Chapter 10 Solutions Overview
Chapter 10 Solutions Overview
Chapter 10
10.1
x dT
411.7 8.85 10 14 0.3173 1/ 2
(a) p-type; inversion
(b) p-type; depletion 1.6 10 19 7 10 15
(c) p-type; accumulation 5
3.43 10 cm
(d) n-type; inversion or x dT 0.343 m
_______________________________________
3 1016
(ii) fp 0.03022 ln
11
1.93 10
10.2
N 0.3613 V
(a) (i) fp Vt ln a
ni
x dT
411.7 8.85 10 14 0.3613 1/ 2
7 1015
0.0259 ln
1.6 10 19 3 10 16
10
1.5 10 1.77 10 cm 5
0.3381 V or x dT 0.177 m
4 s fp
1/ 2
_______________________________________
x dT
eN a
10.3
411.7 8.85 10 14 0.3381
1/ 2
4 s fn
1/ 2
1.6 10 19 7 10 15
(a) max eN d x dT
Q SD eN d
eN d
3.54 10 5 cm
or x dT 0.354 m
eN d 4 s fn 1/ 2
x dT
411.7 8.85 10 14 0.3758
1/ 2
1.6 10 N 411.78.85 10 0.30
19 14
d
1.6 10 19 3 10 16 N d 7.86 1014 cm 3
5
1.80 10 cm 2nd approximation:
or x dT 0.180 m 7.86 1014
fn 0.0259 ln 10
0.2814 V
350 1.5 10
(b) kT 0.0259 0.03022 V
300 Then
Eg
ni2 N c N exp 1.25 10 8 2
3
350 N d 8.38 1014 cm 3
2.8 1019 1.04 1019
300 8.38 1014
(b) fn 0.0259 ln 10
0.2831 V
1.12 1.5 10
exp
0.03022 s 2 fn 20.2831 0.566 V
3.7110 22 _______________________________________
so ni 1.93 1011 cm 3
7 1015
(i) fp 0.03022 ln
11
1.93 10
0.3173 V
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
10.4 10.7
p-type silicon From Problem 10.5, ms 0.9932 V
(a) Aluminum gate Q
Eg V FB ms ss
ms m fp C ox
2e
(a) C ox
ox 3.9 8.85 10 14
We have t ox 200 10 8
N
fp Vt ln a 1.726 10 7 F/cm 2
ni
V FB 0.9932
5 1010 1.6 10 19
6 1015 1.726 10 7
0.0259 ln 10
0.334 V
1.5 10 1.040 V
Then
(b) C ox
3.9 8.85 10 14
ms 3.20 3.25 0.56 0.334 80 10 8
or 4.314 10 7 F/cm 2
ms 0.944 V
V FB 0.9932
5 1010 1.6 10 19
(b) n polysilicon gate 4.314 10 7
Eg 1.012 V
ms fp 0.56 0.334 _______________________________________
2e
or 10.8
ms 0.894 V (a) ms 0.42 V
(c) p polysilicon gate V FB ms 0.42 V
Eg (b)
fp 0.56 0.334
ms
2e C ox
3.98.85 10 14 1.726 10 7 F/cm 2
or 200 10 8
ms 0.226 V Q
(i) V FB ss
4 1010 1.6 10 19
_______________________________________ C ox 1.726 10 7
0.0371 V
10.5
4 1016 (ii) V FB
1011 1.6 10 19
fp 0.0259 ln 10
0.3832 V 1.726 10 7
1.5 10 0.0927 V
Eg (c) V FB ms 0.42 V
ms m fp
2e C ox
3.98.85 10 14 2.876 10 7 F/cm 2
3.20 3.25 0.56 0.3832 120 10 8
ms 0.9932 V (i) V FB
4 1010 1.6 10 19
_______________________________________ 2.876 10 7
0.0223 V
10.6
(ii) V FB
1011 1.6 10 19
(a) N d 21017 cm 3 2.876 10 7
(b) Not possible - ms is always positive. 0.0556 V
