ASSIGNMENT 1
DEPARTMENT OF MATERIALS AND METALLURGICAL ENGINEERING
BANGLADESH UNIVERSITY OF ENGINEERING AND TECHNOLOGY
MME 6113 : ADVANCED WELDING TECHNOLOGY
April 2024 06/10/24
Title: Development of Soldering Techniques for PCB Assembly in an Electronic Manufacturing Company
Issued: Week 02
Submission deadline: Week 05
A. Background
Soldering is a fundamental technique in the assembly of printed circuit boards (PCBs), serving as a connective
and conductive medium for joining electrical components. Solid solder ensures electrical continuity and
functionality, making it a critical aspect of PCB manufacturing. Your team has been hired as Technologists
by an electronic manufacturing company that has initiated a new project for assembling PCBs. Your task is
to develop and recommend the best soldering techniques, process parameters, and quality control measures
while considering the wide variety of solder types and techniques available.
.
Printed Circuit Board (source Wikipedia)
B. Action Plan
As the assigned Technologist Team, you are responsible for developing the appropriate soldering techniques
for the PCB assembly project. This includes selecting suitable materials, optimizing the process parameters,
and ensuring proper quality control. Your team must analyze the various solder types and techniques on the
market, choosing those that align with the company’s requirements and ensuring that the process will produce
high-quality, functional circuit boards.
C. Job Scope
Upon successfully completing this assignment, you will:
• Select the appropriate soldering materials and techniques for PCB assembly based on the given
specifications.
• Analyze and justify the cause-and-effect relationships between soldering process parameters and the
quality of the final product using logical thinking, theoretical knowledge, and practical resources
(videos, articles, etc.).
• Ensure quality control by identifying critical parameters that affect product quality during soldering.
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D. For your study it is strictly advised to mention and consider the following aspects and the indicative
requirements:
Table 1: Aspects and Indicative requirements
Sl. Aspects Indicative Requirements
No.
1. Enterprise/Sector: Specify the industry or sector in which your
electronic manufacturing company operates (e.g.,
consumer electronics, automotive electronics).
2. PCB Details i. Size, Shape, and Type of PCB: Define the
specifications of the PCB your company will
assemble (e.g., single-layer, multi-layer).
ii. Selection of Solder Material(s): Choose the
solder material(s) that will be used (e.g., lead-
based, lead-free, or specialty solders).
iii. Justification: Explain why you selected the
particular solder material(s) based on the PCB
specifications, environmental standards (e.g.,
RoHS compliance), and performance.
3. Soldering Technique/Process: i. Selection of Soldering Technique: Identify the
appropriate soldering technique (e.g., reflow
soldering, wave soldering, hand soldering)
based on the type of PCB and components
used.
ii. ii. Basic Steps of Soldering Process: Outline
the basic steps involved in the soldering
technique you have chosen.
iii. Cause and Effect Diagram of Process
Parameters: Create a cause-and-effect
(Ishikawa) diagram that highlights the key
process parameters (temperature, solder type,
flux, etc.) and how they impact the final quality
of the solder joints.
iv. Justification for Selecting the Process: Provide
a detailed justification for choosing the
soldering process based on cost, efficiency,
complexity of components, and the nature of
the PCB assembly
4. Product Inspection for Quality Control Describe how you will inspect the solder joints and
PCBs for quality, including techniques such as
visual inspection, X-ray inspection, and in-circuit
testing. Specify what key defects you will look for
(e.g., cold joints, bridging, insufficient solder, etc.).
E. Assessment Criteria
• Selection of Materials and Techniques (25%): Appropriateness of the selected materials and processes
for the PCB assembly.
• Cause-and-Effect Analysis (25%): Depth and clarity of the cause-and-effect analysis of process
parameters.
• Justifications (20%): Logical and well-supported justifications for the materials and processes selected.
• Quality Control Measures (15%): Thoroughness of the inspection plan and its ability to ensure high-
quality products.
• Presentation and Communication (15%): Clarity and effectiveness of the presentation.
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F. Assignment Guidelines
1. Group Formation: Form groups of 3-4 members.
2. Research and Resources: You are encouraged to use a combination of textbooks, online resources
(such as video tutorials), and research papers to inform your decisions. Proper citations are required.
3. Do not prepare any report
4. Presentation: Each group will be required to present their findings in a 10-15 minute presentation
followed by a Q&A session. PowerPoint shall be used to prepare for oral presentations and email the
presentations to: ahsanqumrul@[Link].
5. Rubrics Report with group details (names and student no of each team member completely fill in)
should be submitted in the form of soft copy (MS Word) to email: ahsanqumrul@[Link]
✓ This assignment will test your ability to apply theoretical knowledge in a practical, real-world
setting, helping you develop critical thinking, technical problem-solving, and teamwork skills.
✓ The assignment bears 15% marks of overall evaluation.
✓ FIVE (5) marks will be deducted for late submission
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