FCP190N60E N-Channel MOSFET Specs
FCP190N60E N-Channel MOSFET Specs
March 2013
FCP190N60E / FCPF190N60E
N-Channel SuperFET® II MOSFET
600 V, 20.6 A, 190 mΩ
Features Description
® ®
• 650 V @TJ = 150°C SuperFET II MOSFET is Fairchild Semiconductor ’s first gen-
eration of high voltage super-junction (SJ) MOSFET family that is
• Max. RDS(on) = 190 mΩ
utilizing charge balance technology for outstanding low on-resis-
• Ultra Low Gate Charge (Typ. Qg = 63 nC) tance and lower gate charge [Link] advanced tech-
nology is tailored to minimize conduction loss, provide superior
• Low Effective Output Capacitance (Typ. [Link] = 178 pF)
switching performance, and withstand extreme dv/dt rate and
• 100% Avalanche Tested higher avalanche energy. Consequently, SuperFETII MOSFET is
suitable for various AC/DC power conversion for system minia-
Applications turization and higher efficiency.
G
TO-220 TO-220F
G D S GD S
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted
Symbol Parameter FCP190N60E FCPF190N60E Unit
VDSS Drain to Source Voltage 600 V
- DC ±20 V
VGSS Gate to Source Voltage
- AC (f > 1 Hz) ±30 V
-Continuous (TC = 25oC) 20.6 20.6*
ID Drain Current A
-Continuous (TC = 100oC) 13.1 13.1*
IDM Drain Current - Pulsed (Note 1) 61.8 61.8* A
EAS Single Pulsed Avalanche Energy (Note 2) 400 mJ
IAR Avalanche Current (Note 1) 4.0 A
EAR Repetitive Avalanche Energy (Note 1) 2.1 mJ
Peak Diode Recovery dv/dt (Note 3) 20
dv/dt V/ns
MOSFET dv/dt 100
(TC = 25oC) 208 39 W
PD Power Dissipation
- Derate above 25oC 1.67 0.31 W/oC
o
TJ, TSTG Operating and Storage Temperature Range -55 to +150 C
Maximum Lead Temperature for Soldering Purpose, o
TL 300 C
1/8” from Case for 5 Seconds
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol Parameter FCP190N60E FCPF190N60E Unit
RθJC Thermal Resistance, Junction to Case 0.6 3.2
RθCS Thermal Resistance, Case to Heat Sink (Typical) 0.5 0.5 oC/W
Off Characteristics
VGS = 0 V, ID = 10 mA, TJ = 25°C 600 - - V
BVDSS Drain to Source Breakdown Voltage
VGS = 0 V, ID = 10 mA, TJ = 150°C 650 - - V
ΔBVDSS Breakdown Voltage Temperature
ID = 10 mA, Referenced to 25oC - 0.67 - V/oC
ΔTJ Coefficient
BVDS Drain-Source Avalanche Breakdown
VGS = 0 V, ID = 20 A - 700 - V
Voltage
VDS = 480 V, VGS = 0 V - - 1
IDSS Zero Gate Voltage Drain Current μA
VDS = 480 V, TC = 125oC - - 10
IGSS Gate to Body Leakage Current VGS = ±20 V, VDS = 0 V - - ±100 μA
On Characteristics
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250 μA 2.5 - 3.5 V
RDS(on) Static Drain to Source On Resistance VGS = 10 V, ID = 10 A - 0.16 0.19 Ω
gFS Forward Transconductance VDS = 20 V, ID = 10 A - 20 - S
Dynamic Characteristics
Ciss Input Capacitance - 2385 3175 pF
VDS = 25 V, VGS = 0 V
Coss Output Capacitance - 1795 2396 pF
f = 1 MHz
Crss Reverse Transfer Capacitance - 110 165 pF
Coss Output Capacitance VDS = 380 V, VGS = 0 V, f = 1.0 MHz - 42 - pF
