CircuitPro 1.

5
UseCases

Version 1.1

English

LPKF Laser & Electronics AG

Osteriede 7
D-30827 Garbsen

Phone +49 5131-7095-0

Fax +49 5131-7095-90
E-mail info@[Link]
Internet [Link]
CircuitPro 1.5

Editor LPKF Laser & Electronics AG

Osteriede 7
D-30827 Garbsen
Germany
Phone: +49 5131-7095-0
Fax: +49 5131-7095-90
Email: info@[Link]
Order no. 10011141

Filename CircuitPro1.5_HB_V1.1_ENG.docx
Version 1.1
Date created 31.05.2012
Date printed 31.05.2012

Copyright © 2012 LPKF AG

This document and its contents in whole and in part are subject
to copyright. The reproduction, translation or duplication of the
contents as photocopy or any digital form requires written
permission of LPKF AG.

2 © 2012 LPKF AG
 CircuitPro 1.5

Information about this document

General Notations

This document contains all information for Various text attributes, notations, and
assembly, putting into operation, operation, structures are used to enhance the readability
and maintenance or trouble-shooting of the of this document. The text attributes in this
system delivered. All information is intended document mean the following:
for persons with basic knowledge in
installation and operation of software-
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controlled machines. General knowledge on
operational safety as well as basic knowledge Bold Important information
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on using PCs running Microsoft Windows are Italics Brand name
required.
Bold italics LPKF brand name
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A complete and legible copy of this document
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must be available at the operation station.
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system must have read this document. The /…/ reference to a number in the
facility owner is required to ensure that all figure
safety measures listed in this document are
observed. Figures

Figures (photos or drawings) are displayed in

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title, e. g. "Fig. 1: Overview". Numbers in the
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Arrows in the figure show the direction of the
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Tables

Data, facts, and important contexts are clearly

arranged in tables. Each table has a
numbered table title, e. g. "Table 1: Scope of
delivery". Every table has a highlighted
header row containing the column headings.

© 2012 LPKF AG 3
CircuitPro 1.5

Information about this document

Operation descriptions Registered Trademarks and Brand names

Activities or procedures that are realised in The LPKF Logo and the LPKF product names
steps are presented in activity sequences. are registered trademarks of LPKF
Each sequence consists of at least three Laser & Electronics AG.
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the procedure marked by a
preceding “■“.
1. Step Consecutively numbered All other trademarks belong to the respective
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operation step. The procedure
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4 © 2012 LPKF AG
 CircuitPro 1.5 Table of contents

Table of contents

I First steps in CircuitPro

1 How to produce a PCB ...................................................................... 13

1.1 Switching on the machine and starting CircuitPro .................................................. 14

1.2 Selecting a template and creating a new document ............................................... 15
1.3 Importing files .......................................................................................................... 16
1.4 Inserting rubout areas ............................................................................................. 19
1.5 Multiplying the design if needed ............................................................................. 21
1.6 Inserting fiducials .................................................................................................... 23
1.7 Creating toolpaths ................................................................................................... 25
1.8 Loading the tool magazine and assigning the tools to positions ............................ 26
1.9 Starting processing ................................................................................................. 28
2 Dispensing solder paste using the ProtoMat S63 or S103 ............. 39

2.1 Starting the machine and CircuitPro ....................................................................... 40

2.2 Selecting a template and creating a new document ............................................... 41
2.3 Importing data ......................................................................................................... 42
2.4 Creating solder paste paths .................................................................................... 45
2.5 Creating toolpaths ................................................................................................... 47
2.6 Dispense preparation .............................................................................................. 49
2.7 Starting dispensing ................................................................................................. 55

II How to do
1 Creating a 3D part .............................................................................. 65

1.1 Starting the machine and CircuitPro ....................................................................... 66

1.2 Selecting a template and creating a new document ............................................... 67
1.3 Creating the layout .................................................................................................. 69
1.4 Creating 2.5D objects ............................................................................................. 73
1.5 Creating toolpaths ................................................................................................... 76
1.6 Loading the tool magazine and assigning tools to holder positions ....................... 78
1.7 Starting processing ................................................................................................. 81
2 Creating a 3D part from a STEP file ................................................. 89

2.1 Starting the machine and CircuitPro ....................................................................... 90

2.2 Selecting a template and creating a new document ............................................... 91
2.3 Importing data ......................................................................................................... 93
2.4 Creating 2.5D toolpaths .......................................................................................... 97
2.5 Inserting fiducials .................................................................................................... 99
2.6 Creating toolpaths for fiducials ............................................................................. 103
2.7 Loading the tool magazine and assigning tools to holder positions ..................... 106

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Table of contents CircuitPro 1.5

3 Creating a multi-layer PCB with galvanic through-hole plating .. 111

3.1 Starting the machine and CircuitPro ..................................................................... 112

3.2 Selecting a template and creating a new document ............................................. 113
3.3 Importing data ....................................................................................................... 115
3.4 Inserting rubout areas ........................................................................................... 117
3.5 Multiplying the design (if necessary) ..................................................................... 119
3.6 Creating toolpaths ................................................................................................. 121
3.7 Loading the tool magazine and assigning tools to holder positions ..................... 122
3.8 Starting the processing ......................................................................................... 124
4 Creating a front panel...................................................................... 137

4.1 Starting the machine and CircuitPro ..................................................................... 138

4.2 Selecting a template and creating a new document ............................................. 139
4.3 Creating the front panel design ............................................................................. 140
4.4 Creating toolpaths ................................................................................................. 153
4.5 Loading the tool magazine and assigning tools to holder positions ..................... 156
4.6 Start processing .................................................................................................... 158
5 Creating a polyimide stencil ........................................................... 165

5.1 Starting the machine and CircuitPro ..................................................................... 166

5.2 Selecting a template and creating a new document ............................................. 167
5.3 Importing data ....................................................................................................... 168
5.4 Processing data .................................................................................................... 170
5.5 Creating toolpaths ................................................................................................. 172
5.6 Loading the tool magazine and assigning tools to holder positions ..................... 176
5.7 Starting the processing ......................................................................................... 178
6 Creating a flexi-rigid PCB ............................................................... 187

6.1 Starting the machine and CircuitPro ..................................................................... 188

6.2 Selecting a template and creating a new document ............................................. 189
6.3 Importing data ....................................................................................................... 193
6.4 Processing the individual physical layers ............................................................. 198
6.4.1 Drilling and milling the flexible material ...................................................... 199
6.4.2 Processing the FR4 material ...................................................................... 209
6.4.3 Processing the prepreg material ................................................................ 219
6.5 Bonding the individual physical layers .................................................................. 233
6.6 Contour routing the bonded PCB.......................................................................... 234

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 CircuitPro 1.5 Table of contents

III Basics
1 CircuitPro: Basic CAM operations ................................................. 251

1.1 Executing Process planning wizard ...................................................................... 252

1.2 Importing the Gerber files ..................................................................................... 256
1.3 Importing the drill file ............................................................................................. 258
1.4 Inserting a rubout area (optional) .......................................................................... 261
1.5 Inserting fiducials (optional) .................................................................................. 263
1.6 Creating toolpaths ................................................................................................. 265
2 CircuitPro: Basic machining operations ....................................... 275

2.1 Switching to Machining view ................................................................................. 276

2.2 Loading the tool magazine .................................................................................... 277
2.3 Starting processing ............................................................................................... 280
3 Processing DXF files in CircuitPro................................................. 291

3.1 Importing the DXF file ........................................................................................... 292

3.2 Converting the DXF file ......................................................................................... 295
4 Processing Gerber and Excellon files ........................................... 303

4.1 Selecting Gerber and Excellon files ...................................................................... 304

4.2 Selecting the file format ........................................................................................ 307
4.3 Selecting the desired target layer ......................................................................... 308
4.4 Setting/correcting size and format ........................................................................ 309
4.5 Viewing/modifying aperture properties ................................................................. 312
4.6 Using the layer name defined in the Gerber file ................................................... 314
Appendix ................................................................................................... 317

© 2012 LPKF AG HB V1.1/Mai-12 7

First steps in
CircuitPro 1.5
How to produce a
PCB
 CircuitPro 1.5 How to produce a PCB
1

1 How to produce a PCB

This tutorial shows you how to produce a double-sided circuit board without
through plating.
The following steps are necessary to complete the tutorial successfully:
i. Switching on the machine and starting CircuitPro
ii. Selecting a template and creating a new document
iii. Importing data
iv. Inserting rubout areas
v. Multiplying the design if needed
vi. Setting fiducialsCreating toolpaths
vii. Loading the tool magazine and assigning the tools to positions
viii. Starting production

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 How to produce a PCB CircuitPro 1.5
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1.1 Switching on the machine and starting CircuitPro

 Switching on the machine and starting CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed.
Fig. 1:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to the reference points and stops at the Pause
position.

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 CircuitPro 1.5 How to produce a PCB
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1.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New…
➨ Following dialog is displayed:
Fig. 2: New
document

2. In order to produce a double-sided PCB without through-hole plating, select

the template “DoubleSided_NoTHP”.
3. Click on [OK].
4. Click on File > Save As…
5. Enter a file name.
6. Select the memory location.
7. Click on [Save].
➨ The file was saved.
 The template was selected and the new document was created.

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 How to produce a PCB CircuitPro 1.5
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1.3 Importing files

The LPKF tutor data are stored in “My Document\LPKF Laser &
Electronics\ LPKF CircuitPro 1.5\Example Data”.

Tip

 Importing data
1. Click on File > Import…
➨ Following dialog is displayed:
Fig. 3: Import

2. Select the following data:

• [Link]
• [Link]
• [Link]
• [Link]
• [Link]
• [Link]
• [Link]

3. Click on [Open].

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 CircuitPro 1.5 How to produce a PCB
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4. Assign the imported file to their corresponding layers according to the

following table:

File Layer

.BOA Board Outline

.BOT Bottom Layer

.TOP Top Layer

.DRL Drilling Unplated

Fig. 4: Assigned
layers

Instead of manually assigning the individual files to the layers,

you can activate the options “Use layer name” and “Apply to all
Note Gerber files”. Activate the corresponding checkboxes in the tab
“Options”.
If a file contains layer names these are automatically assigned.
Please note that this is only available for Gerber files. All other
files require assigning the layers manually via the drop-down
menu.

© 2012 LPKF AG HB V1.1/Mai-12 17

 How to produce a PCB CircuitPro 1.5
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5. Click on [OK].
➨ The data is displayed in the CAM view:
Fig. 5: CAM view

 The data is imported.

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 CircuitPro 1.5 How to produce a PCB
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1.4 Inserting rubout areas

Inserting rubout areas is used for creating a most precise isolation in certain
areas by removing all redundant copper. This is a preferred option for fine-pitch
arrays for example.
In the existing design, a rubout area around the terminals of the IC is needed.

 Inserting a rubout area.

1. Click on Insert > Rubout area > RuboutTop.
➨ Following dialog is displayed:
Fig. 6: Create
rectangle

2. Draw a rectangle around the contact pads of the IC using your mouse (see
arrow):
Fig. 7: Rectangle
around the pads

3. Click on [Close].
➨ The dialog is closed.
 The rubout area was inserted.

© 2012 LPKF AG HB V1.1/Mai-12 19

 How to produce a PCB CircuitPro 1.5
1

Depending on which layer the rubout area is to be created, it

can be useful to hide the other layers for drawing the rubout
Note area.
The display mode of the objects on the individual layers can be
set in the Layers pane. You can choose between
• True width (filled objects are displayed filled, polylines
are displayed with their true width)
• Outline (only outlines of the filled objects and polylines
are displayed)
• Thin line (outlines of filled objects and and thin line
without defined width in case of polylines are displayed)
and
• Unknown (used when importing CAM files with
undefined objects)

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 CircuitPro 1.5 How to produce a PCB
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1.5 Multiplying the design if needed

For producing whole panels, the design can easily be multiplied and placed on
the base material depending on the size of the design and of the base material.

 Multiplying the design

1. Select the whole design

Please make sure, that the layers’ option “selectable“ is enabled

if the layer contains data.
Note You will find the option in the “layers” pane.

2. Click on Modify > Step & Repeat.

➨ Following dialog is displayed:
Fig. 8: Step &
Repeat

3. Enter “2“, in the \ Repetition X\ field.

4. Enter “100“, in the \ Distance X \ field.

The “Distance” values reflect the size of the design. The value
for spacing between the designs has to be added.
Note

5. Click on [Apply].

© 2012 LPKF AG HB V1.1/Mai-12 21

 How to produce a PCB CircuitPro 1.5
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➨ The design is multiplied in X direction

Fig. 9: Layout in
CAM view

6. Click on [Close].
➨ The dialog is closed.
 The design was multiplied.

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 CircuitPro 1.5 How to produce a PCB
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1.6 Inserting fiducials

For aligning the top and bottom sides of the circuit board you need fiducials.
Fiducials are optical marks on the surface of the circuit board with a defined
diameter of 1.5 mm.
The fiducials are drilled into the board and are recognised by the cameras of the
ProtoMat systems.

For working with fiducials you need the camera system for
fiducial recognition.
Note

Ideally you insert four fiducials for aligning the top and the
bottom sides.
You are also able to work with two fiducials. In this case you
Tip have to insert them diagonally into the layout.

 Inserting fiducials
1. Click on Insert > Fiducial > Fiducial.
➨ Following dialog is displayed:
Fig. 10:Create
circle

2. Left click in the CAM view where you want to place each fiducial hole.
Or
2. Create the fiducial using the dialog “Create circle” and entering the X and Y
position of each fiducial.
➨ The design now looks like follows:

© 2012 LPKF AG HB V1.1/Mai-12 23

 How to produce a PCB CircuitPro 1.5
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Fig. 11:Two
fiducials

3. Click on [Close].
➨ The dialog is closed.
 The fiducials were inserted.
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 CircuitPro 1.5 How to produce a PCB
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1.7 Creating toolpaths

Toolpaths have to be created from the imported data, for producing the circuit
board.

 Creating toolpaths
1. Click on Toolpath > Technology Dialog...
➨ Following dialog is displayed:
Fig. 12:
Technology
Dialog

In the technology dialog, several settings can be modified by

clicking on the [Show details] buttons. For a detailed
Note description of the individual functions of the technology dialog
see the corresponding chapter in the CircuitPro compendium.

2. Click on the right-pointing arrow button in the “Isolation” section until the
“Partial rubout” method is selected.
3. Disable the following functions by clicking on the corresponding
checkmarks:
• Drills
• Pockets
4. Click on [Start].
➨ The results for the generated toolpaths are displayed.
5. Click on [Close].
➨ The dialog with the computation results is closed.
 The toolpaths were created.
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 How to produce a PCB CircuitPro 1.5
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1.8 Loading the tool magazine and assigning the tools to positions
 Loading the tool magazine and assigning the tools to positions
1. Click on Edit > Tool magazine...
➨ Following dialog is displayed:
Fig. 13: Tool
magazine

➨ The required tools for the job are displayed. Missing tools which are
required for the job are marked with a red “X”.
2. Insert the required tool into the tool magazine:
Fig. 14: Inserting
the tool

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 CircuitPro 1.5 How to produce a PCB
1

3. In the dialog, assign the tool to the respective tool magazine position used.
4. Repeat the steps 2 and 3 until all required tools are assigned:
Fig. 15: Tools in
the tool magazine

5. Click on [OK].
➨ The dialog is closed.
 The tools were loaded and assigned to their positions.
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 How to produce a PCB CircuitPro 1.5
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1.9 Starting processing

 Starting processing
1. Click on Machining > Process all.
Fig. 16:
Machining >
Process all

Make sure that <Process

All> is selected in the combo
Note box, so that all phases are
executed.
Instead of processing all phases automatically, you can
process the phases individually. In the combo box select the
desired phase and click on the “Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

After the production started, the machine will process following phases in order.
The phases are displayed via prompts.

Depending on which ProtoMat you use the following phases

could differ from the phases and messages displayed on your
Note screen. Please follow the instructions on your screen.
For machines with manual tool exchange you are regularly
asked to change the tool in the collet, for example.

Phase “MountMaterial”
1. Place the base material onto the machine’s table top.
2. Fasten the base material onto the table top using the adhesive tape.

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 CircuitPro 1.5 How to produce a PCB
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Phase “MaterialSettings”
➨ Following dialog is displayed:
Fig. 17: Material
settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Change the values of copper thickness and material thickness necessary.

3. Define the processing area:
a) Move the dialog „Material Settings“ off to the side.
b) Using your mouse in the machining view, click on the right corner of
your material:

© 2012 LPKF AG HB V1.1/Mai-12 29

 How to produce a PCB CircuitPro 1.5
1

Fig. 18: Right

corner

/1/ Click in the machining view /2/ Material

➨ The machine head moves to this position.

c) Now click on the corresponding button in the dialog “Material Settings“:
Fig. 19: Click on
button

➨ The processing area is adapted.

d) Using your mouse in the machining view, click on the left corner of your
material:

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 CircuitPro 1.5 How to produce a PCB
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Fig. 20: Left

corner

➨ The machine head moves to this position.

e) Now click on the corresponding button in the dialog “Material Settings“:
Fig. 21: Defined
processing area

/1/ Defined processing area

➨ The processing area was adapted to the material.

4. Click on [Continue].
 The material settings were entered.

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 How to produce a PCB CircuitPro 1.5
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Phase “Placement”
In this phase, the job can be positioned, rotated and multiplied within the
processing area.
➨ Following dialog is displayed:
Fig. 22:
Placement

1. Drag the job to the desired position or use the dialog to position the job.
2. If desired, rotate the job by entering a rotation angle.
3. If desired, multiply the job by using the settings in the “Step and Repeat”
section of the dialog.
4. Click on [Continue].

Phase “DrillFiducial”
➨ The machine picks up the tool “Spiral Drill 1.5 mm” and drills the fiducials.

If the spindle motor has not been used before, the motor is
warmed up for 2 minutes.
Note

Phase “Marking Drills”

➨ The machine picks up the tool “Universal Cutter” and marks the positions
for the drill holes.

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 CircuitPro 1.5 How to produce a PCB
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Phase “Drilling Unplated”

➨ The machine picks up the required tool and drills the holes.

This phase may use more than one tool.

Note

Phase “Milling Bottom”

➨ The machine picks up the required tool and mills the isolation tracks.

Phase “Flip Material”

1. Flip the material.

If you are using a ProtoMat S43, S63 or S103 flip the material
along the machine’s X-axis.
Note If you are using a ProtoMat E33 flip the material along the
machine’s Y-axis.

2. Confirm by clicking [OK].

The display in the machining view changes. The position of the

design is adjusted to the circuit board. The side of the circuit
Note board to be processed is now the “Top” side.

Phase “Read Fiducials_Top”

S43, S63 and S103

If the fiducial search is performed for the first time (after having
started CircuitPro) the camera is performing an autofocus five
Note times.
Afterwards the following message is displayed which prompts
you to confirm the focus height:

➨ The camera moves to the positions of the fiducials and determines the
exact position.
If the material is placed at nearly the same position as before, the positions of
the fiducials are recognised automatically.

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 How to produce a PCB CircuitPro 1.5
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The Top side is thus aligned to the Bottom side.

The following dialog is displayed if the fiducials have not been recognized
automatically:
Fig. 23:
Alignment

1. Enlarge the search area by increasing the value of the field \Search Area
Length\.
2. Start the search again.
3. Repeat above steps if necessary.

Enlarging the search spiral increases the time required for

searching the fiducials. Try to put the material at the same
Note position as before when turning the material over (if this is not
predetermined by reference pins).

E33, S43 without camera

If no camera is available for processing the “Read Fiducials_Top” phase, the
Top side is aligned to the Bottom side using the reference pins. The “Read
Fiducials_Top” phase is not processed in this case.

Phase “Milling Top”

➨ The machine picks up the required tools and mills the isolation tracks on the
Top side.

Phase “Contour Routing”

➨ The machine picks up the required tools and drills and mills the outline of
the circuit board.

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 CircuitPro 1.5 How to produce a PCB
1

Phase “Board Production Finished”

➨ A message informs you that the production is finished.
 The production of the circuit board is finished.

If desired, continue with dispensing solder paste on your PCB.

Therefore please refer to the tutorial “Dispensing solder paste
Note using the ProtoMat S63 or S103”.

After PCB production you can carry on with inserting labeling or

applying solder resist. For these cases you can purchase the
LPKF systems ProMask and ProLegend. Furthermore LPKF
Tip offer systems for applying solder paste, equip and solder PCBs.

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 How to produce a PCB CircuitPro 1.5
1

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 Dispensing solder
paste using a
ProtoMat S63 or S103
 Dispensing solder paste using
CircuitPro 1.5 2
the ProtoMat S63 or S103

2 Dispensing solder paste using the ProtoMat S63 or

S103
This tutorial shows you how to dispense solder paste on your board with
CircuitPro.
The following steps are necessary to complete the tutorial successfully:
i. Starting the machine and CircuitPro
ii. Importing data
iii. Creating solder paste paths
iv. Dispense preparation
v. Starting dispensing

Before you start dispensing, your PCB board’s drilling and

milling must be finished (for more information about milling and
Note drilling, see the other tutorials in this document).

This tutorial is based on the tutorial “How to produce a PCB”.

Note

Requirements:
• Dispenser head
• Red plastic needle
• Solder paste (at room temperature)
• Calipers (capable of measuring in millimeters)
• Completed PCB
• Gerber Files (Solder Paste and Drill Layers)
• Compressed Air (@45 psi or 3 bar)

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

2.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 24:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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 Dispensing solder paste using
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2.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New…
➨ Following dialog is displayed:
Fig. 25: New
document

2. Select the template “DoubleSided_NoTHP”.

3. Click on [OK].
4. Click on File > Save As…
5. Enter a file name.
6. Select the memory location.
7. Click on [Save].
➨ The file was saved.
 The template was selected and the new document was created.
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 Dispensing solder paste
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2.3 Importing data

The LPKF tutor data are stored in folder “My documents\LPKF

Laser & Electronics\LPKF CircuitPro 1.5\Example Data”.

