Single-chip Type with Built-in FET Switching Regulator Series

Simple Step-down
Switching Regulators
with Built-in Power MOSFET
BD9873CP-V5,BD9874CP-V5 No.09027EAT39

● Description
The BD9873,74CP-V5 single-channel step-down switching regulator incorporates a Pch MOSFET capable,
as well as circuitry that eliminates the need for external compensation – only a diode, coil, and ceramic capacitor are required –
reducing board size significantly.

●Features
1) Maximum switching current : 1.5A, 3.0A
2) Built-in Pch FET ensures high efficiency
3) Output voltage adjustable via external resistors
4) High switching frequency : 110kHz (fixed)
5) Soft start time : 4ms (fixed)
6) Over current and thermal shutdown protection circuits built in
7) ON/OFF control via STBY pin

●Applications
TVs, printers, DVD players, projectors, gaming devices, PCs, car audio/navigation systems, ETCs, communication equipment, AV
products, office equipment, industrial devices, and more.

●Absolute Maximum Ratings（Ta＝25℃）

Parameter Symbol Ratings Unit

Supply Voltage（VCC-GND） Vcc 36 V
STBY-GND VSTBY 36 V
OUT-GND VOUT 36 V
INV-GND VINV 5 V
Maximum Switching Current 1.5(*1) BD9873 A
Iout
Power Dissipation 3.0(*1) BD9874 A
Operating Temperature Pd 2000(*2) mW
Storage Temperature Topr -40～+85 ℃
Supply Voltage（VCC-GND） Tstg -55～+150 ℃
(*1) Do not exceed Pd, ASO.
(*2) Derated at 16mW/℃ over Ta=25℃

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1/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Operating Conditions(Ta=-40～+85℃)

Limit
Parameter Symbol Unit Conditions
MIN TYP MAX
Input Voltage VCC 8.0 - 35.0 V
0.8×
Output Voltage Vo 1.0 - (VCC-Io× V
Ron)

●Electrical Characteristics（Unless otherwise noted, Ta=25℃,Vcc=12V,Vo=5V,STBY=3V）

Limit
Parameter Symbol Unit Conditions
MIN TYP MAX
- 1.0 1.5 Ω BD9873
Output ON Resistance Ron
- 0.5 1.0 Ω BD9874
Efficiency η 80 88 - ％ Io＝0.5A
Switching Frequency fosc 99 110 121 kHz
Vcc=20V,
- 5 40 mV Io=0.5～1.5A
BD9873
Load Regulation ΔVOLOAD
Vcc=20V,
- 5 40 mV Io=1.0～3.0A
BD9874
Vcc=10～30V,
Line Regulation ΔVOLINE - 5 25 mV
Io=1.0A
Over Current Protection 1.6 - - A BD9873
Iocp
Limit 3.2 - - A BD9874
Over Current Protection
VINV 0.985 1.00 1.015 V
Limit
INV Pin Input Current IINV - 1 2 μA VINV=1.0V
STBY ON VSTBYON 2.0 - VCC V
Pin Threshold
OFF VSTBYOFF -0.3 - 0.3 V
Voltage
STBYPin Input Current Istby 5 15 30 μA STBY=3V
Circuit Current Icc - 5 12 mA INV=2V

Stand-by Current Ist - 0 5 μA STBY＝0V

Soft Start Time Tss - 4 20 ms STBY=0→3V

This product is not designed to be resistant to radiation.

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2/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Block Diagram

VCC
1

VREF
PWM COMP DRIVER

OSC
STBY
5 STBY
CTL
LOGIC OUT
2
TSD OCP

Error AMP INV

4

SS

GND

Fig.1

●Package Dimensions ●Pin Description

3.2±0.1 4.5±0.1 Pin No. Pin Name Function

+0.3 +0.2
10.0 -0.1 2.8 -0.1

Input Power
1 VCC
Supply Pin

Internal Pch FET

2 OUT
Drain Pin
+0.4
15.2 -0.2
12.0±0.2

3 GND Ground
13.60

BD987X
8.0±0.2

16.92

Output Voltage
(1.0)

4 INV
Feedback Pin
4.92±0.2
1.0±0.2

Lot No. 5 STBY

ON/OFF Control
Pin
1 2 3 4 5
0.82±0.1 0.42 ±0.1
0.92 1.58
1.444 1.778 (2.85)
4.12

1 3 5

2 4

TO220CP-V5（Unit：mm）

Fig.2

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3/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Block Function Explanations

・ VREF
Generates the regulated voltage from Vcc input, compensated for temperature.

