Subject Name: Industrial Electronics
Semester: III
Theory Hour: 44h
TOPICS:
SL NO MAJOR TOPICS HOURS
1.0 Introduction 2
2.0 Motor 6
3.0 Power Semiconductor devices 8
4.0 Inverters 6
5.0 Power supplies 4
6.0 UPS 2
7.0 Basics of PCB 8
8.0 Electromechanical devices 6
9.0 Handling of Electronic components 2
Total 44
DETAILED SYLLABUS
TOPIC TOPIC NAMES HOURS
NO
1.0 Introduction 2
1.1 Power Electronics Vs Linear Electronics – Scope & Application
2 Motor 6
2.1 Motor working principle, Type, Application and Specification of DC
Motor, Induction Motor, Special Purpose Motors
3 Power Semiconductor devices 8
3.1 Introduction
3.2 Structure, Characteristics, Operation, Limitations - Power Diodes,
SBJTs & MOSFETs, Thyristors, GTOs, IGBTs
4 Inverters 6
4.1 Introduction
4.2 Basic concepts of switch mode Inverters
4.3 Single phase Half, Full Bridge, Push – Pull Inverters
4.4 Three Phase Inverters
5 Power supplies 4
5.1 Introduction
5.2 Linear Power Supplies
5.3 Switching Power Supplies
5.4 Protection, Isolation
5.5 Specification and Application
6.0 UPS 2
6.1 Block diagram
6.2 Working principle
7.0 Basics of PCB 8
7.1 Introduction to PCB
7.2 Classification of PCB
7.3 Plated through hole Technology
7.4 Through hole mount Components
7.5 Heat Sinks
7.6 Introduction to SMT
7.7 Benefits of Surface mount Technology
7.8 Surface Mount Components
8.0 Electromechanical devices 6
8.1 Types, Application and specifications of Relay, Solenoid, MCB,
Switches
9.0 Handling of Electronic components 2
9.1 ESD and MSD
Subject Name: Digital Electronics
Semester: III
Theory Hours: 44
TOPICS:
SL NO MAJOR TOPICS HOURS
1.0 Introduction to digital electronics 02
2.0 Number systems and codes 04
3.0 Logic gates and Boolean Algebra 08
4.0 Combinational logic circuits 10
5.0 Latches & flip-flops 8
6.0 Sequential Logic Circuits 10
7.0 Types of memory 2
Total
44
DETAILED SYLLABUS
TOPIC TOPIC NAMES HOURS
NO
1.0 Introduction to Digital Electronics 02
1.1 Difference between Analog Signals& Digital Signals
2.0 Number Systems & Codes 04
2.1 Decimal System, Binary System, Octal System, Hexadecimal System,
BCD codes.
