Ceramic SMD Capacitors Code
Ceramic SMD Capacitors Code
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Chip Monolithic
Ceramic Capacitors
Pravin Mevada
Murata
Manufacturing Co., Ltd.
[Link].C02E-12
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Part Numbering 2
Selection Guide 6
Package 84
! Caution 88
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2
Notice 93
3
Reference Data 98
Package 136 12
! Caution 139 13
Notice 145
14
ISO 9001 Certifications 148
15
Please refer to "Specifications and Test Methods" at the end of each chapter of 15 – 19 .
16
17
18
19
20
21
22
23
Recycled Paper
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o Part Numbering
11 1.25g1.0mm 0504
15 1.0g0.5mm 0402
18 1.6g0.8mm 0603
1D 1.4g1.4mm
1X Depends on individual standards.
21 2.0g1.25mm 0805
22 2.8g2.8mm 1111
31 3.2g1.6mm 1206
32 3.2g2.5mm 1210
3X Depends on individual standards.
42 4.5g2.0mm 1808
43 4.5g3.2mm 1812
52 5.7g2.8mm 2211
55 5.7g5.0mm 2220
Continued on the following page.
2
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3
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EIA Code
Capacitance Change from 25°C (%)
Murata Code –55°C –30°C –10°C
Max. Min. Max. Min. Max. Min.
5C/5G 0.58 –0.24 0.40 –0.17 0.25 –0.11
6C 0.87 –0.48 0.59 –0.33 0.38 –0.21
6P 2.33 0.72 1.61 0.50 1.02 0.32
6R 3.02 1.28 2.08 0.88 1.32 0.56
6S 4.09 2.16 2.81 1.49 1.79 0.95
6T 5.46 3.28 3.75 2.26 2.39 1.44
7U 8.78 5.04 6.04 3.47 3.84 2.21
4
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!0Packaging
Code Packaging
L ø178mm Embossed Taping
D ø178mm Paper Taping
K ø330mm Embossed Taping
J ø330mm Paper Taping
E ø178mm Special Packaging
F ø330mm Special Packaging
B Bulk
C Bulk Case
T Bulk Tray
5
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GRM (C0G)
0.1pF–0.1µF
Frequency Control/Tuning,
Class1 TC's;
Impedance Matching
GRM (U2J)
GMA
Optical Communications Wire-Die-Bonding
100pF–10000pF
2kV GR4
Medium Voltage High Capacitance 100pF–4700pF
Only for
Telecommunication
Devices Safety Standard Type GD 10pF–4700pF
Recognized Type GF 10pF–4700pF
Automotive
GCM (C0G, CHA etc.)
(Power-train, Class1 TC's;
220pF–10µF
Safety Equipment)
LLC
Low Inductance
2200pF–2.2µF
6
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e g e
■ Features
1. Terminations are made of metal highly resistant to
migration.
2. The GRM series is a complete line of chip ceramic
T
capacitors in 6.3V, 10V, 16V, 25V, 50V, 100V, 200V L W
Rated Volt. 50 50 50 50 50 25 50 50
(1H) (1H) (1H) (1H) (1H) (1E) (1H) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
0.30pF(R30) 0.50(5)
0.40pF(R40) 0.50(5)
0.50pF(R50) 0.50(5)
0.60pF(R60) 0.50(5)
0.70pF(R70) 0.50(5)
0.75pF(R75) 0.50(5)
0.80pF(R80) 0.50(5)
0.90pF(R90) 0.50(5)
1.0pF(1R0) 0.50(5)
1.1pF(1R1) 0.50(5)
1.2pF(1R2) 0.50(5)
1.3pF(1R3) 0.50(5)
1.4pF(1R4) 0.50(5)
1.5pF(1R5) 0.50(5)
1.6pF(1R6) 0.50(5)
1.7pF(1R7) 0.50(5)
1.8pF(1R8) 0.50(5)
1.9pF(1R9) 0.50(5)
2.0pF(2R0) 0.50(5)
2.1pF(2R1) 0.50(5)
2.2pF(2R2) 0.50(5)
2.3pF(2R3) 0.50(5)
2.4pF(2R4) 0.50(5)
2.5pF(2R5) 0.50(5)
2.6pF(2R6) 0.50(5)
Continued on the following page.
7
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Continued from the preceding page.
Rated Volt. 50 50 50 50 50 25 50 50
(1H) (1H) (1H) (1H) (1H) (1E) (1H) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
2.7pF(2R7) 0.50(5)
2.8pF(2R8) 0.50(5)
2.9pF(2R9) 0.50(5)
3.0pF(3R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
3.1pF(3R1) 0.50(5)
3.2pF(3R2) 0.50(5)
3.3pF(3R3) 0.50(5)
3.4pF(3R4) 0.50(5)
3.5pF(3R5) 0.50(5)
3.6pF(3R6) 0.50(5)
3.7pF(3R7) 0.50(5)
3.8pF(3R8) 0.50(5)
3.9pF(3R9) 0.50(5)
4.0pF(4R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
4.1pF(4R1) 0.50(5)
4.2pF(4R2) 0.50(5)
4.3pF(4R3) 0.50(5)
4.4pF(4R4) 0.50(5)
4.5pF(4R5) 0.50(5)
4.6pF(4R6) 0.50(5)
4.7pF(4R7) 0.50(5)
4.8pF(4R8) 0.50(5)
4.9pF(4R9) 0.50(5)
5.0pF(5R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
5.1pF(5R1) 0.50(5)
5.2pF(5R2) 0.50(5)
5.3pF(5R3) 0.50(5)
5.4pF(5R4) 0.50(5)
5.5pF(5R5) 0.50(5)
5.6pF(5R6) 0.50(5)
5.7pF(5R7) 0.50(5)
5.8pF(5R8) 0.50(5)
5.9pF(5R9) 0.50(5)
6.0pF(6R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
6.1pF(6R1) 0.50(5)
6.2pF(6R2) 0.50(5)
6.3pF(6R3) 0.50(5)
6.4pF(6R4) 0.50(5)
6.5pF(6R5) 0.50(5)
6.6pF(6R6) 0.50(5)
6.7pF(6R7) 0.50(5)
6.8pF(6R8) 0.50(5)
6.9pF(6R9) 0.50(5)
7.0pF(7R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
7.1pF(7R1) 0.50(5)
7.2pF(7R2) 0.50(5)
7.3pF(7R3) 0.50(5)
7.4pF(7R4) 0.50(5)
7.5pF(7R5) 0.50(5)
7.6pF(7R6) 0.50(5)
7.7pF(7R7) 0.50(5)
7.8pF(7R8) 0.50(5)
Continued on the following page.
8
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Continued from the preceding page.
Rated Volt. 50 50 50 50 50 25 50 50
(1H) (1H) (1H) (1H) (1H) (1E) (1H) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
7.9pF(7R9) 0.50(5)
8.0pF(8R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
8.1pF(8R1) 0.50(5)
8.2pF(8R2) 0.50(5)
8.3pF(8R3) 0.50(5)
8.4pF(8R4) 0.50(5)
8.5pF(8R5) 0.50(5)
8.6pF(8R6) 0.50(5)
8.7pF(8R7) 0.50(5)
8.8pF(8R8) 0.50(5)
8.9pF(8R9) 0.50(5)
9.0pF(9R0) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
9.1pF(9R1) 0.50(5)
9.2pF(9R2) 0.50(5)
9.3pF(9R3) 0.50(5)
9.4pF(9R4) 0.50(5)
9.5pF(9R5) 0.50(5)
9.6pF(9R6) 0.50(5)
9.7pF(9R7) 0.50(5)
9.8pF(9R8) 0.50(5)
9.9pF(9R9) 0.50(5)
10pF(100) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
12pF(120) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
15pF(150) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
18pF(180) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
22pF(220) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
27pF(270) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
33pF(330) 0.50(5) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
39pF(390) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
47pF(470) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
56pF(560) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
68pF(680) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
82pF(820) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
100pF(101) 0.50(5) 0.50(5) 0.50(5) 0.50(5)
120pF(121) 0.50(5) 0.50(5) 0.50(5)
150pF(151) 0.50(5) 0.50(5) 0.50(5)
180pF(181) 0.50(5) 0.50(5) 0.50(5)
220pF(221) 0.50(5) 0.50(5)
270pF(271) 0.50(5) 0.50(5)
330pF(331) 0.50(5) 0.50(5)
390pF(391) 0.50(5) 0.50(5)
470pF(471) 0.50(5)
560pF(561) 0.50(5)
680pF(681) 0.50(5)
820pF(821) 0.50(5)
1000pF(102) 0.50(5)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
9
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Rated Volt.
200 100 50 50 50 50 200 100 50 50 50
(2D) (2A) (1H) (1H) (1H) (1H) (2D) (2A) (1H) (1H) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
0.50pF(R50) 0.80(8) 0.80(8) 0.80(8)
0.75pF(R75) 0.80(8) 0.80(8) 0.80(8)
1.0pF(1R0) 0.80(8) 0.80(8) 0.80(8)
2.0pF(2R0) 0.80(8) 0.80(8) 0.80(8)
3.0pF(3R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
4.0pF(4R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
5.0pF(5R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
6.0pF(6R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
7.0pF(7R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
8.0pF(8R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
9.0pF(9R0) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
10pF(100) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
12pF(120) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
15pF(150) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
18pF(180) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
22pF(220) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
27pF(270) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
33pF(330) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
39pF(390) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
47pF(470) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
56pF(560) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
68pF(680) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
82pF(820) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
100pF(101) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
120pF(121) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
150pF(151) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
180pF(181) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
220pF(221) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
270pF(271) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
330pF(331) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
390pF(391) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
470pF(471) 0.80(8) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
560pF(561) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
680pF(681) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
820pF(821) 0.80(8) 0.80(8)
1000pF(102) 0.80(8) 0.80(8) 0.80(8) 0.80(8)
1200pF(122) 0.80(8) 0.80(8) 0.80(8)
1500pF(152) 0.80(8) 0.80(8) 0.80(8)
1800pF(182) 0.80(8) 0.80(8) 0.80(8)
2200pF(222) 0.80(8) 0.80(8) 0.80(8)
2700pF(272) 0.80(8) 0.80(8) 0.80(8)
3300pF(332) 0.80(8) 0.80(8)
3900pF(392) 0.80(8) 0.80(8)
4700pF(472) 0.80(8) 0.80(8)
5600pF(562) 0.80(8) 0.80(8)
6800pF(682) 0.80(8) 0.80(8)
8200pF(822) 0.80(8) 0.80(8)
10000pF(103) 0.80(8) 0.80(8)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
10
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Rated Volt.
200 100 50 50 50 50 200 100 50 50 50
(2D) (2A) (1H) (1H) (1H) (1H) (2D) (2A) (1H) (1H) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
12pF(120) 0.85(9) 0.85(9)
15pF(150) 0.85(9) 0.85(9)
18pF(180) 0.85(9) 0.85(9)
22pF(220) 0.85(9) 0.85(9)
27pF(270) 0.85(9) 0.85(9)
33pF(330) 0.85(9) 0.85(9)
39pF(390) 0.85(9) 0.85(9)
47pF(470) 0.85(9) 0.85(9)
56pF(560) 0.85(9) 0.85(9)
68pF(680) 1.25(B)
82pF(820) 1.25(B)
100pF(101) 1.25(B)
120pF(121) 1.25(B) 0.85(9)
150pF(151) 1.25(B) 1.25(B)
180pF(181) 1.25(B) 0.85(9) 1.25(B)
220pF(221) 1.25(B) 0.85(9) 0.85(9) 1.25(B)
270pF(271) 0.85(9) 0.85(9) 0.85(9) 1.25(B)
330pF(331) 0.85(9) 0.85(9) 0.85(9) 1.25(B)
390pF(391) 1.25(B) 0.85(9) 0.85(9) 1.25(B)
470pF(471) 1.25(B) 0.85(9) 0.85(9) 1.25(B) 0.85(9)
560pF(561) 1.25(B) 1.25(B) 1.25(B) 0.85(9) 1.25(B)
680pF(681) 0.85(9) 1.25(B) 1.25(B) 0.85(9) 1.25(B)
820pF(821) 0.85(9) 1.25(B) 1.25(B) 0.60(6) 1.25(B) 0.60(6)
1000pF(102) 0.85(9) 1.25(B) 0.60(6) 1.25(B) 0.60(6)
1200pF(122) 0.85(9) 0.60(6) 1.25(B) 0.60(6) 1.25(B) 0.60(6)
1500pF(152) 0.85(9) 0.60(6) 1.25(B) 0.85(9) 1.25(B) 0.85(9)
1800pF(182) 0.60(6) 1.25(B) 0.85(9) 1.25(B) 0.85(9)
2200pF(222) 0.60(6) 0.85(9) 0.85(9)
2700pF(272) 0.60(6) 1.25(B) 1.25(B)
3300pF(332) 0.60(6) 1.25(B) 1.25(B)
3900pF(392) 0.60(6)
4700pF(472) 0.60(6)
5600pF(562) 0.85(9)
6800pF(682) 0.85(9)
8200pF(822) 0.85(9)
10000pF(103) 0.85(9) 0.60(6) 0.60(6)
12000pF(123) 0.85(9) 0.60(6) 0.60(6)
15000pF(153) 0.85(9) 0.60(6) 0.60(6)
18000pF(183) 1.25(B) 0.60(6) 0.60(6)
22000pF(223) 1.25(B) 0.85(9) 0.85(9)
27000pF(273) 0.85(9) 0.85(9)
33000pF(333) 1.00(A) 1.00(A)
39000pF(393) 1.25(B) 1.25(B)
47000pF(473) 1.25(B) 1.25(B)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
11
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Rated Volt.
500 200 100 50 25 25 50 50 50 200 100 50 50 50
(2H) (2D) (2A) (1H) (1E) (1E) (1H) (1H) (1H) (2D) (2A) (1H) (1H) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
1.0pF(1R0) 1.15(M)
2.0pF(2R0) 1.15(M)
3.0pF(3R0) 1.15(M)
4.0pF(4R0) 1.15(M)
5.0pF(5R0) 1.15(M)
6.0pF(6R0) 1.15(M)
7.0pF(7R0) 1.15(M)
8.0pF(8R0) 1.15(M)
9.0pF(9R0) 1.15(M)
10pF(100) 1.15(M)
12pF(120) 1.15(M)
15pF(150) 1.15(M)
18pF(180) 1.15(M)
22pF(220) 1.15(M)
27pF(270) 1.15(M)
33pF(330) 1.15(M)
39pF(390) 1.15(M)
47pF(470) 1.15(M)
56pF(560) 1.15(M)
68pF(680) 1.15(M)
82pF(820) 1.15(M)
270pF(271) 1.15(M)
330pF(331) 1.15(M)
390pF(391) 1.15(M)
470pF(471) 1.15(M) 0.85(9)
560pF(561) 1.15(M) 0.85(9)
680pF(681) 0.85(9) 1.15(M) 0.85(9)
820pF(821) 0.85(9) 0.85(9) 0.85(9) 1.15(M) 0.85(9)
1000pF(102) 0.85(9) 1.15(M) 1.15(M) 0.85(9) 1.15(M) 0.85(9)
1200pF(122) 0.85(9) 1.15(M) 1.15(M) 1.15(M) 1.15(M) 0.85(9)
1500pF(152) 0.85(9) 1.15(M) 1.15(M) 1.15(M) 0.85(9)
1800pF(182) 0.85(9) 1.15(M) 0.85(9)
2200pF(222) 0.85(9) 1.15(M) 1.15(M)
2700pF(272) 0.85(9) 1.15(M) 1.15(M)
3300pF(332) 0.85(9) 0.85(9) 1.15(M) 1.15(M)
3900pF(392) 0.85(9) 0.85(9) 1.15(M) 0.85(9) 1.15(M) 0.85(9)
4700pF(472) 0.85(9) 0.85(9) 1.15(M) 0.85(9) 0.85(9)
5600pF(562) 0.85(9) 0.85(9) 0.85(9) 0.85(9)
6800pF(682) 0.85(9) 0.85(9) 0.85(9) 1.15(M) 1.15(M)
8200pF(822) 0.85(9) 1.15(M) 1.15(M) 1.15(M) 1.15(M)
10000pF(103) 0.85(9) 0.85(9)
12000pF(123) 0.85(9)
15000pF(153) 0.85(9)
18000pF(183) 0.85(9)
22000pF(223) 0.85(9)
27000pF(273) 0.85(9)
33000pF(333) 0.85(9)
39000pF(393) 1.15(M)
47000pF(473) 1.15(M)
Continued on the following page.
