VinMin = 14.

0V Device = LM5177DCPR
VinMax = 22.0V Topology = Buck_Boost
Vout = 14.0V Created = 2025-03-28 06:24:31.302
Iout = 20.0A BOM Cost = NA
® BOM Count = 35
WEBENCH Design Report Total Pd = 3.25W

Design : 3 LM5177DCPR
LM5177DCPR 14V-22V to 14.00V @ 20A

_HDRV1_1M1 _HDRV2_1M3
VdsMax= 25.0 V VdsMax= 25.0 V
IdsMax= 44.0 Am ps
Qt y= 2 IdsMax= 5.0 Am ps

Rent
75.0 kOhm Rfbt
63.0 m W 73.2 kOhm
63.0 m W
_RCS_1 Rsns _CSG_1 L1
1.0 m Ohm 7.359 µH
Vin 2.0 W 1.0 m Ohm _SW2_1
_SW1_1 Iout
Cinx Cin
10.0 µF 120.0 µF
1.0 m Ohm 18.0 m Ohm Cout Cout x
Qt y= 3 56.0 µF 664.05 µF
30.0 m Ohm 1.0 µOhm
Rfbb
Renb _LDRV1_1M2 _LDRV2_1M4 5.62 kOhm
VdsMax= 30.0 V VdsMax= 30.0 V 63.0 m W
549.0 Ohm IdsMax= 100.0 Am ps IdsMax= 200.0 Am ps
63.0 m W Qt y= 2

Cvcc
22.0 µF
1.0 m Ohm

Cbias Rdiff1
100.0 nF 10.0 Ohm
280.0 m Ohm 100.0 m W
LM 5 1 7 7 D CP
U1 VIN VOUT

VCC FB Cdiff _RCS_2

220.0 pF
Rdiff2
BIAS
ISNSP 10.0 Ohm _SW1_2
EN_UVLO ISNSN 100.0 m W _CSG_2
CSA
MODE CSB
_HDRV1_2 Cboot 1 _SW2_2
SYNC
HO1 100.0 nF
NU SW1 1.0 m Ohm
NU HB1
LO1

FLT_N Cboot 2
HO2 100.0 nF
IMONOUT SW2 _LDRV1_2 _HDRV2_2 1.0 m Ohm
HB2
LO2
DTRK

COMP NC
NC
SS_ATRK NC _LDRV2_2
NC
NC
CFG NC

SLOPE AGND
PAD
RT PGND

Rim on Ccom p Ccom p2 Css Rcfg

2.52 kOhm 33.0 nF 680.0 pF 8.2 nF 8.25 kOhm
125.0 m W 1.0 m Ohm 3.078 Ohm 1.0 m Ohm 63.0 m W

Rslope Rt
365.0 kOhm 118.0 kOhm
125.0 m W 63.0 m W
Cim on Rcom p
33.0 nF 5.36 kOhm
1.0 m Ohm 63.0 m W

Electrical BOM
Name Manufacturer Part Number Properties Qty Price Footprint

Cbias AVX 08053C104KAT2A Cap= 100.0 nF 1 $0.01

Series= X7R ESR= 280.0 mOhm 0805 7 mm
2

VDC= 25.0 V
IRMS= 0.0 A
Cboot1 Taiyo Yuden EMK107B7104KA-T Cap= 100.0 nF 1 $0.01
Series= X7R ESR= 1.0 mOhm 0603 5 mm
2

VDC= 16.0 V
IRMS= 0.0 A
Cboot2 Taiyo Yuden EMK107B7104KA-T Cap= 100.0 nF 1 $0.01
Series= X7R ESR= 1.0 mOhm 0603 5 mm
2

VDC= 16.0 V
IRMS= 0.0 A
Ccomp MuRata GRM155R61C333KA01D Cap= 33.0 nF 1 $0.01
Series= X5R ESR= 1.0 mOhm 0402 3 mm
2

VDC= 16.0 V
IRMS= 0.0 A
Ccomp2 TDK CGA2B2X7R1H681K050BA Cap= 680.0 pF 1 $0.01
Series= X7R ESR= 3.0778 Ohm 0402 3 mm
2

