PowerEdge R910

Technical Guide

The Dell PowerEdge

R910 is easy to deploy,
manage and maintain.
Designed to save
customers time and
money and to focus on
what matters most:
their people and their
business.
This document is for informational purposes only. Dell reserves the right to make changes without
further notice to any products herein. The content provided is as is and without express or implied
warranties of any kind.

Dell, the Dell logo, PowerEdge, PowerVault, ReadyRails, and Dell OpenManage are trademarks of
Dell, Inc. Citrix and XenServer are registered trademarks of Citrix Systems, Inc. and/or one or more
of its subsidiaries, and may be registered in the United States Patent and Trademark Office and in
other countries. Intel, Xeon, and SpeedStep are registered trademarks and MMX and Core are
trademarks of Intel Corporation in the U.S. and other countries. Broadcom and NetXtreme are
registered trademarks of Broadcom Corporation and/or its affiliates in the United States, certain
other countries and/or the EU. Emulex is a registered trademark of Emulex Corporation. ENERGY
STAR is a registered trademark of the U.S. Environmental Protection Agency. Fusion-io is a registered
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©Copyright 2012 Dell Inc. All rights reserved. Reproduction or translation of any part of this work
beyond that permitted by U.S. copyright laws without the written permission of Dell Inc. is unlawful
and strictly forbidden.
September 2013 | Version 6.0

Dell PowerEdge R910 Technical Guide ii

 Table of Contents
1 Product Comparison ........................................................................................... 6
1.1 Overview .................................................................................................. 6
1.2 Purpose-Built for Reliability ............................................................................ 6
1.3 Efficient Infrastructure .................................................................................. 6
1.4 Intelligent Platforms, Connected Foundations ....................................................... 6
1.5 Comparison ............................................................................................... 7
2 Key Technologies............................................................................................... 8
2.1 Overview .................................................................................................. 8
2.2 Intel Processors Feature Set ............................................................................ 8
2.3 Memory Controller ....................................................................................... 9
2.4 Internal Dual SD Module (IDSM) ........................................................................ 9
2.5 10Gb Embedded NIC ..................................................................................... 9
3 System Information .......................................................................................... 10
4 Mechanical .................................................................................................... 13
4.1 Chassis Description..................................................................................... 13
4.2 Dimensions and Weight ................................................................................ 13
4.3 Front Panel View and Features ...................................................................... 14
4.4 Back Panel View and Features ....................................................................... 15
4.5 Power Supply Indicators ............................................................................... 15
4.6 NIC Indicators ........................................................................................... 15
4.7 Rails and Cable Management ......................................................................... 16
4.8 Fans ...................................................................................................... 16
4.9 Security .................................................................................................. 16
4.9.1 Cover Latch ....................................................................................... 16
4.9.2 Bezel ............................................................................................... 16
4.9.3 Hard Drive ......................................................................................... 16
4.9.4 Trusted Platform Module (TPM) ................................................................ 16
4.9.5 Power Off Security ............................................................................... 17
4.9.6 Intrusion Alert .................................................................................... 17
4.9.7 Secure Mode ...................................................................................... 17
4.10 USB Key .................................................................................................. 17
4.11 Battery ................................................................................................... 17
4.12 Field Replaceable Units (FRU)........................................................................ 17
4.13 User Accessible Jumpers, Sockets, and Connectors ............................................... 17
5 Power, Thermal, Acoustic .................................................................................. 18
5.1 Power Supplies and Power Subsystem .............................................................. 18
5.2 Environmental Specifications......................................................................... 20
5.3 Thermal.................................................................................................. 21
5.4 Acoustics ................................................................................................ 21
6 Processors ..................................................................................................... 24
6.1 Overview ................................................................................................ 24
6.2 Features ................................................................................................. 24
6.3 Supported Processors .................................................................................. 25
6.4 Processor Configurations .............................................................................. 25
6.5 Additional Processor Information .................................................................... 26
7 Memory ........................................................................................................ 27
7.1 Overview ................................................................................................ 27
7.2 Slots and Risers ......................................................................................... 27
7.3 Key Features of the Memory Subsystem ............................................................ 27
7.4 Memory Speed Limitations ............................................................................ 28

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 7.5 Sparing ................................................................................................... 28
7.6 Mirroring ................................................................................................. 28
7.7 RAID ...................................................................................................... 28
7.8 Supported Configurations ............................................................................. 28
8 Chipset ........................................................................................................ 29
8.1 Intel 7500 Chipset I/O Hub (IOH) .................................................................... 29
8.2 IOH QuickPath Interconnect (QPI) ................................................................... 29
8.3 PCI Express Generation 2 ............................................................................. 29
8.4 Direct Media Interface (DMI) ......................................................................... 29
8.5 Intel I/O Controller Hub 10 (ICH10) ................................................................. 29
8.6 PCI Express Connectors................................................................................ 30
9 BIOS ............................................................................................................ 31
9.1 Overview ................................................................................................ 31
9.2 I2C ........................................................................................................ 31
10 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 32
10.1 Overview ................................................................................................ 32
10.2 Option 1: 1GbE I/O riser .............................................................................. 32
10.3 Option 2: 10Gb I/O riser .............................................................................. 32
11 PCI Slots ....................................................................................................... 33
11.1 Overview ................................................................................................ 33
11.2 Quantities and Priorities .............................................................................. 33
11.3 PCI Card Dimensions ................................................................................... 33
12 Storage ........................................................................................................ 34
12.1 Overview ................................................................................................ 34
12.2 Backplanes .............................................................................................. 34
12.2.1 2.5” x4 Backplane ................................................................................ 34
12.2.2 2.5” x16 Backplane .............................................................................. 34
12.3 Flash BIOS Memory ..................................................................................... 34
12.4 Drives .................................................................................................... 34
12.5 RAID Configurations .................................................................................... 35
12.6 Storage Controllers .................................................................................... 37
12.6.1 PERC H200 ......................................................................................... 37
12.6.2 PERC H700 ......................................................................................... 37
12.6.3 PERC H800 ......................................................................................... 38
12.6.4 Storage Card Support Matrix .................................................................... 38
12.7 LED Indicators .......................................................................................... 39
12.8 Optical Drives ........................................................................................... 39
13 Video ........................................................................................................... 40
14 Rack Information ............................................................................................. 41
14.1 Overview ................................................................................................ 41
14.2 Rails ...................................................................................................... 41
14.3 Cable Management Arm (CMA) ....................................................................... 42
14.4 Rack View ............................................................................................... 42
15 Operating Systems ........................................................................................... 44
16 Systems Management ........................................................................................ 45
16.1 Overview ................................................................................................ 45
16.2 Server Management .................................................................................... 45
16.3 Embedded Server Management ...................................................................... 46
16.4 Dell Lifecycle Controller and Unified Server Configurator ....................................... 46
16.5 Integrated Dell Remote Access Controller.......................................................... 46
16.6 iDRAC Express........................................................................................... 47
16.7 iDRAC6 Enterprise ...................................................................................... 47
16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media ............................................. 47

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17 Peripherals .................................................................................................... 50
17.1 USB peripherals......................................................................................... 50
Appendix A. Volatility ........................................................................................... 51
Appendix B. Certifications ..................................................................................... 60
B 1. Regulatory Certifications ............................................................................. 60
B 2. Product Safety Certifications ......................................................................... 60
B 3. Electromagnetic Compatibility ....................................................................... 61
B 4. Ergonomics, Acoustics and Hygienics ............................................................... 61
Appendix C. Industry Standards ............................................................................... 62

Tables
Table 1. Comparison of PowerEdge R910 to R710 and R810 ............................................... 7
Table 2. Features Summary .................................................................................. 10
Table 3. Power Supply Status ................................................................................ 15
Table 4. Power Supply System Configurations ............................................................. 19
Table 5. Power Supply Specifications ....................................................................... 20
Table 6. Environmental Specifications ...................................................................... 20
Table 7. Acoustical Performance ............................................................................ 23
Table 8. Supported Intel Xeon E7-8800 Product Family .................................................. 25
Table 9. Supported Intel Xeon E7-4800 Product Family .................................................. 25
Table 10. Supported Intel Xeon Processor 7500 Series .................................................... 25
Table 11. Supported Hard Drives.............................................................................. 35
Table 12. RAID Configurations ................................................................................. 35
Table 13. Storage Card Support Matrix....................................................................... 38
Table 14. Supported Video Modes ............................................................................ 40
Table 15. Rack Types Supported .............................................................................. 42
Table 16. Rail Adjustability Range and Depth............................................................... 42
Table 17. Unified Server Configurator Features and Description......................................... 46
Table 18. Features List for Base Management Functionality, iDRAC, and vFlash Media .............. 48
Table 19. Volatility Information ............................................................................... 51
Table 20. Product Safety Certifications ...................................................................... 60
Table 21. Electromagnetic Compatibility Certifications ................................................... 61
Table 22. Ergonomics, Acoustics and Hygienics............................................................. 61
Table 23. Industry Standards .................................................................................. 62

Figures
Figure 1. Dimensions ........................................................................................... 13
Figure 2. Front Panel View .................................................................................... 14
Figure 3. Back Panel View ..................................................................................... 15
Figure 4. Power Supply ........................................................................................ 18
Figure 5. 2.5” Hard Drive Carrier ............................................................................ 35
Figure 6. ReadyRails Sliding Rails with Optional CMA ..................................................... 41
Figure 7. R910 Mounted in the B2 Sliding Rails ............................................................. 43
Figure 8. R910 CMA Mounted on the Side Opposite the Power Supplies (Recommended) ........... 43

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1 Product Comparison
1.1 Overview
The Dell™ PowerEdge™ R910 provides performance and reliability in a scalable 4U, four-socket
server. The memory density and powerful I/O capability of the R910 makes it a great virtualization
environment for large workload consolidation. The R910 provides extreme reliability, from the
processor-level Intel® Advanced RAS (Reliability, Availability, Serviceability) Technology to the
internal dual SD modules it uses for hypervisor redundancy. The built-in reliability of Dell servers
minimizes downtime for mission-critical workloads.
The R910 is designed to maximize the efficiency of each component of the server—memory, I/O and
energy consumption. The R910 also has intelligence integrated into the hardware in the form of the
Lifecycle Controller, making the management of your infrastructure easier.

1.2 Purpose-Built for Reliability

The PowerEdge R910 is built for reliability through factory integration and validation. The Dell “one-
touch” process is designed to ensure one person is responsible for the entire server build, resulting in
greater quality control. Every fully configured Dell server is tested (and re-tested) before it leaves
the factory, providing customers with a fully configured and tested, ready-to-deploy server.
In addition, an internal dual (redundant) SD module provides failover for the hypervisor. This feature
was designed based on customer reliability feedback. Dell listened and delivered.
With Intel Advanced RAS Technology features never before seen in an industry-standard server, the
PowerEdge R910 can automatically monitor, report, and recover from hardware errors to maintain
data integrity and keep mission-critical services online.

1.3 Efficient Infrastructure

To maximize workload capability in the data center, performance resources, power efficiency, I/O
and memory scalability are essential. The PowerEdge R910 delivers the high-performing Intel Xeon®
E7-4800 and E7-8800 product family or the Intel Xeon processor 7500 series, up to 2 TB of DDR3
memory, and 2 x 10Gb optional LOM with ten PCIe slots to help consolidate inefficient workloads.
The PowerEdge R910 uses an energy-efficient design that leverages Energy Smart technologies. It
includes power management features that enable power capping, power inventory, and power
budgeting in your specific environment. The design also considers the layout of the internal
components to allow airflow direction to keep the server cool.

1.4 Intelligent Platforms, Connected Foundations

The PowerEdge R910 follows the eleventh-generation PowerEdge behavioral specifications with the
same system design commonality and usability as the entire portfolio. All eleventh-generation
servers are designed to make the user experience easier while saving time and money.
Dell system management solutions focus on simplicity, efficiency, cost containment and reduction,
and an adherence to open standards. Our systems management solutions are complemented by,
connected to, and integrated with third-party offerings, delivering comprehensive solutions across
the complete solutions stack.
The Lifecycle Controller is a chip that is integrated on the server. It helps to simplify administrator
tasks by performing a complete set of provisioning functions such as system deployment, system
updates, hardware configuration, and diagnostics in a pre-OS environment—all from a single,
intuitive interface called the Unified Server Configurator (USC).

