VinMin = 5.
5V Device = TPS56837RPAR
VinMax = 28.0V Topology = Buck
Vout = 5.0V Created = 2025-03-01 13:02:43.958
Iout = 8.0A BOM Cost = $3.01
® BOM Count = 13
WEBENCH Design Report Total Pd = 2.99W
Design : 3 TPS56837RPAR
TPS56837RPAR 5.5V-28V to 5.00V @ 8A
Cboot L1
100.0 nF 3.3 µH
1.0 m Ohm 8.6 m Ohm
TPS5 6 8 3 7 RPA
U1 VIN BOOT
Rpg
EN 100.0 kOhm
SW 63.0 m W
PG
Vin Cinx SS FB Cff Rfbt
100.0 nF 150.0 pF
73.2 kOhm
Cin 1.0 m Ohm PGND
125.0 m W Cout
10.0 µF
2.827 m Ohm MODE AGND 47.0 µF
Qt y= 2 3.037 m Ohm
Iout
Css
22.0 nF Rm ode Vcc_5V Rfbb
1.0 m Ohm 30.1 kOhm 10.0 kOhm
63.0 m W 50.0 m W
Vout = 5.0V
Electrical BOM
Name Manufacturer Part Number Properties Qty Price Footprint
Cboot MuRata GRM155R71C104KA88D Cap= 100.0 nF 1 $0.01
Series= X7R ESR= 1.0 mOhm 0402 3 mm
2
VDC= 16.0 V
IRMS= 0.0 A
Cff Kemet C0603C151K3GACTU Cap= 150.0 pF 1 $0.02
Series= C0G/NP0 VDC= 25.0 V 0603 5 mm
2
IRMS= 0.0 A
Cin TDK CGA6P3X7S1H106K250AB Cap= 10.0 uF 2 $0.31
Series= X7S ESR= 2.827 mOhm 1210_280 15 mm
2
VDC= 50.0 V
IRMS= 4.3729 A
Cinx MuRata GRM21BR71H104KA01L Cap= 100.0 nF 1 $0.03
Series= X7R ESR= 1.0 mOhm 0805 7 mm
2
VDC= 50.0 V
IRMS= 3.85 A
Cout MuRata GRM32ER61C476KE15L Cap= 47.0 uF 1 $0.17
Series= X5R ESR= 3.037 mOhm 1210_280 15 mm
2
VDC= 16.0 V
IRMS= 4.59346 A
Css MuRata GRM155R71C223KA01D Cap= 22.0 nF 1 $0.01
Series= X7R ESR= 1.0 mOhm 0402 3 mm
2
VDC= 16.0 V
IRMS= 0.0 A
L1 Coilcraft XAL7070-332MEB L= 3.3 µH 1 $1.19
8.6 mOhm
2
XAL7070 87 mm
Rfbb Yageo RC0201FR-0710KL Res= 10.0 kOhm 1 $0.01
Series= ? Power= 50.0 mW 0201 2 mm
2
Tolerance= 1.0%
Rfbt Panasonic ERJ-6ENF7322V Res= 73.2 kOhm 1 $0.01
Series= ERJ-6E Power= 125.0 mW 0805 7 mm
2
Tolerance= 1.0%
Rmode Vishay-Dale CRCW040230K1FKED Res= 30.1 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2
Tolerance= 1.0%
Copyright © 2025, Texas Instruments Incorporated 1 [Link]/webench
®
WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00
®
WEBENCH Design
Name Manufacturer Part Number Properties Qty Price Footprint
Rpg Vishay-Dale CRCW0402100KFKED Res= 100.0 kOhm 1 $0.01
Series= CRCW..e3 Power= 63.0 mW 0402 3 mm
2
Tolerance= 1.0%
U1 Texas Instruments TPS56837RPAR Switcher 1 $0.92
2
RPA0010A 16 mm
Copyright © 2025, Texas Instruments Incorporated 2 [Link]/webench
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WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00
®
WEBENCH Design
Copyright © 2025, Texas Instruments Incorporated 3 [Link]/webench
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WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00
®
WEBENCH Design
Operating Values
# Name Value Category Description
1. Cin IRMS 3.115 A Capacitor Input capacitor RMS ripple current
2. Cin Pd 13.712 mW Capacitor Input capacitor power dissipation
3. Cout IRMS 701.072 mA Capacitor Output capacitor RMS ripple current
4. Cout Pd 1.493 mW Capacitor Output capacitor power dissipation
5. IC Ipk 9.214 A IC Peak switch current in IC
6. IC Pd 2.424 W IC IC power dissipation
7. IC Tj 97.877 degC IC IC junction temperature
8. IC Tolerance 6.0 mV IC IC Feedback Tolerance
9. ICThetaJA 28.0 degC/W IC IC junction-to-ambient thermal resistance
10. Iin Avg 1.536 A IC Average input current
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WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00
®
WEBENCH Design
# Name Value Category Description
11. Ipp percentage 30.357 % Inductor Inductor ripple current percentage (with respect to average inductor
current)
12. L Ipp 2.429 A Inductor Peak-to-peak inductor ripple current
13. L Pd 554.63 mW Inductor Inductor power dissipation
14. Cin Pd 13.712 mW Power Input capacitor power dissipation
15. Cout Pd 1.493 mW Power Output capacitor power dissipation
16. IC Pd 2.424 W Power IC power dissipation
17. L Pd 554.63 mW Power Inductor power dissipation
18. Total Pd 2.994 W Power Total Power Dissipation
19. BOM Count 13 System Total Design BOM count
Information
20. Duty Cycle 18.403 % System Duty cycle
Information
21. Efficiency 93.036 % System Steady state efficiency
Information
22. FootPrint 180.0 mm
2
System Total Foot Print Area of BOM components
Information
23. Frequency 522.821 kHz System Switching frequency
Information
24. Iout 8.0 A System Iout operating point
Information
25. Mode CCM System Conduction Mode
Information
26. Pout 40.0 W System Total output power
Information
27. Total BOM $3.01 System Total BOM Cost
Information
28. Vin 28.0 V System Vin operating point
Information
29. Vin p-p 291.614 mV System Peak-to-peak input voltage
Information
30. Vout 5.0 V System Operational Output Voltage
Information