_______________________________________
(c) N d 21015 cm 3
_______________________________________
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
1.6 10 19 2 1016 2.174 10 5 VTP 0.7898 0.41 1.20 V
8 (b) p poly gate on n-type: ms 1.0 V
6.958 10 C/cm 2
C ox
3.9 8.85 10 14 2.30110 7 F/cm 2 VTP 0.7898 1.0 0.210 V
150 10 8 (c) Al gate on n-type: ms 0.29 V
VTP 0.7898 0.29 1.08 V
_______________________________________
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
10.12 Now
5 1015 4 1016
fp 0.0259 ln 0.3294 V
10
fp 0.0259 ln
10
1.5 10 1.5 10
The surface potential is 0.3832 V
s 2 fp 20.3294 0.659 V
411.7 8.85 10 14 0.3832 1/ 2
We have x dT
1.6 10 19 4 1016
Q
V FB ms ss 0.90 V 1.575 10 cm 5
C ox
max
QSD
Now
VT
max
Q SD
s V FB
1.6 10 19 4 1016 1.575 10 5
7
C ox 1.008 10 C/cm 2
We obtain ms 0.94 V
4 s fp
1/ 2
Then
x dT max Q ss
Q SD
eN a VTN ms 2 fp
C ox
411.7 8.85 10 0.3294
1/ 2
14
1.008 10 7 6.4 10 9
1.6 10 19 5 10 15
1.569 10 7
0.94 20.3832
or
x dT 0.413 10 4 cm
Then VTN 0.428 V 0.45 V
Then
max 1.6 10 19 5 1015 0.413 10 4
Q SD _______________________________________
or 10.14
max 3.304 10 8 C/cm 2
Q SD
C ox
ox 3.9 8.85 10 14
We also find t ox 180 10 8
C ox ox
3.9 8.85 10 14 1.9175 10 7 F/cm 3
t ox 400 10 8
Qss 1.6 10 19 4 1010
or 9
6.4 10 C/cm 2
10.13
1.6 10 19 5 1016
C ox
ox 3.9 8.85 10 14
1.419 10 cm 5
Q max Q Now
VTP ms 2 fn
SD ss
Q ss
C ox V FB ms
1.135 10 7
6.4 10 9 C ox
1.9175 10 7 1.03
1.6 10 6 10
19 10
1.10 20.3890
7
1.9175 10
V FB 1.08 V
Then VTP 0.303 V, which is within the
1015
specified value. (b) fp 0.0259 ln
10
_______________________________________ 1.5 10
0.2877 V
10.15
We have C ox 1.569 10 7 F/cm 2 x dT
411.7 8.85 10 14 0.2877 1/ 2
0.2697 V Now
max
411.7 8.85 10 14 0.2697 1/ 2
VTN
Q SD
V FB 2 fp
x dT C ox
1.6 10 19 5 10 14
1.38110 8
1.182 10 cm 4
1.08 20.2877
1.9175 10 7
max
QSD
or VTN 0.433 V
1.6 10 19 5 1014 1.182 10 4 _______________________________________
9
9.456 10 C/cm 2
ms 0.33 V 10.17
(a) We have n-type material under the gate, so
Then
Q max Q 4 s fn
1/ 2
x dT t C
VTP ms 2 fn
SD ss
C ox eN d
where
9.456 10 9 6.4 10 9
1015
1.569 10 7
fn 0.0259 ln 0.288 V
10
1.5 10
0.33 20.2697
Then
0.970 V
Then VTP 0.970 V 0.975 V which x dT
411.7 8.85 10 14 0.288 1/ 2
ms 0.272 V
VT
4.797 10 300 10
8 8
max 1.6 10 19 1015 0.863 10 4
Q SD 1.107 20.3473
or or
max 1.38 10 8 C/cm 2
Q SD VT 0.00455 V 0 V
We have _______________________________________