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1.5 Comparison
A product comparison of the PowerEdge R910 to the R710 and R810 servers is detailed in Table 1.

Table 1. Comparison of PowerEdge R910 to R710 and R810

Feature PowerEdge R710 PowerEdge R810 PowerEdge R910

Chipset Intel® 5520 Intel® 7500 Intel® 7500

Intel Xeon® 5500/5600 Intel Xeon® E7-2800, Intel Xeon® E7-4800 and
Quad-core or six-core E7-4800, and E7-8800 E7-8800 product family
Processor product family Intel Xeon processor 7500
Intel Xeon processor 6500 series
and 7500 series

Sockets 2 2 or 4 4

Memory Up to 18 x DDR3 Up to 32 x DDR3 Up to 64 x DDR3

DIMM Capacity 1, 2, 4, 8, and 32GB 1, 2, 4, 8, 16, and 32GB 1, 2, 4, 8, 16, and 32GB

4 PCIe Gen2 slots + 1 storage 6 PCIe Gen2 slots + 1 Standard: 7 PCIe Gen2 slots
slot: storage slot: (two x4, four x8, one x16)
Slots Two x8 slots Five x8 slots Optional: 10 PCIe Gen2
Two x4 slots One x4 slot (six x4, four x8)
One x4 storage slot One storage x4 slot (Slot5 is G1)

8 x 2.5” or 6 x 3.5” 6 x 2.5” 16 x 2.5”

Hard Drive Bays
Hot-plug Hot-plug Hot-plug

Power Supply Hot-plug, redundant Hot-plug, redundant Hot-plug, redundant

Broadcom® BCM5709C Broadcom® BCM5709C 1GbE or 10Gb Embedded NIC

4 x iSCSI TOE 4 x iSCSI TOE Options:
Optional: various NICs Optional: various NICs 4-port (4 x 1GbE) Embedded
available available NIC Broadcom 5709c, or
NIC/LOM 4-port (2 x 10Gb SFP+ and 2
x 1GbE) Embedded NIC
Broadcom® 57711 +
Broadcom 5709c
Optional: various NICs
available

iDRAC6 Express, BMC, IPMI iDRAC6 Express, BMC, IPMI iDRAC6 Express, BMC, IPMI
Server 2.0, Dell™ OpenManage™ 2.0, Dell™ OpenManage™ 2.0, Dell™ OpenManage™
Management Optional: iDRAC6 Enterprise, Optional: iDRAC6 Enterprise, Optional: iDRAC6 Enterprise,
vFlash media vFlash media vFlash media

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2 Key Technologies
2.1 Overview
The Intel® Xeon® E7-4800 and E7-8800 product family and the Intel Xeon processor 7500 series are
designed specifically for server applications. These processors feature 4-core, 6-core, 8-core, and
10-core processing to maximize performance and performance/watt for data center infrastructures
and highly dense deployments. These Intel Xeon processors also feature Intel Core™ micro-
architecture and Intel 64 architecture for flexibility in 64-bit and 32-bit applications and operating
systems.
The PowerEdge R910 implements a number of new technologies:
 Intel® Xeon® E7-8800 and E7-4800 product family
 32GB low-voltage (LV) DIMMs
 Fusion-io® solid-state storage cards
The Dell™ PowerEdge™ R910 also implements some existing key technologies:
 Intel 7500 chipset
 DDR3 RDIMM memory
 Internal dual SD module
 6G SAS technology
 10GbE Embedded NIC

2.2 Intel Processors Feature Set

Key features of the Intel Xeon E7-4800 and E7-8800 product family include:
 Up to ten cores per processor
 Up to 30 MB shared L3 cache
 32 nm process technology
 Intel Trusted Execution Technology (TXT) and AESNI (AES New Instructions)
 RAS DDDC (Double Device Data Correct)
 Intel HyperThreading (2 threads/core)
Key features of the Intel Xeon processor 7500 series include:
 Up to eight cores per processor
 Four full-width, bidirectional point-to-point Intel® QuickPath Interconnect (QPI) links at
6.4 GT/s
 Four Intel® Scalable Memory Interconnects (SMI) at 6.4 GT/s
 Socket – LS, LGA 1567 package
 No termination required for non-populated processors (must populate CPU socket 1 first)
 64-byte cache line size
 RISC/CISC hybrid architecture
 Compatible with existing x86 code base
 Optimized for 32-bit code
 MMX support
 Execute Disable Bit
 Intel® Wide Dynamic Execution (Executes up to four instructions per clock cycle)
 Simultaneous Multi-Threading (SMT) capability (2 threads/core)
 Support for CPU Turbo Mode on certain models (increases processor frequency if operating
below thermal, power, and current limits)
 Streaming SIMD (Single Instruction, Multiple Data) Extension 4

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 Intel® 64 Technology
 Intel® VT-x and VT-d Technology for virtualization support
 Enhanced Intel® SpeedStep® Technology
 Demand-based switching for active CPU power management as well as support for ACPI
P-States, C-States, and T-States

2.3 Memory Controller

The PowerEdge R910 features Intel® 7500 Scalable Memory Interconnect (SMI), which includes:
 Up to 4 Gb DRAM support
 Up to 32 GB RDIMMs
 Low voltage DDR3L RDIMMs
 Up to 6.4 GT/s
 DDR3 channels (up to 1333 MT/s)

2.4 Internal Dual SD Module (IDSM)

The PowerEdge R910 also offers a second internal USB port dedicated for embedded hypervisor for
virtualization operating systems like Citrix and VMware through a dual SD-to-USB daughter card
called an Internal Dual SD Module. The IDSM port is located on the back of the I/O riser board. The
SD Flash Cards contain a bootable OS image for virtualized platforms. IDSM consists of up to two SD
cards that are mirrored when set in the redundant mode for the higher availability.

2.5 10Gb Embedded NIC

10Gb I/O cards (Embedded NICs) are designed to provide higher data throughput for demanding
applications like virtualization.
The 10Gb NICs are Broadcom® BCM57711 Gigabit MAC with BCM8727 SFP+ PHY. Features include:
 x8 PCI Express Gen2 capable interface
 SFP+ interface supported with SR and LRM optics or direct attached cable
 TOE (TCP Offload Engine)
 iSCSI controller
 RDMA controller (RNIC) (enabled through an optional hardware key)
 NC-SI (Network Controller-Sideband Interface) connection
 Wake-On-LAN (WOL)
 PXE 2.0 remote boot
 iSCSI boot
 IPv4 and IPv6 support
 Bare metal deployment support

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3 System Information
Table 2 lists a summary of features for the Dell™ PowerEdge™ R910. For the latest information on
supported features, visit [Link].

Table 2. Features Summary

Feature Details
Processor Intel® Xeon® E7-4800 and E7-8800 product family
Intel Xeon processor 7500 series
Two or four 4-core, 6-core, 8-core, or 10-core
95W, 105W, and 130W TDP options
Front Side Bus Intel® QuickPath Interconnect (QPI)
# Cores 4, 6, 8, or 10 cores
L2/L3 Cache 12MB, 16MB, 24MB, 30MB
Chipset Intel 7510
1
Maximum Internal Up to 16TB
Storage
Memory1 Up to 2TB (64 DIMM slots): 1GB/2GB/4GB/8GB/16GB/32GB DDR3 up to 1333MT/s
Hard Drive Bays Hot-plug hard drives
Up to sixteen 2.5” drives
Hard Drive Types SATA SSD, SAS, nearline SAS, SATA
External Drive Bay(s) External USB floppy
Optional SATA half-height optical drives such as DVD-ROM or DVD+RW
Optional SATA or SCSI half-height (or full-height) tape back-up drive
Hard Drive Controller Internal: PERC Η200 or PERC Η700
Optional: PERC H800 and 6Gbps SAS
BIOS 4MB flash for system BIOS and Video BIOS
Video Integrated Matrox® G200, 8MB shared video memory
Availability Hot-plug hard drives, hot-plug power; Memory SDDC, ECC, Control Line Parity,
Redundant Cooling, Add Interactive LCD with hot-plug hard drive chassis
Server Management Dell™ Embedded Server Management provides IPMI 2.0 compliance.
Remote Management iDRAC6 Express + Optional iDRAC6 Enterprise
I/O Slots Standard: 7 PCIe Gen2 slots (two x4, four x8, one x16)
Optional: 10 PCIe Gen2 (six x4, four x8)
The storage controller card has a dedicated slot (PCIe x8) apart from the available
10 PCIe slots.
RAID PERC H200, PERC H700, PERC H800 and 6Gbps SAS

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Feature Details
Network Interface Embedded NICs:
Cards 1GbE or 10Gb embedded NIC options with iSCSI offload
Broadcom® 5709c 4-port (4 x 1GbE) Embedded NIC or
Broadcom 57711 4-port (2 x 10GbE + 2 x 1GbE) Embedded NIC + Broadcom 5709c
Optional NICs:
Broadcom 57710 Single Port 10GbE NIC, Copper CAT6 PCIe-8
Intel DA 10GbE NIC, Dual Port, Optical, PCIe-8
Intel 10GbE Single Port 10GbE NIC, Copper, PCIe-8
Broadcom NetXtreme® II 5709 Gigabit NIC with TOE and iSOE, Quad Port, Copper,
PCIe-4 (low-profile option)
Broadcom 5709 Dual Port 1GbE NIC with TOE PCIe-4 (low-profile option)
Broadcom 5709 Dual Port 1GbE NIC with TOE iSCSI, PCIe-4 (low-profile option)
Broadcom NetXtreme II 57711 10GbE NIC w/TOE & iSOE, Dual Port, SFP+, PCIe-8
Intel Gigabit ET NIC, Dual Port, Copper, PCIe-4 (low-profile option)
Intel Gigabit ET NIC, Quad Port, Copper, PCIe-4 (low-profile option)
Brocade® CNA Dual-port adapter
Emulex® CNA iSCSI HBA stand up adapter OCE10102-IX-D
Emulex CNA iSCSI HBA stand up adapter OCE10102-FX-D
Brocade CNA BR1020
QLogic QLE2660 FC16 Single Port, PCIe 3.0 x4
QLogic QLE2662 FC16 Dual Port, PCIe 3.0 x4
USB Total: 5 ports, USB 2.0 compliant
2 back
2 front
1 internal
Power Supplies Hot-plug redundant power supply units
4 x 750W (Energy Smart)
or
4 x 1100W (high-output)
Front Panel The system control panel is located on the front of the system chassis to provide
user access to buttons, display, and I/O interfaces
LCD on front panel for error messaging
System ID System ID switch with LED indicator at back side and LCD indication at front side
128x20 pixel LCD with controls on front panel for system ID and error messaging
System ID for PowerEdge R910 is 0x02d3
Fans Redundant Cooling
Chassis 4U rack-mount
Chassis depth is 29.6”
Rack Support ReadyRails™ sliding rails for tool-less mounting in 4-post racks with square or
unthreaded round holes, with support for optional tool-less cable management arm

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Feature Details
Operating Systems Microsoft® Windows Server® 2012
Microsoft Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V®)
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V)
Microsoft Windows HPC Server 2008
Novell® SUSE® Linux Enterprise Server
Red Hat® Enterprise Linux®

Virtualization Options:
VMware® vSphere® ESXi™
Red Hat Enterprise Virtualization®
For more information on the specific versions and additions, visit
[Link]/OSsupport.
Systems Management Baseboard Management Controller (BMC), IPMI 2.0 compliant, Dell™ OpenManage™
featuring Dell Management Console, Unified Server Configurator, Lifecycle
Controller enabled with optional iDRAC6 Express, iDRAC6 Enterprise, and vFlash
media
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and
operating environment and will be less.

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4 Mechanical
4.1 Chassis Description
The Dell™ PowerEdge™ R910 fits in a rack mount 4U chassis. The R910 chassis brings some new
features over previous generations, including:
 DIMMs on memory risers
 Updated industrial design including a new LCD, bezel, and hard drive carriers
 Toolless rack latches
 Pull-out tray for Express Service Tag and customer labels
 Support for persistent storage (internal USB and SD card slots and external SD card slot)
 Updated, easier power supply removal process

4.2 Dimensions and Weight

The R910 weight with maximum configuration is 47.60 kg (105 lb). Weight empty is 26.31 kg (58 lb).

