Understanding NPN and PNP Transistors
Understanding NPN and PNP Transistors
Lesson 1 Introduction
EEAC 103 LM II
65
LEARNING MATERIAL II
INTRODUCTION
INTRODUCTION
OBJECTIVES
There are four lessons in the module. Read each lesson carefully then
answer the exercises/activities to find out how much you have benefited from
it. Work on these exercises carefully and submit your output to your instructor
through google classroom.
Lesson 1
INTRODUCTION
The transistor was invented by Dr. William Shockley and Dr. John Bardeen at
Bell Laboratory in America in 1951. First time, in 1952 transistor was used in
telephone switching circuits. Since then, it has revolutionized the field of
electronics. The transistor has helped the bulky vacuum tubes in most of the
electronic circuits. The transistor is a basic building block of all modern
electronic systems. It is a three terminal device. The output voltage, current
or power are controlled by the input current in a transistor. Therefore, it is
also called current-controlled device. In short, it is also called BJT. BJT stands
for Bipolar Junction Transistor because the transistor operation is carried out
by two types of charge carriers: majority carriers and minority carriers.
A transistor has a very important property that it can raise the strength of an
input weak signal. This property is called Amplification. Due to this quality,
the transistor is one of the most widely used semiconductor devices.
CONSTRUCTION
A transistor is a single crystal of silicon (Si) or Germanium (Ge). A transistor
can be of two types: NPN or PNP. A transistor consists of two PN junctions.
The junctions are formed by sandwiching either P-type or N-type
semiconductor layers between a pair of opposite types as shown in figures
1(a) and (b).
(a) (b)
A transistor has three regions. They are emitter, base and collector.
1. Emitter: It is an outer region situated in one side of transistor. The
function of emitter is to inject charge carriers (electrons in case of
NPN transistor and holes in cse of PNP transistors) into the base. Since
emitter has to supply large number of charge carriers, so it is heavily
doped “More doping, more will be available charge carriers.”
2. Base: It is the middle region of the transistor. The base is a very thin
and lightly doped region. The function of this region is to pass all the
charge carriers (electrons or holes) onto the collector.
3. Collector: It is the other outer region situated in the other side of the
transistor. The doping of the collector is between the heavy doping of
emitter and lightly doping of base. The function of the collector is to
collect charge carriers (electrons or holes). The collector region is
physically larger than the emitter region. The reason for this is that
the collector has to dissipate more heat. Hence, it is clear that
although a BJT has two same type of outer regions, their function
cannot be interchanged.
TRANSISTOR SYMBOLS
There are two types of transistors known as NPN and PNP. When the transistor
is used as a circuit element in any electronic circuit, it is always represented
by its own symbol as shown in Fig. 2. (a) and (b). Also, the direction of
currents IE, IC, and IB are indicated.
(a) (b)
Fig. 2 (a) represents the symbol for NPN transistors. The emitter has an
arrowhead. The arrowhead indicates the direction of a conventional current
flow in a transistor. The arrowhead points from the P-region towards the N-
region. Therefore, in an NPN transistor, the conventional current will flow
from the base to emitter.
Fig. 2 (b) shows the symbol for PNP transistor. The arrowhead in the emitter
points from the P-region towards the N-region. Therefore, in PNP transistor,
the conventional current will flow from emitter to the base.
The PNP is a complement of the NPN transistor. Hence, in NPN transistor, the
majority carriers are free electrons but in PNP transistor, majority carriers
are holes. The currents and voltages involved in the action of PNP transistor
are opposite to those of NPN transistor.
Out of these two types of transistor, the NPN transistor is mostly used. The
reason for this is that in NPN transistors, the current conduction is mainly by
electronic whereas in PNP transistors the current conduction is mainly by
holes. Since the electrons are more mobile than holes, the conduction is
higher in NPN transistors than PNP transistors.
BJT is a bipolar device where conduction is carried out by both charge carriers
i.e. electrons and holes. The number of electrons diffused in the base region
is more the number of holes diffused in emitter region. Electrons behave as a
minority carrier in the base region.
