MPX2010 Series

10 kPa Temperature Compensated Pressure Sensors

Rev. 14 — 27 April 2021 Product data sheet

1 General Description
The MPX2010 series device is a silicon piezoresistive pressure sensor providing a highly
accurate and linear voltage output directly proportional to the applied pressure. The
sensor is a single monolithic silicon diaphragm with the strain gauge and a thin-film
resistor network integrated on-chip. The chip is laser trimmed for precise span and offset
calibration and temperature compensation.

2 Features and Benefits

• Ratiometric to Supply Voltage
• Differential and Gauge Options
• Temperature Compensated over 0 °C to 85 °C
• Easy-to-Use Chip Carrier Package Options

3 Applications
• Air Movement Control
• Respiratory Diagnostics
• Controllers
• Pressure Switching
NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

4 Ordering Information

Package Case Number of ports Pressure type

Device name Device marking
options number None Single Dual Gauge Differential Absolute
Small Outline Package (MPXV2010 Series)
MPXV2010GP Tray 1369 ● ● MPXV2010GP
MPXV2010DP Tray 1351 ● ● MPXV2010DP
Unibody Package (MPX2010 Series)
MPX2010D Tray 344 ● ● MPX2010D
MPX2010DP Tray 344C ● ● MPX2010DP
MPX2010GP Tray 344B ● ● MPX2010GP
MPX2010GSX Tray 344F ● ● MPX2010D
MPAK Package (MPXM2010 Series)
MPXM2010GS Rail 1320A ● ● MPXM2010GS
MPXM2010GST1 Tape & Reel 1320A ● ● MPXM2010GS

Small outline packages MPAK Packages

MPXV2010GP MPXV2010DP MPXM2010GS/GST1

Case 1369-01 Case 1351-01 Case 1320A-02

Unibody Packages

aaa-041213 aaa-041242 aaa-041665

MPX2010D MPX2010GP MPX2010DP MPX2010GSX

Case 344-15 Case 344B-01 Case 344C-01 Case 344F-01

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

5 Block Diagram
Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure
sensor chip.

Figure 1. Temperature compensated pressure sensor schematic

6 Pin Information

6.1 MPX2010D

1 2 3 4

aaa-037831

Figure 2. Case 344-15

Table 1. Pin definitions - MPX2010D

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

6.2 MPX2010DP

1 2 3 4

aaa-037859

Figure 3. Case 344C-01

Table 2. Pin definitions - MPX2010DP

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output

6.3 MPX2010GP

4 3 2 1
aaa-037861

Figure 4. Case 344B-01

Table 3. Pin definitions - MPX2010GP

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

6.4 MPXM2010GS/GST1

1 2 3 4

aaa-037854

Figure 5. Case 1320A-02

Table 4. Pin definitions - MPXM2010GS/GST1

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output

6.5 MPXV2010GP

5 4

6 3

7 2

8 1

aaa-037857

Figure 6. Case 1369-01

Table 5. Pin definitions - MPXV2010GP

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output
n.a. 5 —
n.a. 6 —
n.a. 7 —
n.a. 8 —

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

6.6 MPXV2010DP

5 4

6 3

7 2

8 1

aaa-037858

Figure 7. CASE 1351-01

Table 6. Pin definitions - MPXV2010DP

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output
n.a. 5 —
n.a. 6 —
n.a. 7 —
n.a. 8 —

6.7 MPX2010GSX

1 2 3 4
aaa-038356

Figure 8. Case 344F-01

Table 7. Pin definitions - MPX2010GSX

Symbol Pin Description
GND 1 Ground
+VOUT 2 + Voltage output
VS 3 Power supply
–VOUT 4 – Voltage output

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

7 Maximum Ratings
Table 8. Maximum ratings
Exposure beyond the specified limits may cause permanent damage or degradation to the device.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Typ Max Unit
Pmax Overpressure P1 > P2 — — 75 kPa
Pburst Burst Pressure P1 > P2 — — 100 kPa
Tstg Storage Temperature −40 — +125 °C
TA Operating Temperature −40 — +125 °C