Tip

Before you start dispensing, your PCB board’s drilling and

milling must be finished.
Note

In this case, the PCB created in the tutorial “How to produce a

double-sided PCB” is necessary to dispense solder paste on it.
Note You can use another file as well if it includes solder paste data.

 Importing data
1. Click on File > Import…
➨ The following dialog is displayed:
Fig. 26: Import

2. Select following files in the folder “UseCase_Dispensing”:

• [Link] (contains the data for dispensing)
• [Link] (contains the drill data)
• [Link]

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 Dispensing solder paste using
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the ProtoMat S63 or S103

To display the Exellon file “[Link]“ correctly, the external

dimensions of the PCB must be available. Therefore you have to
Note import the file “[Link]“.

3. Click on [Open].
➨ The files are shown in the table:
Fig. 27: Assign
layer

4. Assign the imported files to the corresponding layers according to the

following table:

File Layer

.SPT Solder Paste Top

.DRD Drilling Unplated

.BOA Board Outline

Instead of manually assigning the individual files to the layers,

you can activate the options “Use layer name” and “Apply to all
Note Gerber files”. Activate this corresponding checkboxes in the tab
“Options”.
If a file contains layer names these are automatically assigned.
Please note that this is only available for Gerber files. All other
files require assigning the layers manually via the drop-down
menu.

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

For dispensing you only need the layers “SolderPasteTop” to

dispense solder paste and “DrillingUnplated” to recognise the
position.
Tip The data on the other layers may help you to determine the
side/alignment of the circuit board.

5. Click on [OK].
➨ The data are displayed in the CAM view.
 The data are imported.

In the “Layers” pane you can hide the other layers for a clear
display.
Therefore you remove the checkmark in the column “visible” of
Tip the according layer.

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 Dispensing solder paste using
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2.4 Creating solder paste paths

 Creating solder paste paths
1. Click on Toolpath > Dispense.
➨ Following dialog is displayed:
Fig. 28: Dispense

The dialog “Dispense” allows you to make different settings

concerning solder paste paths. For a detailed description, see
Note the corresponding chapter in den CircuitPro compendium.

2. Enable the desired dispenser tool you want to use by marking the
corresponding checkbox.
The following table describes the properties of the dispense tools:
Column Description
Enabled Enables/Disables the corresponding tool via
checkmark.
Minimale size [µm] Specifies the minimum pad size of the pad to
be filled.
Dot distance [µm] Specifies the dot in µm distance between the
single solder paste dots.
Grid angle [*] Specifies the rotation of the solder dot grid on
the pad.
Margin [µm] Specifies the minimum margin in [µm] between
the solder paste dots and the pad margin.
Tool Specifies the corresponding dispense tool.

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

3. Click on [Apply].
➨ The solder paste paths are shown in the machining view:
Fig. 29:
Machining view
with solder paste
paths

 The solder paste paths were created.

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 Dispensing solder paste using
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2.5 Creating toolpaths

Before you start dispensing, you have to create the toolpaths for
the drill data. The drill holes are necessary to align the structured
Note and drilled PCB.

 Creating toolpaths
1. Click on Toolpath > Technology Dialog...
➨ Following dialog is displayed:
Fig. 30:
Technology
Dialog

In the technology dialog, several settings can be modified by

clicking on the [Show details] buttons. For a detailed
Note description of the individual functions of the technology dialog
see the corresponding chapter in the CircuitPro compendium.

2. Disable the following functions by clicking on the corresponding

checkmarks:
• Insulate
• Contour Routing
• Fiducials
• Pockets

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

3. Click on [Start].
➨ The results for the generated toolpaths are displayed.
4. Click on [Close].
➨ The dialog with the computation results is closed.
 The toolpaths were created.
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 Dispensing solder paste using
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2.6 Dispense preparation

In this chapter you will learn how to set the dispenser offset by using the
“Dispense preparation wizard”.
You will pass through following steps:
i. Mounting the material
ii. Setting the material height
iii. Cleaning the dispenser needle
iv. Calculating the dispenser offset

1. Click on Wizards > Dispense preparation wizard:

Fig. 31: Wizards >
Dispense prepa-
ration wizard

➨ The following dialog is displayed:

Fig. 32: Prepare
dispenser

If there is a tool in the clamp, it will be placed back into the tool
holder.
Note

2. Prepare the solder paste as described in the wizard.

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

3. Assemble the dispenser as described in the wizard:

Fig. 33:
Assembling the
dispenser

4. Click on [Next].

 Mounting the auxiliary board

1. Use a scrap piece of copper material that is at least 50 x 50 millimeters.
2. Measure the overall thickness with a set of calipers and note this number.
3. Enter the thickness of the material in the thickness field:
Fig. 34: Enter the
thickness

4. Click on [Next].
5. Close the machine cover.
6. Click on [Next], to start the positioning procedure.
 The auxiliary board was mounted.

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 Dispensing solder paste using
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the ProtoMat S63 or S103

 Setting the material height

1. Move the wizard screen off to the side.
2. Move the dispenser head to the center of your scrap piece by clicking on
the working area with your mouse until the dispense needle is centered on
the material:
Fig. 35: Position
of auxiliary board

The machine will now search for the focus height of the material.
It will repeat this 5 times, in a dice pattern.
Note

3. Follow the instructions displayed in the wizard:

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

Fig. 36: Head

touching the
paper

4. Take off the sheet of paper.

5. Click on [Next].
 The material height was set.

 Cleaning the dispenser needle (or prepare needle)

1. Click on the dispense icon in the wizard:
Fig. 37: Dispense
icon

2. Repeat step 1 until a single stream of paste comes out of the needle.
3. Clean off any paste that has been dispensed.
4. Click on [Next].
 The dispenser needle was cleaned.

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 Dispensing solder paste using
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the ProtoMat S63 or S103

 Calculating the dispenser offset

In this step, the machine is calculating the dispenser offset:
Fig. 38: Camera
offset

1. Click on [Next.
➨ The machine will dispense 5 dots. Dot number 5 will be slightly offset from
the first four. Then the camera will move over the dots and will zoom in.

Make sure, that the camera zooms in the last of the five
dispensed dots!
Note Otherwise the offset is not calculated correctly.

➨ The following dialog is displayed:

Fig. 39:
Alignment

Read in the dot manually if centering failed

1. If the camera did not find the last dot, move the camera head
manually to the position of the dot by using the X-/Y-arrow-icons

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

Note in the pane „Processing“.

2. If the dot is displayed centered in the pane “Camera“ click on
[Find and Center] in the dialog “Alignment”.
 The camera zooms in the dot.

2. Click on [Accept Current Position].

➨ The view changes as follows:
Fig. 40: Dispense
preparation
finished

3. Click on [Done].
 The dispenser offset was calculated.

The dispense preparation is finished now.

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 Dispensing solder paste using
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the ProtoMat S63 or S103

2.7 Starting dispensing

In this chapter you will learn how to dispense the solder paste by using the
“Dispense process wizard”.
You have to perform following steps:
i. Mounting the circuit board
ii. Setting the fiducials (existing holes on the board)
iii. Cleaning the needle
iv. Dispensing the solder paste

1. Click on Wizards > Dispense process wizard…

Fig. 41: Wizards >
Dispense process
wizard

➨ The following dialog is displayed:

Fig. 42: Mount
board

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

 Mounting the circuit board

1. Measure the thickness of your current board with a set of calipers and note
this number.
2. Mount the material onto the machine with the top side of the board of the
board facing up.
3. Fasten the circuit board with adhesive tape.
4. Enter the board thickness into the thickness field:
Fig. 43: Enter the
thickness

5. Click on [Next].
 The circuit board was mounted.

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 Dispensing solder paste using
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the ProtoMat S63 or S103

 Reading in the drill holes

In this step two existing drill holes will be read in to align the circuit board.

If the fiducial search is performed for the first time (after having
started CircuitPro) the camera is performing an autofocus five
Note times.
Afterwards the following message is displayed which prompts
you to confirm the focus height:

1. Follow the instructions displayed in the wizard:

Fig. 44: Select
drill hole

2. Click on [Next].
➨ Following message is displayed:
Fig. 45: Message
“Select drill hole”

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 Dispensing solder paste
2 using the ProtoMat S63 or CircuitPro 1.5
S103

3. Left click on one of the drill holes near a corner of the board.
➨ The camera moves to the drill hole and reads in the position.
➨ The “Alignment” dialog is displayed:
Fig. 46:
Alignment

Read in the drill hole manually if centering failed

1. If the camera did not find the drill hole, move the camera head
Note manually to the position of the drill hole by using the X-/Y-arrow-icons in
the pane „Processing“.
2. If the drill hole is displayed centered in the pane “Camera“ click on
[Find and Center] in the dialog “Alignment”.
 The camera zooms in the drill hole

4. Click on [Accept Current Position].

5. Repeat the steps 1-3 for the second drill hole in the opposite corner.
 The drill holes for aligning the circuit board have been read in.

In the next step the machine will find the focus height on the material, similar to
what it did during the “dispenser offset” step. Afterwards the wizard continues
with step “Dispenser cleaning”.

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 Dispensing solder paste using
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 Cleaning the needle

1. Click on the dispense icon in the wizard screen:
Fig. 47: Dispense
icon

2. Repeat step 1 until a single stream of paste comes out of the needle.
3. Clean off any paste that has been dispensed.
4. Click on [Next].

 The dispenser needle was cleaned.

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S103

 Dispensing solder paste

The machine will now dispense solder paste on your pads.

Note

1. When dispensing is completed, you can decide if you want to apply solder
paste to second board. In this case, click on [Next board]:
Fig. 48: Process
dispensing

2. After all boards are complete, click on [Finish].

3. Remove the paste dispenser from the machine.
 The solder paste was dispensed.

Close the solder paste cartridge by using the cap. Then store the
cartridge in the refrigerator.
Note

For further process steps we recommend the systems LPKF

ProtoPlace for placing components and LPKF ProtoFlow for
lead-free soldering.
Tip

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How to do
Creating a 3D part
 CircuitPro 1.5 Creating a 3D part
1

1 Creating a 3D part
In this section you will learn how to create a 3D part of 5 mm-thick aluminum in
CircuitPro. Pockets are placed on the top side. Furthermore there will be
defined drill holes.

To create a 3D part you need a ProtoMat S63 or S103!

Note

This exercise is based on a base material with the dimensions

100 mm x 100 mm x 5 mm.
Note You are able to use other base materials, too. Make sure that
the dimensions of the used material has at least the dimensions
100 mm x 100 mm and a thickness of 5 mm +/- 1 mm.

Therefore you have to perform following steps:

i. Starting the machine and CircuitPro
ii. Selecting the template and creating the new document
iii. Creating the layout
iv. Creating 2.5D objects
v. Creating toolpaths
vi. Loading the tool magazine and assigning tools to holder positions
vii. Start processing

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 Creating a 3D part CircuitPro 1.5
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1.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 49:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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 CircuitPro 1.5 Creating a 3D part
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1.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New…
➨ The following dialog is displayed:
Fig. 50: New
document

2. Select the template “25D_Top.cbf”.

3. Click on [OK].
➨ The following dialog is displayed:
Fig. 51: Material
properties

4. In the \Type\ field, select the material type “AL (EN AW-6012)” or “AL (EN
AW-5083). In this case these are two different aluminum alloys.
5. Enter the dimensions of your material in the fields \Width\, \Length\ and
\Height\.
6. Click on [OK].
➨ The CAM view is changing:

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 Creating a 3D part CircuitPro 1.5
1

Fig. 52: CAM view

7. Click on File > Save As…

8. Enter a file name for the new file.
9. Click on [Save].

 The new document is created.

You are able to change the material properties such as the

dimensions of the base material. Therefore you have to right-
Note click in the CAM view and click in the context menu on “Material
properties…”.

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 CircuitPro 1.5 Creating a 3D part
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1.3 Creating the layout

In this section you will perform following steps:
i. Creating rectangles for the pockets
ii. Creating circles for drill holes
iii. Multiplying the circle

 Creating rectangles for the pocket

1. Click on Insert > Rectangle…
➨ The following dialog is displayed:
Fig. 53: Create
rectangle

2. Select the layer to create the rectangle on, e.g. “2.5D MillingTop”.
3. Select the option “Absolute” (start and end points are entered from the zero
point).
4. Enter “50” in the fields \Start point X\ and \Start point Y\.
5. Enter “80” in the fields \End point X\ and \End point Y\.
6. Click on [Apply].
➨ The drawn rectangle is shown in the CAM view
Fig. 54: Rectangle
in CAM view

7. For creating another rectangle, enter the following values in the

corresponding fields:
• Start point X: 30
• Start point Y: 30
• Endpoint X: 60
• Endpoint Y: 60

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 Creating a 3D part CircuitPro 1.5
1

8. Click on [Apply].
➨ The second rectangle is shown in the CAM view:
Fig. 55: Second
rectangle

9. Click on [Close].
 The rectangles for the pockets are created.

 Creating circles for drill holes

1. Click on Insert > Circle.
➨ The following dialog is shown
Fig. 56: Create
circle

2. Select the layer „2.5D DrillingTop“ to create your circle.

3. Select the option “Absolute“ (the circle’s center is entered from the zero
point)
4. Enter “15” in the fields \Center X\ and \Center Y\.
5. Enter “2” in the field \Ø\.

If you do not have a Spiral Drill 2 mm, you can enter the
corresponding diameter of our drill tool used.
Note Therefore enter the diameter of your drill tool in the field \Ø\.

6. Click on [Apply].
➨ The circle is shown in the CAM view:

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 CircuitPro 1.5 Creating a 3D part
1

Fig. 57: Circle in

CAM view

7. Click on [Close].
➨ The dialog is closed.
 The circle was created.

 Multiplying the circle

1. Highlight the created circle in the CAM view.
➨ The circle is highlighted in grey.
2. Press your right mouse button.
➨ The context menu is shown.
3. Click on “Step and Repeat…”.

You can also click on Modify > Step and Repeat…

Tip

➨ The following dialog is shown:

Fig. 58: Step
Repeat

4. Enter “5“ in the field \Repetition X\.

5. Enter “5“ in the field \Distance X\.

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 Creating a 3D part CircuitPro 1.5
1

The dimension of the selected object is automatically displayed

in the fields \Distance X\ and \Distance Y\.
Note The desired distance between the objects must be added to this
value.

6. Click on [Apply].
➨ The drawn circle is multiplied in X direction.
Fig. 59:
Multiplying the
circle in X
direction

7. Click on [Close].
➨ The dialog is closed.
 The drawn circle was multiplied.

Assign layer
The layer which contain the drawn objects can be changed
Note manually, if necessary.
1. Highlight the objects.
2. Press your right mouse button.
3. Click in the context menu on “Assign objects to layer”.
 The layer’s list is shown.
4. Click on the desired layer on which you want to place the
objects.
 The objects were moved to the desired layer.

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1

1.4 Creating 2.5D objects

The opened file only contains 2D objects yet.
The drawn 2D objects on the layers “Milling Top” and “Drilling Top” must be
converted to 2.5D objects with a defined depth.

 Creating 2.5D objects

1. Select all objects in the CAM view:
Fig. 60: Select all
objects

2. Press your right mouse button.

➨ The context menu is displayed.
Fig. 61: Context
menu

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 Creating a 3D part CircuitPro 1.5
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3. Click on “Convert to 2.5D…”.

➨ The following dialog is displayed:
Fig. 62: Convert
into 2.5D

The value in field \Destination layer\ is preselected with “Same

as source layer”. The objects will be converted into 2.5D
Note objects and remain on their origin layer.

4. Enter “3“ in field \Z value\.

5. Click on [Convert].
➨ The selected objects were converted to 2.5D objects. You can regard the
object’s properties by highlighting them and clicking in the pane
„Properties“:
Fig. 63:
Properties of the
2.5D object

6. Click on [Close].
➨ The dialog is closed.
 The objects were converted in 2.5D objects.

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Changing the object’s Z value

You are able to change the object’s Z value afterwards:
Note 1. Highlight the desired object.
2. Press your right mouse button.
 The context menu is shown.
3. Click on “Change Z value…“.
 The dialog „Change Z value“ is shown.
4. Enter a new value in the field \New Z value\.
5. Click on [Apply].
 The Z value was changed.
6. Click on [Close].
 The dialog is closed.

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1.5 Creating toolpaths

Before the machine can process the material, the 2.5D toolpaths have to be
created.
 Creating 2.5D toolpaths
7. Click on Toolpath > 2.5D milling…
➨ The following dialog is displayed:
Fig. 64: Create
2.5D milling

8. Activate the 3D object by checkmark in field \Source\.

9. Activate the needed tools for the job by checkmark.

Make sure, that you activate the drill tools with the appropriate
diameter corresponding to the size of your drill holes. For
Note example the Spiral Drill 1 mm if you want to create drill holes
with a diameter of 1 mm.
For the milling of the pockets you need End Mill tools. Activate
the available tools in the list.
You also need drill tools for generating start drills if you have not
disabled this option. If the pocket should be milled with an End
Mill 2 mm, you need to create the start drills with a Spiral Drill
2 mm.

10. Click on [OK] to create the toolpaths.

➨ The CAM view changes as follows:

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Fig. 65: CAM view

11. Click on the tab “3D view”.

If the tab „3D view“ is not displayed, you can activate it by

clicking on the menu item View > 3D Wiew.
Note

➨ The 3D tab displays the 3D part:

Fig. 66: 3D view

You can rotate the object in the 3D view by

activating this icon in the toolbar.

Tip

 The 2.5D toolpaths were created.

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1.6 Loading the tool magazine and assigning tools to holder positions

 Loading the tool magazine and assigning the tools to holder positions
1. Click on Edit > Tool magazine…
➨ The following dialog is displayed:
Fig. 67: Tool
magazine

➨ The tools required for the job are displayed in section “Required tools”.
Tools that are missing in the tool magazine are marked by a red “X”.
Required tools which are already inserted in the tool magazine are marked
by a green checkmark.
2. Insert the required tools into the tool magazine:
Fig. 68: Inserting
the tool

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3. In the dialog, assign the tools to the respective tool magazine positions
used.
Fig. 69:
Assigning the
tools in the dialog

➨ The tools which are displayed in the section “Required tools” are marked
with a green checkmark:
Fig. 70: Assigned
tools

4. Make sure that the tool life spent is sufficient for the current job to be
processed.

If there is a red „X“ displayed beside the progress bar “Tool life
spent” the endurance of the tool is insufficient for the job to be
Note processed:

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5. If necessary, insert additional tools in the tool magazine to reach the

required tool endurance:
Fig. 71:
Assigning
additional tools

6. Click on [OK].
➨ The dialog is closed.
The tools are assigned to the corresponding tool holders:
Fig. 72: Tools in
the tool magazine

 The tools were loaded.

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1.7 Starting processing

 Starting processing
1. Click on Machining > Process all.
Fig. 73:
Machining >
Process all

Make sure that <Process All>

is selected in the combo box
Note of the pane “Processing”, so
that all phases of the job are
executed. The phases
included in the current job are displayed in the section
“Phases” of the pane “Toolpath”.
Instead of processing all phases automatically, you can
process the phases individually. In the combo box select the
desired phase and click on the “Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

After the production started, the machine will process following phases in order.
The phases are displayed via prompts.

Phase “Mount Material”

1. Mount the material onto the processing area.
2. Fasten the material to the table using double-sided adhesive tape.
3. Click on [OK].

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Phase “Placement Top”

➨ The following dialog is displayed:

Fig. 74: Material
placement

 Defining the material corners

1. Move the camera head to the left corner of your base material:
a) Click on the “Processing“ pane.
b) Use the arrow buttons in the X/Y section to move the camera head.
Fig. 75: Pane
„Processing“

The camera head is activated automatically. You are able to tell

this by the green frame around the camera symbol in section
Note “Select a head” of the “Processing” pane:

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 CircuitPro 1.5 Creating a 3D part
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You are able to click on the corner of your material in the

machining view. The camera moves automatically to this point.
Use the X/Y arrow buttons to do the fine adjustment.
Tip

2. Use the auto focus function to align the material corners in the pane
“Camera”.
a) Click on [Autofocus] in the “Processing” pane:
Fig. 76:
Autofocus

3. Move the camera head, so that the left lower corner of your material is
positioned right in the cross hair:
Fig. 77: Cross
hair of camera

If the cross hair is not displayed, you are able to activate it by

clicking on Camera > Overlay > Switch Crosshair State
Note

4. Click on following icon in the dialog “Material Placement“:

➨ The coordinates for the lower left corner were saved.

➨ Following message is displayed:

Fig. 78: Message
for second
position

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5. Confirm the message by clicking on [Yes].

➨ The camera moves automatically to the opposite corner of your material.
6. Place the cross hair right on the top of your material corner by using the X/Y
arrow buttons.
7. Click on following icon in the dialog “Material Placement“:
➨ The coordinates for the upper right corner were saved.
 The coordinates of the material corners were defined.

 Defining the material surface level

To define the material surface level the camera’s Z offset must

be determined first. If it is not already determined you are able to
Note start this procedure in the dialog “Material placement” by clicking
on the following icon:

For more information about teaching the Z focus offset please

refer to the CircuitPro compendium.

After defining the coordinates of the material corners the following message is
displayed:
Fig. 79: Move to
measuring
position

1. Confirm the message by clicking on [Yes].

➨ The camera moves to the center of the material area and then performs an
autofocus to determine the material height.
2. Check if the autofocus has been performed successfully and if the focused
material surface is visible in the pane “Camera”.

