developed by Analog Devices (formerly Linear Technology),
LTspice is widely used for analog and mixed-signal circuit design, analysis, and optimization.

• Key Features:
• Fast and accurate simulation engine.
• Includes schematic capture and waveform viewer.
• Supports various analyses like transient, AC, DC, noise, and Monte Carlo.
• Extensive component library, particularly strong in Analog Devices' power ICs.
• Strengths: Speed, accuracy, free access, strong community support, especially for power electronics applications.

• Weaknesses: Can have a steeper learning curve, less focus on digital simulations, and the user interface might
appear less modern compared to other options.
Circuit simulation tools: LTspice, Multisim, Proteus
• Multisim: Intuitive and comprehensive simulation software: Developed by National Instruments, Multisim is
favored for educational settings and professional circuit design.

• Key Features:
• User-friendly interface with virtual instruments (oscilloscopes, multimeters, function generators).
• Large component library including both standard and industry-specific models.
• Supports various analyses including transient, AC, DC, and mixed-mode simulations (analog and digital).
• Integration with LabVIEW and NI hardware for seamless prototyping and testing.
• Features for PCB layout and 3D visualization.

• Strengths: Easy to use, excellent for learning, strong educational features, good for mixed-signal designs.
• Weaknesses: Not suitable for CMOS level circuit. May require paid licenses, depending on the edition.
Circuit simulation tools: LTspice, Multisim, Proteus
• Proteus: Integrated design environment (IDE) for embedded systems: Proteus Virtual System Modelling (VSM)
combines mixed-mode SPICE simulation with microcontroller simulation.

• Key Features:
• Co-simulation of hardware and firmware, allowing users to test microcontroller code alongside the circuit.
• Supports a wide range of microcontrollers (PIC, AVR, ARM Cortex, Arduino).
• Extensive component libraries and virtual instruments.
• Features for PCB layout design, including automatic routing, design rule checks (DRC), and 3D visualization.
• Debugging facilities, including breakpoints, single stepping, and variable display.

• Strengths: Excellent for embedded systems design, strong microcontroller simulation capabilities, integrated PCB
layout tools.
• Weaknesses: Can encounter errors for large circuits, may have a steeper learning curve for beginners.
Circuit simulation tools: LTspice, Multisim, Proteus
•TINA-TI: Developed by Texas Instruments (TI), this free version of the TINA Design Suite is optimized for TI components and widely used for power and signal processing
applications. It integrates with the TI ecosystem of products, which is valuable for users of TI components.
•QUCS (Quite Universal Circuit Simulator): An open-source circuit simulator that handles analog, digital, and mixed-signal simulations. It provides a graphical user interface and
supports various analysis types like transient, AC, and DC.
•Ngspice: An open-source mixed-level/mixed-signal circuit simulator. It is the successor to the original Berkeley SPICE simulator. Ngspice functions as a backend simulator for
other EDA tools like KiCad and EAGLE.

Online/Web-Based
•EasyEDA: A cloud-based circuit simulation and PCB design tool, making it easy to access and share projects. EasyEDA is free for personal use and offers features like mixed-
mode simulation, schematic capture, and PCB layout design.
•CircuitLab: Another online simulator. It provides a graphical interface, supports both analog and digital simulations, and offers educational resources.
•Tinkercad Circuits: A web-app from Autodesk focused on beginners and tinkerers. It allows designing and simulating circuits with basic components like motors and LEDs, ideal
for use with Arduino microcontrollers.

PCB design software with simulation capabilities

•Altium Designer: A professional PCB design software with integrated simulation capabilities including SPICE simulation.
•Autodesk EAGLE: Includes built-in User Language Programs (ULP) for automating tasks and features like auto-routing, along with SPICE simulation.
•KiCad: An open-source PCB design tool that includes a basic circuit simulator. It's widely used for open-source hardware design.

Specialized
•SIMPLIS/SIMetrix: Focused on power electronics, providing fast and accurate simulations for power supplies and related circuits.
•Simulink (with MATLAB): Ideal for control systems and signal processing applications. Requires a MATLAB license to operate.
•PSIM: Specializes in power electronics and systems with a user-friendly interface and features like power loss analysis. It's faster than SPICE-based simulators due to its use of
ideal switches.
•Xyce: An open-source, SPICE-compatible simulator known for its high-performance, particularly for large circuits and parallel computing.
Functional and timing simulation
• Functional simulation focuses on the logical correctness of the circuit, while timing simulation verifies the circuit's behavior
considering the actual delays of components and wiring.
Functional Simulation:
• Purpose: Verifies the logical behavior of the circuit, ensuring it produces the correct outputs for a given set of inputs,
regardless of timing considerations.
• Focus: Logic gates, Boolean expressions, and the overall functionality of the circuit.
• Timing: Assumes zero or negligible delays for all components and connections.
• Speed: Generally faster than timing simulation because it doesn't involve complex timing calculations.
• Example: A functional simulation might confirm that a circuit correctly adds two numbers based on the expected logic,
without considering how long it takes for the result to appear.

Timing Simulation:
• Purpose: Verifies the circuit's behavior considering the actual delays of logic gates, interconnects, and other components.
• Focus: Accurate timing analysis, including gate delays, clock frequencies, and potential timing violations like setup and hold
time issues.
• Timing: Includes detailed timing information, such as propagation delays, setup times, and hold times.
• Speed: Slower than functional simulation due to the computational complexity of timing analysis.
• Example: After place and route, when the physical implementation of the circuit is known, to ensure that the circuit meets
timing requirements.
 Submit Case Studies in System Design (mini project)
• Case Study 1: Temperature Logger System (Embedded + Analog Sensor)
• Case Study 2: Consumer Product – IR Remote-based Fan Control
• Case Study 3: Signal Generator with Display (FPGA + DAC)
• Case Study 4: Self power electronics (low-power / moderate power)
• Case Study 5: Sensor Networks
• Case Study 6: Digital filter using STM32 / ESP32
• Case Study 7: Vibration monitoring system
• Etc

Deliverables:
• Introduction
• Specification / Features
• Block diagram + flowchart
• Hardware + Software
• Cost of the system
• Simulation + Test bench (if possible)
• Prototype (if possible)
• Report submission