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

8 Operating Characteristics

Table 9. Operating characteristics (VS = 10 Vdc, TA = 25 °C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Units
[1]
Operating Pressure Range POP 0 — 10 kPa
[2]
Supply Voltage VS — 10 16 Vdc
Supply Current Io — 6.0 — mAdc
[3]
Full Scale Span VFSS 24 25 26 mV
[4]
Offset Voff –1.0 — 1.0 mV
Sensitivity ΔV/ΔP — 2.5 — mV/kPa
[5]
Linearity — –1.0 — 1.0 %VFSS
[5]
Pressure Hysteresis (0 kPa to 10 kPa) — — ±0.1 — %VFSS
[5]
Temperature Hysteresis (–40 °C to +125 °C) — — ±0.5 — %VFSS
[5]
Temperature Coefficient of Full Scale Span TCVFSS –1.0 — 1.0 %VFSS
[5]
Temperature Coefficient of Offset TCVoff –1.0 — 1.0 mV
Input Impedance Zin 1300 — 2550 Ω
Output Impedance Zout 1400 — 3000 Ω
[6]
Response Time (10% to 90%) tR — 1.0 — ms
[7]
Warm-Up Time — — 20 — ms
[8]
Offset Stability — — ±0.5 — %VFSS

[1] 1.0 kPa equals 0.145 PSI.

[2] Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to
device self-heating.
[3] Full scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated
pressure.
[4] Offset (Voff) is defined as the output voltage at the minimum rated pressure.
[5] Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure using the end point method over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the
minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum
rated pressure, at 25 °C.
• TcSpan: Output deviation at full rated pressure over the temperature range of 0 °C to 85 °C, relative to 25 °C
• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C
[6] Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step
change in pressure.
[7] Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
[8] Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure Temperature Cycling with Bias test.

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

9 Characteristics

9.1 Voltage output versus applied differential pressure

The output voltage of the differential or gauge sensor increases with increasing pressure
applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the
pressure side (P1).

9.2 On-chip temperature compensation and calibration

Figure 9 shows the typical output characteristics of the MPX2010 series at 25 °C.
The effects of temperature on full scale span and offset are very small and are shown
under Section 8 "Operating Characteristics".
This performance over temperature is achieved by having both the shear stress strain
gauge and the thin-film resistor circuitry on the same silicon diaphragm. Each chip
is dynamically laser trimmed for precise span and offset calibration and temperature
compensation.
35
Output
(mVdc) VS = 10 Vdc
30 TA = 25 °C
P1 > P2
25

20
TYP
15 Span
MAX Range
(Typical)
10
MIN
5

0
Offset
-5 (Typical)
PSI 0 0.362 0.725 1.09 1.45

kPa 2.5 5 7.5 10

Pressure Differential
aaa-038500

Figure 9. Output vs. pressure differential

9.3 Linearity
Linearity refers to how well a transducer's output follows the equation
Vout = Voff + Sensitivity x P over the operating pressure range (Figure 10). There are two
basic methods for calculating nonlinearity:
• End point straight line fit
• Least squares best line fit
While a least squares fit gives the "best case" linearity error (lower numerical value), the
calculations required are burdensome.

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Conversely, an end point fit will give the "worst case" error (often more desirable in error
budget calculations) and the calculations are more straightforward for the user.
NXP's specified pressure sensor linearities are based on the end point straight line
method measured at the midrange pressure.

Least Squares Fit Least

Square
Exaggerated Deviation
Performance

Relative Voltage Output

Curve
Straight Line
Deviation

End Point Straight

Line Fit

Offset

0 50 100

Pressure (% Full Scale)

aaa-038501

Figure 10. Linearity specification comparison

9.4 Pressure (P1) / Vacuum (P2) side identification

NXP designates the two sides of the pressure sensor as the Pressure (P1) side and the
Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel that isolates
the die from the environment. The NXP MPX pressure sensor is designed to operate with
positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using Table 10.

