Application Report

SZZA047 - July 2004

Semiconductor Packing Material

Electrostatic Discharge (ESD) Protection
Albert Escusa and Lance Wright Standard Linear and Logic

ABSTRACT

Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI)
standard packing methodology were subjected to electrical discharges between 0.5 and 20
kV, as generated by an IEC ESD simulator to determine the level of ESD protection provided
by the packing materials. The testing included trays, tape and reel, and magazines.
Additional units were subjected to the same discharge, without the protection of the packing
material. Test results showed that the packing materials used by TI provide protection up to
20 kV, and that a level of ESD protection is required. The die in the components had a Charge
Device Model (CDM) rating of 0.5 kV, and all units experiencing a discharge greater than 500
V sustained sufficient electrical overstress to fail electrical testing when outside of the packing
materials.

Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Packing Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Tube Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Tray Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.3 Tape-and-Reel Packing Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Test Equipment and Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1 3M SED Procedure for Trays/Tape and Reel/Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.2 IEC ESD Simulator Procedure for Trays/Tape and Reel/Tubes . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 Tray-Stack Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1.1 Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1.2 Tray Packing Results on Live TSSOP Devices Using IED Gun . . . . . . . . . . . . . . . . . . 8
5.2 Tape-and-Reel Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2.1 Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.2.2 Tape-and-Reel Packing Results on Live TSSOP Devices Using IEC Gun . . . . . . . . 10
5.3 Tube Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3.1 Tube Event-Detector Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3.2 Tube Packing Results on Live TSSOP Devices Using IEC Gun . . . . . . . . . . . . . . . . 12
5.4 Results of Unpackaged Live TSSOP Devices Using IEC Gun . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks are the property of their respective owners.

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6 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Acknowledgments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

List of Figures
1. Event-Detector Locations in Tray Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2. Tray Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Tray Stack in Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4. Event-Detector Locations in Reel (Used 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5. Carrier-Tape Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6. Tape-and-Reel Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7. Event-Detector Locations in Magazine Bundle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8. Bundle of Tubes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9. Tube Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
10. Carbon-Lined Bag . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11. Test Socket for Live Die Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

List of Tables
1. Test Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Event-Detector Feedback for Black PPE-Tray Packing Configurations . . . . . . . . . . . . . . . . . . . . . . 7
3. Event-Detector Feedback for Blue Dipped-Tray Packing Configurations . . . . . . . . . . . . . . . . . . . . . 7
4. ESD Testing on Live TSSOP Devices for Black PPE-Tray Packing Configurations . . . . . . . . . . . . 8
5. ESD Testing on Live TSSOP Devices for Blue Dipped-Tray Packing Configurations . . . . . . . . . . 8
6. Event-Detector Feedback for Black Static-Dissipative-Reel Packing Configurations . . . . . . . . . . . 9
7. Event-Detector Feedback for Blue Dipped-Reel Packing Configurations . . . . . . . . . . . . . . . . . . . . 10
8. ESD Testing on Live TSSOP Devices for Black Reel Packing Configurations . . . . . . . . . . . . . . . 10
9. ESD Testing on Live TSSOP Devices for Blue Dipped-Reel Packing Configurations . . . . . . . . . 10
10. Event-Detector Feedback for Clear Antistatic Tube Packing Configurations . . . . . . . . . . . . . . . . . 11
11. Event-Detector Feedback for Black Tube Packing Configurations . . . . . . . . . . . . . . . . . . . . . . . . . 12
12. ESD Testing on Live TSSOP Devices for Clear Antistatic Tube Packing Configurations . . . . . . 12
13. ESD Testing on Live TSSOP Devices for Black Tube Packing Configurations . . . . . . . . . . . . . . . 12
14. ESD Ground-Pin Test Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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1 Introduction
Texas Instruments (TI) ships over 5-billion semiconductor devices on an annual basis. To ensure
that these devices reach the customer in good condition, they must be packaged appropriately
to withstand the potential damage of shipping. Semiconductor packing materials must protect
the units from physical damage, vibration shock, and electrostatic discharge (ESD).