VDC= 50.0 V
IRMS= 257.63 mA
Cdiff Samsung Electro- CL21C221JBANNNC Cap= 220.0 pF 1 $0.01
Mechanics Series= C0G/NP0 VDC= 50.0 V 0805 7 mm
2

IRMS= 0.0 A
Cimon MuRata GRM155R61C333KA01D Cap= 33.0 nF 1 $0.01
Series= X5R ESR= 1.0 mOhm 0402 3 mm
2

VDC= 16.0 V
IRMS= 0.0 A

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WEBENCH Design

Name Manufacturer Part Number Properties Qty Price Footprint

Cin Panasonic 35SVPF120M Cap= 120.0 uF 3 $1.33

Series= SVPF ESR= 18.0 mOhm
VDC= 35.0 V
IRMS= 4.4 A
2
CAPSMT_62_F12 151 mm
Cinx TDK C3225X7R1H106M250AC Cap= 10.0 uF 1 $0.27
Series= X7R ESR= 1.0 mOhm 1210 15 mm
2

VDC= 50.0 V
IRMS= 5.0 A
Cout Panasonic 20SVPF56MX Cap= 56.0 uF 1 $0.47
Series= SVPF ESR= 30.0 mOhm
VDC= 20.0 V 2
IRMS= 2.8 A CAPSMT_62_E61 53 mm

Coutx CUSTOM CUSTOM Cap= 664.05 uF 1 NA

Series= ? ESR= 1.0 uOhm CUSTOM 0 mm
2

VDC= 21.0 V
IRMS= 2.6031 A
Css MuRata GRM155R71E822KA01D Cap= 8.2 nF 1 $0.01
Series= X7R ESR= 1.0 mOhm 0402 3 mm
2

VDC= 25.0 V
IRMS= 0.0 A
Cvcc MuRata GRM188R60J226MEA0D Cap= 22.0 uF 1 $0.04
Series= X5R ESR= 1.0 mOhm 0603 5 mm
2

VDC= 6.3 V
IRMS= 6.0 A
L1 CUSTOM CUSTOM L= 7.359 µH 1 NA
1.0 mOhm CUSTOM 0 mm
2

M1 Texas Instruments CSD16327Q3 VdsMax= 25.0 V 2 $0.32

IdsMax= 44.0 Amps
2
DQG0008A 18 mm
M2 Texas Instruments CSD17573Q5B VdsMax= 30.0 V 1 $0.48
IdsMax= 100.0 Amps
2
DNK0008A 56 mm
M3 Texas Instruments CSD16301Q2 VdsMax= 25.0 V 1 $0.11
IdsMax= 5.0 Amps DQK0006C 9 mm
2

M4 Texas Instruments CSD17573Q5B VdsMax= 30.0 V 2 $0.48

IdsMax= 200.0 Amps
2
DNK0008A 56 mm
Rcfg Vishay-Dale CRCW04028K25FKED Res= 8.25 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rcomp Vishay-Dale CRCW04025K36FKED Res= 5.36 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rdiff1 Vishay-Dale CRCW060310R0FKEA Res= 10.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 100.0 mW 0603 5 mm
2

Tolerance= 1.0%
Rdiff2 Vishay-Dale CRCW060310R0FKEA Res= 10.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 100.0 mW 0603 5 mm
2

Tolerance= 1.0%
Renb Vishay-Dale CRCW0402549RFKED Res= 549.0 Ohm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rent Vishay-Dale CRCW040275K0FKED Res= 75.0 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rfbb Vishay-Dale CRCW04025K62FKED Res= 5.62 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
Rfbt Vishay-Dale CRCW040273K2FKED Res= 73.2 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%

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WEBENCH Design

Name Manufacturer Part Number Properties Qty Price Footprint

Rimon Yageo RT0805BRD072K52L Res= 2.52 kOhm 1 NA

Series= RT0805 Power= 125.0 mW 0805 7 mm
2

Tolerance= 0.1%
Rslope Vishay-Dale CRCW0805365KFKEA Res= 365.0 kOhm 1 $0.01
Series= CRCW..e3 Power= 125.0 mW 0805 7 mm
2