12
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Continued from the preceding page.
TC
X5R
(R6)
Part Number GRM15 GRM18 GRM21 GRM31
L x W [EIA] 1.00x0.50 [0402] 1.60x0.80 [0603] 2.00x1.25 [0805] 3.20x1.60 [1206]
TC
X7R
(R7)
Part Number GRM15 GRM18 GRM21 GRM31
L x W [EIA] 1.00x0.50 [0402] 1.60x0.80 [0603] 2.00x1.25 [0805] 3.20x1.60 [1206]
13
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Continued from the preceding page.
X7R
1 TC
(R7)
Part Number GRM15 GRM18 GRM21 GRM31
L x W [EIA] 1.00x0.50 [0402] 1.60x0.80 [0603] 2.00x1.25 [0805] 3.20x1.60 [1206]
10µF 1.60
(106) (C)
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TC Y5V
(F5)
Part Number GRM15 GRM18 GRM21 GRM31
L x W [EIA] 1.00x0.50 [0402] 1.60x0.80 [0603] 2.00x1.25 [0805] 3.20x1.60 [1206]
15
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Dimensions (mm)
Part Number
■ Features L
W T e min. g min.
GRM329 0.85 ±0.1
1. Terminations are made of metal highly resistant GRM32M 1.15 ±0.1
GRM32N 3.2 ±0.3 2.5 ±0.2 1.35 ±0.15 0.3 1.0
to migration. GRM32R 1.8 ±0.2
2. The GRM series is a complete line of chip ceramic GRM32E 2.5 ±0.2
GRM43M 1.15 ±0.1
capacitors in 10V, 16V, 25V, 50V, 100V and 200V GRM43N 1.35 ±0.15
GRM43R 4.5 ±0.4 3.2 ±0.3 1.8 ±0.2 0.3 2.0
ratings. These capacitors have temperature GRM43D 2.0 ±0.2 e g e
T
GRM55R
reflow soldering. GRM55D 2.0 ±0.2 L W
GRM55E 2.5 ±0.2
■ Applications
General electronic equipment
17
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2 Part Number
TC Code
(Standard)
Rated Voltage
(Vdc)
Capacitance
(µF)
Length L
(mm)
Width W
(mm)
Thickness T
(mm)
GRM55DR61H106KA88 X5R (EIA) 50 10 ±10% 5.70 5.00 2.00
GRM55DR72A105KA01 X7R (EIA) 100 1.0 ±10% 5.70 5.00 2.00
GRM55ER72A475KA01 X7R (EIA) 100 4.7 ±10% 5.70 5.00 2.50
GRM55RR71H105KA01 X7R (EIA) 50 1.0 ±10% 5.70 5.00 1.80
GRM55RR71H155KA01 X7R (EIA) 50 1.5 ±10% 5.70 5.00 1.80
GRM55ER11H475KA01 X7R (EIA) 50 4.7 ±10% 5.70 5.00 2.50
GRM55ER71H475KA01 X7R (EIA) 50 4.7 ±10% 5.70 5.00 2.50
GRM55RF52A474ZA01 Y5V (EIA) 100 0.47 +80/-20% 5.70 5.00 1.80
18
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e g e
3
■ Features
1. Small chip size (LxWxT: 0.4x0.2x0.2, 0.6x0.3x0.3
mm)
2. Terminations are made of metal highly resistant to
T
migration.
3. GRM02, GRM03 series is suited to only reflow L W
soldering.
Dimensions (mm)
4. Stringent dimensional tolerances allow highly Part Number
L W T e g min.
reliable, high speed automatic chip placement on GRM022 0.4 ±0.02 0.2 ±0.02 0.2 ±0.02 0.07 to 0.14 0.13
PCBs. GRM033 0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.1 to 0.2 0.2
5. GRM02, GRM03 series are suited to miniature micro wave
module, portable equipment and high frequency
circuits.
■ Applications
1. Miniature micro wave module
2. Portable equipment
3. High frequency circuit
19
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Continued from the preceding page.
21
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e g e
■ Features
1. Terminations are made of metal highly resistant to
4 migration.
2. A wide selection of sizes is available, from the
T
miniature LxWxT: 0.6x0.3x0.3mm or
L W
LxWxT: 1.0x0.5x0.5mm.
3. The GRM03 type is a complete line of chip ceramic Part Number
Dimensions (mm)
capacitors in 25V ratings, The GRM15 type is a L W T e g min.
GRM033 0.6±0.03 0.3±0.03 0.3±0.03 0.1 to 0.2 0.2
complete line of chip ceramic capacitors in 50V GRM155 1.0±0.05 0.5±0.05 0.5±0.05 0.15 to 0.3 0.4
ratings.
4. These capacitors have temperature characteristics
ranging C0G.
5. GRM03 and GRM15 type are applied to only reflow
soldering.
6. Stringent dimensional tolerances allow highly
reliable, high speed automatic chip placement on PCBs.
7. The GRM series is available in paper tape and reel
packaging for automatic placement.
■ Applications
General electronic equipment
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance, Capacitance Tolerance and T Dimension
0.10pF(R10) M, N 0.30(3) 0.50(5)
0.20pF(R20) K, M 0.30(3) 0.50(5)
0.30pF(R30) K, M 0.30(3) 0.50(5)
0.40pF(R40) K, M 0.30(3) 0.50(5)
0.50pF(R50) K, M 0.30(3) 0.50(5)
0.60pF(R60) K, M 0.30(3) 0.50(5)
0.70pF(R70) K, M 0.30(3) 0.50(5)
0.80pF(R80) K, M 0.30(3) 0.50(5)
0.90pF(R90) K, M 0.30(3) 0.50(5)
1.0pF(1R0) J, K 0.30(3) 0.50(5)
1.1pF(1R1) J, K 0.30(3) 0.50(5)
1.2pF(1R2) J, K 0.30(3) 0.50(5)
1.3pF(1R3) J, K 0.30(3) 0.50(5)
1.4pF(1R4) J, K 0.30(3) 0.50(5)
1.5pF(1R5) J, K 0.30(3) 0.50(5)
1.6pF(1R6) J, K 0.30(3) 0.50(5)
1.7pF(1R7) J, K 0.30(3) 0.50(5)
1.8pF(1R8) J, K 0.30(3) 0.50(5)
1.9pF(1R9) J, K 0.30(3) 0.50(5)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance, Capacitance Tolerance and T Dimension
2.0pF(2R0) G, J 0.30(3) 0.50(5)
2.1pF(2R1) G, J 0.30(3) 0.50(5)
2.2pF(2R2) G, J 0.30(3) 0.50(5)
4
2.3pF(2R3) G, J 0.30(3) 0.50(5)
2.4pF(2R4) G, J 0.30(3) 0.50(5)
2.5pF(2R5) G, J 0.30(3) 0.50(5)
2.6pF(2R6) G, J 0.30(3) 0.50(5)
2.7pF(2R7) G, J 0.30(3) 0.50(5)
2.8pF(2R8) G, J 0.30(3) 0.50(5)
2.9pF(2R9) G, J 0.30(3) 0.50(5)
3.0pF(3R0) G, J 0.30(3) 0.50(5)
3.1pF(3R1) G, J 0.30(3) 0.50(5)
3.2pF(3R2) G, J 0.30(3) 0.50(5)
3.3pF(3R3) G, J 0.30(3) 0.50(5)
3.4pF(3R4) G, J 0.30(3) 0.50(5)
3.5pF(3R5) G, J 0.30(3) 0.50(5)
3.6pF(3R6) G, J 0.30(3) 0.50(5)
3.7pF(3R7) G, J 0.30(3) 0.50(5)
3.8pF(3R8) G, J 0.30(3) 0.50(5)
3.9pF(3R9) G, J 0.30(3) 0.50(5)
4.0pF(4R0) G, J 0.30(3) 0.50(5)
4.1pF(4R1) G, J 0.30(3) 0.50(5)
4.2pF(4R2) G, J 0.30(3) 0.50(5)
4.3pF(4R3) G, J 0.30(3) 0.50(5)
4.4pF(4R4) G, J 0.30(3) 0.50(5)
4.5pF(4R5) G, J 0.30(3) 0.50(5)
4.6pF(4R6) G, J 0.30(3) 0.50(5)
4.7pF(4R7) G, J 0.30(3) 0.50(5)
4.8pF(4R8) G, J 0.30(3) 0.50(5)
4.9pF(4R9) G, J 0.30(3) 0.50(5)
5.0pF(5R0) F, G 0.30(3) 0.50(5)
5.1pF(5R1) F, G 0.30(3) 0.50(5)
5.2pF(5R2) F, G 0.30(3) 0.50(5)
5.3pF(5R3) F, G 0.30(3) 0.50(5)
5.4pF(5R4) F, G 0.30(3) 0.50(5)
5.5pF(5R5) F, G 0.30(3) 0.50(5)
5.6pF(5R6) F, G 0.30(3) 0.50(5)
5.7pF(5R7) F, G 0.30(3) 0.50(5)
5.8pF(5R8) F, G 0.30(3) 0.50(5)
5.9pF(5R9) F, G 0.30(3) 0.50(5)
6.0pF(6R0) F, G 0.30(3) 0.50(5)
6.1pF(6R1) F, G 0.30(3) 0.50(5)
6.2pF(6R2) F, G 0.30(3) 0.50(5)
6.3pF(6R3) F, G 0.30(3) 0.50(5)
6.4pF(6R4) F, G 0.30(3) 0.50(5)
6.5pF(6R5) F, G 0.30(3) 0.50(5)
6.6pF(6R6) F, G 0.30(3) 0.50(5)
6.7pF(6R7) F, G 0.30(3) 0.50(5)
6.8pF(6R8) F, G 0.30(3) 0.50(5)
6.9pF(6R9) F, G 0.30(3) 0.50(5)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
23
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Continued from the preceding page.
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance, Capacitance Tolerance and T Dimension
7.0pF(7R0) F, G 0.30(3) 0.50(5)
7.1pF(7R1) F, G 0.30(3) 0.50(5)
4 7.2pF(7R2) F, G 0.30(3) 0.50(5)
7.3pF(7R3) F, G 0.30(3) 0.50(5)
7.4pF(7R4) F, G 0.30(3) 0.50(5)
7.5pF(7R5) F, G 0.30(3) 0.50(5)
7.6pF(7R6) F, G 0.30(3) 0.50(5)
7.7pF(7R7) F, G 0.30(3) 0.50(5)
7.8pF(7R8) F, G 0.30(3) 0.50(5)
7.9pF(7R9) F, G 0.30(3) 0.50(5)
8.0pF(8R0) F, G 0.30(3) 0.50(5)
8.1pF(8R1) F, G 0.30(3) 0.50(5)
8.2pF(8R2) F, G 0.30(3) 0.50(5)
8.3pF(8R3) F, G 0.30(3) 0.50(5)
8.4pF(8R4) F, G 0.30(3) 0.50(5)
8.5pF(8R5) F, G 0.30(3) 0.50(5)
8.6pF(8R6) F, G 0.30(3) 0.50(5)
8.7pF(8R7) F, G 0.30(3) 0.50(5)
8.8pF(8R8) F, G 0.30(3) 0.50(5)
8.9pF(8R9) F, G 0.30(3) 0.50(5)
9.0pF(9R0) F, G 0.30(3) 0.50(5)
9.1pF(9R1) F, G 0.30(3) 0.50(5)
9.2pF(9R2) F, G 0.30(3) 0.50(5)
9.3pF(9R3) F, G 0.30(3) 0.50(5)
9.4pF(9R4) F, G 0.30(3) 0.50(5)
9.5pF(9R5) F, G 0.30(3) 0.50(5)
9.6pF(9R6) F, G 0.30(3) 0.50(5)
9.7pF(9R7) F, G 0.30(3) 0.50(5)
9.8pF(9R8) F, G 0.30(3) 0.50(5)
9.9pF(9R9) F, G 0.30(3) 0.50(5)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
24
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e g e
■ Features
1. This series is suited to flow and reflow soldering.
Capacitor terminations are made of metal highly
resistant to migration.
5
T
2. Large capacitance values enable excellent bypass
effects to be realized. L W
25
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26
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Specifications
No. Item Temperature Test Method
High Dielectric Type
Compensating Type
B1, B3, F1, R6 : Y25 to W85D
Operating
R1, R7 : Y55 to W125D Reference temperature : 25D
1 Temperature Y55 to W125D
E4 : W10 to W85D (2∆, 3∆, 4∆, B1, B3, F1, R1, R6 : 20D)
Range
F5 : Y30 to W85D
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated 5
voltage range.
3 Appearance No defects or abnormalities Visual inspection
27
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Specifications
No. Item Temperature Test Method
High Dielectric Type
Compensating Type
B1, B3 : Within T10% The capacitance change should be measured after 5 min. at
(Y25 to W85D) each specified temp. stage.
R1, R7 : Within ±15% (1)Temperature Compensating Type
(Y55 to W125D) The temperature coefficient is determined using the
R6 : Within T15% capacitance measured in step 3 as a reference.
(Y55 to W85D) When cycling the temperature sequentially from step 1 through
Within the specified tolerance E4 : Within W22/Y56% 5 (5C : W25 to W125D/∆C : W20 to W125D : other temp. coeffs.
No bias
5 (Table A-1) (W10 to W85D)
F1 : Within W30/Y80%
: W25 to W85D/W20 to W85D) the capacitance should be within
the specified tolerance for the temperature coefficient and
(Y25 to W85D) capacitance change as Table A-1.
F5 : Within W22/Y82% The capacitance drift is calculated by dividing the differences
(Y30 to W85D) between the maximum and minimum measured values in the
C8 : Within T22% step 1, 3 and 5 by the cap. value in step 3.