Static electricity is a natural phenomenon. Delicate electronic components are easily damaged
by ESD, and subsequent faults in assembled finished products can be costly. Packing media is
used to protect against ESD, as ICs are delivered to the customer and include items such as
trays, tape and reel, tubes or magazines, boxes, and bags. These items must have a surface
resistance in the static dissipate range of greater than 1x104 Ω/sq, but less than 1x1011 Ω/sq per
ANSI/EOS/ESD S11.11-2001, in order to control a discharge. If the surface resistance is too
small, a charge can dissipate too quickly and electrically overstress the ICs within the packing
medium.

The purpose of this application report is to demonstrate that TI packing methods provide
sufficient ESD protection when used in accordance with EIA-541 and EIA-625 material-handling
guidelines. Packing methods in use today by TI are tape and reel, tray, and tubes. A typical logic
device has minimum ESD criteria, unless approved by a waiver from the Quality department:
[Human-Body Model (HBM), 2000 V] [Charge-Device Model (CDM), 500 V]. The testing
performed in this study was done using a die meeting these minimum requirements, and the
testing performed simulated the CDM. For more information on HBM and CDM, please see the
TI application report, Electrostatic Discharge (ESD), literature number SSYA010, located at
[Link].

2 Packing Methods

2.1 Tube Packing Method

When a customer receives devices packed in tubes, they receive a carbon-lined cardboard box
for surface-mount components. The surface-mount technology (SMT) components are wrapped
in bubble wrap that has an antistatic coating if the moisture sensitivity rating is level 1 (MSL 1). If
not, the tubes are put in a moisture-barrier bag (MBB) and placed in a cardboard box. For
through-hole components, the tubes are shipped inside a carbon-lined bag. Through-hole
components are not moisture sensitive and do not require drypack in an MBB.

2.2 Tray Packing Method

Trays are sent to the customer in a stacked arrangement. There is 4+1, 5+1, or 10+1 tray
stacking, which means that 4, 5, or 10 trays have units with a top tray that is empty. The top tray
acts as a cover. A single carbon-lined cardboard sheet is put on the top and bottom of the tray
stack and bound together with a conductive plastic strap. If the devices are moisture sensitive,
the bundle is drypacked in an MBB and placed in a box with a carbon-lined insert/sleeve. The
top and bottom cardboard sheets and insert provide the Faraday cage (ESD shielding). If the
units are not moisture sensitive, the bundle is wrapped in antistatic bubble wrap and placed in a
non-carbon-lined box.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 3

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2.3 Tape-and-Reel Packing Method

Devices in static-dissipative carrier tape are wound onto an intrinsically static-dissipative reel.
This reel, if moisture sensitive, is placed in an MBB and placed in a non-carbon-lined cardboard
box. If the devices are not moisture sensitive, the reel is placed in the non-carbon-lined box,
without bubble wrap or MBB. The reel has an extra layer of winding at the inner and outer hub to
provide the Faraday cage. The customer receives one reel per box.

3 Text Equipment and Materials

The instruments and materials listed in section 3.2 were used to conduct the ESD tests. The
packing materials listed were qualified in accordance with TI internal qualification procedures.

3.1 Instruments
1. NoiseKen, ESS-2000 IEC ESD Simulator. This instrument, shown in the background of
Figure 2, is used to generate ESD on the packing materials.
2. 3M Event Detector, 37 V. The device is one cubic inch and has a window that turns red
when exposed to 37 V, or higher. The window remains black when exposed to <37 V.

3.2 Materials
All the packing materials listed in Table 1 are TI production materials that are qualified in
accordance with Quality Standard 007-001.

