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Understanding SCR Ratings and Specifications

The document discusses various ratings for SCRs (silicon controlled rectifiers) including voltage, current, power, temperature, turn on/off time. It explains that ratings define the limits within which SCRs can operate reliably and include maximum and minimum values. Exceeding ratings even briefly can damage the SCR. Manufacturers provide rating specifications to ensure proper application of SCRs in power electronic circuits.

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0% found this document useful (0 votes)
237 views14 pages

Understanding SCR Ratings and Specifications

The document discusses various ratings for SCRs (silicon controlled rectifiers) including voltage, current, power, temperature, turn on/off time. It explains that ratings define the limits within which SCRs can operate reliably and include maximum and minimum values. Exceeding ratings even briefly can damage the SCR. Manufacturers provide rating specifications to ensure proper application of SCRs in power electronic circuits.

Uploaded by

divakar r vl
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd

SCR Ratings

In this SCR tutorial, we will learn about some of the important SCR Ratings.
These ratings include Voltage, Current, Power, Temperature, Turn ON Time,
Turn OFF Time, etc.

Outline

Introduction

Under all operating conditions, the reliable operation of the SCR can be
ensured only if it is operated such that its ratings are not exceeded. Each
thyristor or SCR is manufactured to a particular current, voltage, power,
temperature and switching frequency limits within which they can operate
reliably.

These are called ratings, which can be minimum or maximum values that set
limits on the capability of an SCR. Exceeding these limits even for short
duration could considerably leads to malfunction or damage the SCR.

Therefore, for the benefit of users, the manufacturer gives a list of current,
voltage, power, temperature ratings, etc. These ratings are essential for the
correct application of SCR in various power electronic circuits. In practice
SCRs with ratings higher than the required working ratings are selected to
allow safety margin.
These ratings can be continuous, non-repetitive or surge and repetitive
ratings. Depends on the unilateral or bilateral devices, continuous ratings are
denoted in terms of RMS or average values. Surge and repetitive ratings are
corresponding to peak values of the SCR.

So let us discuss various ratings of SCR in brief. Different voltage and current
ratings are assigned with one or more subscripts for easy identification. The
first subscript indicates the state of the SCR and includes

 F- Forward bias
 R- Reverse bias
 T- ON state
 D- Forward blocking state with gate open

The second subscript indicates the operating values and those are

 T- Trigger
 S- Surge or Non-repetitive value
 R- Repetitive value
 W- Working value

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Voltage Ratings of SCR

The voltage capability of the SCR should not be exceeded during the
operation even for short periods. So the SCR is assigned with different voltage
ratings, which are the maximum voltages at which the SCR can function
normally without breakdown of junctions. These are assigned in both blocking
states of an SCR and can withstand against voltage transients. The various
voltage ratings of an SCR are given below.

Peak Working Forward-blocking Voltage VDWM

It specifies the maximum instantaneous value of forward blocking voltage


across the SCR excluding all surge and repetitive transient voltages. Beyond
this value of the voltage the SCR cannot withstand during its operation. This
VDWM is equal to the maximum or peak value of the supply voltage wave
shown in figure.
Peak Repetitive Forward-blocking Voltage VDRM

It is the maximum transient voltage that the SCR can block during it’s the
forward blocking state repeatedly or periodically. This is specified with a
specific biasing resistance between cathode and gate or at a maximum
permissible junction temperature with gate circuit open.

This voltage VDRM is encountered or appeared across the SCR , when the SCR
is turned OFF or commutated or due to diodes in the converter circuit. During
the turn OFF process, an abrupt change in reverse recovery current causes to
create a voltage spike , which is responsible of VDRM to appear across the SCR.

Peak Non-repetitive or Surge Forward-blocking Voltage VDSM

This is the maximum instantaneous value of forward surge voltage across the
SCR that is of non-repetitive. This VDSM is less than the forward break over
voltage VBO and this value is in the range about 130 percent of VDRM.

Peak Working Reverse Voltage VRWM

This is the maximum instantaneous value of reverse voltage across the SCR
excluding all surge and repetitive transient voltages. This VRWM is equal to the
maximum negative value of the supply voltage wave shown in figure.

Peak Repetitive Reverse Voltage VRRM

It is occurrence of the maximum reverse transient voltage repeatedly or


periodically across the SCR in the reverse direction at permissible maximum
junction temperature. Beyond this rating the SCR may get damaged due to
excessive junction temperature. This voltage is also appeared due to the
same reason as of VDRM.

