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Chapter 2

Chapter 2 of 'CMOS VLSI Design' focuses on CMOS transistor theory, covering topics such as MOS capacitors, nMOS and pMOS I-V characteristics, and the effects of capacitance on transistor performance. It explains the operational modes of transistors, including cutoff, linear, and saturation, and discusses the significance of channel charge and carrier velocity in determining current flow. The chapter also addresses pass transistors and their limitations in circuit design.

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0% found this document useful (0 votes)
11 views20 pages

Chapter 2

Chapter 2 of 'CMOS VLSI Design' focuses on CMOS transistor theory, covering topics such as MOS capacitors, nMOS and pMOS I-V characteristics, and the effects of capacitance on transistor performance. It explains the operational modes of transistors, including cutoff, linear, and saturation, and discusses the significance of channel charge and carrier velocity in determining current flow. The chapter also addresses pass transistors and their limitations in circuit design.

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zzzzzzz
Copyright
© All Rights Reserved
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Introduction to

CMOS VLSI
Design

Chapter 2:
CMOS Transistor Theory
copyright@David Harris, 2004
Updated by Li Chen, 2010

Outline
 Introduction
 MOS Capacitor
 nMOS I-V Characteristics
 pMOS I-V Characteristics
 Gate and Diffusion Capacitance
 Pass Transistors
 RC Delay Models

3: CMOS Transistor Theory CMOS VLSI Design Slide 2

1
Introduction
 So far, we have treated transistors as ideal switches
 An ON transistor passes a finite amount of current
– Depends on terminal voltages
– Derive current-voltage (I-V) relationships
 Transistor gate, source, drain all have capacitance
– I = C (DV/Dt) -> Dt = (C/I) DV
– Capacitance and current determine speed
 Also explore what a “degraded level” really means

3: CMOS Transistor Theory CMOS VLSI Design Slide 3

MOS Capacitor
 Gate and body form MOS capacitor
 Operating modes Vg < 0
polysilicon gate
silicon dioxide insulator
+
– Accumulation - p-type body

– Depletion (a)

– Inversion 0 < Vg < Vt


depletion region
+
-

(b)

Vg > V t
inversion region
+
- depletion region

(c)

3: CMOS Transistor Theory CMOS VLSI Design Slide 4

2
Terminal Voltages
 Mode of operation depends on Vg, Vd, Vs Vg

– Vgs = Vg – Vs + +
Vgs Vgd
– Vgd = Vg – Vd - -

– Vds = Vd – Vs = Vgs - Vgd V Vd


s -
Vds +
 Source and drain are symmetric diffusion terminals
– By convention, source is terminal at lower voltage
– Hence Vds ≥ 0
 nMOS body is grounded. First assume source is 0 too.
 Three regions of operation
– Cutoff
– Linear
– Saturation

3: CMOS Transistor Theory CMOS VLSI Design Slide 5

nMOS Cutoff
 No channel
 Ids = 0

Vgs = 0 Vgd
+ g +
- -
s d

n+ n+

p-type body
b

3: CMOS Transistor Theory CMOS VLSI Design Slide 6

3
nMOS Linear
 Channel forms
 Current flows from d to s
V > Vt
– e- from s to d Vgd = Vgs
gs
+ g +
- -
 Ids increases with Vds s d
Vds = 0
n+ n+
 Similar to linear resistor p-type body
b

Vgs > Vt
Vgs > Vgd > Vt
+ g +
- - Ids
s d

n+ n+
0 < Vds < Vgs-Vt
p-type body
b

3: CMOS Transistor Theory CMOS VLSI Design Slide 7

nMOS Saturation
 Channel pinches off
 Ids independent of Vds
 We say current saturates
 Similar to current source

Vgs > Vt
g Vgd < Vt
+ +
- -
s d Ids

n+ n+
Vds > Vgs-Vt
p-type body
b

3: CMOS Transistor Theory CMOS VLSI Design Slide 8

4
I-V Characteristics
 In Linear region, Ids depends on
– How much charge is in the channel?
– How fast is the charge moving?

3: CMOS Transistor Theory CMOS VLSI Design Slide 9

Channel Charge
 MOS structure looks like parallel plate capacitor
while operating in inversion
– Gate – oxide – channel
 Qchannel =

gate
Vg
polysilicon + +
gate V
source gs Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, εox = 3.9) p-type body
p-type body

3: CMOS Transistor Theory CMOS VLSI Design Slide 10

5
Channel Charge
 MOS structure looks like parallel plate capacitor
while operating in inversion
– Gate – oxide – channel
 Qchannel = CV
 C=

gate
Vg
polysilicon + +
gate source V gs
Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, εox = 3.9) p-type body
p-type body

3: CMOS Transistor Theory CMOS VLSI Design Slide 11

Channel Charge
 MOS structure looks like parallel plate capacitor
while operating in inversion
– Gate – oxide – channel
 Qchannel = CV
 C = Cg = eoxWL/tox = CoxWL Cox = eox / tox
 V=
gate
Vg
polysilicon + +
gate V
source gs Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, εox = 3.9) p-type body
p-type body