Table 10. Pressure (P1) side delineation table

Part Number Case Pressure (P1) Side Identifier
Type
MPX2010D 344 Stainless Steel Cap
MPX2010DP 344C Side with Part Marking
MPX2010GP 344B Side with Port Attached
MPX2010GSX 344F Side with Port Attached
MPXV2010GP 1369 Side with Port Attached
MPXV2010DP 1351 Side with Part Marking
MPXM2010GS/GSTI 1320A Side with Port Attached

9.5 Media compatibility

Figure 11 illustrates the differential or gauge configuration in a typical chip carrier. A
silicone gel isolates the die surface and wire bonds from the environment while allowing
the pressure signal to be transmitted to the silicon diaphragm.
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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Operating characteristics, internal reliability and qualification tests are based on the
use of dry clean air as the pressure medium. Media other than dry clean air may have
adverse effects on sensor performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
For more information, refer to application note AN3728.

stainless steel
silicone
die metal cover
die coat epoxy
P1 case
wire bond

lead frame
P2
RTV die
bond

aaa-037713

Figure 11. Unibody package — cross-sectional diagram (not to scale)

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

10 Package Outlines
Package dimensions are provided in package drawings. To find the most current package
outline drawing, go to [Link] and perform a keyword search for the
drawing's document number.

10.1 Small outline packages

Figure 12. SOT1693-1 (Case 1351) – Page 1

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 13. SOT1693-1 (Case 1351) – Page 2

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 14. SOT1693-3 (Case 1369-01) – Page 1

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 15. SOT1693-3 (Case 1369-01) – page 2

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

10.2 Unibody packages

Figure 16. SOT1753-1 (Case 344B-01)

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 17. SOT1754-1 (Case 344C-01)

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 18. SOT1757-1 (Case 344F-01)

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 19. SOT1772-1 (Case 344-15)

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

10.3 MPAK packages

Figure 20. SOT1673-1 (1320A-02) – Page 1

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Figure 21. SOT1673-1 (1320A-02) – Page 2

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

11 References
[1] AN840 – Temperature Compensation Methods For The Motorola X-ducer Pressure Sensor Element
[Link]
[2] AN1984 – Handling Freescale Pressure Sensors
[Link]
[3] AN3150 – Soldering Recommendations for Pressure Sensor Devices
[Link]
[4] AN1318 Interfacing Semiconductor Pressure Sensors to Microcomputers
[Link]
[5] AN3728 Media Compatibility for IPS PRT Pressure Sensors
[Link]

12 Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
MPX2010 v.14 20210427 Released — MPX2010 v.13
Modifications • Redesigned the data sheet to comply with the new identity guidelines of NXP Semiconductors. Adapted legal texts to
the new company name where appropriate.
• Removed the following discontinued part numbers throughout: MPX2010GS
MPX2010 v.13 200810 Released — MPX2010 v.12

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

13 Legal information

13.1 Data sheet status

[1][2] [3]
Document status Product status Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL [Link]

notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
13.2 Definitions
Suitability for use — NXP Semiconductors products are not designed,
Draft — A draft status on a document indicates that the content is still authorized or warranted to be suitable for use in life support, life-critical or
under internal review and subject to formal approval, which may result safety-critical systems or equipment, nor in applications where failure or
in modifications or additions. NXP Semiconductors does not give any malfunction of an NXP Semiconductors product can reasonably be expected
representations or warranties as to the accuracy or completeness of to result in personal injury, death or severe property or environmental
information included in a draft version of a document and shall have no damage. NXP Semiconductors and its suppliers accept no liability for
liability for the consequences of use of such information. inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
Short data sheet — A short data sheet is an extract from a full data sheet risk.
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain Applications — Applications that are described herein for any of these
detailed and full information. For detailed and full information see the products are for illustrative purposes only. NXP Semiconductors makes
relevant full data sheet, which is available on request via the local NXP no representation or warranty that such applications will be suitable
Semiconductors sales office. In case of any inconsistency or conflict with the for the specified use without further testing or modification. Customers
short data sheet, the full data sheet shall prevail. are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
Product specification — The information and data provided in a Product accepts no liability for any assistance with applications or customer product
data sheet shall define the specification of the product as agreed between design. It is customer’s sole responsibility to determine whether the NXP
NXP Semiconductors and its customer, unless NXP Semiconductors and Semiconductors product is suitable and fit for the customer’s applications
customer have explicitly agreed otherwise in writing. In no event however, and products planned, as well as for the planned application and use of
shall an agreement be valid in which the NXP Semiconductors product customer’s third party customer(s). Customers should provide appropriate
is deemed to offer functions and qualities beyond those described in the design and operating safeguards to minimize the risks associated with
Product data sheet. their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
13.3 Disclaimers responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
Limited warranty and liability — Information in this document is believed customer’s third party customer(s). NXP does not accept any liability in this
to be accurate and reliable. However, NXP Semiconductors does not respect.
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability Limiting values — Stress above one or more limiting values (as defined in
for the consequences of use of such information. NXP Semiconductors the Absolute Maximum Ratings System of IEC 60134) will cause permanent
takes no responsibility for the content in this document if provided by an damage to the device. Limiting values are stress ratings only and (proper)
information source outside of NXP Semiconductors. In no event shall NXP operation of the device at these or any other conditions above those
Semiconductors be liable for any indirect, incidental, punitive, special or given in the Recommended operating conditions section (if present) or the
consequential damages (including - without limitation - lost profits, lost Characteristics sections of this document is not warranted. Constant or
savings, business interruption, costs related to the removal or replacement repeated exposure to limiting values will permanently and irreversibly affect
of any products or rework charges) whether or not such damages are based the quality and reliability of the device.
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
Terms and conditions of commercial sale — NXP Semiconductors
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
products are sold subject to the general terms and conditions of commercial
liability towards customer for the products described herein shall be limited
sale, as published at [Link] unless otherwise
in accordance with the Terms and conditions of commercial sale of NXP
agreed in a valid written individual agreement. In case an individual
Semiconductors.
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
Right to make changes — NXP Semiconductors reserves the right to applying the customer’s general terms and conditions with regard to the
make changes to information published in this document, including without purchase of NXP Semiconductors products by customer.
limitation specifications and product descriptions, at any time and without

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10 kPa Temperature Compensated Pressure Sensors

No offer to sell or license — Nothing in this document may be interpreted applications and products. Customer’s responsibility also extends to other
or construed as an offer to sell products that is open for acceptance or open and/or proprietary technologies supported by NXP products for use
the grant, conveyance or implication of any license under any copyrights, in customer’s applications. NXP accepts no liability for any vulnerability.
patents or other industrial or intellectual property rights. Customer should regularly check security updates from NXP and follow up
appropriately. Customer shall select products with security features that best
Quick reference data — The Quick reference data is an extract of the meet rules, regulations, and standards of the intended application and make
product data given in the Limiting values and Characteristics sections of this the ultimate design decisions regarding its products and is solely responsible
document, and as such is not complete, exhaustive or legally binding. for compliance with all legal, regulatory, and security related requirements
concerning its products, regardless of any information or support that may
Export control — This document as well as the item(s) described herein be provided by NXP. NXP has a Product Security Incident Response Team
may be subject to export control regulations. Export might require a prior (PSIRT) (reachable at PSIRT@[Link]) that manages the investigation,
authorization from competent authorities. reporting, and solution release to security vulnerabilities of NXP products.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions. 13.4 Trademarks
Security — Customer understands that all NXP products may be subject Notice: All referenced brands, product names, service names and
to unidentified or documented vulnerabilities. Customer is responsible trademarks are the property of their respective owners.
for the design and operation of its applications and products throughout
their lifecycles to reduce the effect of these vulnerabilities on customer’s NXP — wordmark and logo are trademarks of NXP B.V.

