If you are making part to add

to your library, then only set

the first letter of the Part ID,
leaving the number off until the
component is inserted into a
schematic. For example, assign
integrated circuits the letter U,
capacitors the letter C, resistors
the letter R, and connectors the
letter J. Designing Components
For a Standard Appearance We
recommend designing your
custom components so that
they have the same overall
appearance as those found in
our library. By doing that, a
schematic drawn with a
mixture of our library
components and your special
components will maintain a
professional appearance. Many
integrated circuits having
numerous pins are drawn as a
simple rectangle with lines for
each lead. Because they can be
very large, make a effort to
keep them compact, but also
readable and neat. We
recommend setting the snap-
to-grid to 0.05" and using these
dimensions when drawing
rectangular components: The
width of this component is
shown as For components
having many more pins and
long pin names, a larger width
can be used. For example, the
component ATS908515 in our
library has a width of 1.4
inches. After placing the pins
(shown below as small dots) at
the ends of the lines on the
component, double click on
each one to assign its Pin
number and Pin name in the
Pin Properties dialog box. In the
same dialog box, selecting a
text height of 0.060" will give
the printed pin number and
name text the same
appearance as we use. Once
the Pin number and Pin name
values are set, you will need to
drag their text to the desired
locations. Before positioning
the text, we recommend
setting the snap-to-grid to
0.025 . With the snap set to
0.025", the Pin numbers are
placed such that they sit about
0.006" above the pin and
0.025" from the edge of the
component. The Pin name text
is positioned so that it is
centered vertically with the pin
and about 0.035" from the
component's edge. The pin
numbers and name are also
positioned so that the text is
justified along the edge of the
component. It is our
conventions to place the power
lines at the top of the
component and the ground
lines at the bottom. The last
step in creating a component is
to group all of its parts together
using the Group to make
component command. This
command will display the
Component Properties dialog
box where the Part name (i.e.
AT90S2313) and Part ID (i.e.
U12) is set. When creating an IC
component that is to be added
to your library, the Part ID is
usually set to just U, then the
number following the U is
added later. Once the Part
name and Part ID values are
set, you will need to drag their
text to the desired locations.
We recommend setting the
snap-to-grid to 0.025" before
positioning the text. Naming
Components and Saving Them
Here you can see that the U is
placed near the upper left
corner of the component and
the Part name is placed in the
middle. The orientation of the
Part name text (set in the
Component Properties dialog
box) is set so that it reads from
top to bottom. After a
component has been created,
you will want to save it in your
component library. Once saved,
it will then appear in the list of
Custom components shown in
the Component and Symbol
Manager dialog box. To save a
component, select the Save
custom component command
from the Component menu. At
this point, you will be asked to
enter a name for the new
component. You can enter any
name you like, however the
name can not be longer than 61
characters and can not include
these symbols: / \ : * ? " < > |
When entering the name, we
recommend using the same
naming standard that we use.
By following our convention,
your names will be arranged in
the Component Manager dialog
box in the same order as ours.
Below are the guidelines for
our naming convention. We
begin component names with a
Component category. Here are
the ones we use: Connector -
for connectors IC - Misc -
Passive - for integrated circuits
for batteries, relays, motors…
for resistors, capacitors,
inductors… Semiconductor -
Switch - for transistors, diodes,
LEDs… for switches and buttons
Following the "IC" Component
category, we generally add an
abbreviated name of the IC
manufacture. These are
examples of the abbreviations
we use: • AMD • Allegro •
Analog devices • Atmel • Burr
Brown • Dallas Semi • Fairchild
• Fujitsu • Hitachi Semi •
Intersil • Linear Technology •
Maxim • Microchip • National •
OKI • Philips Semi • ST Micro •
TI • Toshiba Next, the
component's part number is
added. Letters in the part
number are written in upper
case. Following the part
number, a short description of
the part can optionally be
added. Here are a few
examples: LM4861 - Amplifier
LM7805 - Regulator AT90S2313
- Microcontroller MAX873 -
Voltage reference ððð Note
that only the first letter of the
description is in upper case and
the words are separated by
spaces. In some cases a
component package type is
added to the end of the name.