2.2 1’s and 2’s complement
2.3 Number Conversion
2.4 BCD code, Gray, Excess 3, ASCII, EBCDIC code
3.0 Logic gates and Boolean Algebra 08
3.1 NOT, OR, AND, NAND, NOR, EX-OR, EX-NOR
3.2 Boolean Operation
3.3 Demorgan’s Theorem
4.0 Combinational logic circuits 10
4.1 Universal property of NAND and NOR gate
4.2 Half and full address
4.3 Decoders and Encoders
4.4 Multiplexer and De Multiplexer
5.0 Latches & flip-flops 8
5.1 Latches, types, and operation
5.2 Flip flops, different types of flip flops
5.3 Applications of Flip flops
6.0 Sequential Logic Circuits 10
6.1 Introduction to counters
6.2 Asynchronous and Synchronous counter
6.3 Up/Down, cascade counters
6.4 Application of Counter
6.5 Shift register.
7.0 Types of memory 2
7.1 RAM
7.2 ROM
7.3 EPROM
Subject Name: Material Technology
Semester: III
Theory Hour: 44
TOPICS:
SL NO MAJOR TOPICS HOURS
1.0 Properties of Materials 4
2.0 Ferrous Metals 8
3.0 Standard Steel Section and Sheets –Referring Standards 8
4.0 Non – Ferrous Metals and Alloys 8
5.0 Plastics 8
6.0 Insulators 4
7.0 Conductors 4
Total 44
TOPIC TOPIC NAMES HOURS
NO
1.0 Properties of Materials 04
1.1 Mechanical Properties
1.2 Electrical Properties
1.3 Thermal Properties
2.0 Ferrous Metals- Steel
08
2.1 Plain Carbon
2.2 Alloy Steel
2.3 Properties and Application of - Low Carbon Steel, Medium
Carbon Steel, High Carbon Steel, Alloy Steel
3.0 Standard Steel Section and Sheets –Referring Standards 8
3.1 Standard stainless-steel section and Sheets’ –Referring Standards
04 Non – Ferrous Metals and Alloys 8
4.1 Properties and Application of the following- Copper, Aluminium,
Zinc, Tin, Brass and Bronze
5.0 Plastics 8
5.1 Thermo- Plastics and Thermosetting Plastics
5.2 Properties and Application of the following Thermo Plastic – LDPE,
HDPE, PS, PP, PA, PMMA, PVC
06 Insulators 4
6.1 Properties of Insulator
6.2 Common Insulating Material – Application
6.3 Insulating Material Used in Schneider Electric Products
07 Conductors 4
7.1 Properties of Electrical Conductor
7.2 Common Electrical Conductors- Application
7.3 Conductors used in Schneider Electric Products
Subject Name: Sensors and Transducers
Semester: III
Theory Hour: 42
TOPICS:
SL NO MAJOR TOPICS HOURS
1.0 Mechanical Transducers 10
2.0 Electrical Transducers 16
3.0 Proximity Sensors 08
4.0 Feed Back Instruments 08
Total 42
DETAILED SYLLABUS
TOPIC HOURS
NO TOPIC NAMES
1.0 Mechanical Transducers 10
1.1 Temperature - Bimetallic (Thermo Couples), Fluid Expansion,
Thermometer
1.2 Pressure – Manometer, Bourdon Gauge, Force – Balanced Load Cell,
Level to Pressure Conversion
1.3 Flow - Pitot Static Tubes, Turbine Type, Flow meter
2.0 Electrical Transducers 16
2.1 Resistance Thermometer
2.2 Resistance Strain Gauges
2.3 Inductive Transducer (LVDT).
2.4 Capacitor Transducers
2.5 Piezo electric and Magneto strictive
2.6 Photoelectric Transducer
2.7 Tachometer
3.0 Proximity Sensors 08
3.1 Reed Sensor.
3.2 Inductive Proximity Sensor
3.3 Capacitive Proximity Sensor
3.4 Optical Sensor
4.0 Feed Back Instruments 08
4.1 Principles of Feedback
4.2 Merits and Demerits of feedback
4.3 Digital Voltmeter
4.4 Digital Records
4.5 Radiation Type pyrometer
4.6 Ionization and Electromagnetic flow meter
Subject Name: Assembling and testing of Products – Elective (Industry Specific)
Semester: III
Theory Hour: 60
TOPICS:
SL NO MAJOR TOPICS HOURS
1.0 Stripping Insulation from Conductors Cable 12
2.0 Crimp Connections 12
3.0 Connector Assembly 12
4.0 Harness Identification 12
5.0 Connector Mating Testing & Inspection 12
Total 60
DETAILED SYLLABUS
HOURS
TOPIC TOPIC NAMES
NO
Stripping Insulation from Conductors Cable 12
1.0
1.1 Stripping Round Conductors