Coss eff. Effective Output Capacitance VDS = 0 V to 480 V, VGS = 0 V - 178 - pF
Qg(tot) Total Gate Charge at 10V - 63 82 nC
Qgs Gate to Source Gate Charge VDS = 380 V, ID = 10 A - 10 - nC
VGS = 10 V
Qgd Gate to Drain “Miller” Charge (Note 4) - 24 - nC
ESR Equivalent Series Resistance f= 1 MHz - 5 - Ω
Switching Characteristics
td(on) Turn-On Delay Time - 23 56 ns
tr Turn-On Rise Time VDD = 380 V, ID = 10 A - 14 38 ns
td(off) Turn-Off Delay Time VGS = 10 V, RG = 4.7 Ω - 101 212 ns
tf Turn-Off Fall Time (Note 4) - 15 40 ns
10 o
5.5V 150 C
5.0V
4.5V
10 o
25 C
o
-55 C
1
*Notes:
1. 250μs Pulse Test
o
2. TC = 25 C
0.3 1
0.1 1 10 2 3 4 5 6 7 8
VDS, Drain-Source Voltage[V] VGS, Gate-Source Voltage[V]
0.3 o
150 C
RDS(ON) [Ω],
o
25 C
10
VGS = 10V
0.2
VGS = 20V
*Notes:
1. VGS = 0V
o
*Note: TC = 25 C 2. 250μs Pulse Test
0.1 1
0 10 20 30 40 50 60 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]
VDS = 120V
8 VDS = 300V
1000
VDS = 480V
Capacitances [pF]
6
100 Coss
*Note: 4
10 1. VGS = 0V
Crss
2. f = 1MHz
2
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
1 Crss = Cgd *Note: ID = 10A
0.5 0
0.1 1 10 100 600 0 14 28 42 56 70
VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]
Drain-Source On-Resistance
2.5
RDS(on), [Normalized]
1.1
BVDSS, [Normalized]
2.0
1.0 1.5
1.0
0.9
*Notes: 0.5 *Notes:
1. VGS = 0V 1. VGS = 10V
2. ID = 10mA 2. ID = 10A
0.8 0.0
-80 -40 0 40 80 120 160 -80 -40 0 40 80 120 160
o o
TJ, Junction Temperature [ C] TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Safe Operating Area
vs. Case Temperature - FCP190N60E vs. Case Temperature - FCPF190N60E
100 100
10μs
100μs 10μs
ID, Drain Current [A]
10 10
1ms 100μs
10ms 1ms
1 1 10ms
DC
Operation in This Area Operation in This Area
is Limited by R DS(on) is Limited by R DS(on) DC
Figure 11. Maximum Drain Current Figure 12. Eoss vs. Drain to Source Voltage
Switching Capability
25 10
20 8
ID, Drain Current [A]
EOSS, [μJ]
15 6
10 4
5 2
0 0
25 50 75 100 125 150
o 0 100 200 300 400 500 600
TC, Case Temperature [ C]
VDS, Drain to Source Voltage [V]
0.2
PDM
0.1
0.1 t1
0.05
t2
*Notes:
0.02 o
0.01 1. ZθJC(t) = 0.6 C/W Max.
Single pulse 2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.01
-5 -4 -3 -2 -1
10 10 10 10 10 1
Rectangular Pulse Duration [sec]
5
Thermal Response [ZθJC]
0.5
1
0.2
0.1
PDM
0.05
t1
0.02
0.1 t2
0.01
Single pulse *Notes:
o
1. ZθJC(t) = 3.2 C/W Max.
2. Duty Factor, D= t1/t2
3. TJM - TC = PDM * ZθJC(t)
0.01
-5 -4 -3 -2 -1
10 10 10 10 10 1 10 100
Rectangular Pulse Duration [sec]
DUT +
VDS
I SD
L
Driver
RG
Same Type
as DUT VDD
IRM
VSD VDD
Body Diode
Forward Voltage Drop
TO-220AB
TO-220F (Retractable)
Dimensions in Millimeters
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THEREIN, WHICH COVERS THESE PRODUCTS.
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Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Rev. I64
[Link]