DP83822HF, DP83822IF, DP83822H, DP83822I

ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

DP83822 低功耗耐用型 10/100Mbps 以太网物理层收发器

1 特性 3 说明
• 超稳健 10/100Mbs PHY DP83822 是一款超稳健、低功耗单端口 10/100Mbps
– IEC 61000-4-2 ESD：+/- 8KV 接触放电 以太网 PHY，旨在用于恶劣的工业环境。DP83822 提
– IEC 61000-4-4 EFT：4KV 下的 A 类 供通过标准双绞线电缆发送和接收数据或者连接到外部
– CISPR 22 传导发射：B 类 光纤收发器所需的所有物理层功能。此外，DP83822
– CISPR 22 辐射发射：B 类 还可通过标准 MII、RMII 或 RGMII 接口灵活地连接到
– 工作温度：-40C - 125C MAC。
• MAC 接口：RGMII/RMII/MII 为了便于使用，DP83822 提供了集成电缆诊断工具、
• 符合 IEEE 802.3u 标准：100BASE-FX、 内置自检和环回功能。该器件能够凭借其快速下行链路
100BASE-TX 和 10BASE-Te 检测和强制模式下的自动 MDIX 功能支持多条工业现
• 灵活的电源选项 场总线。
– 低功耗单电源选项
DP83822 提供了一种出色的可靠方案来降低功耗，具
• 1.8V AVD < 120mW
体将通过 EEE、WoL 和其他可编程节能模式来实现。
• 3.3V AVD < 220mW
– 可用的 I/O 电压：3.3V/2.5V/1.8V DP83822 是一个功能丰富的引脚到引脚可升级选项，
• 省电功能 适 用 于 TLK105 、 TLK106 、 TLK105L 和 TLK106L
– 节能以太网 (EEE) IEEE 802.3az 10/100 Mbps 以太网 PHY。
– 支持 WoL（局域网唤醒），具有魔术包检测功 DP83822 采用 32 引脚 5.00mm × 5.00mm VQFN 封
能 装。
– 可编程节能模式
• IEEE 1588 时间戳的帧起始监测 器件信息
• 诊断工具：电缆诊断、BIST（内置自检）、环回、 器件型号 封装 (1) 封装尺寸（标称值）
快速链路断开检测 DP83822HF VQFN (32) 5.00mm × 5.00mm
• 强制模式下自动交叉 DP83822H VQFN (32) 5.00mm × 5.00mm

2 应用 DP83822IF VQFN (32) 5.00mm × 5.00mm

DP83822I VQFN (32) 5.00mm × 5.00mm
• 电机驱动器
• 工厂自动化、机器人和运动控制 (1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
• 电网基础设施 录。
• 楼宇自动化
• 工业以太网现场总线
• 实时工业以太网应用，例如 ProfiNET®
100BASE-FX

MII
Transceiver
Fiber Optic
Capacitors

RMII
RGMII

DP83822
MAC 10/100 Mbps 10BASE-Te
Ethernet PHY 100BASE-TX
Magnetics

RJ-45

25-MHz / 50-MHz Status

Clock Source LEDs

Copyright © 2016, Texas Instruments Incorporated

简化原理图

本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
[Link]，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SNLS505
DP83822HF, DP83822IF, DP83822H, DP83822I
ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023 [Link]

Table of Contents
1 特性................................................................................... 1 7.19 10BASE-Te Jabber Timing......................................16
2 应用................................................................................... 1 7.20 100BASE-TX Transmit Latency Timing.................. 16
3 说明................................................................................... 1 7.21 100BASE-TX Receive Latency Timing................... 16
4 Revision History.............................................................. 2 7.22 Timing Diagrams..................................................... 17
5 Device Comparison Table...............................................5 7.23 Typical Characteristics............................................ 24
6 Pin Configuration and Functions...................................5 8 Detailed Description......................................................25
7 Specifications................................................................ 10 8.1 Overview................................................................... 25
7.1 Absolute Maximum Ratings...................................... 10 8.2 Functional Block Diagram......................................... 26
7.2 ESD Ratings............................................................. 10 8.3 Feature Description...................................................27
7.3 Recommended Operating Conditions.......................10 8.4 Device Functional Modes..........................................30
7.4 Thermal Information.................................................. 11 8.5 Programming............................................................ 48
7.5 Electrical Characteristics...........................................11 8.6 Register Maps...........................................................54
7.6 Timing Requirements, Power-Up Timing.................. 12 9 Application and Implementation................................ 106
7.7 Timing Requirements, Power-Up With Unstable 9.1 Application Information........................................... 106
XI Clock....................................................................... 13 9.2 Typical Applications................................................ 106
7.8 Timing Requirements, Reset Timing.........................13 10 Power Supply Recommendations............................112
7.9 Timing Requirements, Serial Management Timing... 13 10.1 Power Supply Characteristics............................... 112
7.10 Timing Requirements, 100 Mbps MII Transmit 11 Layout......................................................................... 117
Timing..........................................................................13 11.1 Layout Guidelines..................................................117
7.11 Timing Requirements, 100 Mbps MII Receive 11.2 Layout Example.................................................... 120
Timing..........................................................................13 12 Device and Documentation Support........................121
7.12 Timing Requirements, 10 Mbps MII Transmit 12.1 Related Links........................................................ 121
Timing..........................................................................14 12.2 接收文档更新通知................................................. 121
7.13 Timing Requirements, 10 Mbps MII Receive 12.3 支持资源................................................................121
Timing..........................................................................14 12.4 Trademarks........................................................... 121
7.14 Timing Requirements, RMII Transmit Timing..........15 12.5 静电放电警告........................................................ 121
7.15 Timing Requirements, RMII Receive Timing...........15 12.6 术语表................................................................... 121
7.16 Timing Requirements, RGMII..................................15 13 Mechanical, Packaging, and Orderable
7.17 Normal Link Pulse Timing....................................... 16 Information.................................................................. 122
7.18 Auto-Negotiation Fast Link Pulse (FLP) Timing...... 16 13.1 Package Option Addendum.................................. 123

4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision F (June 2021) to Revision G (August 2023) Page
• 将 IEC 6100 更正为 IEC 61000.......................................................................................................................... 1
• Changed Language in LED pins from 'Mode' to 'Function'................................................................................. 5
• Changed 'Other Inputs' Max rating from 3.8 to 'VDDIO + 0.3V'........................................................................10
• Added last sentence and register write list. "After enabling/setting the RX_SFD..." etc...................................29
• Third & fourth paragraph added. ......................................................................................................................40
• Added LED_1 . ................................................................................................................................................ 48
• Changed details of register 0x0018 to say LED instead of LED_0 for bits 10:9 .............................................. 54
• Changed the details of register 0x0027 to include Harmonics Compliance Test note......................................54
• Updated details of register 0x0040; added bit 13 description...........................................................................54
• Changed Pin 1 Quadrant from Q2 to Q1........................................................................................................125

Changes from Revision E (March 2019) to Revision F (June 2021) Page

• 更新了整个文档的表、图和交叉参考的编号格式................................................................................................1
• 更新了“特性”部分以突出显示关键特性。....................................................................................................... 1
• 添加了商标..........................................................................................................................................................1
• Added clarification on Tx_CLK state in reset in pin function table......................................................................5
• Added clarification on TX_CLK state in reset in IO Pins State During Reset table............................................ 5

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English Data Sheet: SNLS505
 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

• Added 100BASE-FX output parameters .......................................................................................................... 11

• Added AVO footnote......................................................................................................................................... 12
• Added timing requirement for reset after stabilization of XI clock. ...................................................................13
• Added RMII transmit latency number .............................................................................................................. 16
• Added RGMII transmit latency number ............................................................................................................16
• Added RMII receive latency number.................................................................................................................16
• Added RGMII receive latency number.............................................................................................................. 16
• Updated details of earlier "reserved" bits of register 0x000B and 0x003F....................................................... 54
• Updated description for register 0x0015 and 0x001C...................................................................................... 54
• Added register description of following registers:
0x101,0x0106,0x0107,0x0126,0x04D4,0x0121,0x0122,0x0124,0x010F,0x0111,0x0129,0x0130,0x0410,0x041
6,0x0418,0x0450,0x040D ,0x041F,0x0421...................................................................................................... 54
• Added further information to registers 0x0000,0x0001,0x0469,0x0703C.........................................................54
• Updated default values for registers
:0x0008,0x000A,0x0010,0x0017,0x001E,0x0155,0x0215,0x0462,0x3000,0x3001,0x3014,0x3016............... 54
• Changed TPI network diagram to include optional ferrite bead for EMC improvement..................................107

Changes from Revision D (March 2019) to Revision E (March 2019) Page

• Changed to fix typos on Table 1 ........................................................................................................................ 5

Changes from Revision C (April 2018) to Revision D (March 2019) Page

• Changed the description for LED_1 in Pin Functions table................................................................................ 5
• Changed reset pin state for RX_D[3:0] and LED_1 pins in IO Pins State During Reset.................................... 5
• Added XO and XI capacitance..........................................................................................................................11
• Added Test Conditions to PMD OUTPUT section of the Electrical Characteristics Table................................. 11
• Changed Parameter descriptions and units in Reset Timing Requirements table to match device
performance......................................................................................................................................................13
• Changed NOTE for 100BASE-FX Signal Detect pin polarity from Active LOW to Active HIGH.......................41
• Changed LED_0 strap modes to remove Mode 2 and Mode 3. ...................................................................... 48
• Changed strap description for SD_EN pin from Active LOW to Active HIGH...................................................48
• Deleted LED_0 configuration table................................................................................................................... 48
• Changed LED_1 Configuration table to merge LED_0 and LED_1 configuration into a single table for
clarity.................................................................................................................................................................48
• Changed note in 节 8.5.2 section to clarify LED connections...........................................................................53
• Added registers 0x0106, 0x0107, 0x010F, 0x0114, 0x0116, 0x0126, 0x04D4, 0x04D5, and 0x04D6 ............ 54
• Added 100Base-TX MII power consumption data for -40oC and 125oC.........................................................112

Changes from Revision B (March 2018) to Revision C (April 2018) Page

• Changed TX_D[1:0] back to TX_D[3:0]............................................................................................................ 30
• Changed RX_D[1:0] back to RX_D[3:0]........................................................................................................... 30

Changes from Revision A (August 2016) to Revision B (March 2018) Page

• 根据最新 TI 文档和翻译标准更新了数据表文本和格式....................................................................................... 1
• Updated description of pin 24 and changed pin type from: I/O, PD to: I/O ........................................................5
• Added MII: 100BASE-TX Transmit Latency Timing table ................................................................................ 16
• Added MII: 100BASE-TX Receive Latency Timing table .................................................................................16
• Device Power-Up Timing diagram modified to include start voltage limits....................................................... 17
• Added the 100BASE-TX Transmit Latency Timing graphic ............................................................................. 17
• Added the 100BASE-TX Receive Latency Timing graphic ..............................................................................17
• Changed the Functional Block Diagram .......................................................................................................... 26

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English Data Sheet: SNLS505
DP83822HF, DP83822IF, DP83822H, DP83822I
ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023 [Link]

• Changed TX_D[3:0] to TX_D[1:0].....................................................................................................................30

• Changed RX_D[3:0] to RX_D[1:0].................................................................................................................... 30
• Added note to the 100BASE-FX Receive section and changed the SD_DIS pin to SD_EN............................ 41
• Changed RX_ER strap function from: AMDIX_EN (SD_DIS) to: AMDIX_EN (SD_EN)...................................48
• Added the Detailed Design Procedure section for the TPI Network Circuit typical application...................... 107
• Switched the order of the typical applications................................................................................................ 108
• Added note to the Oscillator section ..............................................................................................................108
• Changed the Power Connections graphic ..................................................................................................... 112

Changes from Revision * (August 2016) to Revision A (August 2016) Page

• 将“产品预发布”更改为“量产数据发布”....................................................................................................... 1

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Product Folder Links: DP83822HF DP83822IF DP83822H DP83822I

English Data Sheet: SNLS505
 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

5 Device Comparison Table

PART 100BASE-FX OPERATING
NUMBER SUPPORT TEMPERATURE
DP83822HF Yes -40°C to 125°C
DP83822H No -40°C to 125°C
DP83822IF Yes -40°C to 85°C
DP83822I No -40°C to 85°C

6 Pin Configuration and Functions

LED_1 / GPIO1

RESET_N
VDDIO

LED_0
MDIO
MDC
XO
24 XI
23 22 21 20 19 18 17

RX_CLK 25 16 RBIAS

RX_DV / RX_CTRL 26 15 NC

CRS / CRS_DV 27 14 AVD

RX_ER 28 13 NC
GND
COL / GPIO2 29 12 TD_P

RX_D0 30 11 TD_M

RX_D1 31 10 RD_P

RX_D2 32 9 RD_M

1 2 3 4 5 6 7 8
RX_D3 / GPIO3

TX_CLK

TX_EN / TX_CTRL

TX_D0

TX_D1

TX_D2

TX_D3

INT / PWDN_N

图 6-1. RHB Package

32-Pin VQFN
Top View

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Product Folder Links: DP83822HF DP83822IF DP83822H DP83822I

English Data Sheet: SNLS505
DP83822HF, DP83822IF, DP83822H, DP83822I
ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023 [Link]

表 6-1. Pin Functions

PIN
TYPE(1) DESCRIPTION
NAME NO.
MAC INTERFACE
MII Transmit Clock: MII Transmit Clock provides a 25-MHz reference
clock for 100-Mbps speed and a 2.5-MHz reference clock for 10-Mbps
O, Hi-Z speed. Note that in MII mode, this clock has constant phase referenced to
the reference clock. Applications requiring such constant phase may use
this feature.
TX_CLK 2 Hi-Z Unused in RMII Mode
RGMII Transmit Clock: The clock is sourced from the MAC layer to the
PHY. When operating at 100-Mbps speed, this clock must be 25-MHz.
I, PD When operating at 10-Mbps speed, this clock must be 2.5-MHz.
Note : When in reset, TX_CLK is an output pin and low value is driven on
it. Only once device is out of reset, TX_CLK is configured as input.
Transmit Enable: TX_EN is presented on the rising edge of the TX_CLK.
TX_EN indicates the presence of valid data inputs on TX_D[3:0] in MII
mode and on TX_D[1:0] in RMII mode. TX_EN is an active high signal.
TX_EN / TX_CTRL 3 I, PD
RGMII Transmit Control: TX_CTRL combines transmit enable and
transmit error signals. TX_EN is presented on the rising edge of TX_CLK
and TX_ER on the falling edge of TX_CLK.
TX_D0 4 Transmit Data: In MII mode, the transmit data nibble received from the
MAC is synchronous to the rising edge of TX_CLK. In RMII mode,
TX_D1 5
I, PD TX_D[1:0] received from the MAC is synchronous to the rising edge of the
TX_D2 6 reference clock. In RGMII mode, the transmit data nibble received from
TX_D3 7 the MAC is synchronous to the rising edge of TX_CLK.

MII Receive Clock: MII Receive Clock provides a 25-MHz reference

clock for 100-Mbps speed and a 2.5-MHz reference clock for 10-Mbps
speed, which is derived from the received data stream.
RX_CLK 25 O Unused in RMII Mode
RGMII Receive Clock:RGMII Receive Clock provides a 25-MHz
reference clock for 100-Mbps speed and a 2.5-MHz reference clock for
10-Mbps speed, which is derived from the receive data stream.
Receive Data Valid: This pin indicates valid data is present on the
RX_D[3:0] for MII mode and on RX_D[1:0] in RMII mode, independent
from Carrier Sense.
RX_DV / RX_CTRL 26 O, S-PD
RGMII Receive Control: RX_CTRL combines receive data valid and
receive error signals. RX_DV is presented on the rising edge of RX_CLK
and RX_ER on the falling edge of RX_CLK.
Receive Error: This pin indicates that an error symbol has been detected
within a received packet in both MII and RMII mode. In MII mode, RX_ER
is asserted high synchronously to the rising edge of RX_CLK. In RMII
RX_ER 28 O, S-PU mode, RX_ER is asserted high synchronously to the rising edge of the
reference clock. This pin is not required to be used by the MAC in MII or
RMII because the PHY is corrupting data on a receive error.
Unused in RGMII Mode
RX_D0 30 Receive Data: Symbols received on the cable are decoded and
presented on these pins synchronous to the rising edge of RX_CLK. They
RX_D1 31
contain valid data when RX_DV is asserted. A nibble RX_D[3:0] is
RX_D2 32 received in MII and RGMII modes. 2-bits RX_D[1:0] is received in RMII
O, S-PD
Mode. PHY address pins PHY_AD[4:1] are multiplexed with RX_D[3:0],
and are pulled-down. PHY_AD[0] (LSB of the address) is multiplexed with
RX_D3 / GPIO3 1 COL on pin 29, and is pulled up. If no external pullup or pulldown is
present, the default PHY address is 0x01.
Carrier Sense: In MII mode this pin is asserted high when the receive or
transmit medium is non-idle.
CRS / CRS_DV 27 O, S-PU Carrier Sense / Receive Data Valid: In RMII mode, this pin combines
the RMII Carrier and Receive Data Valid indications.
Unused in RGMII Mode

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English Data Sheet: SNLS505
 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

表 6-1. Pin Functions (continued)

PIN
TYPE(1) DESCRIPTION
NAME NO.
Collision Detect: For Full-Duplex mode, this pin is always LOW. In Half-
Duplex mode, this pin is asserted HIGH only when both transmit and
COL / GPIO2 29 I/O, S-PU
receive media are non-idle.
Unused in RMII Mode
SERIAL MANAGEMENT INTERFACE
Management Data Clock: Synchronous clock to the MDIO serial
management input/output data. This clock may be asynchronous to the
MDC 20 I
MAC transmit and receive clocks. The maximum clock rate is 25 MHz.
There is no minimum clock rate.
Management Data I/O: Bidirectional management data signal that may
MDIO 19 I/O be sourced by the management station or the PHY. This pin requires a
2.2-kΩ pullup resistor.
Interrupt / Power Down: Register access is required for this pin to be
configured either as power down or as an interrupt. The default function
of this pin is power down. When this pin is configured for a power down
function, an active low signal on this pin places the device in power-down
INT/PWDN 8 I/O, OD mode.
When this pin is configured as an interrupt pin, this pin is asserted low
when an interrupt condition occurs. The pin has an open-drain output with
a weak internal pullup. Some applications may require an external pullup
resistor.
RESET: This pin is an active low reset input that initializes or re-initializes
RESET 18 I, PU all the internal registers of the PHY. Asserting this pin low for at least 10
µs will force a reset process to occur.
CLOCK INTERFACE
Crystal / Oscillator Input
MII reference clock: Reference clock 25-MHz ±100 ppm-tolerance
crystal or oscillator input. The device supports either an external crystal
resonator connected across pins XI and XO, or an external CMOS-level
oscillator connected to pin XI only.
RMII reference clock: Reference clock 50-MHz ±100 ppm-tolerance
XI 23 I
CMOS-level oscillator in RMII Slave mode. Reference clock 25-MHz ±100
ppm-tolerance crystal or oscillator in RMII Master mode.
RGMII reference clock:Reference clock 25-MHz ±100 ppm-tolerance
crystal or oscillator input. The device supports either an external crystal
resonator connected across pins XI and XO, or an external CMOS-level
oscillator connected to pin XI only.
Crystal Output: Reference Clock output. XO pin is used for crystal only.
XO 22 O This pin should be left floating when a CMOS-level oscillator is connected
to XI.
GPIO AND LED INTERFACE
Function 1 (Default): LINK Indication, LED indicates the status of the
link. When the link is good, LED is ON. When the link is down, LED is
OFF.
LED_0 17 O, S-PU
Function 2: ACT Indication, LED indicates transmit and receive activity in
addition to the status of the link. The LED is ON when link is good. The
LED blinks when the transmitter or receiver is active.
Function 1 (Default): This pin is tri-state.
Function 2: SPEED Indication, LED indicates the speed of the link. If
speed is 100 Mbps, LED is ON. If speed is 10 Mbps, LED is OFF.
External Pull resistors are required when LED is connected to this pin.
LED_1 / GPIO1 24 I/O, S-PD
GPIO1: This pin can be used as a GPIO when using register access.
Signal Detect: This pin acts as Signal Detect in 100BASE-FX mode and
shall be connected with Optical Transceiver. Signal Detect high level will
be the VDDIO voltage level.

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English Data Sheet: SNLS505
DP83822HF, DP83822IF, DP83822H, DP83822I
ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023 [Link]

表 6-1. Pin Functions (continued)

PIN
TYPE(1) DESCRIPTION
NAME NO.
MII Mode: COL pin can be used to drive an LED when operating in Full-
Duplex mode. Register access is required for LED configuration.
RMII Mode: This pin can be used as an LED when using register access.
COL / GPIO2 29 I/O, S, PU
RGMII Mode:This pin can be used as an LED when using register
access.
GPIO2: This pin can be used as a GPIO when using register access.
MII Mode: RX_D3 will remain as RX_D3 because it is required for MII
mode.
RMII Mode: RX_D3 pin can be configured to drive an LED. Register
RX_D3 / GPIO3 1 I/O, S-PD access is required for LED configuration.
RGMII Mode:RX_D3 will remain as RX_D3 because it is required for
RGMII mode.
GPIO3: This pin can be used as a GPIO when using register access.
MEDIA DEPENDENT INTERFACE
TD_M 11 Differential Transmit Output (PMD): These differential outputs can be
A automatically configured to either 10BASE-Te, 100BASE-TX, or
TD_P 12 100BASE-FX signaling or forced into a specific signaling mode.
RD_M 9 Differential Receive Input (PMD): These differential inputs are
A automatically configured to accept either 10BASE-Te, 100BASE-TX, or
RD_P 10 100BASE-FX signaling or forced into a specific signaling mode.
POWER AND GROUND PINS
VDDIO 21 P I/O Supply: 3.3 V, 2.5 V, or 1.8 V
AVD 14 P Analog Supply: 3.3 V or 1.8 V
Ground Ground
GND P
Pad
Bias Resistor Connection. A 4.87-kΩ ±1% resistor must be connected
RBIAS 16 I
from RBIAS to GND.
OTHER PINS
NC 13 NC Leave Floating
NC 15 NC Leave Floating
This pin can be left floating when not in used. External Pull resistors are
LED_1 / GPIO1 24 I/O, S-PD
required when LED is connected to this pin.

(1) The definitions below define the functionality of the I/O cells for each pin.
• Type: I - Input
• Type: O - Output
• Type: I/O - Input/Output
• Type OD - Open Drain
• Type: PD, PU - Internal Pulldown/Pullup
• Type: S-PU, S-PD - Strapping Pin (All strap pins have weak internal pullups or pulldowns. If the default strap value is needed to be
changed then an external 2.2-kΩ resistor should be used)

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English Data Sheet: SNLS505
 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

表 6-2. IO Pins State During Reset

PIN NAME NO. TYPE PU/PD/HiZ
MDIO 19 I Hi-Z
MDC 20 I PD
INT_N 8 I PU
RESET_N 18 — —
TX_CLK (1) 2 O PD
TX_EN 3 I PD
TX_D3 7 I PD
TX_D2 6 I PD
TX_D1 5 I PD
TX_D0 4 I PD
LED_0 17 Strap PU
LED_1 24 Strap PD
CRS 27 Strap PU
COL 29 Strap PU
RX_ER 28 Strap PU
RX_DV 26 Strap PD
RX_D3 1 Strap PD
RX_D2 32 Strap PD
RX_D1 21 Strap PD
RX_D0 30 Strap PD
RX_CLK 25 O PD

(1) When in reset, TX_CLK is an output pin and low value is driven
on it. In RGMII mode, once device is out of reset, Tx_CLK is
configured as input.

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English Data Sheet: SNLS505
DP83822HF, DP83822IF, DP83822H, DP83822I
ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023 [Link]

7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AVD –0.5 3.8
VDDIO –0.5 3.8
Input voltage TD–, TD+, RD–, RD+ –0.5 6 V

VDDIO +
Other Inputs –0.5
0.3V
DC output voltage All pins –0.5 3.8 V
TJ Operating junction temperature 135 °C
Tstg Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under 节 7.3.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT

Human-body model (HBM), per ANSI/ All pins except pins 9, 10, 11, and 12 ±3000
ESDA/JEDEC JS-001(1) Pins 9, 10, 11, and 12 ±16000
V(ESD) Electrostatic discharge Charged-device model (CDM), per V
All pins ±1500
JEDEC specification JESD22-C101(2)
IEC 61000-4-2(3) Pins 9, 10, 11, and 12 ±8000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) IEC61000-4-2; 150 pF and 330 Ω, Contact Discharge, Class B.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply Voltage I/O (1.8-V Option) 1.71 1.8 1.89
VDDIO Supply Voltage I/O (2.5-V Option) 2.375 2.5 2.625 V
Supply Voltage I/O (3.3-V Option) 3.15 3.3 3.45
Supply Voltage Analog (3.3-V Option) 3.15 3.3 3.45
AVD(1) V
Supply Voltage Analog (1.8-V Option) 1.71 1.8 1.89
Supply Voltage Center Tap (3.3-V Option)
3.15 3.3 3.45
Center Tap (CT) Magnetic Center Tap
(1) V
Supply Voltage Analog (1.8V Option)
1.71 1.8 1.89
Magnetic Center Tap
Ambient Temperature: DP83822I and DP83822IF -40 85
TA °C
Ambient Temperature: DP83822H and DP83822HF -40 125

(1) Analog supply (AVD) and magnetic center tap must be at the same potential.

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 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

7.4 Thermal Information

DP83822
THERMAL METRIC(1) RHB (VQFN) UNIT
32 PINS
RθJA Junction-to-ambient thermal resistance 41.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.5 °C/W
RθJB Junction-to-board thermal resistance 14.1 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 14.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.4 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
3.3-V VDDIO
IOH = –4 mA
VOH High level output voltage 2.4 V
VDDIO = 3.3-V ±5%
IOL = 4 mA
VOL low level output voltage 0.4 V
VDDIO = 3.3-V ±5%
VIH High level input voltage VDDIO = 3.3-V ±5% 1.7 V
VIL Low level input voltage VDDIO = 3.3-V ±5% 0.8 V
2.5-V VDDIO
IOH = –4 mA
VOH High level output voltage VDDIO × 0.8 V
VDDIO = 2.5-V ±5%
IOL = 4 mA
VOL Low level output voltage 0.4 V
VDDIO = 2.5-V ±5%
VIH High level input voltage VDDIO = 2.5-V ±5% 1.5 V
VIL Low level input voltage VDDIO = 2.5-V ±5% 0.7 V
1.8-V VDDIO
IOH = –2 mA
VOH High level output voltage VDDIO – 0.4 V
VDDIO = 1.8-V ±5%
IOL = 2 mA
VOL Low level output voltage 0.4 V
VDDIO = 1.8-V ±5%
VIH High level input voltage VDDIO = 1.8-V ±5% 1.3 V
VIL Low level input voltage VDDIO = 1.8-V ±5% 0.5 V
DC CHARACTERISTICS
–40°C to 85°C –10 10
IIH Input high current (VIN = VCC) μA
85°C to 125°C –20 20
IIL Input low current (VIN = GND) –40°C to 125°C –10 10 μA

TRI-STATE output current -40°C to 85°C –10 10

IOZ μA
(VOUT = VCC, VOUT = GND) 85°C to 125°C –20 20
CXI/XO XO and XI capacitance(1) 0.8 pF
CIN Input capacitance(1) 5 pF
COUT Output capacitance(1) 5 pF

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7.5 Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RPU-POR Integrated pullup resistance Pins: RX_ER, LED_0, CRS, and kΩ
during latch-in (RESET and COL 37.5 50 62.5
Power-Up)
RPull-Up Integrated pullup resistance 6.75 9 11.25 kΩ
RPull-Down Integrated pulldown resistance 6.75 9 11.25 kΩ
PMD OUTPUTS
VOD MDI 10BASE-Te swing VOD can be controlled through Vpeak
#unique_21/ 1.54 1.75 1.96
unique_21_Connect_42_X3379
VOD MDI 100BASE-TX swing VOD can be controlled through Vpeak
#unique_21/ 0.95 1 1.05
unique_21_Connect_42_X3379
MDI 100BASE-TX voltage
VODsym 98% 100% 102%
symmetry
VOD MDI 100BASE-FX transmitter Differential output voltage pk- Vpk-pk
0.9 1 1.1
swing (1) pk(2)
Tr/f MDI 100BASE-FX transmitter 10%-90% Rise/Fall Time ns
0.5 1 1.5
rise/fall time(1)
Tj_out MDI 100BASE-FX transmitter ns
1.4
total jitter (1)
Vin MDI 100BASE-FX receiver input Input differential voltage pk-pk Vpk-pk
0.22 1.8
swing requirement (1)
Tj_in MDI 100BASE-FX receiver input Input jitter tolerance pk-pk UI
0.45
jitter requirement (1)

(1) Ensured by production test, characterization or design.

(2) Configurable through register 0x0403. Output variance is in range of +/-10%

7.6 Timing Requirements, Power-Up Timing

See (1) (2).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AVD (analog supply) ramp delay post VDDIO
(digital supply) ramp.
T1 Time from start of supply ramp –100 100 ms
AVD and VDDIO potential must not exceed 0.3
V prior to supply ramp.(3)
VDDIO ramp time 100 ms
AVD ramp time 100 ms
Post power-up stabilization time prior to MDC
preamble for register accesses. MDIO is pulled high for 32-bit
T2 200 ms
MDC preamble coming in any time after this max serial management initialization
wait time will be valid.
Hardware configuration latch-in time for power
T3 200 ms
up
Hardware configuration pins transition to output
T4 64 ns
drivers
Fast Link Pulse transmission delay post power
T5 1.5 s
up

(1) Ensured by production test, characterization or design.