Under normal conditions, when the emitter-base junction is forward biased it
allows the current to flow from emitter to collector. When a voltage is applied
at the base terminal, it gets biased and draws current, which directly affects
the current at the other terminals.
BJT is called a current controlled device where small current at the base side
is used to control the large current at other terminals. All three terminals of
the BJT are different in terms of their doping concentrations. The emitter is
highly doped as compared to base and collector.
Types of BJT
BJTs are divided into two types based on the nature and construction of the
transistor. Following are two main types of the BJT.
NPN
• NPN transistors are also called minority carrier devices because minority
charge carriers at the base side are used to control large current at other
terminals of the transistor.
• The current moves from an emitter to the collector where electrons act as
a minority carrier at the base side.
PNP
• PNP (positive-negative-positive) transistor is a type of BJT where N doped
semiconductor layer which acts as a base, is housed between the two layers
of P doped material.
• The base uses small base current and negative base voltage to control large
current at the emitter and collector side and voltage at the collector side
is larger than the voltage at the base side.
• In PNP transistor current direction and voltage polarities are reversed as
compared to NPN transistors.
Fig. 6. PNP
• PNP transistors work in a similar way like NPN transistor with some
exception i.e. holes are diffused through the base from an emitter and are
collected by the collector.
BJT is a current controlled device which is mainly used for amplification and
switching purpose. There are three ways to connect this device with external
electronic circuits called:
Pros of BJTs
Cons of BJTs
Applications
• BJTs come with two major applications called amplification and switching.
• They are the building blocks of most of the electronic circuits, especially
where audio, current or voltage amplification is required.
NPN transistors are preferred over PNP transistors for amplification purpose
because conduction carried out through mobility of electrons is better than
conduction through mobility of holes.
(a) (b)
Fig. 11. (a) Current-controlled, (b) Voltage-controlled amplifiers
The current Ic in Fig. 11a is a direct function of the level of I B. For the FET in
Fig 11b, the current ID is a function of the voltage VGS applied to the circuit.
Just as there are npn and pnp bipolar transistors, there are n-channel and p-
channel field-effect transistors. However, it is important to keep in mind that
the BJT transistor is a bipolar device—the prefix bi- revealing that the
conduction level is a function of two charge carriers, electrons and holes. The
FET is a unipolar device depending solely on either electron (n-channel) or
hole (p-channel) conduction.
For the FET an electric field is established by the charges present that will
control the conduction path of the output circuit without the need for direct
contact between the controlling and controlled quantities.
The basic construction of the n-channel JFET is shown in Fig. 12. Note that
the major part of the structure is the n-type material that forms the channel
between the embedded layers of p-type material. The top of the n-type
channel is connected through an ohmic contact to a terminal referred to as
the drain (D), while the lower end of the same material is connected through
an ohmic contact to a terminal referred to as the source (S). The two p-type
materials are connected together and to the gate (G) terminal. In essence,
therefore, the drain and source are connected to the ends of the n-type
channel and the gate to the two layers of p-type material. In the absence of
any applied potentials the JFET has two p-n junctions under no-bias
conditions. The result is a depletion region at each junction as shown in Fig.
12 that resembles the same region of a diode under no-bias conditions.
Analogies are seldom perfect and at times can be misleading, but the water
analogy of Fig. 13 does provide a sense for the JFET control at the gate
terminal. The source of water pressure can be likened to the applied voltage
from drain to source that will establish a flow of water (electrons) from the
spigot (source). The “gate,” through an applied signal (potential), controls
the flow of water (charge) to the “drain.” The drain and source terminals are
at opposite ends of the n-channel as introduced in Fig. 12.
In Fig. 14, a positive voltage VDS has been applied across the channel and the
gate has been connected directly to the source to establish the condition
VGS=0 V. The result is a gate and source terminal at the same potential and a
depletion region in the low end of each p-material similar to the distribution
of the no-bias conditions of Fig. 12. The instant the voltage V DD (= VDS) is
applied, the electrons will be drawn to the drain terminal, establishing the
conventional current ID with the defined direction of Fig. 14. The path of
charge flow clearly reveals that the drain and source currents are equal (ID =
IS). Under the conditions appearing in Fig. 5.4, the flow of charge is relatively
unrestrained and limited solely by the resistance of the n-channel between
drain and source.
