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Chapter 10 Solutions Overview

This document contains solutions to problems from Chapter 10 of a semiconductor physics textbook. It includes calculations of various semiconductor device parameters such as depletion widths, barrier heights, doping concentrations, and flat-band voltages. The solutions involve equations related to semiconductor physics and require multiple steps of substitution.

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0% found this document useful (0 votes)
236 views17 pages

Chapter 10 Solutions Overview

This document contains solutions to problems from Chapter 10 of a semiconductor physics textbook. It includes calculations of various semiconductor device parameters such as depletion widths, barrier heights, doping concentrations, and flat-band voltages. The solutions involve equations related to semiconductor physics and require multiple steps of substitution.

Uploaded by

water9991234
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10

By D. A. Neamen Problem Solutions


______________________________________________________________________________________

Chapter 10
10.1
x dT  

 411.7  8.85  10 14 0.3173   1/ 2

  

(a) p-type; inversion
(b) p-type; depletion  1.6  10 19 7  10 15 
(c) p-type; accumulation 5
 3.43 10 cm
(d) n-type; inversion or x dT  0.343  m
_______________________________________
 3 1016 
(ii)  fp  0.03022 ln  
11 
 1.93 10 
10.2
N   0.3613 V
(a) (i)  fp  Vt ln  a 
 ni 
x dT  

 411.7  8.85  10 14 0.3613   1/ 2

 7 1015 
 0.0259 ln    
1.6  10 19 3  10 16 
 
10 
 1.5 10   1.77 10 cm 5

 0.3381 V or x dT  0.177  m
 4 s  fp 
1/ 2
_______________________________________
x dT  
 eN a 
10.3

 
 411.7  8.85  10 14 0.3381 
1/ 2
 4 s  fn 
1/ 2

 
1.6  10 19 7  10 15

 (a)  max   eN d x dT
Q SD  eN d  
   eN d 
 3.54 10 5 cm
or x dT  0.354  m  
 eN d  4 s  fn  1/ 2

 3 1016  1st approximation: Let  fn  0.30 V


(ii)  fp  0.0259 ln  
10 
 1.5 10  Then
 0.3758 V 1.25 10  8 2

x dT  
 
 411.7  8.85  10 14 0.3758 
1/ 2
 1.6 10 N 411.78.85 10 0.30
19 14

  

d
 1.6  10 19 3  10 16   N d  7.86 1014 cm 3
5
 1.80 10 cm 2nd approximation:
or x dT  0.180  m  7.86 1014 
 fn  0.0259 ln  10 
  0.2814 V
 350   1.5 10 
(b) kT  0.0259   0.03022 V
 300  Then
  Eg 
ni2  N c N  exp  1.25 10  8 2

 1.6 10 N 411.78.85 10 0.2814


 19 14
 kT  d

  
3
 350   N d  8.38 1014 cm 3
 2.8 1019 1.04 1019  
 300   8.38 1014 
(b)  fn  0.0259 ln  10 
  0.2831 V
  1.12   1.5 10 
 exp 
 0.03022   s  2 fn  20.2831  0.566 V
 3.7110 22 _______________________________________
so ni  1.93 1011 cm 3
 7 1015 
(i)  fp  0.03022 ln  
11 
 1.93 10 
 0.3173 V
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

10.4 10.7
p-type silicon From Problem 10.5,  ms  0.9932 V
(a) Aluminum gate Q
  Eg  V FB   ms  ss
 ms   m        fp  C ox
  2e 
(a) C ox  

ox 3.9 8.85 10 14 
We have t ox 200 10 8
N 
 fp  Vt ln  a   1.726 10 7 F/cm 2
 ni 
V FB  0.9932 
 
5 1010 1.6 10 19 
 6 1015  1.726 10 7
 0.0259 ln  10 
  0.334 V
 1.5 10   1.040 V
Then
(b) C ox 

3.9 8.85 10 14 
 ms  3.20  3.25  0.56  0.334 80 10 8
or  4.314 10 7 F/cm 2
 ms  0.944 V
V FB  0.9932 
 
5 1010 1.6 10 19 
(b) n  polysilicon gate 4.314 10 7
 Eg   1.012 V
 ms     fp   0.56  0.334  _______________________________________
 2e 
or 10.8
 ms  0.894 V (a)  ms  0.42 V
(c) p  polysilicon gate V FB   ms  0.42 V
 Eg  (b)
    fp   0.56  0.334
 ms
 2e  C ox 
3.98.85 10 14   1.726 10 7 F/cm 2
or 200 10 8
 ms  0.226 V Q
(i) V FB   ss  
 
4 1010 1.6 10 19 
_______________________________________ C ox 1.726 10 7
 0.0371 V
10.5
 4 1016  (ii) V FB  
 
1011 1.6 10 19 
 fp  0.0259 ln  10 
  0.3832 V 1.726 10  7
 1.5 10   0.0927 V
 Eg  (c) V FB   ms  0.42 V
 ms   m        fp 
 2e  C ox 
3.98.85 10 14   2.876 10 7 F/cm 2
 3.20  3.25  0.56  0.3832 120 10 8
 ms  0.9932 V (i) V FB  
 
4 1010 1.6 10 19 
_______________________________________ 2.876 10 7
 0.0223 V
10.6
(ii) V FB  
 
1011 1.6 10 19 
(a) N d  21017 cm 3 2.876 10  7
(b) Not possible -  ms is always positive.  0.0556 V
_______________________________________
(c) N d  21015 cm 3
_______________________________________
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