Qss 1.6 10 19 1010 1.6 10 9 C/cm 2
10.19
We now find
Plot
1.38 10 8 1.6 10 9
VT 500 10 8 _______________________________________
3.9 8.85 10 14
0.272 20.288 10.20
Plot
or _______________________________________
VT 1.07 V
_______________________________________ 10.21
Plot
10.18 _______________________________________
Eg
(b) ms m fp 10.22
2e Plot
where _______________________________________
m 0.20 V
and 10.23
1016 (a) For f 1 Hz (low freq),
fp 0.0259 ln 0.3473 V
10
1.5 10 C ox
ox 3.9 8.85 10 14
Then t ox 120 10 8
ms 0.20 0.56 0.3473 2.876 10 7 F/cm 2
or ox
ms 1.107 V
C FB
V
(c) For Q ss 0 t ox ox t s
s eN a
t
max ox ms 2 fp
VTN QSD
3.98.85 10 14
ox
3.9 0.0259 11.7 8.85 10
14
120 10 8
We find
11.7 1.6 10 10
19 16
14
411.7 8.85 10 0.3473
1/ 2
x dT
1.6 10 19 10 16
5
3.00 10 cm
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
Then
411.7 8.85 10 14 0.2697 1/ 2
3.98.85 10 14
x dT
1.6 10 19 5 10 14
C min
3. 9
120 10 8
3.00 10
5
1.182 10 cm 4
11 . 7
Then
3.083 10 8 F/cm 2
C min
3.98.85 10 14
C (inv) C ox 2.876 10 7 F/cm 2
(b) f 1 MHz (high freq),
3.9
120 10 8 1.182 10
4
11.7
C ox 2.876 10 7 F/cm 2 (unchanged) 8.504 10 9 F/cm 2
1.346 10 F/cm
C FB 7 2
(unchanged) C (inv) C ox 2.876 10 7 F/cm 2
3.083 10 8 F/cm 2 (unchanged)
C min (b) f 1 MHz (high freq),
3.083 10 8 F/cm 2
C (inv) C min C ox 2.876 10 7 F/cm 2 (unchanged)
(c) V FB ms 1.10 V 4.726 10 8 F/cm 2 (unchanged)
C FB
max
Q SD 8.504 10 9 F/cm 2 (unchanged)
C min
VTN V FB 2 fp
C ox 8.504 10 9 F/cm 2
C (inv) C min
Now (c) V FB ms 0.95 V
max eN a x dT
max
QSD
Q SD
1.6 10 19 1016 3.00 10 5 VTP
C ox
V FB 2 fn
8
4.80 10 C/cm 2
Now
4.80 10 8 max eN d x dT
VTN 1.10 20.3473 QSD
2.876 10 7
VTN 0.2385 V
1.6 10 19 5 1014 1.182 10 4
9
9.456 10 C/cm 2
_______________________________________
Then
9.456 10 9
10.24 VTP 0.95 20.2697
(a) f 1 Hz (low freq), 2.876 10 7
C ox
ox 3.9 8.85 10 14 VTP 0.378 V
t ox 120 10 8 _______________________________________
s _______________________________________
Now
5 1014
fn 0.0259 ln 0.2697 V
10
1.5 10
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
10.26
QSS
1
t ox O QSS O
b
2 1.6 10
19
gb8 10 g 10
t
or O 1.28 10
2
Then
Now
x x
z
t ox
1
VFB dx t ox
z F
G xI
Ht J
1 1
Cox t ox VFB x O
F
0
1
G
b gHK HK
t ox
af z
t ox
dx 1 O
Cox t ox t t ox t
2
x dx
2
FQ I t at t f Q
1
Cox t ox 0
C H t K
SS
ox ox
SS
which becomes
C
O t ox
O t ox
3 2
ox ox
1 x
VFB
or
Ft I F
G I af
J t 3 3
2
0
Ht K
ox ox
Q G J
ox