Peak Non-repetitive or Surge Reverse Voltage VRSM

It refers to the maximum value of reverse transient voltage across the SCR
that is of non-repetitive. This VRSM is less than the reverse break over voltage
VBR and this value is in the range about 130 percent of VRRM. The surge voltage
ratings VDSM and VRSM can be increased by connecting a diode of equal current
rating in series with the SCR.
The above discussed voltage ratings are belonging to the forward and reverse
blocking states with which the SCR is able to withstand with gate open.

ON-state Voltage VT

This is the voltage drop between the anode and cathode with specified
junction temperature and ON-state forward current. Generally, this value is in
the order of 1 to 1.5 Volts.

Gate Triggering Voltage VGT

This is the minimum voltage required by the gate to produce the gate trigger
current.

Forward dv/dt Rating

This is the maximum rate of rise of anode voltage that will not trigger the SCR
without any gate pulse or signal. If this value is more than the specified value,
the SCR may be switched ON. The SCR in forward blocking mode is
analogous to the capacitor with a dielectric.

So , the charging current flows through it when the applied voltage is


increased. If the rate of rise of voltage is more, sufficient charges will flow
through the junctions J2 of the SCR and hence the SCR will be turned ON
without any gate signal.

This type of triggering is called as false triggering and in practice it is not


employed. Also, this rating depends on the junction temperature. If the
junction temperature is high, the dv/dt rating of the SCR is lower and vice-
versa. With the use of snubber networks across the SCRs, it is possible to
limit the maximum dv/dt applied to the SCR.

Voltage Safety Factor Vf

Generally, the operating voltage of the SCR is kept below the VRSM to avoid the
damage to the SCR due to uncertain conditions. Therefore, the voltage safety
factor relates the operating voltage and VRSM and is given as

Vf = VRSM / (RMS value of the input voltage * √2)

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Current Ratings of SCR

Basically an SCR is a unilateral device and hence average current rating is


assigned to it (while RMS current rating is assigned to bilateral devices). An
SCR has low thermal capacity and short time constant. This means the
junction temperature exceeds its rated value even for short over current.

This may lead to damage the SCR. Therefore, current ratings must be
properly selected for long life of SCR , as the junction temperature depends
on the current handled by it. Let us look at various current ratings of an SCR.

Average ON-state Current Rating ITAV

This is the maximum repetitive average value of forward current that can flow
through the SCR such that the maximum temperature and RMS current limits
are not exceeded. The forward voltage drop across the SCR is very low when
it is in conduction mode. So the power loss in the thyristor is entirely depends
on the forward current ITAV.

In case of phase controlled SCRs, average forward current depends on the


firing angle. For the given average forward current, the RMS value of the
current is increased with decrease in conduction angle. This leads to increase
the voltage drop across the SCR which in turn increases the average power
dissipation. Hence the junction temperature rises beyond the safe limit.

In order to limit the maximum junction temperature, the permissible average


forward current has to be lowered with decrease in conduction angle. The
manufacturers usually provide the data sheet that shows the forward average
current variation with respect to the case temperature. As an example the
current waveform formed from the positive half cycle for different conduction
angles is shown in below.

RMS ON-state Current ITRMS


This is the maximum repetitive RMS current specified at a maximum junction
temperature that can flow through the SCR. For a direct current, both RMS
and average currents are same. However, this rating is important for SCRs
subject to low duty waveforms with peak currents. And also this rating is
required to prevent excessive heating in leads, metallic joints and interfaces of
SCR.

Surge Current Rating ITSM

It specifies the maximum non-repetitive or surge current that the SCR can
withstand for a limited number of times during its life span. The manufacturers
specify the surge rating to accommodate the abnormal conditions of SCR due
to short circuits and faults. If the peak amplitude and the number of cycles of
the surge current are exceeded, the SCR may get damaged.

I2t Rating

This rating is used to determine the thermal energy absorption of the device.
This rating is required in the choice of a fuse or other protective equipment
employed for the SCR. This is the measure of the thermal energy that the
SCR can absorb for a short period of time before clearing the fault by the fuse.