(Y55 to W105D)
Step Temperature (D)
1 Reference Temperature T2
50% of B1 : Within W10/–30% 2 Y55T3 (for ∆C)/Y25T3 (for other TC)
the Rated R1 : Within W15/–40% 3 Reference Temperature T2
Voltage F1 : Within W30/–95% 4 125T3 (for ∆C)/85T3 (for other TC)
5 Reference Temperature T2
No removal of the terminations or other defect should occur. Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 1a using an eutectic solder. Then apply 10N* force in
parallel with the test jig for 10T1 sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
c
*1N (GRM02), 2N (GRp03), 5N (GRp15, GRM18)
(in mm)
Adhesive Strength Type a b c
10
b
28
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Specifications
No. Item Temperature Test Method
High Dielectric Type
Compensating Type
Appearance No defects or abnormalities
Capacitance Within the specified tolerance
[B1, B3, R1, R6, R7, E4, C8] Solder the capacitor on the test jig (glass epoxy board) in the
W.V. : 25V min. : 0.025 max. same manner and under the same conditions as (10).
W.V. : 16/10V : 0.035 max. The capacitor should be subjected to a simple harmonic motion
W.V. : 6.3/4V having a total amplitude of 1.5mm, the frequency being varied
Vibration 30pF and over : QU1000
11
Resistance 30pF and below :
: 0.05 max. (CF3.3µF) uniformly between the approximate limits of 10 and 55Hz. The 5
: 0.1 max. (CU3.3µF) frequency range, from 10 to 55Hz and return to 10Hz, should
Q/D.F. Q U400W20C
[F1, F5] be traversed in approximately 1 minute. This motion should be
C : Nominal Capacitance (pF) W.V. : 25V min. applied for a period of 2 hours in each 3 mutually perpendicular
: 0.05 max. (CF0.1µF) directions (total of 6 hours).
: 0.09 max. (CU0.1µF)
W.V. : 16/10V : 0.125 max.
W.V. : 6.3V : 0.15 max.
Solder the capacitor on the test jig (glass epoxy board) shown
No crack or marked defect should occur. in Fig. 2a using an eutectic solder. Then apply a force in the
direction shown in Fig. 3a for 5T1 sec. The soldering should be
done either with an iron or using the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
b
φ4.5
VWZ[§¨«¬©X¥T°±_¥̀\¦U®ª«]YZ STW¤¥̈¢Q,£§¨RV
^¯
[¬
40
c
20 50 Pressurizing
speed : 1.0mm/sec.
a
Pressurize
Y]^ª®¯ Z«
100
R230
12 Deflection Fig. 2a
t : 1.6mm (GRp02/03/15 : t : 0.8mm)
Flexure : V1 Type a b c
GRM02 0.2 0.56 0.23
Capacitance meter GRp03 0.3 0.9 0.3
45 45 GRp15 0.4 1.5 0.5
GRM18 1.0 3.0 1.2
Fig. 3a GRM21 1.2 4.0 1.65
GRM31 2.2 5.0 2.0
GRM32 2.2 5.0 2.9
GRM43 3.5 7.0 3.7
GRM55 4.5 8.0 5.6
(in mm)
29
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Specifications
No. Item Temperature Test Method
High Dielectric Type
Compensating Type
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No defects or abnormalities
B1, B3, R1, R6, R7, C8
Capacitance Within T2.5% or T0.25pF Fix the capacitor to the supporting jig in the same
: Within T7.5%
Change (Whichever is larger) manner and under the same conditions as (10).
F1, F5, E4 : Within T20%
Perform the five cycles according to the four heat treatments
5 [B1, B3, R1, R6, R7, E4, C8] shown in the following table.
W.V. : 25V min. : 0.025 max. Set for 24T2 hours at room temperature, then measure.
W.V. : 16/10V : 0.035 max. Step 1 2 3 4
Temperature W.V. : 6.3/4V Min. Max.
15 30pF and over : Q U1000 : 0.05 max. (CF3.3µF) Room Room
Cycle Temp. (D) Operating Operating
30pF and below : Temp. Temp.
: 0.1 max. (CU3.3µF) Temp. W0/Y3 Temp. W3/Y0
Q/D.F. Q U400W20C
[F1, F5] Time (min.) 30T3 2 to 3 30T3 2 to 3
C : Nominal Capacitance (pF) W.V. : 25V min.
: 0.05 max. (CF0.1µF) #Initial measurement for high dielectric constant type
: 0.09 max. (CU0.1µF) Perform a heat treatment at 150W0/Y10D for one hour and
W.V. : 16/10V : 0.125 max. then set at room temperature for 24T2 hours.
W.V. : 6.3V : 0.15 max. Perform the initial measurement.
30
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Specifications
No. Item Temperature Test Method
High Dielectric Type
Compensating Type
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No defects or abnormalities
B1, B3, R1, R6, R7, C8
: Within T12.5%
Capacitance Within T7.5% or T0.75pF
F1, F5, E4 : Within T30%
Change (Whichever is larger)
[W.V. : 10V max.]
F1, F5 : Within W30/Y40%
Apply the rated voltage at 40T2D and 90 to 95% humidity for 5
500T12 hours. Remove and set for 24T2 hours at room
[B1, B3, R1, R6, R7, E4, C8] temperature, then measure.
W.V. : 25V min. : 0.05 max. The charge/discharge current is less than 50mA.
Humidity
17 W.V. : 16/10V : 0.05 max.
Load
W.V. : 6.3V #Initial measurement for F1, F5/10V max.
30pF and over : QU200 : 0.075 max. (CF3.3µF) Apply the rated DC voltage for 1 hour at 40T2D.
30pF and below : : 0.125 max. (CU3.3µF) Remove and set for 24T2 hours at room temperature.
Q/D.F. QU100W10C/3 Perform initial measurement.
[F1, F5]
C : Nominal Capacitance (pF) W.V. : 25V min.
: 0.075 max. (CF0.1µF)
: 0.125 max. (CU0.1µF)
W.V. : 16/10V : 0.15 max.
W.V. : 6.3V : 0.2 max.
31
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Dimensions (mm)
Part Number
L W T e min. g min.
■ Features GRM033 0.6 ±0.03 0.3 ±0.03 0.3 ±0.03 0.1 to 0.2 0.2
GRM155 1.0 ±0.05 0.5 ±0.05 0.5 ±0.05 0.15 to 0.35 0.3
1. Smaller size and higher capacitance value GRM185 1.6 ±0.1 0.8 ±0.1 0.5 +0/-0.2 0.2 to 0.5 0.5
GRM188 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5 0.5
2. High reliability and no polarity GRM216 0.6 ±0.1
3. Excellent pulse responsibility and noise reduction GRM219 2.0 ±0.1 1.25 ±0.1 0.85 ±0.1 0.2 to 0.7 0.7
GRM21B 1.25 ±0.1
due to the low impedance at high frequency GRM316 0.6 ±0.1
GRM319 3.2 ±0.15 1.6 ±0.15 0.85 ±0.1 0.3 to 0.8 1.5
4. Ta replacement GRM31M 1.15 ±0.1 e g e
GRM31C 3.2 ±0.2 1.6 ±0.2 1.6 ±0.2
GRM32C 1.6 ±0.2
6 ■ Applications GRM32D 3.2 ±0.3 2.5 ±0.2 2.0 ±0.2 0.3 1.0
GRM32E 2.5 ±0.2
General electronic equipment GRM43D 2.0 ±0.2
T
GRM43E 4.5 ±0.4 3.2 ±0.3 2.5 ±0.2 0.3 2.0
GRM43S 2.8 ±0.2 L W
GRM55F 5.7 ±0.4 5.0 ±0.4 3.2 ±0.2 0.3 2.0
33
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34
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B1, B3, R6, C7, C8 : 0.1 max. The D.F. should be measured at reference temperature at the
F1, F5 : 0.2 max. frequency and voltage shown in the table.
*Table 1 Capacitance Frequency Voltage
Dissipation Factor GRM155 B3/R6 1A 124 to 224 CV10µF (10V min.)*1 1T0.1kHz 1.0T0.2Vrms
8 CV10µF (6.3V max.) 1T0.1kHz 0.5T0.1Vrms
(D.F.) GRM185 B3/R6 1A 105
CG10µF 120T24Hz 0.5T0.1Vrms
GRM188 B3/R6 1C/1A 225
GRM219 B3/R6 1A 475 *1 However the voltage is 0.5T0.1Vrms about Table 1
GRM21B B3/R6 1C/1A 106 items on the left side.
35
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No removal of the terminations or other defects should occur. Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 1a using an eutectic solder. Then apply 10N* force in
parallel with the test jig for 10T1sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
c
soldering is uniform and free of defects such as heat shock.
*5N : GRp15/GRM18, 2N : GRp33
Adhesive Strength Type a b c
10 GRp03 0.3 0.9 0.3
b
a
of Termination
GRp15 0.4 1.5 0.5
Solder resist GRM18 1.0 3.0 1.2
Baked electrode or GRM21 1.2 4.0 1.65
6 Fig. 1a
copper foil GRM31
GRM32
2.2
2.2
5.0
5.0
2.0
2.9
GRM43 3.5 7.0 3.7
GRM55 4.5 8.0 5.6
Appearance No defects or abnormalities Solder the capacitor on the test jig (glass epoxy board) in the
Capacitance Within the specified tolerance same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
11 Vibration uniformly between the approximate limits of 10 and 55Hz. The
B1, B3, R6, C7, C8 : 0.1 max. frequency range, from 10 to 55Hz and return to 10Hz, should
D.F.
F1, F5 : 0.2 max. be traversed in approximately 1 minute. This motion should be
applied for a period of 2 hours in each 3 mutually perpendicular
directions (total of 6 hours).
No cracking or marking defects should occur. Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 2a using an eutectic solder. Then apply a force in the
direction shown in Fig. 3a for 5T1 sec. The soldering should be
done either with an iron or using the reflow method and should
be conducted with care so that the soldering is uniform and free
20 of defects such as heat shock.
50 Pressurizing
speed : 1.0mm/sec. b
R230
Pressurize
VWZ[§¨«¬©X¥T°±_¥̀\¦U®ª«]YZ STW¤¥̈¢Q,£§¨RV
^¯
[¬ ø4.5
40
c
Flexure : V1 a
Fig.3a
Y]^ª®¯ Z« Type
GRp03
GRp15
GRM18
a
0.3
0.4
1.0
100
Fig. 2a
0.9
1.5
3.0
c
t : 1.6mm
b
0.3
0.5
1.2
GRM21 1.2 4.0 1.65
GRM31 2.2 5.0 2.0
GRM32 2.2 5.0 2.9
GRM43 3.5 7.0 3.7
GRM55 4.5 8.0 5.6
(in mm)
36
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Appearance No defects or abnormalities Preheat the capacitor at 120 to 150D for 1 minute.
Immerse the capacitor in an eutectic solder or Sn-3.0Ag-0.5Cu
Capacitance B1, B3, R6, C7, C8 : Within T7.5%
solder solution at 270T5D for 10T0.5 seconds. Set at room
Change F1, F5 : Within T20%
temperature for 24T2 hours, then measure.
B1, B3, R6, C7, C8 : 0.1 max.
Q/D.F.
F1, F5 : 0.2 max. #Initial measurement for high dielectric constant type
Resistance
Perform a heat treatment at 150W0/Y10D for one hour and
to I.R. More than 50Ω · F
14 then set at room temperature for 24T2 hours.
Soldering
Perform the initial measurement.
Heat
*Preheating for GRM32/43/55
Dielectric
No defects Step Temperature Time
Strength
1 100 to 120D 1 min. 6
2 170 to 200D 1 min.
Appearance No defects or abnormalities Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10).
Capacitance B1, B3, R6, C7, C8 : Within T7.5%
Perform the five cycles according to the four heat treatments
Change F1, F5 : Within T20%
shown in the following table.
B1, B3, R6, C7, C8 : 0.1 max. Set for 24T2 hours at room temperature, then measure.
D.F.
F1, F5 : 0.2 max.
Step 1 2 3 4
Temperature I.R. More than 50Ω · F
Min. Max.
15 Sudden Room Room
Temp. (D) Operating Operating
Change Temp. Temp.
Temp. W0/Y3 Temp. W3/Y0
Time (min.) 30T3 2 to 3 30T3 2 to 3
Dielectric
No defects
Strength #Initial measurement for high dielectric constant type
Perform a heat treatment at 150W0/Y10D for one hour and
then set at room temperature for 24T2 hours.
Perform the initial measurement.
Appearance No defects or abnormalities Apply the rated voltage at 40T2D and 90 to 95% humidity for
500T12 hours. The charge/discharge current is less than 50mA.
Capacitance B1, B3, R6, C7, C8 : Within T12.5%
Change F1, F5 : Within T30%
High #Initial measurement
Temperature B1, B3, R6, C7, C8 : 0.2 max. Perform a heat treatment at 150W0/Y10D for one hour and
D.F.
16 High F1, F5 : 0.4 max. then let sit for 24T2 hours at room temperature. Perform the
Humidity initial measurement.
(Steady)
I.R. More than 12.5Ω · F #Measurement after test
Perform a heat treatment at 150W0/Y10D for one hour and
then let sit for 24T2 hours at room temperature, then measure.
Appearance No defects or abnormalities Apply 150% of the rated voltage for 1000T12 hours at the
maximum operating temperature T3D. Let sit for 24T2 hours at
Capacitance B1, B3, R6, C7, C8 : Within T12.5%
room temperature, then measure.
Change F1, F5 : Within T30%
The charge/discharge current is less than 50mA.
B1, B3, R6, C7, C8 : 0.1 max.
D.F.
F1, F5 : 0.4 max. #Initial measurement
17 Durability Perform a heat treatment at 150W0/Y10D for one hour and
then let sit for 24T2 hours at room temperature. Perform the
initial measurement.
I.R. More than 25Ω · F
#Measurement after test
Perform a heat treatment at 150W0/Y10D for one hour and
then let sit for 24T2 hours at room temperature, then measure.
37
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e g e
■ Features
1. Mobile Telecommunication and RF module, mainly
2. Quality improvement of telephone call, Low power
Consumption, yield ratio improvement
T
■ Applications L W
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
0.30pF(R30) 0.30(3) 0.50(5)
0.40pF(R40) 0.30(3) 0.50(5)
0.50pF(R50) 0.30(3) 0.50(5)
0.60pF(R60) 0.30(3) 0.50(5)
0.70pF(R70) 0.30(3) 0.50(5)
0.75pF(R75) 0.30(3) 0.50(5)
0.80pF(R80) 0.30(3) 0.50(5)
0.90pF(R90) 0.30(3) 0.50(5)
1.0pF(1R0) 0.30(3) 0.50(5)
1.1pF(1R1) 0.30(3) 0.50(5)
1.2pF(1R2) 0.30(3) 0.50(5)
1.3pF(1R3) 0.30(3) 0.50(5)
1.4pF(1R4) 0.30(3) 0.50(5)
1.5pF(1R5) 0.30(3) 0.50(5)
1.6pF(1R6) 0.30(3) 0.50(5)
1.7pF(1R7) 0.30(3) 0.50(5)
1.8pF(1R8) 0.30(3) 0.50(5)
1.9pF(1R9) 0.30(3) 0.50(5)
2.0pF(2R0) 0.30(3) 0.50(5)
2.1pF(2R1) 0.30(3) 0.50(5)
2.2pF(2R2) 0.30(3) 0.50(5)
2.3pF(2R3) 0.30(3) 0.50(5)
2.4pF(2R4) 0.30(3) 0.50(5)
2.5pF(2R5) 0.30(3) 0.50(5)
2.6pF(2R6) 0.30(3) 0.50(5)
2.7pF(2R7) 0.30(3) 0.50(5)
2.8pF(2R8) 0.30(3) 0.50(5)
2.9pF(2R9) 0.30(3) 0.50(5)
3.0pF(3R0) 0.30(3) 0.50(5)
3.1pF(3R1) 0.30(3) 0.50(5)
3.2pF(3R2) 0.30(3) 0.50(5)
3.3pF(3R3) 0.30(3) 0.50(5)
3.4pF(3R4) 0.30(3) 0.50(5)
Continued on the following page.