・ OSC
Generates the triangular wave oscillation frequency (900kHz) using an internal resistors and capacitor. Used for PWM
comparator input.

・ Error AMP
This block, via the INV pin, detects the resistor-divided output voltage, compares this with the reference voltage, then
amplifies and outputs the difference.

・ PWM COMP
Outputs PWM signals to the Driver block, which converts the error amp output voltage to PWM form.
・ DRIVER
This push-pull FET driver powers the internal Pch MOSFET, which accepts direct PWM input.
・ STBY
Controls ON/OFF operation via the STBY pin. The output is ON when STBY is High.

・ Thermal Shutdown (TSD)

This circuit protects the IC against thermal runaway and damage due to excessive heat. A thermal sensor detects the
junction temperature and switches the output OFF once the temperature exceeds a threshold value (175°C).
Hysteresis is built in (15°C) in order to prevent malfunctions due to temperature fluctuations.

・ Over Current Protection (OCP)

The OCP circuit detects the voltage difference between Vcc and OUT by measuring the current through the internal
Pch MOSFET and switches the output OFF once the voltage reaches the threshold value. The OCP block is a
self-recovery type (not latch).

・ Soft Start (SS)

This block conducts soft start operations. When STBY is High and the IC starts up the internal capacitor begins
charging. The soft start time is fixed at 5ms.

●Notes for PCB layout C3：0.47uF

R2:1kΩ R1:4kΩ
4
INV STBY 5

L1：100uH
C1：100uF 1 VCC OUT 2
5.0V
GND
3 D1 C4：680uF
C2：4.7uF

Fig.3
• Place capacitors between Vcc and Ground, and the Schottky diode as close as possible to the IC to reduce noise and
maximize efficiency.
• Connect resistors between INV and Ground, and the output capacitor filter at the same Ground potential in order to stabilize
the output voltage.
（If the patterning is longer or thin, it’s possible to cause ringing or waveform crack.）

[Link]
4/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Reference data BD9873CP-V5

100 6 200
Ta=25℃ VCC=12V
90 180
5 160
80

70 VCC=12V VCC=8V 140

4

Vpinvo [V]
60 VCC=36V 120

Freg [kHz]
Ta=85℃
効率 [%]

50 3 100
40 80
2 Ta=-40℃
30 60
20 1 Ta=25℃ 40
10 20
0 0
0
0 0.5 1 1.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
-40 -20 0 20 40 60 80 100
IOUT [A] Ipinvo [A]
Ta [℃]

Fig.4 Fig.5 Fig.6

Efficiency-Load Current Over Current Protection Switching Frequency-Temperature

5.15 8 10
VCC=12V OUT=5V 9 STB=3V
7
5.1
8
6
5.05 7 Ta=85℃
Ta=25℃ Ta=85℃ 5 6
PINVO [V]

PINVO [V]

ICC [mA]
5 4 5 Ta=25℃
Ta=25℃
4
4.95 3
3
Ta=85℃
2
Ta=-40℃ 2 Ta=-40℃
4.9 Ta=-40℃
1 1
4.85 0 0
0 0.5 1 1.5 0 5 10 15 20 25 30 35 5 10 15 20 25 30 35

IOUT [A] VCC [V] VCC [V]

Fig.7 Fig.8 Fig.9

Output voltage- Load Current Output voltage-Supply voltage Circuit current-Supply voltage
Iout=No Load
3 200 1.1
VCC=12V OUT=5V 1.08 VCC=12V
2.5
1.06
150
1.04
2 Ta=85℃
Ta=150℃ 1.02
△VCC_OUT[V]

OFFSET [V]
Fosc [kHz]

1.5 100 1

Ta=25℃ 0.98
1 Ta=25℃ Ta=-40℃
0.96
50
Ta=-40℃ 0.94
0.5
0.92

0 0 0.9
0.0 0.5 1.0 1.5 5 10 15 20 25 30 35 -40 -20 0 20 40 60 80 100

IO[A] VCC [V] Ta [℃]