Table 1. Test Materials

TI PART NUMBER RATED SURFACE RESISTIVITY MATERIAL DESCRIPTION
4200101-0001 1x10e7 Ω/sq Tray, black, PPE
RH Murphy 1x10e5 Ω/sq Tray, blue, antistatic, dipped, ABS
4204205-0003 1x10e9 Ω/sq 13-in black intrinsically static dissipative reel
4200038-0003 1x10e10 Ω/sq 13-in blue antistatic dipped reel
4041338-0001 1x10e9 Ω Tube, clear antistatic, PVC
-034 (Burr Brown) 1x10e3 Ω Tube, black, conductive
4200734-0004 1x10e8 Ω/sq MBB for tube
4200734-0003 1x10e10 Ω/sq MBB for tray, aluminum
4200734-0001 1x10e10 Ω/sq MBB for tape and reel, aluminum
4045704-0025 Interior/exterior: 1x10e10 Ω/sq, Metal: 100 Ω ESD shielding bag for tape and reel
4045704-0026 Interior/exterior: 1x10e10 Ω/sq, Metal: 100 Ω/sq ESD shielding bag for tray
1041370-0104 1x10e4 Ω/sq Conductive insert/sleeve, carbon lined
1041370-0112 1x10e4 Ω/sq Corrugated conductive pad, carbon lined
1041285-0031 NA Pizza box, intermediate container for 13-in reel
1041286-0146 NA Intermediate single JEDEC box for tray
1041286-0117 1x10e4 Ω/sq Carbon-lined intermediate box for tube
4078201-0001 1x10e4 Ω/sq Carbon-lined conductive paper bag

4 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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4 Test Procedure
ESD testing consists of two tests. The first test uses a 37-V Static Event Detector (SED),
manufactured by 3M. The detector is placed within the packing materials (see Figures 1, 4,
and 7) to simulate a “packaged” device. The IEC ESD simulator then is used to discharge 0.5 kV
to 20 kV on the packing configuration. The detector window turns red if it has been exposed to
>37 V. SEDs that experience 37 V indicate that more testing is needed, as the device may be
susceptible to damage due to ESD by exposure to voltages greater than 500 V. The minimum
voltage chosen was 0.5 kV, as this is the CDM ESD rating standard TI die. The maximum
voltage chosen was 20 kV, since it is the maximum value that can be discharged in an
exceptionally low-humidity environment when all handling is in accordance with EIA 541/625.
The second test is a repeat of the first test, with known good devices being packed instead of
SEDs. Additionally, this device is placed in a test socket (see Figure 11) and the discharge is
made directly to the ground pins. For this test, a 48-pin TSSOP package was chosen with a
SSTV16857 Rev C die. This die was chosen because it has the minimum allowable values for
HBM and CDM, which are 2000 and 500 V, respectively. These two tests relate to ESD
sensitivity and are described in detail in TI application report, Electrostatic Discharge (ESD),
literature number SSYA010. Devices with lower values must have a waiver from QA prior to
production shipping. The premise for this test is that no failures prove that TI packing
methodology is sufficient in accordance with the EIA 541/625 ESD packing material and
handling guidelines that TI follows.
The ESD simulator chosen in this study complies with the industry specification IEC 61000-4-2
for system-level ESD evaluation. It generates a more severe stress compared to those specified
in the JEDEC standards of JESD22-A104 for component-level HBM and JESD22-C101 for
component-level CDM. The stress generated by the ESD simulator includes both
component-level HBM and CDM stresses. In addition, at a same-stress voltage level, the
ESD simulator produces an ESD pulse of a greater magnitude than those of the
component-level HBM and CDM stresses. The component-level HBM and CDM tests are
specified in the JEDEC standards and are included in the TI internal specifications for device
qualification. The minimum requirements are 2000 V for HBM and 500 V for CDM. A device with
marginal ESD performance, in accordance with the TI ESD specification, was chosen in this
study.