38
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in it may be discontinued
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Continued from the preceding page.
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
3.5pF(3R5) 0.30(3) 0.50(5)
3.6pF(3R6) 0.30(3) 0.50(5)
3.7pF(3R7) 0.30(3) 0.50(5)
3.8pF(3R8) 0.30(3) 0.50(5)
3.9pF(3R9) 0.30(3) 0.50(5)
4.0pF(4R0) 0.30(3) 0.50(5)
4.1pF(4R1) 0.30(3) 0.50(5)
4.2pF(4R2) 0.30(3) 0.50(5)
4.3pF(4R3) 0.30(3) 0.50(5)
4.4pF(4R4) 0.30(3) 0.50(5) 7
4.5pF(4R5) 0.30(3) 0.50(5)
4.6pF(4R6) 0.30(3) 0.50(5)
4.7pF(4R7) 0.30(3) 0.50(5)
4.8pF(4R8) 0.30(3) 0.50(5)
4.9pF(4R9) 0.30(3) 0.50(5)
5.0pF(5R0) 0.30(3) 0.50(5)
5.1pF(5R1) 0.30(3) 0.50(5)
5.2pF(5R2) 0.30(3) 0.50(5)
5.3pF(5R3) 0.30(3) 0.50(5)
5.4pF(5R4) 0.30(3) 0.50(5)
5.5pF(5R5) 0.30(3) 0.50(5)
5.6pF(5R6) 0.30(3) 0.50(5)
5.7pF(5R7) 0.30(3) 0.50(5)
5.8pF(5R8) 0.30(3) 0.50(5)
5.9pF(5R9) 0.30(3) 0.50(5)
6.0pF(6R0) 0.30(3) 0.50(5)
6.1pF(6R1) 0.30(3) 0.50(5)
6.2pF(6R2) 0.30(3) 0.50(5)
6.3pF(6R3) 0.30(3) 0.50(5)
6.4pF(6R4) 0.30(3) 0.50(5)
6.5pF(6R5) 0.30(3) 0.50(5)
6.6pF(6R6) 0.30(3) 0.50(5)
6.7pF(6R7) 0.30(3) 0.50(5)
6.8pF(6R8) 0.30(3) 0.50(5)
6.9pF(6R9) 0.50(5)
7.0pF(7R0) 0.50(5)
7.1pF(7R1) 0.50(5)
7.2pF(7R2) 0.50(5)
7.3pF(7R3) 0.50(5)
7.4pF(7R4) 0.50(5)
7.5pF(7R5) 0.50(5)
7.6pF(7R6) 0.50(5)
7.7pF(7R7) 0.50(5)
7.8pF(7R8) 0.50(5)
7.9pF(7R9) 0.50(5)
8.0pF(8R0) 0.50(5)
8.1pF(8R1) 0.50(5)
8.2pF(8R2) 0.50(5)
8.3pF(8R3) 0.50(5)
8.4pF(8R4) 0.50(5)
8.5pF(8R5) 0.50(5)
8.6pF(8R6) 0.50(5)
Continued on the following page.
39
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in it may be discontinued
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• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Continued from the preceding page.
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
8.7pF(8R7) 0.50(5)
8.8pF(8R8) 0.50(5)
8.9pF(8R9) 0.50(5)
9.0pF(9R0) 0.50(5)
9.1pF(9R1) 0.50(5)
9.2pF(9R2) 0.50(5)
9.3pF(9R3) 0.50(5)
9.4pF(9R4) 0.50(5)
9.5pF(9R5) 0.50(5)
7 9.6pF(9R6) 0.50(5)
9.7pF(9R7) 0.50(5)
9.8pF(9R8) 0.50(5)
9.9pF(9R9) 0.50(5)
10pF(100) 0.50(5)
12pF(120) 0.50(5)
15pF(150) 0.50(5)
18pF(180) 0.50(5)
20pF(200) 0.50(5)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
40
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in it may be discontinued
burning, etc. without advance notice. Please check with our
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sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
e g e
■ Features
1. Mobile Telecommunication and RF module, mainly
2. Quality improvement of telephone call, Low power
Consumption, yield ratio improvement
T
■ Applications L W
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance, Capacitance Tolerance and T Dimension
0.20pF(R20) M, N 0.30(3) 0.50(5)
0.30pF(R30) K, M 0.30(3) 0.50(5)
0.40pF(R40) K, M 0.30(3) 0.50(5)
0.50pF(R50) K, M 0.30(3) 0.50(5)
0.60pF(R60) K, M 0.30(3) 0.50(5)
0.70pF(R70) K, M 0.30(3) 0.50(5)
0.80pF(R80) K, M 0.30(3) 0.50(5)
0.90pF(R90) K, M 0.30(3) 0.50(5)
1.0pF(1R0) K, M 0.30(3) 0.50(5)
1.1pF(1R1) K, M 0.30(3) 0.50(5)
1.2pF(1R2) K, M 0.30(3) 0.50(5)
1.3pF(1R3) K, M 0.30(3) 0.50(5)
1.4pF(1R4) K, M 0.30(3) 0.50(5)
1.5pF(1R5) K, M 0.30(3) 0.50(5)
1.6pF(1R6) K, M 0.30(3) 0.50(5)
1.7pF(1R7) K, M 0.30(3) 0.50(5)
1.8pF(1R8) K, M 0.30(3) 0.50(5)
1.9pF(1R9) K, M 0.30(3) 0.50(5)
2.0pF(2R0) G, J 0.30(3) 0.50(5)
2.1pF(2R1) G, J 0.30(3) 0.50(5)
2.2pF(2R2) G, J 0.30(3) 0.50(5)
2.3pF(2R3) G, J 0.30(3) 0.50(5)
2.4pF(2R4) G, J 0.30(3) 0.50(5)
2.5pF(2R5) G, J 0.30(3) 0.50(5)
2.6pF(2R6) G, J 0.30(3) 0.50(5)
2.7pF(2R7) G, J 0.30(3) 0.50(5)
2.8pF(2R8) G, J 0.30(3) 0.50(5)
2.9pF(2R9) G, J 0.30(3) 0.50(5)
3.0pF(3R0) G, J 0.30(3) 0.50(5)
3.1pF(3R1) G, J 0.30(3) 0.50(5)
3.2pF(3R2) G, J 0.30(3) 0.50(5)
3.3pF(3R3) G, J 0.30(3) 0.50(5)
3.4pF(3R4) G, J 0.30(3) 0.50(5)
Continued on the following page.
41
!Note • This PDF catalog
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this catalog or oursmoking
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in it may be discontinued
burning, etc. without advance notice. Please check with our
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sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Continued from the preceding page.
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance, Capacitance Tolerance and T Dimension
3.5pF(3R5) G, J 0.30(3) 0.50(5)
3.6pF(3R6) G, J 0.30(3) 0.50(5)
3.7pF(3R7) G, J 0.30(3) 0.50(5)
3.8pF(3R8) G, J 0.30(3) 0.50(5)
3.9pF(3R9) G, J 0.30(3) 0.50(5)
4.0pF(4R0) G, J 0.30(3) 0.50(5)
4.1pF(4R1) G, J 0.30(3) 0.50(5)
4.2pF(4R2) G, J 0.30(3) 0.50(5)
4.3pF(4R3) G, J 0.30(3) 0.50(5)
4.4pF(4R4) G, J 0.30(3) 0.50(5)
4.5pF(4R5) G, J 0.30(3) 0.50(5)
4.6pF(4R6) G, J 0.30(3) 0.50(5)
8 4.7pF(4R7) G, J 0.30(3) 0.50(5)
4.8pF(4R8) G, J 0.30(3) 0.50(5)
4.9pF(4R9) G, J 0.30(3) 0.50(5)
5.0pF(5R0) F, G 0.30(3) 0.50(5)
5.1pF(5R1) F, G 0.30(3) 0.50(5)
5.2pF(5R2) F, G 0.30(3) 0.50(5)
5.3pF(5R3) F, G 0.30(3) 0.50(5)
5.4pF(5R4) F, G 0.30(3) 0.50(5)
5.5pF(5R5) F, G 0.30(3) 0.50(5)
5.6pF(5R6) F, G 0.30(3) 0.50(5)
5.7pF(5R7) F, G 0.30(3) 0.50(5)
5.8pF(5R8) F, G 0.30(3) 0.50(5)
5.9pF(5R9) F, G 0.30(3) 0.50(5)
6.0pF(6R0) F, G 0.30(3) 0.50(5)
6.1pF(6R1) F, G 0.30(3) 0.50(5)
6.2pF(6R2) F, G 0.30(3) 0.50(5)
6.3pF(6R3) F, G 0.30(3) 0.50(5)
6.4pF(6R4) F, G 0.30(3) 0.50(5)
6.5pF(6R5) F, G 0.30(3) 0.50(5)
6.6pF(6R6) F, G 0.30(3) 0.50(5)
6.7pF(6R7) F, G 0.30(3) 0.50(5)
6.8pF(6R8) F, G 0.30(3) 0.50(5)
6.9pF(6R9) F, G 0.50(5)
7.0pF(7R0) F, G 0.50(5)
7.1pF(7R1) F, G 0.50(5)
7.2pF(7R2) F, G 0.50(5)
7.3pF(7R3) F, G 0.50(5)
7.4pF(7R4) F, G 0.50(5)
7.5pF(7R5) F, G 0.50(5)
7.6pF(7R6) F, G 0.50(5)
7.7pF(7R7) F, G 0.50(5)
7.8pF(7R8) F, G 0.50(5)
7.9pF(7R9) F, G 0.50(5)
8.0pF(8R0) F, G 0.50(5)
8.1pF(8R1) F, G 0.50(5)
8.2pF(8R2) F, G 0.50(5)
8.3pF(8R3) F, G 0.50(5)
8.4pF(8R4) F, G 0.50(5)
8.5pF(8R5) F, G 0.50(5)
8.6pF(8R6) F, G 0.50(5)
Continued on the following page.
42
!Note • This PDF catalog
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this catalog or oursmoking
to prevent productsand/or
in it may be discontinued
burning, etc. without advance notice. Please check with our
[Link]
sales representatives or product
• This catalog engineers
has only before ordering.
typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Continued from the preceding page.
TC C0G C0G
(5C) (5C)
Rated Volt. 25 50
(1E) (1H)
Capacitance, Capacitance Tolerance and T Dimension
8.7pF(8R7) F, G 0.50(5)
8.8pF(8R8) F, G 0.50(5)
8.9pF(8R9) F, G 0.50(5)
9.0pF(9R0) F, G 0.50(5)
9.1pF(9R1) F, G 0.50(5)
9.2pF(9R2) F, G 0.50(5)
9.3pF(9R3) F, G 0.50(5)
9.4pF(9R4) F, G 0.50(5)
9.5pF(9R5) F, G 0.50(5)
9.6pF(9R6) F, G 0.50(5)
9.7pF(9R7) F, G 0.50(5)
9.8pF(9R8) F, G 0.50(5)
9.9pF(9R9) F, G 0.50(5) 8
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
43
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Specifications
No. Item Test Method
Temperature Compensating Type
8 7 Capacitance Within the specified tolerance The capacitance/Q should be measured at 25D at the
frequency and voltage shown in the table.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a 5N* force in parallel
with the test jig for 10T1 sec. The soldering should be done either
with an iron or using the reflow method and should be conducted
with care so that the soldering is uniform and free of defects such
as heat shock. *2N (GJM03)
c
Adhesive Strength
10 No removal of the terminations or other defect should occur.
b
of Termination
Solder resist
Baked electrode or
copper foil
Type a b c
GJM03 0.3 0.9 0.3
GJM15 0.4 1.5 0.5
(in mm)
Fig. 1
44
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Specifications
No. Item Test Method
Temperature Compensating Type
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
Capacitance Within the specified tolerance
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
Vibration
11 uniformly between the approximate limits of 10 and 55Hz.
Resistance
QU400W20C The frequency range, from 10 to 55Hz and return to 10Hz,
Q
C : Nominal Capacitance (pF) should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each of 3 mutually
perpendicular directions (total of 6 hours).
Solder the capacitor to the test jig (glass epoxy boards) shown
No cracking or marking defects should occur. in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
b soldering is uniform and free of defects such as heat shock.
φ4.5
VWZ[§¨«¬©X¥T°±_¥̀\¦U®ª«]YZ STW¤¥̈¢£§¨QRV,
^¯
[¬
20 50 Pressurizing
speed : 1.0mm/sec.
8
40
c
12 Deflection Pressurize
a R230
Y]^ª®¯ Z« Type a
100
b
t : 0.8mm
c Flexure : V1
GJM03 0.3 0.9 0.3
GJM15 0.4 1.5 0.5 Capacitance meter
(in mm) 45 45
(in mm)
Fig. 2
Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
Solderability of 75% of the terminations are to be soldered evenly and rosin (JIS-K-5902) (25% rosin in weight proportion).
13
Termination continuously. Preheat at 80 to 120D for 10 to 30 seconds. After preheating,
immerse in eutectic solder solution for 2T0.5 seconds at 230T5D
or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5°C.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Capacitance Within T2.5% or T0.25pF Preheat the capacitor at 120 to 150D for 1 minute.
Resistance Change (Whichever is larger) Immerse the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu
14 to Soldering
QU400W20C solder solution at 270T5D for 10T0.5 seconds.
Heat Q
C : Nominal Capacitance (pF) Let sit at room temperature for 24T2 hours.
45
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Specifications
No. Item Test Method
Temperature Compensating Type
Table A
(1)
Capacitance Change from 25D Value (%)
Temp. Coeff.
Char. Code Y55D Y30D Y10D
(ppm/D) *1
Max. Min. Max. Min. Max. Min.
5C 0T30 0.58 Y0.24 0.40 Y0.17 0.25 Y0.11
*1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.
(2)
Capacitance Change from 20D Value (%)
Nominal Values
Char. Y55D Y25D Y10D
(ppm/D) *2
Max. Min. Max. Min. Max. Min.
2C 0T60 0.82 Y0.45 0.49 Y0.27 0.33 Y0.18
3C 0T120 0.37 Y0.90 0.82 Y0.54 0.55 Y0.36
4C 0T250 0.56 Y0.88 1.54 Y1.13 1.02 Y0.75
*2 : Nominal values denote the temperature coefficient within a range of 20 to 125D.
