AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Description
The AP60N02BD uses advanced trench technology
to provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 2.5V. This
device is suitable for use as a Battery protection
or in other Switching application.
General Features
VDS=20V ID=60A
RDS(ON) < 6.5mΩ @ VGS=4.5V (Type:4.8mΩ)
Application
Battery protection
Load switch
Uninterruptible power supply
Package Marking and Ordering Information
Product ID Pack Marking Qty(PCS)
AP60N02BD TO-252-3L AP60N02BD XXX YYYY 2500
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Symbol Parameter Max. Units
VDSS Drain-Source Voltage 20 V
VGSS Gate-Source Voltage ±12 V
ID@TA=25℃ Continuous Drain Current, VGS @ 4.5V 60 A
ID@TA=70℃ Continuous Drain Current, VGS @ 4.5V 39 A
IDM Pulsed Drain Current note1 200 A
EAS Single Pulsed Avalanche Energy note2 47.6 mJ
PD@TA=25℃ Power Dissipation 37 W
RθJC Thermal Resistance, Junction to Case 4 ℃/W
TJ, TSTG Operating and Storage Temperature Range -55 to +175 ℃
1
AP60N02BD RVE1.0 永源微電子科技有限公司
AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Electrical Characteristics (TC=25℃, unless otherwise noted)
Symbol Parameter Test Condition Min. Typ. Max. Units
V(BR)DSS Drain-Source Breakdown Voltage VGS=0V, ID=250μA 20 24 - V
IDSS Zero Gate Voltage Drain Current VDS=20V, VGS=0V, - - 1.0 μA
IGSS Gate to Body Leakage Current VDS=0V, VGS=±12V - - ±100 nA
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250μA 0.5 0.7 1.2 V
VGS=4.5V, ID=30A - 4.8 6.5
RDS(on) Static Drain-Source on-Resistance note3 mΩ
VGS=2.5V, ID=20A - 8.2 10
Ciss Input Capacitance - 1832 - pF
VDS=10V, VGS=0V,
Coss Output Capacitance - 289 - pF
f = 1.0MHz
Crss Reverse Transfer Capacitance - 271 - pF
Qg Total Gate Charge - 23 - nC
VDS=10V, ID=30A,
Qgs Gate-Source Charge - 4.5 - nC
VGS=4.5V
Qgd Gate-Drain(“Miller”) Charge - 7.3 - nC
td(on) Turn-on Delay Time - 15 - ns
VDS=10V,
tr Turn-on Rise Time - 37 - ns
ID=30A, RGEN=3Ω,
td(off) Turn-off Delay Time - 52 - ns
VGS =4.5V
tf Turn-off Fall Time - 21 - ns
IS Maximum Continuous Drain to Source Diode Forward Current - - 60 A
ISM Maximum Pulsed Drain to Source Diode Forward Current - - 210 A
VSD Drain to Source Diode Forward Voltage VGS = 0V, IS=25A - - 1.2 V
Notes:
1、Repetitive Rating: Pulse Width Limited by Maximum Junction Temperature
2、The test condition is, VDD=10V, VG=4.5V, L=0.5mH, RG=25Ω, IAS=13.8A
3、The data tested by pulsed Pulse Test: Pulse Width≤300μs, Duty Cycle≤0.5%
4、The power dissipation is limited by 150℃ junction temperature 2
AP60N02BD RVE1.0 永源微電子科技有限公司
AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Typical Characteristics
Figure1: Output Characteristics Figure 2: Typical Transfer Characteristics
Figure 3:On-resistance vs. Drain Current Figure 4: Body Diode Characteristics
Figure 5: Gate Charge Characteristics Figure 6: Capacitance Characteristics
3
AP60N02BD RVE1.0 永源微電子科技有限公司
AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Figure 7: Normalized Breakdown Voltage vs. Figure 8: Normalized on Resistance vs
Junction Temperature Junction Temperature
Figure 9: Maximum Safe Operating Area Figure 10: Maximum Continuous Drain
Current vs. Case
Temperature
Figure.11: Maximum Effective
Transient Thermal Impedance, Junction-to-Case
4
AP60N02BD RVE1.0 永源微電子科技有限公司
AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Package Mechanical Data:TO-252-3L
E A Dimensions
B2 Ref. Millimeters Inches
C2
V1
Min. Typ. Max. Min. Typ. Max.