Tolerance= 1.0%
Rsns Susumu Co Ltd RL3264SW4-001M-F-T5 Res= 1.0 mOhm 1 $0.80
Series= RL Power= 2.0 W
2
Tolerance= 1.0% 2512 43 mm

Rt Vishay-Dale CRCW0402118KFKED Res= 118.0 kOhm 1 $0.01

Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2

Tolerance= 1.0%
U1 Texas Instruments LM5177DCPR Switcher 1 $2.80

2
DCP0038A 75 mm

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WEBENCH Design Report LM5177DCPR : LM5177DCPR 14V-22V to 14.00V @ 20A March 28, 2025 06:24:49 GMT-05:00
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WEBENCH Design

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WEBENCH Design Report LM5177DCPR : LM5177DCPR 14V-22V to 14.00V @ 20A March 28, 2025 06:24:49 GMT-05:00
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WEBENCH Design

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WEBENCH Design Report LM5177DCPR : LM5177DCPR 14V-22V to 14.00V @ 20A March 28, 2025 06:24:49 GMT-05:00
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WEBENCH Design

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WEBENCH Design

Operating Values
# Name Value Category Description
1. Cin IRMS 13.93 mA Capacitor Input capacitor RMS ripple current
2. Cin Pd 1.164 µW Capacitor Input capacitor power dissipation
3. Cout IRMS 60.041 mA Capacitor Output capacitor RMS ripple current
4. Cout Pd 108.15 µW Capacitor Output capacitor power dissipation
5. Coutx IRMS 2.048 A Capacitor Output capacitor_x RMS ripple current
6. Coutx Pd 4.193 µW Capacitor Output capacitor_x power loss
7. IC Ipk 20.175 A IC Peak switch current in IC
8. IC Pd 349.69 mW IC IC power dissipation
9. IC Tj 41.75 degC IC IC junction temperature
10. IC Tolerance 10.0 mV IC IC Feedback Tolerance
11. ICThetaJA 33.6 degC/W IC IC junction-to-ambient thermal resistance
12. Iin Avg 20.232 A IC Average input current
13. L Ipp 52.224 mA Inductor Peak-to-peak inductor ripple current
14. L Pd 408.93 mW Inductor Inductor power dissipation
15. M1 Pd 1.279 W Mosfet M1 MOSFET total power dissipation
16. M1 Tj 65.171 degC Mosfet M1 MOSFET junction temperature
17. M2 Pd 0.0 W Mosfet M2 MOSFET total power dissipation
18. M2 Tj 0.0 degC Mosfet M2 MOSFET junction temperature
19. M3 Pd 333.81 mW Mosfet M1 MOSFET total power dissipation
20. M3 Tj 51.698 degC Mosfet M1 MOSFET junction temperature
21. M4 Pd 471.77 mW Mosfet M2 MOSFET total power dissipation
22. M4 Tj 41.794 degC Mosfet M2 MOSFET junction temperature
23. Cin Pd 1.164 µW Power Input capacitor power dissipation
24. Cout Pd 108.15 µW Power Output capacitor power dissipation
25. Coutx Pd 4.193 µW Power Output capacitor_x power loss
26. IC Pd 349.69 mW Power IC power dissipation
27. L Pd 408.93 mW Power Inductor power dissipation
28. M1 Pd 1.279 W Power M1 MOSFET total power dissipation
29. M2 Pd 0.0 W Power M2 MOSFET total power dissipation
30. M3 Pd 333.81 mW Power M1 MOSFET total power dissipation
31. M4 Pd 471.77 mW Power M2 MOSFET total power dissipation
32. Total Pd 3.246 W Power Total Power Dissipation