4.1 3M SED Procedure for Trays/Tape and Reel/Tubes

1. Reset all 37-V SEDs by swiping next to a magnet.
2. Distribute the detectors evenly in the packing material as shown in Figures 1, 4, and 7.
3. Shoot the ESD generator at six different spots around the packing material and record the
result.
4. Perform the same test on the other packing configurations, as shown in the test matrix.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 5

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4.2 IEC ESD Simulator Procedure for Trays/Tape and Reel/Tubes

1. Place five “electrically good” devices in the first packing material to be tested.
a. Trays: Place in all four corners and at the center of the top tray.
b. Carrier tape: Place all five in consecutive pockets, with an empty layer of carrier tape on
top.
c. Tubes: Distribute evenly along the length of the tube.
2. Discharge the ESD generator at ten different spots around the packing material and
record the results.
3. Perform the same test on the other packing configurations, as shown in the test matrix.

5 Results

5.1 Tray-Stack Test Results

5.1.1 Event-Detector Test Results

ÎÎÎÎÎÎÎÎÎÎÎ
Event
Detector
3

ÎÎÎÎÎÎÎÎÎÎÎ
4

ÎÎÎÎÎÎÎÎÎÎÎ 1
2

Stack of Tray
(10+1)

Figure 1. Event-Detector Locations in Tray Stack

6 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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Table 2. Event-Detector Feedback for Black PPE-Tray Packing Configurations(1)(2)

PACKING-MATERIAL CONFIGURATION

IEC 10+1 TRAYS,

10+1 TRAYS, 10+1 TRAYS, 10+1 TRAYS,
ESD GENERATOR CARBON-LINED
10+1 CARBON-LINED CARBON-LINED CARBON-LINED
VOLTAGE SETTING BOARD,
TRAYS BOARD BOARD, BOARD,
INTERMEDIATE BOX
(TOP AND BOTTOM) MBB ESD SHIELD BAG
WITH BUBBLE PACK
2 kV 1,2,3,4 1,2,3,4 NA Good NA
2 kV 1,2,3,4 1,2,3,4 NA Good NA
4 kV 1,2,3,4 1,2,3,4 NA Good NA
6 kV 1,2,3,4 1,2,3,4 NA Good NA
8 kV 1,2,3,4 1,2,3,4 NA Good NA
10 kV 1,2,3,4 1,2,3,4 NA Good NA
12 kV 1,2,3,4 1,2,3,4 NA 1,2,3,4 NA
14 kV 1,2,3,4 1,2,3,4 NA 1,2,3,4 NA
16 kV 1,2,3,4 1,2,3,4 NA 1,2,3,4 NA
18 kV 1,2,3,4 1,2,3,4 NA 1,2,3,4 NA
20 kV 1,2,3,4 1,2,3,4 NA 1,2,3,4 NA
(1) There are four event detectors used, numbered 1 to 4.
(2) Numbers in the table are the event detector numbers that turned red after the ESD stress test. Red means the 37-V event detector has
experienced an ESD >37 V.

Table 3. Event-Detector Feedback for Blue Dipped-Tray Packing Configurations(1)(2

PACKING-MATERIAL CONFIGURATION

IEC 10+1 TRAYS,

10+1 TRAYS, 10+1 TRAYS, 10+1 TRAYS,
ESD GENERATOR CARBON-LINED
CARBON-LINED CARBON-LINED CARBON-LINED
VOLTAGE SETTING 10+1 TRAYS BOARD,
BOARD (TOP AND BOARD, BOARD,
INTERMEDIATE BOX
BOTTOM) MBB ESD SHIELD BAG
WITH BUBBLE PACK
2 kV 1,2,3,4 1,2,3,4 4 NA Good
4 kV 1,2,3,4 1,2,3,4 3,4 NA Good
6 kV 1,2,3,4 1,2,3,4 2,3,4 NA Good
8 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
10 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
12 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
14 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
16 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
18 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
20 kV 1,2,3,4 1,2,3,4 1,2,3,4 NA Good
(1) There are four event detectors used, numbered 1 to 4.
(2) Numbers in the table are the event detector numbers that turned red after the ESD stress test. Red means the 37-V event detector has
experienced an ESD >37 V.