46
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■ Capacitance-Temperature Characteristics
20
X5R 50V
-20
C0G
0
P2H -40
R2H
S2H Y5V 50V
T2H -60
U2J
−5
-80
−10 -100
−60 −40 −20 0 20 40 60 80 100 120 -60 -40 -20 0 20 40 60 80 100
Temperature [˚C] Temperature [˚C]
+20 +80
Capacitance Change [%]
C0G 50V
Capacitance Change [%]
0
+60
−20
+40
Z5U 50V
−40
+20 Y5V 50V
X7R 50V
−60 X7R 50V
Z5U 50V 0
C0G 50V
−80
−20
Y5V 50V
0 1 2 3
−100
0 10 20 30 40 50 AC Voltage [Vrms]
DC Voltage [Vdc]
C0G (GRM21)
100
10
1 [pF]
Capacitance Change [%]
0 C0G 10 [pF]
X7R 10
−10 100 [pF]
Y5V, Z5U
−20
Impedance [Ω]
1000 [pF]
−30
1
−40
0 50 100 1000 10000
Time [Hr]
100m
10m
1M 10M 100M 1G
Frequency [Hz]
47
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[∆T=20˚C] [∆T=20˚C]
100 10
GRM55 0.01
µF
GR
GRM M4
3
GRM 2 3
31
GR M21
GR 32
GR M31
GR M21
GR 18
GR
GR M2
GRM
GR
GR 18
GR
21
M
M
M
M
M
31
43
31
GRM GR
1pF 2 M3
GRM 1
G M2
1
1
G
RM 1
18
R
1000pF
31
GR
10 10 1
Allowable Voltage [Vrms]
pF 100pF
M
55
GR
100
M1
8
pF
10pF
0pF
0.01
µF
1pF
1 100m
8 100m 10m
10M 100M 1G 10M 100M 1G
Frequency [Hz] Frequency [Hz]
[∆T=20˚C]
G
100
GR
RM 31 1
G
M4
RM M2
32
3
G
GR
GR M18
M5
GR
M2
5
GR M21
GR M1
1
M3
10
GR
GR
0
1
0p
M3
F
8
1
10
0.01
Allowable Apparent Power [VA]
0p
10
10
F
µF
pF
1pF
100m
10M 100M 1G
Frequency [Hz]
48
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L W
■ Features
1. Better micro wave characteristics
T
2. Suitable for by-passing
3. High density mounting
■ Applications
1. Optical device for telecommunication
2. IC, IC packaging built-in Dimensions (mm)
Part Number
3. Measuring equipment L W T
GMA05X 0.5 ±0.05 0.5 ±0.05 0.35 ±0.05
GMA085 0.8 ±0.05 0.8 ±0.05 0.5 ±0.1
49
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Operating
R7 : Y55 to W125D
1 Temperature Reference Temperature:25D
F5 : Y30 to W85D
Range
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
3 Appearance No defects or abnormality Visual inspection
7 Capacitance Within the specified tolerance The capacitance/D.F. should be measured at reference
temperature at the frequency and voltage shown in the table.
R7 : 0.035 max.
Dissipation Factor Frequency 1T0.1kHz
8 F5 : 0.09 max. (for 16V)
9 (D.F.)
F5 : 0.125 max. (for 10V)
Voltage 1T0.2Vrms
Alumina substrate
51
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GNM1M2/212 GNM214/314
P P
■ Features
1. High density mounting due to mounting space saving
2. Mounting cost saving
T
L W L W
■ Applications
General electronic equipment Dimensions (mm)
Part Number
L W T P
0.6 ±0.1
GNM1M2 1.37 ±0.15 1.0 ±0.15 0.64 ±0.05
0.8 +0/-0.15
GNM212 0.85 ±0.1 1.0 ±0.1
2.0 ±0.15 1.25 ±0.15
GNM214 0.6 ±0.1 0.5 ±0.05
0.8 ±0.1
GNM314 3.2 ±0.15 1.6 ±0.15 0.8 ±0.1
1.0 ±0.1
TC X5R X7R
(R6) (R7)
Rated Volt.
16 10 6.3 50 25 16
(1C) (1A) (0J) (1H) (1E) (1C)
Capacitance, Capacitance Tolerance and T Dimension
1000pF(102) K, M 0.6(2)
2200pF(222) K, M 0.6(2)
4700pF(472) K, M 0.6(2)
10000pF(103) K, M 0.6(2)
22000pF(223) K, M 0.6(2)
Continued on the following page.
52
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Continued from the preceding page.
TC X5R X7R
(R6) (R7)
TC X5R X7R
(R6) (R7)
Rated Volt. 16 10 50 25 16
(1C) (1A) (1H) (1E) (1C)
Capacitance, Capacitance Tolerance and T Dimension
1000pF(102) K, M 0.6(4) 10
2200pF(222) K, M 0.6(4)
4700pF(472) K, M 0.6(4)
10000pF(103) K, M 0.6(4)
22000pF(223) K, M 0.85(4)
47000pF(473) K, M 0.85(4)
0.10µF(104) K, M 0.85(4)
0.47µF(474) K, M 0.85(2)
1.0µF(105) K, M 0.85(2) 0.85(4)
2.2µF(225) K, M 0.85(2)
The part numbering code is shown in each ( ). The (2) code in T (mm) means number of elements (two).
Dimensions are shown in mm and Rated Voltage in Vdc.
Please refer to Specificaion and Test Methods (2) about X5R, 10V products.
TC X7R X5R
(R7) (R6)
53
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Continued from the preceding page.
TC X7R X5R
(R7) (R6)
10
54
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Specifications
No. Item Test Method
Temperature
High Dielectric Type
Compensating Type
Operating
R7 : –55 to +125°C
1 Temperature 5C : –55 to +125°C
R6 : –30 to +85°C
Range
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities Visual inspection
Adhesive Strength
10 Type a b c d
of Termination Solder resist
Copper foil GNM1M2 0.5 1.6 0.32 0.32
Solder resist
Copper foil GNM212 0.4 1.8 0.15 0.5
GNM214 0.6 2.0 0.25 0.25
GNM314 0.8 2.5 0.4 0.4
(in mm)
Fig. 1
55
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Specifications
No. Item Test Method
Temperature
High Dielectric Type
Compensating Type
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10). The
Capacitance Within the specified tolerance
capacitor should be subjected to a simple harmonic motion
30pF min. : QU1000 having a total amplitude of 1.5mm, the frequency being varied
Vibration
11 30pF max. : Char. 25V min. 16V 10V 6.3V uniformly between the approximate limits of 10 and 55Hz. The
Resistance
QU400+20C 0.025 0.035 0.035 0.05 frequency range, from 10 to 55Hz and return to 10Hz, should
Q/D.F. R7, R6
max. max. max. max. be traversed in approximately 1 minute. This motion should be
C : Nominal applied for a period of 2 hours in each 3 mutually perpendicular
Capacitance (pF) directions (total of 6 hours).
No cracking or marking defects should occur. Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder.
#GNMpp4 #GNMpp2 Then apply a force in the direction shown in Fig. 3 for 5T1 sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
40
40
t=0.8mm
Flexure : V1
10 Type a b c d
Capacitance meter
GNM1M2 2.0T0.05 0.5T0.05 0.32T0.05 0.32T0.05 45 45
GNM212 2.0T0.05 0.6T0.05 0.5T0.05 0.5T0.05
GNM214 2.0T0.05 0.7T0.05 0.3T0.05 0.2T0.05
GNM314 2.5T0.05 0.8T0.05 0.4T0.05 0.4T0.05 Fig. 3
(in mm)
Fig. 2
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
Solderability of 75% of the terminations are to be soldered evenly and
13 80 to 120°C for 10 to 30 seconds. After preheating, immerse in
Termination continuously.
eutectic solder solution for 2T0.5 seconds at 230T5°C or
Sn-3.0Ag-0.5Cu solder solution for 2T0.5 seconds at 245T5°C.
Resistance to The measured and observed characteristics should satisfy the
Soldering Heat specifications in the following table.
Appearance No marking defects
Within T2.5%
Capacitance or T0.25pF Preheat the capacitor at 120 to 150°C for 1 minute. Immerse
R7, R6 : Within T7.5% the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu solder
Change (Whichever is
larger) solution at 270T5°C for 10T0.5 seconds. Let sit at room
temperature for 24T2 hours, then measure.
14 30pF min. : QU1000
30pF max. : • Initial measurement for high dielectric constant type
Char. 25V min. 16V 10V 6.3V
QU400+20C Perform a heat treatment at 150+0/-10°C for one hour and
Q/D.F. 0.025 0.035 0.035 0.05
R7, R6 then let sit for 24T2 hours at room temperature.
max. max. max. max.
C : Nominal Perform the initial measurement.
Capacitance (pF)
I.R. More than 10,000MΩ or 500Ω · F (Whichever is smaller)
Dielectric
No failure
Strength
Continued on the following page.
56
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Specifications
No. Item Test Method
Temperature
High Dielectric Type
Compensating Type
Temperature The measured and observed characteristics should satisfy the
Cycle specifications in the following table. Fix the capacitor to the supporting jig in the same manner and
Appearance No marking defects under the same conditions as (10). Perform the five cycles
according to the four heat treatments listed in the following
Within T2.5% table. Let sit for 24T2 hours (temperature compensating type)
Capacitance or T0.25pF or 48T4 hours (high dielectric constant type) at room
R7, R6 : Within T7.5%
Change (Whichever is temperature, then measure.
larger)
Step 1 2 3 4
15 30pF min. : QU1000 Min. Max.
30pF max. : Room Room
Char. 25V min. 16V 10V 6.3V Temp. (°C) Operating Operating
QU400+20C Temp. +0/–3 Temp. Temp. +3/–0 Temp.
Q/D.F. 0.025 0.035 0.035 0.05
R7, R6 Time (min.) 30±3 2 to 3 30±3 2 to 3
max. max. max. max.
C:Nominal
Capacitance (pF) • Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for one hour and
I.R. More than 10,000MΩ or 500Ω · F (Whichever is smaller) then let sit for 24T2 hours at room temperature.
Dielectric Perform the initial measurement.
No failure
Strength
Humidity Steady The measured and observed characteristics should satisfy the
State specifications in the following table.
Appearance No marking defects
Within T5%
Capacitance or T0.5pF
R7, R6 : Within T12.5%
Change (Whichever is
larger)
10
30pF and over : Sit the capacitor at 40T2°C and 90 to 95% humidity for 500T12
QU350 hours.
16 10pF and over, Remove and let sit for 24T2 hours at room temperature, then
30pF and below: Char. 25V min. 16V 10V/6.3V measure.
Q/D.F. QU275+5C/2 0.05 0.05 0.05
R7, R6
10pF and below : max. max. max.
QU200+10C
C : Nominal
Capacitance (pF)
I.R. More than 1,000MΩ or 50Ω · F (Whichever is smaller)
Dielectric
No failure
Strength
The measured and observed characteristics should satisfy the
Humidity Load
specifications in the following table.
Appearance No marking defects
Within T7.5%
Capacitance or T0.75pF
R7, R6 : Within T12.5%
Change (Whichever is
larger) Apply the rated voltage at 40T2°C and 90 to 95% humidity for
500T12 hours.
30pF and over : Remove and let sit for 24T2 hours at room temprature, then
17 QU200 muasure.
30pF and below : Char. 25V min. 16V 10V/6.3V
The charge/discharge current is less than 50mA.
Q/D.F. QU100+10C/3 0.05 0.05 0.05
R7, R6
max. max. max.
C : Nominal
Capacitance (pF)
I.R. More than 500MΩ or 25Ω · F (Whichever is smaller)
Dielectric
No failure
Strength
Continued on the following page.
57
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Specifications
No. Item Test Method
Temperature
High Dielectric Type
Compensating Type
High Temperature The measured and observed characteristics should satisfy the
Load specifications in the following table.
Appearance No marking defects
Capacitance Within T3%
Change or T0.3pF Apply 200% of the rated voltage for 1000T12 hours at the
R7, R6 : Within T12.5%
(Whichever is maximun operating temperature T3°C. Let sit for 24T2 hours at
larger) room temperature, then measure.
The charge/discharge current is less than 50mA.
30pF and over :
18
QU350
• Initial measurement for high dielectric constant type.
10pF and over,
Char. 25V min. 16V 10V/6.3V Apply 200% of the rated DC voltage for one hour at the
30pF and below :
Q/D.F. 0.04 0.05 0.05 maximun operating temperature T3°C. Remove and let sit for
QU275+5C/2 R7, R6
max. max. max. 24T2 hours at room [Link] initial measurement.
10pF and below :
QU200+10C
C : Nominal
Capacitance (pF)
I.R. More than 1,000MΩ or 50Ω · F (Whichever is smaller)
Table A
Capacitance Change from 25D (%)
Nominal Values
Char. Y55D Y30D Y10D
10 (ppm/D) Note 1
Max. Min. Max. Min. Max. Min.
5C 0T30 0.58 Y0.24 0.40 Y0.17 0.25 Y0.11
Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.
58
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Operating
1 R6 : Y55°C to +85°C
Temperature Range
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage,VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities Visual inspection
of Termination
Type a b c d
Solder resist GNM1M2 0.5 1.6 0.32 0.32
Copper foil
GNM212 0.4 1.8 0.15 0.5
Fig. 1 (in mm)
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board) in
the same manner and under the same conditions as (10).
Capacitance Within the specified tolerance
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
11 Vibration uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
D.F. 0.1 max.
should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each 3 mutually
perpendicular directions (total of 6 hours).
59
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No cracking or marking defects shal occur. Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 2 using a eutectic solder. Then apply a force in the
,Q¢
direction shown in Fig. 3. The soldering should be done either
with an iron or using the reflow method and should be
conducted with care so that the soldering is uniform and free of
20
defects such as heat shock.
50 Pressurizing
speed : 1.0mm/sec.
Pressurize
40
R230
Thickness : 0.8mm
12 Deflection 100
Flexure : V1 5.0
a
b
Capacitance meter
45 45 c 1.0
d
Fig. 3
Type a b c d
GNM1M2 2.0T0.5 0.5T0.05 0.32T0.05 0.32T0.05
GNM212 2.0T0.05 0.6T0.05 0.5T0.05 0.5T0.05
(in mm)
Fig. 2
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
Solderability of 75% of the terminations are to be soldered evenly
13 80 to 120°C for 10 to 30 seconds. After preheating, immerse in
Termination and continuously.
eutectic solder solution for 2T0.5 seconds at 230T5°C or
Sn-3.0Ag-0.5Cu solder solution for 2T0.5 seconds at 245T5°C.
10 Appearance No marking defects
Preheat the capacitor at 120 to 150°C for 1 minute. Immerse
Capacitance the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu solder
R6: Within T7.5%
Change solution at 270T5°C for 10T0.5 seconds.
Resistance
Let sit at room temperature for 24T2 hours, then measure.
14 to Soldering D.F. 0.1 max.
• Initial measurement
Heat
I.R. 50Ω · F min. Perform a heat treatment at 150 +0/-10°C for one hour and
then let sit for 24T2 hours at room temperature. Perform
Dielectric
No failure the initial measurement.
Strength
Appearance No marking defects Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10).
Capacitance
R6: Within T12.5% Perform the five cycles according to the four heat treatments
Change
listed in the following table.
D.F. 0.1 max. Let sit for 24T2 hours at room temperature, then measure.
I.R. 50Ω · F min. Step 1 2 3 4
Temperature
15 Min. Operating Room Max. Operating Room
Cycle Temp. (D)
Temp. Temp. Temp. Temp.