(2) See 图 7-1.
(3) AVD ramping up after VDDIO ramp completion is preferred to avoid false detection of lower level of VDDIO in any corner case.

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7.7 Timing Requirements, Power-Up With Unstable XI Clock

See (1).
PARAMETER MIN NOM MAX UNIT
T1 Reset application after XI stabilization 1 us
T2 Reset pulse width 10 us

(1) See 图 7-2

7.8 Timing Requirements, Reset Timing

See (1) (2).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RESET pulse width XI clock must be stable for a minimum
T1 10 μs
of 1 μs during RESET pulse low time
Post RESET stabilization time prior to MDIO is pulled high for 32-bit serial
T2 2 ms
MDC preamble for register accesses management initialization
Hardware configuration latch-in time
T3 120 ns
for RESET
Hardware configuration pins transition
T4 64 ns
to output drivers
Fast Link Pulse transmission delay
T5 1.5 s
post RESET

(1) Ensured by production test, characterization or design.

(2) See 图 7-3.

7.9 Timing Requirements, Serial Management Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 MDC to MDIO (Output) Delay Time 0 10 ns
T2 MDIO (Input) to MDC Setup Time 10 ns
T3 MDIO (Input) to MDC Hold Time 10 ns
T4 MDC Frequency 2.5 25 MHz

(1) Ensured by production test, characterization or design.

(2) See 图 7-4.

7.10 Timing Requirements, 100 Mbps MII Transmit Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 TX_CLK High / Low Time 16 20 24 ns
T2 TX_D[3:0], TX_EN Data Setup to TX_CLK 10 ns
T3 TX_D[3:0], TX_EN Data Hold from TX_CLK 0 ns

(1) Ensured by production test, characterization or design.

(2) See 图 7-5.

7.11 Timing Requirements, 100 Mbps MII Receive Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 RX_CLK High / Low Time 16 20 24 ns
T2 RX_D[3:0], RX_DV and RX_ER Delay from RX_CLK rising 10 30 ns

(1) Ensured by production test, characterization or design.

(2) See 图 7-6.

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7.12 Timing Requirements, 10 Mbps MII Transmit Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 TX_CLK High / Low Time 190 200 210 ns
T2 TX_D[3:0], TX_EN Data Setup to TX_CLK 25 ns
T3 TX_D[3:0], TX_EN Data Hold from TX_CLK 0 ns

(1) Ensured by production test, characterization or design.

(2) See 图 7-7.

7.13 Timing Requirements, 10 Mbps MII Receive Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 RX_CLK High / Low Time 160 200 240 ns
T2 RX_D[3:0], RX_DV and RX_ER Delay from RX_CLK rising 100 300 ns

(1) Ensured by production test, characterization or design.

(2) See 图 7-8.

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 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

7.14 Timing Requirements, RMII Transmit Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 XI Clock Period 20 ns
T2 TX_D[1:0] and TX_EN Data Setup to XI rising 1.4 ns
T3 TX_D[1:0] and TX_EN Data Hold from XI rising 2 ns
T1 RMII Master Clock (RX_D3 Clock) Period 20 ns
RMII Master Clock (RX_D3 Clock) Duty Cycle 35% 65%
T2 TX_D[1:0] and TX_EN Data Setup to RMII Master Clock rising 4 ns
T3 TX_D[1:0] and TX_EN Data Hold from RMII Master Clock rising 2 ns

(1) Ensured by production test, characterization or design.

(2) See 图 7-9.

7.15 Timing Requirements, RMII Receive Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 XI Clock Period 20 ns
T2 RX_D[1:0], CRS_DV, RX_DV and RX_ER Delay from XI rising 4 14 ns
T1 RX_CLK Clock Period 20 ns
RX_D[1:0], CRS_DV, RX_DV and RX_ER Delay from RX_CLK rising
T2 Note: While working in 'RMII Receive Clock' mode, bit[0] in register 4 10 14 ns
0x000A
T1 RMII Master Clock (RX_D3 Clock) Period 20 ns
RMII Master Clock (RX_D3 Clock) Duty Cycle 35% 65%
RX_D[1:0], CRS_DV, RX_DV and RX_ER Delay from RMII Master
T2 4 10 14 ns
Clock rising

(1) Ensured by production test, characterization or design.

(2) See 图 7-10.

7.16 Timing Requirements, RGMII

See (1) (5).
PARAMETER MIN TYP MAX UNIT
SkewT Data to Clock output Skew (at Transmitter)(2) –500 0 ps
SkewR Data to Clock input Skew (at Receiver)(2) 1 1.8 ns
SetupT Data to Clock output Setup (at Transmitter - integrated delay)(3) 1.2 2 ns
HoldT Data to Clock output Hold (at Transmitter - integrated delay)(3) 1.2 2 ns
SetupR Data to Clock input Setup (at Receiver - integrated delay)(3) 1 2 ns
HoldR Data to Clock input Hold (at Receiver - integrated delay)(3) 1 2 ns
Tcyc_10 Clock Cycle Duration 10 Mbps 360 400 440 ns
Tcyc_100 Clock Cycle Duration 100 Mbps 36 40 44 ns
Duty_T Duty Cycle for 10/100 Mbps(4) 40% 50% 60%
Tr / Tf Rise / Fall Time (20-80%) 750 ps

(1) Ensured by production test, characterization or design.

(2) When operating without RGMII internal delay, the PCB design requires clocks to be routed such that an additional trace delay of
greater than 1.5 ns is added to the associated clock signal.
(3) Device may operate with or without internal delay.
(4) The duty cycle may be stretched or shrunk during speed changes or while transitioning to a received packet's clock domain as long as
minimum duty cycle is not violated and stretching occurs for no more than three Tcyc of the lowest speed transitioned between.
(5) See 图 7-11 and 图 7-12.

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7.17 Normal Link Pulse Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 Pulse Period 16 ms
T2 Pulse Width 100 ns

(1) Ensured by production test, characterization or design.

(2) See 图 7-13.

7.18 Auto-Negotiation Fast Link Pulse (FLP) Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 Clock Pulse to Clock Pulse Period 125 μs
T2 Clock Pulse to Data Pulse Period 62 μs
T3 Clock / Data Pulse Width 114 ns
T4 FLP Burst to FLP Burst Period 16 ms
T5 FLP Burst Width 2 ms

(1) Ensured by production test, characterization or design.

(2) See 图 7-14.

7.19 10BASE-Te Jabber Timing

See (1) (2).
PARAMETER MIN TYP MAX UNIT
T1 Jabber activation time 100 ms
T2 Jabber deactivation time 500 ms

(1) Ensured by production test, characterization or design.

(2) See 图 7-15.

7.20 100BASE-TX Transmit Latency Timing

See 图 7-16.
PARAMETER MIN TYP MAX UNIT
TX_CLK rising edge with TX_EN asserted to MDI start
T1 MII 48 56 ns
of /J/ symbol
RMII(1) 102 ns
RGMII(2) 170 ns

(1) With FAST_RXDV enabled. Register<0x0009>=0x0002.

(2) With FAST_RXDV enabled. Register<0x0009>=0x0002. and Register<0x0457>=0x0410

7.21 100BASE-TX Receive Latency Timing

See 图 7-17.
PARAMETER MIN TYP MAX UNIT
MDI start of /J/ symbol to RX_CLK rising edge with
T2 MII(1) 194 218 ns
RX_DV asserted
RMII(1) 272 ns
RGMII(2) 159 ns

(1) With FAST_RXDV enabled. Register<0x0009>=0x0002.

(2) With FAST_RXDV enabled. Register<0x0009>=0x0002. and Register<0x0457>=0x0410

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7.22 Timing Diagrams

tT1t

VVDDIO
t0.3 Vt
-0.3 Vt

VAVD/CT
t0.3 Vt
-0.3 Vt

XI

Hardware
RESET_N

32 Clocks
tT2t
MDC

tT3t
Latch-in

tT4
Active
I/O Pins

tT5t

FLP Burst

图 7-1. Power-Up Timing

VVDD

XI

T1 T2
RESETN

图 7-2. Power-Up With Unstable XI Input

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VVDD

XI

tT1

Hardware
RESET_N

32 Clocks
tT2

MDC

tT3

Latch-in

tT4
Active
I/O Pins

tT5t

FLP Burst

图 7-3. Reset Timing

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MDC

tT4t tT1t

MDIO
(output)

MDC

tT2t tT3t

MDIO
Valid Data
(input)

图 7-4. Serial Management Timing

tT1t tT1t

TX_CLK

tT2t tT3t

TX_D [3:0]
Valid Data
TX_EN

图 7-5. 100-Mbps Transmit Timing

tT1t tT1t

RX_CLK

tT2t

RX_D [3:0]
RX_DV Valid Data
RX_ER

图 7-6. 100-Mbps Receive Timing

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tT1t tT1t

TX_CLK

tT2t tT3t

TX_D [3:0]
Valid Data
TX_EN

图 7-7. 10-Mbps Transmit Timing

tT1t tT1t

RX_CLK

tT2t

RX_D [3:0]
RX_DV Valid Data
RX_ER

图 7-8. 10-Mbps Receive Timing

tT1t

XI
Master Clock

tT2t tT3t

TX_D[1:0]
Valid Data
TX_EN

图 7-9. RMII Transmit Timing

tT1t

XI
RX_CLK
Master Clock

tT2t

RX_D[1:0]
CRS_DV
Valid Data
RX_DV
RX_ER

图 7-10. RMII Receive Timing

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tTcyct

TX_CLK
(at transmitter)

SkewT

TX_D[3:0] Valid Data

TX_CTRL TX_EN TX_ER TX_EN

SkewR

TX_CLK
(at receiver)

图 7-11. RGMII Transmit Timing

tTcyct

Internal
RX_CLK
Delay
(at transmitter)
Added

SetupT

RX_D[3:0] Valid Data

tHoldTt

RX_CTRL RX_DV RX_ER RX_DV

HoldR
SetupR

RX_CLK
(at receiver)

图 7-12. RGMII Receive Timing

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tT1t

T2

Normal Link
Pulse(s)

图 7-13. Normal Link Pulse(s) Timing

tT1t

tT2t

T3 T3

Fast Link
Pulse(s)

Clock Data Clock Data

Pulse Pulse Pulse Pulse

tT4t

tT5t

FLP Bursts

FLP Burst

图 7-14. Fast Link Pulse Timing

TX_EN

tT2t

tT1t
PMD Output
Pair

COL

图 7-15. 10BASE-Te Jabber Timing

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TX_CLK

TX_EN

TX_D[*:0]

T1

PMD Output IDLE J/K DATA

图 7-16. 100BASE-TX Transmit Latency Timing

PMD Input Pair IDLE (J/K) DATA

T2
RX_DV

RX_CLK

图 7-17. 100BASE-TX Receive Latency Timing

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7.23 Typical Characteristics

mV per Div nS per Div mV per Div nS per Div

500 mV 20 ns 500 mV 80 ns

图 7-18. 100BASE-TX PMD Eye Waveform 图 7-19. 10BASE-Te Link Pulse Waveform

mV per Div nS per Div mV per Div μS per Div

500 mV 10 ns 500 mV 400 μs
图 7-20. 100BASE-FX Waveform 图 7-21. Auto-Negotiation Fast Link Pulses
Waveform

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8 Detailed Description
8.1 Overview
The DP83822 is a fully-featured, single-port Physical Layer transceiver for 10BASE-Te, 100BASE-TX and
100BASE-FX signaling. The device supports the standard Media Independent Interface (MII), Reduced Media
Independent Interface (RMII), and Reduced Gigabit Media Independent Interface (RGMII) for direct connection
to a Media Access Controller (MAC).
The device is designed for power supply flexibility by allowing for a range of I/O voltage interfaces (3.3 V, 2.5 V,
or 1.8 V) and options for analog voltage (1.8 V or 3.3 V) to reduce power consumption. Automatic supply
configuration within the DP83822 allows for any combination of VDDIO supply and AVD supply without the need
for additional configuration settings. The DP83822 uses mixed-signal processing to perform equalization, data
recovery, and error correction to achieve robust operation over CAT5 twisted-pair cable. The DP83822 not only
meets the requirements of IEEE 802.3u, but maintains high margins in terms of crosstalk and alien noise.
The DP83822 is also a pin-to-pin upgradeable option for the TLK105, TLK106, TLK105L, and TLK106L 10/100
Mbps Ethernet PHYs.

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8.2 Functional Block Diagram

MII / RGMII Option RMII Option

RX_DV / RX_CTRL
Serial Serial
TX_EN / TX_CTRL

RX_DV (optional)
Management Management

CRS / CRS_DV

CRS / RX_DV
RX_D[3:0]

RX_D[1:0]
TX_D[3:0]

TX_D[1:0]
RX_CLK
TX_CLK

RX_ER

RX_ER
TX_EN
MDIO

MDIO
MDC

MDC
COL

MII / RGMII / RMII Interface

TX RX
TX_CLK RX_CLK
Data Data

MII
10BASE-Te Registers 10BASE-Te

and and

100BASE-TX/FX 100BASE-TX/FX
Auto-Negotiation
Wake-on-LAN
Energy Efficient Ethernet

Transmit Block Clock Receive Block

Generation

DAC ADC

BIST

LED
Cable Diagnostics Auto-MDIX
Driver

Reference
TD± RD± LEDs
Clock

图 8-1. DP83822 Functional Block Diagram

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8.3 Feature Description

8.3.1 Energy Efficient Ethernet
[Link] EEE Overview
Energy Efficient Ethernet (EEE), defined by IEEE 802.3az, is a capability integrated into Layer 1 (Physical Layer)
and Layer 2 (Data Link Layer) to operate in Low Power Idle (LPI) mode. In LPI mode, power is saved during
periods of low packet utilization. EEE defines the protocol to enter and exit LPI mode without dropping the link or
corrupting packets. The transition time into and out of LPI mode is short enough to be transparent to the upper
layers within the OSI model.
The DP83822 EEE supports 100 Mbps and 10 Mbps speeds. In 10BASE-Te operation, EEE operates with a
reduced transmit amplitude that is fully interoperable with a 10BASE-T PHY.
[Link] EEE Negotiation
EEE is advertised during Auto-Negotiation. Auto-Negotiation is performed at power up, on management
command, after link failure, or due to user intervention. EEE is supported if and only if both link partners
advertise EEE capabilities. If EEE is not supported, all EEE functions are disabled and the MAC should not
assert LPI. To advertise EEE capabilities, the PHY needs to exchange an additional formatted next page and
unformatted next page in sequence.
EEE Negotiation can be activated in two ways:
• Hardware Bootstrapping
• Register Access
EEE Negotiation Advertisements can be activated using RX_D1 pin bootstrap. When RX_D1 is set to strap
mode 2 or mode 3, EEE capabilities will be advertised during the Auto-Negotiation process. EEE Negotiation
Advertisements can also be activated using regsiter access through the SMI. The DP83822 offers two different
ways of accessing EEE control registers within the PHY register set. IEEE 802.3az defines MMD3 and MMD7 as
the locations for EEE control and status registers. The MMD3 and MMD7 registers 0x3000, 0x3001, 0x3016,
0x703C, and 0x703D contain all the required controls and status indications for operating EEE. Additionally, the
DP83822 supports an EEE configuration bypass option that enables EEE control registers within Texas
Instruments' Vendor Specific DEVAD. This helps simplify configuration by allowing for a single DEVAD to be
used. The Energy Efficient Ethernet Configuration Register #2 (EEECFG2, address 0x04D0) contains controls
for enabling and selecting the pin allocation for TX_ER, which is part of the MAC transmit LPI command. The
Energy Efficient Ethernet Configuration Register #3 (EEECFG3, address 0x04D1) contains controls for EEE
configuration bypass.
8.3.2 Wake-on-LAN Packet Detection
Wake-on-LAN provides a mechanism to detect specific frames and notify the connected controller through either
register status change, GPIO indication or an interrupt flag. The WoL feature within the DP83822 allows for
connected devices residing above the Physical Layer to remain in a low power state until frames with the
qualifying credentials are detected. Supported WoL frame types include: Magic Packet, Magic Packet with
Secure-ON and Custom Pattern Match. When a qualifying WoL frame is received, the DP83822 WoL logic circuit
is able to generate a user defined event (either pulses or level change) through any of the GPIO pins or a status
interrupt flag to inform a connected controller that a wake event has occurred. Additionally, the DP83822
includes a CRC Gate to prevent invalid packets from triggering a wake-up event.
The Wake-on-LAN feature set includes:
• Identification of WoL frames in all supported speeds (100BASE-FX, 100BASE-TX and 10BASE-Te).
• Wakeup interrupt generation upon reception of a WoL frame.
• CRC error checking of WoL frames to prevent interrupt generation from invalid frames.
• Magic Packets with Secure-ON password and 64-byte Custom Pattern Match for security.

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[Link] Magic Packet Structure

When configured for Magic Packet detection, the DP83822 scans all incoming frames addressed to the node for
a specific data sequence. This sequence identifies the frame as a Magic Packet frame.
A Magic Packet frame must also meet the basic requirements for the LAN technology chosen, such as SOURCE
ADDRESS, DESTINATION ADDRESS (which may be the receiving station’s IEEE address or a BROADCAST
ADDRESS), and CRC.
The specific Magic Packet sequence consists of 16 duplications of the MAC address of this node, with no breaks
or interruptions, followed by Secure-ON password if security is enabled. This sequence can be located anywhere
within the packet, but must be preceded by a synchronization stream. The synchronization stream is defined as
6-bytes of 0xFF.

DEST (6 bytes)

SRC (6 bytes)

MISC (X bytes, X >= 0)

)) « )) (6 bytes)

MAGIC Pattern

DEST * 16

Secure-On Password (6 bytes) Only if Secure-On is Enabled

MISC (Y bytes, Y >= 0)

CRC (4 bytes)

图 8-2. Magic Packet Structure

[Link] Magic Packet Example

The following is an example Magic Packet for a Destination Address of 11h 22h 33h 44h 55h 66h and a secure-
on password 2Ah 2Bh 2Ch 2Dh 2Eh 2Fh:

DESTINATION SOURCE MISC FF FF FF FF FF FF

11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 11 22 33 44 55 66 11 22 33 44 55 66
11 22 33 44 55 66 2A 2B 2C 2D 2E 2F MISC CRC

[Link] Wake-on-LAN Configuration and Status

Wake-on-LAN functionality is configured through the Receive Configuration Register (RXFCFG, address
0x04A0). Wake-on-LAN status is reported in the Recieve Status Register (RXFS, address 0x04A1). Wake-on-
LAN interrupt flag configuration and status is located in the MII Interrupt Status Register #2 (MISR2, address
0x0013).

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8.3.3 Start of Frame Detect for IEEE 1588 Time Stamp

The DP83822 supports an IEEE 1588 indication pulse at the SFD (start frame delimiter) for receive and transmit
paths. The pulse can be delivered to any of the following pins: LED_0, LED_1 (GPIO1), COL (GPIO2), RX_D3
(GPIO3), INT/PWDN_N and CRS. The 1588 Time Stamp pulse indicates the actual time the symbol is presented
on the lines (for transmit), or the first symbol received (for receive). The exact timing of the pulse can be adjusted
via the IEEE 1588 PTP Configuration Register (PTPCFG, address 0x003F). Each increment of phase value is an
8-ns step.

Message Timestamp Point

Ethernet
First Octet following
Preamble Octet Start-of-Frame
Start-of-Frame
Delimiter

0 1 0 1 0 1 0 1 0 1 0 1 1 1 0 0 0 0 0 0 0

bit
time

图 8-3. IEEE 1588 Message Timestamp Point

There are three registers that are able to control the routing of the IEEE 1588 transmit and receive indications.
The IEEE 1588 PTP Pin Select Register (PTPPSEL, address 0x003E) is able to route both transmit and receive
indications to LED_0 (GPIO1), COL (GPIO2), CRS and INT/PWDN_N, which is also found in the TLK105L and
TLK106L PHYs. Two additional registers in the DP83822 allow for additional pin selections and a centralized
location for GPIO controls through the use of the IO MUX GPIO Control Register #1 and #2 (IOCTRL1 and
IOCTRL2, address 0x0462 and address 0x0463). After enabling/setting the RX_SFD and TX_SFD pins in
register IOCTRLx, please write the following two registers:
• Program (Register 0x0456 = value 0x000A)
• Program (Register 0x04A0 = value 0x1080)
– Please note register 0x04A0 is enabling "bit 7: WOL". This helps improve the accuracy of SFD detection
and is not a must change. This will not cause PHY to detect WoL packets, as WoL function needs
additional register configurations.
Note: A software reset has to be performed to load these register values (Register 0x001F = value 0x4000)
8.3.4 Clock Output
The DP83822 has several clock configuration options. An external crystal or CMOS-level oscillator provides the
stimulus for the internal PHY reference clock. The local reference clock acts as the central source for all clocking
within the device, excluding the pass-through clock option.
All clock configuration options are enabled using the DP83822 IO MUX GPIO Control Register #1 and #2
(IOCTRL1 IOCTRL2, address 0x0462 bits[14:12] for RX_D3 (GPIO3), address 0x0462 bits[6:4] for LED_1
(GPIO1), address 0x0463 bits[6:4] for COL (GPIO2)).
Clock options supported by the DP83822 include:
• MAC IF Clock
• XI Clock
• Free-Running Clock
• Recovered Clock
MAC IF Clock will operate at the same rate as the MAC interface selected. For MII operation, MAC IF Clock
frequency is 25 MHz. For RMII operation, MAC IF Clock frequency is 50 MHz. For RGMII operation, MAC IF
Clock frequency is 25 MHz. XI Clock is a pass-through option, which allows for the XI pin clock to be passed to a
GPIO pin. Please note that the clock is buffered prior to transmission out of the GPIOs, and output clock

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amplitude will be at the selected VDDIO level. Free-Running Clock is an internally generated 125-MHz free-
running clock. Recovered Clock is a 125-MHz recovered clock from a connected link partner.
8.4 Device Functional Modes
8.4.1 MAC Interfaces
[Link] Media Independent Interface (MII)
The Media Independent Interface is a synchronous 4-bit wide nibble data interface that connects the PHY to the
MAC in 100BASE-FX, 100BASE-TX and 10BASE-Te modes. The MII is fully compliant with IEEE 802.3-2002
clause 22.
The MII signals are summarized below:
表 8-1. MII Signals
FUNCTION PINS
TX_D[3:0]
Data Signals
RX_D[3:0]
TX_EN
Transmit and Receive Signals
RX_DV
CRS
Line-Status Signals
COL

TX_CLK

TX_EN

TX_D[3:0]

RX_CLK

PHY RX_DV MAC

RX_ER

RX_D[3:0]

CRS

COL

图 8-4. MII Signaling

Additionally, the MII interface includes the carrier sense signal (CRS), as well as a collision detect signal (COL).
The CRS signal asserts to indicate the reception or transmission of data. The COL signal asserts as an
indication of a collision which can occur during Half-Duplex mode when both transmit and receive operations
occur simultaneously.

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[Link] Reduced Media Independent Interface (RMII)

The DP83822 incorporates the Reduced Media Independent Interface (RMII) as specified in the RMII
specification from the RMII consortium. The purpose of this interface is to provide a reduced pin count alternative
to the IEEE 802.3u MII as specified in Clause 22. Architecturally, the RMII specification provides an additional
reconciliation layer on either side of the MII, but can be implemented in the absence of an MII. The DP83822
offers two types of RMII operations: RMII Slave and RMII Master. In RMII Slave operation, the DP83822
operates off of a 50-MHz CMOS-level oscillator connected to the XI pin and shares the same clock as the MAC.
In RMII Master operation, the DP83822 operates off of either a 25-MHz CMOS-level oscillator connected to XI
pin or a 25-MHz crystal connected across XI and XO pins. A 50-MHz output clock referenced from any of the
three DP83822 GPIOs is connected to the MAC.

备注
If RMII Master mode is configured through bootstraps, a 50-MHz output clock will automatically be
enabled on RX_D3 (GPIO3).

The RMII specification has the following characteristics:

• Supports 100BASE-FX, 100BASE-TX and 10BASE-Te.
• Single clock reference sourced from the MAC to PHY (or from an external source)
• Provides independent 2-bit wide transmit and receive data paths
• Uses CMOS signal levels, the same levels as the MII interface
In this mode, data transfers are two bits for every clock cycle using the internal 50-MHz reference clock for both
transmit and receive paths.
The RMII signals are summarized below:
表 8-2. RMII Signals
FUNCTION PINS
TX_D[1:0]
Data Signals
RX_D[1:0]
TX_EN
Transmit and Receive Signals
CRS_DV

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TX_EN

TX_D[1:0]

RX_CLK (optional)

PHY RX_DV (optional) MAC

RX_ER (optional)

RX_D[1:0]

CRS_DV

XI
(pin 23)

50-MHz Reference
Clock

图 8-5. RMII Slave Signaling

TX_EN

TX_D[1:0]

RX_CLK (optional)

PHY RX_DV (optional) MAC

RX_ER (optional)

RX_D[1:0]

CRS_DV

50-MHz Reference Clock

RX_D3
(pin 1)

25-MHz Reference
Clock

图 8-6. RMII Master Signaling

Data on TX_D[1:0] are latched at the PHY with reference to the clock edges on the XI pin. Data on RX_D[1:0]
are latched at the MAC with reference to the same clock edges on the XI pin. RMII operates at the same speed
in 10BASE-Te, 100BASE-TX and 100BASE-FX. In 10BASE-Te the data is 10 times slower than the reference

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clock, so transmit data is sampled every 10 clock cycles. Likewise, receive data is generated on every 10th clock
so that an attached MAC device can sample the data every 10 clock cycles.
In addition, RMII mode supplies an RX_DV signal that allows a simpler method of recovering receive data
without the need to separate RX_DV from the CRS_DV indication. RX_ER is also supported even though it is
not required by the RMII specification.
RMII includes a programmable elastic buffer to adjust for the frequency differences between the reference clock
and the recovered receive clock. The programmable elastic buffer minimizes internal propagation delay based
on expected maximum packet size and clock accuracy.
Table below indicates how to program the buffer FIFO based on the expected maximum packet size and clock
accuracy. It assumes that the RMII reference clock and the far-end transmitter clock have the same accuracy.
表 8-3. Recommended RMII Packet Sizes
START THRESHOLD LATENCY RECOMMENDED PACKET SIZE RECOMMENDED PACKET SIZE
RBR[1:0] TOLERANCE AT ±50 ppm AT ±100 ppm
1 (4-bits) 2 bits 2400 bytes 1200 bytes
2 (8-bits) 6 bits 7200 bytes 3600 bytes
3 (12-bits) 10 bits 12000 bytes 6000 bytes
4 (16-bits) 14 bits 16800 bytes 8400 bytes

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[Link] Reduced Gigabit Media Independent Interface (RGMII)

The DP83822 also supports Reduced Gigabit Media Independent Interface (RGMII) as specified by RGMII
version 2.0. RGMII is designed to reduce the number of pins required to connect the MAC and PHY. To
accomplish this goal, the control signals are multiplexed. Both rising and falling edges of the clock are used to
sample the control signal pin on the transmit and receive paths. For 10-Mbps operation, RX_CLK and TX_CLK
operate at 2.5 MHz. For 100-Mbps operation, RX_CLK and TX_CLK operate at 25 MHz.
The RGMII signals are summarized below:
表 8-4. RGMII Signals
FUNCTION PINS
TX_D[3:0]
Data Signals
RX_D[3:0]
TX_CTRL
Transmit and Receive Signals
RX_CTRL

TX_CLK

TX_CTRL

TX_D[3:0]

PHY MAC
RX_CLK

RX_CTRL

RX_D[3:0]

25-MHz Crystal or
CMOS-level
Oscillator

图 8-7. RGMII Signaling

During packet reception, RX_CLK may be stretched on either the positive or negative pulse to accommodate the
transition from the internal free running clock to a recovered clock (data synchronous). Additionally, when the
speed of the PHY changes, a similar clock stretching of the positive or negative pulses is allowed to prevent
clock glitches. Data may be duplicated on the falling edge of the clock because double data rate (DDR) is only
required for 1-Gbps operation, which is not supported by the DP83822.
The DP83822 supports in-band status indication. To help simplify detection of link status, speed and duplex, the
DP83822 provides inter-frame signals on RX_D[3:0] pins as specified in 表 8-5 below.
表 8-5. RGMII In-Band Status
RX_DV RX_D3 RX_D[2:1] RX_D0
0 Duplex Status: RX_CLK Clock Speed: Link Status:
Note: In-band status only valid 1 = Full-Duplex 00 = 2.5-MHz (10 Mbps) 1 = Valid link established
when RX_DV is low 0 = Half-Duplex 01 = 25-MHz (100 Mbps) 0 = Link not established
10 = Reserved
11 = Reserved

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8.4.2 Serial Management Interface

The Serial Management Interface provides access to the DP83822 internal register space for status information
and configuration. The SMI is compatible with IEEE 802.3 clause 22 and clause 45. The implemented register
set consists of the registers required by the IEEE 802.3 plus several others to provide additional visibility and
controllability of the DP83822.
The SMI includes the management clock (MDC) and the management input/output data pin (MDIO). MDC is
sourced by the external management entity, also called Station (STA), and can run at a maximum clock rate of
25 MHz. MDC is not expected to be continuous, and can be turned off by the external management entity when
the bus is idle.
MDIO is sourced by the external management entity and by the PHY. The data on the MDIO pin is latched on the
rising edge of the MDC. MDIO pin requires a pullup resistor (2.2 KΩ), which pulls MDIO high during IDLE and
turnaround.
Up to 32 PHYs can share a common SMI bus. To distinguish between the PHYs, a 5-bit address is used. During
power up or hardware reset, the DP83822 latches the PHY_AD[4:0] configuration pins to determine its address.
The management entity must not start an SMI transaction in the first cycle after power up or hardware reset. To
maintain valid operation, the SMI bus must remain inactive at least one MDC cycle after reset is deaserted. In
normal MDIO transactions, the register address is taken directly from the management-frame reg_addr field,
thus allowing direct access to 32 16-bit registers (including those defined in IEEE 802.3 and vendor specific).
The data field is used for both reading and writing. The Start code is indicated by a <01> pattern. This pattern
makes sure that the MDIO line transitions from the default idle line state. Turnaround is defined as an idle bit
time inserted between the Register Address field and the Data field. To avoid contention during a read
transaction, no device may actively drive the MDIO signal during the first bit of Turnaround. The addressed
DP83822 drives the MDIO with a zero for the second bit of turnaround and follows this with the required data.
For write transactions, the station-management entity writes data to the addressed DP83822, thus eliminating
the requirement for MDIO Turnaround. The Turnaround time is filled by the management entity by inserting
<10>.
表 8-6. SMI Protocol
SMI PROTOCOL <idle><start><op code><device addr><reg addr><turnaround><data><idle>
Read Operation <idle><01><10><AAAAA><RRRRR><Z0><XXXX XXXX XXXX XXXX><idle>
Write Operation <idle><01><01><AAAAA><RRRRR><10><XXXX XXXX XXXX XXXX><idle>

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[Link] Extended Register Space Access

The DP83822 SMI function supports read and write access to the extended register set using the Register
Control Register (REGCR, address 0x000D), the Data Register (ADDAR, address 0x000E), and the MDIO
Manageable Device (MMD) indirect method defined in IEEE 802.3ah Draft for Clause 22 for accessing the
Clause 45 extended register set.
The standard register set, MDIO registers 0 to 31, is accessed using the normal direct-MDIO access or the
indirect method, except for register REGCR and register ADDAR, which are accessed only using the normal
MDIO transaction. The SMI function will ignore indirect access to these registers.
REGCR is the MMD access control. In general, register REGCR[4:0] is the device address DEVAD that directs
any accesses of the ADDAR register to the appropriate MMD.
The DP83822 supports three MMD device addresses:
1. The Vendor-Specific device address DEVAD[4:0] = 11111 is used for general MMD register accesses.
2. DEVAD[4:0] = 00011 is used for Energy Efficient Ethernet MMD register accesses. Register names for
registers accessible at this device address are preceded by MMD3.
3. DEVAD[4:0] = 00111 is used for Energy Efficient Ethernet MMD registers accesses. Register names for
registers accessible at this device address are preceded by MMD7.
All accesses through register REGCR and ADDAR must use the correct DEVAD. Transactions with other
DEVAD are ignored. REGCR[15:14] holds the access function: address (00), data with no post increment (01),
data with post increment on writes only (11). Address (10) is not valid.
• ADDAR is the address/data MMD register. ADDAR is used in conjunction with REGCR to provide the access
to the extended register set. If register REGCR[15:14] is (00), then ADDAR holds the address of the
extended address space register. Otherwise, ADDAR holds the data as indicated by the contents of its
address register. When REGCR[15:14] is set to (00), accesses to register ADDAR modify the extended
register set address register. This address register must always be initialized in order to access any of the
registers within the extended register set.
• When REGCR[15:14] is set to (01), accesses to register ADDAR access the register within the extended
register set selected by the value in the address register.
• When REGCR[15:14] set to (10) is not a valid option.
• When REGCR[15:14] is set to (11), access to register ADDAR access the register within the extended
register set selected by the value in the address register. After that access is complete, for write access only,
the value in the address register is incremented. For read accesses, the value of the address register
remains unchanged.
The following sections describe how to perform operations on the extended register set using register REGCR
and ADDAR. The descriptions use the device address for general MMD register accesses (DEVAD[4:0] = 11111).
For register accesses to the MMD3 or MMD7 registers the corresponding device address would be used.

