OPA596DBVR
Quality, reliability & packaging data download
Status: ACTIVE
Report date: 10/08/2025
Assembly site: TI Semiconductor
RoHS
REACH
Device marking
Lead finish/Ball material
MSL rating/Peak reflow
Rating
1 OPA596DBVR - 08 OCTOBER 2025
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2025 Texas Instruments Incorporated
[Link]
Material content
Homogeneous Material Level Component Level
Component Substance CAS Number Amount (mg) Percentage % ppm Percentage % ppm
Bond Wire
Die Attach Adhesive
Lead Frame
Lead Frame Plating
Mold Compound
Semiconductor Device
OPA596DBVR - 08 OCTOBER 2025 2
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2025 Texas Instruments Incorporated
[Link]
MTBF/FIT estimates
MTBF / FIT MTBF / FIT supporting data
MTBF FIT Usage temp (°C) Conf level (%) Activation energy Test temp (°C) Test duration (hours) Sample size Fails Additional comments
(eV)
Qualification summary
Stress Reference Min lot qty SS / lot Condition Duration Result Notes
Ongoing reliability monitoring
FAB process reliability data
Fab Process Reliability Test Rolling Year (4Q2024 - 3Q2025) Sample Size Cumulative Sample Size Disposition
Assembly process reliability data
Package Reliability Test Rolling Year (4Q2024 - 3Q2025) Sample Cumulative Sample Disposition
Family Size Size
3 OPA596DBVR - 08 OCTOBER 2025
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2025 Texas Instruments Incorporated
[Link]
Additional resources
General quality guidelines
Certifications
Conflict minerals specialized disclosure report
Restricted chemical test report
For additional component information, please visit Material content search
For additional information, please contact TI customer support center
OPA596DBVR - 08 OCTOBER 2025 4
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2025 Texas Instruments Incorporated