Time (min.) 30T3 2 to 3 30T3 2 to 3
Dielectric
No failure • Initial measurement
Strength
Perform a heat treatment at 150 +0/-10 °C for one hour and
then let sit for 24T2 hours at room temperature.
Perform the initial measurement.
Appearance No marking defects Apply the rated voltage at 40T2°C and 90 to 95% humidity for
500T12 hours. The charge/discharge currentis less than 50mA.
Capacitance
High R6: Within T12.5% • Initial measurement
Change
Temperature Perform a heat treatment at 150 +0/-10°C for one hour
High D.F. 0.2 max. and then let sit for 24T2 hours at room temperature.
16
Humidity I.R. 12.5Ω · F min. Perform the initial measurement.
(Steady) • Measurement after test
Perform a heat treatment at 150 +0/-10°C for one hour
Dielectric
No failure and then let sit for 24T2 hours at room temperature, then
Strength
measure.
Appearance No marking defects Apply 125% of the rated voltage for 1000T12 hours at the
maximum operating temperature T3°C. Let sit for 24T2 hours
Capacitance
R6: Within T12.5% at room temperature, then measure.
Change
The charge/discharge current is less than 50mA.
D.F. 0.2 max. • Initial measurement
I.R. 25Ω · F min. Perform a heat treatment at 150 +0/-10°C for one hour
17 Durability
and then let sit for 24T2 hours at room temperature.
Perform the initial measurement.
• Measurement after test
Dielectric
No failure Perform a heat treatment at 150 +0/-10°C for one hour
Strength
and then let sit for 24T2 hours at room temperature, then
measure.
60
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e g e
■ Features
1. Proper to compensate for ultrasonic sensor
2. Small chip size and high cap. value
T
■ Applications
Ultrasonic sensor L W
11
61
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Operating
1 Y25 to W85D Reference Temperature: 20°C
Temperature
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated volt-
age range.
3 Appearance No defects or abnormalities Visual inspection
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig.1 using a eutectic solder. Then apply 10N force in the
direction of the arrow.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
c
Adhesive Strength
10 No removal of the terminations or other defect should occur.
of Termination
b
Solder resist
Baked electrode or
copper foil
Type a b c
GRM21 1.2 4.0 1.65
(in mm)
Fig. 1
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
Capacitance Within the specified tolerance
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
Vibration
11 uniformly between the approximate limits of 10 and 55Hz. The
Resistance
frequency range, from 10 to 55Hz and return to 10Hz, should
D.F. 0.01 max.
be traversed in approximately 1 minute. This motion should be
applied for a period of 2 hours in each of 3 mutually perpendic-
ular directions (total of 6 hours).
62
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Solder the capacitor to the test jig (glass epoxy boards) shown
No cracking or marking defects should occur. in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
b
VWZ[§¨«¬©X¥T°±_¥̀\¦U®ª«]YZ STW¤¥̈¢Q,£§¨RV
^¯
[¬ φ4.5
20 50 Pressurizing
speed : 1.0mm/sec.
40
12 Deflection c Pressurize
R230
a
t : 1.6mm
13
Solderability of
Termination
Y]^ª®¯ Z« Type
GRM21
continuously.
a
1.2
100
Fig. 2
Fig.3
45
Flexure : V1
High Capacitance Apply 200% of the rated voltage for 1,000T12 hours at 85T3D.
Within T12.5%
18 Temperature Change Let sit for 24T2 hours at room temperature, then measure.
Load D.F. 0.02 max. The charge/discharge current is less than 50mA.
63
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T
1. Low ESL, good for noise reduction for high
frequency
2. Small, high cap
3300pF 0.5
(332) (5)
64
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Continued from the preceding page.
4.7µF 1.15
(475) (M)
10µF 1.25
(106) (B)
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L W
T
■ Features (Eight Terminals Low ESL Type)
1. Low ESL (100pH) , suitable to decoupling capacitor q w e r Equivalent Circuit
q e t u
for 1GHz clock speed IC. P
2. Small, large cap
i u y t w r y i
12
67
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L W
T
1. Low ESL (45pH), suitable to decoupling capacitor Equivalent Circuit
q w e r
for 2GHz clock speed IC. q e t u o
!0 P t
2. Small, large cap
o i u y w r y i !0
■ APPLICATIONS
Dimensions (mm)
1. High speed micro processor Part Number
L W T P
2. High frequency digital equipment LLM215 2.0 ±0.1 1.25 ±0.1 0.5 +0.05/-0.1 0.5 ±0.05
LLM219 2.0 ±0.1 1.25 ±0.1 0.85 ±0.1 0.5 ±0.05
LLM315 3.2 ±0.15 1.6 ±0.15 0.5 +0.05/-0.1 0.8 ±0.1
LLM31M 3.2 ±0.15 1.6 ±0.15 1.15±0.1 0.8 ±0.1
Rated Volt.
25 16 6.3 4 16 10 6.3
(1E) (1C) (0J) (0G) (1C) (1A) (0J)
Capacitance (Capacitance part numbering code) and T (mm) Dimension (T Dimension part numbering code)
10000pF(103) 0.5(5)
15000pF(153) 0.5(5)
22000pF(223) 0.5(5)
33000pF(333) 0.5(5)
47000pF(473) 0.5(5)
68000pF(683) 0.5(5)
0.10µF(104) 0.5(5) 0.5(5)
0.15µF(154) 0.5(5) 0.5(5)
Continued on the following page.
68
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Continued from the preceding page.
12
69
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Operating
R6 : Y55 to W85°C
1 Temperature
R7, C7 : Y55 to W125°C
Range
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities Visual inspection
Dielectric let sit for 48T4 hours at room temperature. Perform the initial
No failure
Strength measurement.
Continued on the following page.
70
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Appearance No marking defects Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10).
Capacitance
Within T7.5% *1 Perform the five cycles according to the four heat treatments
Change
listed in the following table. Let sit for 48T4 hours at room
W.V.: 25V min.; 0.025 max. temperature, then measure.
D.F.
W.V.: 16V max.; 0.035 max. *1 Step 1 2 3 4
Temperature Min. Operating Room Max. Operating Room
14 I.R. More than 10,000MΩ or 500Ω · F (Whichever is smaller) Temp. (°C) Temp. +0
Cycle –3 Temp.
+3
Temp. –0 Temp.
Time (min.) 30T3 2 to 3 30T3 2 to 3
Dielectric • Initial measurement.
No failure
Strength Perform a heat treatment at 150 +0
–10 °C for one hour and then
let sit for 48T4 hours at room temperature. Perform the initial
measurement.
Appearance No marking defects
Humidity Capacitance Sit the capacitor at 40T2°C and 90 to 95% humidity for 500T12
Within T12.5% *1
15 (Steady Change hours. Remove and let sit for 48T4 hours at room temperature,
State) D.F. 0.05 max. *1 then measure.
71
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e g e
■ Features
1. HiQ and low ESR at VHF, UHF, Microwave
2. Feature improvement, low power consumption for
mobile telecommunication. (Base station, terminal,
etc.)
T
L W
■ Applicatons
High frequency circuit (Mobile telecommunication, etc.) Dimensions (mm)
Part Number
L W T e g min.
GQM188 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5 0.5
GQM219 2.0 ±0.1 1.25 ±0.1 0.85 ±0.1 0.2 to 0.7 0.7
TC C0G C0G
(5C) (5C)
TC C0G C0G
(5C) (5C)
GQM18
10000
100
Resonant Frequency (GHz)
GQM21
Q
100
1
GQM18
10
0
0.1 1 10 100
1 Capacitance (pF)
100M 1G 10G
Frequency (Hz)
73
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13 4 125T3
5 Reference Temp. T2
No removal of the terminations or other defect should occur. Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply 10N* force in parallel
with the test jig for 10T1 sec.
The soldering should be done either with an iron or using the
c reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Adhesive Strength *5N (GQM188)
10
of Termination
Type a b c
b
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
Capacitance Within the specified tolerance
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
Vibration
11 30pF min. : QU1400 uniformly between the approximate limits of 10 and 55Hz. The
Resistance
30pF max. : QU800W20C frequency range, from 10 to 55Hz and return to 10Hz, should
Q
be traversed in approximately 1 minute.
C : Nominal Capacitance (pF) This motion should be applied for a period of 2 hours in each of
3 mutually perpendicular directions (total of 6 hours).
74
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Solder the capacitor on the test jig (glass epoxy board) shown
No crack or marked defect should occur. in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done either with an iron or using the
b reflow method and should be conducted with care so that the
φ4.5
VWZ[§¨«¬©X¥T°±_¥̀\¦U®ª«]YZ STW¤¥̈¢Q,£§¨RV
^¯
[¬ soldering is uniform and free of defects such as heat shock.
40
c
20 50 Pressurizing
speed : 1.0mm/sec.
a Pressurize
12 Deflection
13
Solderability of
Termination
Y]^ª®¯ Z« Type
GQM18
GQM21
a
1.0
1.2
100
Fig. 2
c
1.2
1.65
(in mm)
R230
Capacitance meter
45
Fig. 3
45
Flexure : V1
Dielectric
No failure
Strength
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Capacitance Within T5% or T0.5pF
Change (Whichever is larger)
Let the capacitor sit at 40T2D and 90 to 95% humidity for
Humidity 30pF min. : QU350 500T12 hours.
16 Steady 10pF and over, 30pF and below : QU275+5C/2 Remove and let sit for 24T2 hours (temperature compensating
State Q 10pF max. : QU200W10C type) at room temperature, then measure.
75
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Table A
(1)
Capacitance Change from 25D (%)
Nominal Values
Char. Y55D Y30D Y10D
(ppm/D) *1
13 Max. Min. Max. Min. Max. Min.
5C 0T30 0.58 Y0.24 0.40 Y0.17 0.25 Y0.11
*1 : Nominal values denote the temperature coefficient within a range of 25 to 125D.
76
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SMD Type
e g e
T
2. Nickel barriered terminations of ERB series improve L W
77
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Continued from the preceding page.
14 220pF(221) 1.50(Q)
240pF(241) 1.50(Q)
270pF(271) 1.50(Q)
300pF(301) 1.50(Q)
330pF(331) 1.50(Q)
360pF(361) 1.50(Q)
390pF(391) 1.50(Q)
430pF(431) 1.50(Q)
470pF(471) 1.50(Q)
510pF(511) 1.50(Q)
560pF(561) 1.50(Q)
620pF(621) 1.50(Q)
680pF(681) 1.50(Q)
750pF(751) 1.50(Q)
820pF(821) 1.50(Q)
910pF(911) 1.50(Q)
1000pF(102) 1.50(Q)
The part numbering code is shown in ( ).
Dimensions are shown in mm and Rated Voltage in Vdc.
78
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Operating
1 Y55 to W125D Reference Temperature: 25°C
Temperature Range
The rated voltage is defined as the maximum voltage which
may be applied continuously to the capacitor.
2 Rated Voltage See the previous pages. When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities Visual inspection
No removal of the terminations or other defects should occur. Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 1 using an eutectic solder.
14
c
Then apply 10N* force in parallel with the test jig for 10±1sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Adhesive Strength
10
b
of Termination Type a b c
ERB18 1.0 3.0 1.2
Solder Resist
ERB21 1.2 4.0 1.65
Baked Electrode or
ERB32 2.2 5.0 2.9
Fig.1 Copper Foil
(in mm)
*5N (ERB188)
79
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Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (10).
Capacitance Within the specified tolerance
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
Vibration Satisfies the initial value.
11 uniformly between the approximate limits of 10 and 55Hz.
Resistance 220pFFCV1,220pF : QU10,000
The frequency range, from 10 to 55Hz and return to 10Hz,
Q 220pFFCV1,470pF : QU15,000
should be traversed in approximately 1 minute. This motion
470pFFCV1,000pF : QU13,000
should be applied for a period of 2 hours in each 3 mutually
C : Nominal Capacitance (pF)
perpendicular directions (total of 6 hours).
No crack or marked defect should occur. Solder the capacitor on the test jig (glass epoxy board) shown
20
in Fig. 2a using an eutectic solder. Then apply a force in the
50 Pressurizing
speed : 1.0mm/sec. direction shown in Fig. 3a. The soldering should be done either
Pressurize
±¬¨©_¥̀[\WXT
°®ª«¦]YZU ¢£¤§¨QRSVW, b with an iron or using the reflow method and should be conduct-
ø4.5
R230 ed with care so that the soldering is uniform and free of defects
such as heat shock.
12 Deflection
40
c Type a b c
Flexure : V1
ERB18 1.0 3.0 1.2
a
Capacitance meter ERB21 1.2 4.0 1.65
13
Solderability of
Termination
®¯]^
45 45
Fig.3a
Fig. 2a
t : 1.6mm
ERB32
Item Specifications
Appearance No marked defect solder solution at 270±5D for 10±0.5 seconds. Let sit at room
Capacitance Within T2.5% or T0.25pF temperature for 24±2 hours.
Resistance
14 Change (Whichever is larger) Chip Size Preheat Condition
to Soldering Heat
220pFFCV1,220pF : QU10,000 2.0Z1.25mm max. 1minute at 120 to 150D
Q 220pFFCV1,470pF : QU15,000
3.2Z2.5mm Each 1 minute at 100 to 120D and then 170 to 200D
470pFFCV1,000pF : QU13,000
Dielectric Strength No failure
C : Nominal Capacitance (pF)
40
16 Humidity Change (Whichever is larger) 35
10pFVCU30pF : QU350 30
25
Q 10pFVCF30pF : QU275W 5 2 C +10
20 -2 D
10pFVCF10pF : QU200W10C 15
I.R. 1,000MΩ min. 10 Initial measurement
5
C : Nominal Capacitance (pF) 0 Applied voltage 50Vdc
-5
-10
One cycle 24 hours
0 1 2 3 4 5 6 7 8 9 10 1112 13 14 15 16 17 18 19 2021 22 23 24
Hours
80
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Table A-6
Capacitance Change from 25D (%)
Nominal Values
Char. Y55 Y30 Y10
(ppm/D) Note 1
Max. Min. Max. Min. Max. Min.
5C 0T30 0.58 Y0.24 0.40 Y0.17 0.25 Y0.11
Note 1 : Nominal values denote the temperature coefficient within a range of 25 to 125D (for 5C)
14
81
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10k
10000
PARALLEL
RESONANCE
1k
1000
100
1pF
Impedance (Ohm)
100 10
Q
10pF
1
10 100pF 1pF
100m 10pF
100pF
1
10m
measured by
BOONTON RESONANT
COAXIAL-LINE 34A
0.1 1m
100M 1G 10G 1M 10M 100M 1G 10G
Frequency (Hz) Frequency (Hz)
1pF 10G
10pF
ESR (Ohm)
100pF
0.1
ERB21
1G
ERB32
measured by
BOONTON RESONANT
COAXIAL-LINE 34A
14 0.01
100M 1G 10G
100M
0.1 1 10 100 1000
Capacitance (pF)
Frequency (Hz)
[∆T=20˚C] [∆T=20˚C]
100 10
p F ERB32
00
10
ER ERB21
10 ER B2 1
B3 1
2
Va (Vrms)
Ia (Arms)
F
0p
10
1 100m
100pF
1000pF
0.1 10m
10M 100M 1G 10G 10M 100M 1G 10G
Frequency (Hz) Frequency (Hz)
82
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[∆T=20˚C] [∆T=20˚C]
100 1
pF
ER
00
B3
10
2
ER
2
B2
B3
1
10 100m
ER
pF
Pa (VA)
Pe (W)
1
0
10
B2
ER
pF
00
10
1 10m
F
0p
10
0.1 1m
10M 100M 1G 10G 10M 100M 1G 10G
Frequency (Hz) Frequency (Hz)
14
83
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Package
Packaging Code
Bulk Packaging
Packaging Type Tape Carrier Packaging Bulk Case Packaging
Bulk Packaging in a Bag Bulk Packaging in a Tray
Packaging Code D, L, K, J C B T
84
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Package
Continued from the preceding page.