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[Link] Write Address Operation

To set the address register:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the register address to register ADDAR.
Subsequent writes to register ADDAR (step 2) continue to write the address register.
[Link] Read Address Operation
To read the address register:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Read the register address from register ADDAR.
Subsequent reads to register ADDAR (step 2) continue to read the address register.
[Link] Write (No Post Increment) Operation
To write a register in the extended register set:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the desired register address to register ADDAR.
3. Write the value 0x401F (data, no post increment function field = 01, DEVAD = 31) to register REGCR.
4. Write the content of the desired extended register set to register ADDAR.
Subsequent writes to register ADDAR (step 4) continue to rewrite the register selected by the value in the
address register.

备注
Steps (1) and (2) can be skipped if the address register was previously configured.

[Link] Read (No Post Increment) Operation

To read a register in the extended register set:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the desired register address to register ADDAR.
3. Write the value 0x401F (data, no post increment function field = 01, DEVAD = 31) to register REGCR.
4. Read the content of the desired extended register set in register ADDAR.
Subsequent reads to register ADDAR (step 4) continue to reading the register selected by the value in the
address register.

备注
Steps (1) and (2) can be skipped if the address register was previously configured.

[Link] Write (Post Increment) Operation

1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the desired register address to register ADDAR.
3. Write the value 0x801F (data, post increment function field = 10, DEVAD = 31) or the value 0xC01F (data,
post increment on writes function field = 11, DEVAD = 31) to register REGCR.
4. Write the content of the desired extended register set to register ADDAR.
Subsequent writes to register ADDAR (step 4) write the next higher addressed data register selected by the
value of the address register; the address register is incremented after each access.

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[Link] Read (Post Increment) Operation

To read a register in the extended register set and automatically increment the address register to the next
higher value following the write operation:
1. Write the value 0x001F (address function field = 00, DEVAD = 31) to register REGCR.
2. Write the desired register address to register ADDAR.
3. Write the value 0x801F (data, post increment function field = 10, DEVAD = 31) to register REGCR.
4. Read the content of the desired extended register set in register ADDAR.
Subsequent reads to register ADDAR (step 4) read the next higher addressed data register selected by the
value of the address register; the address register is incremented after each access.
[Link] Example Write Operation (No Post Increment)
The following example will demonstrate a write operation with no post increment. In this example, the MAC
impedance will be adjusted to 99.25 Ω using the IO MUX GPIO Control Register (IOCTRL, address 0x0461).
1. Write the value 0x001F to register 0x000D.
2. Write the value 0x0461 to register 0x000E. (Sets desired register to the IOCTRL)
3. Write the value 0x401F to register 0x000D.
4. Write the value 0x0400 to register 0x000E. (Sets MAC impedance to 99.25 Ω)
[Link] Example Read Operation (No Post Increment)
The following example will demonstrate a read operation with no post increment. In this example, the MMD7
Energy Efficient Ethernet Link Partner Ability Register (MMD7_EEE_LP_ABILITY, address 0x703D) will be read.
1. Write the value 0x0007 to register 0x000D.
2. Write the value 0x003D to register 0x000E. (Sets desired register to the MMD7_EEE_LP_ABILITY)
3. Write the value 0x4007 to register 0x000D.
4. Read the value of register 0x000E. (Data read is the value contained within the MMD7_EEE_LP_ABILITY)
8.4.3 100BASE-TX
[Link] 100BASE-TX Transmitter
The 100BASE-TX transmitter consists of several functional blocks which convert synchronous 4-bit nibble data,
as provided by the MII, to a scrambled MLT-3 125 Mbps serial data stream on the MDI. 4B5B encoding and
decoding is detailed in 表 8-7 below.
The transmitter section consists of the following funcitonal blocks:
1. Code-Group Encoder and Injection Block
2. Scrambler Block with Bypass Option
3. NRZ to NRZI Encoder Block
4. Binary to MLT-3 Converter / Common Driver Block
The bypass option for the functional blocks within the 100BASE-TX transmitter provides flexibility for applications
where data conversion is not always required. The DP83822 implements the 100BASE-TX transmit state
machine diagram as specified in the IEEE 802.3u Standard, Clause 24.

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表 8-7. 4B5B Code-Group Encoding / Decoding

NAME PCS 5B CODE-GROUP MII 4B NIBBLE CODE
DATA CODES
0 11110 0000
1 01001 0001
2 10100 0010
3 10101 0011
4 01010 0100
5 01011 0101
6 01110 0110
7 01111 0111
8 10010 1000
9 10011 1001
A 10110 1010
B 10111 1011
C 11010 1100
D 11011 1101
E 11100 1110
F 11101 1111
IDLE AND CONTROL CODES(1)
H 00100 HALT code-group - Error code
I 11111 Inter-Packet IDLE - 0000
J 11000 First Start of Packet - 0101
K 10001 Second Start of Packet - 0101
T 01101 First End of Packet - 0000
R 00111 Second End of Packet - 0000
P 00000 EEE LPI - 0001(2)
INVALID CODES
V 00001
V 00010
V 00011
V 00101
V 00110
V 01000
V 01100
V 10000
V 11001

(1) Control code-groups I, J, K, T and R in data fields will be mapped as invalid codes, together with RX_ER asserted.
(2) Energy Efficient Ethernet LPI must also have TX_ER / RX_ER asserted and TX_EN / RX_DV deasserted.

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[Link].1 Code-Group Encoding and Injection

The code-group encoder converts 4-bit (4B) nibble data generated by the MAC into 5-bit (5B) code-groups for
transmission. This conversion is required to allow control data to be combined with packet data code-groups.
Refer to 表 8-7 for 4B to 5B code-group mapping details.
The code-group encoder substitutes the first 8-bits of the MAC preamble with a J/K code-group pair (11000
10001) upon transmission. The code-group encoder continues to replace subsequent 4B preamble and data
nibbles with corresponding 5B code-groups. At the end of the transmit packet, upon the deassertion of transmit
enable (TX_EN) signal from the MAC, the code-group encoder injects the T/R code-group pair (01101 00111)
indicating the end of the frame.
After the T/R code-group pair, the code-group encoder continuously injects IDLEs into the transmit data stream
until the next transmit packet is detected (reassertion of transmit enable).
[Link].2 Scrambler
The scrambler is required to control the radiated emissions at the media connector and on the twisted-pair cable.
By scrambling the data, the total energy launched onto the cable is randomly distributed over a wide frequency
range. Without the scrambler, energy levels at the MDI and on the cable could peak beyond FCC limitations at
frequencies related to repeating 5B sequences (that is, continuous transmission of IDLEs).
The scrambler is configured as a closed loop linear feedback shift register (LFSR) with an 11-bit polynomial. The
output of the closed loop LFSR is X-ORd with the serial NRZ data from the code-group encoder. The result is a
scrambled data stream with sufficient randomization to decrease radiated emissions at certain frequencies by as
much as 20 dB.
A serial descrambler is used to de-scramble the received MLT3 decoded data. The descrambler has to generate
an identical data scrambling sequence (N) in order to recover the original unscrambled data (UD) from the
scrambled data (SD) as represented in the equations:
SD = (UD ⊕ N) (1)
UD = (SD ⊕ N) (2)
Synchronization of the descrambler to the original scrambling sequence (N) is achieved based on the knowledge
that the incoming scrambled data stream consists of scrambled IDLE data (which is continuous stream of 1’s).
After the descrambler has recognized 88 consecutive IDLE symbols (or ~18 5-bit IDLE codes) where an IDLE
symbol is bit decoded as ‘b1 after de-scrambling, it will synchronize to the receive data stream and generate
unscrambled data in the form of unaligned 5B code-groups. In order to maintain synchronization, the
descrambler must continuously monitor the validity of the unscrambled data that it generates. To ensure this the
received symbols are continuously monitored to check for any non-IDLE symbols received before start of packet
i.e. /J/K/. If 3 consecutive errors occur i.e. descrambled bits are received as ‘b0 but don’t represent /J/ symbol
the scrambler is forced to unlock state and reset to reacquire a synchronization. Similarly, if the symbol
following /J/ doesn’t match /K/ (i.e. the 2nd SSD symbol) the scrambler is forced to unlock state and reset to
reacquire a synchronization.
[Link].3 NRZ to NRZI Encoder
After the transmit data stream has been serialized and scrambled, the data must be NRZI encoded in order to
comply with the TP-PMD standard for 100BASE-TX transmission over Category-5 Unshielded twisted pair cable.
There is no ability to bypass this block within the DP83822. The NRZI data is sent to the 100 Mbps Driver.
[Link].4 Binary to MLT-3 Converter
The Binary to MLT-3 conversion is accomplished by converting the serial binary data stream output from the
NRZI encoder into two binary data streams with alternately phased logic one events. These two binary streams
are then fed to the twisted pair output driver which converts the voltage to current and alternately drives either
side of the transmit transformer primary winding, resulting in a minimal current MLT-3 signal.

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The 100BASE-TX MLT-3 signal sourced by the PMD Output Pair common driver is slew rate controlled. This
should be considered when selecting AC coupling magnetics to ensure TP-PMD Standard compliant transition
times (3 ns < Trise/fall < 5 ns).
The 100BASE-TX transmit TP-PMD function within the DP83822 is capable of sourcing only MLT-3 encoded
data. Binary output from the PMD Output Pair is not possible in 100 Mbps mode. Fully encoded MLT-3 on both
Tx+ and Tx- and can be configured by configuring Register 0x0404h (for example, in transformer-less designs).
[Link] 100BASE-TX Receiver
The 100BASE-TX receiver consists of several functional blocks which convert the scrambled MLT-3 125 Mbps
serial data stream to synchronous 4-bit nibble data that is provided to the MII.
The receive section consists of the following functional blocks:
1. Input and BLW Compensation
2. Signal Detect
3. Digital Adaptive Equalization
4. MLT-3 to Binary Decoder
5. Clock Recovery Module
6. NRZI to NRZ Decoder
7. Serial to Parallel
8. Descrambler
9. Code-Group Alignment
10. 4B/5B Decoder
11. Link Integrity Monitor
12. Bad SSD Detection
8.4.4 100BASE-FX
The DP83822 provides IEEE 802.3 compliant 100BASE-FX operation. Hardware bootstrap or register
configuration can be used to enable 100BASE-FX operation.
[Link] 100BASE-FX Transmit
In 100BASE-FX mode, the DP83822 transmit pins connect to an industry standard fiber transceiver through a
capacitively coupled circuit. During 100BASE-FX operation, the DP83822 transmit path will bypass the
scrambler and MLT-3 encoder so that only serialized 4B5B encoded NRZI data is transmitted at 125-MHz.
[Link] 100BASE-FX Receive
In 100BASE-FX mode, the DP83822 receive pins connect to an industry standard fiber transceiver through a
capacitively coupled circuit. During 100BASE-FX operation, the DP83822 receive path will bypass the MLT-3
decoder and scrambler. This allows for reception of serialized 4B5B encoded NRZI data at 125 MHz.
The DP83822 also has the added feature of a signal detection pin for direct connection to an industry standard
fiber transceiver. When enabling 100BASE-FX operation using the FX_EN bootstrap, AMDIX_EN bootstrap turns
into SD_EN bootstrap. If 100BASE-FX operation is enabled by setting FX_EN to either bootstrap mode 2 or 3,
SD_EN will enable signal detection pin, LED_1, when SD_EN is set to either bootstrap mode 3 or 4. Please see
表 8-10 for mode information regarding hardware bootstraps.

备注
100BASE-FX signal detect pin (LED_1) polarity is controlled by bit[0] in the Fiber General
Configuration Register (FIBER GENCFG, address 0x0465). By default, signal detect is an active
HIGH polarity.

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备注
TI recommends connecting Signal Detect pin from the Optical Transceiver to the LED_1 pin and
enable it using SD_EN bootstrap pin in 100BASE-FX mode. The LED_1 pin is not used in design and
that, if the electrical link between the fiber module and the DP83822 is broken, disconnected or
otherwise disrupted, the link will recover only by initiating a soft reset through MDIO/MDC interface.

8.4.5 10BASE-Te
The 10BASE-Te transceiver module is IEEE 802.3 compliant. It includes the receiver, transmitter, collision,
heartbeat, loopback, jabber, and link integrity functions, as defined in the standard.
[Link] Squelch
Squelch is responsible for determining when valid data is present on the differential receive inputs. The squelch
circuitry employs a combination of amplitude and timing measurements (as specified in the IEEE 802.3 10BASE-
Te standard) to determine the validity of data on the twisted-pair inputs.
The signal at the start of a packet is checked by the squelch, and any pulses not exceeding the squelch level
(either positive or negative, depending upon polarity) are rejected. When this first squelch level is exceeded
correctly, the opposite squelch level must then be exceeded no earlier than 50ns. Finally, the signal must again
exceed the original squelch level no earlier than 50ns to qualify as a valid input waveform, and not be rejected.
This checking procedure results in the typical loss of three preamble bits at the beginning of each packet. When
the transmitter is operating, five consecutive transitions are checked before indicating that valid data is present.
At this time, the squelch circuitry is reset.
[Link] Normal Link Pulse Detection and Generation
The link pulse generator produces pulses as defined in the IEEE 802.3 10BASE-Te standard. Each link pulse is
nominally 100 ns in duration and transmitted every 16 ms in the absence of transmit data. Link pulses are used
to check the integrity of the connection with the remote end.
[Link] Jabber
Jabber is a condition in which a station transmits for a period of time longer than the maximum permissible
packet length, usually due to a fault condition. The jabber function monitors the DP83822 output and disables
the transmitter if it attempts to transmit a packet of longer than legal size. A jabber timer monitors the transmitter
and disables the transmission if the transmitter is active for approximately 100ms. When disabled by the Jabber
function, the transmitter stays disabled for the entire time that the module's internal transmit enable is asserted.
This signal must be de-asserted for approximately 500ms (unjab time) before the Jabber function re-enables the
transmit outputs. The Jabber function is only available and active in 10BASE-Te mode.
[Link] Active Link Polarity Detection and Correction
Swapping the wires within the twisted-pair causes polarity errors. Wrong polarity affects 10BASE-Te
connections. 100BASE-TX is immune to polarity problems because it uses MLT-3 encoding. 10BASE-Te receive
block automatically detects reversed polarity.
8.4.6 Auto-Negotiation (Speed / Duplex Selection)
Auto-Negotiation provides a mechanism for exchanging configuration information between the two ends of a link
segment. This mechanism is implemented by exchanging Fast Link Pulses (FLP). FLPs are burst pulses that
provide the information used to communicate the abilities between two devices at each end of a link segment.
The DP83822 supports 100BASE-TX and 10BASE-Te modes of operation for Auto-Negotiation. 100BASE-FX is
not included in the Auto-Negotiation process. Auto-Negotiation ensures that the highest performance protocol is
selected based on the advertised abilities of the Link Partner and the local device. Auto-Negotiation can be
enabled or disabled in hardware, using the AN_EN bootstrap, or by regsiter configuration, using bit[12] in the
Basic Mode Control Register (BMCR, address 0x0000). For further details regarding Auto-Negotiation, refer to
Clause 28 of the IEEE 802.3 specification.

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8.4.7 Auto-MDIX Resolution

The DP83822 can determine if a “straight” or “crossover” cable is used to connect to the Link Partner. It
can automatically re-assign channel A and B to establish link with the Link Partner. Auto-MDIX resolution
precedes the actual Auto-Negotiation process that involves exchange of FLPs to advertise capabilities.
Automatic MDI/MDIX is described in IEEE 802.3 Clause 40, section 40.8.2. It is not a required implementation
for 10BASE-Te and 100BASE-TX. Auto-MDIX can also be used when operating the PHY in Forced modes.
Auto-MDIX can be enabled or disabled in hardware, using the AMDIX bootstrap, or by register configuration,
using bit[15] of the PHY Control Register (PHYCR, address 0x0019). When Auto-MDIX is disabled, the PMA is
forced to either MDI (“straight”) or MDIX (“crossover”). Manual configuration of MDI or MDIX can also be
accomplished in hardware, using the AMDIX bootstrap, or by register configuration, using bit[14] of the PHYCR.
Additionally, the DP83822 supports Fast Auto-MDIX configuration via register configuration to enable faster
MDIX resolution for link establishment. Fast Auto-MDIX can be enabled using bit[6] in the Control Register #1
(CR1, address 0x0009).

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8.4.8 Loopback Modes

There are several loopback options within the DP83822 that test and verify various functional blocks within the
PHY. Enabling loopback modes allow for in-circuit testing of the digital and analog data paths. The DP83822
may be configured to any one of the Near-End Loopback modes or to the Far-End (reverse) Loopback mode. MII
Loopback is configured using the Basic Mode Control Register (BMCR, address 0x0000). All other loopback
modes are enabled using the BIST Control Register (BISCR, address 0x0016). Except where otherwise noted,
loopback modes are supported for all speeds (10/100 Mbps and all MAC interfaces).
Reverse PCS Analog
Loopback Loopback Loopback

8 7 6 5 4 3 2 1
Transformer
Processing
Signal

RJ-45
PCS

AFE
MAC MII

MII Digital External

Loopback Loopback Loopback

图 8-8. Loopback Test Modes

[Link] Near-End Loopback

Near-End Loopback provides the ability to loop the transmitted data back to the receiver via the digital or analog
circuitry. The point at which the signal is looped back is selected using loopback control bits[3:0] in the BISCR
register. Auto-Negotiation and Auto-MDIX should be disabled before selecting the Near-End Loopback modes.
This constraint does not apply for external-loopback mode.
[Link] MII Loopback
MII Loopback is the shallowest loop through the PHY. It is a useful test mode to validate communications
between the MAC and the PHY. When in MII Loopback, data transmitted from a connected MAC on the TX path
is internally looped back in the DP83822 to the RX pins where it can be checked by the MAC.
MII Loopback is enabled by setting bit[14] in the BMCR.
[Link] PCS Loopback
PCS Loopback occurs in the PCS layer of the PHY. No signal processing is performed when using PCS
Loopback.
PCS Input Loopback is enabled by setting bit[0] in the BISCR.
PCS Output Loopback is enabled by setting bit[1] in the BISCR.
[Link] Digital Loopback
Digital Loopback includes the entire digital transmit and receive paths. Data is looped back prior to the analog
circuity.
Digital Loopback is enabled by setting bit[2] in the BISCR.
[Link] Analog Loopback
When operating in 10BASE-Te or 100BASE-TX mode, signals can be looped back after the analog front-end.
Analog Loopback requires 100-Ω terminations accross pins #1 and #2 as well as 100-Ω terminations accross
pins #3 and #6 at the RJ45.
Analog Loopback is enabled by setting bit[3] in the BISCR.

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[Link] Far-End (Reverse) Loopback

Far-End (Reverse) loopback is a special test mode to allow PHY testing with a link partner. In this mode, data
that is received from the Link Partner passes through the PHY’s receiver, is looped back at the MAC interface
and then transmitted back to the Link Partner. While in Reverse Loopback mode, all data signals that come from
the MAC are ignored.
Reverse Loopback is enabled by setting bit[4] in the BISCR.
8.4.9 BIST Configurations
The DP83822 incorporates an internal PRBS Built-in Self-Test (BIST) circuit to accommodate in-circuit testing
and diagnostics. The BIST circuit can be used to test the integrity of transmit and receive data paths. The BIST
can be performed using both internal loopbacks (digital or analog) or external loopback using a cable fixture. The
BIST simulates pseudo-random data transfer scenarios in format of real packets and Inter-Packet Gap (IPG) on
the lines. The BIST allows full control of the packet lengths and the IPG.
The BIST Packet Length is controlled using bits[10:0] in the BIST Control and Status Register #2 (BICSR2,
address 0x001C). The BIST IPG Length is controlled using bits[7:0] in the BIST Control and Status Register #1
(BICSR1, address 0x001B).
The BIST is implemented with independent transmit and receive paths, with the transmit clock generating a
continuous stream of a pseudo-random sequence. The device generates a 15-bit pseudo-random sequence for
BIST. Received data is compared to the generated pseudo-random data to determine pass/fail status. The
number of error bytes that the PRBS checker received is stored in bits[15:8] of the BICSR1. PRBS lock status
and sync can be read from the BIST Control Register (BISCR, address 0x0016).
The PRBS test can be put in a continuous mode by using bit[14] in the BISCR. In continuous mode, when the
BIST error counter reaches the maximum value, the counter starts counting from zero again. To read the BIST
error count, bit[15] in the BICSR1 must be set to '1'. This will lock the current value of the BIST errors for
reading. Please note that setting bit[15] also clears the BIST Error Counter.

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8.4.10 Cable Diagnostics

With the vast deployment of Ethernet devices, the need for a reliable, comprehensive and user-friendly cable
diagnostic tool is more important than ever. The wide variety of cables, topologies and connectors deployed
results in the need to non-intrusively identify and report cable faults. The TI cable-diagnostic unit provides
extensive information about cable integrity. The DP83822 offers the following capabilities in its Cable Diagnostic
tool kit:
• Time Domain Reflectometry (TDR)
[Link] TDR
The DP83822 uses Time Domain Reflectometry (TDR) to determine the quality of the cables, connectors and
terminations in addition to estimating the cable length. Some of the possible problems that can be diagnosed
include opens, shorts, cable impedance mismatch, bad connectors, termination mismatches, cross faults, cross
shorts and any other discontinuities along the cable.
The DP83822 transmits a test pulse of known amplitude (1 V) down each of the two pairs of an attached cable.
The transmitted signal continues down the cable and reflects from each cable imperfection, fault, connector and
from the end of the cable itself. After the pulse transmission, the DP83822 measures the return time and
amplitude of all these reflected pulses. This technique enables measuring the distance and magnitude
(impedance) of non-terminated cables (open or short), discontinuities (bad connectors) and improperly
terminated cables with ±1m accuracy.
For all TDR measurements, the transformation between time of arrival and physical distance is done by the
external host using minor computations (such as multiplication, addition and lookup tables). The host must know
the expected propagation delay of the cable, which depends, among other things, on the cable category (for
example, CAT5, CAT5e, or CAT6).
TDR measurement is allowed in the following scenarios:
• While the Link Partner is disconnected – cable is unplugged at the other side
• Link Partner is connected but remains “quiet” (for example, in power down mode)
• TDR could be automatically activated when the link fails or is dropped
TDR Auto-Run can be enabled by using bit[8] in the Control Regsiter #1 (CR1, address 0x0009). When a link
drops, TDR will automatically execute and store the results in the respective TDR Cable Diagnostic Location
Result Registers #1 - #5 (CDLRR, addresses 0x0180 to 0x0184) and the Cable Diagnostic Amplitude Result
Registers #1 - #5 (CDLAR, addresses 0x0185 to 0x0189). TDR can also be run manually using bit[15] in the
Cable Diagnostic Control Register (CDCR, address 0x001E). Cable diagnostic status is obtained by reading
bits[1:0] in the CDCR. Additional TDR functions including cycle averaging, bypass channel and crossover
disable can be found in the Cable Diagnostic Specific Control Register (CDSCR, address 0x0170).

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8.4.11 Fast Link Down Functionality

The DP83822 includes advanced link-down capabilities that support various real-time applications. The link-
down mechanism is configurable and includes enhanced modes that allow extremely fast link-drop reaction
times.
The DP83822 supports an enhanced link drop mechanism, also called Fast Link Drop (FLD), which shortens the
observation window for determining link. There are multiple ways of determining link status, which can be
enabled or disabled based on user preference. Fast Link Drop can be enabled in hardware with bootstrapping or
in software using register configuration. RX_D2 when strapped to either mode 2 or mode 3 will enable FLD at
power up or hardware reset. Additionally, FLD can be configured using the Control Register #3 (CR3, address
0x000B). Bits[3:0] and bit[10] allow for various FLD conditions to be enabled. When link drop occurs, indication
of a particular fault condition can be read from the Fast Link Down Status Register (FLDS, address 0x000F).
First Link Failure
Occurrence
Valid Link Low Quality Data / Link Loss

Link Drop

Link Loss
Indication
(Link LED)

图 8-9. Fast Link Down

Fast Link Down criteria include:

• RX Error Count - when a predefined number of 32 RX_ERs occur in a 10μs window, the link will be dropped.
• MLT3 Error Count - when a predefined number of 20 MLT3 errors occur in a 10μs window, the link will be
dropped.
• Low SNR Threshold - when a predefined number of 20 threshold crossings occur in a 10μs window, the link
will be dropped.
• Signal/Energy Loss - when the energy detector indicates energy loss, the link will be dropped.
The Fast Link Down functionality allows the use of each of these options separately or in any combination.

备注
Because this mode enables extremely quick reaction time, it is more exposed to temporary bad link-
quality scenarios.

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8.5 Programming
8.5.1 Hardware Bootstrap Configurations
The DP83822 uses the receive path functional pins as bootstrap options to place the device into specific modes
of operation. The values of these pins are sampled at power up or hardware reset, through either the RESET pin
or bit[15] in the PHY Reset Control Register (PHYRCR, address 0x001F).
The DP83822 bootstrap pins are 4-level, which are described in greater detail below.