If the autofocus has not been performed successfully, perform it

again by clicking on [Autofocus] in the pane “Processing”.
Note

3. Now click on the following icon for determining the

material height:

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➨ The material height is saved:

Fig. 80: Material
surface level
defined

4. Click on [Continue].
 The material surface level was defined.

• If there is no depth limiter mounted, the phase “Processing 2.5D Top” is

processed.
• If there is a depth limiter mounted, the following message is displayed that
prompts you to dismount it:
Fig. 81: Dismount
the depth limiter

1. Confirm the message by clicking on [OK] and follow the instructions to

dismount the depth limiter.

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 Dismounting the pneumatic depth limiter (S103)

1. Pull down the depth limiter:
Fig. 82:
Pneumatic Depth
limiter

/1/ Pneumatic depth limiter

2. Fasten the depth limiter above the machine head in the hose clamp:
Fig. 83: Fasten
depth limiter

/1/ Pneumatic depth limiter /2/ Hose clamp

 The pneumatic depth limiter was dismounted.

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 Dismounting the mechanical depth limiter (S63)

1. Pull down the mechanical depth limiter:
Fig. 84:
Mechanical depth
limiter

/1/ Mechanical depth limiter

2. Put the mechanical depth limiter close to the machine in order to mount it
again later.
 The mechanical depth limiter was dismounted.

Phase „Processing 2.5D Top ”

If the spindle motor has not run before, a warm-up phase is

started.
Note

➨ The required tools were picked up and the top side of the material is
processed.

Phase „Board Production Finished”

➨ A message informs you that the board production has been finished.
 The 3D part was created.

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Creating a 3D part from
a STEP file
 Creating a 3D part from a
CircuitPro 1.5 2
STEP file

2 Creating a 3D part from a STEP file

In this section you will learn how to create a 3D part from a STEP file. The 3D
part is created from a work piece with the dimensions 28 mm x 18 mm x 6 mm
and the used material is POM. Different slots and drill holes are placed on the
top and bottom side.

To create a 3D part you need a ProtoMat S63 or S103!,

Note

For this tutorial you need a base material with the dimensions
28 mm x 18 mm x 6 mm. You are able to work with other base
Note materials. In this case make sure that your material has at
least the dimensions 28 mm x 18 mm x 6 mm and a thickness
of 6 mm.

To create the 3D part you have to perform the following steps:

i. Starting the machine and CircuitPro
ii. Selecting the template and creating the new document
iii. Importing the data
iv. Creating 2.5D toolpaths
v. Inserting fiducials
vi. Creating toolpaths for the fiducials
vii. Loading the tool magazine and assigning tools to holder positions
viii. Start processing

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2.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 85:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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2.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New…
➨ The following dialog is displayed:
Fig. 86: New
document

2. Select the template “25D_Double.cbf”.

3. Click on [OK].
➨ The following dialog is displayed:
Fig. 87: Material
properties

4. Enter the material type (POM).

5. Adjust the values in the fields \Width\ and \Length\ according to your base
material used.
6. Enter “6 mm” in the field \Height\.
7. Click on [OK].

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➨ The CAM view is changing:

Fig. 88: CAM view

8. Click on File > Save As…

9. Enter a file name for the new file.
10. Click on [Save].

 The new document is created.

You are able to change the material properties such as the

dimensions of the base material. Therefore you have to right-
Note click in the CAM view and click in the context menu on “Material
properties…”.

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2.3 Importing data

The LPKF tutor data is stored in “My Document\LPKF

Laser&Electronics\LPKF CircuitPro 1.5\Example Data\
UseCase_3DPartFromSTEP”.
Tip

First the STEP file is imported in CircuitPro. Afterwards the imported data will be
aligned to the processing volume.
 Importing data
1. Click on File > Import 3D shape...
➨ The following dialog is displayed:
Fig. 89: Importing
the STEP file

2. In the folder “UseCase_3DPartFromSTEP“, select the file

“Tutor_STEP.stp”.
3. Click on [OK].

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➨ The 3D view changes as follows:

Fig. 90: 3D view

 The data was imported.

 Aligning the imported data to the processing volume

1. In the 3D view, right-click on the imported object.
➨ The context menu is shown.

2. In the context menu, click on “Transformation“.

➨ The following dialog is displayed:
Fig. 91: Trans-
formation

3. Click on “Rotate [auto]”.

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STEP file

➨ The view changes as follows:

Fig. 92: Rotate
[auto]

4. Enter “90” in the field \Angle\.

5. Activate the standard axis “Z”.
6. Click on [Apply].
➨ The object is rotated around the Z axis at an angle of 90°. The 3D view
changes as follows:
Fig. 93: 3D view
rotatet around Z
axis

7. Click on the tab “Translate”.

8. Activate the option {Move to center of processing volume}.
9. Click on [Apply].
➨ The object is moved in X and Y direction to the center of the processing
volume. The 3D view changes as follows:

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Fig. 94: Move in X

and Y direction

10. In the tab “Translate”, activate the option {Move to coordinates}.

11. Enter “3” in the field \Z\.
12. Click on [Apply].
➨ The object is moved in Z direction. The 3D view changes as follows:
Fig. 95: Move
object in Z
direction

13. Click on [Close].

➨ The dialog is closed.
 The imported data was aligned to the processing volume.
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2.4 Creating 2.5D toolpaths

Before you insert the fiducials in your layout it is useful to create the 2.5D
toolpaths first.
 Creating 2.5D toolpaths
1. Click on Toolpath > 2.5D milling…
➨ The following dialog is displayed:
Fig. 96: Create
2.5D milling

2. In section \Source\, select the source data “Tutor_STEP_1” for creating the
toolpath.
3. Select the tools that are available for the current job.

For creating uncontinuous drill holes you need an End Mill

0.8 mm. All other structures can be created with the End Mill
Note 1 mm or 2 mm.
Also make sure that you have selected the appropriate drilling
tools if you want to generate start drills for the End Mill tools.

4. Click on [OK] to create the toolpaths.

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➨ The toolpaths are created and visible in the CAM and 3D view. The 3D view
changes as follows:

Fig. 97: 3D view

You can rotate the object in the 3D view in any

direction by activating this icon on your toolbar.

Tip

 The 2.5D toolpaths were created.

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2.5 Inserting fiducials

For the exact alignment of the top and bottom side of the 3D part you need
fiducials. Fiducials are optical marks on the surface of the machined part with a
defined diameter of 1.5 mm. The Fiducials are drilled into the workpiece and are
recognized by the camera of the ProtoMat systems.

Ideally you insert four fiducials for aligning the top and the
bottom side.
You are also able to work with two fiducials. In this case it is
Tip useful to insert them diagonally into the layout.

 Creating new phases for the fiducials

To be able to work with fiducials you have to create new phases to drill and to
read the fiducials. To do this act as follows:
1. Click in the pane “Toolpath”
2. Click on the arrow button next to “Phases”.
➨ The current job’s phases are displayed:
Fig. 98: Phases in
pane “Toolpath”

3. Right-click on “Phases”.
➨ The context menu is shown:
Fig. 99: Context
menu

4. Click on “New Phase”.

➨ The following dialog is shown:

Fig. 100: Create

new phase

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CircuitPro 1.5

5. Enter “DrillFiducial” in the field \Name\.

6. Select “DrillFiducials” in the drop down menu \Processing step\.
7. Enter “3“ in the field \Processing order\.
8. Activate the option <The date is mirrored (bottom side)>.
9. Activate the option <The phase contains toolpath data>.
10. Click on [Apply].
➨ A new processing phase „DrillFiducial“ was created:
Fig. 101: New
phase created

11. Create another processing phase using the following values:

• Name: ReadFiducialsTop
• Processing Step: Read Fiducials Top
• Link to: <None>
• Processing order: 7
• <The date is mirrored (bottom side)>: Not activated
• <The phase contains toolpath data}>: Activated

12. Click on [Apply].

➨ A new processing phase „ReadFiducialsTop“ was created.
13. Click on [Close].
➨ The dialog is closed.
 The new phases for the fiducials were created.

 Inserting fiducials

1. Click on Insert > Fiducial > Create new layer…

➨ A new layer “Fiducial” is created. The following dialog is displayed:

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Fig. 102: Creating

circles

In the drop down menu “Layer“ the new created layer „Fiducial“
is preselected.
Note

2. Activate the option “Absolute” (the center point is calculated from the zero
point).
3. Enter “1.5” in the field \Center X\.
4. Enter “26.5” in the field \Center Y\.
5. Click on [Apply].
➨ The fiducial is created.
6. Repeat the steps 3 to 5 using the following coordinates to create three more
fiducials:
• Center X: 1.5; Center Y: 15
• Center X: 16.5; Center Y: 26.5
• Center X: 16.5; Center Y: 1.5
➨ The Cam view now looks as follows:
Fig. 103: CAM
view with
fiducials

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You are able to create fiducials without entering any coordinate.

Therefore left-click in the CAM view where you want to place the
Note fiducials.

7. Click on [Close].
➨ The dialog is closed.

 The fiducials were inserted.

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2.6 Creating toolpaths for fiducials

The toolpaths for the fiducials have to be created before starting the production
of the 3D part. To do this the layer “Fiducial“ has to be assigned to a processing
phase first.
 Assigning the layer “Fiducial” to a processing phase
1. Click on the pane “Layers”.
2. Select the row of the desired layer:
Fig. 104: Pane
“Layers”

3. In the layer row, click on the arrow button of the column “Phase”.
➨ The phase selection list is shown:
Fig. 105: Phase
selection list

4. Assign the phase “DrillFiducial” to the layer “Fiducial”.

 The layer “Fiducial” was assigned to a processing phase.

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 Creating toolpaths for the fiducials

1. Click on Toolpath > Technology Dialog…

➨ The following dialog is shown:
Fig. 106:
Technology
Dialog

2. Deactivate the following functions:

• Insulate
• Contour Routing
• Drills
• Pockets

3. Click on [Start] to create the toolpaths.

➨ The toolpaths are created and the computation results are displayed.
4. Click on [Close].
➨ The dialog displaying the computation results is closed.
 The toolpaths for the fiducials were created.

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STEP file

 Defining the fiducials for the alignment

1. Click on Maching > Alignment…

➨ The following dialog is displayed:
Fig. 107:
Alignment

2. Click on the arrow button in the row “Fiducial“.

➨ The selection list for the fiducials is shown.
3. Select the fiducials of the phase “DrillFiducial“ for the alignment:
Fig. 108:
Selecting the
fiducials

4. Click on [OK].
➨ The dialog is closed.

 The fiducials are defined.

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2.7 Loading the tool magazine and assigning tools to holder positions
 Loading the tool magazine and assigning the tools to holder positions
1. Click on Edit > Tool magazine…
➨ The following dialog is displayed:
Fig. 109: Tool
magazine

➨ The tools required for the job are displayed. Tools that are missing in the
tool magazine are marked by a red “X”.
2. Insert the required tools into the tool magazine:
Fig. 110: Inserting
the tool

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STEP file

3. In the dialog, assign the tools to the respective tool magazine positions
used.
4. Repeat the steps above until all required tools are assigned:
Fig. 111: Tools in
the tool magazine

5. Click on [OK]
 The tools were loaded and assigned to their positions.
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Creating a multi-layer
PCB with galvanic
through-hole plating
 Creating a multi-layer PCB with
CircuitPro 1.5 3
galvanic through-hole plating

3 Creating a multi-layer PCB with galvanic through-

hole plating
This tutorial shows you how to produce a 4-layer circuit board with galvanic
through-hole plating.
The following steps are necessary to complete the tutorial successfully:
i. Starting the machine and CircuitPro
ii. Selecting a template and creating a new document
iii. Importing data
iv. Inserting rubout areas
v. Multiplying the design (if necessary)
vi. Creating toolpaths
vii. Loading the tool magazine and assigning tools to holder positions
viii. Starting the processing

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3.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 112:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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3.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New…
➨ The following dialog is displayed:
Fig. 113: New
document

2. Select the template “4Layer_GalvanicTHP.cbf”.

3. Click on [OK].
➨ The template is displayed in the CAM view:
Fig. 114: CAM
view - multi-layer

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The template “4Layer_GalvanicTHP.cbf” already contains

fiducials. These do not have to be added anew.
Note The template contains four slot holes that can be used to affix
the individual layers to the press plate for the pressing step.
The template also contains two positioning holes for orientation
during the alignment of the individual layers.

4. Click on File > Save As…

5. Enter a file name for the new file.
6. Click on [Save].

 The new document is created.

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3.3 Importing data

The LPKF tutor data are stored in folder “My documents\LPKF

Laser & Electronics\LPKF CircuitPro 1.5\Example Data\
UseCase_Multilayer”.
Tip

 Importing data
1. Click on File > Import…
➨ The following dialog is displayed:
Fig. 115: Import

2. Select all files in the folder “UseCase_Multilayer”.

3. Click on [OK].
4. Assign the imported files to the corresponding layers (see table):

File extension Layer

.BOA Board Outline

.BOT Bottom Layer

.LY2 Layer 2

.LY3 Layer 3

.TOP Top Layer

.DRL Drill Plated

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Fig. 116:
Assigned layers

Instead of manually assigning the individual files to the layers,

you can activate the options “Use layer name” and “Apply to all
Note Gerber files”. Activate the corresponding checkboxes in the tab
“Options”
If a file contains layer names these are automatically assigned.
Please note that this is only available for Gerber files. All other
files require assigning the layers manually via the drop-down
menu.

5. Click on [OK].
➨ The data is shown in the CAM view:
Fig. 117: CAM
view

 The files are imported.

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3.4 Inserting rubout areas

Inserting rubout areas is used for creating a most precise isolation in certain
areas by removing the redundant copper partially or as a whole depending on
the insulation method.
In this tutorial, a rubout area covering the whole circuit board is created on the
Top and Bottom layers.

 Inserting a rubout area

1. Click on Insert > Rubout area > RuboutTop.
➨ The following dialog is displayed:
Fig. 118: Create
Rectangle

2. Draw a rectangle across the whole area of the design using the mouse:
Fig. 119: Rubout
Top

3. Select “RuboutBottom” in the “Layer” selection list of the dialog.

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4. Draw another rectangle across the whole area of the design using the
mouse:
Fig. 120: Rubout
Bottom

5. Click on [Close].
➨ The dialog is closed.
 The rubout areas are created.

It may be helpful to hide other layers for drawing the rubout

depending on which layer the rubout is to be created.
Note The display mode of the objects on the individual layers can be
set in the “Layers” pane. You can select
• True width (area objects are filled, paths are displayed
with their true width)
• Outline (outlines of the area objects and paths are
displayed)
• Thin line (outlines of area objects are displayed and
thin lines without defined width in case of paths)
• Unknown (used when importing .cam files with
undefined objects)

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3.5 Multiplying the design (if necessary)

The design can be multiplied and placed arbitrarily on the base material for
producing a panel depending on the design's size and on the material's size.

Please make sure, that all layers in the “Layer“ pane are visible
and selectable.
Note Otherwise it may cause incorrect results when multiplying the
design.

 Multiplying the design

1. Select the whole design.
2. Click on Modify > Step & Repeat…
➨ The following dialog is displayed:
Fig. 121: Step &
Repeat

3. Enter “2” in the \Repetition X\ field.

4. Enter “50” in the \Distance X\ field.

The “Distance” values are automatically set to the size of the

design. The value for spacing between the designs has to be
Note added.

5. Click on [Apply].

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➨ The design is multiplied in X direction:

Fig. 122: Design
in the CAM view

6. Click on [Close].
➨ The dialog is closed.
 The design is multiplied.

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3.6 Creating toolpaths

Before the circuit board can be produced, the toolpaths have to be generated
for the imported data.
 Creating toolpaths
1. Click on Toolpath > Technology dialog…
➨ The following dialog is displayed:
Fig. 123:
Technology
Dialog

In the technology dialog, several settings can be modified by

clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.
For this tutorial, the default values of the technology dialog are
used.

2. Click on the right arrow button in the “Insulate” section until the isolation
method “Partial rubout” is displayed.
3. Click on [Start].
➨ The computation results are displayed.
4. Click on [Close].
➨ The dialog with the computation results of the technology dialog is closed.
 The toolpaths are created.
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3.7 Loading the tool magazine and assigning tools to holder positions

This chapter is only relevant if you are using a ProtoMat with

automatic tool change (S63 or S103).
Note

 Loading the tool magazine and assigning tools to holder positions

1. Click on Edit > Tool magazine…
➨ The following dialog is displayed:
Fig. 124: Tool
magazine

➨ The tools required for the job are displayed. Tools required for the job that
are missing are marked by a red “X”.
2. Insert the required tools into the tool holders of the machine:
Fig. 125: Inserting
a tool

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galvanic through-hole plating

3. Assign the tools to the corresponding positions in the dialog.

➨ The tool holders of the machine are loaded:
Fig. 126: Loaded
tool holder

4. Click on [OK].
➨ The dialog is closed.
 The tool magazine is loaded and the tools are assigned to the
corresponding holder positions.
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3.8 Starting the processing

 Starting the processing
1. Click on Machining > Process all.
Fig. 127:
Machining > Pro-
cess all

Make sure that <Process

All> is selected in the combo
Note box, so that all phases are
executed.
Instead of processing all phases automatically, you can
process the phases individually. In the combo box select the
desired phase and click on the “Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

Depending on which ProtoMat you use the following phases

could differ from the phases and messages displayed on your
Note screen. Please follow the instructions on your screen.
For machines with manual tool exchange you are regularly
asked to change the tool in the collet, for example.

Phase “MountMaterial”
1. Mount the base material (multi-layer core) onto the processing area of the
machine.
2. Fasten the material to the processing area using adhesive tape.
3. Click on [OK].

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Phase “MaterialSettings”
➨ The following dialog is displayed:
Fig. 128: Material
Settings

 Entering the material settings

1. Enter the correct values for the base material used.

PCB is selected as default.

Note

2. Adapt the values for copper thickness and material thickness if necessary.
3. Define the processing area:
a) Move the “Material Settings“ dialog off to the side.
b) Click on the position in the machining view that represents the right
corner of your material:

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plating

Fig. 129: Defining

the left corner

/1/ Click on machining area /2/ Job

➨ The machine head moves to this position.

c) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 130: Click on
the icon

➨ The machining area is adjusted.

d) Click on the position in the machining view that represents the right
corner of your material:

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galvanic through-hole plating

Fig. 131: Defining

the left corner

➨ The machine head moves to this position.

e) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 132: Defined
processing area

/1/ Defined processing area

➨ The processing area has been fit to the material.

4. Click on [Continue].
 The material settings were entered.

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Phase “Placement”
In this phase, the job can be placed arbitrarily on the base material, be rotated
and be multiplied if necessary.

At this point, the whole circuit board design including the

template and the toolpaths possibly contained in the template
Note are moved.
If only the design is to be moved within the template, you have to
use the menu item Modify > Transform….

➨ Following dialog is displayed:

Fig. 133:
Placement

1. Click on the job and drag it to the desired position using the mouse.
Or
1. Enter the new position in the dialog.
2. If desired, multiply the job data by entering the number of copies and
spacing values in X and Y direction in the corresponding fields (Step and
Repeat section).

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Phase “DrillFiducial”
➨ The Spiral Drill 1.5 mm is picked up to drill the fiducials.

If the spindle motor has not run before, a 2-minute warm-up

phase is started.
Note

Phase “Prepare Core”

➨ Four slot holes are created near the edges of the circuit board.

Phase “Milling Layer3”

➨ The tools are picked up as required and Layer3 is processed.

Phase “Flip Material”

A message prompts you to turn the material over.
1. Turn the base material over.

Turn the material over around the X axis if you are using an
S43, S63, or S103 machine.
Note Turn the material over around the Y axis if you are using an
E33 machine.

2. Click on [OK].

The display in the machine view changes. The position of your

design is adapted to the material. The material side to be
Note processed now is Top.

Phase “Read Fiducials Layer2”

S43, S63, and S103

If the fiducial search is performed for the first time (after having
started CircuitPro) the camera is performing an autofocus five
Note times.
Afterwards the following message is displayed which prompts
you to confirm the focus height:

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➨ The camera moves to the positions of the fiducials and determines the
exact position.
The Top side is thus aligned to the Bottom side.
The following dialog is displayed if the fiducials have not been recognized
automatically:
Fig. 134:
Alignment

1. Enlarge the search area by increasing the value of the field \Search Area
Length\.
2. Restart the search by clicking on [Start].
3. Repeat steps one and two if necessary.

Enlarging the search spiral increases the time required for

searching the fiducials. Try to put the material at the same
Note position as before when turning the material over (if this is not
predetermined by reference pins).

E33, S43 without camera

If no camera is available for processing the “Read Fiducials_Top” phase, the
Top side is aligned to the Bottom side using the reference pins. The “Read
Fiducials_Top” phase is not processed in this case.

Phase “Milling Layer2”

➨ The tools are picked up as required and Layer2 is processed.

Phase “Dismount Material”

1. Dismount the base material from the machine.
2. Click on [OK].

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Phase “Mount Laminate”

1. Mount the laminate for the Bottom side of the multi-layer PCB onto the
processing area of the machine.
2. Fasten the material to the processing area using adhesive tape.
3. Click on [OK].

Phase “MaterialSettings”
1. Adapt the values for copper thickness and material thickness of the
laminate if necessary.
2. Set the material size.
3. Click on [OK].

Phase “Prepare Laminate Bottom”

➨ The slot holes, position markers and fiducial exposures are processed.

Phase “Dismount Material_1”

1. Dismount the laminate for the Bottom side of the multi-layer PCB from the
machine.
2. Click on [OK].

Phase “Mount Laminate_1”

1. Mount the laminate for the Top side of the multi-layer PCB onto the
processing area of the machine.
2. Fasten the material to the processing area using adhesive tape.
3. Click on [OK].