2.5±0.5
2.0±0.5
2.0±0.5
φ13.0±0.5 φ13.0±0.5
178±2.0
50 min.
φ50 min.
φ328±2.0
φ21.0±0.8
φ21.0±0.8
(in mm)
8mm width 4mm pitch Tape 8mm width 2mm pitch Tape
0.4 max.
(GRM02)
0.5 max.
4.0±0.1 (GRM03/GJM03)
4.0±0.1
0.8 max.
+0.1 1.1 max. 2.0±0.05 +0.1 2.0±0.1 1.75±0.1
4.0±0.1 φ1.5 - 0 2.0±0.1
1.75±0.1 φ1.5 -0 (GRM15/GJM15)
3.5±0.05
3.5±0.05
8.0±0.3
8.0±0.3
A
A
B
B
14
Direction of Feed Direction of Feed
GJM15
GRM21 GRM15 0.65 1.15
(TV0.85mm)
GQM21 1.55±0.15 2.3±0.15
GNM21 *Nominal Value
GRM31
(TV0.85mm)
GNM31 2.0±0.2 3.6±0.2
(TV0.8mm)
(in mm)
GRM32
(TV0.85mm) 2.8±0.2 3.6±0.2
85
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Package
Continued from the preceding page.
8mm width 4mm pitch Tape 12mm width 8mm pitch Tape
0.2±0.1 (LLp)
4.0±0.1 0.25±0.1 (TV2.0mm) +0.1
φ1.5 -0
+0.1 0.3±0.1 (T=2.5mm) 8.0±0.1 2.0±0.1 0.3±0.1
4.0±0.1 φ1.5 -0 2.0±0.1
1.75±0.1 1.75±0.1
4.0±0.1
5.5±0.1
12.0±0.3
3.5±0.05
8.0±0.3
A A
B
B
86
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Package
Continued from the preceding page.
12.0
8.8
6.8
Murata for details.
1.5
2.0
3.0
31.5
36.0
110
(in mm)
14
87
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!Caution
■ Handling
1. Inspection 3. Reel and bulk case
Thrusting force of the test probe can flex the PCB, In the handling of reel and case, please be careful
resulting in cracked chips or open solder joints. and do not drop it.
Provide support pins on the back side of the PCB to Do not use chips from a case which has been dropped.
prevent warping or flexing.
2. Board Separation (or depanalization) FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
(1) Board flexing at the time of separation causes RESULT, WORST CASE, IN A SHORT CIRCUIT
cracked chips or broken solder. AND FUMING WHEN THE PRODUCTS IS USED.
(2) Severity of stresses imposed on the chip at the
time of board break is in the order of:
Pushback<Slitter<V Slot<Perforator.
(3) Board separation must be performed using special
jigs, not with hands.
14
88
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!Caution
D
A
Slit
89
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!Caution
Continued from the preceding page.
4. Reflow Soldering
Sudden heating of the chip results in distortion due to
[Standard Conditions for Reflow Soldering]
,,,
excessive expansion and construction forces within the
chip causing cracked chips. So when preheating, keep Infrared Reflow
temperature differential, ∆T, within the range shown in Temperature (D)
,,,
Soldering
Table 1. The smaller the ∆T, the less stress on the chip. Peak Temperature
Gradual
Solderability of Tin plating termination chip might be 200°C Cooling
,,,
deteriorated when low temperature soldering profile ∆T
170°C
where peak solder temperature is below the Tin melting 150°C
point is used. Please confirm the solderability of Tin 130°C
Preheating
plating termination chip before use.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference Time
(∆T) between the component and solvent within the 60-120 seconds 30-60 seconds
,,,
range shown in the above table.
Vapor Reflow
Table 1
,,,
Temperature (D)
Soldering
Part Number Temperature Differential Peak Temperature
Gradual
GRM02/03/15/18/21/31 Cooling
,,,
GJM03/15 ∆T
170°C
LLL18/21/31 ∆TV190D
150°C
ERB18/21 130°C
Preheating
GQM18/21
GRM32/43/55
LLA18/21/31 Time
LLM21/31 ∆TV130D 60-120 seconds 20 seconds max.
,,,
GNM
ERB32 [Allowable Soldering Temperature and Time]
,,,
Soldering Temperature (D)
Recommended Conditions
270
Pb-Sn Solder
,,,
Lead Free Solder 260
14 Infrared Reflow Vapor Reflow
250
Peak Temperature 230-250°C 230-240°C 240-260°C
240
Atmosphere Air Air Air or N2
230
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu 0 30 60 90
Soldering Time (sec.)
90
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!Caution
Continued from the preceding page.
,,,
6. Flow Soldering
Sudden heating of the chip results in thermal distortion
[Standard Conditions for Flow Soldering]
,,,
causing cracked chips. And an excessively long soldering
Temperature (D)
time or high soldering temperature results in leaching of Soldering
Peak Temperature
the outer electrodes, causing poor adhesion or a Gradual
,,,
Cooling
reduction in capacitance value due to loss of contact
∆T
between electrodes and end termination. 170°C
When preheating, keep the temperature differential 150°C
between solder temperature and chip surface 130°C
Preheating
temperature, ∆T, within the range shown in Table 2. The
smaller the ∆T, the less stress on the chip.
When components are immersed in solvent after Time
60-120 seconds 5 seconds max.
mounting, be sure to maintain the temperature difference
between the component and solvent within the range [Allowable Soldering Temperature and Time]
,,,
shown in Table 2.
,,,
260
Table 2
250
Part Number Temperature Differential
240
GRM18/21/31
230
LLL21/31
∆TV150D
ERB18/21 0 10 20 30
Soldering Time (sec.)
GQM18/21
Up to Chip Thickness
Adhesive
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!Caution
Continued from the preceding page.
ERB18/21
GRM32/43/55
GNM 270°C max.
LLA18/21/31 ∆TV130D 3 seconds max. Air
LLM21/31 / termination
ERB32
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
14
(2) For Microstrip Types
Solder 1mm away from the ribbon terminal base, being
careful that the solder tip does not directly contact the
capacitor. Preheating is unnecessary.
Complete soldering within 3 seconds with a soldering tip
less than 270°C in temperature.
8. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
92
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Notice
■ Rating
Die Bonding/Wire Bonding (GMA Series) 2. Wire Bonding
1. Die Bonding of Capacitors •Wire
•Use the following materials Braze alloy: Gold wire:
Au-Sn (80/20) 300 to 320 degree C in N2 atmosphere 20 micro m (0.0008 inch), 25 micro m (0.001 inch)
•Mounting diameter
(1) Control the temperature of the substrate so •Bonding
that it matches the temperature of the braze (1) Thermocompression, ultrasonic ball bonding.
alloy. (2) Required stage temperature : 200 to 250 degree C
(2) Place braze alloy on substrate and place the (3) Required wedge or capillary weight : 0.5N to 2N.
capacitor on the alloy. Hold the capacitor and (4) Bond the capacitor and base substrate or other
gently apply the load. Be sure to complete the devices with gold wire.
operation in 1 minute.
14
93
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Notice
Pattern Forms
Placing of Chip Components Placing of Leaded Components
Placing Close to Chassis Lateral Mounting
and Leaded Components after Chip Component
Electrode Pattern
Solder Resist
Solder Solder Resist Solder Resist
Resist
Correct
14
94
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Notice
Continued from the preceding page.
b a
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Notice
Continued from the preceding page.
b b
c
p Land Land
c p
f
d
2. Adhesive Application
Thin or insufficient adhesive causes chips to loosen or
become disconnected when flow soldered. The amount a : 20 to 70µm
of adhesive must be more than dimension c shown in the Chip Capacitor b : 30 to 35µm
c : 50 to 105µm
drawing below to obtain enough bonding strength. a
The chip's electrode thickness and land thickness must c
be taken into consideration. Adhesive b
Low viscosity adhesive causes chips to slip after Board Land
*Nominal Value
Continued on the following page.
96
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Notice
Continued from the preceding page.
3. Adhesive Curing
Insufficient curing of the adhesive causes chips to
disconnect during flow soldering and causes deteriorated
insulation resistance between outer electrodes due to
moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
4. Flux Application
An excessive amount of flux generates a large quantity of cleaned. Use flux with a halide content of 0.2wt% max.
flux gas, causing deteriorated solderability. So apply flux But do not use strong acidic flux.
thinly and evenly throughout. (A foaming system is Wash thoroughly because water soluble flux causes
generally used for flow soldering). deteriorated insulation resistance between outer
Flux containing too high a percentage of halide may electrodes unless sufficiently cleaned.
cause corrosion of the outer electrodes unless sufficiently
5. Flow Soldering
Set temperature and time to ensure that leaching of the
[As a Single Chip]
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D A
shown below) and 25% of the length A-B shown below as B
mounted on substrate. D
Outer Electrode
C
■ Others
1. Resin Coating The above notices are for standard applications and
When selecting resin materials, select those with conditions. Contact us when the products are used
low contraction. in special mounting conditions. Select optimum
2. Circuit Design conditions for operation as they determine the
These capacitors on this catalog are not safety reliability of the product after assembly.
recognized products The data here in are given in typical values, not
3. Remarks guaranteed ratings.
97
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Reference Data
1. Solderability
(1) Test Method (2) Test Samples
Subject the chip capacitor to the following conditions. GRM21 : Products for flow/reflow soldering.
Then apply flux (a ethanol solution of 25% rosin) to the (3) Acceptance Criteria
chip and dip it in 230D eutectic solder for 2 seconds. With a 60-power optical microscope, measure the surface
Conditions : area of the outer electrode that is covered with solder.
Expose prepared at room temperature (for 6 months and (4) Results
12 months, respectively) Refer to Table 1.
Prepared at high temperature (for 100 hours at 85D)
Prepared left at high humidity (for 100 hours under
90%RH to 95%RH at 40D)
Table 1
Prepared at Room Temperature Prepared at High Prepared at High Humidity
Sample Initial State Temperature for for 100 Hours at 90 to
6 months 12 months 100 Hours at 85D 95% RH and 40D
Capacitor 20 50 Pressurizing
Speed : 1.0mm/sec.
Pressurize
R230 Note : The material of pressure application jig and
Supporting support is the quenched metal.
45 45 Base (hardness HB 183-255 or superhardness
Flexure HRA90 or more)
14
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1.65
1.0
1.2
40
Fillet up to Chip
W
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Thickness
4.0 1.6
100
Material : Glass Epoxy
: Copper Foil (0.35mm thick)
: Solder Resist
(in mm)
Table 2
1 Characteristics Change in Capacitance
5C Within T5% or T0.5pF, whichever is greater
R7 Within T12.5%
F5 Within T20%
Continued on the following page.
98
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Reference Data
Continued from the preceding page.
(4) Results
±°`_\±°®¯¬ª«§¦`_]^[YZVU
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,¢Q,
GRM21 5C (T=0.6) GRM21 R7 (T=0.6)
100 100
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20 20
0 0
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Flexure (mm) Flexure (mm)
GRM21 F5 (T=0.6)
100
Survival Rate (%)
80
Fillet up to Chip
60 Thickness
R
S
T
W
X
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20
0
0 2 4 6 8
Flexure (mm)
w Material
1.3T
0.7T
e
T
Alumina Ag/Pd=72/28
Substrate Thickness : 10 to 12µm
1.5 1.2 1.5 Glass Epoxy
Substrate
Cu
(in mm) Thickness : 35µm
Paper Phenol
Substrate
99
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Reference Data
Continued from the preceding page.
Table 3
Characteristics Change in Capacitance
5C Within T2.5% or T0.25pF, whichever is greater
R7 Within T7.5%
F5 Within T20%
(4) Results
Accumulated Per-
Accumulated Per-
80 80 80
60 60 e 60 e
40 40 40
20 20 20 w
e w
0 qw 0 q 0 q
0 50 100 150 200 0 50 100 150 200 0 50 100 150 200
Number of Cycles Number of Cycles Number of Cycles
Accumulated Per-
Accumulated Per-
80 80 80
60 60 60
40 40 40
20 20 e 20 e
e
0 qw 0 qw 0 qw
0 50 100 150 200 0 50 100 150 200 0 50 100 150 200
Number of Cycles Number of Cycles Number of Cycles
Accumulated Per-
Accumulated Per-
80 80 80
60 60 60
40 40 40
20 20 20
e e
0 qwe 0 qw 0 qw
0 50 100 150 200 0 50 100 150 200 0 50 100 150 200
Number of Cycles Number of Cycles Number of Cycles
100
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Reference Data
Continued from the preceding page.
20 50 Pressurizing
Capacitor
Speed : 1.0mm/sec.
Pressurize
Note : Material of the pressurizing jig and
R230
the supporting base must be hardened steel
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Supporting (Hardness : HB183 to 255 or carbide Hardness
45 45 Base : HRA90 min.)
Flexure
1.65
Capacitance Meter
1.0
1.2
,
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Solder Amount
Up to Chip
Thickness
4.0 1.6
100
Table 4
Characteristics Change in Capacitance
5C Within T5% or T0.5pF, whichever is greater
Within T12.5%
R7
14
F5 Within T20%
(4) Results
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100 100
Paper Phenol Paper Phenol
80
Survival Rate (%)
Survival Rate (%)
80
T
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Glass Epoxy
40 40
Glass Epoxy
20 20
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0 2 4 6 8 0 2 4 6 8
Flexure (mm) Flexure (mm)
GRM21 F5 (T=0.6)
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100
Paper Phenol
Survival Rate (%)
80
60
40
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101
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Reference Data
Continued from the preceding page.
5. Break Strength
(1) Test Method
Place the chip on a steel plate as illustrated on the right. Storage
P Pressurizing Loading Jig End
Amplifier speed : 2.5mm/sec. φ1.0mm
Increase load applied to a point near the center of the scope
Load cell
test sample.
±`®°̄ª«]^_YZ
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(2) Test Samples Sample
GRM21 5C/R7/F5 Characteristics Steel plate P0.5mm
GRM31 5C/R7/F5 Characteristics
T
S
X
W
\
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¤
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¨
(3) Acceptance Criteria
Define the load that has caused the chip to break or
crack, as the bending force. W γ
Chip Size L W 5C R7 F5
T Charac- Charac- Charac-
(4) Explanation teristics teristics teristics
Break strength, P, is proportionate to the square of the L GRM21 1.5 1.2
300 180 160
thickness of the ceramic element and is expressed as a GRM31 2.7 1.5
curve of secondary degree. (in mm)
The formula is :
2γ WT2
P= (N)
3L
W : Width of ceramic element (mm)
T : Thickness of element (mm)
L : Distance between fulcrums (mm)
γ : Bending stress (N/mm2)
(5) Results
GRM21 GRM31
140 140
R7
Bending-break Strength (N)
5C F5 5C
120 120
14 100 100
R7 F5
80 80
60 60
40 40
20 20
0 0
0 0.4 0.8 1.2 1.6 0 0.4 0.8 1.2 1.6
Thickness of Ceramic Element (mm) Thickness of Ceramic Element (mm)
6. Thermal Shock
Temperature
Solder
¢Q,£¦RU
the chip in a solder bath (6Z4 eutectic solder) in Chip Capacitor Temperature
102
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Reference Data
Continued from the preceding page.