备注
Because bootstrap pins may have alternate functions after reset is de-asserted, they should not be
connected directly to VCC or GND. pullup and pulldown resistors are required for proper operation.
Pins: COL, LED_0, CRS and RX_ER have internal pullup resistors. All other pins with bootstraps have
internal pulldown resistors. To account for the difference between the internal pullup and pulldown,
please reference 表 8-8 and 表 8-9 below for proper implementation.
LED_0 and LED_1 require parallel pullup or pulldown resistors when using the pin in conjunction with
an LED and current limiting resistor.

Configuration of the device may be done via 4-level strapping or via serial management interface. A pullup
resistor and a pulldown resistor of suggested values should be used to set the voltage ratio of the bootstrap pin
input and the supply to select one of the possible modes.
VDDIO VDDIO

VDDIO

RH 50 NŸ RH
±25%

9 NŸ
RL RL ±25%

图 8-10. Bootstrap Circuits

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表 8-8. Recommended 4-Level Strap Resistor Ratios(1)

MODE IDEAL RH (kΩ) IDEAL RL (kΩ)
PULLDOWN PINS (9 kΩ)
1 (Default) OPEN OPEN
2 10 2.49
3 5.76 2.49
4 2.49 OPEN
PULLUP PINS (50 kΩ)
1 OPEN 1.96
2 13 1.96
3 6.2 1.96
4 (Default) OPEN OPEN

(1) Strap resistors with 1% tolerance are recommended.

表 8-9. 4-Level Strap Voltage Ratios(1)

TARGET VOLTAGE MODE 1 MODE 2 MODE 3 MODE 4
Vmax (V) 0.098 x VDDIO 0.181 x VDDIO 0.277 x VDDIO VDDIO
Vtyp (V) 0 0.165 x VDDIO 0.252 x VDDIO VDDIO
Vmin (V) 0 0.148 x VDDIO 0.227 x VDDIO 0.694 x VDDIO

(1) Ensured by production test, characterization or design.

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表 8-10 describes the DP83822 configuration bootstraps:

表 8-10. 4-Level Strap Pins
PIN NAME PIN # DEFAULT STRAP FUNCTION DESCRIPTION
COL 29 [01] MODE FX_EN PHY_AD0 FX_EN:
1 0 0 Enables 100BASE-FX when set to ‘1’
PHY_AD0:
2 1 0 PHY Address bit[0]
3 1 1
4 (Default) 0 1
RX_D0 30 [10] MODE AN_1 PHY_AD1 AN_1:
1 (Default) 1 0 See 表 8-11 below
PHY_AD1:
2 0 0 PHY Address bit[1]
3 0 1
4 1 1
RX_D1 31 [00] MODE EEE_EN PHY_AD2 EEE_EN:
Enables EEE operation when set to '1'
1 (Default) 0 0
PHY_AD2:
2 1 0 PHY Address bit [2]
3 1 1
4 0 1
RX_D2 32 [00] MODE FLD_EN PHY_AD3 FLD_EN:
Enables Fast Link Drop when set to '1'.
1 (Default) 0 0
Energy Detection, Low SNR threshold and
2 1 0 RX_ER will be enabled.
3 1 1 PHY_AD3:
PHY Address bit[3]
4 0 1
RX_D3 1 [10] MODE AN_EN PHY_AD4 AN_EN:
1 (Default) 1 0 See 表 8-11 below
PHY_AD4:
2 0 0 PHY Address bit[4]
3 0 1
4 1 1
LED_0 17 [X1] MODE RESERVED AN_0 AN_0:
1 X 0 See 表 8-11 below

2 X Do Not Use(1)
3 X Do Not Use(1)
4 (Default) X 1
LED_1 24 [1X] Mode RESERVED No added functionality.
Do not use Mode 2 & 3
1 (Default) 0
2 Do Not Use(1)
3 Do Not Use(1)
4 1
CRS 27 [01] MODE LED_SPEED LED_CFG LED_CFG:
See below
1 0 0
LED_SPEED:
2 1 0 See 表 8-12 below
3 1 1
4 (Default) 0 1

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表 8-10. 4-Level Strap Pins (continued)

PIN NAME PIN # DEFAULT STRAP FUNCTION DESCRIPTION
RX_ER 28 [01] MODE RGMII_EN AMDIX_EN AMDIX_EN:
(SD_EN) Enables Auto-MDIX when set to '1'
RGMII_EN:
1 0 0
See 表 8-13 below
2 1 0 SD_EN:
3 1 1 Enables 100BASE-FX Signal Detection on
LED_1 when set to '1'. FX_EN strap must be
4 (Default) 0 1 enabled for SD_EN strap to be functional.
Signal Detection is Active HIGH, but polarity
can be changed using the Fiber General
Configuration Register (FIBER GENCFG,
address 0x0465).
RX_DV 26 [00] MODE XI_50 RMII_EN XI_50:
1 (Default) 0 0 See 表 8-13 below
RMII_EN:
2 1 0 See 表 8-13 below
3 0 1
4 1 1

(1) Makes the phy go into test mode. Should not be used in funtional mode.

表 8-11. Modes of Operation

FX_EN AN_EN AN_1 AN_0 Description
Force Modes
0 0 0 0 10BASE-Te, Half-Duplex
0 0 0 1 10BASE-Te, Full-Duplex
0 0 1 0 100BASE-TX, Half-Duplex
0 0 1 1 100BASE-TX, Full-Duplex
Advertised Modes
0 1 0 0 10BASE-Te, Half-Duplex
0 1 0 1 10BASE-Te, Half/Full-Duplex
0 1 1 0 10BASE-Te, Half-Duplex
100BASE-TX, Half-Duplex
0 1 1 1 10BASE-Te, Half/Full-Duplex
100BASE-TX, Half/Full-Duplex
Fiber Modes
1 X X 0 100BASE-FX, Half Duplex
1 X X 1 100BASE-FX, Full Duplex

表 8-12. LED Configuration

CRS Strap LED_SPEED LED_CFG[0] LED_0 LED_1
Mode
ON for Good Link LED_1 in Tri-State
1 0 0
BLINK for TX/RX Activity
ON for Good Link ON for 100 Mbps SPEED
2 1 0
BLINK for TX/RX Activity OFF for 10 Mbps SPEED
ON for Good Link ON for 100 Mbps SPEED
3 1 1
OFF for No Link OFF for 10 Mbps SPEED
ON for Good Link LED_1 in Tri-State
4 0 1
OFF for No Link

表 8-13. MAC Interface Configuration

RGMII_EN RMII_EN XI_50 Description
0 0 0 MII, 25-MHz Reference Clock

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表 8-13. MAC Interface Configuration (continued)

RGMII_EN RMII_EN XI_50 Description
0 0 1 Reserved
0 1 0 RMII, 25-MHz Reference Clock
0 1 1 RMII, 50-MHz Reference Clock
1 X 0 RGMII, 25-MHz Reference Clock
1 X 1 Reserved

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8.5.2 LED Configuration

The DP83822 supports up to three configurable Light Emitting Diode (LED) pins: LED_0, LED_1 (GPIO1), COL
(GPIO2) and RX_D3 (GPIO3). Several functions can be multiplexed onto the LEDs for different modes of
operation. The LED configuration modes are selected using the LEDs Configuration Register (LEDCFG1,
register 0x0460) and the Multi-LED Control Register (MLEDCR, register 0x0025). LED_0 and COL (GPIO2) use
the MLED function found in register 0x0025. MLED can be routed to only one of these two pins at a time. MLED
routing is determined by bits[1:0] in register 0x0025.
Because LED pins are also used as bootstrap pins, external components must be considered in order to avoid
contention. LED pins are automatically configured for the proper polarity based on the bootstrap configuration at
power up or hardware reset. If an LED pin is resistively pulled low, the corresponding output will be configured as
an active high driver. Conversely, if a given bootstrap input is resistively pulled high, the corresponding output
will be configured as an active low driver.
An example below shows proper bootstrap connections for LED pins using either pullup or pulldown
configurations.
Note: LED_0 and LED_1 require parallel pullup or pulldown resistors when using the pin in conjunction with an
LED and current limiting resistor. A 1.96kΩ to 2.49kΩ resistor should be used as the parallel pull resistor. When
LED pins are not used, they can be left floating.
Pull-Down
VDDIO

Strap Pin

D1 RCL

RP RP

RCL Pull-Up D1

Strap Pin

图 8-11. Example Strap Connections

8.5.3 PHY Address Configuration

The DP83822 can be configured for any of the 32 possible PHY addresses available through bootstrap
configuration. The PHY address is latched into the device upon power up or hardware reset. Each DP83822 or
port sharing PHY on the serial management bus in the system must have a unique PHY address. The DP83822
supports PHY address strapping values 0x0000 (0b00000) through 0x001F (0b11111).
By default, the DP83822 will latch-in PHY address 0x0001 (0b00001). This address can be changed by adding
the required pullup or pulldown resistors defined in the bootstrap section above.

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8.6 Register Maps

In the register definitions under the “TYPE” heading, the following definitions apply:
COR Clear on Read
Strap Default value loads from bootstrap pin after reset
LH Latched high and held until read
LL Latched low and held until read
RO Read Only Access
RO/COR Read Only, Clear on Read
RO/P Read Only, Permanently set to a default value
RW Read Write access
RW/SC Read Write access, Self Clearing bit
SC Register sets on event occurrence and Self-Clears when event ends

表 8-14. 0x0000 Basic Mode Control Register (BMCR)

BIT NAME TYPE DEFAULT FUNCTION

PHY Software Reset:

1 = Initiate software Reset / Reset in Progress
0 = Normal Operation
Writing a 1 to this bit resets the PHY PCS registers. When the reset
15 Reset RW, SC 0
operation is done, this bit is cleared to 0 automatically. PHY Vendor
Specific registers (with MMD = 1F) will not be cleared.
Straps are not re-latched with this reset. Straps are re-latched only
during power up and pin reset.

MII Loopback:
1 = MII Loopback enabled
14 MII Loopback RW 0 0 = Normal Operation
When MII loopback mode is activated, the transmitted data presented
on MII TXD is looped back to MII RXD internally.

Speed Select:
1 = 100 Mbps
13 Speed Selection RW, Strap 1 0 = 10 Mbps
When Auto-Negotiation is disabled (bit[12] = 0 in Register 0x0000),
writing to this bit allows the port speed to be selected.

Auto-Negotiation Enable:
1 = Enable Auto-Negotiation
12 Auto-Negotiation Enable RW, Strap 1 0 = Disable Auto-Negotiation
If Auto-Negotiation is disabled, bit[8] and bit[13] of this register
determine the port speed and duplex mode.

Power Down:
1 = IEEE Power Down
0 = Normal Operation
The PHY is powered down after this bit is set. Only register access is
enabled during this power down condition. To control the power down
11 IEEE Power Down RW 0
mechanism, this bit is OR'ed with the input from the INT/PWDN_N
pin. When the active low INT/PWDN_N is asserted, this bit is set.
Programmed register are not reset to default in power down. Since all
state machines undergo reset so status bits (RO) may show a change
in value.

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表 8-14. 0x0000 Basic Mode Control Register (BMCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Isolate:
10 Isolate RW 0 1 = Isolates the port from the MII with the exception of the SMI
0 = Normal Operation

Restart Auto-Negotiation:
1 = Restarts Auto-Negotiation
0 = Normal Operation
If Auto-Negotiation is disabled (bit[12] = 0), bit[9] is ignored. This bit is
9 Restart Auto-Negotiation RW, SC 0
self-clearing and will return a value of 1 until Auto-Negotiation is
initiated, whereupon it will self-clear. Operation of the Auto-
Negotiation process is not affected by the management entity clearing
this bit.

Duplex Mode:
1 = Full-Duplex
8 Duplex Mode RW, Strap 1 0 = Half-Duplex
When Auto-Negotiation is disabled, writing to this bit allows the port
Duplex capability to be selected.

Collision Test:
1 = Enable COL Signal Test
0 = Normal Operation
7 Collision Test RW 0
When set, this bit causes the COL signal to be asserted in response
to the assertion of TX_EN within 512 bit times. The COL signal is de-
asserted within 4 bit times in response to the de-assertion to TX_EN.

6:0 Reserved RO 0 Reserved

表 8-15. 0x0001 Basic Mode Status Register (BMSR)

BIT NAME TYPE DEFAULT FUNCTION

100Base-T4 Capable:
15 100Base-T4 RO 0
This protocol is not available. Always reads as 0.

100Base-TX Full-Duplex Capable:

14 100Base-TX Full-Duplex RO 1 1 = Device able to perform Full-Duplex 100Base-TX
0 = Device not able to perform Full-Duplex 100Base-TX

100Base-TX Half-Duplex Capable:

13 100Base-TX Half-Duplex RO 1 1 = Device able to perform Half-Duplex 100Base-TX
0 = Device not able to perform Half-Duplex 100Base-TX

10Base-Te Full-Duplex Capable:

12 10Base-Te Full-Duplex RO 1 1 = Device able to perform Full-Duplex 10Base-Te
0 = Device not able to perform Full-Duplex 10Base-Te

10Base-Te Half-Duplex Capable:

11 10Base-Te Half-Duplex RO 1 1 = Device able to perform Half-Duplex 10Base-Te
0 = Device not able to perform Half-Duplex 10Base-Te

10:7 Reserved RO 0 Reserved

Preamble Suppression Capable:

1 = Device able to perform SMI transaction with preamble suppressed
0 = Device not able to perform SMI transaction with preamble
6 SMI Preamble Suppression RO 1
suppressed
If this bit is set to 1, 32-bits of preamble needed only once after reset,
invalid opcode or invalid turnaround.

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表 8-15. 0x0001 Basic Mode Status Register (BMSR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Auto-Negotiation Complete:
1 = Auto-Negotiation process completed
5 Auto-Negotiation Complete RO 0
0 = Auto Negotiation process not completed (either still in process,
disabled or reset)

Remote Fault:
1 = Remote fault condition detected
4 Remote Fault RO, LH 0 0 = No remote fault condition detected
Far End Fault indication or notification from Link Partner of Remote
Fault. This bit is cleared on read or reset.

Auto-Negotiation Ability:
3 Auto-Negotiation Ability RO 1 1 = Device is able to perform Auto-Negotiation
0 = Device is not able to perform Auto-Negotiation

Link Status:
1 = Valid link established (for either 10 Mbps or 100 Mbps operation)
0 = Link not established
2 Link Status RO, LL 0
If link goes low anytime, this bit value will read 0 on first read after link
down event. Will get cleared to 1 only if status is read second time
after link-up.

Jabber Detect:
1 = Jabber condition detected
1 Jabber Detect RO, LH 0
0 = No jabber condition detected
This bit only has meaning for 10Base-Te operation.

Extended Capability:
0 Extended Capability RO 1 1 = Extended register capabilities
0 = Basic register set capabilities only

表 8-16. 0x0002 PHY Identifier Register #1 (PHYIDR1)

BIT NAME TYPE DEFAULT FUNCTION

Organizationally Unique 0010 0000

15:0 RO
Identifier Bits 21:6 0000 0000

表 8-17. 0x0003 PHY Identifier Register #2 (PHYIDR2)

BIT NAME TYPE DEFAULT FUNCTION

Organizationally Unique
15:10 RO 1010 00
Identifier Bits 5:0

Vendor Model Number:

9:4 Model Number RO 10 0100
The six bits of vendor model number are mapped from bits [9] to [4]

Model Revision Number:

3:0 Revision Number RO 0000 Four bits of the vendor model revision number are mapped from bits
[3:0]. This field is incremented for all major device changes.

表 8-18. 0x0004 Auto-Negotiation Advertisement Register (ANAR)

BIT NAME TYPE DEFAULT FUNCTION

Next Page Indication:

15 Next Page RW 0 1 = Next Page Transfer desired
0 = Next Page Transfer not desired

14 Reserved RO 0 Reserved

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表 8-18. 0x0004 Auto-Negotiation Advertisement Register (ANAR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Remote Fault:
13 Remote Fault RW 0 1 = Advertises that this device has detected a Remote Fault
0 = No Remote Fault detected

12 Reserved RO 0 Reserved

Asymmetric Pause Support For Full-Duplex Links:

11 Asymmetric Pause RW 0 1 = Advertise asymmetric pause ability
0 = Do not advertise asymmetric pause ability

Pause Support for Full-Duplex Links:

10 Pause RW 0 1 = Advertise pause ability
0 = Do not advertise pause ability

100Base-T4 Support:
9 100Base-T4 RO 0 1 = Advertise 100Base-T4 ability
0 = Do not advertise 100Base-T4 ability

100Base-TX Full-Duplex Support:

8 100Base-TX Full-Duplex RW, Strap 1 1 = Advertise 100Base-TX Full-Duplex ability
0 = Do not advertise 100Base-TX Full-Duplex ability

100Base-TX Half-Duplex Support:

7 100Base-TX Half-Duplex RW, Strap 1 1 = Advertise 100Base-TX Half-Duplex ability
0 = Do not advertise 100Base-TX Half-Duplex ability

10Base-Te Full-Duplex Support:

6 10Base-Te Full-Duplex RW, Strap 1 1 = Advertise 10Base-Te Full-Duplex ability
0 = Do not advertise 10Base-Te Full-Duplex ability

10Base-Te Half-Duplex Support:

5 10Base-Te Half-Duplex RW, Strap 1 1 = Advertise 10Base-Te Half-Duplex ability
0 = Do not advertise 10Base-Te Half-Duplex ability

Protocol Selection Bits:

4:0 Selector Field RW 0 0001
Technology selector field (IEEE802.3u <00001>)

表 8-19. 0x0005 Auto-Negotiation Link Partner Ability Register (ANLPAR)

BIT NAME TYPE DEFAULT FUNCTION

Next Page Indication:

15 Next Page RO 0 1 = Link partner desires Next Page Transfer
0 = Link partner does not desire Next Page Transfer

Acknowledge:
14 Acknowledge RO 0 1 = Link partner acknowledges reception of link code word
0 = Link partner does not acknowledge reception of link code word

Remote Fault:
13 Remote Fault RO 0 1 = Link partner advertises remote fault event detection
0 = Link partner does not advertise remote fault event detection

12 Reserved RO 0 Reserved

Asymmetric Pause:
11 Asymmetric Pause RO 0 1 = Link partner advertises asymmetric pause ability
0 = Link partner does not advertise asymmetric pause ability

Pause:
10 Pause RO 0 1 = Link partner advertises pause ability
0 = Link partner does not advertise pause ability

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表 8-19. 0x0005 Auto-Negotiation Link Partner Ability Register (ANLPAR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

100Base-T4 Support:
9 100Base-T4 RO 0 1 = Link partner advertises 100Base-T4 ability
0 = Link partner does not advertise 100Base-T4 ability

100Base-TX Full-Duplex Support:

8 100Base-TX Full-Duplex RO 0 1 = Link partner advertises 100Base-TX Full-Duplex ability
0 = Link partner does not advertise 100Base-TX Full-Duplex ability

100Base-TX Half-Duplex Support:

7 100Base-TX Half-Duplex RO 0 1 = Link partner advertises 100Base-TX Half-Duplex ability
0 = Link partner does not advertise 100Base-TX Half-Duplex ability

10Base-Te Full-Duplex Support:

6 10Base-Te Full-Duplex RO 0 1 = Link partner advertises 10Base-Te Full-Duplex ability
0 = Link partner does not advertise 10Base-Te Full-Duplex ability

10Base-Te Half-Duplex Support:

5 10Base-Te Half-Duplex RO 0 1 = Link partner advertises 10Base-Te Half-Duplex ability
0 = Link partner does not advertise 10Base-Te Half-Duplex ability

Protocol Selection Bits:

4:0 Selector Field RO 0 0000
Technology selector field (IEEE802.3 <00001>)

表 8-20. 0x0006 Auto-Negotiation Expansion Register (ANER)

BIT NAME TYPE DEFAULT FUNCTION

15:5 Reserved RO 0 Reserved

Parallel Detection Fault:

4 Parallel Detection Fault RO, LH 0 1 = A fault has been detected during the parallel detection process
0 = No fault detected

Link Partner Next Page Ability:

3 Link Partner Next Page Able RO 0 1 = Link partner is able to exchange next pages
0 = Link partner is not able to exchange next pages

Next Page Ability:

2 Local Device Next Page Able RO 1 1 = Local device is able to exchange next pages
0 = Local device is not able to exchange next pages

Link Code Word Page Received:

1 Page Received RO, LH 0 1 = A new page has been received
0 = A new page has not been received

Link Partner Auto-Negotiation Ability:

Link Partner Auto-Negotiation
0 RO 0 1 = Link partner supports Auto-Negotiation
Able
0 = Link partner does not support Auto-Negotiation

表 8-21. 0x0007 Auto-Negotiation Next Page Register (ANNPTR)

BIT NAME TYPE DEFAULT FUNCTION

Next Page Indication:

15 Next Page RW 0 1 = Advertise desire to send additional next pages
0 = Do not advertise desire to send additional next pages

14 Reserved RO 0 Reserved

Message Page:
13 Message Page RW 1 1 = Current page is a message page
0 = Current page is an unformatted page

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表 8-21. 0x0007 Auto-Negotiation Next Page Register (ANNPTR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Acknowledge2:
1 = Will comply with message
12 Acknowledge 2 RW 0 0 = Cannot comply with message
Acknowledge2 is used by the next page function to indicate that Local
Device has the ability to comply with the message received.

Toggle:
1 = Toggle bit in previously transmitted Link Code Word was 0
0 = Toggle bit in previously transmitted Link Code Word was 1
11 Toggle RO 0 Toggle is used by the Arbiitration function within Auto-Negotiation to
synchronize with the Link Parnter during Next Page exchange. This
bit always takes the opposite value of the Toggle bit in the previously
exchanged Link Code Word.

This field represents the code field of the next page transmission. If
the Message Page bit is set (bit [13] of this register), then the code is
interpreted as a Message Page, as defined in annex 28C of IEEE
000 0000
10:0 CODE RW 802.3u. Otherwise, the code is interperated as an Unformatted Page,
0001
and the interpretation is application specific.
The default value of the CODE represents a Null Page as defined in
Annex 28C of IEEE 802.3u.

表 8-22. 0x0008 Auto-Negotiation Link Partner Ability Next Page Register (ANLNPTR)
BIT NAME TYPE DEFAULT FUNCTION

Next Page Indication:

15 Next Page RO 0 1 = Advertise desire to send additional next pages
0 = Do not advertise desire to send additional next pages

Acknowledge:
14 Acknowledge RO 0 1 = Link partner acknowledges reception of link code word
0 = Link partner does not acknowledge reception of link code work

Message Page:
13 Message Page RO 0 1 = Current page is a message page
0 = Current page is an unformatted page

Acknowledge2:
1 = Will comply with message
12 Acknowledge 2 RO 0 0 = Cannot comply with message
Acknowledge2 is used by the next page function to indicate that Local
Device has the ability to comply with the message received.

Toggle:
1 = Toggle bit in previously transmitted Link Code Word was 0
0 = Toggle bit in previously transmitted Link Code Word was 1
11 Toggle RO 0 Toggle is used by the Arbiitration function within Auto-Negotiation to
synchronize with the Link Parnter during Next Page exchange. This
bit always takes the opposite value of the Toggle bit in the previously
exchanged Link Code Word.

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表 8-22. 0x0008 Auto-Negotiation Link Partner Ability Next Page Register (ANLNPTR) (continued)
BIT NAME TYPE DEFAULT FUNCTION

This field represents the code field of the next page transmission. If
the Message Page bit is set (bit 13 of this register), then the code is
interpreted as a Message Page, as defined in annex 28C of IEEE
0 0000
10:0 Message/ Unformatted Field RO 802.3u. Otherwise, the code is interperated as an Unformatted Page,
0000
and the interpretation is application specific.
The default value of the CODE represents a Null Page as defined in
Annex 28C of IEEE 802.3u.

表 8-23. 0x0009 Control Register #1 (CR1)

BIT NAME TYPE DEFAULT FUNCTION

15:10 Reserved RO 0 Reserved

RMII Enhanced Mode:

1 = Enable RMII Enhanced Mode
0 = RMII operated in normal mode
In normal RMII mode, if the line is not idle, CRS_DV goes high. As
soon as the False Carrier is detected, RX_ER is asserted and RXD is
set to "2" (0010). This situation remains for the duration of the receive
9 RMII Enhanced Mode RW 0 event. While in enhanced mode, CRS_DV is disqualified and de-
asserted when the False Carrier is detected. This status also remains
for the duration of the receive event. In addition, in normal mode, the
start of the packet is intact. Each symbol error is indicatied by setting
RX_ER high. The data on RXD is replaced with "1" starting with the
first symbol error. While in enhanced mode, the CRS_DV is de-
asserted with the first symbol error.

TDR Auto-Run at Link Down:

8 TDR Auto-Run RW 0 1 = Enable execution of TDR procedure after link down event
0 = Disable automatic execution of TDR

Link Loss Recovery:

1 = Enable Link Loss Recovery mechanism
0 = Normal Link Loss operation
7 Link Loss Recovery RW 0 This mode allows recovery from short interference and continue to
hold the link up for a few additional mSec until the short interference is
gone and the signal is OK. Under Normal Link Loss operation, Link
status will go down approximately 250μs from signal loss.

Fast Auto-MDIX:
1 = Enable Fast Auto-MDIX
0 = Normal Auto-MDIX
6 Fast Auto MDIX RW 0
If both link partners are configured to work in Force 100Base-TX
mode (Auto-Negotiation disabled), this mode enables Automatic MDI/
MDIX resolution in a shortened time.

Robust Auto-MDIX:
1 = Enable Robust Auto-MDIX
0 = Disable Auto-MDIX
If link partners are configured for operational modes that are not
5 Robust Auto MDIX RW 0 supported by normal Auto-MDIX, Robust Auto-MDIX allows MDI/
MDIX resolution and prevents deadlock.
When the DP83822 is strapped for 100 Mbps operation with Auto-
MDIX capabilities, Robust Auto-MDIX will be automatically set to aid
in MDI/MDIX resolution and deadlock prevention.

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表 8-23. 0x0009 Control Register #1 (CR1) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Fast Auto-Negotiation Enable:

1 = Enable Fast Auto-Negotiation
4 Fast Auto-Negotiation Enable RW 0 0 = Disable Fast Auto-Negotiation
The PHY Auto-Negotiaties using timer setting according to Fast Auto-
Negotiation Select bits (bits[3:2] in this register).

Fast Auto-Negotiation Select Bits:

Adjusting these bits reduces the time it takes to Auto-Negotiate
between two PHYs. In Fast Auto-Negotiation, both PHYs should be
set to the same configuration. These 2 bits define the duration for
each state of the Auto-Negotiation process according to the table
above. The new duration time must be enabled by setting "Fast Auto
Negotiation Enable" (bit [4] of this register). Note: Using this mode in
cases where both link partners are not configured to the same Fast-
Autonegotiation configuration might produce scenarios with
3:2 Fast Auto-Negotiation Select RW 0 unexpected behavior.

Fast Auto- Auto-

Break Link Link Fail Inhibit
Negotiation Negotitation
Timer Timer
Select Wait Timer

<00> 80 50 35

<01> 120 75 50

<10> 240 150 100

<11> NA NA NA

Fast RX_DV Detection:

1 = Enable Fast RX_DV detection
0 = Diable Fast RX_DV detection
1 Fast RX_DV Detection RW 0 When Fast RX_DV is enabled, RX_DV will assert high on receive
packet due to detection of the /J/ symbol only. If a consecutive /K/
does not appear, RX_ER is generated. In normal mode, RX_DV will
only be asserted after detection of /JK/.

0 Reserved RO 0 Reserved

表 8-24. 0x000A Control Register #2 (CR2)

BIT NAME TYPE DEFAULT FUNCTION

100Base-TX Force Far-End Link Drop:

Writing a 1 asserts the 100Base-TX Force Far-End link drop mode. In
100Base-TX Force Far-End this mode (only valid for 100 Mbps), the PHY disables the TX upon
15 RW 0
Link drop link drop to allow the far-end peer to drop its link as well, thus allowing
both link partners to be aware of the system link failure. This mode
exceeds the standard definition of force 100 Mbps.

100Base-FX Enable:
14 100Base-FX Enable RW, Strap 0 1 = 100Base-FX mode enabled
0 = 100Base-FX mode disabled

13:7 Reserved RW 00 0001 0 Reserved

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表 8-24. 0x000A Control Register #2 (CR2) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Fast Link-Up in Parallel Detect Mode:

1 = Enable Fast Link-Up time during Paralled Detection
6 Fast Link-Up in Parallel Detect RW 0 0 = Normal Parallel Detection Link establishment
In Fast Auto MDIX and in Robust Auto-MDIX modes (bit[6] and bit[5]
in register CR1), this bit is automatically set.

Extended Full-Duplex Ability:

1 = Enable Extended Full-Duplex Ability
0 = Diable Extended Full-Duplex Ability
In Extended Full-Duplex ability, when the PHY is set to Auto-
5 Extended Full-Duplex Ability RW 0
Negotiation or Force 100Base-TX and the link partner is operated in
Force 100Base-TX, the link is always Full-Duplex. When disabled, the
decision to work in Full-Duplex or Half-Duplex mode follows IEEE
specification.

Enhanced LED Link:

1 = LED ON only when link is 100Base-TX Full-Duplex mode
0 = LED ON when link is established
4 Enhanced LED Link RW 0
In Enhanced LED Link mode, TX/RX BLINK on activity is disabled for
this LED pin. LED will only indicate LINK for established 100Base-TX
Full-Duplex links.