This is done when a component
is available in multiple
packages, each having different
pin numbers. These are
examples of a few of the
package type abbreviations
that we use: DIP-40 PLCC-44
QFP-64 SOIC-20 SSOP-28 ððð It
is very important when picking
package type, that the name be
based on the package name
used in the ExpressPCB
program. Double check within
the ExpressPCB program to
verify that the package name
you have selected has pad sizes
and spacing appropriate for
your component.
______________ Here are
several examples of component
names using the ExpressSCH
naming convention with all of
the fields discussed above: IC -
AMD - AM29DL322 - Flash
memory IC - Maxim - MAX232 -
Line driver receiver IC -
National - LM7805 - Regulator -
TO-92 IC - National - LM7805 -
Regulator - TO-220 IC - Atmel -
AT90S8515 - Microcontroller -
PLCC-44 IC - Atmel - AT90S8515
- Microcontroller - DIP-40
Modifying Components From
Our Library In some cases, it is
fastest to build a new
component by starting with a
close fit from our library. In
other cases it is handy to make
simple changes to one of our
library components so that its
appearance is better suited for
your schematic. For example,
you may want to rearranging
the order the pins. Modifying a
component from our library is
easily done by first inserting the
component into your
schematic. Next select the
component with the mouse
and then ungroup it using the
Ungroup component command
from the Component menu.
Now move things around or
make any other changes you
wish using the methods
described above. Finally,
regroup it back together to
create the new part using the
Group to make component
command. The changes that
you make will not affect the
original part in our ExpressSCH
library. Creating Components
With Multiple Gates Some
integrated circuits have
multiple gates in one chip. For
example a 74LS32 TTL
component includes four OR
gates in a 14 pin DIP package.
Here is the procedure for
creating schematic symbols
that have multiple gates in a
single package: 1. Create the
first gate using the steps listed
above in the Making Custom
Schematic Components From
Scratch section. The first gate
should include the power
supply and ground pins. 2.
Assign the pin numbers to each
pin on this first gate. 3. Group
the first gate together by
selecting its pieces and
choosing the Group to make
component command. 4. In the
Components Properties dialog
box, fill in the Part name field
with the IC name (i.e. 74LS32)
and assign the Part ID field to
U. 5. Create each of the
remaining gates one at a time,
grouping them individually
using the same steps 1 through
4. On these gates, do not
include the power pins. Each
gate should have the Part ID set
to U and have the same Part
name as the first. 6. After all of
the gates have been created,
save them in your library as a
single component. Do this by
selecting all the gates with the
mouse and then choosing the
Save custom component
command from the Component
menu. Here is an example
showing a 74LS32 with its four
OR gates: Note that only the
first gate includes the power
and ground lines, shown as pins
14 and 7. Each of these four
gates have been created
individually. That way they can
be moved around
independently in a schematic.
However when the component
is saved in the library, all four
gates that make up one IC
package are saved together.
When a component with
multiple gates is selected from
the library and inserted into
your schematic, all of the gates
will be added at once. Feel free
to position each gate
individually in the schematic.
Be sure to set the same Part ID
value for each gate. Keep in
mind that the Part ID
represents the package, not the
individual gate. For example
these four gates might all have
their Part IDs set to U7. Custom
Component Files When a
component is saved using the
Save custom component
command, it is saved in an
individual file on your computer
and has a .S extension. The
name of the file is the same as
the one you entered when
naming your component. You
can find these files in a
subdirectory where the
ExpressPCB software is
installed. Typically ExpressPCB
and ExpressSCH are installed in
the directory: C:\Program Files\
ExpressPCB If this is where you
installed our software, then you
will find your custom
components in the directory:
C:\Program Files\ExpressPCB\
SchComponents_Custom Feel
free to move the component
files that you have created from
one computer to any other
where ExpressSCH is installed.
Generation 2 VHG Laser
design
After the partial success of the
first-generation VHG laser, it
was necessary to design a
second-generation model with a
higher level of cavity stability,
and with a more flexible silicon
flexure to allow for a broader
PZT sweeping range. The full
second-generation design is
shown
in Fig. 4. This generation 2 laser
has overall dimensions of
18.5mm x 17mm x 17mm. Each
component will be examined in
more detail in the following
discussion.