10.9  max   Q ss


Q SD
 Eg  VTN    ms  2 fp
 ms   m        fp  C ox
 2e 


6.958 10 8  7 1010 1.6 10 19  
where
2.30110 7
 fp  0.0259 ln 
 2 1016 
  0.365 V   ms  20.3653
10 
 1.5 10   0.9843   ms
Then (a) n  poly gate on p-type:  ms  1.12 V
 ms  3.20  3.25  0.56  0.365
VTN  0.9843  1.12  0.136 V
or
 ms  0.975 V (b) p 
poly gate on p-type:  ms  0.28 V
Now VTN  0.9843  0.28  1.26 V
Q (c) Al gate on p-type:  ms  0.95 V
V FB   ms  ss
C ox VTN  0.9843  0.95  0.0343 V
or _______________________________________
Q ss   ms  V FB C ox
We have 10.11

C ox  ox 

3.9 8.85 10 14   fn  0.0259 ln 
 3 1015 
  0.3161 V
10 
t ox 450 10 8  1.5 10 
or


 411.7  8.85  10 14 0.3161   1/ 2

C ox  7.67 10 8 F/cm 2


  

x dT
 1.6  10 19 3  1015 
So now
 
5
 5.223 10 cm
Qss   0.975   1 7.67 10 8
 max   eN d x dT
QSD
 1.92 10 9 C/cm 2
or  
 1.6 10 19 3 1015 5.223 10 5  
Q ss  2.507 10 C/cm 8 2
 1.2  10 10 cm 2
e
C ox 
 
3.9 8.85 10 14  2.30110 7 F/cm 2
_______________________________________ 150 10 8
10.10  max   Q ss 
 Q SD
VTP       ms  2 fn
 2 1016   C ox 
 fp  0.0259 ln    0.3653 V
10 
 1.5 10  
 2.507 10 8  1.6 10 19 7 1010 
 
 

x dT  

 411.7  8.85  10 14 0.3653   1/ 2
 2.30110 7 
 
1.6  10 19 2  10 16

    ms  20.3161
5 VTP  0.7898   ms
 2.174 10 cm
 max   eN a x dT
QSD (a) n  poly gate on n-type:  ms  0.41 V

 
 1.6 10 19 2 1016 2.174 10 5   VTP  0.7898  0.41  1.20 V
8 (b) p  poly gate on n-type:  ms  1.0 V
 6.958 10 C/cm 2

C ox 
 
3.9 8.85 10 14  2.30110 7 F/cm 2 VTP  0.7898  1.0  0.210 V
150 10 8 (c) Al gate on n-type:  ms  0.29 V
VTP  0.7898  0.29  1.08 V
_______________________________________
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

10.12 Now
 5 1015   4 1016 
 fp  0.0259 ln    0.3294 V
10 
 fp  0.0259 ln  
10 
 1.5 10   1.5 10 
The surface potential is  0.3832 V
 s  2 fp  20.3294  0.659 V 
 411.7  8.85  10 14 0.3832    1/ 2


  

We have x dT
 1.6  10 19 4  1016 
Q
V FB   ms  ss  0.90 V  1.575 10 cm 5
C ox
 max 
QSD
Now

VT 
 max 
Q SD
  s  V FB
 
 1.6 10 19 4 1016 1.575 10 5  
7
C ox  1.008 10 C/cm 2
We obtain  ms  0.94 V
 4 s  fp 
1/ 2
Then
x dT     max   Q ss
Q SD
 eN a  VTN    ms  2 fp
 
C ox
 411.7  8.85  10 0.3294  
1/ 2
14
 1.008 10 7  6.4 10 9
 
1.6  10 19 5  10 15 
  
1.569 10 7
 0.94  20.3832
or
x dT  0.413 10 4 cm
Then VTN  0.428 V  0.45 V
Then
 
 max   1.6  10 19 5  1015 0.413  10 4
Q SD   _______________________________________

or 10.14
 max   3.304  10 8 C/cm 2
Q SD
C ox  

ox 3.9 8.85 10 14 
We also find t ox 180 10 8

C ox  ox 

3.9 8.85 10 14   1.9175 10 7 F/cm 3
t ox 400 10 8 
Qss  1.6 10 19 4 1010  
or 9
 6.4  10 C/cm 2

C ox  8.629 10 8 F/cm 2


By trial and error, let N d  51016 cm 3
Then
Now
3.304 10 8
VT   0.659  0.90  5 1016 
8.629 10 8  fn  0.0259 ln  
10 
or  1.5 10 
VT  0.142 V  0.3890 V
_______________________________________
x dT  

 411.7  8.85  10 14 0.3890    1/ 2

10.13  
1.6  10 19 5  1016 
 
C ox 

ox 3.9 8.85 10 14

  1.419 10 cm 5

t ox 220 10 8 QSD max 


 1.569 10 7 F/cm 2  


 1.6 10 19 5 1016 1.419 10 5  

Qss  1.6 10 19
4 10  10
 1.135 10 C/cm 7 3

 6.4  10 9 C/cm 2  ms  1.10 V


Then
By trial and error, let N a  41016 cm 3 .
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

 Q  max   Q   Now
VTP     ms  2 fn
SD ss
Q ss
C ox V FB   ms 
1.135 10 7
 6.4 10 9  C ox

1.9175 10 7  1.03 
1.6 10 6 10 
19 10

 1.10  20.3890
7
1.9175 10
V FB  1.08 V
Then VTP  0.303 V, which is within the
 1015 
specified value. (b)  fp  0.0259 ln  
10 
_______________________________________  1.5 10 
 0.2877 V
10.15
We have C ox  1.569 10 7 F/cm 2 x dT  