Phase „Prepare Laminate Top”

➨ The slot holes, position markers and fiducial exposures are processed.

Phase “Dismount Material_2”

1. Dismount the laminate for the Top side of the multi-layer PCB from the
machine.
2. Click on [OK].

Phase “Press Layer Top_Bottom”

➨ The outer layers Top and Bottom have to be laminated onto the core base
material. This can be done using an LPKF MultiPress S system for
example.

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Phase “Mount Material Top”

1. Mount the laminated material onto the processing area of the machine, the
Top side facing upwards.

The Top and Bottom sides can be distinguished by the position

markers. The Top side has the position markers in the right front
Note corner.

2. Fasten the material to the processing area using adhesive tape.

Phase “MaterialSettings”
1. Adapt the values for copper thickness and material thickness of the
laminated material as required.
2. Define the material area.
3. Click on [OK].

Phase “Read Fiducials Top”

➨ See Phase “Read Fiducials Layer2” above.

Phase “Marking Drills”

➨ The Universal Cutter is picked up and the drill positions are marked.

Phase “Drilling Plated”

➨ The tools are picked up as required and the holes are drilled.

This phase may use several drill tools according to the drill
diameters.
Note

Phase “Dismount Material”

1. Dismount the laminated material from the machine.
2. Click on [OK].

Phase “Through Hole Plating”

➨ The hole have to be plated. This can be done using an LPKF Contac RS
system for example.

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Phase “Mount Material Bottom”

1. Mount the laminated material onto the processing area of the machine, the
Bottom side facing upwards.

The Top and Bottom sides can be distinguished by the position

markers. The Top side has the position markers in the right front
Note corner.

2. Fasten the material to the processing area using adhesive tape.

Phase “MaterialSettings”
1. Adapt the values for copper thickness and material thickness if necessary.

Please note that the copper thickness has increased during the
through-hole plating process. The additional copper thickness
Note depends on the parameters of the through-hole plating process.

2. Define the material area.

3. Click on [OK].

Phase “Read Fiducials Bottom”

➨ See Phase “Read Fiducials Layer2” above.

Phase “Milling Bottom”

➨ The tools are picked up as required and the circuit board is milled.

Phase “Flip Material”

A message prompts you to turn the material over.
1. Turn the material over.

Turn the material over around the X axis if you are using an
S43, S63, or S103 machine.
Note Turn the material over around the Y axis if you are using an
E33 machine.

2. Click on [OK].

The display in the machine view changes. The position of your

design is adapted to the material. The material side to be
Note processed now is Top.

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Phase “Read Fiducials Top”

➨ See Phase “Read Fiducials Layer2” above.

Phase “Milling Top”

➨ The tools are picked up as required and the Top side of the circuit board is
milled.

Phase “Contour Routing”

➨ The tools are picked up as required and the circuit board is drilled and
routed.

Phase “Board Production Finished”

➨ A message informs you that the production is finished.
 The multi-layer circuit board is finished.
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 CircuitPro 1.5 Creating a front panel
4

4 Creating a front panel

In this section you will learn how to create a front panel that contains following
elements:
• Cutouts for switches and a fan
• Holes for fastening LED’s
• Labels
• Markings

Therefore you have to perform following steps:

i. Starting the machine and CircuitPro
ii. Selecting a template and creating a new document
iii. Creating the front panel design
iv. Creating toolpaths
v. Loading the tool magazine and assigning tools to holder positions
vi. Starting processing

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4.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 135:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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4.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New.
➨ The following dialog is displayed:
Fig. 136: New
document

2. Select the template “SingleSided_Top.cbf”.

3. Click on [OK].
4. Click on File > Save as…
5. Enter a new name for the file.
6. Select the storage location.
7. Click on [Save].

 The new document was created.

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4.3 Creating the front panel design

To create the front panel design, following steps are required:
i. Defining the dimensions of the front panel
ii. Inserting cutouts for switches
iii. Inserting holes for LEDs
iv. Inserting markings
v. Creating legends
vi. Creating holes for mounting the front panel
vii. Creating cutouts for a fan

 Defining the dimensions of the front panel

The dimensions of the front panel are defined by inserting a rectangle on the
“BoardOutline” layer with the dimensions of 260 mm x 140 mm.
1. Click on Insert > Rectangle.
➨ Following dialog is displayed:

Fig. 137: Create

rectangle

2. Select the layer BoardOutline.

3. Ensure that {Absolute} is selected.
4. Enter “0” into the \Start point X\ and \Start point Y\ fields.
5. Enter “260” into the \End point X\ field.
6. Enter “140” into the \End point Y\ field.
7. Click on [Create].
➨ The rectangle is created.

8. Click on [Close].
➨ The dialog is closed.

 The dimensions of the front panel are defined.

In order to see the drawn objects in the CAM view that lie
within the board outline, set the mode of layer “BoardOutline”
Note in the “Layers“ pane to “Thin Line”:

The lower left corner of the board outline is now on the zero
point. Thus, you can place all the subsequent objects at
Note specific positions in relation to the board outline.

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If you have the need to place objects in relation to a specific

object, move the zero point as follows:
1. Click on the lower left corner of the reference object. The
anchor point moves to this position.
2. Click on Edit > Set zero point. The zero point is moved to
the anchor point and thus to the lower left corner.

 Inserting cutouts for switches

Two cutouts are needed for switches.

1. Click on Insert > Rectangle.
➨ Following dialog is displayed:

Fig. 138: Create

rectangle

2. Select the layer “BoardOutline”.

3. Select {Absolute} (thus, the start and end point values are in relation to the
zero point).
4. Enter “20” into the \Start point X\ field.
5. Enter “85” into the \Start point Y\ field.
6. Enter “40” into the \End point X\ field.
7. Enter “115” into the \End point Y\ field.
8. Click on [Create].
➨ The rectangle is created.

9. Repeat the steps above to create another rectangle with a start point of
X=50 and Y=85 and an end point of X=70 and Y=115.
➨ The second rectangle is created.

10. Click on [Close].

➨ Both rectangles are displayed in the CAM View:

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Fig. 139:
Rectangles in the
CAM view

The objects have to be converted into closed paths to enable

CircuitPro to generate the contour routing toolpaths in the
Note Technology dialog.

Converting the polygons into closed paths

1. Select the rectangles that you have created.
2. Click on Modify > Convert to path
Tip
 The rectangles are converted to closed paths.

 The cutouts for the switches were inserted.

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 Inserting holes for LEDs

1. Click on Insert > Circle.

➨ Following dialog is displayed:

Fig. 140: Create

circle

2. Select the layer “DrillUnplated”.

3. Select {Absolute}.
4. Enter “20” into the \Center X\ field.
5. Enter “20” into the \Center Y\ field.
6. Enter “5” into the \Center ø\ diameter field.
7. Click on [Apply] to create the circle.
➨ The circle is created.

8. Click on [Close].
➨ The dialog is closed.

9. Select the drill hole to be multiplied.

10. Click on Modify > Step & Repeat.
11. Enter “9” into the \Repetition X\ field.
12. Enter “7” into the \Distance X\ field.
13. Click on [Apply] to multiply the drill hole.
➨ The drill holes were multiplied.

Another series of drill holes is needed, so that we have to insert circles again:
1. Click on Insert > Circle.
2. Select the layer “DrillUnplated”.
3. Select {Absolute}.
4. Enter “105” into the \Center X\ field.
5. Enter “30” into the \Center Y\ field.
6. Enter “5” into the \Center ø\ diameter field.
7. Click on [Apply] to create the circle.
➨ The circle is created.

8. Click on [Close].
➨ The dialog is closed.

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9. Multiply the drill hole in Y direction by using the “Step & Repeat” function.
10. Enter “5” into the \Repetition Y\ field.
11. Enter “20” into the \Distance Y\ field.
12. Click on [Apply] to multiply the drill holes in Y direction.
➨ The design now looks as follows:

Fig. 141: Drill

holes

 The holes for the LEDs were inserted.

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 Inserting markings

An indication of the charge status is to be created above the lower row of LEDs.
1. Click on Insert > Polygon.
➨ Following dialog is displayed:

Fig. 142: Create

Polygon

2. Select the layer “Top Layer”.

3. Select {Absolute}.
4. Enter “17.5” into the \Start point X\ field.
5. Enter “30” into the \Start point Y\ field.
6. Select {Segment}.
7. Enter “80” into the \X\ field.
8. Enter “30” into the \Y\ field.
9. Click on [Set] to create the segment.
10. For the next segment, enter “80” into the \End point X\ field.
11. Enter “50” into the \End point Y\ field.
12. Click on “Set” to create the second segment.
13. Click on “Apply” to create the polygon.
➨ CircuitPro automatically connects the end of the last segment with the start
of the first segment:

Fig. 143: Polygon

 The polygon is created.

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 Creating circular marks around the drill holes

1. Click on Insert > Circle.

2. Select the layer “Top Layer”.
3. Select {Absolute}.
4. Enter “105” into the \Center X\ field.
5. Enter “110” into the \Center Y\ field.
6. Enter “15” into the \Center ø\ diameter field.
7. Click on [Apply] to create the circle.
➨ The circle is created.

8. Click on [Close].
➨ The dialog is closed.

9. Multiply the circles created in Y direction by using the “Step & Repeat”
function.
10. Enter “5” into the \Repetition Y\ field.
11. Enter “-20” into the \Distance Y\ field.
12. Click on [Apply] to multiply the circles in Y direction.
➨ The circle is multiplied in Y direction.

13. Click on [Close].

➨ The dialog is closed and the design now looks as follows:

Fig. 144: Circular

marks

 The circular marks are created around the drill holes.

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 Creating legends

1. Click on Insert > Text.

➨ Following dialog is displayed:

Fig. 145: Define

text

2. Enter the text “Power” in the red highlighted text field.3. Select the layer
“TextTop” in field \Destination\.
4. Modify the text attributes if necessary (in this example size=6 mm, bold,
italic).
5. Enter “15” into the \Position X\ field.
6. Enter “120” into the \Position Y\ field.
7. Click on [Apply] to create the text object.
➨ The text object is displayed in the CAM view.

8. Click on [Close].
➨ The dialog is closed.

9. Click on an empty space in the CAM view.

➨ The text object is no longer selected.

10. Repeat the steps above to create other legends using the values listed in
the following table:
Table 1: Values
for text legends
X position Y position Text
50 120 Laser
20 45 Charge
115 107 Laser
115 87 Gate
115 67 Trigger
115 47 Overload
115 27 Error

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➨ The design now looks as follows:

Fig. 146: Text in

CAM view

 The legends were created.

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 Creating holes for mounting the front panel

1. Click on Insert > Circle.

2. Select the layer “DrillUnplated”.
3. Select {Absolute}.
4. Enter “10” into the \Center X\ field.
5. Enter “10” into the \Center Y\ field.
6. Enter “2.4” into the \Center ø\ diameter field.
7. Click on “Apply” to create the circle.
8. Create another three circles using the following center points:
• X=10; Y=130
• X=250; Y=130
• X=250; Y=10
➨ The new design now looks as follows:
Fig. 147: Holes in
CAM view

 The holes for mounting the front panel were created.

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 Creating cutouts for a fan

This task is to create cutouts for a fan. The required objects are created by
using the function “Open path”.
1. Click on Insert > Open Path.
➨ Following dialog is displayed:

Fig. 148: Create

closed path

2. Select the Layer “BoardOutline”.

 Thus, contour routing toolpaths are generated for the cutouts in the
technology dialog.
3. Select {Absolute}.
4. Enter “173” into the \Start point X\ field.
5. Enter “38” into the \Start point Y\ field.
6. Enter “237” into the \Segment X\ field.
7. Enter “102” into the \Segment Y\ field.
8. Click on [Apply] to create the path.
9. Repeat the steps 4-8 to create six more paths using the following values
(the setting “Absolute” remains unchanged for the individual paths):

Table 2: Values
for creating arcs
Start point X Start point Y Segment X Segment Y
165,5 48 227 109,5
161 61 214 114
161 79 196 114
183 30,5 244,5 92
196 26 249 79
214 26 249 61

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➨ The new design now looks as follows:

Fig. 149: Cutouts

for the fan

Now the width of the open paths has to be changed to create the cutouts.
10. Select one of the created paths.
11. Click in the pane “Properties”.
12. In the pane “Properties” select the field \Width\.
13. Overwrite the value by entering 5 mm.
14. Press “Enter” on your keyboard.

Fig. 150: Pane

„Properties“

➨ The line width has changed.

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The line width of open or closed paths gets visible if switching

to mode “Outline“ in the pane “Layers“. If mode “Thin Line” is
Note selected, the open or closed path is always shown as a thin
line.

15. Repeat the steps 10-14 to change the line width of the remaining six open
paths to 5 mm.
 The cutouts for the fan were created.

 Creating holes for mounting the fan

This task is to create holes for mounting the fan. The holes are creted using the
function „Create circle“.
1. Click on Insert > Circle.
➨ The following dialog is displayed:

Fig. 151: Create

Circle

2. Select the layer „DrillingUnplated“.

3. Select {Absolute}.
4. Enter „165” into the \Center X\ field.
5. Enter „110” into the \Center Y\ field.
6. Enter „2,5” into the \ø\ field.
7. Click on [Apply] to create the circle.
➨ The circle was created.

8. Repeat the steps 4-7 using the following values to create three more circles:
Table. 3: Values
for the circles
X Position Y Position Durchmesser
165 30 2,5
245 110 2,5
245 30 2,5

 The holes were created.

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4.4 Creating toolpaths

Before we start creating the toolpaths, we have to create filled characters
instead of outlined characters.
If the characters of the legends are to be milled fully, the settings of the layer
have to be modified.
In the pane “Layers” check the check box in the “Inv” column in the row of the
“TextTop” layer:
Fig. 152: Pane
“Layers“

This means for a “Wiring” layer (see column “Tech”) that the inside of the object
is filled with milling toolpaths instead of creating an insulating toolpath around
the object when the toolpaths are generated.

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 Creating toolpaths

1. Click on Toolpath > Technolog Dialog.

➨ The following dialog is displayed:

Fig. 153:
Technology
Dialog

In the technology dialog, several settings can be modified by

clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.
This example just requires the “Basic” contour routing method.

2. Click on the left-pointing arrow button in the “Contour Routing” section until
the “Basic” contour routing method is selected.
3. Click on [Start].
➨ The results of the toolpath generation are displayed.

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4. Click on [Close].
➨ The dialog is closed.

CircuitPro processes circular cutouts up to a diameter of

2.4 mm as drill holes. All larger cutouts are processed as inner
Note contours and are cut using the contour router tool.

➨ The design now looks as follows:

Fig. 154: Created
toolpaths

 The toolpaths were created

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4.5 Loading the tool magazine and assigning tools to holder positions
 Loading the tool magazine and assigning the tools to holder positions
1. Click on Edit > Tool magazine…
➨ The following dialog is displayed:
Fig. 155: Tool
magazine

The tools shown in the tool magazine dialog must not

correspond to your needed tools. These tools are examples.
Note

➨ The tools required for the job are displayed. Tools that are missing in the
tool magazine are marked by a red “X”.
2. Insert the required tools into the tool magazine:
Fig. 156: Inserting
a tool

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3. In the dialog, assign the tools to the respective tool magazine positions
used.
➨ The tool holders of the machine are loaded:
Fig. 157: Loaded
tool holder

4. Click on [OK].
➨ The dialog is closed.
 The tools were assigned and the tool magazine was loaded.
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4.6 Start processing

 Start processing
1. Click on Machining > Process all.
Fig. 158:
Machining >
Process all

Make sure that <Process All>

is selected in the combo box,
Note so that all phases are
executed.
Instead of processing all
phases automatically, you can process the phases individually.
In the combo box select the desired phase and click on the
“Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

Depending on which ProtoMat you use the following phases

could differ from the phases and messages displayed on your
Note screen. Please follow the instructions on your screen.
For machines with manual tool exchange you are regularly
asked to change the tool in the collet, for example.

Phase “Mount Material”

1. Mount the material onto the processing area.
2. Fasten the material to the processing area using adhesive tape.
3. Click on [OK].

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Phase “Material Settings”

➨ The following dialog is displayed:
Fig. 159: Material
settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Change the values of copper thickness and material thickness necessary.

3. Define the processing area:
a) Move the dialog „Material Settings“ off to the side.
b) Using your mouse in the machining view, click on the right corner of
your material:

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Fig. 160: Right

corner

/1/ Click in the machining view /2/ Material

➨ The machine head moves to this position.

c) Now click on the corresponding button in the dialog “Material Settings“:
Fig. 161: Click on
button

➨ The processing area is adapted.

d) Using your mouse in the machining view, click on the left corner of your
material:

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Fig. 162: Left

corner

➨ The machine head moves to this position.

e) Now click on the corresponding button in the dialog “Material Settings“:
Fig. 163: Defined
processing area

/1/ Defined processing area

➨ The processing area was adapted to the material.

4. Click on [Continue].
 The material settings were entered.

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Phase “Placement”
In this phase, the job can be positioned, rotated and multiplied within the
processing area.
➨ Following dialog is displayed:
Fig. 164:
Placement

1. Drag the job to the desired position or use the dialog to position the job.
2. If desired, rotate the job by entering a rotation angle.
3. If desired, multiply the job by using the settings in the “Step and Repeat”
section of the dialog.
4. Click on [Continue].

Phase “Marking Drills”

➨ The “Universal Cutter” tool is picked up and the drill positions are marked.

Phase “Drilling Unplated”

➨ The tools are picked up as required and the holes are drilled.

Phase “Milling Top”

➨ The tools are picked up as required and the material (Top side) is milled.

Phase “Contour Routing ”

➨ The tools are picked up as required and the material is drilled and routed.

Phase “Board Production Finished”

➨ A message informs you that the production is finished.
 Your front panel is created.
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5 Creating a polyimide stencil

This tutorial shows you how to produce an SMT stencil made of polyimide that
you can use in the later process stages to apply solder paste (using e.g. the
LPKF ProtoPrint system).
The following steps are necessary to complete the tutorial successfully:
i. Starting the machine and CircuitPro
ii. Selecting a template and creating a new document
iii. Importing data
iv. Processing data
v. Creating toolpaths
vi. Loading the tool magazine and assigning tools to holder positions
vii. Starting the processing

In order to create a stencil, the polyimide film must be fixed on

the underlay with a spray adhesive.
Note

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5.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 165:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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5.2 Selecting a template and creating a new document

 Selecting a template and creating a new document
1. Click on File > New…
➨ The following dialog is displayed:
Fig. 166: New
document

2. Select the template “Stencil QR [Link]”.

3. Click on [OK].
4. Click on File > Save As…
5. Enter a file name for the new file.
6. Select a memory location.
7. Click on [Save].

 The new document is created.

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5.3 Importing data

The LPKF tutor data are stored in folder “My documents\LPKF

Laser & Electronics\LPKF CircuitPro 1.5\Example Data\
UseCase_PolyimideStencil”.
Tip

 Importing data
1. Click on File > Import…
➨ The following dialog is displayed:
Fig. 167: Import

2. In the folder “UseCase_PolyimideStencil”, select the files “[Link]” and

“[Link]”.
3. Click on [OK].
4. Assign the imported files according to the following table:

File extension Layer

.SPT SolderPasteTop

.TOP Top Layer

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Fig. 168: Assign

layers

Instead of manually assigning the individual files to the layers,

you can activate the options “Use layer name” and “Apply to all
Note Gerber files”. Activate the corresponding checkboxes in the tab
“Options”.
If a file contains layer names these are automatically assigned.
Please note that this is only available for Gerber files. All other
files require assigning the layers manually via the drop-down
menu.

5. Click on [OK].
➨ The data are displayed in the CAM view:
Fig. 169: CAM
view

 The data is imported.

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5.4 Processing data

In the CAM view you are able to check the proportion between the solder paste
pads and the copper pads.
The imported data shows you, that both pads on the SolderPaste-Layer and on
the Top-Layer have the same proportion:
Fig. 170: Identical
proportion

In order to achieve better resulty when applying solder paste, LPKF

recommends to minimize the pad dimension for the solder paste. This will
prevent the solder to flow over the copper pads.

 Minimizing the pad dimension of the solder paste pads

1. Highlight the data on the layer “SolderPasteTop“:
a) Click in the pane “Layer” on the layer “SolderPasteTop“.
b) Now click in the pane “Layer” on the adjoining icon “Select
objects on layer”, to highlight all objects on the layer.
2. Click on Modify > Convert to polygon.

The objects on the layer “SolderPasteTop” are flash objects.

These cannot be scaled and must be converted into polygons
Note first.

3. Click on Modify > Transformation.

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➨ The “Transformation” dialog is shown.

4. Select the tab “Scale”:
Fig. 171: Trans-
formation >Scale

5. If not active, enable the option “Scale each object individually”.

6. Enter “70” in the \New size in percent\ field.
7. Click on [Apply].
8. Click on [Close].
➨ The dimension of the solder paste pads on the layer “SolderPasteTop” has
changed:
Fig. 172:
Dimensions
changed

 The dimension of the solder paste pads is minimized.

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5.5 Creating toolpaths

The objects of layer “SolderPasteTop” displayed in the CAM view require an
inner insulation in order to remove the material inside these areas.
This requires that the check box in the “Inv” column of the “SolderPasteTop”
row of the “Layers” pane is activated:
Fig. 173: “Layers”
pane

This means for a “Wiring” layer (see column “Tech”) that the inside of the object
is filled with milling toolpaths instead of creating an insulating toolpath around
the object when the toolpaths are generated.

 Creating toolpaths
1. Click on Toolpath > Technology dialog…
➨ The following dialog is displayed:
Fig. 174:
Technology
Dialog

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5

In the technology dialog, several settings can be modified by

clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.
This example just requires the “Basic” contour routing method.

