STP30N06

STP30N06FI
N - CHANNEL ENHANCEMENT MODE
POWER MOS TRANSISTOR

TYPE V DSS R DS( on) ID

STP30N06 60 V < 0.05 Ω 30 A
STP30N06FI 60 V < 0.05 Ω 19 A

■ TYPICAL RDS(on) = 0.045 Ω

■ AVALANCHE RUGGED TECHNOLOGY
■ 100% AVALANCHE TESTED
■ REPETITIVE AVALANCHE DATA AT 100oC
3 3
■ LOW GATE CHARGE 2 2
1 1
■ HIGH CURRENT CAPABILITY
■ 175oC OPERATING TEMPERATURE
■ APPLICATION ORIENTED TO-220 ISOWATT220
CHARACTERIZATION

APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SOLENOID AND RELAY DRIVERS
■ REGULATORS INTERNAL SCHEMATIC DIAGRAM
[Link] ■ DC-DC & DC-AC CONVERTERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ AUTOMOTIVE ENVIRONMENT (INJECTION,
ABS, AIR-BAG, LAMPDRIVERS, Etc.)

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit

STP30N06 STP30N06FI
VD S Drain-source Voltage (V GS = 0) 60 V
V DG R Drain- gate Voltage (R GS = 20 kΩ) 60 V
V GS Gate-source Voltage ± 20 V
o
ID Drain Current (continuous) at T c = 25 C 30 19 A
ID Drain Current (continuous) at T c = 100 oC 21 13 A
ID M(•) Drain Current (pulsed) 120 120 A
o
P tot Total Dissipation at Tc = 25 C 105 40 W
Derating Factor 0.7 0.27 W/o C
V ISO Insulation Withstand Voltage (DC)  2000 V
o
T stg Storage Temperature -65 to 175 C
o
Tj Max. Operating Junction Temperature 175 C
(•) Pulse width limited by safe operating area

December 1996 1/10

STP30N06/FI

THERMAL DATA

TO-220 ISOWATT220
o
R thj-cas e Thermal Resistance Junction-case Max 1.43 3.57 C/W
o
Rthj- amb Thermal Resistance Junction-ambient Max 62.5 C/W
o
Rt hc- sin k Thermal Resistance Case-sink Typ 0.5 C/W
o
Tl Maximum Lead Temperature For Soldering Purpose 300 C

AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
IA R Avalanche Current, Repetitive or Not-Repetitive 30 A
(pulse width limited by T j max, δ < 1%)
E AS Single Pulse Avalanche Energy 160 mJ
(starting T j = 25 o C, ID = I AR, VD D = 25 V)
E AR Repetitive Avalanche Energy 40 mJ
(pulse width limited by T j max, δ < 1%)
IA R Avalanche Current, Repetitive or Not-Repetitive 21 A
(T c = 100 o C, pulse width limited by T j max, δ < 1%)

o
ELECTRICAL CHARACTERISTICS (Tcase = 25 C unless otherwise specified)
OFF

Symbol Parameter Test Conditions Min. Typ. Max. Unit

V( BR)DSS Drain-source I D = 250 µA VG S = 0 60 V
Breakdown Voltage
I DS S Zero Gate Voltage V DS = Max Rating 1 µA
Drain Current (V GS = 0) V DS = Max Rating x 0.8 T c = 125 oC 10 µA
IG SS Gate-body Leakage V GS = ± 20 V ± 100 nA
Current (V D S = 0)

ON (∗)

Symbol Parameter Test Conditions Min. Typ. Max. Unit

V G S(th) Gate Threshold Voltage V DS = V GS ID = 250 µA 2 2.9 4 V
R DS( on) Static Drain-source On V GS = 10V ID = 15 A 0.045 0.05 Ω
Resistance
I D( on) On State Drain Current V DS > ID( on) x RD S(on) max 30 A
V GS = 10 V

DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs (∗) Forward V DS > ID( on) x RD S(on) max I D = 15 A 8 12 S
Transconductance
C iss Input Capacitance V DS = 25 V f = 1 MHz VG S = 0 950 1250 pF
C oss Output Capacitance 420 600 pF
C rss Reverse Transfer 110 200 pF
Capacitance

2/10
 STP30N06/FI

ELECTRICAL CHARACTERISTICS (continued)

SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t d(on) Turn-on Time V DD = 30 V ID = 30 A 50 70 ns
tr Rise Time R G = 50 Ω VGS = 10 V 190 270 ns
(see test circuit, figure 3)
(di/dt) on Turn-on Current Slope V DD = 40 V ID = 30 A 190 A/µs
R G = 50 Ω VGS = 10 V
(see test circuit, figure 5)
Qg Total Gate Charge V DD = 40 V ID = 30 A V GS = 10 V 30 45 nC
Q gs Gate-Source Charge 11 nC
Q gd Gate-Drain Charge 14 nC

SWITCHING OFF

Symbol Parameter Test Conditions Min. Typ. Max. Unit

t r(Vof f) Off-voltage Rise Time V DD = 40 V ID = 30 A 120 170 ns
tf Fall Time R G = 50 Ω VGS = 10 V 75 100 ns
tc Cross-over Time (see test circuit, figure 5) 180 250 ns

SOURCE DRAIN DIODE

Symbol Parameter Test Conditions Min. Typ. Max. Unit
IS D Source-drain Current 30 A
I SDM(•) Source-drain Current 120 A
(pulsed)
V S D (∗) Forward On Voltage I SD = 30 A VG S = 0 1.6 V
t rr Reverse Recovery I SD = 30 A di/dt = 100 A/µs 85 ns
Time V DD = 30 V T j = 150 o C
Q rr Reverse Recovery (see test circuit, figure 5) 0.25 µC
Charge
I RRM Reverse Recovery 6 A
Current
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area

Safe Operating Areas For TO-220 Safe Operating Areas For ISOWATT220

3/10
STP30N06/FI

Thermal Impedeance For TO-220 Thermal Impedance For ISOWATT220

Derating Curve For TO-220 Derating Curve For ISOWATT220

Output Characteristics Transfer Characteristics

4/10
 STP30N06/FI

Transconductance Static Drain-source On Resistance

Gate Charge vs Gate-source Voltage Capacitance Variations

Normalized Gate Threshold Voltage vs Normalized On Resistance vs Temperature

Temperature

5/10
STP30N06/FI

Turn-on Current Slope Turn-off Drain-source Voltage Slope

Cross-over Time Switching Safe Operating Area

Accidental Overload Area Source-drain Diode Forward Characteristics

6/10
 STP30N06/FI

Fig. 1: Unclamped Inductive Load Test Circuits Fig. 2: Unclamped Inductive Waveforms

Fig. 3: Switching Times Test Circuits For Fig. 4: Gate Charge Test Circuit
Resistive Load

Fig. 5: Test Circuit For Inductive Load Switching

And Diode Reverse Recovery Time

7/10
STP30N06/FI

TO-220 MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.067
F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203
G1 2.4 2.7 0.094 0.106
H2 10.0 10.40 0.393 0.409
L2 16.4 0.645
L4 13.0 14.0 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.2 6.6 0.244 0.260
L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151

E
A

D
C

D1

L2
F1

G1

H2
G

Dia.
F
F2

L5
L9
L7

L6 L4
P011C

8/10
 STP30N06/FI

ISOWATT220 MECHANICAL DATA

mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.4 0.7 0.015 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 0.385 0.417
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126

E
A

D
B

L3

L6

L7
F1

Ø
G1

G
H

F2

1 2 3

L2 L4
P011G

9/10
STP30N06/FI

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.

 1996 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved

SGS-THOMSON Microelectronics GROUP OF COMPANIES

Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
.

10/10