TD62382AP/F/AF
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62382AP,TD62382F,TD62382AF
8CH LOW INPUT ACTIVE SINK DRIVER
The TD62382AP / F / AF are non−inverting transistor array
which are comprised of eight Low saturation output stages and
PNP input stages.
This device is low level input active driver and is suitable for
operation with TTL, 5 V CMOS and 5 V Microprocessor which
have sink current output drivers.
Applications include relay, hammer, lamp and LED display
drivers.
FEATURES
Low saturation output 0.23 V MAX. @IOUT = 40 mA MAX.
Output rating 35 V MIN. / 50 mA MAX. (TD62382F)
50 V MIN. / 50 mA MAX. (TD62382AP,
TD62382AF)
Input compatible with TTL and 5 V CMOS
Low level active inputs
Standard supply voltage
Package type−AP : DIP−18 pin
Package type−F, AF : SOP−18 pin
Weight
DIP18−P−300−2.54D : 1.47 g (Typ.)
SOP18−P−375−1.27 : 0.41 g (Typ.)
PIN CONNECTION (TOP VIEW) SCHEMATICS (EACH DRIVER)
Note: The input and output parasitic diodes cannot be
used as clamp diodes.
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TD62382AP/F/AF
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIS SYMBOL RATING UNIT
Supply Voltage VCC −0.5~7.0 V
AP, AF −0.5~50
Output Sustaining Voltage VCE (SUS) V
F −0.5~35
Output Current IOUT 50 mA / ch
Input Voltage VIN −22~VCC + 0.5 V
Input Current IIN 10 mA
AP 1.47
Power Dissipation PD (Note) W
F, AF 0.96
Operating Temperature Topr −40~85 °C
Storage Temperature Tstg −55~150 °C
Note: Delated above 25°C in the proportion of 11.7 mW / °C (AP−Type), 7.7 mW / °C (F, AF−Type).
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Supply Voltage VCC ― 4.5 5.0 5.5 V
AP, AF ― 0 ― 50
Output Sustaining Voltage VCE (SUS) V
F ― 0 ― 35
DC 1 Circuit 0 ― 40
mA /
Output Current AP IOUT 8 Circuits 0 ― 40
ch
AF, F 8 Circuits 0 ― 40
VIN ― −20 ― VCC V
VCC
Output On VIN (ON) ― −20 ―
Input Voltage − 3.5
V
VCC VCC
Output Off VIN (OFF) ― ―
− 0.3 + 0.5
AP ― ― ― 0.52
Power Dissipation PD W
F, AF ― ― ― 0.35
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TD62382AP/F/AF
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
TEST
CHARACTERISTIC SYMBOL CIR− TEST CONDITION MIN TYP. MAX UNIT
CUIT
VCC = 5.5 V, IIN = 0
Output Leakage Current ICEX 1 ― ― 100 µA
VOUT = 35 V, Ta = 75°C
VCC = 4.5 V, VIN = 0.8 V
Output Saturation Voltage VCE (sat) 2 ― ― 0.23 V
IOUT = 40 mA
VCC = 5.5 V, VIN = 0.4 V ― −0.32 −0.45
Output On IIN (ON) 3 mA
Input Current VCC = 5.5 V, VIN = −20 V ― ― −2.6
Output Off IIN (OFF) 4 ― ― ― −40 µA
VCC
Input Voltage Output on VIN (ON) 5 ― −20 ― V
− 3.5
mA /
Output On ICC(ON) VCC = 5.5 V, VIN = 0 V ― ― 6
ch
Supply Current 6
VCC = VIN = 5.5 V
Output Off ICC(OFF) ― ― 100 µA
Ta = 75°C
VOUT = 35 V
AP, AF ― 0.1 ―
RL = 82 kΩ
Turn−On Delay tON
VOUT = 50 V
F ― 0.1 ―
VCC = 5 V RL = 1 kΩ
7 µs
CL = 15 pF VOUT = 35 V
AP, AF ― 3.0 ―
RL = 82 kΩ
Turn−Off Delay tOFF
VOUT = 50 V
F ― 3.0 ―
RL = 1 kΩ
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TD62382AP/F/AF
TEST CIRCUIT
1. ICEX 2. VCE (sat)
3. IIN (ON) 4. IIN (OFF)
5. VIN (ON) 6. ICC
7. tON, tOFF
Note 1: Pulse Width 50 µs, Duty Cycle 10%
Output Impedance 50 Ω, tr ≤ 10 ns, tf ≤ 5 ns
Note 2: CL includes probe and jig capacitance.
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that
excess current or voltage will not be applied to the IC.
Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to
short−circuit between outputs, air contamination fault, or fault by improper grounding.
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TD62382AP/F/AF
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TD62382AP/F/AF
PACKAGE DIMENSIONS
DIP18−P−300−2.54D Unit: mm
Weight: 1.47 g (Typ.)
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TD62382AP/F/AF
PACKAGE DIMENSIONS
SOP18−P−375−1.27 Unit: mm
Weight: 0.41 g (Typ.)
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TD62382AP/F/AF
RESTRICTIONS ON PRODUCT USE 000707EBA
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
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such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
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document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
8 2001-07-04
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