 411.7  8.85  10 14 0.2877    1/ 2

Qss  6.4 10 9 C/cm 2  


1.6  10 19 10 15  


 8.630 10 5 cm
By trial and error, let N d  51014 cm 3
 max 
QSD
Now
 5 1014    
 1.6 10 19 1015 8.630 10 5 
 fn  0.0259 ln  
10  8
 1.5 10   1.38110 C/cm 2

 0.2697 V Now
 max 


 411.7  8.85  10 14 0.2697    1/ 2
VTN 
Q SD
 V FB  2 fp
  

x dT C ox
 1.6  10 19 5  10 14 
1.38110 8
 1.182 10 cm 4
  1.08  20.2877 
1.9175 10 7
 max 
QSD
or VTN  0.433 V
 
 1.6 10 19 5 1014 1.182 10 4   _______________________________________
9
 9.456 10 C/cm 2

 ms  0.33 V 10.17
(a) We have n-type material under the gate, so
Then
 Q  max   Q    4 s  fn 
1/ 2

x dT  t C   
VTP     ms  2 fn
SD ss

C ox  eN d 
where
 9.456 10 9  6.4 10 9 
    1015 
 1.569 10 7 
  fn  0.0259 ln    0.288 V
10 
 1.5 10 
 0.33  20.2697 
Then
 0.970 V
Then VTP  0.970 V  0.975 V which x dT  

 411.7  8.85  10 14 0.288   1/ 2

meets the specification.  


1.6  10 19 10 15  


_______________________________________ or
x dT  t C  0.863 10 4 cm  0.863  m
10.16
(b)
(a)  ms  1.03 V
t 
3.98.85 10 14  VT   QSD  max   Qss  ox    ms  2 fn
C ox   ox 
180 10 8
For an n  polysilicon gate,
 1.9175 10 7 F/cm 2
Eg 
 ms     fn   0.56  0.288
 2e 
 
or
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

 ms  0.272 V
VT 
4.797 10 300 10 
8 8

Now 3.98.85 10  14

  
 max   1.6  10 19 1015 0.863  10 4
Q SD   1.107  20.3473
or or
 max   1.38  10 8 C/cm 2
Q SD VT  0.00455 V  0 V
We have _______________________________________
  
Qss  1.6 10 19 1010  1.6 10 9 C/cm 2
10.19
We now find
 
Plot
 1.38 10 8  1.6 10 9
VT  500 10 8  _______________________________________

3.9 8.85 10 14

 0.272  20.288 10.20
Plot
or _______________________________________
VT  1.07 V
_______________________________________ 10.21
Plot
10.18 _______________________________________
 Eg 
(b)  ms   m        fp  10.22
 2e  Plot
where _______________________________________
 m     0.20 V
and 10.23
 1016  (a) For f  1 Hz (low freq),
 fp  0.0259 ln    0.3473 V
10 
 1.5 10  C ox  

ox 3.9 8.85 10 14 
Then t ox 120 10 8
 ms  0.20  0.56  0.3473  2.876 10 7 F/cm 2
or ox
 ms  1.107 V  
C FB
  V 
(c) For Q ss  0 t ox   ox  t s
 s  eN a
t 
 max   ox    ms  2 fp
VTN  QSD 
3.98.85 10 14 
 ox 
 3.9  0.0259 11.7 8.85  10 
14
120  10 8   
We find
 11.7  1.6 10 10 
19 16


 14

 411.7  8.85  10 0.3473 
1/ 2

  1.346 10 7 F/cm 2


   
x dT C FB
 1.6  10 19 10 16 
ox
or  
C min
 
x dT  0.30 10 4 cm  0.30  m t ox   ox   x dT
Now  s 
 
 max   1.6  10 19 1016 0.30  10 4
Q SD   Now
 1016 
or  fp  0.0259 ln    0.3473 V
10 
 max   4.797  10 8 C/cm 2
Q SD  1.5 10 
Then


 411.7  8.85  10 14 0.3473  1/ 2

   
x dT
 1.6  10 19 10 16 
5
 3.00 10 cm
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

Then

 411.7  8.85  10 14 0.2697    1/ 2

 
3.98.85 10 14
 x dT 

1.6  10 19 5  10 14  

C min  
 3. 9 
120  10 8   
 3.00  10
5
  1.182 10 cm 4
 11 . 7 
Then
 3.083 10 8 F/cm 2
 
C min
3.98.85 10 14 
C  (inv)  C ox  2.876 10 7 F/cm 2
(b) f  1 MHz (high freq),
 3.9 
120  10 8    1.182  10
4
 
 11.7 
C ox  2.876 10 7 F/cm 2 (unchanged)  8.504 10 9 F/cm 2
  1.346 10 F/cm
C FB 7 2
(unchanged) C  (inv)  C ox  2.876 10 7 F/cm 2
  3.083 10 8 F/cm 2 (unchanged)
C min (b) f  1 MHz (high freq),
  3.083 10 8 F/cm 2
C  (inv)  C min C ox  2.876 10 7 F/cm 2 (unchanged)
(c) V FB   ms  1.10 V   4.726 10 8 F/cm 2 (unchanged)
C FB
 max 
Q SD   8.504 10 9 F/cm 2 (unchanged)
C min
VTN   V FB  2 fp
C ox   8.504 10 9 F/cm 2
C  (inv)  C min
Now (c) V FB   ms  0.95 V
 max   eN a x dT
 max 
QSD
Q SD
  
 1.6 10 19 1016 3.00 10 5  VTP  
C ox
 V FB  2 fn
8
 4.80 10 C/cm 2
Now
4.80 10 8  max   eN d x dT
VTN   1.10  20.3473 QSD
2.876 10 7
VTN  0.2385 V
 