2. Click on [Show Details] in the “Insulate” section.

➨ The details for insulation are displayed.
Fig. 175:
Insulation details

3. In the drop down list “Primary”, select the tool “Micro Cutter 0.1 mm

All other tools are not qualified for milling the polimide stencil.
Deactivate all other tools in the drop down list „Available tools“.
Note

4. Click on [Hide details].

➨ The details are hidden.

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5. Deactivate all other functions of the technology dialog except insulation. To

achieve this, click on the check marks next the individual sections:
Fig. 176:
Deactivating
functions

➨ The functions are deactivated.

6. Click on [Start].
➨ CircuitPro creates the toolpaths.
➨ The dialog with the computation results is displayed.
7. Click on [Close].
➨ The dialog is closed.
 The toolpaths are created.

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CircuitPro automatically creates several toolpaths for an inner

insulation. There are two distinct kinds of toolpaths:
Note • Toolpath for insulating the inside of the selected objects.
• Toolpath for removing the material inside the insulated area.
The toolpath that removes the material inside the insulated
area is marked with “_1” in the “Toolpath” pane.

The material is cut through when insulation the objects for

producing the stencil. Thus the toolpath for removing the
material inside the insulation (Insulate_SolderPasteTop_ Micro
Cutter 0.1mm_1“) is not necessary and can be deleted.
Deleting a toolpath
1. Select the desired toolpath in the “Toolpath” pane.
2. Press the “Del” key or select “Delete” in the context
menu.

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5.6 Loading the tool magazine and assigning tools to holder positions

This chapter is relevant, if you use a ProtoMat with automatic

tool change (S63 or S103).
Note

 Loading the tool magazine and assigning tools to holder positions

1. Click on Edit > Tool magazine…
➨ The following dialog is displayed:
Fig. 177: Tool
magazine

➨ The tools required for the job are displayed. Tools required for the job that
are missing are marked by a red “X”.
2. Insert the required tools into the tool holders of the machine:
Fig. 178: Insert
tool

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3. Assign the tools to the corresponding positions in the dialog.

➨ The tool holder in the machine is loaded:
Fig. 179: Loaded
tool holder

4. Click on [OK].
➨ The dialog is closed.
 The tools are inserted into the tool holders and assigned accordingly.
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5.7 Starting the processing

 Starting the processing
1. Click on Machining > Process all.
Fig. 180:
Machining >
Process all

Make sure that <Process All>

is selected in the combo box,
Note so that all phases are
executed.
Instead of processing all phases automatically, you can
process the phases individually. In the combo box select the
desired phase and click on the “Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

Depending on which ProtoMat you use the following phases

could differ from the phases and messages displayed on your
Note screen. Please follow the instructions on your screen.
For machines with manual tool exchange you are regularly
asked to change the tool in the collet, for example.

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Phase “MountMaterial”
1. First spray adhesive (e.g. 3M type 75) onto the surface of the underlay.
2. Place the polyimide film centered on the underlay.
3. Press the polyimide film on the underlay.
4. Use a rubber roll to remove all air blisters:
5. Put the underlay on the working table using the dowel
pins if a vacuum table is not assembled.
Or
5. Fasten the underlay on the vacuum table by using adhesive tape.
6. Click on [OK].

Phase “Material Settings”

➨ The following dialog is displayed:

Fig. 181: Material
Settings

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 Creating a polyimide stencil CircuitPro 1.5
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 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Enter the thickness of your material (polyimide film) in the field \Copper
Thickness\
3. If a vacuum table is not assembled: Enter “0” in the field \Material
Thickness\.
Or
3. If a vacuum table is assembled: Enter the thickness of your underlay in the
field \Material Thickness\.

The polyimide film has no copper layer. Since the material is cut
with an insulation tool, the thickness of the material (polyimide
Note film) has to be entered in the field for the copper thickness.

4. Define the processing area:

a) Move the dialog „Material Settings“ off to the side.
b) Using your mouse in the machining view, click on the right corner of
your material:
Fig. 182: Right
corner

/1/ Click in the machining view /2/ Material

➨ The machine head moves to this position.

c) Now click on the corresponding button in the dialog “Material Settings“:

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Fig. 183: Click on

button

➨ The processing area is adapted.

d) Using your mouse in the machining view, click on the left corner of your
material:
Fig. 184: Left
corner

➨ The machine head moves to this position.

e) Now click on the corresponding button in the dialog “Material Settings“:

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Fig. 185: Defined

processing area

/1/ Defined processing area

➨ The processing area was adapted to the material.

5. Click on [Continue].
 The material settings were entered.

Phase “Placement”
In this phase, the job can be placed arbitrarily on the base material and be
multiplied if necessary.
➨ Following dialog is displayed:
Fig. 186:
Placement

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1. Click on the job and drag it to the desired position using the mouse.
Or
2. Enter the new position in the dialog.

At this point, the whole circuit board design including the

template and the toolpaths possibly contained in the template
Note are moved.
If only the design is to be moved within the template, you have to
use the menu item Modify > Transform….

Phase “Milling Top”

➨ The Micro Cutter is picked up. The stencil is milled.

Phase “Board Production Finished”

➨ A message informs you that the production is finished.

1. Remove the stencil from the underlay:
2. Put the stencil on a table with the adhesive side
facing upwards.
3. Take a lint-free cloth.
4. Moisten the cloth with rubbing alcohol.
5. Remove any remaining adhesive from the stencil.

 The polyimide stencil is created.

At a later stage of the process, you can clamp the stencil in an

LPKF ProtoPrint and apply solder paste onto the circuit board
with high precision using the stencil.
Tip You can also cut the stencil to size for other solder paste
processes.

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Creating a flexi-rigid
PCB
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6 Creating a flexi-rigid PCB

This tutorial shows you how to produce a flexi-rigid circuit board.
The following steps are necessary to complete the tutorial successfully:
i. Starting the machine and CircuitPro
ii. Selecting a template and creating a new document
iii. Importing data
iv. Drilling and milling the individual physical layers
v. Bonding the individual physical layers
vi. Routing the bonded PCB

Thin materials like the flexible polyimide material and the

prepreg can only be machined using a vacuum table and air-
Note cushioned milling-depth limiter.

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6.1 Starting the machine and CircuitPro

 Starting the machine and CircuitPro
1. Switch on the machine.
2. Start CircuitPro.
➨ CircuitPro automatically connects to the machine. The connection steps are
displayed:
Fig. 187:
Connection steps

➨ CircuitPro reads the settings from the machine.

 The machine moves to its reference points and subsequently moves to the
Pause position.
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6.2 Selecting a template and creating a new document

This section shows you how to create the new document move the fiducials into
the prepreg area
 Selecting a template and creating a new document
1. Click on File>New…
➨ The following dialog is displayed:
Fig. 188: New
document

2. Select the template “4Layer_ProConduct_MultiPressS.cbf”.

You need to select a template that contains registration holes

for the LPKF MultiPress S system because creating a flexi-rigid
Note PCB requires bonding of rigid and flexible materials. Thus, the
different physical layers can be aligned for bonding using the
registration system of the MultiPress S system.

3. Click on [OK].
➨ The template is displayed in the CAM view:

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Fig. 189: CAM

view

/1/ Fiducial /2/ Prepreg

The fiducials in the selected template are outside the prepreg's area (see figure
above) as the prepreg usually is not machined in a multi-layer application and
thus does not need to be aligned to the other layers.
This tutorial's flexi-rigid PCB, however, requires a cutout in the prepreg. Thus,
the prepreg has to be aligned to the other physical layers for bonding. Follow
these steps:

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 Moving the fiducials into the prepreg area:

1. Click on the “Toolpath” pane.
2. Click on the plus symbol next to “Phases”.
➨ The phases are displayed:
Fig. 190: Phases

3. Delete the toolpaths of the phases “PrepareLaminatBottom” and

“PrepareLaminatTop” marked in the figure above.
4. Move the fiducial into the prepreg area:
• Activate the following “Move selected objects” icon:
• Click on the fiducial to be moved.
• Drag the fiducial while pressing the left mouse button to the desired position
in the CAM view.
Fig. 191: Phases

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Modify the distance between the fiducials on one side (see

figure above) in order to orient and align the prepreg correctly
Note to the other materials for bonding.

➨ The fiducials have been moved into the prepreg area.

5. Click on File > Save As…
6. Enter a file name for the new file.
7. Select the memory location.
8. Click on [Save].

 The new document is created.

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6.3 Importing data

In this section you will pass through following steps:
i. Importing data
ii. Deleting unnecessary production phases
iii. Assigning imported data to production phases

The LPKF tutor data are stored in folder “My documents\LPKF

Laser & Electronics\LPKF CircuitPro 1.5\Example Data\
UseCase_FlexiRigidPCB”.
Tip

 Importing data
1. Click on File > Import…
➨ The following dialog is displayed:
Fig. 192: Import

2. Select the file “Tutor_Starrflex.cam”.

3. Click on [OK].
➨ The data are displayed in the CAM view:

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Fig. 193: CAM

view

The modified template with imported .cam file now contains the following:data:
Material used Layer Function

FR4 CuttingInside Cutout for flexible section

FR4 CuttingLaminat+Core Slots for registration system of the

LPKF MultiPress S

FR4 CuttingLaminat Cutout for fiducials

Prepreg CuttingInside Cutout for flexible section

Prepreg CuttingLaminat Cutout for fiducials

Flexible BottomLayer Insulation

material

Flexible Fiducial Fiducials for aligning the individual

material layers for bonding

Flexible CuttingLaminat+Core Slots for registration system of the

material LPKF MultiPress S

Bonded FR4 BoardOutline Contour routing of the PCB

and flexible
material

Due to the selected template “4Layer_ProConduct_MultiPressS.cbf”, the job

contains production phases that are not needed for processing this tutorial's
PCB. These can be deleted in the “toolpath” pane before processing.

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 Deleting unnecessary production phases

1. Click on the “Toolpath” pane.
Fig. 194:
“Toolpath” pane

2. Delete the following phases in the “toolpath” pane:

• MillingTextLayer3 through to MillingTextBottom
• MillingPocketBottom through to MarkingDrills
• DismountMaterial3 through to ProcessProConduct
• ReadTopography through to Dispense
3. Select the desired phase.
4. Press the right mouse button in order to open the context menu.
5. Select “Delete” in the context menu.
➨ The selected phase is deleted.
6. Repeat steps 3 to 5 for all other production phases to be deleted.
 The unnecessary production phases are deleted.

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 Assigning imported data to production phases

Some layers of the imported data need to be assigned to a production phase.
The generated toolpaths are thus assigned to a specific process step.
1. Click on the “Layer” pane.
2. Select the row of the desired layer:
Fig. 195: “Layers”
pane

3. In the layer row, click on the arrow in the “Phase” column.

➨ The phase selection list is displayed:
Fig. 196: Phase
selection list

4. Assign the phase according to the following table:

Layer Phase
CuttingLaminat DrillingUnplated
CuttingInside ContourRouting

 The data are assigned to production phases.

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In this tutorial, the various physical layers are processed only on one side and
are not turned over during processing (no “FlipMaterial” phases).

As this tutorial uses a multi-layer template, some phases can

contain Top-side data per default, other phases can contain
Note Bottom-side data.
Ensure that the toolpaths of all production phases of this
tutorial are on the same side, e.g. the Bottom side, so that the
physical layers can be aligned correctly in the later process
stages. You can check this as follows:
1. Click on the “Toolpath” pane.
2. Click on the desired phase using the right mouse button.
➨  The context menu is displayed.
3. Click on “Edit” in the context menu.
 The “Edit” dialog is displayed. If the phase contains
toolpaths, the check box “The data are mirrored” must be
checked.
4. Check the check box “The data are mirrored” if the phase
contains toolpaths.
5. Click on [Apply].
6. Click on [Close].

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6.4 Processing the individual physical layers

The imported .cam file contains the data for producing the whole flexi-rigid PCB
but these are needed at different stages of the production process.
Creating the toolpaths should be done separately for each production stage.
Thus, the data needed for each production stage can be selected
correspondingly for generating the toolpaths.
Processing the individual physical layers is divided into three sections:
i. Processing the flexible material
ii. Processing the FR4 material
iii. Processing the prepreg material
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6.4.1 Drilling and milling the flexible material

In this section, the flexible material of the flexi-rigid PCB is drilled and milled.
The following steps are necessary for drilling and milling the flexible material:
i. Creating toolpaths
ii. Loading the tool magazine and assigning tools to holder positions
iii. Starting the processing

This tutorial uses a 0.15-mm-thick flexible polyimide material

with an 18-µm-thick copper layer.
Note

Creating toolpaths

1. Click on Toolpath > Technology dialog…

➨ The following dialog is displayed:
Fig. 197:
Technology
Dialog

In the technology dialog, the settings for generating toolpaths

can be modified by clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.

2. Click on [Show Details] in the “Insulate” section.

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➨ The details for insulation are displayed.

Fig. 198:
Insulation details

3. Select the layer “BottomLayer” in the “Source” selection list.

4. Click on [Hide details].
➨ The details are hidden.
5. Click on [Show Details] next to “Fiducials”.
➨ The details for fiducials are displayed.
Fig. 199:
Fiducials - details

6. Select the “Fiducial” layer in the “Source” selection list.

7. Click on [Hide details].
➨ The details are hidden.
8. Deactivate the following functions by clicking on the corresponding check
marks:
• Contour Routing
• Drilling
• Milling pockets
9. Click on [Start].
➨ The toolpaths are created and the computation results are displayed..
 The toolpaths are created.

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Loading the tool magazine and assigning tools to holder positions

This section is only relevant, if you use a ProtoMat with

automatic tool change (S63 or S103).
Note

1. Click on Edit > Tool magazine…

➨ The following dialog is displayed:
Fig. 200: Tool
magazine

➨ The tools required for the job are displayed. Tools required for the job that
are missing are marked by a red “X”.
2. Insert the required tools into the tool holders of the machine:
Fig. 201: Inserting
a tool

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3. Assign the tools to the corresponding positions in the dialog.

➨ The tool holders of the machine are loaded:
Fig. 202: Loaded
tool holder

 The tools are inserted into the tool holders and assigned accordingly.

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Starting the processing

1. Click on Machining > Process all.

Fig. 203:
Machining > Pro-
cess all

Make sure that <Process All>

is selected in the combo box,
Note so that all phases are
executed.
Instead of processing all
phases automatically, you can process the phases individually.
In the combo box select the desired phase and click on the
“Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

Phase “MountMaterial”
1. Mount the flexible material onto the processing area of the machine.
2. Fasten the base material onto the table top using the adhesive tape.
3. Click on [OK].

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Phase “Material Settings”

➨ The following dialog is displayed:
Fig. 204: Material
Settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Enter “18” µm into the field \Copper Thickness\.

3. Enter ”0.15” mm into the field \Material Thickness\.
4. Define the processing area:
a) Move the “Material Settings“ dialog off to the side.
b) Click on the position in the machining view that represents the right
corner of your material:

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Fig. 205: Defining

the right corner

/1/ Click on machining area /2/ Job

➨ The machine head moves to this position.

c) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 206: Click on
the icon

➨ The machining area is adjusted.

d) Click on the position in the machining view that represents the left
corner of your material:

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Fig. 207: Defining

the left corner

➨ The machine head moves to this position.

e) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 208: Defined
processing area

/1/ Defined processing area

➨ The processing area has been fit to the material.

5. Click on [Continue].
 The material settings were entered.

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Phase “Placement”
In this phase, the job can be placed arbitrarily on the base material, be rotated
and/or be multiplied if necessary.

At this point, the whole circuit board design including the

template and the toolpaths possibly contained in the template
Note are moved.
If only the design is to be moved within the template, you have to
use the menu item Modify > Transform….

➨ Following dialog is displayed:

Fig. 209:
Placement

1. Click on the job and drag it to the desired position using the mouse.
Or
1. Enter the new position in the dialog.
2. If desired, rotate the job data by entering a rotation angle.
3. If desired, multiply the job data by entering the number of copies and
spacing values in X and Y direction in the corresponding fields (Step and
Repeat section).

Phase “DrillFiducial”
➨ The Spiral Drill 1.5 mm is picked up to drill the fiducials.

If the spindle motor has not run before, a 2-minute warm-up

phase is started.
Note

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Phase “PrepareCore”
➨ The slots for registration system of the LPKF MultiPress S are drilled.

Phase “MillingBottom”
➨ The flexible material is milled.

Phase “Board Production Finished”

➨ A message informs you that the processing is finished.
 The milling and drilling of the flexible material is finished.
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6.4.2 Processing the FR4 material

In this section, the FR4 material of the flexi-reigid PCB is processed.

The following steps are necessary in this section:
i. Deleting toolpaths
ii. Creating toolpaths
iii. Loading the tool magazine and assigning tools to holder positions
iv. Starting the processing

This tutorial uses FR4 material with an 1 mm-thick copper layer.

Note

Deleting toolpaths

The toolpaths that were generated in the previous section of this tutorial for
insulation and drilling the fiducials have to be deleted. They are not needed for
processing the FR4 material.
1. Click on the “Toolpath” pane.
2. Click on the plus symbol next to phases “DrillFiducial” and “MillingBottom”.
➨ The toolpaths of the phases are displayed.
The following toolpaths have to be deleted:
Phase Toolpath
DrillFiducial Fiducials_Fiducial_Spiral Drill 1.5 mm
Insulate_BottomLayer_Universal Cutter 0.2 mm
MillingBottom
Insulate_BottomLayer_Universal Cutter 0.2 mm_1

3. Select the desired toolpath.

4. Press the right mouse button in order to open the context menu.
5. Select “Delete” in the context menu.
➨ The selected toolpaths are deleted.
6. Repeat steps 3 to 5 for all other toolpaths to be deleted.

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Creating toolpaths

1. Click on Toolpath > Technology dialog…

➨ The following dialog is displayed:
Fig. 210:
Technology
Dialog

In the technology dialog, the settings for generating toolpaths

can be modified by clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.

2. Click on the left arrow icon in the “Contour Routing” section until the “Basic”
contour routing method is displayed.
3. Click on [Show details].
➨ The details for contour routing are displayed:
Fig. 211: Contour
routing details

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4. Select the layer “CuttingInside” in the “Source” selection list.

5. Activate the {Inside} radio button.
6. Click on [Hide details].
➨ The details are hidden.
7. Click on [Show Details] next to “Drills”.
➨ The details are displayed:
Fig. 212: Drills
details

8. Select the layer “CuttingLaminat” in the “Source” selection list.

9. Deactivate the option “Create marking drills”.
10. Click on [Hide details].
➨ The details are hidden.
11. Deactivate the following functions by clicking on the corresponding check
marks:
• Insulate
• Drilling fiducials
• Pockets

12. Click on [Start].

➨ The toolpaths are created and the computation results are displayed..
 The toolpaths are created.

© 2012 LPKF AG HB V1.1/Mai-12 211

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Loading the tool magazine and assigning tools to holder positions

This section is only relevant, if you use a ProtoMat with

automatic tool change (S63 or S103).
Note

1. Click on Edit > Tool magazine…

➨ The following dialog is displayed:
Fig. 213: Tool
magazine

➨ The tools required for the job are displayed. Tools required for the job that
are missing are marked by a red “X”.
2. Insert the required tools into the tool holders of the machine:
Fig. 214: Inserting
a tool

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3. Assign the tools to the corresponding positions in the dialog.

➨ The tool holders of the machine are loaded:
Fig. 215: Loaded
tool holder

 The tools are inserted into the tool holders and assigned accordingly.

© 2012 LPKF AG HB V1.1/Mai-12 213

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Starting the processing

1. Click on Machining > Process all.

Fig. 216:
Machining > Pro-
cess all

Make sure that <Process

All> is selected in the
Note combo box, so that all
phases are executed.
Instead of processing all phases automatically, you can
process the phases individually. In the combo box select the
desired phase and click on the “Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

Phase “MountMaterial”
1. Mount the base material onto the processing area of the machine.
2. Fasten the material to the processing area using adhesive tape.
3. Click on [OK].

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Phase “Material Settings”

➨ The following dialog is displayed:
Fig. 217: Material
Settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Enter “18” µm into the field \Copper Thickness\.

3. Enter ”0.15” mm into the field \Material Thickness\.
4. Define the processing area:
a) Move the “Material Settings“ dialog off to the side.
b) Click on the position in the machining view that represents the right
corner of your material:

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Fig. 218: Defining

the right corner

/1/ Click on machining area /2/ Job

➨ The machine head moves to this position.

c) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 219: Click on
the icon

➨ The machining area is adjusted.

d) Click on the position in the machining view that represents the left
corner of your material:

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Fig. 220: Defining

the left corner

➨ The machine head moves to this position.

e) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 221: Defined
processing area

/1/ Defined processing area

➨ The processing area has been fit to the material.

5. Click on [Continue].
 The material settings were entered.

© 2012 LPKF AG HB V1.1/Mai-12 217

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Phase “Placement”
The job cannot be placed again at this stage as the position has already been
defined by the flexible material in the previous steps.
1. Confirm the current placement by clicking on [OK].

Phase “PrepareCore”
➨ The slots for the registration system of the LPKF MultiPress S are drilled.

Phase “DrillingUnplated”
➨ The cutouts for aligning the prepreg for bonding are drilled.

Phase “ContourRouting”
➨ The cutout for the flexible section is cut out.

Phase “Board Production finished”

➨ A message informs you that the processing is finished.
 Processing of the FR4 material is finished.
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6.4.3 Processing the prepreg material

This section of the tutorial is on processing the prepreg material of the flexi-rigid
PCB.
The following steps are necessary for processing the prepreg material:
i. Deleting toolpaths
ii. Enlarging the cutouts around the fiducials
iii. Creating toolpaths
iv. Loading the tool magazine and assigning tools to holder positions
v. Starting the processing

This tutorial uses a 100 mm thick prepreg material

Note

Deleting toolpaths

The toolpaths for processing the FR4 material have to be deleted as they are
not necessary for processing the prepreg material or have to be re-computed.