Fig10 Fig.11 Fig.12

V(VCC-OUT)-Iout Switching Frequency - Supply INV Pin Threshold voltage-
lt Temperature

5msec / div 5msec / div 10

STBY 8
5V / div
ICC(STB) [μA]

6
VOUT

500mV / div 4
VOUT
2V / div
2

0
-40 -20 0 20 40 60 80 100
Ta [℃]
Fig.13 Fig.14 Fig.15
Load Response Start-up waveform ICC(STB)-Ta
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5/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Reference data BD9874CP-V5

100 6 200
Ta=25℃ VCC=12V
90 180

80 5
160

70 VCC=8V 140
VCC=12V
4
60 120

Vpinvo [V]
VCC=36V

Freg [kHz]
効率 [%]

50 3 100
Ta=85℃
40 80
Ta=-40℃
30 2
60

20 Ta=25℃ 40
1
10 20
0 0 0
0 0.5 1 1.5 2 2.5 3 0 1 2 3 4 5 6 -40 -20 0 20 40 60 80 100
IOUT [A] Ipinvo [A] Ta [℃]

Fig.16 Fig.17 Fig.18

Efficiency - Load Current Over Current Protection Switching
F T t
5.15 8 10
VCC=12V OUT=5V 9 STB=3V
7
5.1
8
6
7
5.05
5 Ta=25℃ Ta=85℃
Ta=25℃ Ta=85℃ 6
PINVO [V]
PINVO [V]

ICC [mA]
5 4 5

4
3 Ta=25℃
4.95
3
2 Ta=85℃
Ta=-40℃ 2 Ta=-40℃
4.9 Ta=-40℃
1 1

4.85 0 0
0 0.5 1 1.5 2 2.5 3 0 5 10 15 20 25 30 35 5 10 15 20 25 30 35

IOUT [A] VCC [V] VCC [V]

Fig.19 Fig.20 Fig.21

Output voltage - Load Current Output voltage-Supply voltage Circuit current-Supply voltage
Iout= No Load

3 200 1.1
VCC=12V OUT=5V VCC=12V
1.08
2.5
1.06
150
1.04
2 Ta=85℃
1.02
△VCC_OUT[V]

Ta=-40℃
OFFSET [V]
Fosc [kHz]

1.5 100 1
Ta=25℃
0.98
1 Ta=25℃ Ta=-40℃
0.96
50
0.94
0.5
Ta=150℃
0.92
0 0 0.9
0.0 0.5 1.0 1.5 2.0 2.5 3.0 5 10 15 20 25 30 35 -40 -20 0 20 40 60 80 100

IO[A] VCC [V] Ta [℃]

Fig.22 Fig.23 Fig.24

V(VCC-OUT)-Iout Switching Frequency - Supply voltage INV Pin Threshold voltage-
Temperature
5msec / div 5msec / div 10

STBY 8

5V / div
ICC(STB) [μA]

6
VOUT

4
VOUT
500mV / div
2
2V / div

0
-40 -20 0 20 40 60 80 100
Ta [℃]
Fig.25 Fig.26 Fig.27
Load Response Start-up waveform ICC (STB)-Ta
[Link]
6/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Application component selection and settings

Inductor L1

A large inductor series impedance will result in deterioration of efficiency. OCP operation greater than 1.6A may cause
inductor overheating, possibly leading to overload or output short.
Note that the current rating for the coil should be higher than IOUT(MAX)＋⊿IL.
Iout（MAX）: maximum load current
If you flow more than maximum current rating, coil will become overload, and cause magnetic saturation, and those account
for efficiency deterioration. Select from enough current rating of coil which doesn’t over peak current.
(VCC－VOUT) VOUT 1
⊿IL. = × ×
L1 VCC fosc

L1：inductor value, VCC：maximum input voltage, VOUT：output voltage, ⊿IL：coil ripple current value, fosc：oscillation frequency

Schottky Diode D1

Select a Schottky diode having an inter-terminal capacity as small as possible (reverse recovery time as short as possible)
and a forward voltage VF as low as possible. (Noise can be reduced and efficiency improved by reduction of switching
noise and switching loss, as well as reduction of voltage drop loss of forward voltage.)
Diode should be selected on the basis of maximum current rating in forward direction, voltage rating in reverse direction,
and power dissipation of diode.
・The maximum current rating is higher than the combined maximum load current and coil ripple current (⊿IL).
・The reverse voltage rating is higher than the VIN value.

