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Microelectronics
+ Microelectronics is a subfield of electronics.
*As the name suggests, microelectronics relates to the study and
manufacture of very “small” electronic designs and components.
* Many components of normal electronic design are available in a
microelectronic equivalent. Such as:
Transistors, capacitors, inductors, resistors, diodes and
(naturally) insulators and conductors can all be found in microelectronic
devices.Microelectronics
+ Microelectronics is a “subdivision” of the field of electronics that deals with
very small and microscopic elements to manufacture electronic
components.
+ Microelectronics has been rapidly evolving as the most in-demand field of
electronics because of the increasing demand for inexpensive and
lightweight equipment that use up a little amount of electric power.
* A branch of electronics technology called Microelectronics.Microelectronics
* In modern society, micro-electronic components are popular and can be found in
almost everything: computers, tablets, mobile phones, vehicles and many
many other devices and systems which require or make use of electronics.
* Micro-Electronics Engineering is a specialized field that is under the discipline of
Electronics Engineering and is dedicated to the design and development of
microchips.Clean room concept
+A cleanroom is a controlled environment where pollutants like dust,
airborne microbes and aerosol particles are filtered out in order to provide
the cleanest area possible.
+ Most cleanrooms are used for manufacturing products such as electronics,
pharmaceutical products, and medical equipment.
+A cleanroom can be classified into different levels of contamination
depending on the amount of particles allowed in the space, per cubic
meter.
+ Cleanrooms also control variables like temperature, air flow, and humidity.HOW DOES IT WORK?
* Essentially, cleanrooms work to remove pollutants, particles, and
contaminants from outside ambient air.
+ Outside air is first circulated to a filter system.
+ The filters then clean and decontaminate this outside air according to
their specifications.
+ The filtered air is then forced into the cleanroom.Who needs a cleanroom
+ There are a wide variety of reasons that a company may need a cleanroom.
If manufacturing something that is easily affected by contaminants or particles in the air.
+ Few common reasons to need a cleanroom and some common industries that regularly use
cleanrooms:
+ Manufacturing Companies
Research Facilities
Pharmaceutical Companies
Medical Laboratories
Electronic Part Production.Silicon Wafers:
+ In the semiconductor or silicon wafer industry, the term wafer appeared in the 1950s to describe a
thin round slice of semiconductor material, typically germanium or silicon.
* Allelectronic devices we use today ranging from:
+ Cell phones
+1
+ Computers
+ Smart speakers
have one thing in common in their manufacturing process namely Silicon Wafer.
* Round shape comes from single-crystal ingots usually produced using the Czochralski method
* Wafers are formed of highly pure, nearly defect-free single crystalline material, with a purity of
99.9999999% or higher.
+ One process for forming crystalline wafers is known as the Czochralski method.Silicon wafers are thin slices of pure crystalized silicon.
‘These pure forms of wafers are normally called undoped or intrinsic silicon wafer.
(One of the reasons for using Silicon wafer in semiconductor industry is the natural abundance of
Silicon.
Aso itis one of the most abundant material found on earth usually found in the form of SiO2.
Another reason of using silicon is that electrical characteristics of the silicon can be precisely
controlled by addition of dopants.
Silicon wafers that are doped with impurities such as:
+ Boron create P- type wafers and
+ Wafers that are doped with Arsenic or Phosphorous create N-type wafers.
‘The P type wafers have several positive charged holes
whereas N type wafers have several negative charged electrons in it.One of the biggest reasons that wafers are round is because they are in that
shape from the beginning.
The silicon ingots that are used to grow the wafer are circular in shape.
This is due to the process of dipping a seed crystal into molten silicon and
rotating and slowly extracting as the crystal grows. This is also known as the
popular Czochralski method.
Since the product is already circular in shape, the wafers are cut into that
same shape. While they could be cut into a different shape, it would waste
silicon.
Note: An ingot is a piece of relatively pure material, usually metal, that is cast
into a shape suitable for further processing.Silicon wafers are used as semiconductors in electronics, specifically,
manufacturing process of integrated circuits.
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor,
such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits .
The wafer serves as the substrate for microelectronics devices built in and upon the
wafer.
It’ undergoes many microfabrication processes, such as doping, ion
implantation, etching, thin-film _deposition of various _—materials,
and photolithoaraphic patterning.
Finally, the individual microcircuits are separated by wafer dicing and packaged as an
integrated circuit.Cleaning, texturing and etching
+ Wafers are cleaned with weak acids to remove unwanted particles.
* There are several standard cleaning procedures to make sure the
surface of a silicon wafer contains no contamination.
+ One of the most effective methods is RCA clean.Silicon WafersGrowth of single crystal silicon —- Czochralski Method
+ Scientist made this discovery by accident: instead of dipping his pen into
his inkwell, he dipped it in molten tin, and drew a tin filament, which later
proved to be a single crystal.
* The Czochralski method, also Czochralski technique or Czochralski
process, is a method of crystal growth used to obtain single crystal of
semiconductor (e.g. silicon, germanium and gallium arsenide).Silicon Wafer Preparation
Various steps involve are:
a
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. Preparation of MGS and EGS.
b.
Crystal Growth and doping
. Ingot trimming and grinding
|. Ingot slicing
. Wafer polishing and etching
. Wafer cleaning
The raw material for the preparation of single crystal silicon is the electronic grade
silicon (EGS) which is a polycrystalline material of high purity.+ EGS is the raw material for the preparation of single crystal silicon.
+ Production of EGS requires multiple/many steps/process.
+ First step: to produce the metallurgical grade silicon (MGS) is produced in a submerged electrode arc
furnace.
PSRETSSUE ERS
SsNext Step: After obtaining MGS, the next step of the process is to palverized the silicon mechanically and react with
anhydrous hydrogen chloride (HCL) to form trichlorosilane (SiHc13)
Si Geld) + EACH (Om) na © Sr Cl, (Qa) tHe Het
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