6/8/2018
ECE4740:
Digital VLSI Design
Lecture 3: Nanometer MOSFETs
75
It’s not that complicated…
Body effect revisited
76
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Body effect revisited
• Again: What is the impact of VB to VT?
+
S VGS D
G
-
n+ n+
n-channel Depletion
Region
p-substrate
77
Body effect revisited (cont’d)
• Let us lower VB (such that VB<VS)
• Equivalent with reducing VBS=VB-VS or
increasing VSB=VS-VB
+
S VGS D
G
-
n+ n+
n-channel Depletion
Region
p-substrate
B
reduces potential in
p –substrate
78
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Body effect revisited (cont’d)
• Means we need larger VG
to form n-channel!
• Threshold voltage
VT increases S
-
+
V GS
G
D
n+ n+
n-channel Depletion
Region
p-substrate
79
Other explanation
• If we lower VB, then depletion region at
source and drain grows think reverse
biased pn-junctions (diodes)
• Charge gets pulled S
-
+
V GS
G
D
out of channel
n+ n+
to depletion region
n-channel Depletion
• Requires larger VGS p-substrate
Region
to undo that effect B
80
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Summary of body effect
• Reducing VB such that VB<VS is equivalent
to reducing VBS or increasing VSB
• VSB means threshold voltage VT
• VSB means threshold voltage VT
• Opposite behavior for VBS
81
The graph
0.9
0.85
0.8
0.75
(V)
0.7
VVT (V)
0.65
T
0.6
0.55
0.5
0.45
0.4
-2.5 -2 -1.5 -1 -0.5 0
V (V)
-VSB=VBS (V)BS
increasing VSB reduces VBS ,
which increases VT
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Why should we care?
• The body effect can be used to
– Make switching faster (reducing VT)
– Reduce static power consumption
due to leakage (increasing VT):
• normal operation:
connect B with S
• standby operation:
lower VBS
83
Image taken from: [Link]
Today’s devices are tiny!
Short-channel effects
84
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Modern transistors are tiny
10nm likely to be the realistic limit
for standard Si based devices
85
Image taken from: [Link]
How about short-channel devices?
-4
L<0.25µm
x 10
2.5
VGS= 2.5 V
early saturation
2
VGS= 2.0 V
1.5
linear relation
ID (A)
1
VGS= 1.5 V for fixed VDS
0.5 VGS= 1.0 V
0
0 0.5 1 1.5 2 2.5
VDS (V)
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Velocity saturation
• Velocity of carriers
saturates due to
scattering (collisions)
• For L=0.25µm
NMOS, only VDS2V
is sufficient to reach
velocity saturation
87
Image taken from: [Link]
Effects of velocity saturation
10 • Short-channel device
enters saturation
before VDS=VGS-VT
• Saturation current
IDS(sat) shows linear
dependence with VGS
0
• Vsat more pronounced in NFET than PFET
88
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(First-order model)
• Carrier velocity can be modeled as:
• We can redo the calculations for the resistive
and saturation region (not important)
89
Improved FET models this term
lowers the
carrier
mobility
• Resistive (linear) region: VGS-VT>VDSat
• (Velocity) saturation region: VGS-VT<VDSat
VDSat=κ(VGT)*VGT, VGT=VGS-VT 90
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ID vs. VGS characteristics
-4
x 10 x 10
-4
6 2.5
5
2
4
linear
quadratic 1.5
ID (A)
ID (A)
3
1
2
0.5
1
quadratic
0 0
0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5
VGS (V) VGS (V)
long channel short channel
91
Short-channel PFET
• Once, again: polarities of all voltages and
currents reversed
-4
x 10
0
V GS = -1.0V
-0.2
V GS = -1.5V
-0.4
ID (A)
V GS = -2.0V
-0.6
-0.8
V GS = -2.5V
-1
-2.5 -2 -1.5 -1 -0.5 0
VDS (V)
92
Image taken from: [Link]
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What happens if VGS<VT?
Subthreshold conduction
93
Another look at ID vs. VGS curves
-4
long channel short channel
x 10 x 10
-4
6 2.5
5
2
4 linear
quadratic 1.5
ID (A)
ID (A)
1
2
1 0.5
quadratic
0 0
0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5
VGS (V) VGS (V)
current does not drop
abruptly to 0 for VGS<VT 94
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Subthreshold conduction (leakage)
• FETs are conducting partially for VGS<VT
• Parasitic bipolar transistor
n+ n+
Body
• Two diode equations:
95
Subthreshold conduction (cont’d)
• Undesirable effect: 10-2
linear region
– Current flowing when
transistor should be quadratic region
off
• Affects dynamic subthreshold
circuits (DRAMs) exponential
region
• Affects static power
consumption 10-12 VT
WHY?
0 0.5 1 1.5 2 2.5
VGS (V)
96
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They will affect the dynamic behavior!