・Power dissipation for the selected diode must be within the rated level.

The power dissipation of the diode is expressed by the following formula:

Pdi=Iout(MAX)×Vf×(1-VOUT/VCC)

Iout（MAX）: maximum load current, Vf: forward voltage, VOUT: output voltage, VCC: input voltage

Output Capacitor C4

A suitable output capacitor should satisfy the following formula for ESR:
ESR≦⊿VL/⊿IL
⊿VL : permissible ripple voltage, ⊿IL : coil ripple current
Another factor that must be considered is the permissible ripple current. Select a capacitor with sufficient margin, governed
by the following formula:
IRMS =⊿IL/2√3
IRMS: effective value of ripple current to the output capacitor, ⊿IL : coil ripple current
The output capacitor is one of the important parts for system stability, and when some capacitor is selected, expected
characteristics cannot be provided, depending on ambient temperature, output voltage setting condition, etc.
Fully confirm ESR, temperature characteristics, DC, and bias characteristics before evaluation.

Intput Capacitor C1,C2

The input capacitor is the source of current flow to the coil via the built-in Pch FET when the FET is ON. When selecting
the input capacitor sufficient margin must be provided to accommodate capacitor voltage and permissible ripple current.
The expression below defines the effective value of the ripple current to the input capacitor. It should be used in
determining the suitability of the capacitor in providing sufficient margin for the permissible ripple current.

IRMS＝IOUT×√(1－VOUT / VCC)×VOUT / VCC

IRMS : effective value of the ripple current to the input capacitor

IOUT : output load current, VOUT: output voltage, VCC: input voltage

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BD9873CP-V5,BD9874CP-V5 Technical Note

Capacitor C3

C3 is for compensating the stability of application frequency characteristics.

When C3 is not available, overshoot or undershoot is possible in starting or in rapid change of load.

Be sure to insert 0.47 μF.

Resistor R1,R2
These resistors determine the output voltage:
VOUT＝1.0V×(1 + R1/R2)

Select resistors less than 10kΩ.

BD9873CP-V5
＜Recommended Components (Example)＞

Inductor L1＝100uH ： RCR1616（SUMIDA）

Schottky Diode D1＝RB050LA-40（ROHM）
Capacitor C1＝100uF ： Al electric capacitor
C2＝4.7uF ： Laminated ceramic capacitor
C3＝0.47μF ： Laminated ceramic capacitor
C4＝680μF ： Al electric capacitor

BD9874CP-V5
＜Recommended Components (Example)＞

Inductor L1＝RCR1616（SUMIDA）
Schottky Diode D1＝RB050LA-40（ROHM）
Capacitor C1＝100uF ： Al electric capacitor
C2＝4.7uF ： Laminated ceramic capacitor
C3＝0.47μF ： Laminated ceramic capacitor
C4＝680μF ： Al electric capacitor

[Link]
8/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Power Dissipation

15
(1) No heat sink

(2) Aluminum heat sink

50×50×2（mm3）
POWER DISSIPATION : Pd [W]

(3) 11.0W
(3) Aluminum heat sink
10
100×100×2（mm3）

(2) 6.5W

(1) 2.0W

0
0 25 50 75 100 125 150
AMBIENT TEMPERATURE : Ta[C]
AMBIENT TEMPERATURE : Ta[℃]
Fig.28

●Tj (tip junction temperature) calculating method

It is impossible to measure the tip junction temperature Tj outside the IC, but it can be calculated by the formula shown below.

Calculation method of tip junction temperature Tj

Tj=(W×θj－c)＋Tc

W ：Power consumed by IC (calculated by the formula below)

θj－c ：Thermal resistance from the tip to the back of the package
12.5 ºC/W for TO220 package
Tc ：IC surface temperature (to be measured by thermocouple, etc.)