It is the time integral of the square of the maximum instantaneous current. For
a reliable protection of SCR by the fuse or other protective equipment, the
I2t rating of the fuse (or any other protective equipment) must be less than the
I2t rating of the SCR.

di/dt Rating
It is the maximum allowable rate of rise of anode to cathode current without
any damage or harm to an SCR. If the rate of rise of anode current is very
rapid compared to the spreading velocity of the charge carriers, local hot spots
are created due to concentration of carriers (on account of high current
density) in the restricted area of the junctions.

This raises the junction temperature above the safe limit and hence the SCR
may be damaged. Therefore, for all SCRs the maximum allowable di/dt rating
specified in order to protect the SCR. It is specified in amperes/microseconds
and typically it lies in the range 50 to 800 ampere/microseconds.

Latching Current IL

It is the minimum ON state current required to maintain the SCR in ON state


after gate drive has been removed. After turning ON of the SCR, the anode
current must be allowed to build up such that the latching current is attained
before the gate pulse is removed. Otherwise the SCR will be turned OFF if the
gate signal is removed.

Holding Current IH

This is the minimum value of the anode current below which SCR stops
conducting and turns OFF. The holding current is associated with turn OFF
process and usually it is a very small value in the range of mill amperes.

Gate Current IG

As the gate current is more, earlier will be the turn ON of the SCR and vice-
versa. However, safety limits must be provided for gate by specifying
maximum and minimum gate currents. For controlling the SCR, gate current is
applied to the gate terminal. This gate current is divided into two types;
minimum gate current IGmin and maximum gate current IGmax.

The minimum gate current IGmin is the current required by the gate terminal to
turn ON the SCR where as IGmax is the maximum current that can be applied
safely to the gate. Between these two limits the conduction angle of the SCR
is controlled.

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Temperature Rating of SCR

The forward and reverse blocking capability of the SCR is determined by


junction temperature Tj. If the maximum junction temperature is exceeded, the
SCR will be driven to conduction state even without any gate signal. This
upper limit of Tj is imposed by considering the temperature dependence on
break over voltage, thermal stability and turn OFF time.

And also an upper storage temperature limit Ts is also required to limit thermal
stresses on silicon crystal, lead attachments and encapsulating epoxy. Excess
of these two temperature limits may cause unreliable operation of an SCR. In
some cases, upper storage temperature limit is higher than the operating
temperature limit of an SCR.

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Power Ratings of SCR


The power dissipation in the SCR produces a temperature rise in the junction
regions. The dissipation of power in the SCR includes forward power
dissipation; turn ON and OFF losses and gate power dissipation.

Average Power Dissipation Pav

It is the multiplication of the average anode current and forward voltage drop
across the SCR. This is the major source of junction heating in an SCR for
normal duty cycle operations. The peak power from a given source must not
exceed the average power dissipation rating to maintain the safety of the
device. This rating is specified for different conduction angles as a function of
average forward current as shown in figure.

Gate Power Dissipation PG

This rating defines both forward or reverse peak power and the average
power applied to the gate. If these ratings are exceeded, considerable
damage occurs to the gate. Therefore, while calculating the voltage and
currents applied, the width of gate pulses has to be considered (because the
peak power is the function of time). For pulse type triggering, gate losses are
negligible whereas gate signals with a high duty cycle, the gate losses
becomes more significant.

Other power losses include ON state losses, OFF state losses, forward
blocking losses and reverse blocking losses. Turn ON and OFF losses have to
be taken into consideration while selecting the SCR rating since these
constitute a significant portion of the total losses. And also forward and
reverse blocking losses are very small compared to the conduction losses
since a small leakage current and negligible voltage drop in blocking states.

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Turn ON and Turn OFF Time Ratings

The turn ON time is the time interval between the instant at which the gate
signal is applied and the instant at which the ON-state current reaches 90
percent of its final value. Shorter will be the turn ON time if the gate drive is
increased. This turn ON time is valid only for resistive load because the rate of
rise of anode current is slow in inductive load.

Therefore, the turn ON time does not indicate the time in which the device
stays ON if the gate signal is removed. And if the load is resistive, turn ON
time surely, indicates the time interval in which the SCR stays ON even the
gate is removed.

Turn OFF time is the time interval between the instant at which the anode
current goes zero or negative and the instant positive voltage is reapplied to
the SCR. For fast switching SCRs both turn ON and OFF time values are very
low.