L
A 2.10 2.50 0.083 0.098
A2 0 0.10 0 0.004
B 0.66 0.86 0.026 0.034
D
H
B2 5.18 5.48 0.202 0.216
C 0.40 0.60 0.016 0.024
C2 0.44 0.58 0.017 0.023
D 5.90 6.30 0.232 0.248
B C D1 5.30REF 0.209REF
G E 6.40 6.80 0.252 0.268
DETAIL A
E1 4.63 0.182
V1 G 4.47 4.67 0.176 0.184
H 9.50 10.70 0.374 0.421
D1
V2
L 1.09 1.21 0.043 0.048
V1 L2 1.35 1.65 0.053 0.065
A2
E1 V1 7° 7°
L2 V2 0° 6° 0° 6°
DETAIL A
TO-252
Reel Spectification-TO-252
B
D
0 P0 P2 Dimensions
T
Ref. Millimeters Inches
E
t1
Min. Typ. Max. Min. Typ. Max.
F
A A W 15.90 16.00 16.10 0.626 0.630 0.634
W
B0
E 1.65 1.75 1.85 0.065 0.069 0.073
D1
F 7.40 7.50 7.60 0.291 0.295 0.299
P1 K0
A0 D0 1.40 1.50 1.60 0.055 0.059 0.063
B B B
D1 1.40 1.50 1.60 0.055 0.059 0.063
5°
20 P0 3.90 4.00 4.10 0.154 0.157 0.161
A A
29
P1 7.90 8.00 8.10 0.311 0.315 0.319
Φ3
P2 1.90 2.00 2.10 0.075 0.079 0.083
A0 6.85 6.90 7.00 0.270 0.271 0.276
Φ13 B0 10.45 10.50 10.60 0.411 0.413 0.417
K0 2.68 2.78 2.88 0.105 0.109 0.113
T 0.24 0.27 0.009 0.011
t1 0.10 0.004
10P0 39.80 40.00 40.20 1.567 1.575 1.583
5
AP60N02BD RVE1.0 永源微電子科技有限公司
AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Attention
1,Any and all APM Microelectronics products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in
serious physical and/or material damage. Consult with your APM Microelectronics representative nearest
you before using any APM Microelectronics products described or contained herein in such applications.
2,APM Microelectronics assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all APM Microelectronics
products described or contained herein.
3, Specifications of any and all APM Microelectronics products described or contained here instipulate the
performance, characteristics, and functions of the described products in the independent state, and are
not guarantees of the performance, characteristics, and functions of the described products as mounted
in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an
independent device, the customer should always evaluate and test devices mounted in the customer’s
products or equipment.
4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products.
However, any and all semiconductor products fail with some probability. It is possible that these
probabilistic failures could give rise to accidents or events that could endanger human lives that could
give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment,
adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include
but are not limited to protective circuits and error prevention circuits for safe design, redundant
design,and structural design.
5,In the event that any or all APM Microelectronics products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from the authorities concerned in
accordance with the above law.
6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or
otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD.
7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not
guaranteed for volume production. APM Microelectronics believes information herein is accurate and
reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual
property rights or other rights of third parties.
8, Any and all information described or contained herein are subject to change without notice due to
product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for
the APM Microelectronics product that you Intend to use.
6
AP60N02BD RVE1.0 永源微電子科技有限公司
AP60N02BD
20V N-Channel Enhancement Mode MOSFET
Edition Date Change
Rve1.0 2021/7/28 Initial release
Copyright Attribution“APM-Microelectronice”
AP60N02BD RVE1.0 永源微電子科技有限公司