3: CMOS Transistor Theory CMOS VLSI Design Slide 12

6
Channel Charge
 MOS structure looks like parallel plate capacitor
while operating in inversion
– Gate – oxide – channel
 Qchannel = CV
 C = Cg = eoxWL/tox = CoxWL Cox = eox / tox
 V = Vgc – Vt = (Vgs – Vds/2) – Vt
gate
Vg
polysilicon + +
gate source V gs
Cg Vgd drain
W
Vs - - Vd
tox
channel
n+ - + n+
SiO2 gate oxide
Vds
L
n+ n+ (good insulator, εox = 3.9) p-type body
p-type body

3: CMOS Transistor Theory CMOS VLSI Design Slide 13

Carrier velocity
 Charge is carried by e-
 Carrier velocity v proportional to lateral E-field
between source and drain
 v=

3: CMOS Transistor Theory CMOS VLSI Design Slide 14

7
Carrier velocity
 Charge is carried by e-
 Carrier velocity v proportional to lateral E-field
between source and drain
 v = mE m called mobility
 E=

3: CMOS Transistor Theory CMOS VLSI Design Slide 15

Carrier velocity
 Charge is carried by e-
 Carrier velocity v proportional to lateral E-field
between source and drain
 v = mE m called mobility
 E = Vds/L
 Time for carrier to cross channel:
– t=

3: CMOS Transistor Theory CMOS VLSI Design Slide 16

8
Carrier velocity
 Charge is carried by e-
 Carrier velocity v proportional to lateral E-field
between source and drain
 v = mE m called mobility
 E = Vds/L
 Time for carrier to cross channel:
– t=L/v

3: CMOS Transistor Theory CMOS VLSI Design Slide 17

nMOS Linear I-V


 Now we know
– How much charge Qchannel is in the channel
– How much time t each carrier takes to cross

I ds =

3: CMOS Transistor Theory CMOS VLSI Design Slide 18

9
nMOS Linear I-V
 Now we know
– How much charge Qchannel is in the channel
– How much time t each carrier takes to cross
Qchannel
I ds =
t
=

3: CMOS Transistor Theory CMOS VLSI Design Slide 19

nMOS Linear I-V


 Now we know
– How much charge Qchannel is in the channel
– How much time t each carrier takes to cross
Qchannel
I ds =
t
= µCox Vgs − Vt − ds Vds
W V
L 2
W
= β Vgs − Vt − ds Vds
V β = µCox
 2 L

3: CMOS Transistor Theory CMOS VLSI Design Slide 20

10
nMOS Saturation I-V
 If Vgd < Vt, channel pinches off near drain
– When Vds > Vdsat = Vgs – Vt
 Now drain voltage no longer increases current

I ds =

3: CMOS Transistor Theory CMOS VLSI Design Slide 21

nMOS Saturation I-V


 If Vgd < Vt, channel pinches off near drain
– When Vds > Vdsat = Vgs – Vt
 Now drain voltage no longer increases current

I ds = β Vgs − Vt − dsat V
V
 dsat
 2 

3: CMOS Transistor Theory CMOS VLSI Design Slide 22

11
nMOS Saturation I-V
 If Vgd < Vt, channel pinches off near drain
– When Vds > Vdsat = Vgs – Vt
 Now drain voltage no longer increases current

I ds = β Vgs − Vt − dsat V
V
 dsat
 2 
β
= (Vgs − Vt )
2

3: CMOS Transistor Theory CMOS VLSI Design Slide 23

nMOS I-V Summary


 Shockley 1st order transistor models


 0 Vgs < Vt cutoff


I ds =  β  Vgs − Vt − ds V V < V
V
 ds linear
  
2 ds dsat

 β
( )
2
 V gs − Vt Vds > Vdsat saturation
2

3: CMOS Transistor Theory CMOS VLSI Design Slide 24

12
Example
 A 0.6 mm process from AMI Semiconductor
– tox = 100 Å
– m = 350 cm2/V*s 2.5
V =5 gs
– Vt = 0.7 V 2
 Plot Ids vs. Vds 1.5 V =4

Ids (mA)
gs

– Vgs = 0, 1, 2, 3, 4, 5 1
– Use W/L = 4/2 l 0.5
V =3 gs

Vgs = 2
Vgs = 1
0
0 1 2 3 4 5
W  3.9 • 8.85 ⋅ 10−14   W  W Vds
β = µCox = ( 350 )  −8   L  = 120 L µ A / V
2

L  100 ⋅ 10  

3: CMOS Transistor Theory CMOS VLSI Design Slide 25

pMOS I-V
 All dopings and voltages are inverted for pMOS
 Mobility mp is determined by holes
– Typically 2-3x lower than that of electrons mn
– 120 cm2/V*s in AMI 0.6 mm process
 Thus pMOS must be wider to provide same current
– In this class, assume mn / mp = 2