Zerodur Tubes
One of the main goals in the
generation 2 VHG laser design
was to created a very stable and
robust laser cavity. Thus two
circular zerodur pieces were
designed to encompass the
entire
cavity to protect it against
thermal fluctuations and
external vibrations. Zerodur is a
ceramic with
low thermal conductivity and a
near zero thermal expansion
coefficient of 0.01 x 10-6 m/K
[9].
The design includes two
zeordur tubes, one enclosing the
lens and VHG, and the other
enclosing
the diode, to allow for optical
feedback to be found by moving
the lens and VHG with respect
to
the diode. After feedback is
found, the goal is to optically
contact the two zerodur pieces,
making them essentially one
piece. Thus, the diode, lens, and
VHG will ultimately be fixed
with
respect to the zerodur, and
therefore essentially fixed with
respect to each other, creating a
superstable.
Copper Pieces
The main purpose of using
copper to surround the two
zerodur tubes is its good
thermal
conductivity. The right copper
piece comes in direct contact
with the laser diode, making it
is
easy and quick to control the
diode temperature via a TEC
placed on the copper piece. The
reason to add the second copper
piece is to regulate the
temperature between the laser
diode and
VHG. Because the temperature
of diode and VHG might be
different when the laser system
is
operating, there will be a
thermal gradient between the
front and back of the laser
cavity.
Although zerodur’s low
conductivity will make it easier
to establish this thermal
gradient, the
addition of the copper piece will
further aide in maintaining the
gradient. A third copper piece
was designed, but never
implemented, to thermally
control the VHG.
7
Laser Diode
A 785 nm laser diode
(HL7851G, Thorlabs) was used
in the laser system. The
measured
center wavelength of this diode
at room temperature (25ºC) was
781 nm. The diode was rated
for
50 mW power output at 150 mA
current. To save costs, the diode
was not AR-Coated, and
therefore a less than ideal
mode-hop-free range is
expected for the entire laser
system, since the
front diode surface itself forms
a cavity within the diode. Thus
multiple cavities with
competing
modes will be formed within
the laser, decreasing the mode-
hop-free range.
Collimation Lens and Lens
Holder
A collimating lens (GELTECH
350390-B molded glass
aspheric lens) has been used to
collimate
the emitted laser beam from
laser diode. The numerical
aperture is 0.67 mm and the
effective
focal length is 2.75 mm. The
AR-coating for laser
wavelength ranges from 600 nm
to 1050 nm.
The lens holder is designed to
hold the collimation lens and
permit it to be translated in the
cavity’s axial direction,
providing for optimal
collumiation of the laser beam.
The lens holder
consists of two invar sleeves.
The outer sleeve is designed to
be glued to the zerodur tube,
and
the inner sleeve is designed to
rigidly hold the lens, thus
allowing the inner sleeve and
lens to
slide axially with respect to the
outer sleeve. This provides the
lens a sufficient range of motion
so that good columniation can
be achieved. The lens holder is
made of invar, with a low
thermal
expansion coefficient of 1.2 x
10-6 m/K, to minimize thermal
drift in the lens position.
Silicon Flexure
The design of the silicon
flexure, shown in Fig. 5a, is
similar to that of the first
generation
VHG laser (Fig. 2). It was
micromachined of a 500 μm
thick single-crystal silicon
wafer, with
8
dimensions of 12.7mm x
12.7mm. However, instead of
making two 300 μm deep
flexure cuts on
both the front and back side of
the silicon flexure, two 350 μm
cuts on the front side and four
350 μm cuts on the back side
were made to allow for a larger
PZT sweep range of the VHG.
Also, the PZT pockets were
placed in a rectangular patter,
instead of a linear patter,
providing a
more compact flexure design
with less surface area. Since the
silicon flexure directly contacts
the VHG, it allows for VHG
temperature control. The
flexure, along with the backside
plate, also
allow the PZTs to be preloaded