Isolate MII:
1 = Isolate MII Enabled
Isolate MII in 100Base-TX Half- 0 = Normal MII output operation
3 RW 0
Duplex or 10Base-Te In Isolate MII, MII outputs are isolated when Half-Duplex link
established for 100Base-TX or when Half-Duplex or Full-Duplex link
established for 10Base-Te.

Detection of Receive Symbol Error During IDLE State:

2 RX_ER During IDLE RW 0 1 = Enable detection of Receive symbol error during IDLE state
0 = Disable detection of Receive symbol error during IDLE state

Detection of Transmit Error:

1 = Disable detection of transmit error in odd-nibble boundary
0 = Enable detection of transmit error in odd-nibble boundary
1 Odd-Nibble Detection Disable RW 0
Detection of odd-nibble will extend TX_EN by one additional TX_CLK
cycle and behaves as if TX_ER were asserted during that additional
cycle

RMII Receive Clock:

0 RMII Receive Clock RW 0 1 = RMII Data (RXD[1:0]) is sampled and referenced to RX_CLK
0 = RMII Data (RXD[1:0]) is sampled and referenced to XI

表 8-25. 0x000B Control Register #3 (CR3)

BIT NAME TYPE DEFAULT FUNCTION

15:13 Reserved RW 000 Reserved

12 Bypass Digital Equalizer Error RW 1 1 = Ignores the intermittent error output of digital equalizer

Descrambler Fast Link Drop:

1 = Drop the link on descrambler link loss
De-scrambler Fast Link Down
10 RW 0 0 = Do not drop the link on descrambler link loss
Mode
This option can be enabled in parallel to the other fast link down
modes in bits[3:0].

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表 8-25. 0x000B Control Register #3 (CR3) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Bypass Digital Equalizer

9 RW 0 1 = Bypass 0th coefficient of digital equalizer
Coefficient

8:7 Reserved RW 00 Reserved

Polarity Swap:
1 = Inverted polarity on both pairs: TD+ and TD-, RD+ and RD-
6 Polarity Swap RW 0 0 = Normal polarity
Port Mirror Function:
To enable port mirroring, set this bit and bit [5] high.

MDI/MDIX Swap:
1 = Swap MDI pairs (Receive on TD pair, Transmit on RD pair)
5 MDI/MDIX Swap RW 0 0 = MDI pairs normal (Receive on RD pair, Transmit on TD pair)
Port Mirror Function:
To enable port mirroring, set this bit and bit[6] high.

4 Reserved RW 0 Reserved

Fast Link Down Modes:

Bit 3 Drop the link based on RX Error count of the MII interface.
When a predefined number of 32 RX Error occurences in a 10μs
interval is reached, the link will be dropped.
Bit 2 Drop the link based on MLT3 Error count (Violation of the MLT3
coding in the DSP output). When a predefined number of 20 MLT3
Error occurences in a 10μs interval is reached, the link will be
dropped.
3:0 Fast Link Down Mode RW 0000 Bit 1 Drop the link based on Low SNR Threshold. When a
predefined number of 20 Threshold crossing occurences in a 10μs
interval is reached, the link will be dropped.
Bit 0 Drop the link based on Signal/Energy Loss indication. When
the Energy detector indicates Energy Loss, the link will be dropped.
Typical reaction time is 10μs.
The Fast Link Down function is an OR of all 5 options (bit[10] and
bits[3:0]), the designer can enable any combination of these
conditions.

表 8-26. 0x000D Register Control Register (REGCR)

BIT NAME TYPE DEFAULT FUNCTION

Extended Register Command:

00 = Address
15:14 Extended Register Command RW 0 01 = Data, no post increment
10 = Data, post increment on read and write
11 = Data, post increment on write only

13:5 Reserved RO 0 Reserved

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表 8-26. 0x000D Register Control Register (REGCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Device Address:
Bits[4:0] are the device address, DEVAD, that directs any accesses of
ADDAR register (0x000E) to the appropriate MMD. Specifically, the
DP83822 uses the vendor specific DEVAD [4:0] = "11111" for
4:0 DEVAD RW 0 accesses to registers 0x04D1 and lower. For MMD3 access, the
DEVAD[4:0] = '00011'. For MMD7 access, the DEVAD[4:0] = '00111'.
All accesses through registers REGCR and ADDAR should use the
DEVAD for either MMD, MMD3 or MMD7. Transactions with other
DEVAD are ignored.

表 8-27. 0x000E Data Register (ADDAR)

BIT NAME TYPE DEFAULT FUNCTION

If REGCR register bits[15:14] = '00', holds the MMD DEVAD's address

15:0 Address/Data RW 0
register, otherwise holds the MMD DEVAD's data.

表 8-28. 0x000F Fast Link Down Status Register (FLDS)

BIT NAME TYPE DEFAULT FUNCTION

15:9 Reserved RO 0 Reserved

Fast Link Down Status:

1 0000 = Descrambler Loss Sync
0 1000 = RX Errors
0 0100 = MLT3 Errors
8:4 Fast Link Down Status RO, LH 0 0 0010 = SNR Level
0 0001 = Signal/Energy Lost
Status Registers that latch high each time a given Fast Link Down
mode is activated and causes a link drop (assuming the modes were
enabled)

3:0 Reserved RO 0 Reserved

表 8-29. 0x0010 PHY Status Register (PHYSTS)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

MDI/MDIX Mode Status:

14 MDI/MDIX Mode RO 0 1 = MDI Pairs swapped (Receive on TD pair, Transmit on RD pair)
0 = MDI Pairs normal (Receive on RD pair, Transmit on TD pair)

Receive Error Latch:

1 = Receive error event has occurred
0 = No receive error event has occurred
13 Receive Error Latch RO, LH 0
Receive error event has occured since last read of RECR register
(address 0x0015). This bit will be cleared upon a read of the RECR
register.

Polarity Status:
1 = Inverted Polarity detected
0 = Correct Polarity detected
12 Polarity Status RO, LH 0
This bit is a duplication of bit[4] in the 10BTSCR register (address
0x001A). This bit will be cleared upon a read of the 10BTSCR
register, but not upon a read of the PHYSTS register.

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表 8-29. 0x0010 PHY Status Register (PHYSTS) (continued)

BIT NAME TYPE DEFAULT FUNCTION

False Carrier Sense Latch:

1 = False Carrier event has occurred
0 = No False Carrier event has occurred
11 False Carrier Sense Latch RO, LH 0
False Carrier event has occurred since last read of FCSCR register
(address 0x0014). This bit will be cleared upon a read of the FCSR
register.

Signal Detect:
Active high 100Base-TX unconditional Signal Detect indication from
10 Signal Detect RO, LL 0
PMD
Note: During EEE_LPI the value of this register bit should be ignored

Descrambler Lock:
9 Descrambler Lock RO, LL 0 Active high 100Base-TX Descrambler Lock indication from PMD
Note: During EEE_LPI the value of this register bit should be ignored

Link Code Word Page Received:

1 = A new Link Code Word Page has been received
8 Page Received RO 0 0 = Link Code Word Page has not been received
This bit is a duplicate of Page Received (bit[1]) in the ANER register
and it is cleared on read of the ANER register (address 0x0006).

MII Interrupt Pending:

1 = Indicates that an internal interrupt is pending
7 MII Interrupt RO, LH 0 0 = No interrupt pending
Interrupt source can be determined by reading the MISR register
(0x0012). Reading the MISR will clear this interrupt bit indication.

Remote Fault:
1 = Remote Fault condition detected
0 = No Remote Fault condition detected
6 Remote Fault RO 0
Fault criteria: notification from link partner of Remote Fault via Auto-
Negotiation. Cleared on read of BMSR register (address 0x0001) or
by reset.

Jabber Detection:
1 = Jabber condition detected
0 = No Jabber This bit is only for 10 Mbps operation.
5 Jabber Detect RO 0
This bit is a duplicate of the Jabber Detect bit in the BMSR register
(address 0x0001) and will not be cleared upon a read of the PHYSTS
register.

Auto-Negotiation Status:
4 Auto-Negotiation Status RO 0 1 = Auto-Negotiation complete
0 = Auto-Negotiation not complete

MII Loopback Status:

3 MII Loopback Status RO 0 1 = Loopback enabled
0 = Normal operation

Duplex Status:
2 Duplex Status RO 0 1 = Full-Duplex mode
0 = Half-Duplex mode

Speed Status:
1 Speed Status RO 1 1 = 10 Mbps mode
0 = 100 Mbps mode

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表 8-29. 0x0010 PHY Status Register (PHYSTS) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Link Status:
1 = Valid link established (for either 10 Mbps or 100 Mbps)
0 = No link established
0 Link Status RO 0
This bit is duplicated from the Link Status bit in the BMSR register
(address 0x0001) and will not be cleared upon a read of the PHYSTS
register.

表 8-30. 0x0011 PHY Specific Control Register (PHYSCR)

BIT NAME TYPE DEFAULT FUNCTION

Disable PLL:
1 = Disable internal clocks circuitry
15 Disable PLL RW 0
0 = Normal operation
Note: clock circuitry can be disabled only in IEEE power down mode.

Power Save Mode Enable:

14 Power Save Mode Enable RW 0 1 = Enable power save modes
0 = Normal operation

Power Saving Modes Selection Field:

Power Save Mode Enable (bit[14]) must be set to '1' for power save
modes to be enabled.

Power Mode Name Description

Normal operation mode. PHY is

<00> Normal
fully functional.

<01> Reserved Reserved

Low Power Active Energy Saving

mode that shuts down all internal
circuitry besides SMI and energy
13:12 Power Save Modes RW 00
detect functionalities. In this mode
<10> Active Sleep
the PHY sends NLP every 1.4
seconds to wake up link partner.
Automatic power-up is done when
link partner is detected.

Low Power Passive Energy

Saving mode that shuts down all
internal circuitry besides SMI and
<11> Passive Sleep
energy detect functionalities.
Automatic power-up is done when
link partner is detected.

Scrambler Bypass:
11 Scrambler Bypass RW 0 1 = Scrambler bypass enabled
0 = Scrambler bypass disabled

10 Reserved RW 0 Reserved

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表 8-30. 0x0011 PHY Specific Control Register (PHYSCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Far-End Loopback FIFO Depth:

00 = 4 nibbles FIFO
01 = 5 nibbles FIFO
10 = 6 nibbles FIFO
9:8 Loopback FIFO Depth RW 01
11 = 8 nibbles FIFO
This FIFO is used to adjust RX (receive) clock rate to TX clock rate.
FIFO depth needs to be set based on expected maximum packet size
and clock accuracy. Default value sets to 5 nibbles.

7:5 Reserved RO 0 Reserved

Collision in Full-Duplex Mode:

1 = Enable Collision generation signaling in Full-Duplex mode
4 COL Full-Duplex Enable RW 0
0 = Disable Collision in Full-Duplex mode
Note: When in Half-Duplex mode, Collision will always be active.

Interrupt Polarity:
3 Interrupt Polarity RW 1 1 = Normal operation is 1 logic and during interrupt is 0 logic
0 = Normal operation is 0 logic and during interrupt is 1 logic

Test Interrupt:
1 = Generate an interrupt
2 Test Interrupt RW 0 0 = Do not generate interrupt
Forces the PHY to generate an interrupt to facilitate interrupt testing.
Interrupts will continue to be generated as long as this bit remains set.

Interrupt Enable:
1 = Enable event based interrupts
1 Interrupt Enable RW 0 0 = Disable event based interrupts
Enable interrupt dependent on the event enables in the MISR register
(address 0x0012).

Interrupt Output Enable:

1 = INT/PWDN_N is an interrupt output
0 Interrupt Output Enable RW 0 0 = INT/PWDN_N is a Power Down pin
Enable active low interrupt events via the INT/PWDN_N pin by
configuring the INT/PWDN_N pin as an output.

表 8-31. 0x0012 MII Interrupt Status Register #1 (MISR1)

BIT NAME TYPE DEFAULT FUNCTION

Change of Link Quality Status Interrupt:

15 Link Quality Interrupt RO, LH 0 1 = Change of link quality when link is ON
0 = Link quality is Good

Change of Energy Detection Status Interrupt:

14 Energy Detect Interrupt RO, LH 0 1 = Change of energy detected
0 = No change of energy detected

Change of Link Status Interrupt:

13 Link Status Changed Interrupt RO, LH 0 1 = Change of link status interrupt is pending
0 = No change of link status

Change of Speed Status Interrupt:

12 Speed Changed Interrupt RO, LH 0 1 = Change of speed status interrupt is pending
0 = No change of speed status

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表 8-31. 0x0012 MII Interrupt Status Register #1 (MISR1) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Change of Duplex Status Interrupt:

11 Duplex Mode Changed Interrupt RO, LH 0 1 = Change of duplex status interrupt is pending
0 = No change of duplex status

Auto-Negotiation Complete Interrupt:

Auto-Negotiation Completed
10 RO, LH 0 1 = Auto-Negotiation complete interrupt is pending
Interrupt
0 = No Auto-Negotiation complete event is pending

False Carrier Counter Half-Full Interrupt:

1 = False Carrier HF interrupt is pending
False Carrier Counter Half-Full
9 RO, LH 0 0 = False Carrier HF event is not pending
Interrupt
False Carrier counter (Register FCSCR, address 0x0014) exceeds
half-full interrupt is pending.

Receiver Error Counter Half-Full Interrupt:

1 = Receive Error HF interrupt is pending
Receive Error Counter Half-Full
8 RO, LH 0 0 = Receive Error HF event is not pending
Interrupt
Receiver Error counter (Register RECR, address 0x0015) exceeds
half-full interrupt is pending.

7 Link Quality Interrupt Enable RW 0 Enable interrupt on change of link quality

6 Energy Detect Interrupt Enable RW 0 Enable interrupt on change of energy detection

5 Link Status Changed Enable RW 0 Enable interrupt on change of link status

Speed Changed Interrupt

4 RW 0 Enable Interrupt on change of speed status
Enable

Duplex Mode Changed Interrupt

3 RW 0 Enable Interrupt on change of duplex status
Enable

Auto-Negotiation Completed
2 RW 0 Enable Interrupt on Auto-negotiation complete event
Enable

1 False Carrier HF Enable RW 0 Enable Interrupt on False Carrier Counter Register half-full event

0 Receive Error HF Enable RW 0 Enable Interrupt on Receive Error Counter Register half-full event

表 8-32. 0x0013 MII Interrupt Status Register #2 (MISR2)

BIT NAME TYPE DEFAULT FUNCTION

Energy Efficient Ethernet Error Interrupt:

15 EEE Error Interrupt RO, LH 0 1 = EEE error has occurred
0 = EEE error has not occurred

Auto-Negotiation Error Interrupt:

14 Auto-Negotiation Error Interrupt RO, LH 0 1 = Auto-Negotiation error interrupt is pending
0 = No Auto-Negotiation error event pending

Page Receiver Interrupt:

13 Page Received Interrupt RO, LH 0 1 = Page has been received
0 = Page has not been received

Loopback FIFO Overflow/Underflow Event Interrupt:

Loopback FIFO OF/UF Event
12 RO, LH 0 1 = FIFO Overflow/Underflow event interrupt pending
Interrupt
0 = No FIFO Overflow/Underflow event pending

MDI/MDIX Crossover Status Change Interrupt:

MDI Crossover Change
11 RO, LH 0 1 = MDI crossover status changed interrupt is pending
Interrupt
0 = MDI crossover status has not changed

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表 8-32. 0x0013 MII Interrupt Status Register #2 (MISR2) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Sleep Mode Event Interrupt:

10 Sleep Mode Interrupt RO, LH 0 1 = Sleep mode event interrupt is pending
0 = No Sleep mode event pending

Polarity Change Interrupt / WoL Packet Received Interrupt:

Polarity Changed Interrupt /
9 RO, LH 0 1 = Data polarity interrupt pending / WoL packet was recieved
WoL Packet Received Interrupt
0 = No Data polarity pending / No WoL packet received

Jabber Detect Event Interrupt:

8 Jabber Detect Interrupt RO, LH 0 1 = Jabber detect event interrupt pending
0 = No Jabber detect event pending

7 EEE Error Interrupt Enable RW 0 Enable interrupt on EEE Error

Auto-Negotiation Error Interrupt

6 RW 0 Enable Interrupt on Auto-Negotiation error event
Enable

5 Page Received Interrupt Enable RW 0 Enable Interrupt on page receive event

4 Loopback FIFO OF/UF Enable RW 0 Enable Interrupt on loopback FIFO Overflow/Underflow event

3 MDI Crossover Change Enable RW 0 Enable Interrupt on change of MDI/X status

2 Sleep Mode Event Enable RW 0 Enable Interrupt on sleep mode event

Polarity Changed / WoL Packet

1 RW 0 Enable Interrupt on change of polarity status
Enable

0 Jabber Detect Enable RW 0 Enable Interrupt on Jabber detection event

表 8-33. 0x0014 False Carrier Sense Counter Register (FCSCR)

BIT NAME TYPE DEFAULT FUNCTION

15:8 Reserved RO 0 Reserved

False Carrier Event Counter:

This 8-bit counter increments on every false carrier event. This
7:0 False Carrier Event Counter RO, COR 0 counter stops when it reaches its maximum count (FFh). When the
counter exceeds half-full (7Fh), an interrupt event is generated. This
register is cleared on read.

表 8-34. 0x0015 Receive Error Count Register (RECR)

BIT NAME TYPE DEFAULT FUNCTION

RX_ER Counter:
When a valid carrier is presented (only while RXDV is set), and there
is at least one occurrence of an invalid data symbol, this 16-bit
counter increments for each receive error detected. The RX_ER
15:0 Receive Error Counter RO, COR 0
counter does not count in MII loopback mode. The counter stops
when it reaches its maximum count (FFFFh). When the counter
exceeds half-full (7Fh), an interrupt is generated. This register is
cleared on read.

表 8-35. 0x0016 BIST Control Register (BISCR)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

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表 8-35. 0x0016 BIST Control Register (BISCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

BIST Error Counter Mode:

1 = Continuous mode
0 = Single mode
14 BIST Error Counter Mode RW 0 Continuous mode, when the BIST Error counter reaches its max
value, a pulse is generated and the counter starts counting from zero
again. When in Single mode, if the BIST Error Counter reaches its
max value, PRBS checker will stop counting.

PRBS Checker:
1 = PRBS Checker Enabled
13 PRBS Checker RW 0 0 = PRBS Checker Disabled
When PRBS checker is enabled, DP83822 will check PRBS data
received.

Packet Generation Enable:

12 Packet Generation Enable RW 0 1 = Enable packet generator with PRBS data
0 = Disable packet generator

PRBS Checker Lock/Sync Indication:

11 PRBS Checker Lock/Sync RO 0 1 = PRBS checker is locked and synced on received bit stream
0 = PRBS checker is not locked

PRBS Checker Sync Loss Indication:

10 PRBS Checker Sync Loss RO, LH 0 1 = PRBS checker has lost sync
0 = PRBS checker has not lost sync

Packet Generation Status Indication:

9 Packet Generator Status RO 0 1 = Packet Generator is active and generating packets
0 = Packet Generator is off

Sleep Mode Indication:

8 Power Mode RO 1 1 = Indicates that the PHY is in normal power mode
0 = Indicates that the PHY is in one of the sleep modes

7 Reserved RO 0 Reserved

Transmit Data in MII Loopback Mode (valid only at 100 Mbps):

1 = Enable transmission
0 = Disable transmission
When enabled, data received from the MAC on the TX pins will be
6 Transmit in MII Loopback RW 0
routed to the MDI in parallel to the MII loopback (to RX pins). This bit
may be set only in MII Loopback mode - setting bit[14] in in BMCR
register (address 0x0000). When disabled, data from the MAC is not
transmitted to the MDI.

5 Reserved RO 0 Reserved

Loopback Mode Select:

The PHY provides several options for loopback that test and verify
various functional blocks within the PHY. Enabling loopback mode
allows in-circuit testing of the DP83822 digital and analog data paths
Near-end Loopback
4:0 Loopback Mode RW 0 00001 = PCS Input Loopback
00010 = PCS Output Loopback
00100 = Digital Loopback
01000 = Analog Loopback (requires 100-Ω termination) Far-end
Loopback
10000 = Reverse Loopback

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表 8-36. 0x0017 RMII and Status Register (RCSR)

BIT NAME TYPE DEFAULT FUNCTION

15:13 Reserved RO 0 Reserved

RGMII RX Clock Shift:

1 = Receive path internal clock shift is enabled
0 = Receive path internal clock shift is disabled
12 RGMII RX Clock Shift RW 0
When enabled, receive path internal clock (RX_CLK) is delayed by
3.5ns relative to recieve data. When disabled, data and clock are in
align mode.

RGMII TX Clock Shift:

1 = Transmit path internal clock shift is disabled
11 RGMII TX Clock Shift RW 0 0 = Transmit path internal clock shift is enabled
When enabled, transmit path internal clock (TX_CLK) is delayed by
3.5ns relative to transmit data.

RGMII TX Clock Sync:

1 = PHY and MAC share same clock reference
0 = PHY operates from same or independent clock source as MAC
10 RGMII TX Synced RW 0 This mode, when enabled, reduces latency since both MAC and PHY
are synchronized to the same clock source. This mode can also be
used when enabling the PHY Clock Output by connecting the MAC to
the PHY Output Clock.

RGMII Mode Enable:

9 RGMII Mode RW, Strap 0 1 = Enable RGMII mode of operation
0 = Mode determined by bit[5]

RMII TX Clock Shift:

8 RMII TX Clock Shift RW 0 1 = Transmit path internal clock shift is enabled
0 = Transmit path internal clock shift is disabled

RMII Reference Clock Select:

Strap XI_50 determines the clock reference requirement.
7 RMII Clock Select RW, Strap 0
1 = 50-MHz clock reference, CMOS-level oscillator
0 = 25-MHz clock reference, crystal or CMOS-level oscillator

RMII Recovered Clock Async FIFO Bypass:

0 = Bypass Asynchronous FIFO
RMII Recovered Clock Async 1 = Normal operation
6 RW 1
FIFO Bypass When in RMII Recovered Clock mode, the asynchronous FIFO can be
bypassed to reduce the receive path latency within the DP83822.
50-MHz clock is outputted on RX_CLK when in Async fifo bypass

RMII Mode Enable:

5 RMII Mode RW 0 1 = Enable RMII mode of operation
0 = Enable MII mode of operation

RMII Revision Select:

1 = RMII revision 1.0
0 = RMII revision 1.2
4 RMII Revision Select RW 0 RMII revision 1.0, CRS_DV will remain asserted until final data is
transferred. CRS_DV will not toggle at the end of a packet.
RMII revision 1.2, CRS_DV will toggle at the end of a packet to
indicate de-assertion of CRS.

RX FIFO Overflow Status:

3 RMII Overflow Status RO, COR 0 1 = Overflow detected
0 = Normal

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表 8-36. 0x0017 RMII and Status Register (RCSR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

RX FIFO Underflow Status:

2 RMII Underflow Status RO, COR 0 1 = Underflow detected
0 = Normal

Receive Elasticity Buffer Size:

This field controls the Receive Elasticity Buffer which allows for
frequency variation tolerance between the 50-MHz RMII clock and the
recovered data. The following values indicate the tolerance in bits for
a single packet. The minimum setting allows for standard Ethernet
1:0 Receive Elasticity Buffer Size RW 01 frame sizes at ±50ppm accuracy. For greater frequency tolerance, the
packet lengths may be scaled (for ±100ppm), divide the packet
lengths by 2). 00 = 14 bit tolerance (up to 16800 byte packets)
01 = 2 bit tolerance (up to 2400 byte packets)
10 = 6 bit tolerance (up to 7200 byte packets)
11 = 10 bit tolerance (up to 12000 byte packets)

表 8-37. 0x0018 LED Control Register (LEDCR)

BIT NAME TYPE DEFAULT FUNCTION

15:11 Reserved RO 0 Reserved

LED Blinking Rate (ON/OFF duration):

00 = 20Hz (50 ms)
10:9 Blink Rate RW 10 01 = 10Hz (100 ms)
10 = 5Hz (200 ms)
11 = 2Hz (500 ms)

8 Reserved RW 0 Reserved

LED_0 Link Polarity Setting:

1 = Active High polarity setting
7 LED_0 Polarity RW, Strap 0 0 = Active Low polarity setting
LED_0 polarity defined by strapping value of this pin. This register
allows for override of this strap value.

6:5 Reserved RW 0 Reserved

Drive Link LED_0 Select:

4 Drive LED_0 RW 0 1 = Drive value of ON/OFF bit[1] onto LED_0 output pin
0 = Normal operation

3:2 Reserved RW 0 Reserved

1 LED_0 ON/OFF Setting RW 0 Value to force LED_0 output

0 Reserved RW 0 Reserved

表 8-38. 0x0019 PHY Control Register (PHYCR)

BIT NAME TYPE DEFAULT FUNCTION

Auto-MDIX Enable:
15 Auto MDI/X Enable RW, Strap 0 1 = Enable Auto-Negotiation Auto-MDIX capability
0 = Disable Auto-Negotiation Auto-MDIX capability

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表 8-38. 0x0019 PHY Control Register (PHYCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Force MDIX:
1 = Force MDI pairs to cross (MDIX)
0 = Normal operation (MDI)
14 Force MDI/X RW 0
When Force MDI/X is enabled, receive data is on the TD pair and
transmit data is on the RD pair. When disabled, receive data is on the
RD pair and transmit data is on the TD pair.

Pause Receive Negotiation Status:

Indicates that pause receive should be enabled in the MAC. Based on
bits[11:10] in ANAR register and bits[11:10] in ANLPAR register
13 Pause RX Status RO 0
settings. The function shall be enabled according to IEEE 802.3
Annex 28B Table 28B-3, "Pause Resolution", only if the Auto-
Negotiation highest common denominator is a Full-Duplex technology.

Pause Transmit Negotiated Status:

Indicates that pause should be enabled in the MAC. Based on
bits[11:10] in ANAR register and bits[11:10] in ANLPAR register
12 Pause TX Status RO 0
settings. This function shall be enabled according to IEEE 802.3
Annex 28B Table 28B-3, "Pause Resolution", only if the Auto-
Negotiation highest common denominator is a Full-Duplex technology.

MII Link Status:

11 MII Link Status RO 0 1 = 100Base-TX Full-Duplex link is active
0 = No active 100Base-TX Full-Duplex link

10:8 Reserved RO 0 Reserved

Bypass LED Stretching:

1 = Bypass LED stretching
7 Bypass LED Stretching RW 0 0 = Normal LED operation
Set this bit to '1' to bypass the LED stretching, the LED reflects the
internal value.

6 Reserved RW 0 Reserved

Configuration LED_CFG LED_0

ON for LINK
1 1
5 LED Configuration RW, Strap 1 OFF for no LINK

ON for LINK
2 0
BLINK for TX/RX Activity

PHY Address:
4:0 PHY Address RO, Strap 0000 1
Strapping configuration for PHY Address

表 8-39. 0x001A 10Base-Te Status/Control Register (10BTSCR)

BIT NAME TYPE DEFAULT FUNCTION

15:14 Reserved RO 0 Reserved

Lower Receiver Threshold Enable:

1 = Enable 10Base-Te lower receiver threshold
13 Receiver Threshold Enable RW 0 0 = Normal 10Base-Te operation
When enabled, receiver threshold is lowered to allow for operation
with longer cables.

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表 8-39. 0x001A 10Base-Te Status/Control Register (10BTSCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Squelch Configuration: Used to set the Peak Squelch 'ON' threshold

for the 10Base-Te receiver. Starting from 200mV to 600mV, step size
of 50mV with some overlapping as shown below: 0000 = 200mV
0001 = 250mV
0010 = 300mV
12:9 Squelch RW 0000 0011 = 350mV
0100 = 400mV
0101 = 450mV
0110 = 500mV
0111 = 550mV
1000 = 600mV

8 Reserved RW 0 Reserved

NLP Transmission Control:

7 NLP Disable RW 0 1 = Disable transmission of NLPs
0 = Enable transmission of NLPs

6:5 Reserved RO 0 Reserved

Polarity Status:
1 = Inverted Polarity detected
0 = Correct Polarity detected
4 Polarity Status RO 0
This bit is a duplication of bit[12] in the PHYSTS register (0x0010).
Both bits will be cleared upon a read of 10BTSCR register, but not
upon a read of the PHYSTS register.

3:1 Reserved RO 0 Reserved

Jabber Disable:
1 = Jabber function disabled
0 Jabber Disable RW 0
0 = Jabber function enabled
Note: This function is only applicable in 10Base-Te operation.

表 8-40. 0x001B BIST Control and Status Register #1 (BICSR1)

BIT NAME TYPE DEFAULT FUNCTION

BIST Error Count:

Holds number of errored bytes received by the PRBS checker. Value
in this register is locked and cleared when write is done to bit[15].
15:8 BIST Error Count RO 0x0 When BIST Error Counter Mode is set to '0', count stops on 0xFF (see
register 0x0016)
Note: Writing '1' to bit[15] will lock the counter's value for successive
read operation and clear the BIST Error Counter.

BIST IPG Length:

Inter Packet Gap (IPG) Length defines the size of the gap (in bytes)
7:0 BIST IPG Length RW 0111 1101
between any 2 successive packets generated by the BIST. Default
value is 0x7D (equal to 500 bytes).

表 8-41. 0x001C BIST Control and Status Register #2 (BICSR2)

BIT NAME TYPE DEFAULT FUNCTION

15:11 Reserved RO 0 Reserved

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表 8-41. 0x001C BIST Control and Status Register #2 (BICSR2) (continued)

BIT NAME TYPE DEFAULT FUNCTION

BIST Packet Length:

101 1110 Length of the generated BIST packets. The value of this register
10:0 BIST Packet Length RW
1110 defines the size (in bytes) of every packet that is generated by the
BIST. Default value is 0x5EE, which is equal to 1518 bytes.