 1.6 10 19 5 1014 1.182 10 4  
9
 9.456 10 C/cm 2
_______________________________________
Then
9.456 10 9
10.24 VTP    0.95  20.2697 
(a) f  1 Hz (low freq), 2.876 10  7

C ox  

ox 3.9 8.85 10 14  VTP  0.378 V
t ox 120 10 8 _______________________________________

 2.876 10 7 F/cm 2 10.25


ox The amount of fixed oxide charge at x is
 
C FB
  V   x x C/cm 2
t ox   ox  t s
 s  eN a
By lever action, the effect of this oxide charge
3.98.85 10 14 
on the flatband voltage is
 1  x 
   x x
 3.9  0.0259 11.7 8.85  10  V FB  
14
120  10 8    C ox  t ox 
 11.7  1.6 10 5 10 
19 14
If we add the effect at each point, we must
  4.726 10 8 F/cm 2
C FB integrate so that
x x 
t ox
ox

1
 
C min V FB   dx
  C ox t ox
t ox   ox   x dT 0

 s  _______________________________________
Now
 5 1014 
 fn  0.0259 ln    0.2697 V
10 
 1.5 10 
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

10.26
QSS
1
t ox  O  QSS   O 
b
2 1.6  10
19
gb8  10 g 10

(a) We have  x   2 200  10


8

t
or  O  1.28  10
2

Then
Now
x x 
z
t ox
1
VFB   dx t ox

z F
G xI
Ht J
1 1
Cox t ox VFB    x  O
F
0

IJF I Cox t ox Kdx


z
t ox
QSS 0 ox


1
G
b gHK HK
t ox

af z
t ox
dx 1 O
Cox t ox  t t ox t  
2
x dx
2

FQ I t  at  t f   Q
1
Cox t ox 0

C H t K
 SS
ox ox
SS
which becomes
C
O t ox
 O t ox
3 2
ox ox
1 x
VFB     
or
Ft I F
G I af
J t 3 3
2
0

Ht K
ox ox

 Q G J
ox

VFB
H K
ox
SS ox
ox
Then
b1.6  10 g b8  10 gb200  10 g b

19 10 8

1.28  10 g b200  10 g 2 8 2

3.9b8.85  10 g
14 VFB 
33.9b8.85  10 g
14

or
or V FB  0.0494 V
VFB  0.0742 V
_______________________________________
(b) 10.27
We have Sketch

 x  
QSS

b1.6  10 gb8  10 g 19 10
_______________________________________
8
t ox 200  10
10.28
 6.4  10   O
3
Sketch
_______________________________________
Now
x x 
z z
t ox t ox
1  10.29
VFB   dx   O xdx
Cox t ox Cox t ox (b)
0 0
N N 
or V FB  Vbi  Vt ln  a 2 d 

 O t ox  ni 
2

VFB  
2 ox
 0.0259  ln 
  
 1016 1016 

b
 6.4  10 gb200  10 g 3 8 2

 1.5  1010 
2


23.9 b
8.85  10 g
14 or
V FB  0.695 V
or
(c) Apply VG  3 V, Vox  3 V
VFB  0.0371 V
(c)
For VG  3 V,
Fx I
 x    GJ d 
Ht K O
ox dx

s
We find n-side:   eN d
d eN eN x
  d     d  C1
dx s s
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
have
eN d x n
  0 at x   x n , then C1   2Vn  Vox  Vbi
s
so which can be written as
eN eN d x n2 eN d x n t ox
   d x  x n  for  x n  x  0   Vbi
s s s
In the oxide,   0 , so or
d
V 
 0    constant. From the x n2  x n t ox  bi s  0
dx eN d
boundary conditions, in the oxide Solving for x n , we obtain
eN x 2
 d n t t   V
s x n   ox   ox   s bi
2  2  eN d
In the p-region,
d  eN a eN a x If we apply a voltage V G , then replace V bi by
    C2 Vbi  VG , so
dx s s s

  0 at x  t ox  x p , then  t ox  t   V  VG 
2

xn  x p     ox   s bi

eN a
s
t ox  xp  x  2  2  eN d
We find
eN a x p eN d x n 500  10 8
At x  t ox ,     xn  x p  
s s 2
So that N a x p  N d x n  500 10 8 
   
2

11.7 8.85 10 14 3.695 
Since N a  N d , then x n  x p  2 
 
1.6 10 19 1016  
The potential is which yields

   dx x n  x p  4.646  10 5 cm
For zero bias, we can write Now
Vn  Vox  V p  Vbi V ox 
eN d x n t ox
where Vn , Vox , V p are the voltage drops s
across

1.6 10 10 4.646 10 500 10 
19 16 5 8

the n-region, the oxide, and the p-region, 11.78.85 10  14

respectively. For the oxide: or


eN d x n t ox Vox  0.359 V
V ox    t ox 
s We also find
For the n-region: eN d x n2
eN d  x 2  Vn  V p 
Vn x   
  x n  x   C  2 s
s  2 

1.6 10 10 4.646 10 
19 16 5 2

211.7 8.85 10 


Arbitrarily, set V n  0 at x   x n , then 14

eN d x n2
C  so that or
2 s Vn  V p  1.67 V
eN d
V n x    x  x n 2 _______________________________________
2 s
10.30
eN d x n2 (a) n-type
At x  0 , V n  which is the voltage
2 s (b) We have
drop across the n-region. Because of 200 10 12
C ox   110 7 F/cm 2
symmetry, Vn  V p . Then for zero bias, we 2 10 3
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
Also