It is important to note that the depletion region is wider near the top of both
p-type or n-type materials. The reason for the change in width of the region
is best described through the help of Fig. 15. Assuming a uniform resistance
in the n-channel, the resistance of the channel can be broken down to the
divisions appearing in the figure. The current ID will establish the voltage
levels through the channel as indicated on the same figure. The result is that
the upper region of the p-type material will be reverse-biased by about 1.5
V, with the lower region only reverse-biased by 0.5 V. Recall from the
discussion of the diode operation that the greater the applied reverse bias,
the wider the depletion region—hence the distribution of the depletion region
as shown in Fig. 15. The fact that the p-n junction is reverse-biased for the
length of the channel results in a gate current of zero amperes as shown in
the same figure. The fact that I G = 0 A is an important characteristic of the
JFET.
As the voltage VDS is increased from 0 to a few volts, the current will increase
as determined by Ohm’s law and the plot of ID versus VDS will appear as shown
in Fig. 16. The relative straightness of the plot reveals that for the region of
low values of VDS, the resistance is essentially constant. As V DS increases and
approaches a level referred to as VP in Fig. 16, the depletion regions of Fig.
14 will widen, causing a noticeable reduction in the channel width. The
reduced path of conduction causes the resistance to increase and the curve
in the graph of Fig. 16 to occur. The more horizontal the curve, the higher
the resistance, suggesting that the resistance is approaching “infinite” ohms
SYMBOLS
The graphic symbols for the n-channel and p-channel JFETs are provided in
Fig. 18. Note that the arrow is pointing in for the n-channel device of Fig.
5.18a to represent the direction in which IG would flow if the p-n junction
were forward-biased. For the p-channel device (Fig. 18b) the only difference
in the symbol is the direction of the arrow.
Lesson 2
For the BJT to be biased in its linear or active operating region the following
must be true:
1. The base–emitter junction must be forward-biased (p-region voltage
more positive), with a resulting forward-bias voltage of about 0.6 to
0.7 V.
2. The base–collector junction must be reverse-biased (n-region more
positive), with the reverse-bias voltage being any value within the
maximum limits of the device.
2. Cutoff-region operation:
Base–emitter junction reverse biased
3. Saturation-region operation:
Base–emitter junction forward biased
Base–collector junction forward biased
FIXED BIAS
+ VCC − I B RB − VBE = 0
Note the polarity of the voltage drop across RB as established by the indicated
direction of IB. Solving the equation for the current IB will result in the
following:
+ VCC − VBE
IB = (4.4)
RB
Consider first the base–emitter circuit loop of Fig. 4.4. Writing Kirchhoff’s
voltage equation in the clockwise direction for the loop, we obtain
V − VBE
I B = CC (4.4)
RB
The collector–emitter section of the network appears in Fig. 4.5 with the
indicated direction of current IC and the resulting polarity across RB. The
magnitude of the collector current is related directly to IB through
I C = I B (4.5)
It is interesting to note that since the base current is controlled by the level
of RB and IC is related to IB by a constant β, the magnitude of IC is not a
function of the resistance RC. Change RC to any level and it will not affect the
level of IB or IC as long as we remain in the active region of the device.