表 8-42. 0x001E Cable Diagnostic Control Register (CDCR)

BIT NAME TYPE DEFAULT FUNCTION

Cable Diagnostic Process Start:

1 = Start cable measurement
15 Cable Diagnostic Start RW 0 0 = Cable Diagnostic is disabled
Diagnostic Start bit is cleared once Diagnostic Done indication bit is
triggered.

000 0001
14:2 Reserved RO Reserved
0000 00

Cable Diagnostic Process Done:

1 Cable Diagnostic Status RO 1 1 = Indication that cable measurement process is complete
0 = Cable Diagnostic had not completed

Cable Diagnostic Process Fail:

0 Cable Diagnostic Test Fail RO 0 1 = Indication that cable measurement process failed
0 = Cable Diagnostic has not failed

表 8-43. 0x001F PHY Reset Control Register (PHYRCR)

BIT NAME TYPE DEFAULT FUNCTION

Software Reset:
1 = Reset PHY
15 Software Reset RW, SC 0
0 = Normal Operation
This bit is self cleared and has the same effect as Hardware reset pin.

Digital Restart:
1 = Restart PHY
14 Digital Restart RW, SC 0 0 = Normal Operation
This bit is self cleared and resets all PHY digital circuitry except the
registers.

13:0 Reserved RW 0 Reserved

表 8-44. 0x0025 Multi-LED Control Register (MLEDCR)

BIT NAME TYPE DEFAULT FUNCTION

15:10 Reserved RW 0 Reserved

MLED Polarity Swap:

The polarity of MLED depends on the routing configuration. If the pin
strap is Pull-Up then polarity is active low. If the pin strap is Pull-Down
9 MLED Polarity Swap RW Strap
then polarity is active high.
0 = Active Low (default when pin strapped HIGH)
1 = Active High (default when pin strapped LOW)

8:7 Reserved RW 0 Reserved

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表 8-44. 0x0025 Multi-LED Control Register (MLEDCR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

MLED Configurations:
000 0 = LINK OK
000 1 = RX/TX Activity
001 0 = TX Activity
001 1 = RX Activity
010 0 = Collision
010 1 = Speed, High for 100Base-TX
011 0 = Speed, High for 10Base-Te
011 1 = Full-Duplex
100 0 = LINK OK / BLINK on TX/RX Activity
6:3 MLED Configuration RW 000 0 100 1 = Active Stretch Signal
101 0 = MII LINK (100BT+FD)
101 1 = LPI Mode (EEE)
110 0 = TX/RX MII Error
110 1 = Link Lost
111 0 = Blink for PRBS error
111 1 = Reserved
Link Lost, LED remains ON until BMCR register (address 0x0001) is
read.
Blink for PRBS Errors, LED remains ON for single error and remains
until BICSR1 register (address 0x001B) is cleared.

2 Reserved RW 0 Reserved

MLED Route to LED_0:

00 = MLED routed to COL
1:0 MLED Route to LED_0 RW 00 01 = Reserved
10 = Reserved
11 = MLED routed to LED_0

表 8-45. 0x0027 Compliance Test Register (COMPT)

BIT NAME TYPE DEFAULT FUNCTION

15:5 Reserved RW 0 Reserved

10Base-Te Test Pattern Enable:

1 = Enable 10Base-Te Test Patterns
4 10Base-Te Test Patterns Enable RW 0 0 = Disable 10Base-Te Test Patterns
Note: Repetitive 1 and 0 for 10Base-Te test pattern cannot be used for
harmonics Compliance test.

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表 8-45. 0x0027 Compliance Test Register (COMPT) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Compliance Test Configuration Select:

Bit[4] in Register 0x0027 = 1, Enables 10Base-Te Test Patterns.
Bit[4] in Register 0x0428 = 1, Enables 100Base-TX Test Modes
Bits[3:0] select the 10Base-Te test pattern, as follows:
0000 = Single NLP
0001 = Single Pulse 1
0010 = Single Pulse 0
0011 = Repetitive 1
0100 = Repetitive 0
0101 = Preamble (repetitive ‘10’)
0110 = Single 1 followed by TP_IDLE
0111 = Single 0 followed by TP_IDLE
1000 = Repetitive ‘1001’ sequence
1001 = Random 10Base-Te data
1010 = TP_IDLE_00
1011 = TP_IDLE_01
1100 = TP_IDLE_10
1101 = TP_IDLE_11
3:0 Compliance Test Configuration RW 0000 100Base-TX Test Mode is determined by bits {[5] in register 0x0428,
[3:0] in register 0x0027}. The bits determine the number of 0's to
follow a '1'.
0,0001 = Single '0' after a '1'
0,0010 = Two '0' after a '1'
0,0011 = Three '0' after a '1'
0,0100 = Four '0' after a '1'
0,0101 = Five '0' after a '1'
0,0110 = Six '0' after a '1'
0,0111 = Seven '0' after a '1'
...
1,1111 = Thirty one '0' after a '1'
0,0000 = Clears the shift register
Note 1: To reconfigure the 100Base-TX Test Mode, bit[4] must be
cleared in register 0x0428 and then reset to '1' to configure the new
pattern.
Note 2: When performing 100Base-TX or 10Base-Te tests modes, the
speed must be forced using the Basic Mode Control Register
(BMCR), address 0x0000.

表 8-46. 0x003E IEEE 1588 PTP Pin Select Register (PTPPSEL)

BIT NAME TYPE DEFAULT FUNCTION

15:7 Reserved RO 0 Reserved

IEEE 1588 TX Pin Select:

Assigns transmit SFD pulse indication to pin selected by value
001 = Reserved
010 = Reserved
6:4 IEEE 1588 TX Pin Select RW 000 011 = LED_0 Pin
100 = CRS Pin
101 = COL Pin
110 = INT/PWDN_N Pin
111 = No pulse output

3 Reserved RO 0 Reserved

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表 8-46. 0x003E IEEE 1588 PTP Pin Select Register (PTPPSEL) (continued)
BIT NAME TYPE DEFAULT FUNCTION

IEEE 1588 RX Pin Select:

Assigns receive SFD pulse indication to pin selected by value
001 = Reserved
010 = Reserved
2:0 IEEE 1588 RX Pin Select RW 000 011 = LED_0 Pin
100 = CRS Pin
101 = COL Pin
110 = INT/PWDN_N Pin
111 = No pulse output

表 8-47. 0x003F IEEE 1588 PTP Configuration Register IEEE 1588 Precision Timing Configuration
Register (PTPCFG)
BIT NAME TYPE DEFAULT FUNCTION

PTP Transmit Timing:

15:13 PTP Transmit Timing RW 101
Set IEEE 1588 indication for TX path (8ns step)

PTP Receive Timing:

12:10 PTP Receive Timing RW 101
Set IEEE 1588 indication for RX path (8ns step)

Configure TX Error Input Pin:

00 = No TX Error
9:8 TX Error Input Pin RW 00 01 = Reserved
10 = Use INT/PWDN_N pin as TX error
11 = Use COL pin as TX error

Timer For De-scrambler Unlock

7:4 RW 1111
Based Link-Down

3:0 Reserved RW 1111 Reserved

表 8-48. 0x0040 Fiber Far-End Fault Generation/Detection Force

BIT NAME TYPE DEFAULT FUNCTION

15:14 Reserved RW 11 Reserved

13 Force 100 Mbps Link Enable RW 0 Forces PHY to enable Link at 100
Mbps regardless of link partner

12:7 Reserved RW 0 0001 0 Reserved

1=Far end fault generation is

6 FEF Gen Disable RW 0
disabled

1=Disable detection of far end

5 FEF Detect Disable RW 0
fault

4:0 Reserved RW 1 1101 Reserved

表 8-49. 0x0042 TX_CLK Phase Shift Register (TXCPSR)

BIT NAME TYPE DEFAULT FUNCTION

15:5 Reserved RO 0 Reserved

TX Clock Phase Shift Enable:

1 = Perform Phase Shift to TX_CLK
4 Phase Shift Enable RW, SC 0 0 = No change in TX_CLK phase
When enabled, TX_CLK phase shift is according to the value written
to TX Clock Phase Shift Value (bits[4:0]).

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表 8-49. 0x0042 TX_CLK Phase Shift Register (TXCPSR) (continued)

BIT NAME TYPE DEFAULT FUNCTION

TX Clock Phase Shift Value:

The value of this register represents the current phase shift between
Reference clock at XI and MII tramsmit clock at TX_CLK. Any different
3:0 Phase Shift Value RW 0000 value that will be written to these bits will shift TX_CLK by 4 times the
difference (in ns).
Example: If the value of the register is 0x0002, writing 0x0009 to this
register will shift TX_CLK by 28ns. (4 times 7ns)

表 8-50. 0x0101 DSP Configuration Register 1 (DSPCR1)

BIT NAME TYPE DEFAULT FUNCTION

15:8 Reserved RW 0010 0000 Reserved

1 = Disable internal filter during a

7 Internal Filter Disable RW 0
phase of link-up training

表 8-51. 0x0106 Digital Filter Configuration Register 1 (DFCR1)

BIT NAME TYPE DEFAULT FUNCTION

15:12 Internal Threshold For Filter RW 1011 Internal threshold to activate filter coefficients set1 for short cables.

11 Reserved 0 Reserved

10 Enable Filter Coefficient RW 0 1= Enable internal filter coefficient in steady state

9:8 Reserved RW 00 Reserved

7:6 Filter Coefficients RW 10 Filter coefficient values for long cables

5:4 Reserved RW 11 Reserved

3:0 Internal Threshold For Filter RW 1011 Internal threshold to activate filter coefficients set0 for short cables.

表 8-52. 0x0107 Digital Filter Configuration Register 2 (DFCR2)

BIT NAME TYPE DEFAULT FUNCTION

0000 0110
15:0 Reserved RW Reserved
0000 0101

表 8-53. 0x010F DSP Configuration Register 2 (DSPCR2)

BIT NAME TYPE DEFAULT FUNCTION

15:9 Reserved RW 0000 001 Reserved

8 DSP Loop Input RW 1 Selects the type of input for the gain correction loop

7:0 Reserved RW 0000 0000 Reserved

表 8-54. 0x0111 DSP Configuration Register 3 (DSPCR3)

BIT NAME TYPE DEFAULT FUNCTION

15:4 Reserved RW 0110 0000 0000 Reserved

3:0 Starting Gain Index RW 011 Initial value of gain index

表 8-55. 0x0114 Digital Feedback Equalizer Control Register (DFECR)

BIT NAME TYPE DEFAULT FUNCTION

0100 0000
15:0 Reserved RW Reserved
0000 1010

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表 8-56. 0x0116 AGC Bandwidth Control Register (AGCBCR)

BIT NAME TYPE DEFAULT FUNCTION

0000 0001
15:0 Reserved RW Reserved
0100 1010

表 8-57. 0x0121 MSE Threshold To Enter Recovery State From Steady State
BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Ignore on read

14:0 Bad MSE Threshold RW 001 1001 1001 1010 Bad MSE threshold for 100M

表 8-58. 0x0122 MSE Threshold For Timing Loop

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Ignore on read

14:0 Good MSE1 Threshold RW 001 0000 0010 0111 Good MSE1 threshold for 100M

表 8-59. 0x0123 MSE Threshold For Link-up

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Ignore on read

14:0 Good MSE2 Threshold RW 000 0101 0001 1100 Good MSE2 threshold for 100M

表 8-60. 0x0126 Digital Equalizer Timer Register (DETR)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RW 0 Reserved

14:12 Training Timer 1 RW 100 Timer value used for DSP state shift

11:6 Training Timer 2 RW 0110 00 Timer value used in timing loop

5:3 Training Timer 3 RW 011 Timer value used in gain loop

2:0 Training Timer 4 RW 011 Timer value used in gain loop

表 8-61. 0x0129 DSP Configuration Register 4 (DSPCR4)

BIT NAME TYPE DEFAULT FUNCTION

15:8 Reserved RW 0000 0000 Reserved

7:4 Max Gain Index RW 0000 Limit of max gain index

3:0 Min Gain Index RW 1111 Limit of min gain index

表 8-62. 0x0130 DSP Configuration Register 5 (DSPCR5)

BIT NAME TYPE DEFAULT FUNCTION

15:12 Reserved RW 0000 Reserved

11 Disable Gain Retrain RW 0 1 = Disable Gain Retraining

10:0 Reserved RW 000 0000 0001 Reserved

表 8-63. 0x0155 ALCD Control and Results 1 Register (ALCDRR1)

BIT NAME TYPE DEFAULT FUNCTION

Active Link Cable Diagnostic Start:

15 ALCD Start Test SC 0 1 = Start ALCD test
0 = Do not start ALCD test

14:13 Reserved RO 00 Reserved

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表 8-63. 0x0155 ALCD Control and Results 1 Register (ALCDRR1) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Active Link Cable Diagnostic Status:

12 ALCD Test Status RO 0 1 = ALCD is not complete
0 = ALCD is complete

11:4 ALCD Sum Out RO 0000 0000

3:0 Reserved RW 0001 Reserved

表 8-64. 0x0170 Cable Diagnostic Specific Control Register (CDSCR)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Cross TDR Diagnostic Mode:

1 = Disable TDR Cross Mode
14 Cable Diagnostic Cross Disable RW 0 0 = Enable TDR Cross Mode
When enabled, the TDR mechanism is looking for reflection on the
other pair to check for shorts between pairs.

TD Diagnostic Bypass:
1 = Bypass TD pair diagnostic
13 Cable Diagnostic TD Bypass RW 0
0 = TDR is executed on TD pair
When enabled, TDR on TD pair will not be executed.

RD Diganostic Bypass:
1= Bypass RD pair diagnostic
12 Cable Diagnostic RD Bypass RW 0
0 = TDR is executed on RD pair
When enabled, TDR on RD pair will not be executed.

11 Reserved RW 1 Reserved

Number of TDR Cycles to Average:

000 = 1 TDR cycle
001 = 2 TDR cycles
010 = 4 TDR cycles
Cable Diagnostic Average
10:8 RW 110 011 = 8 TDR cycles
Cycles
100 = 16 TDR cycles
101 = 32 TDR cycles
110 = 64 TDR cycles
111 = Reserved

7:0 Reserved RW 0101 0010 Reserved

表 8-65. 0x0171 Cable Diagnostic Specific Control Register 2 (CDSCR2)

BIT NAME TYPE DEFAULT FUNCTION

1100 1000
15:4 Reserved RW Reserved
0101

3:0 TDR Pulse Control RW 1100 Configure expected self reflection in TDR

表 8-66. 0x0173 Cable Diagnostic Specific Control Register 3 (CDSCR3)

BIT NAME TYPE DEFAULT FUNCTION

15:8 Cable Length Configuration RW 1111 1111 Configure duration of listening to detect long cable reflections

7:0 Reserved RW 0001 1110 Reserved

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表 8-67. 0x0177 Cable Diagnostic Specific Control Register 4 (CDSCR4)

BIT NAME TYPE DEFAULT FUNCTION

15:13 Reserved RW 000 Reserved

12:8 Short Cables Threshold RW 1 1000 Threshold to compensate for strong reflections in short cables

7:0 Reserved RW 1001 1011 Reserved

表 8-68. 0x0180 Cable Diagnostic Location Result Register #1 (CDLRR1)

BIT NAME TYPE DEFAULT FUNCTION

Location of the Second peak discovered by the TDR mechanism on

15:8 TD Peak Location 2 RO 0000 0000 Transmit Channel (TD). The value of these bits need to be translated
into distance from the PHY.

Location of the First peak discovered by the TDR mechanism on

7:0 TD Peak Location 1 RO 0000 0000 Transmit Channel (TD). The value of these bits need to be translated
into distance from the PHY.

表 8-69. 0x0181 Cable Diagnostic Location Result Register #2 (CDLRR2)

BIT NAME TYPE DEFAULT FUNCTION

Location of the Fourth peak discovered by the TDR mechanism on

15:8 TD Peak Location 4 RO 0000 0000 Transmit Channel (TD). The value of these bits need to be translated
into distance from the PHY.

Location of the Third peak discovered by the TDR mechanism on

7:0 TD Peak Location 3 RO 0000 0000 Transmit Channel (TD). The value of these bits need to be translated
into distance from the PHY.

表 8-70. 0x0182 Cable Diagnostic Location Result Register #3 (CDLRR3)

BIT NAME TYPE DEFAULT FUNCTION

Location of the First peak discovered by the TDR mechanism on

15:8 RD Peak Location 1 RO 0000 0000 Receive Channel (RD). The value of these bits need to be translated
into distance from the PHY.

Location of the Fifth peak discovered by the TDR mechanism on

7:0 TD Peak Location 5 RO 0000 0000 Transmit Channel (TD). The value of these bits need to be translated
into distance from the PHY.

表 8-71. 0x0183 Cable Diagnostic Location Result Register #4 (CDLRR4)

BIT NAME TYPE DEFAULT FUNCTION

Location of the Third peak discovered by the TDR mechanism on

15:8 RD Peak Location 3 RO 0000 0000 Receive Channel (RD). The value of these bits need to be translated
into distance from the PHY.

Location of the Second peak discovered by the TDR mechanism on

7:0 RD Peak Location 2 RO 0000 0000 Receive Channel (RD). The value of these bits need to be translated
into distance from the PHY.

表 8-72. 0x0184 Cable Diagnostic Location Result Register #5 (CDLRR5)

BIT NAME TYPE DEFAULT FUNCTION

Location of the Fifth peak discovered by the TDR mechanism on

15:8 RD Peak Location 5 RO 0000 0000 Receive Channel (RD). The value of these bits need to be translated
into distance from the PHY.

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表 8-72. 0x0184 Cable Diagnostic Location Result Register #5 (CDLRR5) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Location of the Fourth peak discovered by the TDR mechanism on

7:0 RD Peak Location 4 RO 0000 0000 Receive Channel (RD). The value of these bits need to be translated
into distance from the PHY.

表 8-73. 0x0185 Cable Diagnostic Amplitude Result Register #1 (CDLAR1)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Amplitude of the Second peak discovered by the TDR mechanism on

14:8 TD Peak Amplitude 2 RO 000 0000 Transmit Channel (TD). The value of these bits is translated into type
of cable fault and/or interference.

7 Reserved RO 0 Reserved

Amplitude of the First peak discovered by the TDR mechanism on

6:0 TD Peak Amplitude 1 RO 000 0000 Transmit Channel (TD). The value of these bits is translated into type
of cable fault and/or interference.

表 8-74. 0x0186 Cable Diagnostic Amplitude Result Register #2 (CDLAR2)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Amplitude of the Fourth peak discovered by the TDR mechanism on

14:8 TD Peak Amplitude 4 RO 000 0000 Transmit Channel (TD). The value of these bits is translated into type
of cable fault and/or interference.

7 Reserved RO 0 Reserved

Amplitude of the Third peak discovered by the TDR mechanism on

6:0 TD Peak Amplitude 3 RO 000 0000 Transmit Channel (TD). The value of these bits is translated into type
of cable fault and/or interference.

表 8-75. 0x0187 Cable Diagnostic Amplitude Result Register #3 (CDLAR3)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Amplitude of the First peak discovered by the TDR mechanism on

14:8 RD Peak Amplitude 1 RO 000 0000 Receive Channel (RD). The value of these bits is translated into type
of cable fault and/or interference.

7 Reserved RO 0 Reserved

Amplitude of the Fifth peak discovered by the TDR mechanism on

6:0 TD Peak Amplitude 5 RO 000 0000 Transmit Channel (TD). The value of these bits is translated into type
of cable fault and/or interference.

表 8-76. 0x0188 Cable Diagnostic Amplitude Result Register #4 (CDLAR4)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Amplitude of the Third peak discovered by the TDR mechanism on

14:8 RD Peak Amplitude 3 RO 000 0000 Receive Channel (RD). The value of these bits is translated into type
of cable fault and/or interference.

7 Reserved RO 0 Reserved

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表 8-76. 0x0188 Cable Diagnostic Amplitude Result Register #4 (CDLAR4) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Amplitude of the Second peak discovered by the TDR mechanism on

6:0 RD Peak Amplitude 2 RO 000 0000 Receive Channel (RD). The value of these bits is translated into type
of cable fault and/or interference.

表 8-77. 0x0189 Cable Diagnostic Amplitude Result Register #5 (CDLAR5)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Amplitude of the Fifth peak discovered by the TDR mechanism on

14:8 RD Peak Amplitude 5 RO 000 0000 Receive Channel (RD). The value of these bits is translated into type
of cable fault and/or interference.

7 Reserved RO 0 Reserved

Amplitude of the Fourth peak discovered by the TDR mechanism on

6:0 RD Peak Amplitude 4 RO 000 0000 Receive Channel (RD). The value of these bits is translated into type
of cable fault and/or interference.

表 8-78. 0x018A Cable Diagnostic General Result Register (CDLGR)

BIT NAME TYPE DEFAULT FUNCTION

Polarity of the Fifth peak discovered by the TDR mechanism on

15 TD Peak Polarity 5 RO 0
Transmit Channel (TD).

Polarity of the Fourth peak discovered by the TDR mechanism on

14 TD Peak Polarity 4 RO 0
Transmit Channel (TD).

Polarity of the Third peak discovered by the TDR mechanism on

13 TD Peak Polarity 3 RO 0
Transmit Channel (TD).

Polarity of the Second peak discovered by the TDR mechanism on

12 TD Peak Polarity 2 RO 0
Transmit Channel (TD).

Polarity of the First peak discovered by the TDR mechanism on

11 TD Peak Polarity 1 RO 0
Transmit Channel (TD).

Polarity of the Fifth peak discovered by the TDR mechanism on

10 RD Peak Polarity 5 RO 0
Receive Channel (RD).

Polarity of the Fourth peak discovered by the TDR mechanism on

9 RD Peak Polarity 4 RO 0
Receive Channel (RD).

Polarity of the Third peak discovered by the TDR mechanism on

8 RD Peak Polarity 3 RO 0
Receive Channel (RD).

Polarity of the Second peak discovered by the TDR mechanism on

7 RD Peak Polarity 2 RO 0
Receive Channel (RD).

Polarity of the First peak discovered by the TDR mechanism on

6 RD Peak Polarity 1 RO 0
Receive Channel (RD).

Cross Reflections were detected on TD. Indicate on Short between

5 Cross Detect on TD RO 0
TD and TD

Cross Reflections were detected on RD. Indicate on Short between

4 Cross Detect on RD RO 0
TD and RD

3 Above 5 TD Peaks RO 0 More than 5 reflections were detected on TD

2 Above 5 RD Peaks RO 0 More than 5 reflections were detected on RD

1:0 Reserved RO 0 Reserved

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表 8-79. 0x0215 ALCD Control and Results 2 Register (ALCDRR2)

BIT NAME TYPE DEFAULT FUNCTION

0000 0000
15:4 Reserved RO Reserved
0000

3:0 PGA Control RO 1111 Control word to analog PGA

表 8-80. 0x021D ALCD Control and Results 3 Register (ALCDRR3)

BIT NAME TYPE DEFAULT FUNCTION

15:12 Reserved RO 0 Reserved

0110 0000
11:0 FAGC Accumulator RW FAGC Accumulator
0000

表 8-81. 0x0403 Line Driver Control Register (LDCTRL)

BIT NAME TYPE DEFAULT FUNCTION

15:12 Reserved RW 1001 Reserved

100Base-FX Line Driver Swing Select (peak-to-peak):

0000 = 0.533-V
0001 = 0.567-V
0010 = 0.600-V
0011 = 0.633-V
0100 = 0.667-V
0101 = 0.700-V
0110 = 0.733-V
100Base-FX Line Driver Swing
11:8 RW 1111 0111 = 0.767-V
Select
1000 = 0.800-V
1001 = 0.833-V
1010 = 0.867-V
1011 = 0.900-V
1100 = 0.933-V
1101 = 0.976-V
1110 = 1.000-V
1111 = 1.033-V (Default Setting)

100Base-TX Line Driver Swing Select (peak-to-peak):

0000 = 1.600-V
0001 = 1.633-V
0010 = 1.667-V
0011 = 1.700-V
0100 = 1.733-V
0101 = 1.767-V
0110 = 1.800-V
100Base-TX Line Driver Swing
7:4 RW 1100 0111 = 1.833-V
Select
1000 = 1.867-V
1001 = 1.900-V
1010 = 1.933-V
1011 = 1.967-V
1100 = 2.000-V (Default Setting)
1101 = 2.033-V
1110 = 2.067-V
1111 = 2.100-V

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表 8-81. 0x0403 Line Driver Control Register (LDCTRL) (continued)

BIT NAME TYPE DEFAULT FUNCTION

10Base-Te Line Driver Swing Select:

0000 = 3.200-V
0001 = 3.233-V
0010 = 3.267-V
0011 = 3.300-V
0100 = 3.333-V
0101 = 3.367-V
0110 =3.400-V
10Base-Te Line Driver Swing
3:0 RW 1111 0111 = 3.433-V
Select
1000 = 3.467-V
1001 = 3.500-V
1010 = 3.533-V
1011 = 3.567-V
1100 = 3.600-V
1101 = 3.633-V
1110 = 3.667-V
1111 = 3.700-V (Default Setting)

表 8-82. 0x0404 Line Driver Class Selection (LDCSEL)

BIT NAME TYPE DEFAULT FUNCTION

0x0020 : Reduced MLT-3 (Class B)

15:0 Line Driver Class Selection RW 0020
0x0024 : To program full MLT-3 on both Tx+ and Tx– (Class A)

表 8-83. 0x040D Auto-neg Energy Threshold Register

BIT NAME TYPE DEFAULT FUNCTION

15: 5 Reserved RW 0000 0000 000

Decides threshold of energy

4:0 Auto-neg Energy Threshold Value RW 0 1000
detection during auto-negotiation

表 8-84. 0x0410 DC Correction Control Register

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RW 0 Reserved

1 = Enable Fixed Value of DC

14 Enable Fixed DC Correction RW 0
Correction

13:0 Reserved RW 10 0000 0000 0000

表 8-85. 0x0416 Analog Filter Control Register 1

BIT NAME TYPE DEFAULT FUNCTION

15:13 Reserved RW 000 Reserved

Controls the cut-off frequency of

12:8 Filter 1 cut-off RW 01000
filter 1

7:0 Reserved RW 0111 0000 Reserved

表 8-86. 0x0418 Analog Equalizer Control Register

BIT NAME TYPE DEFAULT FUNCTION

15:14 Reserved RW 00 Reserved

Analog equalizer controls useful

13:8 Analog Equalizer Control RW 0000 00
for short shielded cables

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表 8-86. 0x0418 Analog Equalizer Control Register (continued)

BIT NAME TYPE DEFAULT FUNCTION

7:0 Reserved RW 0000 0000 Reserved

表 8-87. 0x041F Analog Power Detect Control

BIT NAME TYPE DEFAULT FUNCTION

15:13 Reserved RW 000 Reserved

Force AVDD to be detected as

3.3V
1=Force AVDD to be detected as
12 Force AVDD Detect RW 0
3.3V
0=Internal circuit detects the
AVDD supply level

Force AVDDIO to be detected as

3.3V
11 = Force AVDDIO to be
11:10 Force AVDDIO Detect RW 00
detected as 3.3V
00 = Internal circuit detects the
AVDDIO supply level

9:0 Reserved RW 00 0000 0000 Reserved

A. For specific applications which require bypassing auto supply detection, registers 0x0421 and 0x041F can be used to program specific
supply levels

表 8-88. 0x0421 Analog Power Detect Status

BIT NAME TYPE DEFAULT FUNCTION

15:3 Reserved RO 0 Reserved

1 for 3.3V AVDD

2 AVDD Level RO AVDD level indication
0 for 1.8V AVDD

11 for 3.3V VDDIO

1:0 VDDIO Level RO 00 for 1.8V VDDIO VDDIO level indication
01 for 2.5V VDDIO

表 8-89. 0x0428 Deep Power Down Control Register (DPDWN)

BIT NAME TYPE DEFAULT FUNCTION

15:6 Reserved RO 0 Reserved

MSB 100Base-TX Idle Pattern:

100Base-TX Test Mode is determined by bits {[5] in register 0x0428,
[3:0] in register 0x0027}. The bits determine the number of 0's to
follow a '1'.
0,0001 = Single '0' after a '1'
0,0010 = Two '0' after a '1'
0,0011 = Three '0' after a '1'
5 MSB 100Base-TX Idle Pattern RW 0
0,0100 = Four '0' after a '1'
0,0101 = Five '0' after a '1'
0,0110 = Six '0' after a '1'
0,0111 = Seven '0' after a '1' .
..
1,1111 = Thirty one '0' after a '1'
0,0000 = Clears the shift register

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表 8-89. 0x0428 Deep Power Down Control Register (DPDWN) (continued)

BIT NAME TYPE DEFAULT FUNCTION

100Base-TX Idle Pattern Test Mode:

1 = 100Base-TX Idle Pattern Enable
100Base-TX Idle Pattern Test
4 RW 0 0 = Normal operation
Mode
When enabled, 100Base-TX Idle Pattern is determined by bit[5] in
register 0x0428 and bits[3:0] in register 0x0027.