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WEBENCH Design

# Name Value Category Description

33. BOM Count 35 System Total Design BOM count
Information
34. Cross Freq 8.436 kHz System Bode plot crossover frequency
Information
35. Duty Cycle 1.098 % System Duty cycle
Information
36. Efficiency 98.854 % System Steady state efficiency
Information
37. FootPrint 1.782 k mm
2
System Total Foot Print Area of BOM components
Information
38. Frequency 255.468 kHz System Switching frequency
Information
39. Gain Marg -20.361 dB System Bode Plot Gain Margin
Information
40. Iout 20.0 A System Iout operating point
Information
41. Low Freq Gain 86.174 dB System Gain at 1Hz
Information
42. Mode CCM System Conduction Mode
Information
43. Phase Marg 69.079 deg System Bode Plot Phase Margin
Information
44. Pout 280.0 W System Total output power
Information
45. Total BOM NA System Total BOM Cost
Information
46. Vin 14.0 V System Vin operating point
Information
47. Vout 14.0 V System Operational Output Voltage
Information
48. Vout Actual 14.025 V System Vout Actual calculated based on selected voltage divider resistors
Information
49. Vout Tolerance 2.895 % System Vout Tolerance based on IC Tolerance (no load) and voltage divider
Information resistors if applicable
50. Vout p-p 47.594 µV System Peak-to-peak output ripple voltage
Information

Design Inputs
Name Value Description
Iout 20.0 Maximum Output Current
VinMax 22.0 Maximum input voltage
VinMin 14.0 Minimum input voltage
VinTyp 14.0 Typical input voltage
Vout 14.0 Output Voltage
base_pn LM5177 Base Product Number
source DC Input Source Type
Ta 30.0 Ambient temperature

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WEBENCH Assembly

Component Testing
Some published data on components in datasheets such as Capacitor ESR and Inductor DC resistance is based on conservative values that
will guarantee that the components always exceed the specification. For design purposes it is usually better to work with typical values. Since
this data is not always available it is a good practice to measure the Capacitance and ESR values of Cin and Cout, and the inductance and DC
resistance of L1 before assembly of the board. Any large discrepancies in values should be electrically simulated in WEBENCH to check for
instabilities and thermally simulated in WebTHERM to make sure critical temperatures are not exceeded.

Soldering Component to Board

If board assembly is done in house it is best to tack down one terminal of a component on the board then solder the other terminal. For surface
mount parts with large tabs, such as the DPAK, the tab on the back of the package should be pre-tinned with solder, then tacked into place
by one of the pins. To solder the tab town to the board place the iron down on the board while resting against the tab, heating both surfaces
simultaneously. Apply light pressure to the top of the plastic case until the solder flows around the part and the part is flush with the PCB. If the
solder is not flowing around the board you may need a higher wattage iron (generally 25W to 30W is enough).

Initial Startup of Circuit

It is best to initially power up the board by setting the input supply voltage to the lowest operating input voltage 14.0V and set the input supply's
current limit to zero. With the input supply off connect up the input supply to Vin and GND. Connect a digital volt meter and a load if needed
to set the minimum Iout of the design from Vout and GND. Turn on the input supply and slowly turn up the current limit on the input supply.
If the voltage starts to rise on the input supply continue increasing the input supply current limit while watching the output voltage. If the
current increases on the input supply, but the voltage remains near zero, then there may be a short or a component misplaced on the board.
Power down the board and visually inspect for solder bridges and recheck the diode and capacitor polarities. Once the power supply circuit is
operational then more extensive testing may include full load testing, transient load and line tests to compare with simulation results.

Load Testing
The setup is the same as the initial startup, except that an additional digital voltmeter is connected between Vin and GND, a load is connected
between Vout and GND and a current meter is connected in series between Vout and the load. The load must be able to handle at least rated
output power + 50% ( 7.5 watts for this design). Ideally the load is supplied in the form of a variable load test unit. It can also be done in the
form of suitably large power resistors. When using an oscilloscope to measure waveforms on the prototype board, the ground leads of the
oscilloscope probes should be as short as possible and the area of the loop formed by the ground lead should be kept to a minimum. This will
help reduce ground lead inductance and eliminate EMI noise that is not actually present in the circuit.

Design Assistance
1. Master key : 0DFEF5CAA4CB1208CCE6AEA8D156A7B3[v1]
2. LM5177 Product Folder : [Link] : contains the data sheet and other resources.

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