However, as we shall see, the level of RC will determine the magnitude of VCE,
which is an important parameter. Applying Kirchhoff’s voltage law in the
clockwise direction around the indicated closed loop of Fig. 4.5 will result in
the following:
VCE + I C RC − VCC = 0
And
VCE = VCC − I C RC (4.6)
which states in words that the voltage across the collector–emitter region of
a transistor in the fixed-bias configuration is the supply voltage less the drop
across RC. As a brief review of single- and double-subscript notation recall
that
VCE = VC − VE (4.7)
where VCE is the voltage from collector to emitter and VC and VE are the
voltages from collector and emitter to ground respectively. But in this case,
since VE = 0 V, we have
VCE = VC (4.8)
In addition, since
VBE = VB − VE (4.9)
And VE = 0, then
VBE = VB (4.10)
Recall that
I E = ( + 1) I B (4.16)
+ VCC − I B RB − VBE − ( + 1) I B RE = 0
Solving I B gives
VCC − VBE
IB =
RB + ( + 1) RE
COLLECTOR-EMITTER LOOP
+ I E RE + VCE + I C RC − VCC = 0
The single-subscript voltage VE is the voltage from emitter to the ground and
is determined by
VE = I E RE (4.20)
VCE = VC − VE
Or VC = VCC − I C RC (4.22)
The voltage at the base with respect to ground can be determined from
VB = VCC − I B RB (4.23)
Or VB = VBE + VE (4.24)
Solution:
In the previous bias configurations, the bias current ICQ and voltage
VCEQ were a function of the current gain ( ) of the transistor. However,
since is temperature sensitive, especially for silicon transistors, and the
actual value of beta is usually not well defined, it would be desirable to
develop a bias circuit that is less dependent, or in fact, independent of the
transistor beta. The voltage-divider bias configuration is such a network.
There are two methods that can be applied to analyze the voltage-divider
configuration. The first to be demonstrated is the exact method that can be
applied to any voltage-divider configuration. The second is referred to as the
approximate method and can be applied only if specific conditions are
satisfied.
EXACT ANALYSIS
The input side of the network of Fig. 4.25 can be redrawn as shown in Fig.
4.27 for the dc analysis. The Thévenin equivalent network for the network to
the left of the base terminal can then be found in the following manner:
RTH = R1 || R2 (4.28)
ETh: The voltage source VCC is returned to the network and the open-circuit
Thévenin voltage of Fig. 4.29 determined as follows:
R2VCC
ETH = VR 2 = (4.29)
R1 + R2
The Thévenin network is then redrawn as shown in Fig. 4.30, and IBQ can be
determined by first applying Kirchhoff’s voltage law in the clockwise direction
for the loop indicated:
ETH − VBE
IB = (4.30)
RTH + ( + 1) RE
Once IB is known, the remaining quantities of the network can be found in the
same manner as developed for the emitter-bias configuration. That is,
The remaining equations for VE, VC, and VB are also the same as obtained for
the emitter-bias configuration.
Example 4.7. Determine the dc bias voltage VCE and the current IC for the
voltage-divider configuration of Fig. 4.31.
Solution:
APPROXIMATE ANALYSIS
The input section of the voltage-divider configuration can be represented by
the network of Fig. 4.32. The resistance Ri is the equivalent resistance
between base and ground for the transistor with an emitter resistor RE. the
reflected resistance between base and emitter is defined by Ri = ( + 1) RE . If
Ri is much larger than the resistance R2, the current IB will be much smaller
than I2 (current always seeks the path of least resistance) and I2 will be
approximately equal to I1. If we accept the approximation that IB is essentially
zero amperes compared to I1 or I2, then I1 = I2 and R1 and R2 can be considered
series elements. The voltage across R2, which is actually the base voltage,
can be determined using the voltage-divider rule (hence the name for the
configuration). That is,
R2VCC
VB = (4.32)
R1 + R2
Since Ri = ( + 1) RE RE the condition that will define whether the
approximate approach can be applied will be the following:
In other words, if the above condition (Eq. 4.33) is satisfied, the approximate
approach will be used. If not, use the exact analysis.
VE = VB − VBE (4.34)
VE
IE = (4.35)
RE
And
I CQ I E (4.36)
VCE = VCC − I C RC − I E RE
But since I E I C ,
Note in the sequence of calculations from Eq. (4.33) through Eq. (4.37) that
does not appear and IB was not calculated. The Q-point (as determined by
ICQ and VCEQ) is therefore independent of the value of .
Example 4.8. Repeat the analysis of Fig. 4.31. using the approximate
technique, and compare solutions for I C and VCEQ.