VFB
H K
ox
SS ox
ox
Then
b1.6 10 g b8 10 gb200 10 g b
19 10 8
1.28 10 g b200 10 g 2 8 2
3.9b8.85 10 g
14 VFB
33.9b8.85 10 g
14
or
or V FB 0.0494 V
VFB 0.0742 V
_______________________________________
(b) 10.27
We have Sketch
x
QSS
b1.6 10 gb8 10 g 19 10
_______________________________________
8
t ox 200 10
10.28
6.4 10 O
3
Sketch
_______________________________________
Now
x x
z z
t ox t ox
1 10.29
VFB dx O xdx
Cox t ox Cox t ox (b)
0 0
N N
or V FB Vbi Vt ln a 2 d
O t ox ni
2
VFB
2 ox
0.0259 ln
1016 1016
b
6.4 10 gb200 10 g 3 8 2
1.5 1010
2
23.9 b
8.85 10 g
14 or
V FB 0.695 V
or
(c) Apply VG 3 V, Vox 3 V
VFB 0.0371 V
(c)
For VG 3 V,
Fx I
x GJ d
Ht K O
ox dx
s
We find n-side: eN d
d eN eN x
d d C1
dx s s
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
have
eN d x n
0 at x x n , then C1 2Vn Vox Vbi
s
so which can be written as
eN eN d x n2 eN d x n t ox
d x x n for x n x 0 Vbi
s s s
In the oxide, 0 , so or
d
V
0 constant. From the x n2 x n t ox bi s 0
dx eN d
boundary conditions, in the oxide Solving for x n , we obtain
eN x 2
d n t t V
s x n ox ox s bi
2 2 eN d
In the p-region,
d eN a eN a x If we apply a voltage V G , then replace V bi by
C2 Vbi VG , so
dx s s s
0 at x t ox x p , then t ox t V VG
2
xn x p ox s bi
eN a
s
t ox xp x 2 2 eN d
We find
eN a x p eN d x n 500 10 8
At x t ox , xn x p
s s 2
So that N a x p N d x n 500 10 8
2
11.7 8.85 10 14 3.695
Since N a N d , then x n x p 2
1.6 10 19 1016
The potential is which yields
dx x n x p 4.646 10 5 cm
For zero bias, we can write Now
Vn Vox V p Vbi V ox
eN d x n t ox
where Vn , Vox , V p are the voltage drops s
across
1.6 10 10 4.646 10 500 10
19 16 5 8
the n-region, the oxide, and the p-region, 11.78.85 10 14
eN d x n2
C so that or
2 s Vn V p 1.67 V
eN d
V n x x x n 2 _______________________________________
2 s
10.30
eN d x n2 (a) n-type
At x 0 , V n which is the voltage
2 s (b) We have
drop across the n-region. Because of 200 10 12
C ox 110 7 F/cm 2
symmetry, Vn V p . Then for zero bias, we 2 10 3
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
Also
C ox
ox
t ox ox
3.9 8.85 10 14
Qn C ox VGS V DS
t ox C ox 110 7
or max Q ss
Q SD
6
o ms 2 fp
t ox 3.45 10 cm 34.5 nm 345 A
C ox
(c)
Using the definition of threshold voltage VT ,
Q
V FB ms ss we have
C ox Qn C ox VGS V DS VT
or At saturation
Q V DS V DS sat VGS VT
0.80 0.50 ss 7
10 which then makes Q n equal to zero at the
which yields
drain terminal.
