Requirement Details
OvercurrenUse a fuse or resettable polyfuse; alternatively, current-limiting resistors or PTC thermistors.
OvervoltagUse TVS diode, MOV, or Zener diode across sensitive components to clamp voltage spikes.
Reverse PolInclude a diode in series with the input power line or a MOSFET-based solution for low voltage drop.
Inductive KUse a flyback diode across inductive loads to absorb energy from voltage spikes.
ESD (ElectrPlace ESD protection diodes at PCB's input/output connectors, especially in static-prone environments.
Thermal PrAdd temperature sensors and a thermal shutdown circuit if excessive heat is a concern.
PCB LayoutMinimize loop areas, route high-current traces carefully, use ground planes, avoid breaks in ground plane near com
DecouplingPlace close to power pins of ICs, use multiple capacitors (e.g., 0.1 μF and 10 μF) to cover a broad frequency range.
Shielding aAdd shielding for high-frequency signals/noisy components; use ferrite beads on signal lines.
Controlled Follow controlled impedance routing for high-speed signals; use differential pairs with matched lengths.
GroundingUse a single-point ground reference, separate analog/digital grounds, connect grounds at a single point before supp
ComponentPlace high-speed/high-power components near connectors; isolate components generating EMI from sensitive ana
w voltage drop.
ne environments.
eaks in ground plane near components.
ver a broad frequency range.
h matched lengths.
ds at a single point before supply return.
erating EMI from sensitive analog sections.