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Tables
Tab. 1. Pin definitions - MPX2010D .............................. 3 Tab. 7. Pin definitions - MPX2010GSX ......................... 6
Tab. 2. Pin definitions - MPX2010DP ............................4 Tab. 8. Maximum ratings ...............................................7
Tab. 3. Pin definitions - MPX2010GP ............................4 Tab. 9. Operating characteristics (VS = 10 Vdc, TA
Tab. 4. Pin definitions - MPXM2010GS/GST1 ...............5 = 25 °C unless otherwise noted, P1 > P2) ........ 8
Tab. 5. Pin definitions - MPXV2010GP ......................... 5 Tab. 10. Pressure (P1) side delineation table ............... 10
Tab. 6. Pin definitions - MPXV2010DP ......................... 6 Tab. 11. Revision history ...............................................22

Figures
Fig. 1. Temperature compensated pressure Fig. 11. Unibody package — cross-sectional
sensor schematic .............................................. 3 diagram (not to scale) ..................................... 11
Fig. 2. Case 344-15 ......................................................3 Fig. 12. SOT1693-1 (Case 1351) – Page 1 ................. 12
Fig. 3. Case 344C-01 ................................................... 4 Fig. 13. SOT1693-1 (Case 1351) – Page 2 ................. 13
Fig. 4. Case 344B-01 ................................................... 4 Fig. 14. SOT1693-3 (Case 1369-01) – Page 1 ............ 14
Fig. 5. Case 1320A-02 ................................................. 5 Fig. 15. SOT1693-3 (Case 1369-01) – page 2 .............15
Fig. 6. Case 1369-01 ....................................................5 Fig. 16. SOT1753-1 (Case 344B-01) ........................... 16
Fig. 7. CASE 1351-01 .................................................. 6 Fig. 17. SOT1754-1 (Case 344C-01) ........................... 17
Fig. 8. Case 344F-01 ................................................... 6 Fig. 18. SOT1757-1 (Case 344F-01) ............................18
Fig. 9. Output vs. pressure differential ......................... 9 Fig. 19. SOT1772-1 (Case 344-15) ..............................19
Fig. 10. Linearity specification comparison .................. 10 Fig. 20. SOT1673-1 (1320A-02) – Page 1 ................... 20
Fig. 21. SOT1673-1 (1320A-02) – Page 2 ................... 21

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NXP Semiconductors
MPX2010 Series
10 kPa Temperature Compensated Pressure Sensors

Contents
1 General Description ............................................ 1
2 Features and Benefits ........................................ 1
3 Applications .........................................................1
4 Ordering Information .......................................... 2
5 Block Diagram .....................................................3
6 Pin Information ....................................................3
6.1 MPX2010D .........................................................3
6.2 MPX2010DP ...................................................... 4
6.3 MPX2010GP ...................................................... 4
6.4 MPXM2010GS/GST1 .........................................5
6.5 MPXV2010GP ....................................................5
6.6 MPXV2010DP ....................................................6
6.7 MPX2010GSX ....................................................6
7 Maximum Ratings ............................................... 7
8 Operating Characteristics .................................. 8
9 Characteristics .................................................... 9
9.1 Voltage output versus applied differential
pressure ............................................................. 9
9.2 On-chip temperature compensation and
calibration ...........................................................9
9.3 Linearity ............................................................. 9
9.4 Pressure (P1) / Vacuum (P2) side
identification ..................................................... 10
9.5 Media compatibility .......................................... 10
10 Package Outlines .............................................. 12
10.1 Small outline packages ....................................12
10.2 Unibody packages ........................................... 16
10.3 MPAK packages .............................................. 20
11 References ......................................................... 22
12 Revision history ................................................ 22
13 Legal information .............................................. 23

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.

© NXP B.V. 2021. All rights reserved.

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Date of release: 27 April 2021
Document identifier: MPX2010