Qss 3 10 8 C/cm 2 1.875 1011 cm 2 _______________________________________
(d)
ox 10.33
C FB
k n W
kT s
t ox ox
(a) I D
2VGS VT V DS V DS
2
2 L
s e eN d
3.9 8.85 10 14 3.45 10 6
0.18
2
8 20.8 0.40.2 0.2
2
3.9
0.025911.7 8.85 10 14 0.0864 mA
11.7 1.6 10 2 10
19 16
k W
(b) I D n VGS VT
2
2 L
which yields
0.18
80.8 0.4
2
7.82 10 8 F/cm 2
C FB
2
or
0.1152 mA
C FB 156 pF
(c) Same as (b), I D 0.1152 mA
_______________________________________
k W
(d) I D n VGS VT
2
10.31 2 L
(a) Point 1: Inversion 0.18
81.2 0.4
2
2: Threshold
3: Depletion 2
4: Flat-band 0.4608 mA
5: Accumulation _______________________________________
_______________________________________
10.34
k p W
10.32
We have
(a) I D
2 L
2V SG VT V SD V SD
2
Qn Cox VGS Vx ms 2 fp
Q ss Q SD
max
0.10
2
15 20.8 0.40.25 0.25
2
Now let V x V DS , so I D 0.103 mA
k p W
Qn C ox VGS V DS (b) I D V SG VT
2
2 L
max Q ss
Q SD 0.10
150.8 0.4
2
ms 2 fp
C ox 2
0.12 mA
max is a
For a p-type substrate, Q SD
negative value, so we can write
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
k p W 10.37
V SG VT
(c) I D
3.98.85 10 14 3.138 10 7 F/cm 2
2
2 L C ox
0.10 110 10 8
151.2 0.4
2
2 L 0.025 mA
VGS 1.2 V, V DS sat 0.75 V,
0.6 W
1.0 1.4 0.8
2
I D sat 1.1111.2 0.45
2
2 L
W 0.625 mA
L
9.26 VGS 1.8 V, V DS sat 1.35 V,
I D sat 1.1111.8 0.45
2
0.6
(b) I D 9.261.85 0.8
2
2 2.025 mA
3.06 mA VGS 2.4 V, V DS sat 1.95 V,
k W I D sat 1.1112.4 0.45
2
(c) I D n 2VGS VT V DS V DS
2
2 L 4.225 mA
0.6
2
9.26 21.2 0.80.15 0.15
2
(c) I D 0 for VGS 0.45 V
VGS 0.6 V,
0.271 mA
_______________________________________
I D 1.111 20.6 0.450.1 0.1
2
0.0222 mA
10.36 VGS 1.2 V,
(a) Assume biased in saturation region
I D 1.111 21.2 0.450.1 0.1
2
k p W 0.156 mA
ID V SG VT
2
2 L VGS 1.8 V,
0.10
0.12
200 VT
2
I D 1.111 21.8 0.450.1 0.1
2
2 0.289 mA
VT 0.289 V VGS 2.4 V,
Note: V SD 1.0 V V SG VT 0 0.289 V
I D 1.111 22.4 0.450.1 0.1
2
So the transistor is biased in the saturation 0.422 mA
region. _______________________________________
0.12
(b) I D 200.4 0.289
2
2 10.38
0.570 mA
C ox
ox 3.9 8.85 10 14
0.12 t ox 110 10 8
(c) I D 2020.6 0.2890.15
2 3.138 10 7 F/cm 2
0.15
2
Kp
p C ox W
or 2L
I D 0.293 mA
210 3.138 10 7 35
_______________________________________ 21.2
9.6110 4 A/V 2 =0.961 mA/V 2
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
(a) V SG 0 , I D 0 10.40
V SG 0.6 V, V SD sat 0.25 V Sketch
_______________________________________
I D sat 0.9610.6 0.35
2
0.060 mA 10.41
V SG 1.2 V, V SD sat 0.85 V Sketch
_______________________________________
I D sat 0.9611.2 0.35
2
0.694 mA 10.42
V SG 1.8 V, V SD sat 1.45 V We have
V DS sat VGS VT V DS VT
I D sat 0.9611.8 0.35
2
so that
2.02 mA
V DS V DS sat VT
V SG 2.4 V, V SD sat 2.05 V
Since V DS V DS sat , the transistor is always
I D sat 0.9612.4 0.35
2
biased in the saturation region. Then
4.04 mA
I D K n VGS VT
2
6.40 mA
