ITEM: SURFACE MOUNT LED SMD SPECIFICATION
Part No: PLBT3020-YDW2900K
Characters
3.0mm2.0mm SMT LED , 1.3mm THICKNESS.
LOW POWER CONSUMPTION.
VIEWING ANGLE 120.
VARIOUS COLORS AND LENS TYPES AVAILABLE.
PACKAGE: 2000 PCS/REEL.
ITEM
MATERIALS
Resin(Mold)
Silicon
Lens Color
Yellow
Dice
InGaN
Emitted color
White
The Chip made in EPISTAR Corporation.
Typical Correlated Colour Temperature is 2900K
Absolute Maximum RatingsTa=25
Item
Power Dissipation/DICE
DC Forward Current/DICE
Single chip pulsed Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
Symbol
Value
Unit
PD
120
mW
IF
30
mA
IFP
VR
mA
100
5
Topr
-30 ~ +80
Tstg
-40 ~ +100
Tsol
260for5sec
Duty 1/10Pulse Width 0.1ms .
please refer to IF-Ta diagram of curves for the temperature during application
Soldering time max 10sec
08.15.11 Rev0 JAS
Electrical-Optical CharacteristicsTa=25
Value
Symbol
Parameter
Forward Voltage
Luminous intensity
Unit
Min.
Typ.
Max.
Vf
2.8
3.2
3.6
Iv
1850
2250
2450
mcd
Test condition
If=20mA
If=20mA
5.5
6.5
0.4407
0.4043
Wavelength
Lm
If=20mA
If=20mA
Ir
10
Vr=5V
Viewing angle
21/2
120
Deg
If=20mA
Color Rendering Index
CRI
70
Reverse Current
If=20mA
[Link] intensity (IV) 10%, Forward Voltage(VF) 0.1V, Wavelength (X,Y) 0.01
CRI5.
[Link] standard testing
Range of bins
Bin
VF(V)
Bin
BinB
BinC
2.8-2.9
2.9-3.0
BinI
BinD
BinF
BinG
BinH
3.0-3.1
3.1-3.2
3.2-3.3
Color coordinate
Comparison
3.3-3.4
3.4-3.5
VF(V)
3.5-3.6
Bin
Bin5
Bin6
Bin7
Iv(mcd)
1850-2050
2050-2250
2250-2450
WD
WE
BinE
Bin
WL(nm)
08.15.11 Rev0 JAS
Color coordinate Comparison
0.44
2760K
0.42
3160K
0.4
0.38
WE
0.41
Bin Code X
2960K
WD
0.43
0.45
0.47
WE
0.4292
0.4064
0.4193
0.3855
0.4344
0.3937
0.4451
0.4149
WD
0.4451
0.4147
0.4344
0.3937
0.4519
0.4044
0.4633
0.4245
08.15.11 Rev0 JAS
Outline Dimensions
REC0MMEND PADLAYOUT
All dimensions are in millimeters.
Tolerance is 0.1 unless other specified
Specifications are subject to change without notice.
08.15.11 Rev0 JAS
COMMODITY: SURFACE MOUNT CHIP LED SMD SPECIFICATION
DEVICE NUMBER: PLBT3020-YDW2900K
Fig.2 Relative Luminous Intensity-IF
(Ta=25)
Forward Current IF(mA)
Relative Luminous Intensity
Fig.1 IF-VF(Ta=25)
Forward Current IF(mA)
Forward Voltage
VF(V)
Fig.4 Relative Luminous Intensity-Ta
Fig.3 Wavelength Characteristics
(Ta=25)
Relative Luminous Intensity
6.00E-05
4.00E-05
2.00E-05
0.00E+00
300
400
500
Wavelength d (nm)
600
700
800
Relative Luminous Intensity
8.00E-05
Ambient Temperature Ta ()
Forward Current IF(mA)
Fig.5 IF-Ta
VerIS-1.0
08.15.11 Rev0 JAS
Reflow Profile
Ambient Temperature Ta ()
Reflow Temp/Time
NOTES:
1. We recommend the reflow temperature 240(5).the maximum soldering temperature should be limited to
260.
2. Dont cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
08.15.11 Rev0 JAS
Test circuit and handling precautions
Test circuit
Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause big
current change (Burn out will happen).
[Link]
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature: 5~30 (41~86)
2.2 Shelf life in sealed bag: 12 month at 5~30 and 60% R.H. after the package is
Opened, the products should be used within a week or they should be keeping to stored at
20%R.H. with .ip-lock sealed.
[Link]*
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 703 x(12~24hrs) and 5%RH, taped reel type
3.2 1003 x(45min~1hr), bulk type
3.3 1303 x (15~30min), bulk type
* It shall be normal to see slight color fading of carrier (light yellow) after baking in process.
08.15.11 Rev0 JAS
Test items and results of reliability
Type
Test Item
Temperature Cycle
Test Conditions
-45 30min
20 min
105 30min
Note
Number of
Damaged
100 cycle
0/22
100 cycle
0/22
-10 15min
Environmental
Sequence
Thermal Shock
5sec
100 15min
High Humidity Heat Cycle
30 65
90%RH 24hrs/1cycle
10 cycle
0/22
High Temperature Storage
Ta=100
1000 hrs
0/22
Ta=85
Humidity Heat Storage
RH=85%
1000 hrs
0/22
Low Temperature Storage
Ta=-40
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
Ta=25
Operation
Sequence
Life Test
IF=20mA
85 RH=85%
High Humidity Heat Life Test
IF=15mA
Ta=-20
Low Temperature Life Test
IF=20mA
08.15.11 Rev0 JAS
3020 Single-Color High Performance SMD Top LEDs Packaging Specifications
.
Feeding Direction
Dimensions of Reel (Unit: mm)
Feeding Direction
Polarity Mark
Dimensions of Tape (Unit: mm)
Arrangement of Tape
NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of allowable missing smds is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 2000pcs/Reel
VerIS-1.0
No.1soldering
LED Usage and Handling Instructions
AIts not better to be manual soldering.
BReflow soldering
1Soldering according to the following temperature chart is highly recommended
2Soldering paste
Use soldering paste with the melting point at 230
is recommended
No.2Collet
1Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the products quality. LED is different from
other electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collets lowering down height is not well set,
it will bring damage to the gold wire at the time of collets picking up and loading which will cause the LED fail
to light up, light up now and then or other quality problems
2How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case
that improper position of collet will damage the gold wire inside the LED. Different collets fit for different
products, please refer to the following pictures cross out.
Outer diameter of collet should be
larger than the lighting area
Outer diameter of collet
Picture 1
Picture 2
3How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will
directly affect the quality of products during SMT is that if the collect go down too much, it
will press lens and cause the distortion or breaking of gold wire. The setting of collet position
should follow the pictures belowed.
Picture 3
Picture 4
No.3Other points for attention
ANo pressure should be exerted to the epoxy shell of the SMD under high temperature.
BDo not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to
break.
CLED should be used as soon as possible when being taken out of the original package, and should be
stored in anti-moisture and anti-ESD package.
No.4This usage and handling instruction is only for your reference.
VerIS-1.0