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5.1.2 Tray Packing Results on Live TSSOP Devices Using IED Gun

Table 4. ESD Testing on Live TSSOP Devices

for Black PPE-Tray Packing Configurations(1)
PACKING-MATERIAL CONFIGURATION
IEC 10+1 TRAYS, 10+1 TRAYS,
ESD GENERATOR VOLTAGE CARBON-LINED CARBON-LINED
SETTING 10+1 TRAYS
BOARD BOARD,
(TOP AND BOTTOM) MBB
0.5, 1, 2–20 (2 kV included) kV No failures No failures No failures
(1) The devices used in the test are serialized as shown in the table.

Table 5. ESD Testing on Live TSSOP Devices

for Blue Dipped-Tray Packing Configurations
PACKING-MATERIAL CONFIGURATION

IEC 10+1 TRAYS,

10+1 TRAYS, 10+1 TRAYS,
ESD GENERATOR VOLTAGE CARBON-LINED
CARBON-LINED CARBON-LINED
SETTING 10+1 TRAYS BOARD,
BOARD BOARD,
INTERMEDIATE BOX
(TOP AND BOTTOM) ESD SHIELD BAG
WITH BUBBLE PACK
0.5, 1, 2-20 (2 kV included) kV No failures No failures No failures No failures

Figure 2. Tray Stack Figure 3. Tray Stack in Box

Summary of test results:

The 3M event-detector results show that units packed in the tray configuration can experience
up to 37 V when not packed in an ESD shielding bag or in an MBB that is exposed to at least
12 kV. As expected, the ESD shielding bag provides the best results. Both tray materials
performed about the same. TI does not ship all units in ESD bags because of the expense. The
IEC test results show that no units failed or experienced more than 500 V when exposed to
20 kV in any packing configuration. These tests show that the low-cost packing method, when
used in accordance with EIA-541 and EIA-625, provides sufficient ESD protection.

8 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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5.2 Tape-and-Reel Test Results

5.2.1 Event-Detector Test Results

ÏÏÏ
ÏÏÏÏÏÏÏ
2 Reel

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ÏÏÏÏÏÏÏ
ÏÏÏ
ÏÏÏÏÏÏÏ
3

ÏÏÏ ÏÏÏ
ÏÏÏ ÏÏÏ
ÏÏÏ
ÏÏÏÏÏÏÏ
ÏÏÏÏÏÏÏ
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1

Event Detector

Figure 4. Event-Detector Locations in Reel (Used 3)

Table 6. Event-Detector Feedback for Black Static-Dissipative-Reel

Packing Configurations(1)(2)
PACKING-MATERIAL CONFIGURATION
IEC
1 FULL 1 FULL 1 FULL REEL,
ESD GENERATOR
1 FULL REEL REEL, REEL, ESD SHIELD
VOLTAGE SETTING
PIZZA BOX MBB BAG
2 kV 2 Good Good Good
4 kV 1,2,3 Good Good Good
6 kV 1,2,3 Good Good Good
8 kV 1,2,3 Good Good Good
10 kV 1,2,3 1 Good Good
12 kV 1,2,3 Good Good Good
14 kV 1,2,3 1,2 3 Good
16 kV 1,2,3 1,2,3 1,2,3 Good
18 kV 1,2,3 1,2,3 1,2,3 Good
20 kV 1,2,3 1,2,3 1,2,3 Good
(1) There are four event detectors used, numbered 1 to 4.
(2) Numbers in the table are the event detector numbers that turned red after the ESD stress test.
Red means the 37-V event detector has experienced an ESD >37 V.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 9

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Table 7. Event-Detector Feedback

for Blue Dipped-Reel Packing Configurations(1)(2)
PACKING-MATERIAL CONFIGURATION
IEC
1 FULL 1 FULL 1 FULL REEL,
ESD GENERATOR
1 FULL REEL REEL, REEL, ESD SHIELD
VOLTAGE SETTING
PIZZA BOX MBB BAG
2 kV 1,2,3 Good Good Good
4 kV 1,2,3 Good Good Good
6 kV 1,2,3 Good Good Good
8 kV 1,2,3 Good Good Good
10 kV 1,2,3 1 Good Good
12 kV 1,2,3 1,2 Good Good
14 kV 1,2,3 1,3 1.2,3 Good
16 kV 1,2,3 1,2,3 1,2,3 Good
18 kV 1,2,3 1,2,3 1,2,3 Good
20 kV 1,2,3 1,2,3 1,2,3 Good
(1) There are four event detectors used, numbered 1 to 4.
(2) Numbers in the table are the event detector numbers that turned red after the ESD stress test.
Red means the 37-V event detector has experienced an ESD >37 V.