_______________________________________
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
10.44 (b)
I D I D sat K n VGS VT K nV DS sat
2 2
(a) g m
V GS so
2 10 4 K n 4
2
K n 2VGS VT V DS V DS
2
10.45
I D K n 2VGS VT V DS V DS
2
We find that VT 0.2 V
1.25 10 5 23 0.81 1
2
Now or
W n C ox I D 42.5 A
I D sat VGS VT
2L _______________________________________
where
ox 3.9 8.85 10 14 10.47
C ox
t ox
425 10 8 (a) C ox
3.98.85 10 14
or 180 10 8
C ox 8.12 10 8 F/cm 2 1.9175 10 7 F/cm 2
We are given W L 10 . From the graph, for
(i) k n n C ox 450 1.9175 10 7
5
VGS 3 V, we have 8.629 10 A/V 2
W n C ox 2 L
0.033 3 0.2
0.08629 W
2 0.4
2L
0.8
2
or 2 L
W n C ox
0.139 10 3
W
7.24
2L L
or
(b) (i) k p p C ox 210 1.9175 10 7
1
2
10 n 8.12 10 8 0.139 10 3 4.027 10 A/V 5 2
10.48 max
Q SD
From Problem 10.37, K n 1.111 mA/V 2 VTO V FB 2 fp
C ox
(a) g mL
K n 2VGS VT V DS V DS
2
1.135 10 7
VGS 0.5 20.3890
2.30110 7
K n 2V DS 1.11120.1
0.7713 V
so g mL 0.222 mA/V C W
K n n ox
(b) g ms
K n VGS VT
2
2L
VGS
450 2.301 10 7 8
2 K n VGS VT 21.1111.5 0.45 21.2
so g ms 2.33 mA/V 3.452 10 4 A/V 2
_______________________________________ or K n 0.3452 mA/V 2
(b) g ms
K p V SG VT
2
20.389
V SG 0.2525 V
2K p VSG VT 20.9611.5 0.35 VT 0.7713 0.2525 1.024 V
or g ms 2.21 mA/V (iii) V SB 2 V,
_______________________________________ VT 0.5594 20.389 2
10.50 20.389
2e s N a 0.4390 V
(a)
C ox VT 0.7713 0.4390 1.210 V
3.98.85 10 14 (iv) V SB 4 V,
Now C ox
150 10 8 VT 0.5594 20.389 4
Then
2.30110 7 F/cm 2 20.389
0.7294 V
2 1.6 10 19 11.7 8.85 10 14 5 1016 VT 0.7713 0.7294 1.501 V
2.30110 7 _______________________________________
0.5594 V 1/ 2
10.51
5 1016
(b) fp 0.0259 ln 0.3890 V 1016
10
1.5 10 fp 0.0259 ln 0.3473 V
10
1.5 10
411.7 8.85 10 14 0.3890
1/ 2
VT 2 V 2
(i) x dT
1.6 10 19 5 10 16
fp SB fp
0.22 0.2358 20.3294 VBS 0.357
2 1.6 10 19 11.7 8.85 10 14 1015
8
8.63 10
20.3294
V BS 2.39 V
20.288 VSB 20.288
or
_______________________________________
0.357 0.211 0.576 VSB 0.576
10.53 which yields
(a) n poly-to-p-type ms 1.0 V VSB 5.43 V
_______________________________________
1015
fp 0.0259 ln 0.288 V
10
1.5 10 10.54
also Plot
_______________________________________
4 s fp
1/ 2
x dT
eN a 10.55
411.7 8.85 10 14 0.288
1/ 2 (a)
W n C ox
1.6 10 19 10 15
gm
L
VGS VT
or W n ox
x dT 0.863 10 4 cm VGS VT
Lt ox
Now
104003.98.85 10 14 5 0.65
max 1.6 10 19 1015 0.863 10 4
Q SD
475 10 8
or or
max 1.38 10 8 C/cm 2
Q SD g m 1.26 mS
Also Now
C ox
ox 3.9 8.85 10 14 g m
gm g
m 0.8
1
t ox 400 10 8 1 g m rs gm 1 g m rs
or which yields
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
1 1 1 1 Then
rs 1 1
g m 0.8 1.26 0.8
C M 1.035 10 14
or
1 0.8974 10 3 10 10 3
rs 0.198 k or
(b) For VGS 3 V, g m 0.683 mS C M 1.032 10 13 F
Then Now
g m
0.683
0.602 mS
C gsT C ox L 0.75 10 4 W
1 0.6830.198
3.98.85 10 14
or 8
g m 500 10
0.602
0.88 2 10 4 0.75 10 4 20 10 4
g m 0.683
or
which is a 12% reduction.