Solution:
The general relationship that can be applied to the dc analysis of all FET
amplifiers are
IG 0A (6.1)
and
ID = IS (6.2)
2
1 − VGS
I D = I DSS (6.3)
VP
We shall consider three FET biasing techniques: fixed bias configuration, self-
bias, and voltage-divider bias.
The simplest of biasing arrangements for the n-channel JFET appears in Fig.
6.1. Referred to as the fixed-bias configuration, it is one of the few FET
configurations that can be solved just as directly using either a mathematical
or graphical approach.
For dc analysis,
IG 0A
VRG = I G RG = (0 A) RG = 0V
The fact that the negative terminal of the battery is connected directly to
the defined positive potential of VGS clearly reveals that the polarity of VGS
is directly opposite to that of VGG . Applying Kirchoff’s voltage law in the
clockwise direction of the indicated loop of Fig 7.2 results in
− VGG − VGS = 0
and
VGS = −VGG
Since VGG is a fixed dc supply, the voltage VGS is fixed in magnitude, resulting
in the designation “fixed-bias configuration.”
2
V
I D = I DSS 1 − GS
VP
SELF-BIAS CONFIGURATION
For the dc analysis, the capacitors can again be replaced by “open circuits”
and the resistor RG replaced by a short-circuit equivalent since I G = 0 A . The
result is the network of Fig. 7.9 for the important dc analysis.
VRS = I D RS
− VGS − VRS = 0
and
VGS = −VRS
or
VGS = − I D RS (7.10)
Note that in this case that VGS is a function of the output current I D and not
fixed in magnitude as occurred for the fixed bias configuration.
2
V
I D = I DSS 1 − GS
VP
2
− I D RS
= I DSS 1 −
VP
2
I R
= I DSS 1 + D S
VP
VS = I D RS (7.12)
VG = 0 (7.13)
Example:
Determine the following for the network of Fig. 7.12 assuming VGSQ = −2.6V
and I DQ = 2.6mA is obtained from the Shockley’s equation
(a) V DS
(b) VP
(c) VG
(d) VD
Solution:
The network can be redrawn as shown in Fig. 7.22 for the dc analysis. Note
that the capacitors, including by-pass capacitor Cs, have been replaced by
“open-circuit” equivalent. In addition, the source VDD was separated into two
equivalent sources to permit a further separation of the input and output
regions of the network.
KCL requires that IR1=IR2 and the series equivalent circuit appearing to the left
of the figure can be used to find the level of VG.
The voltage VG, equal to the voltage across R2, can be found using the voltage-
divider rule as follows:
R2VDD
VG =
R1 + R2
VG − VGS − VRS = 0
VGS = VG − VRS
VGS = VG − I D RS
Once the quiescent values of I DQ and VGSQ are determined from the graph
using shockley’s equation, the remaining network analysis can be performed
in the usual manner.
That is,
VDS = VDD − I D ( RD + RS )
VD = VDD − I D RD
VS = I D RS
VDD
I R1 = I R 2 =
R1 + R2
Example:
Determine the following for the network shown in Fig. 7.25 assuming
I DQ = 2.4mA and VGSQ = −1.8V is obtained from the shockley’s equation:
a. VD
b. VS
c. V DS
d. VDG
Solution:
a. VD = VDD − I D RD
= 16 V − (2.4 mA)( 2.4 k)
= 10.4 V
c. VDS = VDD − I D ( RD + RS )
= 16 V − (2.4 mA)( 2.4 k + 1.5 k)
= 6.64 V
or
VDS = VD − Vs
= 10.24 V − 3.6 V
= 6.64 V
d. VDG = VD − VG
= 10.24 V − 1.82 V
= 8.42 V
Lesson 3
Basic Transistor
Application: amplifier,
switch
Transistor Amplifier
A transistor acts as an amplifier by raising the strength of a weak signal. The
DC bias voltage applied to the emitter base junction, makes it remain in
forward biased condition. This forward bias is maintained regardless of the
polarity of the signal. The below figure shows how a transistor looks like when
connected as an amplifier.