FET capacitances
and resistances
97
MOSFET capacitance model
G
CGS CGD
S D
CSB CGB CDB
B
• We are typically interested in modeling this
as a single capacitance CG
Image taken from: [Link] 98
MOS_Cap_Delay-[Link]
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Gate capacitance*
polysilicon gate
Source Drain
W
n+ xd xd n+
gate-bulk
Ld
overlap
lateral top view
diffusion
gate oxide
tox
n+ L n+ overlap capacitances;
no big deal in deep
cross section submicron technology!
*The gate capacitance is necessary to form the channel; all other capacitances are parasitic and not needed.
Image taken from: [Link] 99
MOS_Cap_Delay-[Link]
C’s depend on operation regime!
VGS<VT VGS>VT+VDS VGS<VT+VDS
G G G
CGC CGC CGC
S D S D S D
Region CGB CGS CGD CG
Subthreshold CoxWL 0 0 CoxWL + 2CoW
Linear 0 CoxWL/2 CoxWL/2 CoxWL + 2CoW
Saturation 0 2/3CoxWL 0 2/3CoxWL + 2CoW
Co=overlap cap.
often ignored
• Important regions are saturation and subtreshold
100
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Junction (diffusion) capacitances
• Caused by reverse-biased source-body
and drain-body pn-junctions
• Nonlinear (voltage N A+ channel-stop implant
dependent) side wall
source
W
ND
bottom
xj side wall
channel
Image taken from: LS substrate NA
[Link] 101
/Lectures/Lecture11-MOS_Cap_Delay-[Link]
Parasitic resistances
• Drain-source on resistance (RDSon)
Polysilicon gate
Drain
contact
LD
W
n+ n+
Drain
channel resistance Body parasitic resistance
from channel to
contact RC
102
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Challenges of deep-submicron devices
Nanometer transistors
103
Threshold variations
• For deep submicron devices, threshold voltage
becomes function of (small) L, W, and VDS
• Depletion regions of source and drain junction
cannot be ignored anymore VT
– parts of gate already depleted
Long-channel threshold
– reduces VT
L
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Threshold variations (cont’d)
• Increasing VD increases width of drain
pn-junction depletion region
– decreases VT: approximate model VT=VT0 – λdVDS
– known as drain-induced barrier lowering (DIBL)
– Not that critical for digital circuits
VT
• If VDS exceeds certain low V DS threshold
voltage: D-S shortened
– called punch-through
– permanent device damage!
VDS
105
Gate leakage
• High electric field can cause tunneling
through gate oxide (insulator)
• Becomes an issue for L=100nm and below
(static power consumption)
high capacitance
[Link]
106
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Hot carrier effects
• Threshold voltage drifts over time
• Electrons (and holes) can tunnel into the
gate oxide at 1V/µm
– VT increases for NMOS
– VT decreases for PMOS
• Causes long-term reliability issues
107
CMOS latch-up
• Parasitic bipolar transistors
– If one of the bipolar transistors is forward
biased, current flows into other BJT
– Positive feedback circuit fails
• Rnwell and Rpwell must be minimized!
– provide additional well and substrate
contacts close to source connections 108
Image taken from: [Link]
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They will be very useful later
Pass transistors
109
Pass transistor*
• We assumed that VS is on GND
• What if VS>0? E.g., transistor passing VDD
• If VG-VT<VS then
VG=VDD NFET is off
G • NMOS cannot pull
VD=VDD
S D
Vout? higher than VDD-VTn
• PMOS pull no lower
than |VTp|
110
*You should think that there is a big resistor pulling D down to ground.
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Pass transistor (cont’d)
• NMOS cannot pull higher than VDD-VTn
• Simple formula for NMOS:
VG=VDD
G
D S
Vin Vout?
• NFET is a bad pull up (max VDD-VT)
• PFET is a bad pull down (min VT)
111
Pass-transistor delay
VG=VDD
G
D S
Vin Vout
time constant:
Ron
Vin
Cload
but they can be very
cheap switches!
• Pass transistors can be slow,
especially if load capacitance is large
112
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Things to remember
Recap MOSFET
113
Recap: MOSFET
NMOS
saturation region
linear region
quadratic increase in VGS
for long channel FETs,
linear for short channels
FET almost off if VGS<VT
VGS-VT=VDS
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Things to remember: NFET/NMOS
• FETs are “switches”; almost off when VGS<VT
• Operating regimes
– linear (resistive) regime: VGS-VT>VDS
– saturation regime: VGS-VT<VDS
• Channel-length modulation
• Short-channel effects: velocity saturation
– transistor earlier in saturation regime
– VGS has linear relationship on ID
• Subthreshold conduction
115
Square law equations of long NMOS
• Linear (resistive or triode) regime
VGS > VT
VDS < VGS-VT
• Saturation regime
VGS > VT
VDS > VGS-VT
• Subthreshold regime
VGS < VT
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117
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