Deep Power Down Speed Selection:

3 Deep Power Down Speed RW 0 1 = 50ms duration to exit Deep Power Down
0 = 100ms duration to exit Deep Power Down

Deep Power Down Enable:

1 = Deep Power Down activated
0 = Normal operation
2 Deep Power Down Enable RW 0 Note: If set, the DP83822 enters into deep power down mode. Deep
power down mode requires that IEEE Power Down be enabled first by
either register access (set bit[11] = '1' in register 0x0000) or using INT/
PWDN pin.

1:0 Reserved RW 0 Reserved

表 8-90. 0x0450 DSP Configuration Register 6 (DSPCR6)

BIT NAME TYPE DEFAULT FUNCTION

15:14 Reserved RW 00 Reserved

13 Equalizer Calibration Bypass RW 0 1 = Bypass equalizer calibration

12:0 Reserved RW 0 0001 0100 0001 Reserved

表 8-91. 0x0456 General Configuration Register (GENCFG)

BIT NAME TYPE DEFAULT FUNCTION

15:4 Reserved RW 0 Reserved

Min IPG Enable:

1 = Enable Minimum Inter-Packet Gap (IPG is set to 120ns)
0 = IPG set to 0.20μs
3 Min IPG Enable RW 1
Note:
IPGs <200ns should only be used when operating with a MII MAC IF
configuration.

2:0 Reserved RW 0 Reserved

表 8-92. 0x0460 LEDs Configuration Register #1 (LEDCFG1)

BIT NAME TYPE DEFAULT FUNCTION

15:12 Reserved RO 0 Reserved

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表 8-92. 0x0460 LEDs Configuration Register #1 (LEDCFG1) (continued)

BIT NAME TYPE DEFAULT FUNCTION

LED_1 Control:
Selects the source for LED_1.
0000 = LINK OK
0001 = RX/TX Activity
0010 = TX Activity
0011 = RX Activity
0100 = Collision
0101 = Speed, High for 100Base-TX
0110 = Speed, High for 10Base-Te
0111 = Full-Duplex
1000 = LINK OK / BLINK on TX/RX Activity
11:8 LED_1 Control RW 0101
1001 = Active Stretch Signal
1010 = MII LINK (100BT+FD)
1011 = LPI Mode (EEE)
1100 = TX/RX MII Error
1101 = Link Lost
1110 = Blink for PRBS error
1111 = Reserved
Link Lost, LED remains ON until BMCR register (address 0x0001) is
read.
Blink for PRBS Errors, LED remains ON for single error and remains
until BICSR1 register (address 0x001B) is cleared.

LED_3 Control:
7:4 LED_3 Control (RX_D3) RW 0101 Selects the source for RX_D3. Please reference bits[11:8] for list of
sources.

3:0 Reserved RW 0001 Reserved

表 8-93. 0x0461 IO MUX GPIO Control Register (IOCTRL)

BIT NAME TYPE DEFAULT FUNCTION

0000 0100
15:5 Reserved RW Reserved
000

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表 8-93. 0x0461 IO MUX GPIO Control Register (IOCTRL) (continued)

BIT NAME TYPE DEFAULT FUNCTION

MAC Impedance Control:

MAC interface impedance control sets the series termination for the
digital pins.
0 000 = 99.25 Ω
0 001 = 91.13 Ω
0 010 = 84.24 Ω
0 011 = 78.31 Ω
0 100 = 73.17 Ω
0 101 = 68.65 Ω
4:1 MAC Impedance Control RW 1 000 0 110 = 64.66 Ω
0 111 = 61.11 Ω
1 000 = 58.07 Ω (Default Setting)
1 001 = 55.18 Ω
1 010 = 52.57 Ω
1 011 = 50.20 Ω
1 100 = 48.03 Ω
1 101 = 46.04 Ω
1 110 = 44.20 Ω
1 111 = 42.51 Ω

0 Reserved RW 0 Reserved

表 8-94. 0x0462 IO MUX GPIO Control Register #1 (IOCTRL1)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

Clock Source:
If RX_D3 is configured as a clock source from bits[10:8] the following
field determines the reference
000 = MAC IF Clock
001 = XI Clock (Pass-Through Clock from XI pin)
010 = Internal Reference Clock: 25-MHz
011 = Reserved
100 = RMII Master Mode Reference Clock: 50-MHz
14:12 RX_D3 / GPIO_3 Clock Source RW 000
101 = Reserved
110 = Free Running Clock: 125-MHz
111 = Recovered Clock: 125-MHz
MAC IF Clock: MII Mode the clock frequency is 25-MHz, RMII Mode
the clock frequency is 50-MHz; RGMII Mode the clock frequency is
25-MHz.
RMII Master Mode Reference Clock: Identical to MAC IF Clock in
RMII Master Mode.

11 Reserved RO 0 Reserved

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表 8-94. 0x0462 IO MUX GPIO Control Register #1 (IOCTRL1) (continued)

BIT NAME TYPE DEFAULT FUNCTION

RX_D3 GPIO Configuration:

000 = Normal operation
001 = LED_3 (Default: Speed, High for 100Base-TX)
010 = WoL
10:8 RX_D3 / GPIO_3 Control RW 000 011 = Clock reference according to bits[14:12]
100 = IEEE 1588 TX Indication
101 = IEEE 1588 RX Indication
110 = Constant '0'
111 = Constand '1'

7 Reserved RO 0 Reserved

Clock Source:
If LED_1 is configured as a clock source from bits[2:0] the following
field determines the reference
000 = MAC IF Clock
001 = XI Clock (Pass-Through Clock from XI pin)
010 = Internal Reference Clock: 25-MHz
011 = Reserved
100 = RMII Master Mode Reference Clock: 50-MHz
6:4 LED_1 / GPIO_1 Clock Source RW 000
101 = Reserved
110 = Free Running Clock: 125-MHz
111 = Recovered Clock: 125-MHz
MAC IF Clock: MII Mode the clock frequency is 25-MHz, RMII Mode
the clock frequency is 50-MHz; RGMII Mode the clock frequency is
25-MHz.
RMII Master Mode Reference Clock: Identical to MAC IF Clock in
RMII Master Mode.

3 Reserved RO 0 Reserved

LED_1 GPIO Configuration:

000 = Tri-state
001 = LED_1 (Default: Speed, High for 100Base-TX)
010 = WoL
2:0 LED_1 / GPIO_1 Control RW, Strap 000 011 = Clock reference according to bits[6:4]
100 = IEEE 1588 TX Indication
101 = IEEE 1588 RX Indication
110 = Constant '0'
111 = Constand '1'

表 8-95. 0x0463 IO MUX GPIO Control Register #2 (IOCTRL2)

BIT NAME TYPE DEFAULT FUNCTION

15:7 Reserved RO 0 Reserved

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表 8-95. 0x0463 IO MUX GPIO Control Register #2 (IOCTRL2) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Clock Source:
If COL is configured as a clock source from bits[2:0] the following field
determines the reference
000 = MAC IF Clock
001 = XI Clock (Pass-Through Clock from XI pin)
010 = Internal Reference Clock: 25-MHz
011 = Reserved
100 = RMII Master Mode Reference Clock: 50-MHz
6:4 COL / GPIO_2 Clock Source RW 000
101 = Reserved
110 = Free Running Clock: 125-MHz
111 = Recovered Clock: 125-MHz
MAC IF Clock: MII Mode the clock frequency is 25-MHz, RMII Mode
the clock frequency is 50-MHz; RGMII Mode the clock frequency is
25-MHz.
RMII Master Mode Reference Clock: Identical to MAC IF Clock in
RMII Master Mode.

3 Reserved RO 0 Reserved

COL GPIO Configuration:

000 = Normal operation
001 = MLED (Register 0x0025)
010 = WoL
2:0 COL / GPIO_2 Control RW 000 011 = Clock reference according to bits[6:4]
100 = IEEE 1588 TX Indication
101 = IEEE 1588 RX Indication
110 = Constant '0'
111 = Constand '1'

表 8-96. 0x0465 Fiber General Configuration Register (FIBER GENCFG)

BIT NAME TYPE DEFAULT FUNCTION

1111 1111
15:1 Reserved RW Reserved
0000 000

100Base-FX Signal Detect Polarity:

1 = Signal Detect is Active LOW
0 = Signal Detect is Active HIGH
When set to Active HIGH, Link drop will occur if SD pin senses a LOW
100Base-FX Signal Detect
0 RW 0 state (SD = '0').
Polarity
When set to Active LOW, Link drop will occur if SD pin senses a HIGH
state (SD = '1').
Note: To enable 100Base-FX Signal Detection on LED_1 (pin #24),
strap SD_EN = '1'

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表 8-97. 0x0467 Strap Latch-In Register #1 (SOR1)

BIT NAME TYPE DEFAULT FUNCTION

RX_D1 Strap Mode:

00 = Mode 1
01 = Mode 2
10 = Mode 3
11 = Mode 4
15:14 RX_D1 Strap Mode RO, Strap 00
Please refer to the strap section in the datasheet for information
regarding PHY configuration.
Note: Bit values ('00', '01', '10', '11') are just used to indicate the Strap
Mode and do not reflect the same bit sequence that is defined in the
strap section of the datasheet.

RX_D0 Strap Mode:

13:12 RX_D0 Strap Mode RO, Strap 00
Use same reference as defined by bits[15:14] in this register.

COL Strap Mode:

11:10 COL Strap Mode RO, Strap 11
Use same reference as defined by bits[15:14] in this register.

RX_ER Strap Mode:

9:8 RX_ER Strap Mode RO, Strap 11
Use same reference as defined by bits[15:14] in this register.

CRS Strap Mode:

7:6 CRS Strap Mode RO, Strap 11
Use same reference as defined by bits[15:14] in this register.

RX_DV Strap Mode:

5:4 RX_DV Strap Mode RO, Strap 00
Use same reference as defined by bits[15:14] in this register.

3:2 Reserved RO 00 Reserved

LED_0 Strap Mode:

00 = Mode 1
01 = Reserved
10 = Reserved
11 = Mode 4
1:0 LED_0 Strap Mode RO, Strap 11
Please refer to the strap section in the datasheet for information
regarding PHY configuration.
Note: Bit values ('00', '01', '10', '11') are just used to indicate the Strap
Mode and do not reflect the same bit sequence that is defined in the
strap section of the datasheet.

表 8-98. 0x0468 Strap Latch-In Register #2 (SOR2)

BIT NAME TYPE DEFAULT FUNCTION

15:4 Reserved RO 0 Reserved

RX_D3 Strap Mode:

3:2 RX_D3 Strap Mode RO, Strap 00
Use same reference as defined by bits[15:14] in register 0x0467.

RX_D2 Strap Mode:

1:0 RX_D2 Strap Mode RO, Strap 00
Use same reference as defined by bits[15:14] in register 0x0467.

表 8-99. 0x0469 LEDs Configuration Register #2 (LEDCFG2)

BIT NAME TYPE DEFAULT FUNCTION

15:11 Reserved RO 0 Reserved

LED_1 Polarity:
1 = Active High
10 LED_1 Polarity RW 0
0 = Active Low
Value depends upon pull configuration on LED_1 pin.

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表 8-99. 0x0469 LEDs Configuration Register #2 (LEDCFG2) (continued)

BIT NAME TYPE DEFAULT FUNCTION

LED_1 Force Override Value:

9 LED_1 Force Override Value RW 0 1 = LED_1 forced High
0 = LED_1 forced Low

LED_1 Force Override Enable:

1 = Enable Force Override
8 LED_1 Force Override Enable RW 0
0 = Disable Force Override
When enabled, bit[9] in this register determines state of LED_1.

7 Reserved RO 0 Reserved

LED_3 Polarity:
6 LED_3 Polarity RW 1 1 = Active High
0 = Active Low

LED_3 Force Override Value:

5 LED_3 Force Override Value RW 0 1 = RX_D3 forced High
0 = RX_D3 forced Low

LED_3 Force Override Enable:

1 = Enable Force Override
4 LED_3 Force Override Enable RW 0
0 = Disable Force Override
When enabled, bit[5] in this register determines state of RX_D3.

3:0 Reserved RO 0 Reserved

表 8-100. 0x04A0 Receive Configuration Register (RXFCFG)

BIT NAME TYPE DEFAULT FUNCTION

Bit Nibble Swap:

00 = Normal order, no swap (RXD[3:0])
15:14 Bit Nibble Swap RW 00 01 = Swap bits order (RXD[0:3])
10 = Swap nibbles order (RXD[3:0] , RXD[7:4])
11 = Swap bits order in each nibble (RXD[4:7] , RXD[0:3])

SFD Byte Search:

13 SFD Byte RW 0 1 = SFD is 0x5D (i.e. Receive module searches for 0x5D)
0 = SFD is 0xD5 (i.e. Receive module searches for 0xD5)

CRC Gate:
1 = Bad CRC gates Magic Packet and Pattern Indications
12 CRC Gate RW 1 0 = Bad CRC does not gate Magic Packet or Pattern Indications
If Magic Packet has Bad CRC there will be no indication (status,
interrupt, GPIO) when enabled.

WoL Level Change Indication Clear:

WoL Level Change Indication
11 W, SC 0 If WoL Indication is set for Level change mode, this bit clears the level
Clear
upon a write.

WoL Pulse Indication Select:

Only valid when WoL Indication is set for Pulse mode.
00 = 8 clock cycles (of 125-MHz clock)
10:9 WoL Pulse Indication Select RW 00
01 = 16 clock cycles
10 = 32 clock cycles
11 = 64 clock cycles

WoL Indication Select:

8 WoL Indication Select RW 0 1 = Level change mode
0 = Pulse mode

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表 8-100. 0x04A0 Receive Configuration Register (RXFCFG) (continued)

BIT NAME TYPE DEFAULT FUNCTION

WoL Enable:
7 WoL Enable RW 0 1 = Enable Wake-on-LAN (WoL)
0 = Normal operation

6 Bit Mask Flag RW 0 Bit Mask Flag

5 Secure-ON Enable RW 0 Enable Secure-ON password for Magic Packets

4:2 Reserved RW 0 Reserved

1 WoL Pattern Enable RW 0 Enable Interrupt upon reception of packet with configured pattern

0 WoL Magic Packet Enable RW 0 Enable Interrupt upon reception of Magic Packet

表 8-101. 0x04A1 Receive Status Register (RXFS)

BIT NAME TYPE DEFAULT FUNCTION

15:13 Reserved RO 0 Reserved

WoL Interrupt Source:

Source of Interrupt for bit[1] of register 0x0013.
12 WoL Interrupt Source RW 0 1 = WoL Interrupt
0 = Data Polarity Interrupt
When enabling WoL, this bit is automatically set to WoL Interrupt.

11:8 Reserved RO 0 Reserved

SFD Error:
7 SFD Error RO, LH, SC 0 1 = Packet with SFD error
0 = No SFD error

Bad CRC:
6 Bad CRC RO, LH, SC 0 1 = Bad CRC was received
0 = No bad CRC received

Secure-ON Hack Flag:

5 Secure-On Hack Flag RO, LH, SC 0 1 = Invalid Password detected in Magic Packet
0 = Valid Secure-ON Password

4:2 Reserved RO, LH, SC 0 Reserved

WoL Pattern Status:

1 WoL Pattern Status RO, LH, SC 0 1 = Valid packet with configured pattern received
0 = No valid packet with configured pattern received

WoL Magic Packet Status:

0 WoL Magic Packet Status RO, LH, SC 0 1 = Valid Magic Packet received
0 = No valid Magic Packet received

表 8-102. 0x04A2 Receive Perfect Match Data Register #1 (RXFPMD1)

BIT NAME TYPE DEFAULT FUNCTION

MAC Destination Address Byte Perfect Match Data:

15:8 RW 0
4 Configured for MAC Destination Address

MAC Destination Address Byte Perfect Match Data:

7:0 RW 0
5 Configured for MAC Destination Address

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表 8-103. 0x04A3 Receive Perfect Match Data Register #2 (RXFPMD2)

BIT NAME TYPE DEFAULT FUNCTION

MAC Destination Address Byte Perfect Match Data:

15:8 RW 0
2 Configured for MAC Destination Address

MAC Destination Address Byte Perfect Match Data:

7:0 RW 0
3 Configured for MAC Destination Address

表 8-104. 0x04A4 Receive Perfect Match Data Register #3 (RXFPMD3)

BIT NAME TYPE DEFAULT FUNCTION

MAC Destination Address Byte Perfect Match Data:

15:8 RW 0
0 Configured for MAC Destination Address

MAC Destination Address Byte Perfect Match Data:

7:0 RW 0
1 Configured for MAC Destination Address

表 8-105. 0x04A5 Receive Secure-ON Password Register #1 (RXFSOP1)

BIT NAME TYPE DEFAULT FUNCTION

Secure-ON Password Select:

15:8 Secure-ON Password Byte 1 RW 0
Secure-ON password for Magic Packets

Secure-ON Password Select:

7:0 Secure-ON Password Byte 0 RW 0
Secure-ON password for Magic Packets

表 8-106. 0x04A6 Receive Secure-ON Password Register #2 (RXFSOP2)

BIT NAME TYPE DEFAULT FUNCTION

Secure-ON Password Select:

15:8 Secure-ON Password Byte 3 RW 0
Secure-ON password for Magic Packets

Secure-ON Password Select:

7:0 Secure-ON Password Byte 2 RW 0
Secure-ON password for Magic Packets

表 8-107. 0x04A7 Receive Secure-ON Password Register #3 (RXFSOP3)

BIT NAME TYPE DEFAULT FUNCTION

Secure-ON Password Select:

15:8 Secure-ON Password Byte 5 RW 0
Secure-ON password for Magic Packets

Secure-ON Password Select:

7:0 Secure-ON Password Byte 4 RW 0
Secure-ON password for Magic Packets

表 8-108. 0x04A8 Receive Pattern Register #1 (RXFPAT1)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 1 RW 0
Configures byte 1 of the pattern

Pattern Configuration:
7:0 Pattern Byte 0 RW 0
Configures byte 0 of the pattern

表 8-109. 0x04A9 Receive Pattern Register #2 (RXFPAT2)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 3 RW 0
Configures byte 3 of the pattern

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表 8-109. 0x04A9 Receive Pattern Register #2 (RXFPAT2) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
7:0 Pattern Byte 2 RW 0
Configures byte 2 of the pattern

表 8-110. 0x04AA Receive Pattern Register #3 (RXFPAT3)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 5 RW 0
Configures byte 5 of the pattern

Pattern Configuration:
7:0 Pattern Byte 4 RW 0
Configures byte 4 of the pattern

表 8-111. 0x04AB Receive Pattern Register #4 (RXFPAT4)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 7 RW 0
Configures byte 7 of the pattern

Pattern Configuration:
7:0 Pattern Byte 6 RW 0
Configures byte 6 of the pattern

表 8-112. 0x04AC Receive Pattern Register #5 (RXFPAT5)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 9 RW 0
Configures byte 9 of the pattern

Pattern Configuration:
7:0 Pattern Byte 8 RW 0
Configures byte 8 of the pattern

表 8-113. 0x04AD Receive Pattern Register #6 (RXFPAT6)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 11 RW 0
Configures byte 11 of the pattern

Pattern Configuration:
7:0 Pattern Byte 10 RW 0
Configures byte 10 of the pattern

表 8-114. 0x04AE Receive Pattern Register #7 (RXFPAT7)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 13 RW 0
Configures byte 13 of the pattern

Pattern Configuration:
7:0 Pattern Byte 12 RW 0
Configures byte 12 of the pattern

表 8-115. 0x04AF Receive Pattern Register #8 (RXFPAT8)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 15 RW 0
Configures byte 15 of the pattern

Pattern Configuration:
7:0 Pattern Byte 14 RW 0
Configures byte 14 of the pattern

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表 8-116. 0x04B0 Receive Pattern Register #9 (RXFPAT9)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 17 RW 0
Configures byte 17 of the pattern

Pattern Configuration:
7:0 Pattern Byte 16 RW 0
Configures byte 16 of the pattern

表 8-117. 0x04B1 Receive Pattern Register #10 (RXFPAT10)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 19 RW 0
Configures byte 19 of the pattern

Pattern Configuration:
7:0 Pattern Byte 18 RW 0
Configures byte 18 of the pattern

表 8-118. 0x04B2 Receive Pattern Register #11 (RXFPAT11)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 21 RW 0
Configures byte 21 of the pattern

Pattern Configuration:
7:0 Pattern Byte 20 RW 0
Configures byte 20 of the pattern

表 8-119. 0x04B3 Receive Pattern Register #12 (RXFPAT12)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 23 RW 0
Configures byte 23 of the pattern

Pattern Configuration:
7:0 Pattern Byte 22 RW 0
Configures byte 22 of the pattern

表 8-120. 0x04B4 Receive Pattern Register #13 (RXFPAT13)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 25 RW 0
Configures byte 25 of the pattern

Pattern Configuration:
7:0 Pattern Byte 24 RW 0
Configures byte 24 of the pattern

表 8-121. 0x04B5 Receive Pattern Register #14 (RXFPAT14)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 27 RW 0
Configures byte 27 of the pattern

Pattern Configuration:
7:0 Pattern Byte 26 RW 0
Configures byte 26 of the pattern

表 8-122. 0x04B6 Receive Pattern Register #15 (RXFPAT15)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 29 RW 0
Configures byte 29 of the pattern

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表 8-122. 0x04B6 Receive Pattern Register #15 (RXFPAT15) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
7:0 Pattern Byte 28 RW 0
Configures byte 28 of the pattern

表 8-123. 0x04B7 Receive Pattern Register #16 (RXFPAT16)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 31 RW 0
Configures byte 31 of the pattern

Pattern Configuration:
7:0 Pattern Byte 30 RW 0
Configures byte 30 of the pattern

表 8-124. 0x04B8 Receive Pattern Register #17 (RXFPAT17)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 33 RW 0
Configures byte 33 of the pattern

Pattern Configuration:
7:0 Pattern Byte 32 RW 0
Configures byte 32 of the pattern

表 8-125. 0x04B9 Receive Pattern Register #18 (RXFPAT18)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 35 RW 0
Configures byte 35 of the pattern

Pattern Configuration:
7:0 Pattern Byte 34 RW 0
Configures byte 34 of the pattern

表 8-126. 0x04BA Receive Pattern Register #19 (RXFPAT19)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 37 RW 0
Configures byte 37 of the pattern

Pattern Configuration:
7:0 Pattern Byte 36 RW 0
Configures byte 36 of the pattern

表 8-127. 0x04BB Receive Pattern Register #20 (RXFPAT20)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 39 RW 0
Configures byte 39 of the pattern

Pattern Configuration:
7:0 Pattern Byte 38 RW 0
Configures byte 38 of the pattern

表 8-128. 0x04BC Receive Pattern Register #21 (RXFPAT21)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 41 RW 0
Configures byte 41 of the pattern

Pattern Configuration:
7:0 Pattern Byte 40 RW 0
Configures byte 40 of the pattern

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表 8-129. 0x04BD Receive Pattern Register #22 (RXFPAT22)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 43 RW 0
Configures byte 43 of the pattern

Pattern Configuration:
7:0 Pattern Byte 42 RW 0
Configures byte 42 of the pattern

表 8-130. 0x04BE Receive Pattern Register #23 (RXFPAT23)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 45 RW 0
Configures byte 45 of the pattern

Pattern Configuration:
7:0 Pattern Byte 44 RW 0
Configures byte 44 of the pattern

表 8-131. 0x04BF Receive Pattern Register #24 (RXFPAT24)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 47 RW 0
Configures byte 47 of the pattern

Pattern Configuration:
7:0 Pattern Byte 46 RW 0
Configures byte 46 of the pattern

表 8-132. 0x04C0 Receive Pattern Register #25 (RXFPAT25)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 49 RW 0
Configures byte 49 of the pattern

Pattern Configuration:
7:0 Pattern Byte 48 RW 0
Configures byte 48 of the pattern

表 8-133. 0x04C1 Receive Pattern Register #26 (RXFPAT26)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 51 RW 0
Configures byte 51 of the pattern

Pattern Configuration:
7:0 Pattern Byte 50 RW 0
Configures byte 50 of the pattern

表 8-134. 0x04C2 Receive Pattern Register #27 (RXFPAT27)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 53 RW 0
Configures byte 53 of the pattern

Pattern Configuration:
7:0 Pattern Byte 52 RW 0
Configures byte 52 of the pattern

表 8-135. 0x04C3 Receive Pattern Register #28 (RXFPAT28)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 55 RW 0
Configures byte 55 of the pattern

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[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

表 8-135. 0x04C3 Receive Pattern Register #28 (RXFPAT28) (continued)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
7:0 Pattern Byte 54 RW 0
Configures byte 54 of the pattern

表 8-136. 0x04C4 Receive Pattern Register #29 (RXFPAT29)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 57 RW 0
Configures byte 57 of the pattern

Pattern Configuration:
7:0 Pattern Byte 56 RW 0
Configures byte 56 of the pattern

表 8-137. 0x04C5 Receive Pattern Register #30 (RXFPAT30)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 59 RW 0
Configures byte 59 of the pattern

Pattern Configuration:
7:0 Pattern Byte 58 RW 0
Configures byte 58 of the pattern

表 8-138. 0x04C6 Receive Pattern Register #31 (RXFPAT31)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 61 RW 0
Configures byte 61 of the pattern

Pattern Configuration:
7:0 Pattern Byte 60 RW 0
Configures byte 60 of the pattern

表 8-139. 0x04C7 Receive Pattern Register #32 (RXFPAT32)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Configuration:
15:8 Pattern Byte 63 RW 0
Configures byte 63 of the pattern

Pattern Configuration:
7:0 Pattern Byte 62 RW 0
Configures byte 62 of the pattern

表 8-140. 0x04C8 Receive Pattern Byte Mask Register #1 (RXFPBM1)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Byte Mask Configuration:

15:0 Mask Bytes 0 to 15 RW 0 Configures masks for bytes 0 to 15.
For each byte '1' means it is masked.

表 8-141. 0x04C9 Receive Pattern Byte Mask Register #2 (RXFPBM2)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Byte Mask Configuration:

15:0 Mask Bytes 16 to 31 RW 0 Configures masks for bytes 16 to 31.
For each byte '1' means it is masked.

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表 8-142. 0x04CA Receive Pattern Byte Mask Register #3 (RXFPBM3)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Byte Mask Configuration:

15:0 Mask Bytes 32 to 47 RW 0 Configures masks for bytes 32 to 47.
For each byte '1' means it is masked.

表 8-143. 0x04CB Receive Pattern Byte Mask Register #4 (RXFPBM4)

BIT NAME TYPE DEFAULT FUNCTION

Pattern Byte Mask Configuration:

15:0 Mask Bytes 48 to 63 RW 0 Configures masks for bytes 48 to 63.
For each byte '1' means it is masked.

表 8-144. 0x04CC Receive Pattern Control Register (RXFPATC)

BIT NAME TYPE DEFAULT FUNCTION

15:6 Reserved RO 0 Reserved

Pattern Start Point:

Number of bytes after SFD where comparison begins on RX packets
to the configured pattern.
00000 = Start compare on 1st byte after SFD
5:0 Pattern Start Point RW 01100 00001 = Start compare on 2nd byte after SFD
...
01100 = Start compare on 13th byte (Default)
Default setting is 0xC, which means the pattern comparision will begin
after source and destination addresses since they are each 6 bytes.

表 8-145. 0x04D0 Energy Efficient Ethernet Configuration Register #2 (EEECFG2)

BIT NAME TYPE DEFAULT FUNCTION

15 Reserved RO 0 Reserved

TX_ER for LPI Request:

14 TX_ER for LPI Request RW 0 1 = TX_ER used for LPI Request
0 = TX_ER not used for LPI Request

13:7 Reserved RO 00 0011 0 Reserved

TX_ER Pin Select:

00 = No Pin Selected
6:5 TX_ER Pin Select RW 00 01 = INT/PWDN
10 = COL/GPIO
11 = No Pin Selected

4:0 Reserved RO 0 0010 Reserved

表 8-146. 0x04D1 Energy Efficient Ethernet Configuration Register #2 (EEECFG3)

BIT NAME TYPE DEFAULT FUNCTION

0000 0001
15:4 Reserved RW Reserved
1000

EEE Advertise Bypass:

1 = Bit [0] determines EEE Auto-Negotiation Abilities
0 = MMD3 and MMD7 determine EEE Auto-Negotiation Abilities
3 EEE Capabilities Bypass RW 1
Allows for EEE Advertisment during Auto-Negotiation to be
determined by bit[0] in register 0x04D1 rather than the Next Page
Registers (Register 0x003C and Register 0x003D in MMD7).

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表 8-146. 0x04D1 Energy Efficient Ethernet Configuration Register #2 (EEECFG3) (continued)

BIT NAME TYPE DEFAULT FUNCTION

EEE Next Page Disable:

2 EEE Next Page Disable RW 0 1 = Reception of EEE Next Pages is disabled
0 = Reception of EEE Next Pages is enabled

EEE RX Path Shutdown:

1 EEE RX Path Shutdown RW 1 1= Enable shutdown of Analog RX path at LPI_Quiet
0 = Analog RX path is active during LPI_Quiet

EEE Capabilities Enable:

1 = PHY supports EEE capabilities
0 = PHY does not support EEE
When enabled, Auto-Negotiation will negotiate to EEE as defined by
0 EEE Capabilities Enable RW, Strap 1
register 0x003C and register 0x003D in MMD7.
When disabled, register 0x0014 in MMD3, register 0x003C and
register 0x003D in MMD7 are ignored.
Bit should be written to 0 (irrespective of strap used) to disable EEE.