The low resistance in input circuit, lets any small change in input signal to
result in an appreciable change in the output. The emitter current caused by
the input signal contributes the collector current, which when flows through
the load resistor RL, results in a large voltage drop across it. Thus a small
input voltage results in a large output voltage, which shows that the transistor
works as an amplifier.
Example
Let there be a change of 0.1v in the input voltage being applied, which further
produces a change of 1mA in the emitter current. This emitter current will
obviously produce a change in collector current, which would also be 1mA.
5 kΩ × 1 mA = 5V
Performance of Amplifier
As the common emitter mode of connection is mostly adopted, let us first
understand a few important terms with reference to this mode of connection.
Input Resistance
As the input circuit is forward biased, the input resistance will be low. The
input resistance is the opposition offered by the base-emitter junction to the
signal flow.
By definition, it is the ratio of small change in base-emitter voltage (ΔVBE) to
the resulting change in base current (ΔI B) at constant collector-emitter
voltage.
VBE
Input resistance, Ri =
I B
Where Ri = input resistance, VBE=base-emitter voltage, and IB = base current
Output Resistance
The output resistance of a transistor amplifier is very high. The collector
current changes very slightly with the change in collector-emitter voltage.
VCE
Output resistance, Ro =
I C
Where Ro = Output resistance, VCE = Collector-emitter voltage, and IC =
Collector-emitter voltage.
By definition, it is the total load as seen by the a.c. collector current. In case
of single stage amplifiers, the effective collector load is a parallel
combination of RC and Ro.
RC + Ro
= RAC
RC + Ro
Hence for a single stage amplifier, effective load is equal to collector load
RC. In a multi-stage amplifier (i.e. having more than one amplification stage),
the input resistance Ri of the next stage also comes into picture.
RC Ri
RC || Ri =
RC + Ri
Current Gain
The gain in terms of current when the changes in input and output currents
are observed, is called as Current gain. By definition, it is the ratio of change
in collector current (ΔIC) to the change in base current (ΔIB).
I C
Current Gain, =
I B
The value of β ranges from 20 to 500. The current gain indicates that input
current becomes β times in the collector current.
Voltage Gain
The gain in terms of voltage when the changes in input and output currents
are observed, is called as Voltage gain. By definition, it is the ratio of change
in output voltage (ΔVCE) to the change in input voltage (ΔVBE).
Lesson 4
However, both the NPN & PNP type bipolar transistors can be made to operate
as “ON/OFF” type solid state switch by biasing the transistors Base terminal
differently to that for a signal amplifier.
Solid state switches are one of the main applications for the use of transistor
to switch a DC output “ON” or “OFF”. Some output devices, such as LED’s
only require a few milliamps at logic level DC voltages and can therefore be
driven directly by the output of a logic gate. However, high power devices
such as motors, solenoids or lamps, often require more power than that
supplied by an ordinary logic gate so transistor switches are used.
If the circuit uses the Bipolar Transistor as a Switch, then the biasing of the
transistor, either NPN or PNP is arranged to operate the transistor at both
sides of the “ I-V ” characteristics curves we have seen previously.
The areas of operation for a transistor switch are known as the Saturation
Region and the Cut-off Region. This means then that we can ignore the
operating Q-point biasing and voltage divider circuitry required for
amplification, and use the transistor as a switch by driving it back and forth
between its “fully-OFF” (cut-off) and “fully-ON” (saturation) regions as shown
below.
Operating Regions
The pink shaded area at the bottom of the curves represents the “Cut-off”
region while the blue area to the left represents the “Saturation” region of
the transistor. Both these transistor regions are defined as:
1. Cut-off Region
Here the operating conditions of the transistor are zero input base current
(IB), zero output collector current ( I C ) and maximum collector voltage (VCE)
which results in a large depletion layer and no current flowing through the
device. Therefore the transistor is switched “Fully-OFF”.
Then we can define the “cut-off region” or “OFF mode” when using a bipolar
transistor as a switch as being, both junctions reverse biased, VB < 0.7v and
IC = 0. For a PNP transistor, the Emitter potential must be negative with
respect to the Base.