Xa Xb Y Za Za Zb Zc
(width (width (Height) (depth (depth (depth (depth
with rack without with without without with
latches) rack bezel) bezel) power power
latches) supply and supply)
bezel)
482.4mm 422.0mm 172.6mm 35.0mm 20.4mm 699.0mm 753.0mm

Figure 1. Dimensions

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4.3 Front Panel View and Features

Figure 2. Front Panel View

The following components and connectors are located on the front of the R910:
 Power-on indicator, power button
 USB connectors; connects USB devices to the system; two 4-pin, USB 2.0-compliant
 LCD menu buttons which allow you to navigate the control panel LCD menu
 LCD panel which provides system ID, status information, and system error messages
 Non-Maskable Interrupt (NMI) button
 Ambient temperature sensor
 System identification button
 Optical drive (optional)
 Hard drives
The LCD panel is a graphics display controlled by the iDRAC. Error codes can be sent to the display by
either ESM or BIOS. See the Front-Panel Features and Indicators section in the About Your System
chapter of the PowerEdge R910 Hardware Owner’s Manual on [Link]/Manuals for more
information.
BIOS has the ability to enter a Secure Mode through Setup, which locks the Power and NMI buttons.
When in this mode, pressing either button has no effect and does not mask other sources of NMI and
power control.
The system control panel is located on the front of the system chassis to provide user access to
buttons, display, and I/O interfaces. See the Front-Panel Features and Indicators section in the About
Your System chapter of the PowerEdge R910 Hardware Owner’s Manual on [Link]/Manuals
for more information.
Features of the system control panel include:
 ACPI-compliant power button with an integrated green power LED (controlled by iDRAC6)
 128x20 pixel LCD panel with controls
 Two navigation buttons
 One select button
 One system ID button
 Non-Maskable Interrupt (NMI) button (recessed)
 Ambient temperature sensor
 Two external USB 2.0 connectors

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4.4 Back Panel View and Features

Figure 3. Back Panel View

For detailed information, see the Back-Panel Features and Indicators section in the About Your
System chapter of the PowerEdge R910 Hardware Owner’s Manual on [Link]/Manuals.

4.5 Power Supply Indicators

The PowerEdge R910 redundant power supplies have one status bi-color LED: green for AC power
present and amber for a fault as detailed in Table 3.

Table 3. Power Supply Status

LED Power Supply Status
AC Power is not present

AC Power is present

Fault of any kind is detected

DC Power is applied to the system

Redundant power supply mismatch
↔
(when hot-plugged/swapped)

See the Power Indicator Codes section in the About Your System chapter of the PowerEdge R910
Hardware Owner’s Manual on [Link]/Manuals for more information.

4.6 NIC Indicators

See the NIC Indicator Codes section in the About Your System chapter of the PowerEdge R910
Hardware Owner’s Manual on [Link]/Manuals for more information.

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4.7 Rails and Cable Management

ReadyRailsTM Sliding Rails for 4-post racks support the following:
 Toolless installation in 19” EIA-310-E compliant square or unthreaded round hole 4-post racks
including all generations of Dell racks. (Note: Threaded 4-post racks require Dell’s fixed shelf
or third-party adapter brackets available through Dell Software & Peripherals.)
 Full extension of the system out of the rack to allow serviceability of key internal components
 Optional cable management arm (CMA) except on racks less than 1m in depth including Dell
4200 and 2400 racks.

Measurements and adjustment ranges for the rack:

 Rail depth without the CMA: 755 mm
 Rail depth with the CMA: 883 mm
 Square-hole rack adjustment range: 686–883 mm
 Round-hole rack adjustment range: 672–876 mm
See Section 14, Rack Information, for more information.

4.8 Fans
Six 120mm single-rotor hot-pluggable fans are mounted in a fan bay in the back of the chassis. Each
fan has a single wire harness that plugs into the planar fan connectors (FAN1 through FAN6).
The Embedded Server Management (ESM) logic in the system controls and monitors the speed of the
fans. A fan speed fault or over-temperature condition results in a notification by ESM.
The R910 power supply units have integrated fans. The system requires a blank in place of the empty
power supply slot. System fan speed is pulse-width modulated.
The iDRAC6 controls and monitors the speed of the fans. A fan speed fault or over-temperature
condition results in a notification by iDRAC6.

4.9 Security
4.9.1 Cover Latch
A tooled latch is integrated in the side cover to secure it to the tower chassis. A locked bezel secures
the cover latch.

4.9.2 Bezel
A lock on the bezel is used to protect unauthorized access to system hard drives and the system
cover. System status (through the LCD) is viewable when the bezel is installed.

4.9.3 Hard Drive

The front bezel of the system contains a lock. A locked bezel secures the system hard drives.

4.9.4 Trusted Platform Module (TPM)

TPM is used to generate/store keys, protect/authenticate passwords, and create/store digital
certificates. TPM can also be used to enable the BitLocker™ hard drive encryption feature in Windows
Server 2008.

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TPM is enabled through a BIOS option and uses HMAC-SHA1-160 for binding. A Trusted Computing
Module (TCM) version of the planar is available for use where TCM is the standard, for example, in
China.

4.9.5 Power Off Security

The control panel is designed such that the power switch cannot be accidentally activated. The lock
on the bezel secures the switch behind the bezel. In addition, there is a setting in the CMOS setup
that disables the power button function.

4.9.6 Intrusion Alert

A switch mounted on the cooling shroud is used to detect chassis intrusion. When the cover is
opened, the switch circuit closes to indicate intrusion to the iDRAC6. When enabled, the software
can provide notification to the customer that the cover has been opened.

4.9.7 Secure Mode

BIOS has the ability to enter a secure boot mode via Setup. This mode includes the option to lock out
the power and NMI switches on the Control Panel or set up a system password.

4.10 USB Key

An optional USB memory key installed inside your system can be used as a boot device, security key,
or mass storage device. The USB connector must be enabled by the Internal USB Port option in the
Integrated Devices screen of the System Setup program.
To boot from the USB memory key, configure the USB memory key with a boot image and then
specify the USB memory key in the boot sequence in the System Setup program.

4.11 Battery
A replaceable coin cell CR2032 3V battery is mounted on the planar to provide backup power for the
Real-Time Clock and CMOS RAM on the ICH10 chip.

4.12 Field Replaceable Units (FRU)

The planar contains a serial EEPROM to store FRU information including Dell part number, part
revision level, and serial number. The backplane SEP and the power supply microcontroller are also
used to store FRU data.

4.13 User Accessible Jumpers, Sockets, and Connectors

For detailed information, see the Jumpers and Connectors section in the PowerEdge R910 Hardware
Owner’s Manual on [Link]/Manuals.

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5 Power, Thermal, Acoustic

The Dell™ PowerEdge™ R910 achieves enhanced power efficiency by implementing the following
features:
 User-selectable power cap (subsystems will throttle to maintain the specified power cap)
 Improved power budgeting
 Larger heat-sinks for processors and IOH
 Accurate inlet temperature
 Power supply and voltage regulator (VR) efficiency improvements
 Switching regulators instead of linear regulators
 Closed loop thermal throttling
 Increased back venting and 3D venting
 PWM fans with an increased number of fan zones and configuration-dependent fan speeds
 Use of DDR3 memory (lower voltage than DDR2)
 Processor VR dynamic phase shedding
 Memory VR static phase shedding
 Random time interval for system start
 Allows an entire rack to power on without exceeding the available power
 BIOS Power/Performance options page
 BIOS-based CPU P-state manager (power management in a virtualized environment)
 Ability to slow down or throttle memory
 Ability to disable a processor core
 Ability to turn off items not being used (USB ports, embedded NICs, unused PCIe lanes)
 Option to run PCIe at Gen1 speeds instead of Gen2

5.1 Power Supplies and Power Subsystem

PowerEdge R910 supports two types of power supply units:
 1100W high-output
 750W Energy Smart

Figure 4. Power Supply

The power supply bay is designed to prevent unsupported power supplies from being installed. Mixing
of 1100W and 750W power supplies is not supported. R910 power supplies have embedded cooling
fans and one bi-colored status LED.
The PowerEdge R910 power supplies have a FRU EEPROM; FRU data is stored in the memory of the
power supply microcontroller. iDRAC can update the power supply firmware over the PMBus. Power is
“soft-switched,” allowing power cycling using a switch on the front of the system enclosure or

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through a software control (through server management functions). The power system is compatible
with industry standards, such as ACPI and the Microsoft Windows Server Hardware Design Guide.
If not using all four power supplies, it is preferred that the power supply be installed starting from
PS1 bay in order to avoid power loss in the PDB copper planes. However, there is nothing that
prevents the use of the rest of the bays in that case. The empty bays should be populated with the
PS sheet metal blanks for thermal reasons.
The system power distribution consists of one, two, three or four AC-to-DC power supplies connected
to the planar through the PDB. The power supply only provides +12V and +12Vaux. The power
supplies connect indirectly to the planar through the power distribution board (PDB). There is a
power cable that connects the PDB and the backplane. Another cable also connects the PDB to the
optical and/or tape drives. There are no cables involved for delivering the power from the power
supplies to the motherboard.
The 12V power is then distributed to the rest of the subsystems like the backplane and optical drive
from the motherboard using cables. There are several voltage regulators in the system to supply
different voltage levels needed by different logic devices.
R910 has four power supply bays. Power supply system configurations are shown in Table 4.

Table 4. Power Supply System Configurations

Power Supply Configuration
Non-redundant configuration (1+0)
Redundant Energy Optimal configuration (1+1)
High-output power supply (1100W) Non-redundant Full-power configuration (2+0)
Failover configuration (2+1)
Redundant Full-power configuration (2+2)
Non-redundant configuration (1+0)
Redundant Energy Optimal configuration (1+1)
Energy Smart power supply (750W) Non-redundant Full-power configuration (2+0)
Failover configuration (2+1)
Redundant Full-power configuration (2+2)

There are two different redundancy modes with two of the power supplies. One is (2+0) non-
redundant capable of running full system configuration, and the other is (1+1) redundant running
limited configuration. You can switch the mode between (1+1) and (2+0) using the iDRAC GUI only for
the two power supply cases, depending on if the system is capable of supporting the new mode or
not. The other modes of redundancy are automatics based on the functional supplies present when
AC is applied and the system is powered on.
In the (2+2) mode, if the power supplies are evenly split across two separate grids on the AC line
side, then this mode would also be considered “AC or Grid” redundant in addition to power.

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Table 5. Power Supply Specifications
AC Power supply (per power supply)
Wattage 1100W (High Output PSU)
750W (Energy Smart PSU)
Voltage 90–264V, 47–63Hz, auto-ranging
Heat dissipation 8407 BTU/hr maximum (with two or four
1100W power supplies)
5732 BTU/hr maximum (with two or four
750W power supplies)
Maximum inrush current Under typical line conditions and over the
entire system ambient operating range, the
inrush current may reach 55A per power
supply for 10ms or less

5.2 Environmental Specifications

Table 6 details the environmental specifications for the R910.

Table 6. Environmental Specifications

Temperature
Operating 10°C to 35°C (50°to 95°F) with a maximum temperature gradation of 10 o C per hour.
Note: For altitudes above 2950 feet, the maximum operating temperature is derated
1°F/550 feet.
Storage –40°C to 65°C (-40°to 149°F) with a maximum temperature gradation of 20°C per
hour
Relative Humidity
Operating 20% to 80% (noncondensing) with a maximum humidity gradation of 10% per hour
Storage 5% to 95% (noncondensing) with a maximum humidity gradation of 10% per hour
Maximum Vibration
Operating 0.26 Grms at 5-350Hz in operational orientations
Storage 1.54 Grms at 10-250Hz in all orientations
Maximum Shock
Operating Half sine shock in all operational orientations of 31G +/- 5% with a pulse duration of
2.6 ms +/- 10%
Storage Half sine shock on all six sides of 71G +/- 5% with a pulse duration of 2 ms +/-10%;
Square wave shock on all six sides of 27 G with velocity change @ 235 in/sec or
greater
Altitude
Operating -16 to 3048m (-50 to 10,000ft) Note: For altitudes above 2950 feet, the maximum
operating temperature is derated 1oF/550 feet
Storage -16 to 10,600m (-50 to 35,000ft)

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Airborne contaminant level
Class G1 or lower as defined by ISA-S71.04-1985 (G1 maximum corrosive contaminant levels
measured at ≤ 50% relative humidity)

For additional information about environmental measurements for specific system configurations, see
Product Safety, EMC, and Environmental Datasheets on [Link].