表 8-147. 0x04D4 TLOOP Bandwidth Control Register 1 (TLBCR1)

BIT NAME TYPE DEFAULT FUNCTION

0111 0010
15:0 Reserved RW Reserved
0010 0000

表 8-148. 0x04D5 TLOOP Bandwidth Control Register 2 (TLBCR2)

BIT NAME TYPE DEFAULT FUNCTION

1111 1011
15:0 Reserved RW Reserved
1100 0001

表 8-149. 0x04D6 TLOOP Bandwidth Control Register 3 (TLBCR3)

BIT NAME TYPE DEFAULT FUNCTION

0000 0001
15:0 Reserved RW Reserved
1100 0001

表 8-150. 0x3000 MMD3 PCS Control Register #1 (MMD3_PCS_CTRL_1)

BIT NAME TYPE DEFAULT FUNCTION

PCS Reset:
1 = Soft Reset of MMD3, MMD7 and PCS registers
15 PCS Reset RW, SC 0 0 = Normal operation
Reset clears MMD3, MMD7 and PCS registers. Reset does not clear
Vendor Specific Registers (DEVAD = 31).

14:11 Reserved RO 000 0 Reserved

RX Clock Stoppable:
10 RX Clock Stoppable RW 1 1 = Receive Clock stoppable during LPI
0 = Receive Clock not stoppable

00 0000
9:0 Reserved RO Reserved
0000

表 8-151. 0x3001 MMD3 PCS Status Register #1 (MMD3_PCS_STATUS_1)

BIT NAME TYPE DEFAULT FUNCTION

15:12 Reserved RO 0 Reserved

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表 8-151. 0x3001 MMD3 PCS Status Register #1 (MMD3_PCS_STATUS_1) (continued)

BIT NAME TYPE DEFAULT FUNCTION

TX LPI Received:
11 TX LPI Received RO 0 1 = TX PCS has received LPI
0 = LPI not received

RX LPI Received:
10 RX LPI Received RO 0 1 = RX PCS has received LPI
0 = LPI not received

TX LPI Indication:
9 TX LPI Indication RO 0 1 = TX PCS is currently receiving LPI
0 = TX PCS is not currently receiving LPI

RX LPI Indication:
8 RX LPI Indication RO 0 1 = RX PCS is currently receiving LPI
0 = RX PCS is not currenly receiving LPI

7 Reserved RO 0 Reserved

TX Clock Stoppable:
6 TX Clock Stoppable RO 1 1 = MAC may stop clock during LPI
0 = TX Clock is not stoppable

5:0 Reserved RO 0 Reserved

表 8-152. 0x3014 MMD3 Energy Efficient Ethernet Capability Register (MMD3_EEE_CAPABILITY)

BIT NAME TYPE DEFAULT FUNCTION

15:3 Reserved RO 0 Reserved

EEE 1Gbps Enable:

2 EEE 1Gbps Enable RO 0 1 = EEE is supported for 1000Base-T
0 = EEE is not supported for 1000Base-T

EEE 100Mbps Enable:

1 EEE 100Mbps Enable RO 1 1 = EEE is supported for 100Base-TX
0 = EEE is not supported for 100Base-TX

0 Reserved RO 0 Reserved

表 8-153. 0x3016 MMD3 Wake Error Counter Register (MMD3_WAKE_ERR_CNT)

BIT NAME TYPE DEFAULT FUNCTION

EEE Wake Error Counter:

This register counts the wake time faults where the PHY fails to
complete its normal wake sequence within the time required for the
15:0 EEE Wake Error Counter RO, LH 0
specific PHY type.
This counter is cleared after a read and holds at all ones in the case
of overflow. PCS Reset also clears this register.

表 8-154. 0x703C MMD7 Energy Efficient Ethernet Advertisement Register

(MMD7_EEE_ADVERTISEMENT)
BIT NAME TYPE DEFAULT FUNCTION

15:2 Reserved RO 0 Reserved

Advertise 100Base-TX EEE:

1 Advertise 100Base-TX EEE RW,Strap 1 1 = Energy Efficient Ethernet is advertised for 100Base-TX
0 = Energy Efficient Ethernet is not advertised

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表 8-154. 0x703C MMD7 Energy Efficient Ethernet Advertisement Register

(MMD7_EEE_ADVERTISEMENT) (continued)
BIT NAME TYPE DEFAULT FUNCTION

0 Reserved RO 0 Reserved

表 8-155. 0x703D MMD7 Energy Efficient Ethernet Link Partner Ability Register (MMD7_EEE_LP_ABILITY)
BIT NAME TYPE DEFAULT FUNCTION

15:2 Reserved RO 0 Reserved

Link Partner EEE Capability:

1 Link Partner EEE Capability RO 0 1 = Link Partner is advertising EEE capability for 100Base-TX
0 = Link Partner is not advertising EEE capability for 100Base-TX

0 Reserved RO 0 Reserved

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9 Application and Implementation

备注
以下应用部分中的信息不属于 TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。

9.1 Application Information

The DP83822 is a single-port 10/100 Mbps Ethernet PHY. It supports connections to an Ethernet MAC through
MII, RMII, or RGMII. Connections to the Ethernet media are made via the IEEE 802.3 defined Media Dependent
Interface.
When using the device for Ethernet applications, it is necessary to meet certain requirements for normal
operation. The following subsections are intended to assist in appropriate component selection and required
circuit connections.
9.2 Typical Applications
图 9-1 shows a typical application for the DP83822. More typical application examples are given in this section.
100BASE-FX

MII

Transceiver
Fiber Optic
Capacitors
RMII
RGMII

DP83822
MAC 10/100 Mbps 10BASE-Te
Ethernet PHY 100BASE-TX

Magnetics
RJ-45

25-MHz / 50-MHz Status

Clock Source LEDs

Copyright © 2016, Texas Instruments Incorporated

图 9-1. Typical DP83822 Application

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9.2.1 TPI Network Circuit

图 9-2 shows the recommended twisted-pair interface network circuit for 10/100 Mbps. Variations with PCB and
component characteristics require that the application be tested to verify that the circuit meets the requirements
of the intended application.
Center tap of the transformer must be connected to analog supply rail (AVD) with decoupling capacitors close to
the transformer. All resistors and capacitors must be placed as close to the device as possible.
AVD
Supply

Pin 9
(RD-)
Ferrite bead for improved
3.3-V
49.9  Supply
EMC (op onal)
1:1

1
F 0.1 F RD -
49.9 

Pin 10 RD +
(RD+)

1 F 0.1 F

Pin 11 TD -
(TD-)
3.3-V
49.9  Supply
TD +

1 F 0.1 F 1:1
49.9  1 F 0.1 F RJ 45

Pin 12
(TD+)

图 9-2. TPI Network Circuit

[Link] Design Requirements

The design requirements for the DP83822 in TPI operation (100BASE-TX or 10BASE-Te) are:
1. AVD Suppy = 3.3 V or 1.8 V
2. Center Tap Supply = AVD Supply
3. VDDIO Supply = 3.3 V, 2.5 V, or 1.8 V
4. Reference Clock Input = 25-MHz or 50-MHz (RMII Slave)
[Link] Detailed Design Procedure
For the detailed design procedure of the TPI network circuit, see 节 [Link].
[Link] Application Curves
For expected TPI network MDI curves, see 图 7-18 and 图 7-19 and 图 7-21.

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9.2.2 Fiber Network Circuit

图 9-3 shows the recommended circuit for a 100-Mbps fiber network. Variations with PCB and component
characteristics require that the application be tested to verify that the circuit meets the requirements of the
intended application.
All resistors and capacitors should be placed as close to the fiber transceiver as possible.
3.3 V

49.9 Ÿ 49.9 Ÿ 49.9 Ÿ 49.9 Ÿ

Pin 12
(FX_TDP)
0.1 F

Pin 11
(FX_TDM)
0.1 F

DP83822 Pin 24
Fiber Transceiver
PHY (SD_IN)

Pin 10
(FX_RDP)
0.1 F

Pin 9
(FX_RDM)
0.1 F

Place resistors and capacitors

All values are typical and are ±1%
close to the fiber transceiver

Copyright © 2016, Texas Instruments Incorporated

图 9-3. Fiber Network Circuit

[Link] Design Requirements

[Link].1 Clock Requirements
The DP83822 supports an external CMOS-level oscillator source or an internal oscillator with an external crystal.
[Link].1.1 Oscillator
If an external clock source is used, XI should be tied to the clock source and XO should be left floating. The
amplitude of the oscillator should be a nominal voltage of VDDIO.

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备注
The DP83822 requires Clock to be present at PoR. In case clock is delayed, pull-down on XI is
recommended to avoid spurious signal latch-up.

[Link].1.2 Crystal
The use of a 25-MHz, parallel, 20-pF load crystal is recommended if operating with a crystal. A typical
connection diagram is shown below for a crystal resonator circuit. The load capacitor values will vary with the
crystal vendors; check with the vendor for the recommended loads.

XI XO
(pin 23) (pin 22)

R1

CL1 CL2

图 9-4. Crystal Oscillator Circuit

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表 9-1. 25-MHz Oscillator Specification

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency 25 MHz
Frequency Tolerance Including operational -100 100 ppm
temperature, aging and other
factors
Rise / Fall Time 10% - 90% 8 nsec
Jitter (Short Term) Cycle-to-cycle 50 100 psec
Jitter (Long Term) Accumulative over 10 ms 1 nsec
Symmetry Duty Cycle 40 60 %
Load Capacitance 15 30 pF

表 9-2. 50-MHz Oscillator Specification

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency 50 MHz
Frequency Tolerance Including operational -100 100 ppm
temperature, aging and other
factors
Rise / Fall Time 10% - 90% 8 nsec
Jitter (Short Term) Cycle-to-cycle 50 psec
Jitter (Long Term) Accumulative over 10 ms 1 nsec
Symmetry Duty Cycle 40 60 %
Load Capacitance 15 30 pF

表 9-3. 25-MHz Crystal Specification

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Frequency 25 MHz
Frequency Tolerance Including operational -100 100
temperature, aging and other ppm
factors
Load Capacitance 10 40 pF

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[Link] Detailed Design Procedure

The Media Independent Interface (MII / RMII / RGMII) connects the DP83822 to the Media Access Controller
(MAC). The MAC may in-fact be a discrete device or integrated into a microprocessor, CPU, FPGA, or ASIC.
The Media Dependent Interface (MDI) connects the DP83822 to the transformer of the Ethernet network or to
AC isolation capacitors when interfacing with a fiber transceiver.
[Link].1 MII Layout Guidelines
1. MII signals are single-ended signals
2. Traces should be routed with 50-Ω impedance to ground
3. Keep trace lengths as short as possible, less than two inches is recommended and less than six inches
maximum
[Link].2 RMII Layout Guidelines
1. RMII signals are single-ended signals
2. Traces should be routed with 50-Ω impedance to ground
3. Keep trace lengths as short as possible, less than two inches is recommended and less than six inches
maximum
[Link].3 RGMII Layout Guidelines
1. RGMII signals are single-ended signals
2. Traces should be routed with 50-Ω impedance to ground
3. Keep trace lengths as short as possible, less than two inches is recommended and less than six inches
maximum
4. Internal Clock Delay can be enabled on the transmit and receive path independently within the DP83822
using register access
[Link].4 MDI Layout Guidelines
1. MDI signals are differential
2. Traces should be routed with 50-Ω impedance to ground and 100-Ω differential controlled impedance
3. Route MDI traces to the transformer on the same layer
4. Use a metal shielded RJ-45 connector and electrically connect the shield to chassis ground
5. Avoid supplies and ground beneath the magnetics
6. Do not overlap the circuit ground and chassis ground planes. Keep chassis ground and circuit ground
isolated by turning chassis ground into an isolated island by leaving a gap between the planes. Connecting a
1206 (size) capacitor between chassis ground and circuit ground is recommended to avoid floating metal.
Capacitors less than 805 (size) can create an arching path for ESD due to a small air-gap.
[Link] Application Curves
For expected Fiber network MDI curve, see 图 7-20.

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10 Power Supply Recommendations

The DP83822 is capable of operating with a wide range of I/O supply voltages (3.3 V, 2.5 V, or 1.8 V) along with
any of the two analog supply options (3.3 V or 1.8 V).
The recommended power supply de-coupling network is shown below:

3.3-V, 2.5-V or
1.8-V Supply

VDDIO Ferrite bead for improved EMC

(pin 21) (optional)
10 nF 100 nF 1 F 10 F

Ferrite bead for improved EMC

(optional)
3.3-V or 1.8-V AVD
Supply (pin 14)
10 F 1 F 100 nF 10 nF

A. The smallest value is placed closest to the pin

图 10-1. Power Connections

备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.

10.1 Power Supply Characteristics

The following data was measured using a DP83822 evaluation module. All the power dissipation numbers are
measured at nominal voltage under typical temperature of 25°C. Center tap must be connected to the same
potential as the analog supply rail (AVD).
表 10-1. Power Supply Characteristics(1)
MAGNETIC AVD VDDIO TOTAL
PARAMETER TEST CONDITIONS SUPPLY SUPPLY SUPPLY POWER
(mA) (mA) (mA) (mW)
3.3-V AVD/CT AND 3.3-V VDDIO

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表 10-1. Power Supply Characteristics(1) (continued)

MAGNETIC AVD VDDIO TOTAL
PARAMETER TEST CONDITIONS SUPPLY SUPPLY SUPPLY POWER
(mA) (mA) (mA) (mW)
MII, Link-Up, No Traffic 22 36 15 241
MII, Link-Up, 960-ns IPG (100% 22 36 21
261
Utilization), 1514-byte Packets, 25oC
MII, Link-Up, 960-ns IPG (100% 22 25 20
221
Utilization), 1514-byte Packets, -40oC
MII, Link-Up, 960-ns IPG (100% 22 52 22
317
100BASE-TX Utilization), 1514-byte Packets, 125oC
RMII, Link-Up, No Traffic 22 36 6 211
RMII, Link-Up, 960-ns IPG (100% 22 36 7
215
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 22 36 8 218
RGMII, Link-Up, 960-ns IPG (100% 22 36 9
221
Utilization), 1514-byte Packets
MII, Link-Up, No Traffic 2 18 7 89
MII, Link-Up, 960-ns IPG (100% 49 18 7
244
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 2 18 6 86
10BASE-Te RMII, Link-Up, 960ns IPG (100% 49 18 6
241
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 2 18 7 89
RGMII, Link-Up, 960-ns IPG (100% 49 18 7
244
Utilization), 1514-byte Packets
Passive Sleep RMII, bits[15:12] = 0b0111 in register 2 16 6
79
0x0011
Active Sleep RMII, bits[15:12] = 0b0110 in register 2 16 6
79
0x0011
IEEE Power Down RMII, bits[11] = 1 in register 0x0000 2 4 6 40
Deep Power Down RMII, bits[11] = 1 in register 0x0000 and 2 3 6
36
bit[2] = 1 in register 0x0428
Energy Efficient Ethernet TX and RX LPI, RMII 2 17 6 83
3.3-V AVD/CT AND 1.8-V VDDIO
MII, Link-Up, No Traffic 22 36 10 209
MII, Link-Up, 960-ns IPG (100% 22 36 12
213
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 22 36 3 197
100BASE-TX RMII, Link-Up, 960-ns IPG (100% 22 36 4
199
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 22 36 5 200
RGMII, Link-Up, 960-ns IPG (100% 22 36 5
200
Utilization), 1514-byte Packets
MII, Link-Up, No Traffic 2 18 4 73
MII, Link-Up, 960ns IPG (100% 49 18 4
228
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 2 18 3 71
10BASE-Te RMII, Link-Up, 960-ns IPG (100% 49 18 3
227
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 2 18 4 73
RGMII, Link-Up, 960-ns IPG (100% 49 18 4
228
Utilization), 1514-byte Packets

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表 10-1. Power Supply Characteristics(1) (continued)

MAGNETIC AVD VDDIO TOTAL
PARAMETER TEST CONDITIONS SUPPLY SUPPLY SUPPLY POWER
(mA) (mA) (mA) (mW)
Passive Sleep RMII, bits[15:12] = 0b0111 in register 2 16 3
65
0x0011
Active Sleep RMII, bits[15:12] = 0b0110 in register 2 16 3
65
0x0011
IEEE Power Down RMII, bits[11] = 1 in register 0x0000 2 4 3 25
Deep Power Down RMII, bits[11] = 1 in register 0x0000 and 2 3 3
22
bit[2] = 1 in register 0x0428
Energy Efficient Ethernet TX and RX LPI, RMII 2 17 3 68

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 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

表 10-1. Power Supply Characteristics(1) (continued)

MAGNETIC AVD VDDIO TOTAL
PARAMETER TEST CONDITIONS SUPPLY SUPPLY SUPPLY POWER
(mA) (mA) (mA) (mW)
1.8-V AVD/CT AND 3.3-V VDDIO
MII, Link-Up, No Traffic 22 36 15 154
MII, Link-Up, 960-ns IPG (100% 22 36 21
174
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 22 36 6 124
100BASE-TX RMII, Link-Up, 960-ns IPG (100% 22 36 7
128
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 22 36 8 131
RGMII, Link-Up, 960-ns IPG (100% 22 36 9
134
Utilization), 1514-byte Packets
MII, Link-Up, No Traffic 1 17 7 56
MII, Link-Up, 960-ns IPG (100% 49 17 7
142
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 1 17 6 52
10BASE-Te RMII, Link-Up, 960-ns IPG (100% 49 17 6
139
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 1 17 7 56
RGMII, Link-Up, 960-ns IPG (100% 49 17 7
142
Utilization), 1514-byte Packets
Passive Sleep RMII, bits[15:12] = 0b0111 in register 1 16 6
50
0x0011
Active Sleep RMII, bits[15:12] = 0b0110 in register 1 16 6
50
0x0011
IEEE Power Down RMII, bits[11] = 1 in register 0x0000 1 4 6 29
Deep Power Down RMII, bits[11] = 1 in register 0x0000 and 1 3 6
27
bit[2] = 1 in register 0x0428
Energy Efficient Ethernet TX and RX LPI, RMII 1 17 6 52

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表 10-1. Power Supply Characteristics(1) (continued)

MAGNETIC AVD VDDIO TOTAL
PARAMETER TEST CONDITIONS SUPPLY SUPPLY SUPPLY POWER
(mA) (mA) (mA) (mW)
1.8-V AVD/CT AND 1.8-V VDDIO
MII, Link-Up, No Traffic 22 36 10 122
MII, Link-Up, 960-ns IPG (100% 22 36 12
126
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 22 36 3 110
100BASE-TX RMII, Link-Up, 960-ns IPG (100% 22 36 4
112
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 22 36 5 113
RGMII, Link-Up, 960-ns IPG (100% 22 36 5
113
Utilization), 1514-byte Packets
MII, Link-Up, No Traffic 1 17 4 40
MII, Link-Up, 960-ns IPG (100% 49 17 4
126
Utilization), 1514-byte Packets
RMII, Link-Up, No Traffic 1 17 3 38
10BASE-Te RMII, Link-Up, 960-ns IPG (100% 49 17 3
124
Utilization), 1514-byte Packets
RGMII, Link-Up, No Traffic 1 17 4 40
RGMII, Link-Up, 960-ns IPG (100% 49 17 4
126
Utilization), 1514-byte Packets
Passive Sleep RMII, bits[15:12] = 0b0111 in register 1 16 3
36
0x0011
Active Sleep RMII, bits[15:12] = 0b0110 in register 1 16 3
36
0x0011
IEEE Power Down RMII, bits[11] = 1 in register 0x0000 1 4 3 14
Deep Power Down RMII, bits[11] = 1 in register 0x0000 and 1 3 3
13
bit[2] = 1 in register 0x0428
Energy Efficient Ethernet TX and RX LPI, RMII 1 17 3 38

(1) Ensured by production test, characterization, or design.

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11 Layout
11.1 Layout Guidelines
11.1.1 Signal Traces
PCB traces are lossy and long traces can degrade signal quality. Traces should be kept short as possible.
Unless mentioned otherwise, all signal traces should be 50-Ω single-ended impedance. Differential traces
should be 50-Ω single-ended and 100-Ω differential. Take care to ensure impedance is controlled throughout.
Impedance discontinuities will cause reflections leading to emissions and signal integrity issues. Stubs should be
avoided on all signal traces, especially differential signal pairs.

图 11-1. Differential Signal Traces

Within the differential pairs, trace lengths should be run parallel to each other and matched in length. Matched
lengths minimize delay differences, avoiding an increase in common mode noise and emissions. Length
matching is also important for MAC interface connections. All transmit signal traces should be length matched to
each other and all receive signal traces should be length matched to each other.
Ideally, there should be no crossover or vias on signal path traces. Vias present impedance discontinuities and
should be minimized when possible. Route trace pairs on the same layer. Signals on different layers should not
cross each other without at least one return path plane between them. Differential pairs should always have a
constant coupling distance between them. For convenience and efficiency, TI recommends routing critical
signals first (that is, MDI differential pairs, reference clock, and MAC IF traces).

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11.1.2 Return Path

A general best practice is to have a solid return path beneath all signal traces. This return path can be a
continuous ground or DC power plane. Reducing the width of the return path can potentially affect the
impedance of the signal trace. This effect is more prominent when the width of the return path is comparable to
the width of the signal trace. Breaks in return path between the signal traces should be avoided at all cost. A
signal crossing a split plane may cause unpredictable return path currents and could impact signal quality and
result in emissions issues.

图 11-2. Differential Signal Pair and Plane Crossing

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11.1.3 Transformer Layout

There must be no metal layer running beneath the transformer. Transformers can inject noise into metal beneath
them, which can affect the performance of the system. Because the DP83822 is a current mode line driver
design, the center tap pin on the device side of the transformer must be tied to the analog supply rail (AVD). De-
coupling capacitors must be placed near the center tap pin of the transformer as shown in 图 9-2.
[Link] Transformer Recommendations
The following magnetics have been tested with the DP83822 using the DP83822EVM.
表 11-1. Recommended Transformers
MANUFACTURER PART NUMBER
HX1198FNL
HX1188NL
Pulse Electronics HX1188FNL
H2019NL
H1102NL
Abracon ALAN101
Bel Fuse S5585999J1F
Sumida CLP0612
7490120110
Wurth Electronics 733330
7490100111a

表 11-2. Transformer Electrical Specifications

PARAMETER TEST CONDITIONS TYP UNIT
Turn Ratio ±2% 1:1 -
Insertion Loss 1 - 100 MHz –1 dB
1 - 30 MHz –16 dB
Return Loss 30 - 60 MHz –12 dB
60 - 80 MHz –10 dB
1 - 50 MHz –30 dB
Differential to Common Rejection Ratio
50 - 150 MHz –20 dB
30 MHz –35 dB
Crosstalk
60 MHz –30 dB
Isolation HPOT 1500 Vrms

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11.1.4 Metal Pour

All metal pours that are not signals or power must be tied to ground. There must be no floating metal in the
system, and there must be no metal between differential traces.
11.1.5 PCB Layer Stacking
To meet signal integrity and performance requirements, a minimum four-layer PCB is recommended. However, a
six-layer PCB should be used when possible.

图 11-3. Recommended Layer Stack-Up

11.2 Layout Example

See the DP83822EVM for more information regarding layout.

Transformer
Plane
PHY Termination (if not RJ-45
Coupling
Component components integrated Connector
Components
in RJ-45)

Chassis
System Power/Ground Planes Ground Plane

图 11-4. Layout Example

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12 Device and Documentation Support

12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
表 12-1. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER ORDER NOW
DOCUMENTS SOFTWARE COMMUNITY
DP83822HF Click here Click here Click here Click here Click here
DP83822IF Click here Click here Click here Click here Click here
DP83822H Click here Click here Click here Click here Click here
DP83822I Click here Click here Click here Click here Click here

备注
These devices can not be differntiated by register reads. These devices are distinguished by
production tests of the corresponding functionalities.

12.2 接收文档更新通知
要接收文档更新通知，请导航至 [Link] 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
12.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
ProfiNET® is a registered trademark of PROFIBUS and PROFINET International (PI)..
所有商标均为其各自所有者的财产。
12.5 静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。

12.6 术语表
TI 术语表 本术语表列出并解释了术语、首字母缩略词和定义。

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13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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13.1 Package Option Addendum

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13.1.1 Packaging Information

Status Package Package Package Eco Plan Lead/Ball Op Temp
Orderable Device (1) Pins (2) MSL Peak Temp (3) Device Marking(4) (5)
Type Drawing Qty Finish (°C)
RoHS &
DP83822HFRHBR ACTIVE VQFN RHB 32 3000 NIPDAU Level-2-260C-1 YEAR -40 to 125 822HF
Green
RoHS &
DP83822HFRHBT ACTIVE VQFN RHB 32 250 NIPDAU Level-2-260C-1 YEAR -40 to 125 822HF
Green
RoHS &
DP83822HRHBR ACTIVE VQFN RHB 32 3000 NIPDAU Level-2-260C-1 YEAR -40 to 125 822H
Green
RoHS &
DP83822HRHBT ACTIVE VQFN RHB 32 250 NIPDAU Level-2-260C-1 YEAR -40 to 125 822H
Green
RoHS &
DP83822IFRHBR ACTIVE VQFN RHB 32 3000 NIPDAU Level-2-260C-1 YEAR -40 to 85 822IF
Green
RoHS &
DP83822IFRHBT ACTIVE VQFN RHB 32 250 NIPDAU Level-2-260C-1 YEAR -40 to 85 822IF
Green
RoHS &
DP83822IRHBR ACTIVE VQFN RHB 32 3000 NIPDAU Level-2-260C-1 YEAR -40 to 85 822I
Green
RoHS &
DP83822IRHBT ACTIVE VQFN RHB 32 250 NIPDAU Level-2-260C-1 YEAR -40 to 85 822I
Green

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using
this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please
check [Link] for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS
requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where
designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the
die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free
(RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb)
based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
space
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will
appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device
Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI
bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and
accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers
consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to
Customer on an annual basis.

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 DP83822HF, DP83822IF, DP83822H, DP83822I
[Link] ZHCSFD6G – JULY 2016 – REVISED AUGUST 2023

13.1.2 Tape and Reel Information

REEL DIMENSIONS TAPE DIMENSIONS
K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants
Reel Reel
Package Package A0 B0 K0 P1 W Pin1
Device Pins SPQ Diameter Width W1
Type Drawing (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) (mm)
DP83822HFRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822HFRHBT VQFN RHB 32 250 178.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822HRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822HRHBT VQFN RHB 32 250 178.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IFRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IFRHBT VQFN RHB 32 250 178.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IRHBT VQFN RHB 32 250 178.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1

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TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DP83822HFRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822HFRHBT VQFN RHB 32 250 210.0 185.0 35.0
DP83822HRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822HRHBT VQFN RHB 32 250 213.0 191.0 55.0
DP83822IFRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822IFRHBT VQFN RHB 32 250 213.0 191.0 55.0
DP83822IRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822IRHBT VQFN RHB 32 250 213.0 191.0 55.0

126 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated

Product Folder Links: DP83822HF DP83822IF DP83822H DP83822I

English Data Sheet: SNLS505
 PACKAGE OPTION ADDENDUM

[Link] 7-May-2024

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

DP83822HFRHBR ACTIVE VQFN RHB 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 822HF Samples

DP83822HFRHBT ACTIVE VQFN RHB 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 822HF Samples

DP83822HRHBR ACTIVE VQFN RHB 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 822H Samples

DP83822HRHBT ACTIVE VQFN RHB 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 822H Samples

DP83822IFRHBR ACTIVE VQFN RHB 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 822IF Samples

DP83822IFRHBT ACTIVE VQFN RHB 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 822IF Samples

DP83822IRHBR ACTIVE VQFN RHB 32 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 822I Samples

DP83822IRHBT ACTIVE VQFN RHB 32 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 822I Samples

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

[Link] 7-May-2024

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

[Link] 15-Jun-2024

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DP83822HFRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822HFRHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822HRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822HRHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IFRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IFRHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IRHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1
DP83822IRHBT VQFN RHB 32 250 180.0 12.4 5.3 5.3 1.1 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

[Link] 15-Jun-2024

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DP83822HFRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822HFRHBT VQFN RHB 32 250 210.0 185.0 35.0
DP83822HRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822HRHBT VQFN RHB 32 250 210.0 185.0 35.0
DP83822IFRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822IFRHBT VQFN RHB 32 250 210.0 185.0 35.0
DP83822IRHBR VQFN RHB 32 3000 367.0 367.0 35.0
DP83822IRHBT VQFN RHB 32 250 210.0 185.0 35.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

[Link] 15-Jun-2024

TRAY

L - Outer tray length without tabs KO -

Outer
tray
height

W-
Outer
tray
width
Text

P1 - Tray unit pocket pitch

CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device Package Package Pins SPQ Unit array Max L (mm) W K0 P1 CL CW
Name Type matrix temperature (mm) (µm) (mm) (mm) (mm)
(°C)
DP83822HFRHBR RHB VQFN 32 3000 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822HFRHBT RHB VQFN 32 250 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822HRHBR RHB VQFN 32 3000 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822HRHBT RHB VQFN 32 250 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822IFRHBR RHB VQFN 32 3000 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822IFRHBT RHB VQFN 32 250 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822IRHBR RHB VQFN 32 3000 35 x 14 150 315 135.9 7620 8.8 7.9 8.15
DP83822IRHBT RHB VQFN 32 250 35 x 14 150 315 135.9 7620 8.8 7.9 8.15

Pack Materials-Page 3
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