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Multichip Production Process Overview

The document outlines the multichip production process, detailing steps such as wafer testing, mounting, dicing, die bonding, plasma cleaning, wire bonding, and quality control. It also describes molding, X-ray control, dambar cutting, electroplating, trim and form, final testing, and finishing. Each step includes specific techniques and materials used to ensure the quality and functionality of the semiconductor components.

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carlosgabriel.jimenez
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3 views2 pages

Multichip Production Process Overview

The document outlines the multichip production process, detailing steps such as wafer testing, mounting, dicing, die bonding, plasma cleaning, wire bonding, and quality control. It also describes molding, X-ray control, dambar cutting, electroplating, trim and form, final testing, and finishing. Each step includes specific techniques and materials used to ensure the quality and functionality of the semiconductor components.

Uploaded by

carlosgabriel.jimenez
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

MULTICHIP PRODUCTION

● Wafer Test
- This are supplied in dust type
- Undergoes a lot of testing (parametric testing with test structures),500 tests in
less than 3 seconds
- Wafer Fab - conductivity(aluminum contact opening of 100 micrometers) of the
semiconductor(130 needles-probe)
● Wafer Mounting
- Wafers should be divided into individual dice
- Mounted in a metal frame with the aid of an adhesive film (fiber) that is 70
micrometers thick
- The adhesive film (fiber) is used to ensure that the dice remain in their original
position
● Dicing
- Cut using saw blades made up of diamonds that is 30 micrometers wide, 30000
rotation per minute
- Deionized water is used to cool and remove the silicon dust
● Die Bonding (Substrate)
- Imaging system and any positioning errors are corrected
- The remaining dice (small printed circuit board) are bonded onto copper strips
with an epoxy
- Lead Frames - printed circuit boards ( where copper strips are attached)
- filled with silver particles for 45 minutes in a furnace at 145 degree
celsius.
● Die Bonding ( Controller, flash Memory)
- Diced wafer and memory chip are now bonded onto the lead frames
● Plasma Cleaning
- After hardening the silver conducting adhesive on the furnace, the plasma
cleaning takes place
- Removes any organic contamination on the contact surfaces of the dice
● Wire Bonding
- The aluminum contact surface, or bonding pad, on the dice and the fingers of the
copper lead frame - achieved through a thin gold wire that is 25 micrometers
thick
- Welded by fully automatic wire bonders (capillary) at 200 degree celsius with
pressure and ultrasonic energy
● Quality Control
- Mechanical pull test
- Keep individual parameters within the specification limits on the basis of the
control charts
● Molding
- To protect the wire connections from mechanical damage and to prevent the
silicon dice from corroding, molded with a plastic compound ( a thermoset,80%
ultra fine glass particles) under high pressure and a temperature of 175 degree
Celsius
● X-ray Control
- Shadow image is seen to confirm that the components doesn’t change its
position
● Dambar Cutting
- The dambar cuts the copper lead frame via stamping process
● Electroplating
- Ensures that the finished components can be further processed by the customer
without problems
● Trim and Form
- Trimmed to the right length and given their final shape, after placed in transport
trays
● Final Test
- Full check; -45 degree to 95 degree celsius (minimum and maximum
temperature)
● Finishing (Marking,scanning, tape and reel)
- Marked its type,date of manufacture,batch number (lote) using a laser beam
- Putting its precise identification

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