5.3 Thermal
The PowerEdge R910 delivers uncompromising computing performance with a robust thermal and
acoustical design that quietly and efficiently maintains the server’s temperatures. Thermal
management of the R910 takes inventory of the system configuration and monitors component
temperatures throughout the system to intelligently control system fans and throttle components
when needed to maintain desired power consumption and reliability levels. The R910 is designed to
maintain full performance across the entire ambient temperature operating range (10°C to 35°C).
Because of its optimized thermal management, the R910 is significantly quieter and has higher
performance than its predecessor R900 (including higher-powered processors and twice the memory
slots and hard drive count).
Thermal features for the R910 include the following:
 Optimized airflow impedance for optimum cooling efficiency
 Custom air baffling directs airflow through the components to maintain proper cooling
 Custom designed heat sinks maintain processor, IOH, and chipset temperatures within thermal
design targets
 Highly Optimized Fan Control Algorithm:
o Base fan speeds are a function of hardware configuration and ambient temperature to
minimize airflow for a given environment.
o PID control algorithms are used for both processor and DIMMs to maintain appropriate
thermal margin
o Double refresh switching allows for DIMM temperature excursions up to 95°C while
maintaining performance and thermal design targets
 The R910 thermal algorithm monitors the thermal sensor on each DIMM to
maintain DIMM temperatures below the typical 85°C specification in normal
operating conditions.
 Under extreme operating conditions, the thermal algorithm can switch the
DIMMs into Double Refresh mode, allowing an additional 10°C of thermal
headroom. In Double Refresh mode, the DIMMs are allowed to operate as high
as 95°C.

5.4 Acoustics
The acoustical design of the PowerEdge R910 reflects the following:
 Adherence to Dell’s high sound quality standards: Sound quality is different from sound
power level and sound pressure level in that it describes how humans respond to annoyances
in sound, like whistles, hums, etc. One of the sound quality metrics in the Dell specification is
prominence ratio of a tone, and this is listed in Table 7.
 Noise ramp and descent at bootup: Fan speeds, hence noise levels, ramp during the boot
process in order to add a layer of protection for component cooling in the case that the
system were not to boot properly.
 Noise levels vs. configurations: Hardware configurations do result in different noise levels.
For example, processor-power dependence is shown in the following table.

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The acoustical performance for two different processor power configurations of the PowerEdge R910
are shown in Table 7.

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Table 7. Acoustical Performance

105W Configuration @ 23±2°C Ambient

Operating LwA-UL LpA Prominent
Hard Power Mode (bels) (dBA) Tones
Processors DIMM RAID
Drives Supply

Standby 3.2 16 None

4 x Intel®
Xeon® 4 x 15K 4x PERC Idle 5.7 38 None
16 x 2GB
E7540 2.5” SAS 1100W H800
(105W) Stressed
5.6 38 None
processor

130W Configuration @ 23±2°C Ambient

Operating LwA-UL LpA Prominent
Hard Power Mode (bels) (dBA) Tones
Processors DIMM RAID
Drives Supply

Standby 3.2 16 None

4 x Intel®
Xeon® 4 x 15K 4x PERC Idle 6.4 45 None
16 x 8GB
E7540 2.5” SAS 1100W H800
(130W) Stressed
6.4 45 None
processor

Definitions
Standby: AC Power is connected to power supplies but the system is not turned on.
Idle: Reference ISO7779 (2010) definition 3.1.7; system is running in its OS but no other specific
activity.
Stressed Processor: An operating mode per ISO7779 (2010) definition 3.1.6. The software
SPECPower_ssj2008 is utilized to stress the processors. SPECPower is set to 50% loading.
LwA–UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and
measured in accordance to ISO 7779 (2010).
LpA: Average bystander A-Weighted sound pressure level. The system is placed in a rack with its
bottom at 25 cm from the floor. The acoustic transducers are at the four bystander positions, ref
ISO7779 (2010) Section 8.6.2.
Prominent tones: Criteria of D.6 and D.11 of ECMA-74 11th ed. (2010) are followed to determine if
discrete tones are prominent. The system is placed in a rack with its bottom at 75-cm from the floor.
The acoustic transducer is at front bystander position, ref ISO7779 3rd (2010), Section 8.6.2.

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6 Processors
6.1 Overview
The Intel® Xeon® processor 7500 series and the Intel Xeon E7-4800 and E7-8800 product family are
designed specifically for high-end server applications. The processors feature up to ten-core
processing to maximize performance and performance/watt for data center infrastructures and
highly dense deployments. These processors also feature Intel Core™ micro-architecture and Intel 64
architecture for flexibility in 64-bit and 32-bit applications and operating systems.
The Intel Xeon processor 7500 series uses a 1567-contact Flip-Chip Land Grid Array (FC-LGA) package
that plugs into a surface-mount socket (Socket-LS). The PowerEdge R910 provides support for up to
four processors.
Selective processors in the Intel Xeon processor 7500 series and Intel Xeon E7-4800 and E7-8800
product family also support Turbo Mode. Turbo Mode is an OS-controlled operation that
automatically allows the processor to run faster than the marked frequency if the processor is
operating below power, temperature, and current limits.

6.2 Features
Key features of the Intel Xeon E7-4800 and E7-8800 product family include:
 Up to ten cores per processor
 Four point-to-point QuickPath Interconnect links at 6.4 GT/s
 32 nm process technology
 Intel HyperThreading (2 threads/core)
 Up to 30 MB shared L3 cache
 Intel Trusted Execution Technology (TXT) and AESNI (AES New Instructions)
 RAS DDDC (Double Device Data Correct)
Key features of the Intel processor 7500 series include:
 Up to eight cores per processor
 Four point-to-point QuickPath Interconnect links at 6.4 GT/s
 1567-pin FC-LGA(Flip Chip-Land Grid Array) package
 45 nm process technology
 No termination required for non-populated CPUs (must populate CPU socket 1 first)
 Two Integrated DDR3 memory controllers
 Each memory controller supports two Intel Scalable Memory Interconnects (SMI) for a total of
4 SMIs
 64-byte cache line size
 RISC/CISC hybrid architecture
 Compatible with existing x86 code base
 Intel MMX™ support
 Execute Disable Bit
 Intel Wide Dynamic Execution
 Executes up to four instructions per clock cycle
 Simultaneous Multi-Threading (SMT) capability
 Support for CPU Turbo Mode (on certain models)
 Increases processor frequency if operating below thermal, power and current limits
 Streaming SIMD (Single Instruction, Multiple Data) Extensions 2, 3, and 4
 Intel 64 Technology

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 Intel VT-x and VT-d Technology for virtualization support
 Enhanced Intel SpeedStep® Technology
 Demand-based switching for active processor power management as well as support for ACPI
P-States, C-States and T-States

6.3 Supported Processors

Table 8. Supported Intel Xeon E7-8800 Product Family
Model Speed TDP Power Cache Cores QPI Speed
E7-8867L 2.13GHz 105W 30M 10 6.4GT/s
E7-8837 2.66GHz 130W 24M 8 6.4GT/s

Table 9. Supported Intel Xeon E7-4800 Product Family

Model Speed TDP Power Cache Cores QPI Speed
E7-4870 2.40GHz 130W 30M 10 6.4GT/s
E7-4860 2.26GHz 130W 24M 10 6.4GT/s
E7-4850 2.00GHz 130W 24M 10 6.4GT/s
E7-4830 2.13GHz 105W 24M 8 6.4GT/s
E7-4820 2.00GHz 105W 18M 8 5.86GT/s
E7-4807 1.86GHz 95W 18M 8 4.80GT/s

Table 10. Supported Intel Xeon Processor 7500 Series

Model Speed TDP Power Cache Cores QPI Speed
X7560 2.26GHz 130W 24M 8 6.4GT/s
X7550 2.00GHz 130W 18M 8 6.4GT/s
E7540 2.00GHz 105W 18M 6 6.4GT/s
L7555 1.86GHz 95W 24M 8 5.86GT/s
L7545 1.86GHz 95W 18M 6 5.86GT/s
E7530 1.86GHz 105W 12M 6 5.86GT/s
E7520 1.86GHz 105W 18M 4 4.8GT/s

6.4 Processor Configurations

The system is designed such that at least both CPU1 and CPU2 processors are required to access all
the I/O expansion slots. There are two IOH QPI-to-PCIe bridges in order to provide sufficient PCIe
lanes to meet the MRD requirements. IOH1 is the legacy bridge that is connected to CPU1 whereas
IOH2 is connected to CPU2. If only CPU1 is populated, the I/Os behind IOH2 (slots 1, 2, 3, 4 and 6)
will not be available.
The system will not boot up if the CPUs are not installed correctly. The supported CPU configuration
is either 2-processors or 4-processors.

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6.5 Additional Processor Information

Refer to the Processors section in the Installing System Components chapter of the Dell PowerEdge
R910 Systems Hardware Owner’s Manual on [Link]/Manuals for additional processor
information.

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7 Memory
7.1 Overview
The Dell™ PowerEdge™ R910 uses DDR3 memory providing a high-performance, high-speed memory
interface capable of low latency response and high throughput. The R910 supports Registered ECC
DDR3 DIMMs (RDIMM).
R910 uses the Intel® Xeon® processor 7500 series that has two integrated memory controllers. Each
of those memory controllers then has two Scalable Memory Interconnect (SMI) channels that connect
to the memory buffer. The R910 has both the SMI channels from each controller routed to the
memory riser with two memory buffers connected.
The SMI channels from each controller operate in lockstep (the DIMMs need to be populated in
matched pairs behind lockstep channel). Each memory buffer has two DDR3 channels that can
support up to two DIMMs per channel.
The DDR3 memory interface consists of 16 memory buffers, each of which has two DDR3 memory
channels. Each channel supports up to two RDIMMs for single/dual/quad rank. By limiting to two
DIMMs per DDR channel, the system can support DIMMs at 1333 MT/s.
The R910 memory interface supports memory demand and patrol scrubbing, single-bit correction and
multi-bit error detection. Correction of a x4 or x8 device failure (chip kill) is supported with SDDC.
The following properties/rules apply to R910:
 DIMMs must be populated in matched pairs for each processor (A1/A2, A3/A4). Single DIMM
operation is not supported.
 If DIMMs of different speeds are mixed, all channels will operate at the fastest common
frequency. Note that R910 only supports DDR3 1333 MT/s modules.
 Memory mirroring and sparing configurations will be supported as follows:
o Memory sparing will be allowed on configurations with >= 64GB populated
o Memory mirroring will be enabled on configurations with >=64GB populated
 The first DIMM slot in each channel is color-coded with white ejection tabs for ease of
installation.
 In the case of mixed-rank population, populate the DIMM with the highest number of ranks
first (in sockets with white ejection tabs)
 DIMM sockets are placed 0.450” (11.43 mm) apart, center-to-center in order to provide
enough space for sufficient airflow to cool stacked DIMMs. DIMMs must be installed in each
channel starting with the DIMM farthest from the processor (DIMM 1). Population order is
identified by silkscreen and a label. The order is dependent on the memory configuration
used.

7.2 Slots and Risers

R910 has 8 memory risers; each memory riser has 8 DIMM slots. So there are a total of 64 DIMMs. See
the Dell PowerEdge R910 Systems Hardware Owner’s Manual on [Link]/Manuals for
detailed information.

7.3 Key Features of the Memory Subsystem

Registered (RDIMM) ECC DDR3 technology:
 Each channel carries 64 data and 8 ECC bits
 Support for up to 2 TB of memory (with sixty-four 32 GB RDIMMs)
 Support for 1333 MT/s single, dual, and quad rank DIMMs
 Support ODT (On Die Termination)

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 Clock gating (CKE) to conserve power when DIMMs are not accessed (DIMMs enter a low power
self-refresh mode)
 I2C access to SPD EEPROM for access to RDIMM thermal sensors
 Single-Bit Error Correction
 SDDC (Single Device Data Correction — x4 or x8 devices)
 Support for Closed Loop Thermal Management on RDIMMs
 Multi-Bit Error Detection
 Support for Memory Mirroring in limited configurations
 Support for Memory (Rank) Sparing in limited configurations

7.4 Memory Speed Limitations

The memory frequency is determined by a variety of inputs:
 Speed of the DIMMs
 Speed supported by the processor (note the DDR3 speed is 1/6 the frequency of the SMI link)
 BIOS can limit frequency to DDR3 800 MT/s based on user power savings configuration in the
SETUP menu
The PowerEdge R910 supports DDR3 1333 MT/s DIMMs. Some processor models will have lower SMI
link speeds resulting in slower DDR3 buses. The supported frequencies are as follows:
 SMI link speed at 4.8GT/sec => DDR3 800 MT/s
 SMI link speed of 5.86 GT/sec => DDR3 978 MT/s
 SMI link speed of 6.4 GT/sec => DDR3 1067 MT/s

7.5 Sparing
For rank sparing, one rank on each lockstep Intel 7500 Scalable Memory Interconnect (SMI) pair will
be reserved as a spare, and in the event that another rank exceeds a threshold of correctable ECC
errors, the “failing” rank will be copied to the spare. Once that operation is complete, the failed
rank will be disabled.