 Deleting toolpaths
1. Click on the “Toolpath” pane.
2. Click on the plus symbol next to phases “PrepareCore”, “DrillingUnplated”,
and “ContourRouting”.
➨ The toolpaths of the phases are displayed.
The following toolpaths have to be deleted:
Phase Toolpath
PrepareCore_Contour router 2 mm
PrepareCore
PrepareCore_Spiral Drill 2 mm
Drills_CuttingLaminat_Contour router 2 mm
DrillingUnplated
Drills_CuttingLaminat_Spiral Drill 2 mm
ContourRouting_CuttingInside_Contour router 2 mm
ContourRouting
ContourRouting_CuttingInside_Spiral Drill 2 mm

3. Select the desired toolpath.

4. Press the right mouse button in order to open the context menu.
5. Select “Delete” in the context menu.
➨ The selected toolpaths are deleted.
6. Repeat steps 3 to 5 for all other toolpaths to be deleted.
 The toolpaths are deleted.

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Enlarging the cutouts around the fiducials

To enable recognising the holes in the flexible material for contour routing the
PCB, the cutouts around the fiducials have to be enlarged in the prepreg
material. This prevents the prepreg material from creeping into the fiducials
during the bonding process.

 Enlarging the cutouts around the fiducials

1. Select the cutouts around the fiducials:
Fig. 222:
Selecting a
cutout around a
fiducial

2. Click on the “Properties” pane.

3. Check the properties of the circular cutout around the fiducial:
Fig. 223:
Properties of the
cutout

The “Properties” pane displays the following information on the cutout:

• Aperture D12 is used to create the cutout.
• Aperture D12 is in aperture list “[Link]”.
As the cutout around the fiducials is to be enlarged, check the diameter of the
aperture next.

4. Click on the “Geometry” pane.

5. Click on the plus symbol next to the aperture lists.

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➨ The aperture lists are displayed:

Fig. 224: Aperture
lists

6. Click on the plus symbol next to aperture list “[Link]”.

➨ The apertures contained are listed. Among them, you find aperture D12 that
is used for creating the cutout around the fiducial.
7. Select aperture D12.
8. Click on the “Properties” pane again.
➨ The properties of aperture D12 are displayed:
Fig. 225: Aperture
size

➨ The name of the aperture is displayed in the “General” section.

➨ The diameter of the aperture is displayed in the “Dimensions” section. The
diameter is 4 mm.

© 2012 LPKF AG HB V1.1/Mai-12 221

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9. Click on the aperture size in order to modify it:

Fig. 226:
Modifying the
aperture size

10. Overwrite the “4” with an “8”.

➨ The aperture size is changed from 4 mm to 8 mm diameter.
 The cutouts around the fiducials are enlarged.

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Creating toolpaths

 Creating toolpaths
1. Click on Toolpath > Technology dialog…
➨ The following dialog is displayed:
Fig. 227:
Technology
Dialog

In the technology dialog, the settings for generating toolpaths

can be modified by clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.

2. Click on the left arrow icon in the “Contour Routing” section until the “Basic”
contour routing method is displayed.
3. Click on [Show details].
➨ The details for contour routing are displayed:

© 2012 LPKF AG HB V1.1/Mai-12 223

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Fig. 228: Contour

routing details

4. Select the layer “CuttingInside” in the “Source” selection list.

5. Activate the {Outside} radio button.
6. Select the “Contour router 2 mm” tool.

Using the outside contour in combination with the 2-mm tool

enlarges the cutout by 2 mm compared with the FR4 material.
Note This is intentional as the prepreg material "creeps" during the
bonding process.

7. Click on [Hide details].

➨ The details are hidden.
8. Click on [Show Details] next to “Drills”.
➨ The details are displayed:
Fig. 229: Drills
details

9. Select the layer “CuttingLaminat” in the “Source” selection list.

10. Deactivate the option “Create marking drills”.
11. Click on [Hide details].
➨ The details are hidden.

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12. Deactivate the following functions by clicking on the corresponding check

marks:
• Insulate
• Fiducials
• Pockets

13. Click on [Start].

➨ The toolpaths are created and the computation results are displayed..
 The toolpaths are created.

© 2012 LPKF AG HB V1.1/Mai-12 225

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Loading the tool magazine and assigning tools to holder positions

This section is only relevant, if you use a ProtoMat with

automatic tool change (S63 or S103).
Note

1. Click on Edit > Tool magazine…

➨ The following dialog is displayed:
Fig. 230: Tool
magazine

➨ The tools required for the job are displayed. Tools required for the job that
are missing are marked by a red “X”.
2. Insert the required tools into the tool holders of the machine:
Fig. 231: Inserting
a tool

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3. Assign the tools to the corresponding positions in the dialog.

➨ The tool holders of the machine are loaded:
Fig. 232: Loaded
tool holder

 The tools are inserted into the tool holders and assigned accordingly.

© 2012 LPKF AG HB V1.1/Mai-12 227

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Starting the processing

1. Click on Machining > Process all.

Fig. 233:
Machining > Proc
ess all

Make sure that <Process All>

is selected in the combo box,
Note so that all phases are
executed.
Instead of processing all
phases automatically, you can process the phases individually.
In the combo box select the desired phase and click on the
“Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

Phase “MountMaterial”
1. Mount the base material onto the processing area of the machine.
2. Fasten the material to the processing area using adhesive tape.
3. Click on [OK].

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Phase “Material Settings”

➨ The following dialog is displayed:
Fig. 234: Material
Settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Enter “18” µm into the field \Copper Thickness\.

3. Enter ”0.15” mm into the field \Material Thickness\.
4. Define the processing area:
a) Move the “Material Settings“ dialog off to the side.
b) Click on the position in the machining view that represents the right
corner of your material:

© 2012 LPKF AG HB V1.1/Mai-12 229

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Fig. 235: Defining

the right corner

/1/ Click on machining area /2/ Job

➨ The machine head moves to this position.

c) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 236: Click on
the icon

➨ The machining area is adjusted.

d) Click on the position in the machining view that represents the left
corner of your material:

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Fig. 237: Defining

the left corner

➨ The machine head moves to this position.

e) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 238: Defined
processing area

/1/ Defined processing area

➨ The processing area has been fit to the material.

5. Click on [Continue].
 The material settings were entered.

© 2012 LPKF AG HB V1.1/Mai-12 231

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Phase “Placement”
The job cannot be placed again at this stage as the position has already been
defined by the flexible material in the previous steps.
1. Confirm the current placement by clicking on [OK].

Phase “DrillingUnplated”
➨ The cutouts for aligning the prepreg for bonding are drilled.

Phase “ContourRouting”
➨ The cutout for the flexible section is cut out.

Phase “Board Production Finished”

➨ A message informs you that the processing is finished.
 Processing of the prepreg material is finished.
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6.5 Bonding the individual physical layers

The flexible material is bonded to the rigid FR4 material using the prepreg
material.

We recommend the LPKF MultiPress S system for this process

step.
Note

 Bonding the physical layers

1. Stack the physical layers produced in the previous steps in the following
order:

I. Flexible material
 Ensure that the milled side faces downwards!

II. Prepreg material

 Align the prepreg material to the flexible material. Use the fiducials in
the flexible material as reference.

III. FR4 material

 Align the FR4 material to the flexible material. Use the reference
hole system as reference.

Insert a strip of corresponding size into the cutout of the FR4

material (e.g. the material previously cut out). This supports the
Note flexible material while bonding and achieves better results.

2. Bond the materials with constant temperature and constant pressure.

 The physical layers are bonded.

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6.6 Contour routing the bonded PCB

The following steps are necessary for contour routing the bonded PCB:
i. Inserting a production phase
ii. Creating toolpaths
iii. Loading the tool magazine and assigning tools to holder positions
iv. Starting the processing

Inserting a production phase

An additional production phase for reading the fiducials has to be inserted

before the toolpaths for contour routing the PCB are generated.

The cutouts in the prepreg and FR4 material enable to read the
fiducials in the flexible material from the Top side (the flexible
Note material facing downwards).

 Inserting a production phase

Ensure that no existing production phase is selected in the

“Toolpath” pane, otherwise no new production phase can be
Note created!

1. Click on Machining > Production phase…

➨ The following dialog is displayed:
Fig. 239: Creating
a new phase

2. Enter the name “ReadFiducials” for the new phase.

3. Select the processing step “Read fiducials top”.

You can enter this processing step manually if it does not exist.

Note

4. Enter “8” for processing order.

5. Activate the check box “The phase contains toolpath data”.
6. Click on [Apply].

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➨ The new phase ReadFiducials is inserted before the ContourRouting phase

in order to read the fiducials from the Top side of the PCB.

You can check in the “Phases” section of the “Toolpath” pane

whether the new phase has been inserted.
Note

 The new production phase has been inserted.

Deleting toolpaths

All toolpaths previously generated for processing the individual physical layers
have to be deleted. They are not needed for routing the the PCB.

 Deleting toolpaths
1. Click on the “Toolpath” pane.
2. Click on the plus symbol next to “Phases”.
➨ The phases are displayed.

The individual phases are marked with a plus symbol if they

contain toolpaths.
Note

3. Click on the plus symbols of all phases in order to display all toolpaths.
➨ The toolpaths are displayed.
4. Select a toolpath.
5. Press the right mouse button in order to open the context menu.
6. Select “Delete” in the context menu.
➨ The selected toolpaths are deleted.
7. Repeat steps 4 to 6 for all other toolpaths.
 The toolpaths are deleted.

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Creating toolpaths

The PCB has to be put on the processing area of the ProtoMat machine with
the flexible material facing downwards to enable contour routing. The PCB is
thus processed from the Top side.

Check in the “Toolpath” pane whether the “ContourRouting”

phase is processed on the Top side.
Note Follow these steps:
1. Click on the desired phase using the right mouse button.
2. Click on “Edit” in the context menu.
3. Make sure that the check box “The data are mirrored” is
unchecked. If not, uncheck the mark.

 Creating toolpaths
1. Click on Toolpath > Technology dialog…
➨ The following dialog is displayed:
Fig. 240:
Technology
Dialog

In the technology dialog, the settings for generating toolpaths

can be modified by clicking on the [Show details] buttons.
Note For a detailed description of the individual functions of the
technology dialog see the corresponding chapter in the
CircuitPro compendium.

2. Click on the left arrow icon in the “Contour Routing” section until the
“Horizontal gaps” contour routing method is displayed.
3. Click on [Show details].

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➨ The details for contour routing are displayed:

Fig. 241: Contour
routing details

4. Select the “BoardOutline” layer in the “Source” selection list.

5. Activate the {Outside} radio button if it is not active.
6. Click on [Hide details].
➨ The details are hidden.
7. Click on [Show Details] next to “Fiducials”.
➨ The details for fiducials are displayed.
Fig. 242:
Fiducials - details

8. Select the “Fiducial” layer in the “Source” selection list.

9. Click on [Hide details].
➨ The details are hidden.
10. Deactivate the following functions by clicking on the corresponding check
marks:
• Insulate
• Drills
• Pockets

11. Click on [Start].

➨ The toolpaths are created and the computation results are displayed.
 The toolpaths are created.

© 2012 LPKF AG HB V1.1/Mai-12 237

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Loading the tool magazine and assigning tools to holder positions

This section is only relevant, if you use a ProtoMat with

automatic tool change (S63 or S103).
Note

1. Click on Edit > Tool magazine…

➨ The following dialog is displayed:
Fig. 243: Tool
magazine

➨ The tools required for the job are displayed. Tools required for the job that
are missing are marked by a red “X”.
2. Insert the required tools into the tool holders of the machine:
Fig. 244: Inserting
a tool

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3. Assign the tools to the corresponding positions in the dialog.

➨ The tool holders of the machine are loaded:
Fig. 245: Loaded
tool holder

 The tools are inserted into the tool holders and assigned accordingly.

© 2012 LPKF AG HB V1.1/Mai-12 239

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Starting the processing

1. Click on Machining > Process all.

Fig. 246:
Machining > Proc
ess all

Make sure that <Process All>

is selected in the combo box,
Note so that all phases are
executed.
Instead of processing all
phases automatically, you can process the phases individually.
In the combo box select the desired phase and click on the
“Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

Once you have started the processing, the ProtoMat machine executes the job
in individual phases. The phases are displayed in messages:

➨ Phase “MountMaterial”
1. Mount the PCB onto the machine's processing area with the flexible
material facing down (Top side up).

Ensure that the positioning holes are at the right font corner.

Note

2. Fasten the material to the processing area using adhesive tape.

3. Click on [OK].

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Phase “Material Settings”

➨ The following dialog is displayed:
Fig. 247: Material
Settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Enter “18” µm into the field \Copper Thickness\.

3. Enter ”0.15” mm into the field \Material Thickness\.
4. Define the processing area:
a) Move the “Material Settings“ dialog off to the side.
b) Click on the position in the machining view that represents the right
corner of your material:

© 2012 LPKF AG HB V1.1/Mai-12 241

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Fig. 248: Defining

the right corner

/1/ Click on machining area /2/ Job

➨ The machine head moves to this position.

c) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 249: Click on
the icon

➨ The machining area is adjusted.

d) Click on the position in the machining view that represents the left
corner of your material:

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Fig. 250: Defining

the left corner

➨ The machine head moves to this position.

e) Click on the corresponding icon in the “Material Settings” dialog:
Fig. 251: Defined
processing area

/1/ Defined processing area

➨ The processing area has been fit to the material.

5. Click on [Continue].
 The material settings were entered.

Phase “Placement”
The job cannot be placed again at this stage as the position has already been
defined by the flexible material in the previous steps.
1. Confirm the current placement by clicking on [OK].

© 2012 LPKF AG HB V1.1/Mai-12 243

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Phase “Read Fiducial”

➨ The camera searches for the fiducials in the flexible material.

If the fiducial search is performed for the first time (after having
started CircuitPro) the camera is performing an autofocus five
Note times.
Afterwards the following message is displayed which prompts
you to confirm the focus height:

If the material is placed at nearly the same position as before, the positions of
the fiducials are recognised automatically.
The following dialog is displayed if the fiducials have not been recognized
automatically:
Fig. 252:
Alignment

1. Enlarge the search area by increasing the value of the field \Search Area
Length\.
2. Restart the search by clicking on [Start].
3. Repeat steps one and two if necessary.

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Enlarging the search spiral increases the time required for

searching the fiducials. Try to put the material at the same
Note position as before when turning the material over (if this is not
predetermined by reference pins).

Phase “ContourRouting”

➨ The bonded PCB is cut out.

Phase “Board Production Finished”

➨ A message informs you that the processing is finished.

 The bonded PCB has been cut out.

Creating the flexi-rigid PCB is finished successfully.

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Basics
CircuitPro: Basic CAM
operations
 CircuitPro: Basic CAM
CircuitPro 1.5 1
operations

1 CircuitPro: Basic CAM operations

This tutorial shows you how to process basic CAM operations in CircuitPro.
The following steps are necessary to complete the tutorial successfully:
i. Executing the Process Planning Wizard
ii. Importing the Gerber files
iii. Importing the drill file
iv. Establishing rubout boundaries
v. Inserting fiducials
vi. Creating toolpaths

You are able to perform these steps by using the virtual

machine. This enables you to work without a real machine. Click
on Machining > Connect > Virtual.
Tip

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1.1 Executing Process planning wizard

CircuitPro must be running.

Note

 Executing the Process planning wizard

1. Click the icon “Process planning Wizard” on the toolbar:
Fig. 253: Icon
Process Planning
Wizard

Or
1. Click on Wizards > Process planning wizard…
➨ The process planning wizard starts:
Fig. 254: Process
planning wizard

2. Select the type of process.

3. Click on [Next].

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Fig. 255: Process

planning wizard

4. Select the number of copper layers you are going to use.

5. Click on [Next].
Fig. 256:
Selecting the
substrate

6. Select which substrate you are going to use.

The options will be presented based on what you told the

system in the Equipment configuration wizard during in the initial
Note installation.
You can start the Equipment configuration wizard any time to
customize the available systems.

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7. Click on [Next].
Fig. 257: Through
hole plating
equipment

8. Select which through-hole plating method will be used for PCB production.
9. Click on [Next].
10. Select if you are using any surface finishing (silkscreen or solder mask):
Fig. 258: Surface
finishing

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11. Click on [Next].

Fig. 259:
Summary

12. Verify the configuration and click on [Done].

 The Process planning wizard is finished.
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1.2 Importing the Gerber files

The LPKF tutor data are stored in “My Document\LPKF Laser &
Electronics\ LPKF CircuitPro 1.5\Example Data”.

Tip

 Importing the Gerber files

1. Click on the icon “Import” on the toolbar:
Fig. 260: Icon
import

Or
1. Click on File > Import…
➨ The following dialog is displayed:

Fig. 261: Import

dialog

2. Select all required data according to the table below.

3. Click on [Open].
4. Assign the imported files to their corresponding layers according to the
following table:

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File Layer
.BOA Board Outline
.BOT Bottom Layer
.SMB Solder Mask Bottom
.SMT Solder Mask Top
.SPT Solder Paste Top
.TOP Top Layer

5. Therefore, click on the column “Layer/Template” and choose the

corresponding layer in the drop down list:
Fig. 262:
Assigned layers

Instead of manually assigning the individual files to the layers,

you can activate the options “Use layer name” and “Apply to all
Note Gerber files”.
If a file contains layer names these are automatically assigned.
Please note that this is only available for Gerber files. All other
files require assigning the layers manually via the drop-down
menu.

6. Click on [OK].
➨ The data are displayed in the CAM view.
 The Gerber files were imported.

For more information about importing Gerber files, please refer

to the tutorial “Processing Gerber and Excellon files”.
Note
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1.3 Importing the drill file

This step can be completed at the same time as importing the

Gerber files.
Note

 Importing the drill file

1. Click the icon “Import” on the toolbar:
Fig. 263: Icon
import

Or
1. Click on File > Import….
➨ The following dialog is displayed:

Fig. 264: Import

dialog

2. Select the drill file “[Link]”.

3. Click on [Open].

In this document, the DRL file is the Excellon drill file. This may
also be a text file, (.txt. extension) depending on your layout
Note package.

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4. Change the layer/template column to DrillPlated or DrillUnplated:

Fig. 265:
Changing the
layer column

This depends on whether you are using a through-hole plating

system:
Note  If so, use the layer DrillPlated.
 If not, use the layer DrillUnplated.
This will also affect when the holes are drilled:
 DrillPlated is drilled on the bottom side of the board.
 DrillUnplated is drilled from the top side of the board.
If this is a single sided board, use DrillUnplated.

In the graphic display, the correct view of the drills, you should see the different
sized apertures and the correct location of your drills.
 If the display is correct, continue with step 6.
 If the display is not correct, continue with step 5.

5. Check the settings in the tab “General”. If necessary change the settings
until your design is displayed correctly.

For details about the settings, please refer to the tutorial

“Processing Gerber and Excellon files”.
Note

Fig. 266: Display

correct

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6. Click on [OK].
➨ The design is now displayed on screen:

Fig. 267: Design

displayed in CAM
view

 The drill file was imported.

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1.4 Inserting a rubout area (optional)

You can remove excess copper if desired. Therefore you have to insert rubout
areas.
 Inserting a rubout area
1. Click on Insert > Rubout area > Rubout all layers…:
Fig. 268: Rubout
all layers

➨ The following dialog is displayed:

Fig. 269: Create
rectangle

2. Move the “Create rectangle” dialog off to the side.

3. Single click on one corner of the board, or on the desired location.
4. Single click on the opposite corner of the board, or on the desired location.
5. Click on [Close].

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➨ The rubout area is created on your board:

Fig. 270: Rubout
area

If you wish to create a rectangle by a specific size, you may

use the coordinate system in the rectangle window.
Note

 The rubout area was inserted.

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1.5 Inserting fiducials (optional)

For aligning the top and bottom sides of the circuit board you need fiducials.
Fiducials are optical marks on the surface of the circuit board with a defined
diameter of 1.5 mm.
The fiducials are drilled into the board and are recognised by the cameras of the
ProtoMat systems.

For working with fiducials you need the camera system for
fiducial recognition.
Note

Ideally you insert four fiducials for aligning the top and the
bottom sides.
You are also able to work with two fiducials. In this case you
Tip have to insert them diagonally into the layout.

 Inserting fiducials
1. Click on Insert > Fiducial > Fiducial:
Fig. 271: Insert >
Fiducial

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➨ The following dialog is displayed:

Fig. 272: Create
circle

2. Move the “Create circle” dialog off to the side.

3. Left click where you want to place each fiducial hole:
Fig. 273: Example
for placing
fiducials

Best results are just off each corner of the board.

Note

4. Click on [Close].
 The fiducials were inserted.

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1.6 Creating toolpaths

The Technology Dialog is used for creating toolpaths in CircuitPro.

There are various options how to create toolpaths etc. For more
detailed information please refer to the chapter “Technology
Note Dialog” in the compendium.

You will pass through following steps:

i. Selecting the insulation type
ii. Selecting the contour routing type
iii. Creating the toolpaths

1. Click the icon “Technology Dialog” on the toolbar:

Fig. 274: Icon
Technology
Dialog

Or
1. Click on Toolpath > Technology Dialog…
➨ The following dialog is displayed:
Fig. 275:
Technology
Dialog

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 Selecting the insulation type.

1. Click on the right/left arrow keys in the section “Insulation” to choose the
insulation type you desire.
2. Click on [Show Details] for more information about the insulation type.