C ox 
ox 
 t ox  ox 

3.9 8.85 10 14  
Qn  C ox  VGS  V DS 
t ox C ox 110 7 
or  max   Q ss
 Q SD  
6
o    ms  2 fp  
t ox  3.45 10 cm  34.5 nm  345 A
 C ox  

(c)
Using the definition of threshold voltage VT ,
Q
V FB   ms  ss we have
C ox Qn  C ox VGS  V DS   VT 
or At saturation
Q V DS  V DS sat   VGS  VT
 0.80  0.50  ss 7
10 which then makes Q n equal to zero at the
which yields
drain terminal.
Qss  3 10 8 C/cm 2  1.875 1011 cm 2 _______________________________________
(d)
ox 10.33
 
C FB
k n W
    kT  s 
t ox   ox    
(a) I D   
2VGS  VT V DS  V DS
2

 2 L
 s   e  eN d 
   
 3.9 8.85 10 14  3.45 10 6 
 0.18 
 2 

8 20.8  0.40.2  0.2
2

 3.9 

0.025911.7 8.85 10 14    0.0864 mA

 11.7  1.6 10 2 10 
19 16

k W
(b) I D  n  VGS  VT 
2

2 L
which yields
 0.18 
 80.8  0.4
2
  7.82 10 8 F/cm 2
C FB
 2 
or
 0.1152 mA
C FB  156 pF
(c) Same as (b), I D  0.1152 mA
_______________________________________
k W
(d) I D  n  VGS  VT 
2

10.31 2 L
(a) Point 1: Inversion  0.18 
 81.2  0.4
2
2: Threshold
3: Depletion  2 
4: Flat-band  0.4608 mA
5: Accumulation _______________________________________
_______________________________________
10.34
k p W
10.32
We have
(a) I D 
2 L
 
2V SG  VT V SD  V SD
2

 
Qn  Cox VGS  Vx    ms  2 fp 
 Q ss  Q SD
 max 
 0.10 

 2 

15 20.8  0.40.25  0.25
2

Now let V x  V DS , so I D  0.103 mA
 k p W
Qn  C ox VGS  V DS  (b) I D   V SG  VT 
2

 2 L
 max   Q ss
 Q SD   0.10 
    150.8  0.4
2
   ms  2 fp
 C ox    2 

 0.12 mA
 max  is a
For a p-type substrate, Q SD
negative value, so we can write
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

k p W 10.37
 V SG  VT 
(c) I D 
3.98.85 10 14   3.138 10 7 F/cm 2
2

2 L C ox 
 0.10  110 10 8
151.2  0.4

 
2

 2   C W 425 3.138  10 7 20


K n  n ox 
 0.48 mA 2L 21.2
(d) Same as (c), I D  0.48 mA  1.11110 3 A/V 2 =1.111 mA/V 2
_______________________________________ (a) VGS  0 , I D  0
VGS  0.6 V, V DS sat   0.15 V,
10.35
k W I D sat   1.1110.6  0.452
(a) I D  n  VGS  VT 
2

2 L  0.025 mA
VGS  1.2 V, V DS sat   0.75 V,
 0.6  W 
1.0    1.4  0.8
2
I D sat   1.1111.2  0.45
2
 2  L 
W  0.625 mA

L
 9.26 VGS  1.8 V, V DS sat   1.35 V,
I D sat   1.1111.8  0.45
2
 0.6 
(b) I D   9.261.85  0.8
2

 2   2.025 mA
 3.06 mA VGS  2.4 V, V DS sat   1.95 V,
k W I D sat   1.1112.4  0.45
 
2
(c) I D  n  2VGS  VT V DS  V DS
2

2 L  4.225 mA

 0.6 
 2 

9.26 21.2  0.80.15  0.15
2
 (c) I D  0 for VGS  0.45 V
VGS  0.6 V,
 0.271 mA
_______________________________________

I D  1.111 20.6  0.450.1  0.1
2

 0.0222 mA
10.36 VGS  1.2 V,
(a) Assume biased in saturation region 
I D  1.111 21.2  0.450.1  0.1
2

k p W  0.156 mA
ID   V SG  VT 
2

2 L VGS  1.8 V,

0.10  
 0.12 
200  VT 
2 
I D  1.111 21.8  0.450.1  0.1
2

 2   0.289 mA
 VT  0.289 V VGS  2.4 V,
Note: V SD  1.0 V  V SG  VT  0  0.289 V 
I D  1.111 22.4  0.450.1  0.1
2

So the transistor is biased in the saturation  0.422 mA
region. _______________________________________
 0.12 
(b) I D   200.4  0.289
2

 2  10.38
 0.570 mA
C ox  

ox 3.9 8.85 10 14 
 0.12  t ox 110 10 8
(c) I D   2020.6  0.2890.15
 2   3.138 10 7 F/cm 2
 0.15
2
 Kp 
 p C ox W
or 2L
I D  0.293 mA


210 3.138 10 7 35 
_______________________________________ 21.2
 9.6110 4 A/V 2 =0.961 mA/V 2
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

(a) V SG  0 , I D  0 10.40
V SG  0.6 V, V SD sat   0.25 V Sketch
_______________________________________
I D sat   0.9610.6  0.35
2

 0.060 mA 10.41
V SG  1.2 V, V SD sat   0.85 V Sketch
_______________________________________
I D sat   0.9611.2  0.35
2

 0.694 mA 10.42
V SG  1.8 V, V SD sat   1.45 V We have
V DS sat   VGS  VT  V DS  VT
I D sat   0.9611.8  0.35
2

so that
 2.02 mA
V DS  V DS sat   VT
V SG  2.4 V, V SD sat   2.05 V
Since V DS  V DS sat  , the transistor is always
I D sat   0.9612.4  0.35
2
biased in the saturation region. Then
 4.04 mA
I D  K n VGS  VT 
2