2. Saturation Region
Here the transistor will be biased so that the maximum amount of base
current is applied, resulting in maximum collector current resulting in the
minimum collector emitter voltage drop which results in the depletion layer
being as small as possible and maximum current flowing through the
transistor. Therefore the transistor is switched “Fully-ON”.
Then we can define the “saturation region” or “ON mode” when using a
bipolar transistor as a switch as being, both junctions forward biased, V B >
0.7v and IC = Maximum. For a PNP transistor, the Emitter potential must be
positive with respect to the Base.
The simplest way to switch moderate to high amounts of power is to use the
transistor with an open-collector output and the transistors Emitter terminal
connected directly to ground. When used in this way, the transistors open
collector output can thus “sink” an externally supplied voltage to ground
thereby controlling any connected load.
The circuit resembles that of the Common. The difference this time is that to
operate the transistor as a switch the transistor needs to be turned either
fully “OFF” (cut-off) or fully “ON” (saturated). An ideal transistor switch
would have infinite circuit resistance between the Collector and Emitter when
turned “fully-OFF” resulting in zero current flowing through it and zero
resistance between the Collector and Emitter when turned “fully-ON”,
resulting in maximum current flow.
In practice when the transistor is turned “OFF”, small leakage currents flow
through the transistor and when fully “ON” the device has a low resistance
value causing a small saturation voltage ( VCE ) across it. Even though the
transistor is not a perfect switch, in both the cut-off and saturation regions
the power dissipated by the transistor is at its minimum.
In order for the Base current to flow, the Base input terminal must be made
more positive than the Emitter by increasing it above the 0.7 volts needed for
a silicon device. By varying this Base-Emitter voltage VBE, the Base current is
also altered and which in turn controls the amount of Collector current
flowing through the transistor as previously discussed.
MODULE SUMMARY
Congratulations! You have just studied Module II. Now you are ready to
evaluate how much you have benefited from your reading by answering the
summative test. Good Luck!!!
SUMMATIVE TEST
2.
3.
4. For the network of Fig 7.89, assuming I Q = 3.3mA and VGSQ = −1.5V is
obtained from the graph of shockley’s equation, determine
a. VG
b. VD
c. VS
d. V DS
The doping concentration affects how efficiently the transistor operates: the emitter is highly doped to increase charge carrier injection, the base is lightly doped and thin to allow carriers to pass quickly, and the collector is moderately doped to handle larger currents .
The common-emitter configuration is preferred for amplification because it provides a significant voltage and current gain. This setup uses a small current at the base to control a large current between the emitter and collector, making it effective for amplification purposes .
The emitter-base junction being forward biased allows current to flow from emitter to collector, which is essential for transistor operation. It controls conduction by enabling charge carriers to cross this junction, in active mode allowing amplification .
If both junctions of a BJT are forward biased, it operates in saturation mode. In this mode, the BJT allows a large current to flow from emitter to collector, acting as a closed circuit .
NPN transistors have a current flow from base to emitter, with electrons as the majority carriers, while PNP transistors have current flow from emitter to base, with holes as the majority carriers. The direction of current and the type of charge carriers used in conduction are opposite in these transistors .
The Thévenin equivalent simplifies the analysis of the voltage-divider bias circuit by reducing the network to a simple voltage source and resistor, enabling easier calculation of current and voltage levels in the circuit .
The frequency response of the common-base configuration is high, partly due to its low input capacitance and is suitable for high-frequency applications compared to the common-emitter, which is preferred for medium frequency range applications .
The approximate analysis method for a voltage-divider bias circuit can be used if the resistance R2 is at least ten times larger than the emitter resistor RE multiplied by the transistor’s beta. If 2 * RE ≥ beta, the approximate method is applicable .
The self-bias configuration is advantageous because it does not require multiple DC supplies, achieving a stable bias through negative feedback via the source resistor, and compensating better for variations in device parameters and temperature changes .
Temperature sensitivity greatly affects the bias current ICQ and voltage VCEQ because changes in temperature alter the current gain beta, which controlled these parameters in earlier configurations. This problem is addressed in voltage-divider bias to be less beta-dependent .