800V N-Channel MOSFET Specifications
800V N-Channel MOSFET Specifications
January 2009
TM
QFET
FQP8N80C/FQPF8N80C/FQPF8N80CYDTU
800V N-Channel MOSFET
D
!
◀ ▲
G! ●
●
TO-220 GD S
TO-220F
G DS
FQP Series FQPF Series !
S
Thermal Characteristics
Symbol Parameter FQP8N80C FQPF8N80C Units
RθJC Thermal Resistance, Junction-to-Case 0.7 2.1 °C/W
RθJS Thermal Resistance, Case-to-Sink Typ. 0.5 -- °C/W
RθJA Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 800 -- -- V
∆BVDSS Breakdown Voltage Temperature
ID = 250 µA, Referenced to 25°C -- 0.5 -- V/°C
/ ∆TJ Coefficient
IDSS VDS = 800 V, VGS = 0 V -- -- 10 µA
Zero Gate Voltage Drain Current
VDS = 640 V, TC = 125°C -- -- 100 µA
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 3.0 -- 5.0 V
RDS(on) Static Drain-Source
VGS = 10 V, ID = 4 A -- 1.29 1.55 Ω
On-Resistance
gFS Forward Transconductance VDS = 50 V, ID = 4 A (Note 4) -- 5.6 -- S
Dynamic Characteristics
Ciss Input Capacitance VDS = 25 V, VGS = 0 V, -- 1580 2050 pF
Coss Output Capacitance f = 1.0 MHz -- 135 175 pF
Crss Reverse Transfer Capacitance -- 13 17 pF
Switching Characteristics
td(on) Turn-On Delay Time -- 40 90 ns
VDD = 400 V, ID = 8 A,
tr Turn-On Rise Time -- 110 230 ns
RG = 25 Ω
td(off) Turn-Off Delay Time -- 65 140 ns
(Note 4, 5)
tf Turn-Off Fall Time -- 70 150 ns
Qg Total Gate Charge VDS = 640 V, ID = 8 A, -- 35 45 nC
Qgs Gate-Source Charge VGS = 10 V -- 10 -- nC
Qgd Gate-Drain Charge (Note 4, 5) -- 14 -- nC
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 25mH, IAS = 8A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 8A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
VGS
Top : 15.0 V
10.0 V
1
8.0 V
10 7.0 V 1
10
6.5 V
6.0 V
Bottom : 5.5 V o
150 C
ID, Drain Current [A]
※ Notes :
1. 250μ s Pulse Test ※ Notes :
10
-1 2. TC = 25℃ 1. VDS = 50V
2. 250μ s Pulse Test
-1
10
10
-1
10
0
10
1
2 4 6 8 10
3.0
1
10
2.5
Drain-Source On-Resistance
VGS = 10V
RDS(ON) [Ω ],
0
10
1.0 10
-1
2500 12
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd VDS = 160V
Crss = Cgd
10 VDS = 400V
2000 Ciss
VDS = 640V
VGS, Gate-Source Voltage [V]
8
1500
Capacitance [pF]
Coss 6
1000
※ Notes :
1. VGS = 0 V 4
2. f = 1 MHz
500 Crss
2
※ Note : ID = 8A
0 0
10
-1
10
0
10
1 0 10 20 30 40
1.2 3.0
2.5
Drain-Source Breakdown Voltage
1.1
Drain-Source On-Resistance
BV DSS , (Normalized)
RDS(ON) , (Normalized)
2.0
1.0 1.5
1.0
0.9 ※ Notes :
1. VGS = 0 V ※ Notes :
2. ID = 250 μ A 0.5 1. VGS = 10 V
2. ID = 4.0 A
0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o
TJ, Junction Temperature [ C]
o
TJ, Junction Temperature [ C]
1
100 µs 100 µs
1
10 10
1 ms 1 ms
ID, Drain Current [A]
ID, Drain Current [A]
10 ms 10 ms
DC
0 0
10 10 DC
-1 ※ Notes : 10
-1 ※ Notes :
10 o o
1. TC = 25 C 1. TC = 25 C
o o
2. TJ = 150 C 2. TJ = 150 C
3. Single Pulse 3. Single Pulse
-2 -2
10 10
0 1 2 3 0 1 2 3
10 10 10 10 10 10 10 10
Figure 9-1. Maximum Safe Operating Area Figure 9-2. Maximum Safe Operating Area
for FQP8N80C for FQPF8N80C
10
8
ID, Drain Current [A]
0
25 50 75 100 125 150
TC, Case Temperature [℃]
0
10
(t), T h e r m a l R e s p o n s e D = 0 .5
0 .2
※ N o te s :
-1 1 . Z θ J C ( t) = 0 .7 ℃ /W M a x .