5.2.2 Tape-and-Reel Packing Results on Live TSSOP Devices Using IEC Gun

Table 8. ESD Testing on Live TSSOP Devices

for Black Reel Packing Configurations
IEC Packing-Material Configuration
ESD Generator 1 Full Reel, 1 Full Reel, 1 Full Reel,
1 Full Reel
Voltage Setting Pizza Box MBB ESD Shield Bag
0.5, 1, 2-20 (2 kV included) kV No failures No failures No failures No failures

Table 9. ESD Testing on Live TSSOP Devices

for Blue Dipped-Reel Packing Configurations
IEC Packing-Material Configuration
ESD Generator 1 Full Reel, 1 Full Reel, 1 Full Reel,
1 Full Reel
Voltage Setting Pizza Box MBB ESD Shield Bag
0.5, 1, 2-20 (2 kV included) kV No failures No failures No failures No failures

Figure 5. Carrier-Tape Reel Figure 6. Tape-and-Reel Box

10 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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Summary of test results:

The 3M event-detector results show that the reel and pizza box provide some level of protection,
but not as much as when the reel is packed in an MBB bag. As with the tray packing, the event
detector never experienced 37 V when the reel was packed inside an ESD shielding bag. The
static-dissipative reel performed better than the dipped reel. The IEC test results show that no
units failed or experienced more than 500 V when exposed to 20 kV in any packing
configuration. These tests show that the low-cost packing method, when used in accordance
with EIA-541 and EIA-625, provides sufficient ESD protection.

5.3 Tube Test Results

5.3.1 Tube Event-Detector Test Results

Magazines Magazines

1 2 3 4

Event Detectors
Event Detector Embedded in the
Middle of Magazine Bundle

Figure 7. Event-Detector Locations in Magazine Bundle

Table 10. Event-Detector Feedback

for Clear Antistatic Tube Packing Configurations(1)(2)
Packing-Material Configuration

IEC Bundle of
Bundle of
ESD Generator Tubes, Bundle of
Bundle Tubes,
Voltage Setting Carbon-Lined Tubes,
of Tubes Carbon-Lined
Intermediate MBB
Bag
Box
2 kV 1,2,3,4 Good Good 1
4 kV 1,2,3,4 Good Good 1
6 kV 1,2,3,4 Good Good 1,2,3,4
8 kV 1,2,3,4 Good 1,2,3,4 1,2,3,4
10 kV 1,2,3,4 Good 1,2,3,4 1,2,3,4
12 kV 1,2,3,4 4 1,2,3,4 1,2,3,4
14 kV 1,2,3,4 2,3,4 1,2,3,4 1,2,3,4
16 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
18 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
20 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
(1) There are four event detectors used, numbered 1 to 4.
(2) Numbers in the table are the event detector numbers that turned red after the ESD stress test. Red means
the 37-V event detector has experienced an ESD >37 V.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 11

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Table 11. Event-Detector Feedback

for Black Tube Packing Configurations(1)(2)
Packing-Material Configuration

IEC Bundle of
Bundle of
ESD Generator Tubes, Bundle of
Bundle Tubes,
Voltage Setting Carbon-Lined Tubes,
of Tubes Carbon-Lined
Intermediate MBB
Bag
Box
2 kV 1,2,3,4 Good Good 1,2,3,4
4 kV 1,2,3,4 1 Good 1,2,3,4
6 kV 1,2,3,4 1 Good 1,2,3,4
8 kV 1,2,3,4 1,2 Good 1,2,3,4
10 kV 1,2,3,4 1,4 Good 1,2,3,4
12 kV 1,2,3,4 1,2,3,4 1,4 1,2,3,4
14 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
16 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
18 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
20 kV 1,2,3,4 1,2,3,4 1,2,3,4 1,2,3,4
(1) There are four event detectors used, numbered 1 to 4.
(2) Numbers in the table are the event detector numbers that turned red after the ESD stress test. Red means
the 37-V event detector has experienced an ESD >37 V.