(c) I D  0 for V SG  0.35 V


where, from Problem 10.37,
V SG  0.6 V
K n  1.111 mA/V 2 and VT  0.45 V

I D  0.961 20.6  0.350.1  0.1
2
 Then
 0.0384 mA V DS  VGS I D (mA)
V SG  1.2 V 0 0

I D  0.961 21.2  0.350.1  0.1
2
 1
2
0.336
2.67
 0.154 mA
3 7.22
V SG  1.8 V
 
4 14.0
I D  0.961 21.8  0.350.1  0.1
2
5 23.0
 0.269 mA _______________________________________
V SG  2.4 V
 
10.43
I D  0.961 22.4  0.350.1  0.1
2
From Problem 10.38, K p  0.961 mA/V 2
 0.384 mA
_______________________________________ 
I D  K p 2V SG  VT V SD   V SD
2

I D
10.39 gd   2K p VSG  VT 
VSD VSD 0
(a) From Problem 10.37, K n  1.111 mA/V 2
For V SG  0.35 V, g d  0
For VGS  0.8 V, I D  0
For V SG  0.35 V,
VGS  0 , V DS sat   0.8 V
g d  20.961V SG  0.35
I D sat   1.1110  0.8
2
For V SG  2.4 V,
 0.711 mA g d  20.9612.4  0.35
VGS  0.8 V, V DS sat   1.6 V
 3.94 mA/V
I D sat   1.1110.8  0.8
2
_______________________________________
 2.84 mA
VGS  1.6 V, V DS sat   2.4 V
I D sat   1.1111.6  0.8
2

 6.40 mA
_______________________________________
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

10.44 (b)
I D I D sat   K n VGS  VT   K nV DS sat 
2 2
(a) g m 
V GS so
2 10 4  K n 4

  
2
 K n 2VGS  VT V DS   V DS
2

VGS which yields


 K n 2V DS  K n  12.5  A/V 2
1.25  K n 20.05 (c)
V DS sat   VGS  VT  2  0.8  1.2 V
 K n  12.5 mA/V 2
so V DS  V DS sat 
(b) I D  12.520.8  0.30.05 0.05
2
  
I D sat   1.25 10 5 2  0.8
2
 0.594 mA
(c) I D  12.50.8  0.3
2 or
I D sat   18  A
 3.125 mA
(d)
V DS  V DS sat 
_______________________________________

10.45 
I D  K n 2VGS  VT V DS  V DS
2

We find that VT  0.2 V  
 1.25 10 5 23  0.81  1
2

Now or
W n C ox I D  42.5  A
I D sat    VGS  VT 
2L _______________________________________
where

ox 3.9 8.85 10 14  10.47
C ox 
t ox

425 10 8 (a) C ox 
3.98.85 10 14 
or 180 10 8
C ox  8.12 10 8 F/cm 2  1.9175 10 7 F/cm 2
We are given W L  10 . From the graph, for 
(i) k n   n C ox  450 1.9175 10 7 
5
VGS  3 V, we have  8.629 10 A/V 2

I D sat   0.033 , or k n  86.29  A/V 2


 k   W 
then (ii) I D sat    n  VGS  VT 
2

W n C ox  2  L 
0.033   3  0.2
 0.08629  W 
 2  0.4
2L
0.8  
2
or  2  L 
W n C ox
 0.139 10 3 
W
 7.24
2L L
or

(b) (i) k p   p C ox  210  1.9175  10 7 
1
2
 
10 n 8.12 10 8  0.139 10 3  4.027 10 A/V 5 2

which yields or k p  40.27  A/V 2


 n  342 cm 2 /V-s  k p  W 
(ii) I D sat     VSG  VT 
2
_______________________________________
  
2 L
 0.04027  W 
 2  0.4
10.46
0.8  
2
(a)  2  
L
V DS sat   VGS  VT
W
or   15.5
L
4  VGS  0.8  VGS  4.8 V
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
_______________________________________  1.135 10 7 C/cm 2

10.48  max 
Q SD
From Problem 10.37, K n  1.111 mA/V 2 VTO   V FB  2 fp
C ox
(a) g mL 

 
K n 2VGS  VT V DS   V DS
2
 1.135 10 7
VGS   0.5  20.3890
2.30110 7
 K n 2V DS   1.11120.1
 0.7713 V
so g mL  0.222 mA/V  C W
K n  n ox
(b) g ms 


K n VGS  VT 
2
 2L
VGS

 
450  2.301  10 7 8 
 2 K n VGS  VT   21.1111.5  0.45 21.2 
so g ms  2.33 mA/V  3.452 10 4 A/V 2
_______________________________________ or K n  0.3452 mA/V 2

10.49 For I D  0 , VGS  VTO  0.7713 V


For I D  0.5  0.3452VGS  0.7713
2
From Problem 10.38, K p  0.961 mA/V 2
 VGS  1.975 V
(a) g mL 

V SG
 
K p 2V SG  VT V SD   V SD
2
 (c) (i) For V SB  0 , VT  VTO  0.7713 V
 K p 2VSD   0.96120.1 (ii) V SB  1 V,
or g mL  0.192 mA/V 
VT  0.5594 20.389  1