7.6 Mirroring
For mirroring, the PowerEdge R910 supports 2P/4P configurations for 64GB and larger only. When
mirroring is enabled, only half of the physical memory is visible to the system software. A full copy
of the memory is maintained, and in the event of an uncorrectable error, the system will switch over
to the mirrored copy. The R910 uses intra-socket mirroring.

7.7 RAID
The PowerEdge R910 does not support memory RAID.

7.8 Supported Configurations

See the System Memory section in the Installing System Components chapter in the Dell PowerEdge
R910 Systems Hardware Owner's Manual on [Link]/Manuals.

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8 Chipset
The Dell™ PowerEdge™ R910 system-board incorporates the Intel® 7500 chipset for I/O and processor
interfacing. The Intel 7500 chipset is designed to support the Intel Xeon® E7-4800 and E7-8800
product family, and the Intel Xeon processor 7500 series, QPI interconnect, DDR3 memory technology,
and PCI Express Generation 2. The Intel 7500 chipset consists of the EX IOH, Intel® 7500 Scalable
Memory Buffer, and the ICH10 South Bridge.

8.1 Intel 7500 Chipset I/O Hub (IOH)

The R910 motherboard incorporates dual Intel 7500 chipset IOH to provide a link between the four
Intel Xeon processor 7500 series sockets and the I/O components. The main components of the IOH
consist of two full-width QPI links (one to each processor), 72 lanes of PCIe Gen2, and a x4 DMI link
to connect directly to the ICH10 South Bridge.

8.2 IOH QuickPath Interconnect (QPI)

The QuickPath Architecture consists of serial point-to-point interconnects for the processors and the
IOH. The PowerEdge R910 has a total of four QuickPath Interconnect (QPI) links including one link
connecting the processors and links connecting both processors with the IOH and links connecting
both IOHs. Each link consists of 20 lanes (full-width) in each direction with a link speed of 6.4 GT/s.
An additional lane is reserved for a forwarded clock. Data is sent over the QPI links as packets.
The QuickPath Architecture features four layers. The physical layer consists of the actual connection
between components, and supports polarity inversion and lane reversal for optimizing component
placement and routing. The link layer is responsible for flow control and the reliable transmission of
data. The routing layer is responsible for the routing of QPI data packets. The protocol layer is
responsible for high-level protocol communications, including the implementation of a MESIF (modify,
exclusive, shared, invalid, forward) cache coherence protocol.

8.3 PCI Express Generation 2

PCI Express Generation 2 (PCIe Gen2) is a serial point to point interconnects for I/O devices. PCIe
Gen2 doubles the signaling bit rate of each lane from 2.5 Gb/s to 5 Gb/s. Each of the PCIe Gen2
ports is backwards compatible with Gen1 transfer rates.

8.4 Direct Media Interface (DMI)

The DMI (previously called the Enterprise Southbridge Interface) connects the Boxboro‐EX Legacy IOH
with the Intel I/O Controller Hub (ICH). The DMI is equivalent to a x4 PCIe Gen1 link with a transfer
rate of 1 GB/s in each direction.

8.5 Intel I/O Controller Hub 10 (ICH10)

ICH10 is a highly integrated I/O controller, supporting the following functions:
 Six x1 PCIe Gen1 ports, with the capability of combining ports 1-4 as a x4 link
 Used on PowerEdge R910 for slot 5
 PCI Bus 32-bit Interface Rev 2.3 running at 33 MT/s
 Up to six Serial ATA (SATA) ports with transfer rates up to 300 MB/s
 R910 features one SATA port for optional internal optical drive
 Six UHCI and two EHCI (High-Speed 2.0) USB host controllers, with up to twelve USB ports
(R910 has four external USB ports and one internal ports dedicated for IDSM and embedded
storage)
 Power management interface (ACPI 3.0b compliant)

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 Platform Environmental Control Interface (PECI)
 Intel Dynamic Power Mode Manager
 I/O interrupt controller
 SMBus 2.0 controller
 Low Pin Count (LPC) interface to Super I/O, Trusted Platform Module (TPM), and SuperVU
 Serial Peripheral Interface (SPI) support for up to two devices (R910 BIOS flash device is
connected to the ICH10 using SPI)

8.6 PCI Express Connectors

The R910 planar incorporates four 164-pin PCI Express-style x8 (slots 1, 2, 3 and 5) and three 164-pin
PCI Express-style x16 connectors (slots 4, 6 and 7) for connectivity to the PCIe cards. Only one x16
(slot 7) out of the three physical connectors is electrically x16 as well. The other two (slots 4 and 6)
are electrically x8 using a x16 physical connector for double wide GPGPU adapters.

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9 BIOS
9.1 Overview
The Dell™ PowerEdge™ R910 BIOS is based on the Dell BIOS core, and supports the following features:
 Intel® Xeon® E7-4800 and E7-8800 product family, and Intel Xeon processor 7500 series
support
 Simultaneous Multi-Threading (SMT) support
 CPU Turbo Mode support
 PCI 2.3 compliant
 Plug and Play 1.0a compliant
 MP (Multiprocessor) 1.4 compliant
 Boot from hard drive, optical drive, iSCSI drive, USB key, and SD card
 ACPI support
 Direct Media Interface (DMI) support
 PXE and WOL support for on-board NICs
 Memory mirroring and spare bank support
 SETUP access through <F2> key at end of POST
 USB 2.0 (USB boot code is 1.1 compliant)
 F1/F2 error logging in CMOS
 Virtual KVM, CD, and floppy support
 Unified Server Configurator (UEFI 2.1) support
 Power management support including DBS, Power Inventory and multiple Power Profiles

9.2 I2C
I2C is a simple bi-directional 2-wire bus for efficient inter-integrated circuit control. All I2C-bus
compatible devices incorporate an on-chip interface which allows them to communicate directly with
each other via the I2C-bus. These I2C devices perform communication functions between intelligent
control devices (e.g., microcontrollers), general-purpose circuits (e.g., LCD drivers, remote I/O
ports, memories) and application-oriented circuits.
The PE R910, BIOS accesses the I2C through the ICH10 (Intel I/O Controller Hub 10). There are two
MUX’s on ICH10’s I2C bus.
 One MUX (U_ICH_SPD) controls the DIMM SPDs through four split segments
 The other MUX (U_ICH_MAIN) controls the clock buffers, TOE, USB Hub through four split
segments.
 BIOS controls both the MUX’s through the two select lines using GPIO pins.
The Clock chip, USB hub, and the front panel EEPROM device addresses are located on the IOH I2C
bus.

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10 Embedded NICs/LAN on Motherboard (LOM)

10.1 Overview
The Dell™ PowerEdge™ R910 supports two options for Embedded NICs (I/O riser card):
 4-port 1GbE using 2x Broadcom 5709c
 4-port (2 x 10Gb SFP+ & 2 x 1GbE) using 1 x Broadcom 57711 & 1 x Broadcom 5709c
iSCSI offload is standard on both options.

10.2 Option 1: 1GbE I/O riser

Two dual-port Broadcom BCM5709C Gigabit Ethernet controllers with support circuitry are embedded
on the R910 1GbE IO riser board. Features of the LAN device include:
 x4 PCI Express Gen2 capable interface (R910 operates dual-port controllers at Gen1 speed)
 MAC and PHY integrated
 3072x18 Byte context memory
 64 KB receive buffer
 TOE (TCP Offload Engine)
 iSCSI controller
 RDMA controller (RNIC) (enabled through an optional hardware key)
 NC-SI (Network Controller-Sideband Interface) connection
 Wake-On-LAN (WOL)
 PXE 2.0 remote boot
 iSCSI boot
 IPv4 and IPv6 support
 Bare metal deployment support

10.3 Option 2: 10Gb I/O riser

In addition to a Broadcom BCM5709C dual port Ethernet controller, there is a dual-port 10 Gb MAC
controller along with the external PHY embedded on the R910 10 Gb IO riser board. The devices are
Broadcom BCM57711 Gigabit MAC with BCM8727 SFP+ PHY. Features include:
 x8 PCI Express Gen2 capable interface
 SFP+ interface supported with SR and LRM optics or direct attached cable
 TOE (TCP Offload Engine)
 iSCSI controller
 RDMA controller (RNIC) (enabled through an optional hardware key)
 NC-SI (Network Controller-Sideband Interface) connection
 Wake-On-LAN (WOL)
 PXE 2.0 remote boot
 iSCSI boot
 IPv4 and IPv6 support
 Bare metal deployment support
Four functional power supplies (2+2 configuration) are required to use the 10Gb I/O riser.

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11 PCI Slots
11.1 Overview
The Dell™ PowerEdge™ R910 planar provides seven PCI Express expansion slots as the base. There is
an option to expand the x16 Slot7 with a PCIe riser to four x4 additional slots, bringing the total
number of open expansion slots to ten with the riser option. There is also a dedicated storage slot.
The following requirements apply to the R910 PCIe slots:
 Supports 25 W maximum power capability for each expansion slot
 Does not support hot-plugging of PCIe cards
 does not support full-length PCIe cards

11.2 Quantities and Priorities

Refer to the Expansion Cards and Expansion-Card Risers section in the Installing System Components
chapter of the Dell PowerEdge R910 Systems Hardware Owner’s Manual on
[Link]/Manuals.

11.3 PCI Card Dimensions

Refer to the Expansion Cards and Expansion-Card Risers section in the Installing System Components
chapter of the Dell PowerEdge R910 Systems Hardware Owner’s Manual on
[Link]/Manuals.

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12 Storage
12.1 Overview
The Dell™ PowerEdge™ R910 system supports up to sixteen 2.5” hard disk drives. See Table 11 for
details.

12.2 Backplanes
R910 supports either a sixteen-drive backplane or a four-drive backplane for 2.5” drives.
Depending on the type of backplane, there are sixteen or four hot-plug capable Serial Attached SCSI
(SAS) or Serial ATA (SATA) drive slots with two LED indicators per slot, up to two Mini-SAS cable
connectors for connecting the backplane to the integrated PERC H200 or H700 storage adapters, and
a 20-pin planar signal/power connector. PERC H200 storage adapter will only be supported with the
2.5” 4-drive HDD backplane.

12.2.1 2.5” x4 Backplane

The four-drive 2.5” backplane assembly is detailed as follows:
 Only 2.5” drives are supported in this configuration
 One mini-SAS cable is used to connect channel “A” of the integrated PERC H200 or H700
storage controller card to the four-drive backplane.
 Mixing SATA and SAS is not supported.

12.2.2 2.5” x16 Backplane

The sixteen-drive 2.5” backplane assembly is detailed as follows:
 Only 2.5” drives are supported in this configuration
 Two mini-SAS cables are used to connect both channels of the integrated PERC H700 storage
card to the sixteen-drive backplane.
 A SAS expander is used to map 16 drives to the PERC H700 (2 x4 SAS) controller
 Mixing SATA and SAS is not supported.
 Mixing SAS and SSD is supported.

12.3 Flash BIOS Memory

A Flash EEPROM resides on the SPI Bus for BIOS and configuration storage. A 16 Mbit device is utilized
for this function. The Flash memory permits the BIOS to be upgraded in the field. The Flash BIOS may
be write-protected by software.

12.4 Drives
The PowerEdge R910 supports the new 2.5” hard drive carriers. These carriers implement new
industrial design to match the front bezel.
For the slots that are not occupied by drives, a carrier blank is provided to maintain proper cooling,
maintain a uniform appearance to the unit, and provide EMI shielding.
R910 supports diskless configuration.