The following insulation types are available:

a) Basic insulation
 The method “Basic insulation” is isolating the traced pads from the copper
only.
Fig. 276: Basic
insulation

b) Basic insulation, pads double

 The method “Basic insulation, double pads” isolates the traces and double
isolates the pads.
Fig. 277: Basic
insulation, pads
double

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c) Partial rubout
 The method “Partial rubout” isolates the traces and pads and removes any
excess copper within the rubout boundary inside of your board.
Fig. 278: Partial
rubout

d) Complete rubout
 The method “Complete rubout” isolates the traces and pads along with
removing the excess copper from the entire board.
Fig. 279:
Complete rubout

After you have chosen the insulation method, continue with step 3.
3. Select the milling tools that you wish to use in the available tools drop-down
menu by checking/unchecking the tool name.

A recommended combination of tools is: Universal Cutter

0.2 mm, the End Mill 0.4 mm and the End Mill 1.0 mm.
Note For RF boards use the 0.25 mm End Mill instead of the
Universal Cutter.
If your designs have smaller spacing requirements than 8 mils,
use the End Mill 0.15 mm (6 mil), the End Mill 0.1 mm (4 mil) or
the Micro Cutter 0.1 mm (4 mil).
If milling a RF board, change the primary tool!

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4. Click on [Hide details].

 The insulation type has been selected.

 Selecting the contour routing type

1. Click on the right/left arrow keys in the section “Contour Routing” to choose
the option you would like to cut the board out.
2. Click on [Show Details] for more information about the contour routing
types.

The following contour routing types are available:

a) Basic
 The method “Basic” routes along the outside of your board without gaps.
Fig. 280: Basic
routing

b) Horizontal gaps
 The method “Horizontal gaps” routes along the outside of your board with
gaps on top and bottom side.
Fig. 281:
Horizontal gaps
routing

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c) Vertical gaps
 The method “Vertical gaps” routes along the outside of your board with gaps
on the left and right side.
Fig. 282: Vertical
gaps routing

d) Edge gaps
 The method “Edge gaps” routes along the outside of your board leaving tabs
in the center of each edge of the board.
Fig. 283: Edge
gaps routing

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e) Corner gap
 The method “Corner gap” routes along the outside of your board leaving tabs
in the corners.
Fig. 284: Corner
gap routing

f) Equidistant gaps
 The method “Equidistant gaps” routes along the outside of your board
leaving tabs at equal distance that you specify.
Fig. 285: Equidis-
tant gaps routing

After you have chosen the contour routing method, continue with step 3.
3. If desired, change the tool used during the contour routing by clicking on the
tool drop-down menu:
Fig. 286: Tool
drop-down menu

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4. Change the 2.0 mm contour router to the 1.0 mm contour router.

If your design is larger than 2x3 inches, the 2.0 mm Contour

Router is recommended.
Note If your design is smaller than 2x3 inches, the 1.0 mm Contour
Router is recommended.

The 1.0 mm Contour Router is also recommended if the board

outline is not a traditional rectangle. This helps minimize the risk
Note of a rounded corner.

 The contour routing type has been selected.

 Creating the toolpaths
After you have chosen your insulation method and your contour routing type,
you have to start to create the toolpaths.
1. Click on [Start].
➨ The software will now create all toolpaths and identify which drills shall be
used. When finished, you will get a report of which tools are used.
Fig. 287:
Computation
Results

2. Click on [Close], to close the report window.

 The toolpaths have been created.

Now your design is ready to be produced as a PCB. Continue

with the steps described in the tutorial “CircuitPro - Basic
Note machining operations”.
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 CircuitPro: Basic machining
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2 CircuitPro: Basic machining operations

This tutorial shows you how to process basic machining operations (ProtoMat S
series) in CircuitPro and is based on using a 2-sided template without Through-
Hole Plating. Although the document follows a certain set of steps, the steps
could vary in order depending on the template chosen by the user.
Therefore you have to perform following steps:
i. Switching to Machining view
ii. Loading the tool magazine
iii. Starting board production

CircuitPro must be running and the machine must be connected.

Note

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2.1 Switching to Machining view

To start the board production, you have to switch to machining view first.
1. Click on the tab “Machining view”:
Fig. 288: Tab
“Machining view”

➨ You will see your board on your screen:

Fig. 289:
Machining view

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2.2 Loading the tool magazine

In this step you will learn, how to load the tool magazine and assign the tools to
their tool holder positions.

This chapter is relevant, if you use a ProtoMat with automatic tool

change (S63 or S103).
Note

 Loading the tool magazine and assigning the tools to holder positions
1. Click on the icon “Tool magazine” on the toolbar:
Fig. 290: Icon
Tool magazine

Or
1. Click on Edit > Tool magazine…
➨ The following dialog is displayed:
Fig. 291: Tool
magazine

The required tools for producing the board are listed on the left of the screen
(see arrow).
2. Click on the drop-down menu in each individual tool position.

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➨ The list of available tools is shown:

Fig. 292: Tool list

3. Select one of the tools that are listed on the left in section “Required tools”.
4. Insert the chosen tool (in the dialog) physically into the corresponding tool
holder:
Fig. 293: Insert
tool into holder

5. Repeat this procedure until you have placed all required tools into the tool
holder of the machine.
➨ The tools you have placed are highlighted with a checkmark.
Fig. 294: Tool
magazine

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As you assign each tool to a tool holder, the corresponding tool

is highlighted with a checkmark. You will also notice that if you
Note have a tool loaded into the tool magazine and it is not required
for this design, there is no highlight like a checkmark or a cross.

6. Click on [OK].
➨ You will notice that the colors of the tool holders on the main layout screen
match the colored rings on the physical tools, as shown below:
Fig. 295: Colors
of the tool
holders

 The tool magazine is loaded and the tools are assigned to holder positions.
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2.3 Starting processing

This chapter describes the processing of the circuit board.
 Starting processing
1. Click on the icon “Process Planning wizard” on the toolbar:
Fig. 296: Icon
“Process
Planning wizard“

Or
1. Click on Machining > Process all.
Fig. 297:
Machining >
Process all

Make sure that <Process All>

is selected in the combo box,
Note so that all phases are
executed.
Instead of processing all phases automatically, you can
process the phases individually. In the combo box select the
desired phase and click on the “Start processing” button.
You can also start processing beginning with a specific phase.
Select the desired phase in the combo box and click on the
“ladder” button The selected phase and all following phases
are processed in the correct order.

After the production started, the machine will process following phases in order.
The phases are displayed via prompts.

Depending on which ProtoMat you use the following phases

could differ from the phases and messages displayed on your
Note screen. Please follow the instructions on your screen.
For machines with manual tool exchange you are regularly
asked to change the tool in the collet, for example.

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Phase “MountMaterial”
1. Place the base material onto the machine’s table top.
2. Fasten the base material onto the table top using the adhesive tape.

Phase “MaterialSettings”
➨ Following dialog is displayed:
Fig. 298: Material
settings

 Entering the material settings

1. Enter the correct values for the material used.

PCB is selected as default.

Note

2. Adapt the values of copper thickness and material thickness if necessary.

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3. Define the processing area:

a) Move the dialog „Material Settings“ off to the side.
b) Using your mouse in the machining view, click on the right corner of
your material:
Fig. 299: Right
corner

/1/ Click in the machining view /2/ Material

➨ The machine head moves to this position.

c) Now click on the corresponding button in the dialog “Material Settings“:
Fig. 300: Click on
button

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➨ The processing area is adapted.

d) Using your mouse in the machining view, click on the left corner of your
material:
Fig. 301: Left
corner

➨ The machine head moves to this position.

e) Now click on the corresponding button in the dialog “Material Settings“:
Fig. 302: Defined
processing area

/1/ Defined processing area

➨ The processing area was adapted to the material.

4. Click on [Continue].
 The material settings were entered.

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Phase “Placement”
In this phase, the job can be placed arbitrarily on the base material and be
multiplied if necessary.
➨ Following dialog is displayed:
Fig. 303:
Placement

1. Click on the job and drag it to the desired position using the mouse.
Or
3. Enter the new position in the dialog.
2. If desired, multiply the job data by entering the number of copies and
spacing values in X and Y direction in the corresponding fields (Step and
Repeat section).

If you wish to
create multiple
copies of your
Tip layout, enter in
section “Step and
Repeat” the
number of copies
for each axis.
Then click on
[OK].
The spacing between the copies is measured from the
respective outer edge of the adjacent layout.
LPKF recommends increasing this distance slightly to produce a
frame between the copies, as this makes it easier to cut out.

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Phase “DrillFiducial”
➨ The machine picks up the tool “Spiral Drill 1.5 mm” and drills the fiducials.

If the spindle motor has not been used before, the motor is
warmed up for 2 minutes.
Note

Phase “Marking Drills”

➨ The machine picks up the tool “Universal Cutter” and marks the positions
for the drill holes.

Phase “Drilling Unplated”

➨ The machine picks up the required tool and drills the holes.

This phase may use more than one tool.

Note

Phase “Milling Bottom”

➨ The machine picks up the required tool and mills the isolation tracks.

Phase “Flip Material”

1. Flip the material.

If you are using a ProtoMat S43, S63 or S103 flip the material
along the machine’s X-axis.
Note If you are using a ProtoMat E33 flip the material along the
machine’s Y-axis.

2. Confirm by clicking [OK].

The display in the machining view changes. The position of the

design is adjusted to the circuit board. The side of the circuit
Note board to be processed is now the “Top” side.

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Phase “Read Fiducials_Top”

S43, S63 and S103

If the fiducial search is performed for the first time (after having
started CircuitPro) the camera is performing an autofocus five
Note times.
Afterwards the following message is displayed which prompts
you to confirm the focus height:

➨ The camera moves to the positions of the fiducials and determines the
exact position.
The Top side is thus aligned to the Bottom side.
The following dialog is displayed if the fiducials have not been recognized
automatically:
Fig. 304:
Alignment

1. Enlarge the search area by increasing the value of the field \Search Area
Length\.
2. Start the search again.
3. Repeat above steps if necessary.

Enlarging the search spiral increases the time required for

searching the fiducials.
Note

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E33, S43 without camera

If no camera is available for processing the “Read Fiducials_Top” phase, the
Top side is aligned to the Bottom side using the reference pins. The “Read
Fiducials_Top” phase is not processed in this case.

Phase “Milling Top”

➨ The machine picks up the required tools and mills the isolation tracks on the
Top side.

Phase “Contour Routing”

➨ The machine picks up the required tools and drills and mills the outline of
the circuit board.

Phase “Board Production Finished”

➨ A message informs you that the production is finished.
 The production of the circuit board is finished.

If desired, continue with dispensing solder paste on your PCB.

Therefore please refer to the tutorial “Dispensing solder paste
Note using the ProtoMat S63 or S103”.

Subsequent to the board production you are able to label your

circuit board or apply solder resist. LPKF offers you various
systems such as the ProMask or ProLegend for these
Tip processes. Furthermore LPKF systems for applying solder
paste, for mounting components and for soldering circuit boards
are available. Do not hesitate to ask us.

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2 operations
CircuitPro 1.5

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Processing DXF files
in CircuitPro
 Processing DXF files in
CircuitPro 1.5 3
CircuitPro

3 Processing DXF files in CircuitPro

This tutorial shows you how to process DXF files in CircuitPro.
The following steps are necessary to complete the tutorial successfully:
i. Importing the DXF file
ii. Converting the DXF file

You are able to perform these steps by using the virtual

machine. This enables you to work without a real machine. Click
on Machining > Connect > Virtual.
Tip

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 Processing DXF files in
3 CircuitPro
CircuitPro 1.5

3.1 Importing the DXF file

CircuitPro must be running.

Note

The LPKF tutor data are stored in “My Document\LPKF Laser &
Electronics\ LPKF CircuitPro 1.5\Example Data\
UseCase_DXFFiles”.
Tip

 Importing the file

1. Click the icon “Import” on the toolbar:
Fig. 305: Icon
import

Or
1. Click on File > Import…
➨ The following dialog is displayed:

Fig. 306: Import

dialog

2. Select the file “Tutor_dxf.dxf”.

3. Click on [Open].
➨ The document’s information is shown in the table.
4. Change the layer/template column to “TopLayer”:

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CircuitPro

Fig. 307: Change

column

5. Select in the tab “General” the increment that the DXF file was originally
drawn in:
Fig. 308:
Selecting the
increment

The information given in the column “Size/Format” enables you

to check, if the actual size corresponds to the real size of your
design.
Tip If the size does not correspond to the real size, change the unit
in the tab “General”.

6. Click on [OK].
➨ The data is shown in the CAM view:

Fig. 309: CAM

view

 The file was imported.

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Please note that certain data of the DXF files could be on non-
visible layers.
Note When importing these files the corresponding layer is also non-
visible in CircuitPro.

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 Processing DXF files in
CircuitPro 1.5 3
CircuitPro

3.2 Converting the DXF file

Converting the DXF file includes the following steps:
• Defining the Board Outline
• Assigning the objects to the corresponding layers
• Converting the objects to polygons
• Converting the drilling holes

 Defining the Board Outline

You are able to highlight every single element of the board

outline by clicking and holding down the Shift-key.
After having highlighted all elements you can combine them to a
Tip closed path by using the functions “Convert to closed path”.

1. Click on the board outline:

Fig. 310: Board
outline selected

2. Press the right mouse button.

3. Select “Assign objects to layer”.

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 Processing DXF files in
3 CircuitPro
CircuitPro 1.5

4. Click on “BoardOutline”:
Fig. 311: Assign
objects to layer

➨ The color of the board outline changes.

 The board outline is defined.

 Assigning the objects to the corresponding layers

1. Highlight all traces that will go onto the top layer.

You can also single click on the traces. Hold the control key
down to select multiple items.

Tip

Fig. 312:
Highlighting the
traces

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 Processing DXF files in
CircuitPro 1.5 3
CircuitPro

2. Press the right mouse button.

3. Select “Assign objects to layer”.
4. Click on “TopLayer”:
Fig. 313: Assign
objects to layer

➨ The traces were assigned to the top layer.

5. Assign the drill holes to the layer “DrillUnplated”:

a) Highlight all drill holes.
b) Follow steps 2 and 3.
c) Click on “DrillUnplated”
➨ The drill holes were assigned to the layer “DrillUnplated”.
 The objects were assigned to the corresponding layers.

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CircuitPro 1.5

 Converting the objects to polygons

1. Single left click on the “TopLayer” in the pane “Layers”:
Fig. 314: Pane
“Layers”

2. Click on the icon “Select objects on layer” in the pane “Layers”:

Fig. 315: Select
objects on layer

3. Press the right mouse button.

4. In the context menu, select “Convert to polygon”:

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 Processing DXF files in
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CircuitPro

Fig. 316: Convert

to polygon

This will combine all segments and fill the object.

Note

 The objects were converted to polygons.

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 Processing DXF files in
3 CircuitPro
CircuitPro 1.5

 Converting the drill holes

1. Highlight all drill holes:
Fig. 317:
Highlighting the
drill holes

You can also single click on the drill holes. Hold the control key
down to select multiple items.

Tip

2. Click on Modify > Draw to flash:

 The drill holes were converted.

The .dxf file was successfully imported and converted. Now you
can insert rubout areas or/and fiducials before you start
processing your board. Please refer to the tutorial “Basic CAM
Tip operations” in this case.
If you want to start processing your board without inserting
rubout areas/fiducials, please refer to the tutorial “Basic
machining operations”.

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Processing Gerber
and Excellon files
 Processing Gerber and
CircuitPro 1.5 4
Excellon files

4 Processing Gerber and Excellon files

This tutorial shows you how to process Gerber and Excellon files in CircuitPro.
The following steps are necessary to complete the tutorial successfully:
i. Selecting Gerber and Excellon files
ii. Selecting the file format
iii. Selecting the desired target layer
iv. Setting/correcting size and format
v. Setting apertures and tools
vi. Using the layer name defined in the Gerber file

You can perform these steps by using the virtual machine. Thus,
you can work without a real machine. Click on Machining >
Connect > Virtual and [Connect].
Tip

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 Processing Gerber and
4 Excellon files
CircuitPro 1.5

4.1 Selecting Gerber and Excellon files

CircuitPro must be running.

Note

 Selecting files

The LPKF tutor data are stored in “My Documents\LPKF Laser &
Electronics\ LPKF CircuitPro 1.5\Example Data”.

Tip

1. Click the icon “Import” on the toolbar:

Fig. 318: Icon
import

Or
1. Click on File > Import…
➨ The following dialog is displayed:
Fig. 319: Import
dialog

2. Select the files to be imported.

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 Processing Gerber and
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Excellon files

Instead of selecting individual Gerber or Excellon files, you can

select a whole folder. In this case, all files in the selected folder
Note are displayed in the table (see figure below).

3. Click on [Open].
➨ The files to be imported are displayed in the table:
Fig. 320:
Imported files

The columns of the table highlighted contain the following information/settings:

Column Description

Import Checkmark the files that you want to import.

File name The name of the selected file is displayed.

Format The format of the selected file is displayed. If

CircuitPro has not recognised the file format
correctly, you can assign the correct format in
the corresponding drop-down list (for more
information please refer to chapter “Selecting
the file format”).

Aperture/Tool List The Aperture list is usually part of the Gerber or

Excellon file. The apertures contained are
displayed in the “Apertures/Tools” tab.

Layer/Template Assign the layer that is to contain the imported

data (for more information please refer to the
chapter “Selecting the desired target layer”).

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CircuitPro 1.5

Column Description

Size/Format The size of the imported design is displayed in

this column (for more information please refer to
the chapter “Setting/correcting size and
format”).

 The files are selected.

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 Processing Gerber and
CircuitPro 1.5 4
Excellon files

4.2 Selecting the file format

If CircuitPro does not recognise the file format, the corresponding row in the
dialog is grayed-out:
Fig. 321:
Unrecognised
files

In such a case, the information on aperture list, layer, and format are also
missing.
You can select the file format manually.

 Selecting the file format

1. In the “Format” column, click on the arrow button of the file concerned.
➨ The format selection list is displayed:
Fig. 322:
Selecting the file
format manually

2. Click on the corresponding file format (“GerberX” in this case).

➨ The information in the columns “Aperture/Tool List”, “Layer/Template”, and
”Size/Format” is displayed automatically if you have selected the correct file
format.
Fig. 323: File
details

➨ The checkmark in the “Import” column is set automatically by CircuitPro.

 The file format is selected.
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4 Excellon files
CircuitPro 1.5

4.3 Selecting the desired target layer

Once you have selected the files to be imported, these files have to be assigned
to layers in CircuitPro. You can assign the files in the “Layer/Template” column:
Fig. 324:
“Layer/Template”
column
1
2
3

There are three ways to assign the layer:

1. Keeping the layer that is created during file selection:
In this case, CircuitPro creates a new layer during the file import if it does not
exist in the template (see /1/).
2. Selecting a layer that already exists in the template file of CircuitPro:
These layers are in the templates of CircuitPro and appear in the drop-down
lists that are shown when you click on the list's arrow button (see /2/).
3. Creating a new layer:
If you want to create a new layer, you can enter a name for the layer in the
“Layer/Template” column. CircuitPro creates a new layer for this file during the
file import (see /3/).

After the file import, the layers are listed in the “Layers” pane of CircuitPro:
Fig. 325: “Layers”
pane

1
3

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 Processing Gerber and
CircuitPro 1.5 4
Excellon files

4.4 Setting/correcting size and format

In some cases, the design of the file is not displayed correctly. There are four
possible causes for this:
• Wrong measurement unit: A wrong measurement unit was selected when
importing the file (inch instead of mm).
• Wrong number of decimal digits: The number of decimal digits entered does
not match the file's contents.
• Wrong declaration of the value (relative/absolute)
• Wrong null suppression (decimal)

 Checking and modifying the measurement unit

The dimensions of the imported files are listed in the “Size/Format” column.
Millimeters are used by default.

If the imported files are GerberX files, the measurement unit is

preset by default and cannot be modified.
Note You can modify the measurement unit for all other file types
(Gerber, Excellon etc.) in the “General” tab of CircuitPro's Import
dialog.

If the design size of some files looks peculiar, you should check the
measurement unit:
Fig. 326:
Abnormal design
size

1. Click on the tab “General”.

Fig. 327: Wrong
measurement
unit

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4 Excellon files
CircuitPro 1.5

2. Check the measurement unit.

3. If the measurement unit is set to “inch”, click on the arrow button.
➨ The measurement unit selection list is displayed.
4. Select “mm” as measurement unit.
➨ The design's dimensions change automatically.
Fig. 328:
Corrected
measurement
unit

 The measurement unit has been checked and corrected.

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 Processing Gerber and
CircuitPro 1.5 4
Excellon files

 Checking and correcting the number of decimal digits

If the design is still not displayed correctly in the “2D View” tab, you should
check the number of decimal digits. An incorrect display of the design data may
look as follows:
Fig. 329:
Incorrect preview

1. Click on the tab “General”.

2. Change the “n” digit count from “4” to “3”.
➨ The design's preview changes as follows:
Fig. 330: Correct
preview

 The number of decimal digits has been checked and corrected.

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 Processing Gerber and
4 Excellon files
CircuitPro 1.5

4.5 Viewing/modifying aperture properties

You can view the properties of the apertures contained in the files. You can also
modify the aperture properties according to your needs.

 Modifying aperture properties

1. Select the file whose apertures you want to regard.
➨ The aperture contained in the file is displayed in the “Apertures/Tools” tab.
➨ The aperture properties are displayed in the “Attributes” tab.
Fig. 331: Aperture
properties

The following aperture properties can be modified in the “Attributes” tab:

• Shape of the aperture (circle, square, oval, etc.)
• Rotation of the aperture
• Parameters that define the aperture's geometry

If you change the aperture's attributes, the “Attributes” tab displays a preview of
the aperture.
In this example, the aperture's shape is to be changed from “circle” to
“rectangle”.
2. Click on the arrow button of the drop-down list “Type”.
➨ The aperture shape selection list is displayed:

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 Processing Gerber and
CircuitPro 1.5 4
Excellon files

Fig. 332:
Available
aperture shapes

3. Click on “Rectangle” in the drop-down list.

4. Enter “1.5” in the field \A:\
➨ The aperture's shape and size are changed according to your input:
Fig. 333: Modified
aperture shape
and size

 The aperture's properties are modified.