– *** plot I-V here

3: CMOS Transistor Theory CMOS VLSI Design Slide 26

13
Capacitance
 Any two conductors separated by an insulator have
capacitance
 Gate to channel capacitor is very important
– Creates channel charge necessary for operation
 Source and drain have capacitance to body
– Across reverse-biased diodes
– Called diffusion capacitance because it is
associated with source/drain diffusion

3: CMOS Transistor Theory CMOS VLSI Design Slide 27

Gate Capacitance
 Approximate channel as connected to source
 Cgs = eoxWL/tox = CoxWL = CpermicronW
 Cpermicron is typically about 2 fF/mm

polysilicon
gate
W
tox
L SiO2 gate oxide
n+ n+ (good insulator, εox = 3.9ε0)
p-type body

3: CMOS Transistor Theory CMOS VLSI Design Slide 28

14
Diffusion Capacitance
 Csb, Cdb
 Undesirable, called parasitic capacitance
 Capacitance depends on area and perimeter
– Use small diffusion nodes
– Comparable to Cg
for contacted diff
– ½ Cg for uncontacted
– Varies with process

3: CMOS Transistor Theory CMOS VLSI Design Slide 29

Pass Transistors
 We have assumed source is grounded
 What if source > 0? VDD
– e.g. pass transistor passing VDD VDD

3: CMOS Transistor Theory CMOS VLSI Design Slide 30

15
Pass Transistors
 We have assumed source is grounded
 What if source > 0? VDD
– e.g. pass transistor passing VDD VDD
 Vg = VDD
– If Vs > VDD-Vt, Vgs < Vt
– Hence transistor would turn itself off
 nMOS pass transistors pull no higher than VDD-Vtn
– Called a degraded “1”
– Approach degraded value slowly (low Ids)
 pMOS pass transistors pull no lower than Vtp

3: CMOS Transistor Theory CMOS VLSI Design Slide 31

Pass Transistor Ckts

VDD VDD VDD


VDD VDD
VDD

VDD

VDD
VSS

3: CMOS Transistor Theory CMOS VLSI Design Slide 32

16
Pass Transistor Ckts

VDD VDD VDD


VDD VDD
VDD
Vs = VDD-Vtn VDD-Vtn
VDD-Vtn VDD-Vtn

VDD
Vs = |Vtp| VDD-Vtn
VDD VDD-2Vtn
VSS

3: CMOS Transistor Theory CMOS VLSI Design Slide 33

Effective Resistance
 Shockley models have limited value
– Not accurate enough for modern transistors
– Too complicated for much hand analysis
 Simplification: treat transistor as resistor
– Replace Ids(Vds, Vgs) with effective resistance R
• Ids = Vds/R
– R averaged across switching of digital gate
 Too inaccurate to predict current at any given time
– But good enough to predict RC delay

3: CMOS Transistor Theory CMOS VLSI Design Slide 34

17
RC Delay Model
 Use equivalent circuits for MOS transistors
– Ideal switch + capacitance and ON resistance
– Unit nMOS has resistance R, capacitance C
– Unit pMOS has resistance 2R, capacitance C
 Capacitance proportional to width
 Resistance inversely proportional to width
d
s
kC
kC
R/k
d 2R/k
d
g k g kC
g k g
s kC kC
kC s
s
d

3: CMOS Transistor Theory CMOS VLSI Design Slide 35

RC Values
 Capacitance
– C = Cg = Cs = Cd = 2 fF/mm of gate width
– Values similar across many processes
 Resistance
– R ≈ 6 KW*mm in 0.6um process
– Improves with shorter channel lengths
 Unit transistors
– May refer to minimum contacted device (4/2 l)
– Or maybe 1 mm wide device
– Doesn’t matter as long as you are consistent

3: CMOS Transistor Theory CMOS VLSI Design Slide 36

18
Inverter Delay Estimate
 Estimate the delay of a fanout-of-1 inverter

2 Y 2
A
1 1

3: CMOS Transistor Theory CMOS VLSI Design Slide 37

Inverter Delay Estimate


 Estimate the delay of a fanout-of-1 inverter
2C

2C
2C
2 Y 2
A Y
1 1
C
R C

3: CMOS Transistor Theory CMOS VLSI Design Slide 38

19
Inverter Delay Estimate
 Estimate the delay of a fanout-of-1 inverter
2C

2C 2C
2C 2C
2 Y 2
A Y
1 1 R C
C
R C C

3: CMOS Transistor Theory CMOS VLSI Design Slide 39

Inverter Delay Estimate


 Estimate the delay of a fanout-of-1 inverter
2C

2C 2C
2C 2C
2 Y 2
A Y
1 1 R C
C
R C C

d = 6RC

3: CMOS Transistor Theory CMOS VLSI Design Slide 40

20

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