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Figure 5. 2.5” Hard Drive Carrier

Each hard drive carrier has two LED indicators visible from the front of the system. One is a green
LED for disk activity and the other is a bicolor (green/amber) LED for status information. The activity
LED is driven by the disk drive during normal operation. The bicolor LED is controlled by the SEP
device on the backplane. Both LEDs are used to indicate certain conditions under direction of a
storage controller.

Table 11. Supported Hard Drives

Hard Drive Type Capacities
(2.5”)
SAS 73GB, 146GB, 300GB, 600GB, 900GB
SATA 1TB
SATA SSD 50GB, 100GB
SAS SSD 149GB
Nearline SAS 500GB, 1TB

12.5 RAID Configurations

Table 12. RAID Configurations

Non-mixed drives (all SATA HDD,

all SAS HDD, or all SATA SSD or all
SAS SSD)
2.5” Drives
Configuration
Configuration Description
Type x4 Backplane x16 Backplane

Min Max Config Max

Drives Drives Type Drives

Diskless C0 NCZ Diskless Configuration 0 0 X X

Configuration

SAS/SATA/ C1 MSS Integrated SAS/SATA/SSD No 1 4 X X

SATA SSD/SAS RAID (PERC H200, PERC H700)
SSD—No RAID

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SAS/SATA/ C2 MSSRO Integrated SAS/SSD RAID 0 2 4 2 16

SATA SSD/SAS (PERC H200, PERC H700)
SSD—RAID
C3 MSSR1 Integrated SAS/SSD RAID 1 2 2 2 2
(PERC H200, PERC H700)

C4 MSSR5 Integrated SAS/SSD RAID 5 3 4 3 16

(PERC H700)

C5 MSSR6 Integrated SAS/SSD RAID 6 4 4 4 16

(PERC H700)

C6 MSSR10 Integrated SAS/SSD RAID 10 4 4 4 16

(PERC H700, PERC H200)

C7 MSSR50 Integrated SAS/SSD RAID 50 X X 6 16

(PERC H700)

C8 MSSR60 Integrated SAS/SSD RAID 60 X X 8 16

(PERC H700)

C9 MSSR1R1 Integrated SAS/SSD RAID 1/ 4 4 4 (2+2) 4

RAID 1 (PERC H700, (2+2) (2+2) (2+2)
PERC H200)

C10 MSSR1R5 Integrated SAS/SSD RAID X X 5 (2+3) 16

1/RAID 5 (PERC H700) (2+14)

C11 MSSR1R6 Integrated SAS/SSD RAID X X 5 (2+4) 16

1/RAID 6 (PERC H700) (2+14)

Mixed SATA SSD/SAS

2.5” Drives
Configuration
Configuration Description x4 Backplane x16 Backplane
Type

Min Max Min Max

Drives Drives Drives Drives

SSD/SAS— C12 MSSROR1-X Integrated SSD/SAS RAID 1+2 1+2 1+2 14+2
RAID 0/RAID 1 (PERC H200,
PERC H700)
RAID 0 set is SSD, RAID 1 set is
SAS

C13 MSSR1R1-X Integrated SSD/SAS RAID 2+2 2+2 2+2 2+2

1/RAID 1 (PERC H200, PERC
H700)
RAID 1 set is SSD, second RAID
1 set is SAS

C14 MSSR1R5-X Integrated SSD/SAS RAID X X 2+3 2+14

1/RAID 5 (PERC H700)

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RAID 1 set is SSD, RAID 5 set is
SAS

C15 MSSR1R10-X Integrated SSD/SAS RAID X X 2+4 2+14

1/RAID 10 (PERC H700)
RAID 1 set is SSD, RAID 10 set
is SAS

C16 MSSR1R50-X Integrated SSD/SAS RAID X X 2+6 2+14

1/RAID 50 (PERC H700)
RAID 1 set is SSD, RAID 50 set
is SAS

C17 MSSR10R50- Integrated SSD/SAS RAID X X 4+6 8+8

X 10/RAID 50 (PERC H700)
RAID10 set is SSD, RAID 50 set
is SAS

Additional RAID requirements are listed as follows:

 All connection types are backplane.
 X indicates not supported.
 The x16 backplane is supported only by PERC H700.
 The x4 backplane is supported by both PERC H200 and PERC H700.
 SATA drives are supported only on the x4 backplane. A maximum of only one SATA drive is
allowed and is only in the C1 configuration.

12.6 Storage Controllers

12.6.1 PERC H200
The PERC H200 integrated HBA is a SAS 2.0 6Gb native PCIe half-length half-height expansion card
that plugs into a dedicated x8 storage slot. It supports RAID 0, RAID 1, RAID 10 and non-RAID hard
drive configurations. It incorporates one four-channel mini-SAS internal connector (SFF8087) for
connection to internal x4 2.5” drive backplane. Since there are a maximum of up to 4-drives, the
second mini-SAS connector from H200 to the backplane would not get used. PERC H200 will only be
supported when the 4-drive 2.5” backplane is present on R910.

12.6.2 PERC H700

For customers who need a more advanced hardware RAID solution, the PERC H700 (formerly known as
PERC 7/iR) is an option. The PERC H700 is a SAS 2.0 6Gb half-length PCIe x8 expansion card that uses
the LSI 2108 ROC (RAID on Chip) processor running at 800MT/s with a PCI Express host interface and
DDR2 memory. It supports 512MB cache that is battery backed. It supports RAID 0, RAID 1, RAID 5,
RAID 6, RAID 50, RAID 60 and PRL-11 hard drive configurations. It incorporates two four-channel
mini-SAS connectors (SFF8087) for connection to internal x4 or x16 2.5” drive backplanes. The second
mini-SAS connectors would not get used when connecting PERC H700 to the x4 internal backplane.

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12.6.3 PERC H800
The R910 can support up to four PERC 800 adapter cards for access to external SAS direct-attach
storage. Features of the PERC H800 include:
 LSI 2108 (Liberator) ROC
 6Gb/s SAS
 x8 PCIe Gen2
 800 MT/s Core PPC
 DDRII, 800 MT/s, mini-DIMM
 512MB dual mini-SAS connectors
 Supports connection to Dell PowerVault™ MD1220 and PowerVault MD1200 6Gb enclosures only

12.6.4 Storage Card Support Matrix

Table 13. Storage Card Support Matrix

PowerEdge
Storage R910 PCIe PCI I/O Battery
Card Usage Support Slot Con Bracket Con RAID Backup
2 x4 0, 1, 5,
PERC H700 Internal mini-
Storage 6, 10,
Backplane Yes—Max 1 x8 No SAS int Yes
Integrated slot 50, 60,
Storage
PRL-11
Yes—Max 4
0, 1, 5,
PERC H800 External (PowerVault
x4 ext 6, 10,
SAS/SATA MD1200 and PCIe slot x8 Yes Yes
PERC Adapter x4 ext 50, 60,
Storage PowerVault
SAS/ PRL-11
MD1220)
SATA
Backup to
H800—Max 2
(MD1000
External
PERC 6/E PowerVault x4 ext 0, 1, 5,
Legacy PCIe slot x8 Yes Yes
Adapter MD1000 only x4 ext 10, 50
Storage
and MD1020
PowerVault
MD1120)
Internal
PERC H200 Storage x4 mini-
Backplane Yes—Max 1 x8 No 0, 1, 10 No
Integrated slot SAS int
Storage
External
SAS 6Gbps SAS SAS tape
HBA Yes—Max 2 PCIe slot x8 Yes x4 int None No
HBA and
SAS/ RBODs
SATA
External
SAS Backup to
SAS 5/E x4 ext
6Gbps SAS PCIe slot x8 Yes None No
Adapter (DAS, x4 ext
HBA—Max 2
Tape)

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Internal
ICH10 On Planar SATA Yes—1 port
Optical — — — x1 int — —
SATA via chipset for Optical
(No HDD)
External
SCSI Tape
LSI or Yes—Max 2
LSI 2032 SCSI
2032 External PCIe slot x4 Yes — —
Adapter (ext)
SCSI legacy
SCSI
storage

12.7 LED Indicators

Each disk drive carrier has two LED indicators visible from the front of the system. One is a green LED
for disk activity and the other is a bicolor (green/amber) LED for status information. The activity LED
is driven by the disk drive during normal operation. The bicolor LED is controlled by the storage
enclosure processor (SEP) device on the backplane. Both LEDs are used to indicate certain conditions
under direction of a storage controller.
For more information, see the Hard-Drive Indicator Patterns section in the About Your System
chapter in the Dell PowerEdge R910 Systems Hardware Owner’s Manual on
[Link]/Manuals.

12.8 Optical Drives

SATA optical drives are optional in all R910 systems and connect to the planar via the SATA interface
to ICH10. IDE (PATA) optical drives are not supported.
The following internal optical drives are available on R910: DVD-ROM and DVD+RW.
If the optical drive is not ordered with the system, a blank is installed in its place.

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13 Video
The Dell™ PowerEdge™ R910 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an
integrated video subsystem, connected to the 32-bit PCI interface of the ICH10. This logic is based on
the Matrox® G200. The device only supports 2D graphics.
The video device outputs are multiplexed between the front and back video ports. If a monitor is
connected to the front video connector, it will take precedence over the rear connection, thereby
removing the display from the rear connection.
The integrated video core shares its video memory with the iDRAC6’s 128 MB DDR2 application space
memory. This memory is also used for the KVM buffer.
The R910 system supports the following 2D graphics video modes:

Table 14. Supported Video Modes

Resolution Refresh Rate (Hz) Color Depth
(bit)
640 x 480 60, 72, 75, 85 8, 16, 32
800 x 600 56, 60, 72, 75, 85 8, 16, 32
1024 x 768 60, 72, 75, 85 8, 16, 32
1152 x 864 75 8, 16, 32
1280 x 1024 60, 75, 85 8, 16
1280 x 1024 60 32

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14 Rack Information
14.1 Overview
The ReadyRails™ sliding rail system for the Dell™ PowerEdge™ R910 provides tool-less support for
racks with square or unthreaded round mounting holes including all generations of Dell racks. The
optional cable management arm (CMA) can be mounted on either the left or right side of the sliding
rails without the use of tools for fast and easy deployment.
Important notes:

 The R910 is not compatible with any other Dell rails including previous generation rails, but it
does use the same rails as the R810 and R815.
 The R910 supports sliding rails only. Static rails are not supported.
 Threaded hole racks require Dell’s fixed shelf or adapter brackets available from Rack
Solutions.
 The CMA is not supported on racks that are less than 1m in depth including Dell’s 4200 and
2400 racks.

14.2 Rails
The ReadyRails sliding rails for the R910 support tool-less mounting in 19”-wide, EIA-310-E compliant
square hole and unthreaded round hole racks and are available with or without the optional cable
management arm (CMA).

Figure 6. ReadyRails Sliding Rails with Optional CMA

As noted below, the R910 rails do not support mounting in threaded hole or 2-post racks*.

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Table 15. Rack Types Supported
Rack Types Supported
Rail Mounting Rail
4-Post 2-Post
Identifier Interface Type
Square Round Thread Flush Center

B2 ReadyRails™ Sliding √ √ X X X

*Adapter brackets are available from Rack Solutions that allow the R910
sliding rails to mount in threaded racks. The only option available for 2-
post racks is to mount the system on a fixed shelf.
Other factors to consider when deploying the R910 include the spacing between the front and back
mounting flanges of the rack, the type and location of any equipment mounted in the back of the
rack such as power distribution units (PDUs), and the overall depth of the rack. For example, use of
the CMA requires racks that are a minimum of 1m in depth with the PDUs or other rack accessories
positioned on the sides or back of the rack away from the CMA.

Table 16. Rail Adjustability Range and Depth

Rail Adjustability Range (mm) Rail Depth (mm)
Square Round Threaded Without With
Min Max Min Max Min Max CMA CMA

686 883 672 876 — — 755 883

The min-max values listed above represent the allowable distance between the front and back
mounting flanges in the rack. Rail depth without the CMA represents the minimum depth of the rail
with the outer CMA brackets removed (as measured from the front mounting flanges of the rack).