10
0 .1 2 . D u t y F a c t o r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C ( t)
0 .0 5
0 .0 2
θ JC
0 .0 1
s in g le p u l s e
Z
-2
10
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
10
0 D = 0 .5
0 .2 ※ N o te s :
1 . Z θ J C (t) = 2 .1 ℃ /W M a x .
2 . D u ty F a c to r, D = t 1 /t 2
0 .1 3 . T J M - T C = P D M * Z θ J C (t)
-1 0 .0 5
10
0 .0 2
0 .0 1
θ JC
Z
-2 s in g le p u ls e
10
-5 -4 -3 -2 -1 0 1
10 10 10 10 10 10 10
t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ]
DUT +
V DS
I SD
L
D r iv e r
R G
S am e T ype
as DUT V DD
V G S • d v / d t c o n t r o lle d b y R G
• I S D c o n t r o lle d b y p u ls e p e r io d
G a t e P u ls e W id th
V GS D = --------------------------
G a te P u ls e P e r io d 10V
( D r iv e r )
I F M , B o d y D io d e F o r w a r d C u r r e n t
I SD
( DUT ) d i/ d t
IR M
B o d y D io d e R e v e r s e C u r r e n t
V DS
( DUT ) B o d y D io d e R e c o v e r y d v / d t
V SD
V DD
B o d y D io d e
F o r w a r d V o lt a g e D r o p
DUT +
V DS
I SD
L
D r iv e r
R G
S am e T ype
as DUT V DD
V G S • d v / d t c o n t r o lle d b y R G
• I S D c o n t r o lle d b y p u ls e p e r io d
G a t e P u ls e W id th
V GS D = --------------------------
G a te P u ls e P e r io d 10V
( D r iv e r )
I F M , B o d y D io d e F o r w a r d C u r r e n t
I SD
( DUT ) d i/ d t
IR M
B o d y D io d e R e v e r s e C u r r e n t
V DS
( DUT ) B o d y D io d e R e c o v e r y d v / d t
V SD
V DD
B o d y D io d e
F o r w a r d V o lt a g e D r o p
TO-220
9.90 ±0.20 4.50 ±0.20
1.30 ±0.10
(8.70)
2.80 ±0.10
(1.70)
+0.10
ø3.60 ±0.10 1.30 –0.05
18.95MAX.
(3.70)
15.90 ±0.20
9.20 ±0.20
(1.46)
(3.00)
(45°
)
(1.00)
13.08 ±0.20
10.08 ±0.30
10.00 ±0.20
Dimensions in Millimeters
TO-220F
3.30 ±0.10
(7.00) (0.70)
6.68 ±0.20
15.87 ±0.20
15.80 ±0.20
(1.00x45°)
MAX1.47
9.75 ±0.30
0.80 ±0.10
(3
0°
)
#1
0.35 ±0.10 +0.10
0.50 –0.05 2.76 ±0.20
2.54TYP 2.54TYP
[2.54 ±0.20] [2.54 ±0.20]
4.70 ±0.20
9.40 ±0.20
Dimensions in Millimeters
PDP SPM™ ®
FlashWriter® *
FPS™ Power-SPM™
PowerTrench® The Power Franchise®
F-PFS™
PowerXS™
* EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor.
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