(b) g ms 


K p V SG  VT 
2
  20.389 
V SG  0.2525 V
 2K p VSG  VT   20.9611.5  0.35 VT  0.7713  0.2525  1.024 V
or g ms  2.21 mA/V (iii) V SB  2 V,
_______________________________________ VT  0.5594 20.389  2
10.50  20.389 
2e s N a  0.4390 V
(a)  
C ox VT  0.7713  0.4390  1.210 V
3.98.85 10 14  (iv) V SB  4 V,
Now C ox 
150 10 8 VT  0.5594 20.389  4
Then
 2.30110 7 F/cm 2  20.389 
 0.7294 V

  
2 1.6 10 19 11.7 8.85 10 14 5 1016   VT  0.7713  0.7294  1.501 V
2.30110 7 _______________________________________
  0.5594 V 1/ 2

10.51
 5 1016 
(b)  fp  0.0259 ln    0.3890 V  1016 
10 
 1.5 10   fp  0.0259 ln    0.3473 V
10 
 1.5 10 

 411.7  8.85  10 14 0.3890  

 1/ 2

VT    2  V  2 
(i) x dT

1.6  10 19 5  10 16 

 fp SB fp

 0.12 20.3473  2.5


 
 1.419 10 5 cm
 max 
QSD  20.3473 
 
 1.6 10 19 5 1016 1.419 10 5   or
VT  0.114 V
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

Now VT  VTO  VT C ox  8.63 10 8 F/cm 2


0.5  VTO  0.114 We find
 VTO  0.386 V   
Qss  1.6 10 19 5 1010  8 10 9 C/cm 2
_______________________________________ Then
 max   Q ss
Q SD
10.52 VT    ms  2 fp
(a) C ox 
3.98.85 10 14  C ox
200 10 8  1.38 10 8  8 10 9 
    1.0  20.288
 1.726 10 7 F/cm 2 8.63 10 8 
 
2e s N d or
 VT  0.357 V
C ox
(b) For NMOS, apply V SB and VT shifts in a

  
2 1.6 10 19 11.7 8.85 10 14 5 1015   positive direction, so for VT  0 , we want
1.726 10 7 VT  0.357 V.
  0.2358 V 1 / 2 So
 5 1015 
(b)  fn  0.0259 ln    0.3294 V
10 
 1.5 10 
VT 
2e s N a
C ox
 2 fp  V SB  2 fp 
VT    2  V BS  2 fn  or
    
fn


 0.22  0.2358 20.3294  VBS  0.357 
2 1.6 10 19 11.7 8.85 10 14 1015


8
8.63 10
 20.3294
 V BS  2.39 V

 20.288  VSB  20.288 
or
_______________________________________

0.357  0.211 0.576  VSB  0.576 
10.53 which yields
(a) n  poly-to-p-type   ms  1.0 V VSB  5.43 V
_______________________________________
 1015 
 fp  0.0259 ln    0.288 V
10 
 1.5 10  10.54
also Plot
_______________________________________
 4 s  fp 
1/ 2

x dT  
 eN a  10.55

 411.7  8.85  10 14 0.288 

 1/ 2 (a)
W n C ox
 
1.6  10 19 10 15  

 gm 
L
VGS  VT 
or W n ox
x dT  0.863 10 4 cm  VGS  VT 
Lt ox
Now
104003.98.85 10 14  5  0.65

 max   1.6  10 19 1015 0.863  10 4
Q SD    
475 10 8
or or
 max   1.38  10 8 C/cm 2
Q SD g m  1.26 mS
Also Now

C ox  

ox 3.9 8.85 10 14  g m 
gm g
 m  0.8 
1
t ox 400 10 8 1  g m rs gm 1  g m rs
or which yields
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

1  1  1  1  Then
rs    1    1
g m  0.8  1.26  0.8  
C M  1.035 10 14 
or  
 1  0.8974 10 3 10 10 3  
rs  0.198 k  or
(b) For VGS  3 V, g m  0.683 mS C M  1.032 10 13 F
Then Now
g m 
0.683
 0.602 mS 
C gsT  C ox L  0.75  10 4 W  
1  0.6830.198

3.98.85 10 14

or 8
g m 500 10
  
0.602
  0.88  2 10 4  0.75 10 4 20 10 4
g m 0.683
or
which is a 12% reduction.
_______________________________________ C gsT  3.797  10 14 F
We now find
10.56 gm
fT 
(a) The ideal cutoff frequency for no overlap
capacitance is,

2 C gsT  C M 
gm  V  V  0.8974 10 3
fT   n GS 2 T 
2 C gs 2 L 
2 3.797 10 14  1.032 10 13 

400 4  0.75 or
f T  1.01 GHz

2 2  10 4 2
 _______________________________________
or
f T  5.17 GHz 10.57
(b) Now (a) For the ideal case
gm  4 10 6
fT  f T  ds 

2 C gsT  C M  2 L 2 2 10  4  
where or
CM  C gdT 1  g m RL  f T  3.18 GHz
We find (b) With overlap capacitance (using the

C gdT  C ox 0.75  10 4 20  10 4   values from Problem 10.56),

3.98.85 10  gm
14
fT 
 8

2 C gdT  C M 
500 10

 0.75 10 4 20 10 4   We find
g m  WC ox ds
or
C gdT  1.035  10 14 F 
20 10 3.98.85 10 4 10 
4 14 6

8
500 10
Also or
W n C ox
gm  VGS  VT  g m  0.5522 10 3 S
L


 
20 10 4 4003.9 8.85 10 14   We have
CM  C gdT 1  g m RL 

2 10  4 500 10 8   
 1.035 10 14 
 4  0.75
or  
 1  0.5522 10 3 10 10 3  
g m  0.8974 10 3 S or
C M  6.750 10 14 F
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________

Then
0.5522 10 3
fT 

2 3.797 10 14  6.75 10 14 
or
f T  0.833 GHz
_______________________________________

Common questions

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The drain current (I_D) in saturation for a MOS transistor is described by the equation I_D = (1/2) μ_n C_ox (W/L) (V_GS - V_T)^2. An increase in the gate-source voltage (V_GS) while V_T remains constant enhances the overdrive voltage (V_GS - V_T) and exponentially increases I_D, transitioning the device further into saturation. Likewise, for a fixed V_GS, a higher V_T reduces the effective gate voltage, thus decreasing I_D as saturation necessitates a larger overdrive voltage. Source 6 illustrates these dynamics through V_GS variations, reflecting the quadratic relationship between V_GS-V_T and I_D .