14.3 Cable Management Arm (CMA)

The optional cable management arm (CMA) for the R910 organizes and secures the cords and cables
exiting the back of the server and unfolds to allow the server to extend out of the rack without
having to detach the cables. Some key features of the R910 CMA include:
 Large U-shaped baskets to support dense cable loads
 Open vent pattern for optimal airflow
 Fully reversible (can be mounted on either side) with no conversion required
 Utilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable
damage during cycling
 Includes a low profile fixed tray to both support and retain the CMA in its fully closed position
 Both the CMA and the tray mount without the use of tools via simple and intuitive snap-in
designs

14.4 Rack View

The R910 ReadyRails sliding rails are a “drop-in” design, meaning that the system is installed
vertically into the rails by inserting the shoulder nuts on the sides of the system into the J-slots in
the inner rail members with the rails in the fully extended position.

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Figure 7. R910 Mounted in the B2 Sliding Rails

The R910 CMA can be mounted to either side of the rails without the use of tools or the need for
conversion, but it is recommended that it be mounted on the side opposite the power supplies to
allow easier access to the power supplies for service or replacement.

Figure 8. R910 CMA Mounted on the Side Opposite the Power Supplies (Recommended)

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15 Operating Systems
For detailed information, see the following:
 Operating System Support Matrix for Dell PowerEdge Systems on [Link]
 Dell PowerEdge R910 Systems Getting Started With Your System guide on
[Link]/Manuals

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16 Systems Management
16.1 Overview
Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of
managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell
developed systems management solutions gives you choice and flexibility, so you can simplify and
save in IT environments of any size. To help you meet your server management demands, Dell offers
Dell OpenManage™ systems management solutions for:
• Deployment of one or many servers from a single console
• Monitoring of server and storage health and maintenance
• Update of system, operating system, and application software
Dell offers IT management solutions for organizations of all sizes—priced and sized appropriately, and
supported comprehensively.

16.2 Server Management

A Dell Systems Management and Documentation DVD and a Dell Management Console DVD are
included with the product. ISO images are also available. A brief description of available content:
• Dell Systems Build and Update Utility (SBUU): Dell Systems Build and Update Utility assists in
OS install and pre-OS hardware configuration and updates.
• Server Update Utility (SUU): This DVD has an inventory tool for managing updates to
firmware, BIOS, and drivers for either Linux or Windows varieties.
• OpenManage Server Administrator (OMSA): The OpenManage Server Administrator tool
provides a comprehensive, one-to-one (one console to one server) systems management
solution, designed for system administrators to manage systems locally and remotely over a
network. OMSA allows system administrators to focus on managing their entire network by
providing comprehensive one-to-one systems management.
• Management Console: Dell IT Assistant (ITA) is also included, as well as tools to allow access
to our remote management products. These tools are Remote Access Service for iDRAC and
the Baseboard Management Controller (BMC) Utility.
• Active Directory Snap-in Utility: The Active Directory Snap-in Utility provides an extension
snap-in to the Microsoft Active Directory. This allows you to manage Dell specific Active
Directory objects. The Dell-specific schema class definitions and their installation are also
included on the DVD.
• Dell Systems Service Diagnostics Tools: Dell Systems Service and Diagnostics tools deliver the
latest Dell optimized drivers, utilities, and operating system-based diagnostics that you can
use to update your system.
• eDocs: The section includes PDF files for PowerEdge systems, storage peripherals, and Dell
OpenManage™ software.
• Dell Management Console (DMC): The Dell Management Console is a systems management
console that enables systems administrators to discover and inventory devices on your
network. It provides functions such as health and performance monitoring of networked
devices, and patch management capabilities for Dell systems. DMC differs from the IT
Assistant management console (described above) in that with DMC, value-add plug-ins that
enable advanced functionality can be purchased and added to the base DMC product.

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16.3 Embedded Server Management

The Dell™ PowerEdge™ R910 implements circuitry for the next generation of Embedded Server
Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC
(Integrated Dell Remote Access Controller) is responsible for acting as an interface between the host
system and its management software and the periphery devices.
iDRAC6 provides features for managing the server remotely or in data center lights-out
environments.
Advanced iDRAC features require the installation of the optional iDRAC6 Enterprise card.

16.4 Dell Lifecycle Controller and Unified Server Configurator

Embedded management is comprised of interdependent pieces:
• Dell Lifecycle Controller
• Unified Server Configurator
• iDRAC6
Dell Lifecycle Controller powers the embedded management features. It includes integrated and
tamper-proof storage for system-management tools and enablement utilities (firmware, drivers,
etc.). Lifecycle Controller enables pre-OS server deployment, OS installation, platform updates,
platform configuration, and diagnostics capabilities.
Dell Unified Server Configurator (USC) is a graphical user interface (GUI) that aids in local server
provisioning in a pre-OS environment. To access the Unified Server Configurator, press the <F10> key
within 10 seconds of the Dell logo appearance during the system boot process. Table 17 details
current functionality enabled by the USC.

Table 17. Unified Server Configurator Features and Description

Feature Description
Faster O/S Installation Drivers and the installation utility are embedded on system, so no
need to scour [Link].
Faster System Updates Integration with Dell support automatically directed to latest
versions of the Unified Server Configurator, iDRAC, RAID, BIOS, NIC,
and power supply.
Update Rollback Ability to recover to previous “known good state” for all updatable
components.
More Comprehensive Diagnostics Diagnostic utilities are embedded on system.
Simplified Hardware Configuration Detects RAID controller and allows user to configure virtual disk and
choose virtual disk as boot device, eliminating the need to launch a
separate utility. Also provides configuration for iDRAC, BIOS, and
NIC/LOM.

16.5 Integrated Dell Remote Access Controller

The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet
straightforward management of remote servers, by delivering “as if you are there” presence and
control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s),
whether that server is located in a different room, a different building, a different city, or in a

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different country. iDRAC6 is a purchasable option and is available as three offerings: iDRAC6 Express,
iDRAC6 Enterprise, and Virtual Flash (vFlash) media:
 iDRAC6 Express is most appropriate for small-to-medium customers with limited remote
management needs.
 iDRAC6 Enterprise is appropriate for large data center customers with distributed servers.
 iDRAC6 with vFlash Media is provided for large enterprise customers with requirements for
system management automation.

16.6 iDRAC Express

The iDRAC Express is standard on the PowerEdge R910. In addition to providing a Lifecycle
Controller, the iDRAC6 Express offers the following key features:
• Graphical web interface
• Standard-based interfaces
• Server Sensor monitoring and fault alerting
• Secure operation of remote access functions including authentication, authorization, and
encryption
• Power control and management with the ability to limit server power consumption and
remotely control server power states
• Advanced troubleshooting capabilities
For more information on iDRAC6 Express features, see Table 18.

16.7 iDRAC6 Enterprise

The optional iDRAC6 Enterprise card provides access to advanced iDRAC6 features. The iDRAC6
Enterprise connects directly to the R910 planar and is mounted parallel to the planar with stand-offs.
Key features for the iDRAC6 Enterprise include:
• Scripting capability with Dell’s Racadm command-line
• Remote video, keyboard, and mouse control with Virtual Console
• Remote media access with Virtual Media
• Dedicated network interface

16.8 iDRAC6 Enterprise with Virtual Flash (vFlash) Media

The iDRAC6 Enterprise can be upgraded by adding the vFlash Media card. This is an 8 GB Dell-
branded SD card that enables a persistent 256 MB virtual flash partition. The vFlash media delivers
the following key features:
 Support for 8 GB SD storage media
 Can be used as a repository for a pre-OS image, eliminating the need to maintain a network
infrastructure for OS deployment
 Can also be used for permanent diagnostics image for use after system failures, or permanent
failsafe image for periodic configuration changes
A more detailed feature list for iDRAC6 Express, iDRAC6 Enterprise, and vFlash media is shown in
Table 18.

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Table 18. Features List for Base Management Functionality, iDRAC, and vFlash Media
Base Management
Feature Functionality iDRAC 6 Express iDRAC6 Enterprise vFlash Media
Interface and Standards Support
IPMI 2.0    
Web-based GUI   
SNMP   
WSMAN   
SMASH-CLP   
Racadm command-  
line
Conductivity
Shared/Failover    
Network Modes
IPv4    
VLAN Tagging    
IPv6   
Dynamic DNS   
Dedicated NIC  
Security and Authentication
Role-based    
Authority
Local Users    
Active Directory   
SSL Encryption   
Remote Management and Remediation
Remote Firmware    
Update
Server power    
control
Serial-over-LAN    
(with proxy)
Serial-over-LAN (no   
proxy)
Power capping   
Last crash screen   
capture
Boot capture   
Serial-over-LAN   
Virtual media  

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Base Management
Feature Functionality iDRAC 6 Express iDRAC6 Enterprise vFlash Media
Virtual console  
Virtual console  
sharing
Virtual flash 
Monitoring
Sensor Monitoring    
and Alerting
Real-time Power   
Monitoring
Real-time Power   
Graphing
Historical Power   
Counters
Logging Features
System Event Log    
RAC Log   
Trace Log  

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17 Peripherals
17.1 USB peripherals
The Dell™ PowerEdge™ R910 supports the following USB devices:
 DVD (bootable; requires two USB ports)
 USB Key (bootable)
 Keyboard (only one USB keyboard is supported)
 Mouse (only one USB mouse is supported)

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Appendix A. Volatility
The Dell™ PowerEdge™ R910 contains both volatile and non-volatile (NV) components. Volatile
components lose their data immediately upon removal of power from the component. Non-volatile
components continue to retain their data even after the power has been removed from the
component. Components chosen as user-definable configuration options (those not soldered to the
motherboard) are not included in the Statement of Volatility. Configuration option information
(pertinent to options such as microprocessors, system memory, remote access controllers, and
storage controllers) is available by component separately. The following NV components are present
in the PowerEdge R910 server.

Table 19. Volatility Information

Server BIOS Memory (SPI Flash, IC)
Size: 4 MB
Type [Flash PROM, EEPROM]: Flash EEPROM (Serial Peripheral Interface)
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Boot Code, Configuration Information, EUFI
environment
How is data input to this memory? Loading flash memory requires a vendor-
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS-based executable containing
the firmware file and the loader. System loaded
with arbitrary data in firmware memory will not
operate.
How is this memory write protected? Software write protected
Server CMOS (Complementary Metal-Oxide Semiconductor) Memory
Size: 512 Bytes
Type [Flash PROM, EEPROM]: Battery-Backed NVRAM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] RTC and storing system configuration settings
How is data input to this memory? F2 Setup Menu during POST
How is this memory write protected? N/A
Remarks Jumper on motherboard can be used to clear to
factory default settings.
Removing CMOS battery will clear to factory
defaults settings as well.
Server BMC (Baseboard Management Controller)/iDRAC Express Boot Block Flash
Size: 2 MB
Type [Flash PROM, EEPROM]: Serial Flash

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Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] iDRAC boot loader and configuration (i.e. MAC
address), Lifecycle log.
How is data input to this memory? Data pre-programmed or update using Dell
utility which is a DOS or Windows or Linux based
executable containing firmware file and loader
How is this memory write protected? Software write protected
Remarks Bad contents yield the iDRAC inoperable and is
unrecoverable in the customer environment.
Note the lifecycle log is automatically updated
by the iDRAC as various system component FW,
HW and SW versions are changed.
Server BMC/iDRAC Express Internal Flash
Size: 1 GB
Type [Flash PROM, EEPROM]: NAND Flash
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] iDRAC Operating System plus Managed System
Services Repository (i.e., Unified Server
Configurator, OS drivers, diagnostics, rollback
versions of various programmables)
How is data input to this memory? iDRAC OS: Loading flash memory requires a
vendor-provided firmware file and loader
program which is executed by booting up the
system from a floppy or OS-based executable
containing the firmware file and the loader.
System loaded without a good iDRAC firmware
image yields a non-functional iDRAC.
Managed Services Repository: Various partitions
are loaded via vendor-provided firmware file
and loader program just like iDRAC OS.
How is this memory write protected? Software write protected
System Event Log (SEL) Memory and Baseboard FRU
Size: 4 KB
Type [Flash PROM, EEPROM]: SERIAL EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Store system events from BMC and BIOS. FRU
information for board such as PPID, MAC
addresses etc.
How is data input to this memory? For SEL, BMC writes to it.
For FRU, data is pre-programmed or input using