Calculation method of electric power W consumed by IC

W=Vin×Iin－VOUT×IOUT－VF×IOUT×（1－VOUT/Vin）

Vin ： Input voltage

Iin ： Input voltage
VOUT ： Output voltage
IOUT ： Load Current
VF ： Forward voltage of Schottky diode

[Link]
9/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●I/O Equivalent Circuit

1Pin,FIN (VCC, GND) 2pin (OUT) 4pin (INV) 5pin (STBY)

VCC

VCC
VCC

STBY
VCC

OUT INV

GND

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BD9873CP-V5,BD9874CP-V5 Technical Note

●Operation Notes
1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may result in IC
deterioration or damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when such
damage is suffered. A physical safety measure such as a fuse should be implemented when use of the IC in a special mode where
the absolute maximum ratings may be exceeded is anticipated.

2) GND potential
Ensure a minimum GND pin potential in all operating conditions. In addition, ensure that no pins other than the GND pin carry
a voltage lower than or equal to the GND pin, including during actual transient phenomena.

3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.

4) Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply and GND pin caused by the
presence of a foreign object may result in damage to the IC.

5) Operation in a strong electromagnetic field

Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.

6) Thermal shutdown circuit (TSD circuit)

This IC incorporates a built-in thermal shutdown circuit (TSD circuit). The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of the thermal shutdown circuit is assumed.

7) Testing on application boards

When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic measure, and
use similar caution when transporting or storing the IC. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process.

8) Common impedance
Power supply and ground wiring should reflect consideration of the need to lower common impedance and minimize ripple as much as
possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance).

9) Applications with modes that reverse VCC and pin potentials may cause damage to internal IC circuits.
For example, such damage might occur when VCC is shorted with the GND pin while an external capacitor is charged.
It is recommended to insert a diode for preventing back current flow in series with VCC or bypass diodes between VCC and
each pin.

10) IC pin input

This monolithic IC contains P+ isolation and PCB layers between adjacent elements in order to keep them isolated.
P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a variety of parasitic
elements. For example, when a resistor and transistor are connected to pins as shown in following chart,
 the P/N junction functions as a parasitic diode when GND > (Pin A) for the resistor or GND > (Pin B) for the
transistor (NPN).
 Similarly, when GND > (Pin B) for the transistor (NPN), the parasitic diode described above combines with the N layer of
other adjacent elements to operate as a parasitic NPN transistor.
The formation of parasitic elements as a result of the relationships of the potentials of different pins is an inevitable result of the IC's
architecture. The operation of parasitic elements can cause interference with circuit operation as well as IC malfunction and damage.
For these reasons, it is necessary to use caution so that the IC is not used in a way that will trigger the operation of parasitic elements,
such as by the application of voltages lower than the GND (PCB) voltage to input and output pins.

Bypass diode

Resistance Transistor ( PinＡ )

～

Ｂ
～

( PinＡ ) Ｃ Ｅ Parasitic diode

Back current prevention diode ( PinＢ )

Ｎ ＧＮＤ ＧＮＤ
Ｐ Ｐ
＋ Ｐ ＋
VCC Ｐ
＋
Ｐ
＋
Ｐ
( Pin Ｂ )
Ｎ Ｎ Ｎ Ｎ Ｎ Ｎ
Ｐ substrate Ｐ substrate Ｂ Ｃ
Output Pin
ＧＮＤ ＧＮＤ Ｅ
Parasitic diode Parasitic diode
ＧＮＤ
Fig.29 Other adjacent components
Parasitic diode

[Link]
11/12 2009.07 - Rev.A
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BD9873CP-V5,BD9874CP-V5 Technical Note

●Part order number

B D 9 8 7 3 C P ― V 5 E 2

Part No. Type/No. Package Packaging and forming specification

CP-V5 : TO220CP-V5 E2 : Embossed tape and reel

TO220CP-V5
4.5±0.1
+0.3 φ3.2±0.1 +0.2
10.0 -0.1 2.8 -0.1
+0.4
15.2 -0.2

12.0 ± 0.2

13.60
8.0 ± 0.2

16.92
(1.0)
4.92 ± 0.2

1.0 ± 0.2

0.82±0.1
0.42±0.1
0.92
1.58
1.444 1.778
(2.85)
4.12

(Unit : mm)

[Link]
12/12 2009.07 - Rev.A
© 2009 ROHM Co., Ltd. All rights reserved.
Catalog No.08T000A '08.11 ROHM © 1000 NZ
 Notice

Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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