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Engineering Mechanics in Microsystem Design

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0% found this document useful (0 votes)
36 views5 pages

Engineering Mechanics in Microsystem Design

xfxgxgxg

Uploaded by

Vinod Kumar
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Dr.

Swetha Vura ICEAS

MODULE 3
Engineering Mechanics for Microsystem Design

Introduction:
Engineering Mechanics, which involves both solid and fluid mechanics, is the base for
mechanical design of microsystems. Mechanics is the branch of engineering science that
studies the relationship between the applied forces and resulting motions. The word motion in
microsystems can involve either rigid body motion (accelerometer) or deformation of solids
(diaphragm).
Solid mechanics is extensively used in design of system packaging whereas fluid mechanics is
involved in design of microvalves and microfluidics.
Units for Solid Mechanics Problems: The following International System (SI) units are
recommended.
The unit newton (N) is used for forces. A force of 1 N is defined as a force required to give 1
kg mass an acceleration of 1 m/s2. Since 1 kg of mass has a weight of 9.81 N, we can recognize
that 1 kg force equals 9.81 Ns.
Gravitational acceleration, g = 9.81 m/s2
The unit meter (m) is recommended for length. Thus, 1 μm = 10-6 m, and 1 mm = 1000 μm.
The unit kilogram (kg) is recommended for the mass in all computations. The pascal (Pa) is
used for pressures and stresses; 1 Pa is equivalent to 1 N/m2, from which 1 MPa = 106 Pa= 106
N/m2.

Static Bending of Thin Plates:


Micro pressure sensors work on the principle of converting strain in a deformed thin slicon
diaphragm (circular, square, or rectangular) by applied pressure into desired form of electronics
output.
Bending of a rectangular plate:
The differential equation for the deflection of a rectangular plate subject to lateral bending is
given by

In which w=w(x,y) is the lateral deflection of a flat plane due to uniformly distributed applied
pressure p. The x-y plane defines the plate as in Fig. 3.1.
Dr. Swetha Vura ICEAS

Fig. 3.1: Bending of a rectangular plate

The parameter D is the flexural rigidity of the plate given by

Where E=Young’s modulus, v=Poisson’s ratio and h=thickness of the plate


The bending moments and the bending stresses can be given by
Dr. Swetha Vura ICEAS

Bending of Circular Plates with Edge Fixed:


The following equations are for a circular plate with a radius a, thickness h and uniform
pressure p.

Fig. 3.2: A circular plate subjected to uniform pressure loading

where W=(∏a2)p and m=1/v. The negative sign in deflection indicates its downward direction.
Dr. Swetha Vura ICEAS

Bending of Rectangular Plates with all Edges Fixed:

Fig. 3.3: Bending of a rectangular plate

Bending of Square Plates with all Edges Fixed:


Square diaphragms are used commonly in micro pressure sensors because it allows easy slicing
or dicing of the silicon sensing elements from standard sized wafers.
In Fig. 3.4, by letting the two edges of the plate parallel to each other (a=b), we can get the
following expressions.
Dr. Swetha Vura ICEAS

Fig. 3.4: Bending of a square plate

Based on the geometry of diaphragm, the following can be concluded.

It is understood that circular diaphragm is most favourable. The deflection is excessive but a
mechanical stopper can be installed in the die to limit such deflection.
The square diaphragm appears to be the least favoured geometry from the maximum stress
and deflection point of view but is popular because of easy wafer dicing.

Common questions

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Different geometries in microsystem components critically influence functionality through their effect on rigidity and deflection under stress. For instance, circular and square diaphragms demonstrate different deflection patterns and stress concentrations when subjected to uniform pressures. Circular diaphragms exhibit more uniform stress distributions and smaller deflections, enhancing mechanical stability and sensor sensitivity. In contrast, square diaphragms, while facilitating manufacturing processes, may exhibit larger deflections and higher stress concentrations, potentially affecting performance where precise measurements are necessary. Geometry selection must thus consider both intended functionality and practical manufacturing constraints .

Microscale pressure sensors leverage the static bending principles in thin plates by converting the strain developed in deformed diaphragms into electronic signals. The strain in these plates due to applied pressure leads to deflection, captured as the sensor's output. A circular diaphragm is most favorable because it provides a uniform stress distribution compared to square diaphragms, and its geometry facilitates easier control over excessive deflection with a mechanical stopper, enhancing deformation control and accuracy .