5.3.2 Tube Packing Results on Live TSSOP Devices Using IEC Gun

Table 12. ESD Testing on Live TSSOP Devices

for Clear Antistatic Tube Packing Configurations
Packing-Material Configuration

IEC Bundle of
Bundle
ESD Generator Tubes, Bundle
Bundle of Tubes,
Voltage Setting Carbon-Lined of Tubes,
of Tubes Carbon-Lined
Intermediate MBB
Bag
Box
0.5, 1, 2-20 (2 kV included) kV No failures No failures No failures No failures

Table 13. ESD Testing on Live TSSOP Devices for Black Tube
Packing Configurations
Packing-Material Configuration

IEC Bundle of
Bundle
ESD Generator Tubes, Bundle
Bundle of Tubes,
Voltage Setting Carbon-Lined of Tubes,
of Tubes Carbon-Lined
Intermediate MBB
Bag
Box
0.5,1, 2-20 (2 kV included) kV No failures No failures No failures No failures

12 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

 SZZA047

Figure 8. Bundle of Tubes Figure 9. Tube Box

Figure 10. Carbon-Lined Bag

Summary of test results:

The 3M event-detector results show that tube packing is not as effective as tray or reel packing.
The 37-V event detector tripped more times. The clear antistatic tubes performed significantly
better than the black, conductive tubes. However, the question is whether the units experience
more than the rated 500 V for live devices. The IEC results show that this is not the case. None
of the TSSOP units failed when exposed to 20 kV in any packing configuration. These tests
show that the low-cost packing method, when used in accordance with EIA-541 and EIA-625,
provides sufficient ESD protection.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 13

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5.4 Results of Unpackaged Live TSSOP Devices Using IEC Gun

Table 14. ESD Ground-Pin Test Results

IEC ESD Generator Units Failures
Voltage Setting
500 V 560-564 0/5
1000 V 565-569 1/5
2000 V 570-574 1/5
4000 V 575-579 5/5
6000 V 580-584 5/5
8000 V 585-589 5/5
10000 V 590-594 5/5
12000 V 595-599 5/5
14000 V 600-604 5/5
16000 V 605-609 5/5
18000 V 610-614 5/5
20000 V 615-619 5/5

Summary of test results:

The unpackaged test results show that live devices begin to fail when exposed to greater than
500 V. When the units are subjected to 4 kV, and greater, 100% of the sample size fails. The
failures are expected, since the die has a 500-V CDM rating. For the testing, the units were
placed in the test socket shown in Figure 11, with the ground pins wired together. The ground
pins were grounded and the IEC gun was discharged on the non-ground pins.

Figure 11. Test Socket for Live Die Testing

14 Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

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6 Conclusion
TI semiconductor packing methods protect standard die, which have minimum HBM and CDM
ratings for discharges up to 20 kV. Unpackaged semiconductor devices with standard die begin
to fail between 0.5 kV and 1 kV, as expected. A maximum discharge of 20 kV was used, as ESD
becomes worse at low humidity. Under certain conditions, 20 kV can be achieved via package
handling. The test results conclude that tray, tape-and-reel, and tube packing materials and
methods being used at TI are sufficient to prevent ESD damage when the packing medium is
handled in accordance with industry-standard guidelines (EIA 541/625).

7 Acknowledgments
The authors would like to thank Tom Diep, TI authority on ESD, for his guidance in setting up
and running the experiment and being the technical reviewer of this application report. Tom was
gracious enough to let us use his ESD laboratory to do the testing.

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 15

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