Common questions

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The reliable operation of an SCR depends on staying within its specified voltage, current, power, and temperature ratings. Exceeding these ratings can lead to malfunction or damage. Voltage ratings like Peak Repetitive Forward-blocking Voltage (VDRM) and Peak Repetitive Reverse Voltage (VRRM) ensure the device can handle certain transient conditions without breakdown. Current ratings like Average ON-state Current Rating (ITAV) and Surge Current Rating (ITSM) help manage thermal loads and prevent overheating. These ratings are interconnected; for instance, high current can increase junction temperature, leading to breakdown if the temperature limit is exceeded. Therefore, all ratings function together to ensure safe and efficient device operation .

To manage temperature rise in SCRs during high current operations, effective strategies include: utilizing heat sinks or active cooling systems to dissipate heat quickly, implementing snubber circuits to limit dv/dt stress, and using current derating to operate below maximum values under high temperatures. Properly setting conduction angles to reduce power dissipation and integrating thermal cutoffs or sensors to monitor temperature limits are also critical strategies. These measures help maintain thermal stability, ensure device longevity, and prevent damage during intense electrical loads .

SCR power losses differ across its operational states: in the ON state, significant power loss is due to the voltage drop across the device; in the OFF state, losses are minimal but include leakage currents. During switching, additional losses occur due to the finite times to turn on/off. Understanding and accounting for these losses in system design is essential to ensure efficient heat dissipation and avoid overheating. This consideration is especially crucial in high-power applications where cumulative losses can lead to inefficiencies and reduced system reliability .

Junction temperature limits are crucial for maintaining the structural and electrical integrity of SCRs. If exceeded, these limits can cause the SCR to enter conduction without a gate signal, leading to uncontrolled operation. Prolonged high temperatures can also degrade the silicon material, lead attachments, and encapsulating materials, ultimately reducing the device's lifespan and reliability. Exceeding these limits affects the SCR's break over voltage and thermal stability, heightening the risk of device failure .

The I2t rating of an SCR represents the energy it can withstand without damage during a fault. It is a critical parameter in selecting protective components like fuses, as the fuse's I2t must be less than the SCR's I2t to protect the device effectively. If the protective component cannot handle these energy levels, the SCR may experience excessive thermal stress, leading to permanent damage. Therefore, aligning these ratings ensures that in an overcurrent scenario, the protective component intervenes before the SCR sustains irreparable harm .

Adhering to the di/dt rating of an SCR is critical because it prevents local hot spots from forming due to excessive anode current rise, which could cause the junction temperature to exceed safe limits. If these hot spots occur, they can lead to permanent device failure due to the localized thermal stresses. This is particularly important during the initial turn-on phase, as the ensuring smooth current rise prevents excessive current density and helps in maintaining the integrity of the SCR junctions .

Gate current specifications, including the minimum gate current (IGmin) and maximum gate current (IGmax), are crucial for controlling the SCR's turn-on process. IGmin is the minimum current needed to trigger the SCR, while IGmax denotes the upper limit beyond which damage could occur. A well-defined gate current helps achieve efficient and timely triggering, reducing turn-on time and ensuring the SCR enters conduction promptly without overstress. This balance is vital in maintaining device reliability and optimizing switching performance .

Latching current (IL) is the minimum current required to maintain the SCR in the ON state after the gate signal is removed. In contrast, holding current (IH) is the minimum current below which the SCR reverts to the OFF state. Latching current must be sustained immediately after triggering to ensure the SCR remains conductive, while holding current determines the level below which the SCR can safely turn off. These parameters are vital for ensuring that the SCR operates correctly under varying load conditions, contributing to circuit stability and preventing inadvertent turn-off .

Surge voltage ratings (such as VDSM and VRSM) refer to the maximum transient voltages an SCR can handle non-repetitively, while repetitive voltage ratings (such as VDRM and VRRM) are the maximum voltages the SCR can withstand periodically. Surge ratings are typically higher to manage rare, short-duration spikes, while repetitive ratings are lower to handle consistent operational conditions. These differences impact circuit design by necessitating protective measures like capacitor banks or varistors to safeguard against surge voltages without exceeding repetitive limits during normal operation .

Snubber circuits limit the rate of rise of voltage (dv/dt) across the SCR, which prevents false triggering. An SCR can mistakenly turn on if the dv/dt rating is exceeded due to capacitive coupling within the device when it is supposed to be in a blocking state. By controlling the dv/dt using snubber circuits, one ensures that the SCR only turns on when an appropriate gate signal is applied, thus maintaining operational stability and preventing unintended device activation .

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