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4 Excellon files
CircuitPro 1.5

4.6 Using the layer name defined in the Gerber file

The Gerber files contain the name of the layer. You can see the layer name in
the “Text View” tab of the Import dialog:
Fig. 334: Layer
name in Gerber
file

The option “Use layer name” is only available for importing

Gerber files as the layer name is defined in the Gerber file.
Note

 Using the layer name for import

In CircuitPro, you can either
• define globally that the layer name is read from the Gerber files during import
or
• you activate this option only once during import.

How to activate the option globally:

1. Click on Extras > Options…
➨ The following dialog is displayed:
Fig. 335: Extras >
Options

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 Processing Gerber and
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Excellon files

2. Click in the category tree on the left on General > Import/Export > Formats
> Gerber.
➨ The dialog changes as follows:
Fig. 336: Extras >
Options

3. Click on the arrow button of the drop-down list “Use layer name”.
• If the value of “Use layer name” is set to “True”, the correct layer is assigned to
the Gerber files automatically in CircuitPro:
Fig. 337: Import
using option
“Use layer name”

• If the value is left at “False”, the option is not globally activated.

In the latter case, you can define each time again when importing Gerber files
whether to use the layer name.

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CircuitPro 1.5

Using the layer name automatically when importing:

1. Switch to the “Options” tab in the “Import” dialog.
Fig. 338:
“Options” tab

2. Checkmark the check boxes “Use layer name” and “Apply to all Gerber
files”.
 The name contained in the Gerber files is used as the layer name.

You can also import Gerber files without using the option “Use
layer name”. In this case, you have to assign the files manually
Note to the corresponding layer.

=== Ende der Liste für T extmar ke Inhalt ===

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Appendix
 CircuitPro 1.5 Appendix

Appendix
Fig. 1: Connection steps .............................................................................................................. 14
Fig. 2: New document ................................................................................................................. 15
Fig. 3: Import ............................................................................................................................... 16
Fig. 4: Assigned layers ................................................................................................................ 17
Fig. 5: CAM view ......................................................................................................................... 18
Fig. 6: Create rectangle ............................................................................................................... 19
Fig. 7: Rectangle around the pads .............................................................................................. 19
Fig. 8: Step & Repeat .................................................................................................................. 21
Fig. 9: Layout in CAM view.......................................................................................................... 22
Fig. 10:Create circle .................................................................................................................... 23
Fig. 11:Two fiducials .................................................................................................................... 24
Fig. 12: Technology Dialog .......................................................................................................... 25
Fig. 13: Tool magazine ................................................................................................................ 26
Fig. 14: Inserting the tool ............................................................................................................. 26
Fig. 15: Tools in the tool magazine ............................................................................................. 27
Fig. 16: Machining > Process all ................................................................................................. 28
Fig. 17: Material settings ............................................................................................................. 29
Fig. 18: Right corner .................................................................................................................... 30
Fig. 19: Click on button ................................................................................................................ 30
Fig. 20: Left corner ...................................................................................................................... 31
Fig. 21: Defined processing area ................................................................................................ 31
Fig. 22: Placement ...................................................................................................................... 32
Fig. 23: Alignment ....................................................................................................................... 34
Fig. 24: Connection steps ............................................................................................................ 40
Fig. 25: New document ............................................................................................................... 41
Fig. 26: Import ............................................................................................................................. 42
Fig. 27: Assign layer .................................................................................................................... 43
Fig. 28: Dispense ........................................................................................................................ 45
Fig. 29: Machining view with solder paste paths ......................................................................... 46
Fig. 30: Technology Dialog .......................................................................................................... 47
Fig. 31: Wizards > Dispense preparation wizard ........................................................................ 49
Fig. 32: Prepare dispenser .......................................................................................................... 49
Fig. 33: Assembling the dispenser .............................................................................................. 50
Fig. 34: Enter the thickness ......................................................................................................... 50
Fig. 35: Position of auxiliary board .............................................................................................. 51
Fig. 36: Head touching the paper ................................................................................................ 52
Fig. 37: Dispense icon ................................................................................................................. 52
Fig. 38: Camera offset ................................................................................................................. 53
Fig. 39: Alignment ....................................................................................................................... 53
Fig. 40: Dispense preparation finished ........................................................................................ 54
Fig. 41: Wizards > Dispense process wizard .............................................................................. 55
Fig. 42: Mount board ................................................................................................................... 55
Fig. 43: Enter the thickness ......................................................................................................... 56
Fig. 44: Select drill hole ............................................................................................................... 57

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Appendix CircuitPro 1.5

Fig. 45: Message “Select drill hole” ............................................................................................. 57

Fig. 46: Alignment ....................................................................................................................... 58
Fig. 47: Dispense icon ................................................................................................................. 59
Fig. 48: Process dispensing ........................................................................................................ 60
Fig. 49: Connection steps ............................................................................................................ 66
Fig. 50: New document ............................................................................................................... 67
Fig. 51: Material properties .......................................................................................................... 67
Fig. 52: CAM view ....................................................................................................................... 68
Fig. 53: Create rectangle ............................................................................................................. 69
Fig. 54: Rectangle in CAM view .................................................................................................. 69
Fig. 55: Second rectangle ........................................................................................................... 70
Fig. 56: Create circle ................................................................................................................... 70
Fig. 57: Circle in CAM view ......................................................................................................... 71
Fig. 58: Step Repeat ................................................................................................................... 71
Fig. 59: Multiplying the circle in X direction ................................................................................. 72
Fig. 60: Select all objects ............................................................................................................ 73
Fig. 61: Context menu ................................................................................................................. 73
Fig. 62: Convert into 2.5D ........................................................................................................... 74
Fig. 63: Properties of the 2.5D object .......................................................................................... 74
Fig. 64: Create 2.5D milling ......................................................................................................... 76
Fig. 65: CAM view ....................................................................................................................... 77
Fig. 66: 3D view ........................................................................................................................... 77
Fig. 67: Tool magazine ................................................................................................................ 78
Fig. 68: Inserting the tool ............................................................................................................. 78
Fig. 69: Assigning the tools in the dialog ..................................................................................... 79
Fig. 70: Assigned tools ................................................................................................................ 79
Fig. 71: Assigning additional tools ............................................................................................... 80
Fig. 72: Tools in the tool magazine ............................................................................................. 80
Fig. 73: Machining > Process all ................................................................................................. 81
Fig. 74: Material placement ......................................................................................................... 82
Fig. 75: Pane „Processing“ .......................................................................................................... 82
Fig. 76: Autofocus ....................................................................................................................... 83
Fig. 77: Cross hair of camera ...................................................................................................... 83
Fig. 78: Message for second position ......................................................................................... 83
Fig. 79: Move to measuring position ........................................................................................... 84
Fig. 80: Material surface level defined ........................................................................................ 85
Fig. 81: Dismount the depth limiter.............................................................................................. 85
Fig. 82: Pneumatic Depth limiter ................................................................................................. 86
Fig. 83: Fasten depth limiter ........................................................................................................ 86
Fig. 84: Mechanical depth limiter................................................................................................. 87
Fig. 85: Connection steps ............................................................................................................ 90
Fig. 86: New document ............................................................................................................... 91
Fig. 87: Material properties .......................................................................................................... 91
Fig. 88: CAM view ....................................................................................................................... 92
Fig. 89: Importing the STEP file .................................................................................................. 93
Fig. 90: 3D view ........................................................................................................................... 94
Fig. 91: Transformation ............................................................................................................... 94

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 CircuitPro 1.5 Appendix

Fig. 92: Rotate [auto] ................................................................................................................... 95

Fig. 93: 3D view rotatet around Z axis ........................................................................................ 95
Fig. 94: Move in X and Y direction .............................................................................................. 96
Fig. 95: Move object in Z direction .............................................................................................. 96
Fig. 96: Create 2.5D milling ......................................................................................................... 97
Fig. 97: 3D view ........................................................................................................................... 98
Fig. 98: Phases in pane “Toolpath” ............................................................................................. 99
Fig. 99: Context menu ................................................................................................................. 99
Fig. 100: Create new phase ........................................................................................................ 99
Fig. 101: New phase created .................................................................................................... 100
Fig. 102: Creating circles ........................................................................................................... 101
Fig. 103: CAM view with fiducials .............................................................................................. 101
Fig. 104: Pane “Layers” ............................................................................................................. 103
Fig. 105: Phase selection list..................................................................................................... 103
Fig. 106: Technology Dialog...................................................................................................... 104
Fig. 107: Alignment ................................................................................................................... 105
Fig. 108: Selecting the fiducials................................................................................................. 105
Fig. 109: Tool magazine ............................................................................................................ 106
Fig. 110: Inserting the tool ......................................................................................................... 106
Fig. 111: Tools in the tool magazine ......................................................................................... 107
Fig. 112: Connection steps ........................................................................................................ 112
Fig. 113: New document ........................................................................................................... 113
Fig. 114: CAM view - multi-layer ............................................................................................... 113
Fig. 115: Import ......................................................................................................................... 115
Fig. 116: Assigned layers .......................................................................................................... 116
Fig. 117: CAM view ................................................................................................................... 116
Fig. 118: Create Rectangle ....................................................................................................... 117
Fig. 119: Rubout Top ................................................................................................................. 117
Fig. 120: Rubout Bottom ........................................................................................................... 118
Fig. 121: Step & Repeat ............................................................................................................ 119
Fig. 122: Design in the CAM view ............................................................................................. 120
Fig. 123: Technology Dialog...................................................................................................... 121
Fig. 124: Tool magazine ............................................................................................................ 122
Fig. 125: Inserting a tool ............................................................................................................ 122
Fig. 126: Loaded tool holder...................................................................................................... 123
Fig. 127: Machining > Process all ............................................................................................. 124
Fig. 128: Material Settings ......................................................................................................... 125
Fig. 129: Defining the left corner ............................................................................................... 126
Fig. 130: Click on the icon ......................................................................................................... 126
Fig. 131: Defining the left corner ............................................................................................... 127
Fig. 132: Defined processing area ............................................................................................ 127
Fig. 133: Placement .................................................................................................................. 128
Fig. 134: Alignment ................................................................................................................... 130
Fig. 135: Connection steps ........................................................................................................ 138
Fig. 136: New document ........................................................................................................... 139
Fig. 137: Create rectangle ......................................................................................................... 140
Fig. 138: Create rectangle ......................................................................................................... 141

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Fig. 139: Rectangles in the CAM view ...................................................................................... 142

Fig. 140: Create circle ............................................................................................................... 143
Fig. 141: Drill holes .................................................................................................................... 144
Fig. 142: Create Polygon ........................................................................................................... 145
Fig. 143: Polygon ...................................................................................................................... 145
Fig. 144: Circular marks ............................................................................................................ 146
Fig. 145: Define text .................................................................................................................. 147
Fig. 146: Text in CAM view ....................................................................................................... 148
Fig. 147: Holes in CAM view ..................................................................................................... 149
Fig. 148: Create closed path ..................................................................................................... 150
Fig. 149: Cutouts for the fan ...................................................................................................... 151
Fig. 150: Pane „Properties“ ....................................................................................................... 151
Fig. 151: Create Circle .............................................................................................................. 152
Fig. 152: Pane “Layers“ ............................................................................................................. 153
Fig. 153: Technology Dialog...................................................................................................... 154
Fig. 154: Created toolpaths ....................................................................................................... 155
Fig. 155: Tool magazine ............................................................................................................ 156
Fig. 156: Inserting a tool ............................................................................................................ 156
Fig. 157: Loaded tool holder...................................................................................................... 157
Fig. 158: Machining > Process all ............................................................................................. 158
Fig. 159: Material settings ......................................................................................................... 159
Fig. 160: Right corner ................................................................................................................ 160
Fig. 161: Click on button ............................................................................................................ 160
Fig. 162: Left corner .................................................................................................................. 161
Fig. 163: Defined processing area ............................................................................................ 161
Fig. 164: Placement .................................................................................................................. 162
Fig. 165: Connection steps ........................................................................................................ 166
Fig. 166: New document ........................................................................................................... 167
Fig. 167: Import ......................................................................................................................... 168
Fig. 168: Assign layers .............................................................................................................. 169
Fig. 169: CAM view ................................................................................................................... 169
Fig. 170: Identical proportion ..................................................................................................... 170
Fig. 171: Transformation >Scale ............................................................................................... 171
Fig. 172: Dimensions changed .................................................................................................. 171
Fig. 173: “Layers” pane ............................................................................................................. 172
Fig. 174: Technology Dialog...................................................................................................... 172
Fig. 175: Insulation details ......................................................................................................... 173
Fig. 176: Deactivating functions ................................................................................................ 174
Fig. 177: Tool magazine ............................................................................................................ 176
Fig. 178: Insert tool .................................................................................................................... 176
Fig. 179: Loaded tool holder...................................................................................................... 177
Fig. 180: Machining > Process all ............................................................................................. 178
Fig. 181: Material Settings ......................................................................................................... 179
Fig. 182: Right corner ................................................................................................................ 180
Fig. 183: Click on button ............................................................................................................ 181
Fig. 184: Left corner .................................................................................................................. 181
Fig. 185: Defined processing area ............................................................................................ 182

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Fig. 186: Placement .................................................................................................................. 182

Fig. 187: Connection steps ........................................................................................................ 188
Fig. 188: New document ........................................................................................................... 189
Fig. 189: CAM view ................................................................................................................... 190
Fig. 190: Phases........................................................................................................................ 191
Fig. 191: Phases........................................................................................................................ 191
Fig. 192: Import ......................................................................................................................... 193
Fig. 193: CAM view ................................................................................................................... 194
Fig. 194: “Toolpath” pane .......................................................................................................... 195
Fig. 195: “Layers” pane ............................................................................................................. 196
Fig. 196: Phase selection list..................................................................................................... 196
Fig. 197: Technology Dialog...................................................................................................... 199
Fig. 198: Insulation details ......................................................................................................... 200
Fig. 199: Fiducials - details ........................................................................................................ 200
Fig. 200: Tool magazine ............................................................................................................ 201
Fig. 201: Inserting a tool ............................................................................................................ 201
Fig. 202: Loaded tool holder...................................................................................................... 202
Fig. 203: Machining > Process all ............................................................................................. 203
Fig. 204: Material Settings ......................................................................................................... 204
Fig. 205: Defining the right corner ............................................................................................. 205
Fig. 206: Click on the icon ......................................................................................................... 205
Fig. 207: Defining the left corner ............................................................................................... 206
Fig. 208: Defined processing area ............................................................................................ 206
Fig. 209: Placement .................................................................................................................. 207
Fig. 210: Technology Dialog...................................................................................................... 210
Fig. 211: Contour routing details ............................................................................................... 210
Fig. 212: Drills details ................................................................................................................ 211
Fig. 213: Tool magazine ............................................................................................................ 212
Fig. 214: Inserting a tool ............................................................................................................ 212
Fig. 215: Loaded tool holder...................................................................................................... 213
Fig. 216: Machining > Process all ............................................................................................. 214
Fig. 217: Material Settings ......................................................................................................... 215
Fig. 218: Defining the right corner ............................................................................................. 216
Fig. 219: Click on the icon ......................................................................................................... 216
Fig. 220: Defining the left corner ............................................................................................... 217
Fig. 221: Defined processing area ............................................................................................ 217
Fig. 222: Selecting a cutout around a fiducial ........................................................................... 220
Fig. 223: Properties of the cutout .............................................................................................. 220
Fig. 224: Aperture lists .............................................................................................................. 221
Fig. 225: Aperture size .............................................................................................................. 221
Fig. 226: Modifying the aperture size ........................................................................................ 222
Fig. 227: Technology Dialog...................................................................................................... 223
Fig. 228: Contour routing details ............................................................................................... 224
Fig. 229: Drills details ................................................................................................................ 224
Fig. 230: Tool magazine ............................................................................................................ 226
Fig. 231: Inserting a tool ............................................................................................................ 226
Fig. 232: Loaded tool holder...................................................................................................... 227

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Fig. 233: Machining > Process all ............................................................................................. 228

Fig. 234: Material Settings ......................................................................................................... 229
Fig. 235: Defining the right corner ............................................................................................. 230
Fig. 236: Click on the icon ......................................................................................................... 230
Fig. 237: Defining the left corner ............................................................................................... 231
Fig. 238: Defined processing area ............................................................................................ 231
Fig. 239: Creating a new phase ................................................................................................ 234
Fig. 240: Technology Dialog...................................................................................................... 236
Fig. 241: Contour routing details ............................................................................................... 237
Fig. 242: Fiducials - details ........................................................................................................ 237
Fig. 243: Tool magazine ............................................................................................................ 238
Fig. 244: Inserting a tool ............................................................................................................ 238
Fig. 245: Loaded tool holder...................................................................................................... 239
Fig. 246: Machining > Process all ............................................................................................. 240
Fig. 247: Material Settings ......................................................................................................... 241
Fig. 248: Defining the right corner ............................................................................................. 242
Fig. 249: Click on the icon ......................................................................................................... 242
Fig. 250: Defining the left corner ............................................................................................... 243
Fig. 251: Defined processing area ............................................................................................ 243
Fig. 252: Alignment ................................................................................................................... 244
Fig. 253: Icon Process Planning Wizard ................................................................................... 252
Fig. 254: Process planning wizard ............................................................................................ 252
Fig. 255: Process planning wizard ............................................................................................ 253
Fig. 256: Selecting the substrate ............................................................................................... 253
Fig. 257: Through hole plating equipment................................................................................. 254
Fig. 258: Surface finishing ......................................................................................................... 254
Fig. 259: Summary .................................................................................................................... 255
Fig. 260: Icon import .................................................................................................................. 256
Fig. 262: Assigned layers .......................................................................................................... 257
Fig. 263: Icon import .................................................................................................................. 258
Fig. 264: Import dialog ............................................................................................................... 258
Fig. 265: Changing the layer column ........................................................................................ 259
Fig. 266: Display correct ............................................................................................................ 259
Fig. 267: Design displayed in CAM view ................................................................................... 260
Fig. 274: Icon Technology Dialog .............................................................................................. 265
Fig. 275: Technology Dialog...................................................................................................... 265
Fig. 276: Basic insulation .......................................................................................................... 266
Fig. 277: Basic insulation, pads double ..................................................................................... 266
Fig. 278: Partial rubout .............................................................................................................. 267
Fig. 279: Complete rubout ......................................................................................................... 267
Fig. 280: Basic routing ............................................................................................................... 268
Fig. 281: Horizontal gaps routing .............................................................................................. 268
Fig. 282: Vertical gaps routing................................................................................................... 269
Fig. 283: Edge gaps routing ...................................................................................................... 269
Fig. 284: Corner gap routing ..................................................................................................... 270
Fig. 285: Equidis-tant gaps routing ........................................................................................... 270
Fig. 286: Tool drop-down menu ................................................................................................ 270

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Fig. 287: Computation Results .................................................................................................. 271

Fig. 288: Tab “Machining view” ................................................................................................. 276
Fig. 289: Machining view ........................................................................................................... 276
Fig. 290: Icon Tool magazine .................................................................................................... 277
Fig. 291: Tool magazine ............................................................................................................ 277
Fig. 292: Tool list ....................................................................................................................... 278
Fig. 293: Insert tool into holder .................................................................................................. 278
Fig. 294: Tool magazine ............................................................................................................ 278
Fig. 295: Colors of the tool holders ........................................................................................... 279
Fig. 296: Icon “Process Planning wizard“ .................................................................................. 280
Fig. 297: Machining > Process all ............................................................................................. 280
Fig. 298: Material settings ......................................................................................................... 281
Fig. 299: Right corner ................................................................................................................ 282
Fig. 300: Click on button ............................................................................................................ 282
Fig. 301: Left corner .................................................................................................................. 283
Fig. 302: Defined processing area ............................................................................................ 283
Fig. 303: Placement .................................................................................................................. 284
Fig. 304: Alignment ................................................................................................................... 286
Fig. 305: Icon import .................................................................................................................. 292
Fig. 306: Import dialog ............................................................................................................... 292
Fig. 307: Change column .......................................................................................................... 293
Fig. 308: Selecting the increment .............................................................................................. 293
Fig. 309: CAM view ................................................................................................................... 293
Fig. 318: Icon import .................................................................................................................. 304
Fig. 319: Import dialog ............................................................................................................... 304
Fig. 320: Imported files .............................................................................................................. 305
Fig. 321: Unrecognised files ...................................................................................................... 307
Fig. 322: Selecting the file format manually .............................................................................. 307
Fig. 323: File details .................................................................................................................. 307
Fig. 324: “Layer/Template” column ........................................................................................... 308
Fig. 325: “Layers” pane ............................................................................................................. 308
Fig. 326: Abnormal design size ................................................................................................. 309
Fig. 327: Wrong measurement unit ........................................................................................... 309
Fig. 328: Corrected measurement unit ...................................................................................... 310
Fig. 329: Incorrect preview ........................................................................................................ 311
Fig. 330: Correct preview .......................................................................................................... 311
Fig. 331: Aperture properties..................................................................................................... 312
Fig. 332: Available aperture shapes .......................................................................................... 313
Fig. 333: Modified aperture shape and size .............................................................................. 313
Fig. 334: Layer name in Gerber file ........................................................................................... 314
Fig. 335: Extras > Options ......................................................................................................... 314
Fig. 336: Extras > Options ......................................................................................................... 315
Fig. 337: Import using option “Use layer name” ........................................................................ 315
Fig. 338: “Options” tab ............................................................................................................... 316

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