31. Vout Actual 4.992 V System Vout Actual calculated based on selected voltage divider resistors
Information
32. Vout Tolerance 2.795 % System Vout Tolerance based on IC Tolerance (no load) and voltage divider
Information resistors if applicable
33. Vout p-p 19.555 mV System Peak-to-peak output ripple voltage
Information
Design Inputs
Name Value Description
Iout 8.0 Maximum Output Current
VinMax 28.0 Maximum input voltage
VinMin 5.5 Minimum input voltage
Vout 5.0 Output Voltage
base_pn TPS56837 Base Product Number
source DC Input Source Type
Ta 30.0 Ambient temperature
Copyright © 2025, Texas Instruments Incorporated 5 [Link]/webench
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WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00
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WEBENCH Design
®
WEBENCH Assembly
Component Testing
Some published data on components in datasheets such as Capacitor ESR and Inductor DC resistance is based on conservative values that
will guarantee that the components always exceed the specification. For design purposes it is usually better to work with typical values. Since
this data is not always available it is a good practice to measure the Capacitance and ESR values of Cin and Cout, and the inductance and DC
resistance of L1 before assembly of the board. Any large discrepancies in values should be electrically simulated in WEBENCH to check for
instabilities and thermally simulated in WebTHERM to make sure critical temperatures are not exceeded.
Soldering Component to Board
If board assembly is done in house it is best to tack down one terminal of a component on the board then solder the other terminal. For surface
mount parts with large tabs, such as the DPAK, the tab on the back of the package should be pre-tinned with solder, then tacked into place
by one of the pins. To solder the tab town to the board place the iron down on the board while resting against the tab, heating both surfaces
simultaneously. Apply light pressure to the top of the plastic case until the solder flows around the part and the part is flush with the PCB. If the
solder is not flowing around the board you may need a higher wattage iron (generally 25W to 30W is enough).
Initial Startup of Circuit
It is best to initially power up the board by setting the input supply voltage to the lowest operating input voltage 5.5V and set the input supply's
current limit to zero. With the input supply off connect up the input supply to Vin and GND. Connect a digital volt meter and a load if needed
to set the minimum Iout of the design from Vout and GND. Turn on the input supply and slowly turn up the current limit on the input supply.
If the voltage starts to rise on the input supply continue increasing the input supply current limit while watching the output voltage. If the
current increases on the input supply, but the voltage remains near zero, then there may be a short or a component misplaced on the board.
Power down the board and visually inspect for solder bridges and recheck the diode and capacitor polarities. Once the power supply circuit is
operational then more extensive testing may include full load testing, transient load and line tests to compare with simulation results.
Load Testing
The setup is the same as the initial startup, except that an additional digital voltmeter is connected between Vin and GND, a load is connected
between Vout and GND and a current meter is connected in series between Vout and the load. The load must be able to handle at least rated
output power + 50% ( 7.5 watts for this design). Ideally the load is supplied in the form of a variable load test unit. It can also be done in the
form of suitably large power resistors. When using an oscilloscope to measure waveforms on the prototype board, the ground leads of the
oscilloscope probes should be as short as possible and the area of the loop formed by the ground lead should be kept to a minimum. This will
help reduce ground lead inductance and eliminate EMI noise that is not actually present in the circuit.
Design Assistance
1. Master key : A6FA1A4947A75A09A7C7FFBF7DDB130D[v1]
2. TPS56837 Product Folder : [Link] : contains the data sheet and other resources.
Copyright © 2025, Texas Instruments Incorporated 6 [Link]/webench
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WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00
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WEBENCH Design
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WEBENCH Design Report TPS56837RPAR : TPS56837RPAR 5.5V-28V to 5.00V @ 8A March 1, 2025 13:02:55 GMT-06:00