The substrate doping concentration (N_d) heavily influences the flat-band voltage (V_FB) and the threshold voltage (V_T) of a semiconductor device. An increase in N_d raises the bulk potential (ψ_B), altering the flat-band condition by shifting the band alignment and requiring a modification in V_FB. This also affects V_T as it depends on the dopant-induced band bending quantified by V_T = V_FB + 2ψ_B + (√(2ε_si q N_d 2ψ_B) / C_ox). A higher N_d thus typically results in a more positive V_T for n-type devices, necessitating greater gate bias to achieve channel inversion, as discussed in Source 3 .

The threshold voltage (V_T) dictates when a MOSFET begins to conduct significantly. V_T is influenced by factors such as the body effect, oxide thickness, doping concentration, and surface state charge. The formula V_T = V_FB + 2ψ_B + (√(2ε_si q N_A 2ψ_B) / C_ox) incorporates these factors, with ψ_B being the bulk potential and N_A the doping concentration. For n-type materials under a gate, as seen in Source 3, V_T can be computed considering the oxide capacitance and the presence of charge traps, resulting in a specific voltage necessary to invert the surface potential and form a conducting channel .

Trial-and-error techniques in semiconductor parameter optimization involve iterative adjustments of doping concentrations (N_d) to achieve targeted electrical characteristics such as threshold voltage or flat-band voltage. This approach requires testing various doping levels under realistic simulation conditions, observing changes in device characteristics, and selecting configurations that meet design criteria. This method is particularly effective when theoretical models offer insufficient guidance due to complex interactions within the semiconductor material. Source 1 exemplifies how different values of N_d were tested until optimal device performance was noted, demonstrating the method's utility in achieving precise control over semiconductor junction properties .

The oxide capacitance (C_ox) plays a critical role in determining the flat-band voltage (V_FB) in semiconductor devices, which is essential for understanding MOS device behavior. It is calculated using parameters such as the oxide permittivity (ε_ox), oxide thickness (t_ox), and the equation C_ox = ε_ox / t_ox. The flat-band voltage can then be determined using V_FB = φ_ms - (Q_ss / C_ox), where φ_ms is the metal-semiconductor work function difference and Q_ss is the charge density on the semiconductor surface. For example, in Source 2, the equation involving C_ox and Q_ss estimates V_FB to be -1.08 V .

The body effect is primarily affected by the substrate bias voltage, doping concentration, and oxide thickness. It manifests as a shift in threshold voltage (V_T) when a potential difference is applied between the body and the source terminal, described by ΔV_T = γ (√(ψ_s + V_SB) - √ψ_s), with γ being the body effect coefficient. Designers can mitigate this by minimizing the body-source voltage (V_SB), adjusting doping levels to optimize ψ_s without overly increasing γ, or using wells in SOI technologies to effectively isolate body contacts, reducing body effect issues, as shown in the analysis from Source 4 .

The flat-band voltage (V_FB) serves as an indicator of interface states within a MOS structure. Deviations from expected V_FB values often point to the presence of these charge states at the semiconductor-oxide interface, which alter the distribution of charges and hence the device's electrostatic condition. Interface states impact device performance by increasing leakage currents and contributing to threshold voltage instability. Accurate measurements of V_FB against expected values can reveal these states, as discrepancies necessitate compensation in V_FB calculations. As explored in Source 1, unexpected swings in V_FB associated with calculated values highlight the impact of interface states .

The work function difference (Φ_ms) between the metal and semiconductor is crucial in determining the flat-band voltage (V_FB) of MOS capacitors. By proper selection and engineering of material properties to achieve an optimal Φ_ms, designers ensure that V_FB aligns with desired operational characteristics, minimizing band bending in equilibrium. This adjustment is necessary to fine-tune threshold voltages and maintain control over leakage currents and overall device stability under operating conditions. Source 1 mentions adjustments made to Φ_ms, affecting V_FB in design scenarios to meet semiconductor device specifications .

Capacitance, particularly oxide capacitance (C_ox), is a fundamental determinant of the transient response of semiconductors. A higher C_ox results in faster charge-discharge cycles, enabling quicker switching responses in MOS devices. The transient response is critical for high-frequency applications where rapid state changes are needed. C_ox influences the speed of these responses due to its impact on the time constant (τ = RC_ox), where R is the channel resistance. Reducing τ through optimized C_ox designs leads to enhanced operational speeds. These relationships are detailed in Source 2, illustrating how capacitance modulation impacts transient dynamics in MOSFET applications .

Oxide thickness (t_ox) significantly affects the capacitance (C_ox = ε_ox / t_ox), which is directly tied to the threshold voltage (V_T) of a MOSFET. Thicker oxides result in lower capacitance values, thereby increasing the threshold voltage due to reduced gate control over the channel. Conversely, thinner oxides offer higher capacitance, decreasing V_T and enabling better gate modulation of the channel, thereby enhancing device switching speed and reducing power consumption. As evidenced in Source 5, variations in t_ox directly impact V_T, influencing device efficiency and control .

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