100% Material Declaration Data Sheet for Ultrascale+ &

PK924(v1.0) October 10, 2017

Component Substance Description CAS # or Description % of component Use in product Component weight / Component % of total
substance weight ( in
grams)
0.724022 4.588%
Silicon die
Silicon 7440-21-3 100.00 basis 0.724022
0.031395 0.199%
Bump Tin 7440-31-5 98.20 basis 0.030830
Silver 7440-22-4 1.80 basis 0.000565
0.085500 0.542%
Bisphenol F type liquid 9003-36-5 15.00 basis 0.012825
1,6-Bis(2,3- 27610-48-6 10.00 basis 0.008550
Bisphenol A type liquid 25068-38-6 5.00 basis 0.004275
Underfill
Amine type hardener trade secret 10.00 basis 0.008550
Silicon dioxide 60676-86-0 58.00 filler 0.049590
Carbon black 1333-86-4 1.00 color agent 0.000855
Additives trade secret 1.00 additives 0.000855
0.012704 0.081%
Tin 7440-31-5 82.70 metal 0.010506
Solder paste Silver 7440-22-4 2.70 metal 0.000343
Copper 7440-50-8 1.55 metal 0.000197
Additives trade secret 13.05 flux 0.001658
0.001200 0.008%
BaTiO3 type 1304-28-5 30.22 Ceramic 0.000363
Titanium dioxide 13463-67-7 15.11 0.000181
Misc - 5.04 0.000060
Nickel 7440-02-0 33.44 Inner electrode 0.000401
Capacitor 1
Copper 7440-50-8 11.87 Out electrode 0.000142
Silicon dioxide 7631-86-9 1.06 0.000013
diboron trioxide; boric 1303-86-2 0.26 0.000003
NIckel 7440-02-0 0.81 Plating1 0.000010
Tin 7440-31-5 2.19 Plating2 0.000026
0.000920 0.006%
BaTiO3 type 12047-27-7 61.70 Ceramic 0.000568
Nickel 7440-02-0 4.89 Inner Electrode 0.000045
Capacitor 2 Indium tin oxide 50926-11-9 18.30 Outer Electrode 0.000168
Copper 7440-50-8 13.40 Outer Electrode 0.000123
Nickel 7440-02-0 0.49 Plating1 0.000005
Tin 7440-31-5 1.22 Plating2 0.000011
6.710000 42.522%
Heat sink Copper 7440-50-8 98.35 Main material 6.599285
Nickel 7440-02-0 1.65 Main material 0.110715
0.223000 1.413%
Aluminium Oxide Al2O3 - 80.00 Main material 0.178400
Heat sink adhesive
Dimethyl siloxane,
68083-19-2 20.00 Main material 0.044600
dimethylvinyl-terminated
1.267250 8.031%
Tin 7440-31-5 96.50 Main material 1.222896
Solder ball
Silver 7440-22-4 3.00 Main material 0.038018
Copper 7440-50-8 0.50 Main material 0.006336
6.724009 42.611%
Copper 7440-50-8 42.22 2.838877
Tin 7440-31-5 0.44 0.029586
Substrate Silver 7440-22-4 0.01 0.000672
Core N/A 38.59 2.594795
ABF N/A 17.36 1.167288
Solder Mask N/A 1.38 0.092791

Revision History

Date Version Description of Revisions

10/10/2017 1.0 Initial Xilinx Release.

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