_______________________________________ C gsT 3.797 10 14 F
We now find
10.56 gm
fT
(a) The ideal cutoff frequency for no overlap
capacitance is,
2 C gsT C M
gm V V 0.8974 10 3
fT n GS 2 T
2 C gs 2 L
2 3.797 10 14 1.032 10 13
400 4 0.75 or
f T 1.01 GHz
2 2 10 4 2
_______________________________________
or
f T 5.17 GHz 10.57
(b) Now (a) For the ideal case
gm 4 10 6
fT f T ds
2 C gsT C M 2 L 2 2 10 4
where or
CM C gdT 1 g m RL f T 3.18 GHz
We find (b) With overlap capacitance (using the
C gdT C ox 0.75 10 4 20 10 4 values from Problem 10.56),
3.98.85 10 gm
14
fT
8
2 C gdT C M
500 10
0.75 10 4 20 10 4 We find
g m WC ox ds
or
C gdT 1.035 10 14 F
20 10 3.98.85 10 4 10
4 14 6
8
500 10
Also or
W n C ox
gm VGS VT g m 0.5522 10 3 S
L
20 10 4 4003.9 8.85 10 14 We have
CM C gdT 1 g m RL
2 10 4 500 10 8
1.035 10 14
4 0.75
or
1 0.5522 10 3 10 10 3
g m 0.8974 10 3 S or
C M 6.750 10 14 F
Semiconductor Physics and Devices: Basic Principles, 4th edition Chapter 10
By D. A. Neamen Problem Solutions
______________________________________________________________________________________
Then
0.5522 10 3
fT
2 3.797 10 14 6.75 10 14
or
f T 0.833 GHz
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The drain current (I_D) in saturation for a MOS transistor is described by the equation I_D = (1/2) μ_n C_ox (W/L) (V_GS - V_T)^2. An increase in the gate-source voltage (V_GS) while V_T remains constant enhances the overdrive voltage (V_GS - V_T) and exponentially increases I_D, transitioning the device further into saturation. Likewise, for a fixed V_GS, a higher V_T reduces the effective gate voltage, thus decreasing I_D as saturation necessitates a larger overdrive voltage. Source 6 illustrates these dynamics through V_GS variations, reflecting the quadratic relationship between V_GS-V_T and I_D .
The substrate doping concentration (N_d) heavily influences the flat-band voltage (V_FB) and the threshold voltage (V_T) of a semiconductor device. An increase in N_d raises the bulk potential (ψ_B), altering the flat-band condition by shifting the band alignment and requiring a modification in V_FB. This also affects V_T as it depends on the dopant-induced band bending quantified by V_T = V_FB + 2ψ_B + (√(2ε_si q N_d 2ψ_B) / C_ox). A higher N_d thus typically results in a more positive V_T for n-type devices, necessitating greater gate bias to achieve channel inversion, as discussed in Source 3 .
The threshold voltage (V_T) dictates when a MOSFET begins to conduct significantly. V_T is influenced by factors such as the body effect, oxide thickness, doping concentration, and surface state charge. The formula V_T = V_FB + 2ψ_B + (√(2ε_si q N_A 2ψ_B) / C_ox) incorporates these factors, with ψ_B being the bulk potential and N_A the doping concentration. For n-type materials under a gate, as seen in Source 3, V_T can be computed considering the oxide capacitance and the presence of charge traps, resulting in a specific voltage necessary to invert the surface potential and form a conducting channel .