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Dell utility at ICT/Functional Tester during
board assembly.
How is this memory write protected? Software write protected
FRU Memory for the I/O Risers (1GbE or 10Gb) and Memory Riser
Size: 256 Bytes
Type [Flash PROM, EEPROM]: EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] FRU information for boards such as board name,
PPID, manufacturing date etc.
How is data input to this memory? Data pre-programmed or using Dell utility at
ICT/Functional Tester during board assembly.
How is this memory write protected? Not write protected
DIMM Modules SPD (Serial Presence Detect) EEPROM
(up to 64 depending on the number of DIMM modules present)
Size: 256 Bytes
Type [Flash PROM, EEPROM]: EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] DIMM information and temperature settings
How is data input to this memory? Data preprogrammed by the DIMM vendors
(lower 128 bytes). Also during boot sequence,
data is written to SPD EEPROM (upper 128
Bytes).
How is this memory write protected? Not write protected
TPM (Trusted Platform Module) (if applicable)
Size: 128 Bytes
Type [Flash PROM, EEPROM]: EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Stores encryption keys for TPM functionality
How is data input to this memory? Data is pre-programmed by vendor. Keys are
updated using TPM-enabled operating systems.
How is this memory write protected? Software write protected
Remarks F2 BIOS setup option to enable/activate/clear
TPM Alternative Plug-in Module (if applicable)
Size: 256 Bytes
Type [Flash PROM, EEPROM]: EEPROM

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Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Stores encryption keys for TPM functionality
How is data input to this memory? Data is pre-programmed by vendor. Keys are
updated using TPM enabled operating systems.
How is this memory write protected? Software write protected
Remarks F2 BIOS setup option to enable/activate/clear
Server CPLD Devices (x2 per baseboard)
Size: 2280 macro-cells and 256 macro-cells
Type [Flash PROM, EEPROM]: Internal Flash EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] System power sequence control, error/config
detection, and BIOS-BMC interaction.
How is data input to this memory? Programming CPLD(s) requires a vendor-
provided logic file and loader program which is
executed by booting up the system from a
floppy or OS-based executable containing the
logic file and the loader. System loaded with
arbitrary data in CPLD(s) will not operate.
How is this memory write protected? Software write protected
Remarks Need AC cycle after updating CPLD
®
Broadcom 5709/57711 PCI-e Network Interface Controller Flash
Size: 1MB
Type [Flash PROM, EEPROM]: Serial Flash
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Embedded Network Controller FW and config
data
How is data input to this memory? Loading flash memory requires a vendor-
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS-based executable
containing the firmware file and the loader.
System loaded with arbitrary data in firmware
memory would not have the network ports
operational.
How is this memory write protected? Software write protected
Remarks There is a quantity of 2 SPI flash on both the I/O
risers. On 1GbE I/O riser, both flash parts are
for the two 5709C controllers whereas on 10Gb
I/O riser, one is for 5709C and the other one is

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for 57711 network controller.
Broadcom 8727 PHY (Physical Layer) EEPROM (applicable to only 10Gb I/O riser)
Size: 32KB
Type [Flash PROM, EEPROM]: Serial EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Stores the PHY firmware
How is data input to this memory? Data is preprogrammed or update using Dell
LOM FW update utility. System loaded with
arbitrary data in firmware memory will not have
the 10Gb SFP+ network ports operational
How is this memory write protected? Software write protected
Remarks 10Gb I/O riser is optional
10 Gb I/O riser CPLD (applicable to only 10Gb I/O riser when present)
Size: 64 Macrocells
Type [Flash PROM, EEPROM]: CPLD
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Stores the standby power delivery routing to
10Gb network controller and its PHY
How is data input to this memory? Data is preprogrammed at board build
How is this memory write protected? Software write protected
Remarks 10Gb I/O riser is optional
Dell PERC H700i storage controller CPLD/Flash/NVSRAM etc. (if applicable)
Size: FRU: 256 Bytes
Boot ROM: 8 KB
Flash: 8 MB
CPLD: 128 Macrocells
NVSRAM: 128 KB
iButton key EEPROM: 128 Bytes
Battery-Backed Cache: 512 MB
Type [Flash PROM, EEPROM]: FRU, EEPROM, Flash, CPLD, Non-volatile SRAM
and a 1-wire EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Flash stores the storage controllers firmware
CPLD controls the power sequencing & battery
backup logic
NVSRAM stores the controller configuration

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FRU stores the PPID, manufacturing date etc.
Battery-Backed Cache: Stores the data if the
cache is not cleared and battery backup unit is
enabled in the case of a power loss.
How is data input to this memory? FRU/CPLD data is preprogrammed at board
build.
NVSRAM is updated by the storage controller
Flash is updated by Dell provided update
package
Cache stores the data before getting written to
the disks when WriteBack policy is enabled with
battery backup.
How is this memory write protected? FRU is not write protected but other
components detailed above in the Size row are
software write protected.
Remarks PERC H700i controller is optional
Dell PERC H200i storage controller Flash/NVSRAM/FRU (if applicable)
Size: FRU: 256 Bytes
Boot ROM: 8 KB
Flash: 8 MB
NVSRAM: 128 KB
Type [Flash PROM, EEPROM]: Flash (NOR), EEPROM and NVSRAM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Flash stores the storage controllers firmware
NVSRAM stores the controller configuration
FRU stores the PPID, manufacturing date etc.
How is data input to this memory? FRU data is preprogrammed at board build.
NVSRAM is updated by the storage controller
Flash is updated by Dell provided update
package
How is this memory write protected? FRU is not write protected but everything else is
software write protected
Remarks PERC H200i controller is optional
Server (4- or 16-drive SAS) Backplane Storage Controller Memory
Size: 32KB
Type [Flash PROM, EEPROM]: Embedded Microcontroller Flash
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Stores the server storage backplane FW and FRU

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How is data input to this memory? Loading flash memory requires a vendor-
provided firmware file and loader program
which is executed by booting up the system
from a floppy or OS-based executable
containing the firmware file and the loader.
System loaded with arbitrary data in firmware
memory would not operate.
How is this memory write protected? Software write protected
Remarks There is quantity of “1” PSoC device on the 4-
drive backplane versus “2” on the 16-drive
backplane.
Server (16-drive SAS only) Backplane SAS Expander EEPROM
Size: 4MB
Type [Flash PROM, EEPROM]: Flash EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Store SAS expander firmware and configuration
data
How is data input to this memory? Data pre-programmed or update using Dell
utility which is a DOS-based executable
containing the firmware file and loader.
How is this memory write protected? Software write protected
Remarks Ensure that SAS x16 BP cables are attached to
planar prior to update. After update, the
system should be AC cycled before update takes
effect.
Power Supply Firmware and FRU (Field Replacement Unit) Memory
Size: 1100W LiteOn: 4KB FLASH with 256 Bytes RAM
1100W/750W Emerson: 8K and 16K FLASH with
384 and 1024 Bytes RAM respectively
750W Delta: Flash ROM size 48K bytes and
EEPROM size 1K bytes
Type [Flash PROM, EEPROM]: FLASH, EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Stores PSU controller firmware. FRU information
for boards such as name, manufacturing date
etc.
How is data input to this memory? FRU and firmware data pre-programmed by the
PSU vendors. PSU firmware can be updated by
Dell provided update package.
How is this memory write protected? Software write protected
Remarks The number of these devices depends on the
number of PSUs installed.

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Dell Internal Dual SD Module (IDSM) microcontroller flash (if present)
Size: 256 KB
Type [Flash PROM, EEPROM]: EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Store firmware for IDSM functionality
How is data input to this memory? Loading flash memory requires a vendor-
provided firmware file and loader program.
IDSDM module loaded with arbitrary data in
firmware memory would not operate.
How is this memory write protected? Software write protected
Remarks IDSM is an option
Dell Internal Dual SD Module (IDSM) write journal flash (if present)
Size: 8 MB
Type [Flash PROM, EEPROM]: EEPROM
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Store write journal for shutdown recovery
How is data input to this memory? IDSM microcontroller writes to and read from
these memory via SPI interface during
operation.
How is this memory write protected? Software write protected
Remarks IDSM is an option
SD card(s) (if present) for IDSM (one or two SD cards depending on the redundancy mode
ordered with it)
Size: Multiple (1GB, 2GB, 8GB)
Type [Flash PROM, EEPROM]: Secure Digital NAND Flash
Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Normal usage is embedded Hypervisor OS but
not limited
How is data input to this memory? Factory load, OS run time usage and OS updates
and configuration changes.
How is this memory write protected? Media-write protection or software-write
protected
Remarks IDSM is an option
vFlash for iDRAC Enterprise
Size: Multiple
Type [Flash PROM, EEPROM]: Secure Digital NAND Flash

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Can user programs or operating system write No
data to it during normal operation?
Does it retain data when powered off? Yes
Purpose? [boot code] Storage of logs, user images like files, drivers,
OS’s etc.
How is data input to this memory? Preloaded media before installation, or remote
out-of-band upload of user data (i.e., ISO
images, files) or local server read/write
capability to use like a hard disk.
How is this memory write protected? Media write protection or Software write
protected
Remarks iDRAC Enterprise and vFlash are optional

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Appendix B. Certifications
B 1. Regulatory Certifications
Regulatory compliance certificates can be located at the following sites:
 [Link]
/dec_conform?c=us&l=en&s=corp

B 2. Product Safety Certifications

The product has been certified and bears the Mark, as applicable, of the Product Safety authorities
as indicated in Table 20.

Table 20. Product Safety Certifications

Country/Region Authority or Mark
Argentina IRAM
Belarus BELLIS
Canada SCC
China CNCA or CCC
Croatia KONCAR
European Union CE
Germany TUV
IECEE IECEE CB
Israel SII
Kazakhstan OTAN – CKT
Kenya KEBS
Kuwait KUCAS
Mexico NYCE or NOM
Moldova INSM
Nigeria SONCAP
Norway NEMKO
Russia GOST
Saudi Arabia KSA ICCP
South Africa NRCS
Taiwan BSMI
UKRTEST or
Ukraine UKRSERTCOMPUTER
United States NRTL
Uzbekistan STZ

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B 3. Electromagnetic Compatibility
The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated
in Table 21.

Table 21. Electromagnetic Compatibility Certifications

Country/Region Authority or Mark Class
Australia/New ACMA or C-Tick
Zealand Class A
Belarus BELLIS Class A
Bosnia, Herzegovina,
Montenegro, Serbia KVALITET Class A
Canada ICES Class A
China CNCA or CCC Class A
Croatia KONCAR Class A
European Union CE Class A
Israel SII Class A
Japan VCCI Class A
Kazakhstan OTAN – CKT Class A
Moldova INSM Class A
Norway NEMKO Class A
Russia GOST Class A
South Africa SABS Class A
South Korea KCC Class A
Taiwan BSMI Class A
Ukraine UKRTEST or UKRSERTCOMPUTER Class A
United States FCC Class A
Uzbekistan STZ Class A
Vietnam ICT Class A

B 4. Ergonomics, Acoustics and Hygienics

The product has been certified and bears the Mark, as applicable, of the Ergonomics, Acoustics and
Hygienics authorities as indicated in Table 22.

Table 22. Ergonomics, Acoustics and Hygienics

Country/Region Authority or Mark
Belarus BELLIS
Germany GS
Russia GOST

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Appendix C. Industry Standards

The Dell™ PowerEdge™ R910 system conforms to the industry standards detailed in Table 23.

Table 23. Industry Standards

Standard URL for Information and Specifications
ACPI [Link]
Advance Configuration and
Power Interface Specification,
v2.0c
Energy Star [Link]
EPA Version 1.0 of the _servers
Computer Server specification
Ethernet [Link]
IEEE 802.3-2005
IPMI [Link]
Intelligent Platform
Management Interface, v2.0
DDR3 Memory [Link]
DDR3 SDRAM Specification,
Rev. 3A
LPC [Link]
Low Pin Count Interface m
Specification, Rev. 1.1
PCI Express [Link]
PCI Express Base Specification
Rev. 2.0
PMBus [Link]
Power System Management
Protocol Specification, v1.1
SAS [Link]
Serial Attached SCSI, v1.1
SATA [Link]
Serial ATA Rev. 2.6;
SATA II, Extensions to SATA
1.0a, Rev. 1.2
SMBIOS [Link]
System Management BIOS
Reference Specification, v2.6
TPM [Link]
Trusted Platform Module n_specification
Specification, v1.2
UEFI [Link]
Unified Extensible Firmware
Interface Specification, v2.1

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Standard URL for Information and Specifications
USB [Link]
Universal Serial Bus
Specification, Rev. 2.0
Windows Logo [Link]
Windows Logo Program System mspx
and Device Requirements,
v3.10

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