The primary factors influencing the design of microsystems that utilize solid mechanics include the applied forces, the resulting motion or deformation, material properties like Young's modulus and Poisson's ratio, and boundary conditions. These factors are interconnected as follows: applied forces cause motion or deformation in the microsystem, which is influenced by material properties determining the extent of this response. For instance, Young's modulus determines the material's stiffness and affects how much it will deform under a given stress. Poisson's ratio affects the distribution of strain in different directions. Boundary conditions define how the system can move or deform at its limits, thus influencing the stress and strain distribution in the structure .

Units of measurement significantly affect the calculation and understanding of forces, pressures, and deflections in microsystems by providing a standard reference for interpreting physical quantities. For example, using the International System (SI) units such as newton (N) for force and pascal (Pa) for pressure ensures that calculations are consistent and comparable. Given that 1 Pa equals 1 N/m², this relationship helps in discerning the pressure applied to a particular area of a microsystem, crucial for understanding bending and deflection phenomena. This standardized approach prevents errors and misinterpretations that might arise from using non-standard or incompatible units .

Flexural rigidity, denoted as D, significantly influences the deflection of thin plates under uniform pressure. It reflects the plate’s resistance to bending and is defined by the equation D = Eh³/12(1-ν²), where E is Young's modulus, h is the thickness of the plate, and ν is the Poisson's ratio. A higher flexural rigidity indicates a greater resistance to deformation, thereby resulting in a smaller deflection under the same level of applied pressure. These parameters collectively describe the material and geometric stiffness, dictating how stiff a plate will behave under loading conditions .

Choosing between square and circular diaphragms involves several trade-offs. Square diaphragms allow for more efficient manufacturing, particularly slicing or dicing from standard-sized wafers, making them a common choice for large-scale production. However, they are not mechanically optimal due to higher stresses and deflections as compared to circular diaphragms. Circular diaphragms ensure better mechanical performance since they provide more uniform pressure distribution, resulting in lower deflection and stress concentrations, thereby offering higher precision in applications where these properties are critical. Thus, the choice depends on the priority given to either manufacturing efficiency or mechanical performance in the sensor's intended application .

Gravitational acceleration, with a value of 9.81 m/s², affects microsystem design by contributing to the weight force calculations. This factor can influence the application of forces on the system components. For microsystems, especially in portable devices, understanding gravitational effects aids in ensuring mechanical stability and counteracting any additional force effects that might compromise device sensitivity and precision. Moreover, such considerations are crucial in cases where microsystems are used in non-standard orientations or under varying gravitational conditions, requiring specific designs to mitigate those impacts for maintaining performance reliability .

In microfluidics, fluid mechanics complements solid mechanics by addressing the behavior of fluids within the micro-channels and its interaction with the solid walls of the system. It ensures efficient system design by managing pressure drops, flow rates, and the behavior of fluid under different boundary conditions. While solid mechanics focuses on maintaining structural integrity against deformation and stress, fluid mechanics ensures that the flow characteristics are optimized for minimal resistance and maximal efficiency, integrating seamlessly with solid mechanics principles to provide holistic system functionality critical for applications like microvalves and chemical mixing .

The pascal (Pa), as the SI unit for pressure, plays a critical role in depicting the forces exerted over a unit area, essential for microsystem applications where precise force distribution is vital. It relates directly to the dimensions, as it is expressed in N/m², indicating that pressure considers both force and area aspects. This unit helps engineers calculate how much stress a material can withstand based on its dimensions and material properties, such as tensile strength and elasticity (measured by Young's modulus), ensuring that components function under expected loads without failure .

Boundary conditions play a critical role in determining the mechanical behavior of microsystems such as diaphragms in pressure sensors. Specifically, these conditions dictate how a diaphragm can deflect or bend and influence stress distribution within the material. For example, a fixed-edge boundary condition in diaphragms results in minimal deflection at the edges while concentrating stresses at certain points, potentially limiting performance and lifespan. Properly designed boundary conditions help tailor deflection patterns, which aid in achieving uniform sensor responses and accurate pressure measurements, optimizing device performance .

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