Trial-and-error techniques in semiconductor parameter optimization involve iterative adjustments of doping concentrations (N_d) to achieve targeted electrical characteristics such as threshold voltage or flat-band voltage. This approach requires testing various doping levels under realistic simulation conditions, observing changes in device characteristics, and selecting configurations that meet design criteria. This method is particularly effective when theoretical models offer insufficient guidance due to complex interactions within the semiconductor material. Source 1 exemplifies how different values of N_d were tested until optimal device performance was noted, demonstrating the method's utility in achieving precise control over semiconductor junction properties .
The oxide capacitance (C_ox) plays a critical role in determining the flat-band voltage (V_FB) in semiconductor devices, which is essential for understanding MOS device behavior. It is calculated using parameters such as the oxide permittivity (ε_ox), oxide thickness (t_ox), and the equation C_ox = ε_ox / t_ox. The flat-band voltage can then be determined using V_FB = φ_ms - (Q_ss / C_ox), where φ_ms is the metal-semiconductor work function difference and Q_ss is the charge density on the semiconductor surface. For example, in Source 2, the equation involving C_ox and Q_ss estimates V_FB to be -1.08 V .
The body effect is primarily affected by the substrate bias voltage, doping concentration, and oxide thickness. It manifests as a shift in threshold voltage (V_T) when a potential difference is applied between the body and the source terminal, described by ΔV_T = γ (√(ψ_s + V_SB) - √ψ_s), with γ being the body effect coefficient. Designers can mitigate this by minimizing the body-source voltage (V_SB), adjusting doping levels to optimize ψ_s without overly increasing γ, or using wells in SOI technologies to effectively isolate body contacts, reducing body effect issues, as shown in the analysis from Source 4 .
The flat-band voltage (V_FB) serves as an indicator of interface states within a MOS structure. Deviations from expected V_FB values often point to the presence of these charge states at the semiconductor-oxide interface, which alter the distribution of charges and hence the device's electrostatic condition. Interface states impact device performance by increasing leakage currents and contributing to threshold voltage instability. Accurate measurements of V_FB against expected values can reveal these states, as discrepancies necessitate compensation in V_FB calculations. As explored in Source 1, unexpected swings in V_FB associated with calculated values highlight the impact of interface states .
The work function difference (Φ_ms) between the metal and semiconductor is crucial in determining the flat-band voltage (V_FB) of MOS capacitors. By proper selection and engineering of material properties to achieve an optimal Φ_ms, designers ensure that V_FB aligns with desired operational characteristics, minimizing band bending in equilibrium. This adjustment is necessary to fine-tune threshold voltages and maintain control over leakage currents and overall device stability under operating conditions. Source 1 mentions adjustments made to Φ_ms, affecting V_FB in design scenarios to meet semiconductor device specifications .
Capacitance, particularly oxide capacitance (C_ox), is a fundamental determinant of the transient response of semiconductors. A higher C_ox results in faster charge-discharge cycles, enabling quicker switching responses in MOS devices. The transient response is critical for high-frequency applications where rapid state changes are needed. C_ox influences the speed of these responses due to its impact on the time constant (τ = RC_ox), where R is the channel resistance. Reducing τ through optimized C_ox designs leads to enhanced operational speeds. These relationships are detailed in Source 2, illustrating how capacitance modulation impacts transient dynamics in MOSFET applications .
Oxide thickness (t_ox) significantly affects the capacitance (C_ox = ε_ox / t_ox), which is directly tied to the threshold voltage (V_T) of a MOSFET. Thicker oxides result in lower capacitance values, thereby increasing the threshold voltage due to reduced gate control over the channel. Conversely, thinner oxides offer higher capacitance, decreasing V_T and enabling better gate modulation of the channel, thereby enhancing device switching speed and reducing power consumption. As evidenced in Source 5, variations in t_ox directly impact V_T, influencing device efficiency and control .