1.2 Stripping Jackets Over Shields
Stripping Flat Conductor Cable
1.3
Crimp Connections 12
2.0
2.1 Inspection of Crimp Contact
Process Controls
2.2
Connector Assembly 12
3.0
Assembly of Crimp-Type connectors
3.1
Assembly of Solder-Type Connectors
3.2
Assembly of Hermetic and Environmental connectors
3.3
Assembly of Adapters and cable clamp connectors
3.4
Assembly of RF connectors and coaxial contacts
3.5
Process controls for two-piece crimp rings and Stub-Type splicing
3.6
devices
Inspection and Verification Testing
3.7
Harness Identification 12
4.0
Permanent Identification
4.1
Verification of Identification
4.2
Connector Mating Testing & Inspection 12
5.0
5.1 Connector Mating and De-mating
Testing
5.2
Subject Name: Soldering Techniques– Elective (Industry Specific)
Semester: III
Theory Hour: 60
TOPICS:
SL NO HOURS
MAJOR TOPICS
1.0 Introduction to Connectivity 08
2.0 Types of Printed Circuit Board 08
3.0 Circuit Components 08
4.0 Soldering Temperature Characteristics 08
5.0 Soldering 12
6.0 Through Hole Assembly Technology 08
7.0 Surface Mount Technology 08
Total 60
DETAILED SYLLABUS
HOURS
TOPIC TOPIC NAMES
NO
1.0 Introduction to Connectivity 08
1.1 Fundamental Criteria of Connectivity
1.2 Solder Lead Density
1.3 PCB Board Track Density
2.0 Types of Printed Circuit Board 08
2.1 Introduction
2.2 Classification of Printed Circuit Board
2.3 Graphically Produced Boards
2.4 Plated Through-Hole Technology
3.0 Circuit Components 08
3.1 Introduction
3.2 Through Hole Mount Components
3.3 SMT Components
3.4 Heat Sinks
4.0 Soldering Temperature Characteristics 08
Effect of the following Parameters on Temperature -Solder Tip,
4.1
Workstation, Posture of soldering
Effect of Temperature on the following - Solder Quality, Effect on
4.2 Product
5.0 Soldering 12
Types of Soldering
5.1 Soft soldering – Procedure and Application
Silver soldering – Procedure and Application
Solders
Soldering material used in Electronic / Electrical Industry –
5.2
Specification and Application
Solders used in DEUTSCH Connectors – Specification
Flux
5.3 Flux used in soldering – Specification and Application
Flux used in DEUTSCH Connectors – Specification
Soldering Iron
Basic soldering Iron – Specification and Application
Temperature controlled soldering Iron - Specification and Application
5.4
Soldering Station - Specification and Application
Soldering Procedure
De-soldering Procedure
6.0 Through Hole Assembly Technology 08
6.1 Introduction
6.2 Advantages of Through Hole Assembly Technology
6.3 Design
6.4 Manufacturing Process
6.5 Inspection
7.0 Surface Mount Technology 08
7.1 Introduction
7.2 Advantages of Surface Mount Technology
7.3 Design
7.4 Manufacturing Process
7.5 Inspection
Subject Name: Digital Electronics Lab
Semester: III
Practical Hour: 30
LIST OF EXPERIMENTS
EX NO EXERCISES HOURS
1 Familiarization of Logic Gates 5
2 Universal Property of NAND, NOR gates 5
3 Boolean Algebra 6
4 Multiplexer 4
5 Demultiplexers 4
6 Half adder and Full adder 6
Total 30
Subject Name: Industrial Electronics Lab
Semester: III
Practical Hour: 30
LIST OF EXPERIMENTS
EX EXERCISES HOURS
NO
1 Familiarization of Protecting Devices 10
2 Familiarization of Motors 10
3 Familiarization of PCB Fabrication process 10
Total 30
Subject Name: Sensors and Transducers Lab
Semester: III
Practical Hour: 12
LIST OF EXPERIMENTS
EX NO EXERCISES HOURS
1 Mechanical sensors – Identification and Specification 4
– Thermocouple, Load cell
2 Electrical transducer – Identification and 4
Specification – Strain Gauge, Photoelectric.
3 Proximity Sensors – Identification and specification – 4
Reed Sensor, Inductive, Capacitive, Optical
proximity sensor.
Total 12