(4) Results
100
60
F5
40
20 R7
5C
0
200 240 280 320 360
Temperature Differential ∆T (D)
(4) Results
280 280
270 270
260 260
250 250
240 240
230 230
220 220
210 210
0 60 120 180 240 0 10 20 30 40 50 60
Dip Soldering
Soldering Temperature (D)
280
270
260
250
240
230
220
210
0 10 20 30 40 50 60
103
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Reference Data
Continued from the preceding page.
(4) Results
80 80
60 60
40 40
20 20
0 0
200 240 280 320 360 200 240 280 320 360
Soldering Iron Tip Temperature (D) Soldering Iron Tip Temperature (D)
GRM21 F5 (T=0.6)
100
Incidence of Cracks (%)
14 80
60
40
20
0
200 240 280 320 360
Soldering Iron Tip Temperature (D)
104
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■ Features
1. Murata's original internal electrode structure
realizes high flash-over voltage.
T
2. A new monolithic structure for small, surface- L W
■ Applications
1. Ideal for use on high frequency pulse circuits such
as snubber circuits for switching power supplies,
DC-DC converters, ballasts (inverter fluorescent
lamps), etc.
2. Ideal for use as the ballast in liquid crystal back
lighting inverters.
3. Please contact our sales representatives or
engineers before using our products for other
applications not specified above.
SL/U2J Characteristics
105
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Continued from the preceding page.
106
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15
107
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in it may be discontinued
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Operating
1 Y55 to W125D
Temperature Range
2 Appearance No defects or abnormalities Visual inspection
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 1 using a eutectic solder.
Then apply 10N force in the direction of the arrow.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
Adhesive Strength soldering is uniform and free of defects such as heat shock.
9 No removal of the terminations or other defect should occur.
of Termination
15 10N, 10T1s
Speed : 1.0mm/s
Glass Epoxy Board
Fig. 1
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified tolerance
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each 3 mutually perpendicular directions
Vibration (total of 6 hrs.).
10
Resistance
C0G/U2J char. : 1,000 min.
Q
SL char. : 400W20C*1 min.
Solder resist
Cu
Glass Epoxy Board
108
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No cracking or marking defects should occur. Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder.
b
φ4.5 Then apply a force in the direction shown in Fig. 3.
VZ[§«¬TX¥©°±¨_¥̀\W®«ª¦]ZYU STW¤¥̈¢Q,§¨£VR
^¯
[¬ d
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
40
c soldering is uniform and free of defects such as heat shock.
a 20 50 Pressurizing
t : 1.6 speed : 1.0mm/s
Y]^ª®¯ Z«
11 Deflection 100
Pressurize
R230
LZW Dimension (mm)
(mm) a b c d
Flexure=1
2.0Z1.25 1.2 4.0 1.65
3.2Z1.6 2.2 5.0 2.0 Capacitance meter
1.0
3.2Z2.5 2.2 5.0 2.9 45 45 (in mm)
4.5Z2.0 3.5 7.0 2.4
Fig. 3
Fig. 2
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in
Solderability of 75% of the terminations are to be soldered evenly solder solution for 2T0.5 sec.
12
Termination and continuously. Immersing speed : 25T2.5mm/s
Temp. of solder : 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects Preheat the capacitor at 120 to 150D* for 1 min.
Capacitance Immerse the capacitor in solder solution at 260T5D for 10T1 sec.
Within T2.5% Let sit at *1room condition for 24T2 hrs., then measure.
Change
#Immersing speed : 25T2.5mm/s
Resistance C0G/U2J char. : 1,000 min.
13 to Soldering Q
SL char. : 400W20C*2 min. *Preheating for more than 3.2Z2.5mm
Heat
I.R. More than 10,000MΩ
Step Temperature Time
Dielectric 1 100 to 120D 1 min.
In accordance with item No.4 2 170 to 200D 1 min.
Strength
Appearance No marking defects Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4 using a eutectic solder.
Capacitance
Within T2.5% Perform the 5 cycles according to the 4 heat treatments listed in
Change
the following table.
C0G char. : 1,000 min. Let sit for 24T2 hrs. at *1room condition, then measure.
Q U2J char. : 500 min. Step Temperature (D) Time (min.)
SL char. : 400W20C*2 min. 1 Min. Operating Temp.T3 30T3
I.R. More than 10,000MΩ 2 Room Temp. 2 to 3
Temperature 3 Max. Operating Temp.T2 30T3
14
Cycle 4 Room Temp. 2 to 3
15
Dielectric
In accordance with item No.4
Strength Solder resist
Cu
Glass Epoxy Board
Fig. 4
109
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e g e
■ Features
1. A new monolithic structure for small, high
T
capacitance capable of operating at high voltage L W
levels. Part Number
Dimensions (mm)
L W T e g min.
2. Sn-plated external electrodes realizes good GRM188 1.6 ±0.1 0.8 ±0.1 0.8 ±0.1 0.2 to 0.5 0.4
solderability. GRM21A 2.0 ±0.2 1.25 ±0.2 1.0 +0,-0.3 0.7
GRM21B 1.25 ±0.2
3. Use the GRM18/21/31 types with flow or reflow GRM31B 3.2 ±0.2 1.6 ±0.2 1.25 +0,-0.3
GRM31C 1.6 ±0.2
soldering, and other types with reflow soldering 1.2
GRM32Q 3.2 ±0.3 2.5 ±0.2 1.5 +0,-0.3 0.3 min.
only. GRM32D 2.0 +0,-0.3
GRM43Q 1.5 +0,-0.3
4.5 ±0.4 3.2 ±0.3 2.2
GRM43D 2.0 +0,-0.3
GRM55D 5.7 ±0.4 5.0 ±0.4 2.0 +0,-0.3 3.2
■ Applications
1. Ideal for use as a hot-cold coupling for DC-DC
converter.
2. Ideal for use on line filters and ringer detectors
for telephones, facsimiles and modems.
3. Ideal for use on diode-snubber circuits for
switching power supplies.
16
111
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Operating
1 Y55 to W125D Y
Temperature Range
2 Appearance No defects or abnormalities Visual inspection
Fig. 1
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified tolerance
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each 3 mutually perpendicular directions
Vibration (total of 6 hrs.).
10
Resistance
D.F. 0.025 max.
16
Solder resist
Cu
Glass Epoxy Board
No cracking or marking defects should occur. Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder.
b Then apply a force in the direction shown in Fig. 3.
φ4.5
VZ[§«¬TX¥©°±¨_¥̀\W®«ª¦]ZYU STW¤¥̈¢Q,§¨£VR
^¯
[¬
20 50 Pressurizing
a speed : 1.0mm/s
t : 1.6
Y]^ª®¯ Z«
100 Pressurize
11 Deflection R230
LZW Dimension (mm)
(mm) a b c d Flexure=1
1.6Z0.80 1.0 3.0 1.25
Capacitance meter
2.0Z1.25 1.2 4.0 1.65
3.2Z1.60 2.2 5.0 2.05 45 45 (in mm)
1.0
3.2Z2.50 2.2 5.0 2.95
Fig. 3
4.5Z3.20 3.5 7.0 3.75
5.7Z5.00 4.5 8.0 5.65
Fig. 2
* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
Continued on the following page.
112
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typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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Appearance No marking defects Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4 using a eutectic solder.
Capacitance
Within T7.5% Perform the 5 cycles according to the 4 heat treatments listed in
Change
the following table.
D.F. 0.025 max. Let sit for 24T2 hrs. at *room condition, then measure.
CU0.01µF : More than 100MΩ • µF Step Temperature (D) Time (min.)
I.R. 1 Min. Operating Temp.T3 30T3
CF0.01µF : More than 10,000MΩ
2 Room Temp. 2 to 3
3 Max. Operating Temp.T2 30T3
4 Room Temp. 2 to 3
Temperature
14
Cycle #Pretreatment
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
let sit for 24T2 hrs. at *room condition.
Dielectric
In accordance with item No.4
Strength
Solder resist
Cu
Glass Epoxy Board
Fig. 4
Appearance No marking defects
Capacitance Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
Within T15%
Change for 500 W24
Y00 hrs.
Humidity Remove and let sit for 24T2 hrs. at *room condition, then
D.F. 0.05 max.
15 (Steady measure.
State) CU0.01µF : More than 10MΩ • µF #Pretreatment
I.R.
CF0.01µF : More than 1,000MΩ Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
let sit for 24T2 hrs. at *room condition.
16
Dielectric
In accordance with item No.4
Strength
Appearance No marking defects Apply 120% of the rated voltage (150% of the rated voltage in
Capacitance Within T15% (rated voltage : DC250V, DC630V) case of rated voltage : DC250V, 110% of the rated voltage in
Change Within T20% (rated voltage : DC1kV) case of rated voltage : DC1kV) for 1,000 W48
Y00 hrs. at maximum
113
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■ Features
1. These items are designed specifically for tele-
communication devices (IEEE802.3) in Ethernet LAN.
2. A new monolithic structure for small, high
T
capacitance capable of operating at high voltage
levels. L W
■ Applications
Ideal for use on telecommunication devices in Ethernet
LAN
114
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typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Operating
1 Y55 to W125D Y
Temperature Range
2 Appearance No defects or abnormalities Visual inspection
Fig. 1
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified tolerance
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each 3 mutually perpendicular directions
Vibration
11 (total of 6 hrs.).
Resistance
D.F. 0.025 max.
17
Solder resist
Cu
Glass Epoxy Board
* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
Continued on the following page.
115
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
No cracking or marking defects should occur. Solder the capacitor to the testing jig (glass epoxy board) shown
b
in Fig. 2 using a eutectic solder.
φ4.5
VZ[§«¬TX¥©°±¨_¥̀\W®«ª¦]ZYU STW¤¥̈¢Q,§¨£VR
^¯
[¬ d
Then apply a force in the direction shown in Fig. 3.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
40
c
soldering is uniform and free of defects such as heat shock.
a
t : 1.6 20 50 Pressurizing
speed : 1.0mm/s
Y]^ª®¯ Z«
12 Deflection 100
Pressurize
LZW Dimension (mm) R230
(mm) a b c d
4.5Z2.00 3.5 7.0 2.45 Flexure=1
1.0
4.5Z3.20 3.5 7.0 3.75
Capacitance meter
Fig. 2 45 45 (in mm)
Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Solderability of Immerse in solder solution for 2T0.5 sec.
13 75% of the terminations are to be soldered evenly and continuously.
Termination Immersing speed : 25T2.5mm/s
Temp. of solder : 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects Preheat the capacitor as table.
Immerse the capacitor in solder solution at 260T5D for 10T1
Capacitance
Within T10% sec. Let sit at *room condition for 24T2 hrs., then measure.
Change
#Immersing speed : 25T2.5mm/s
D.F. 0.025 max. #Pretreatment
Resistance Perform a heat treatment at 150 W00Y10 D for 60T5 min. and then
I.R. More than 1,000MΩ
14 to Soldering let sit for 24T2 hrs. at *room condition.
Heat
*Preheating
Dielectric
In accordance with item No.4 Step Temperature Time
Strength
1 100 to 120D 1 min.
2 170 to 200D 1 min.
Appearance No marking defects Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4 using a eutectic solder.
Capacitance
Within T15% Perform the 5 cycles according to the 4 heat treatments listed in
Change
the following table.
D.F. 0.05 max. Let sit for 24T2 hrs. at *room condition, then measure.
I.R. More than 3,000MΩ Step Temperature (D) Time (min.)
1 Min. Operating Temp.T3 30T3
2 Room Temp. 2 to 3
3 Max. Operating Temp.T2 30T3
4 Room Temp. 2 to 3
Temperature
15 #Pretreatment
Cycle
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
let sit for 24T2 hrs. at *room condition.
Dielectric
In accordance with item No.4
Strength
17
Solder resist
Cu
Glass Epoxy Board
Fig. 4
116
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17
117
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■ Features
1. Suitable for the trigger of the flash circuit,
because real capacitance is stable during
operating voltage.
T
2. The thin type fit for thinner camera.
3. Sn-plated external electrodes realizes good L W
18
118
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• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering. 05.12.14
Operating
1 Y55 to W125D Y
Temperature Range
2 Appearance No defects or abnormalities Visual inspection
Fig. 1
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified tolerance
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each 3 mutually perpendicular directions
Vibration (total of 6 hrs.).
10
Resistance
D.F. 0.025 max.
Solder resist
Cu
Glass Epoxy Board
No cracking or marking defects should occur. Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder.
b Then apply a force in the direction shown in Fig. 3.
φ4.5
VZ[§«¬TX¥©°±¨_¥̀\W®«ª¦]ZYU STW¤¥̈¢Q,§¨£VR
^¯
[¬
20 50 Pressurizing
a speed: 1.0mm/s
11 Deflection t : 1.6
Y]^ª®¯ Z«
100 Pressurize
R230
LZW Dimension (mm)
(mm) a b c d Flexure=1
3.2Z1.6 2.2 5.0 2.0 1.0
Capacitance meter
Fig. 2 45 45 (in mm)
Fig. 3
119
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typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
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Appearance No marking defects Preheat the capacitor at 120 to 150D* for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1
Capacitance
Within T10% sec. Let sit at *room condition for 24T2 hrs., then measure.
Change
#Immersing speed : 25T2.5mm/s
D.F. 0.025 max. #Pretreatment
Resistance Perform a heat treatment at 150 W00Y10 D for 60T5 min. and then
13 to Soldering CU0.01µF: More than 100MΩ • µF
I.R. let sit for 24T2 hrs. at *room condition.
Heat CF0.01µF: More than 10,000MΩ
*Preheating for more than 3.2Z2.5mm
Dielectric Step Temperature Time
In accordance with item No.4
Strength 1 100 to 120D 1 min.
2 170 to 200D 1 min.
Appearance No marking defects Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4 using a eutectic solder.
Capacitance
Within T7.5% Perform the 5 cycles according to the 4 heat treatments listed in
Change
the following table.
D.F. 0.025 max. Let sit for 24T2 hrs. at *room condition, then measure.
CU0.01µF: More than 100MΩ • µF Step Temperature (D) Time (min.)
I.R. 1 Min. Operating Temp.T3 30T3
CF0.01µF: More than 10,000MΩ
2 Room Temp. 2 to 3
3 Max. Operating Temp.T2 30T3
4 Room Temp. 2 to 3
Temperature
14
Cycle #Pretreatment
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
let sit for 24T2 hrs. at *room condition.
Dielectric
In accordance with item No.4
Strength
Solder resist
Cu
Glass Epoxy Board
Fig. 4
Appearance No marking defects
Capacitance Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
Within T15%
Change for 500 W24
Y00 hrs.
Humidity Remove and let sit for 24T2 hrs. at *room condition, then
D.F. 0.05 max.
15 (Steady measure.
State) CU0.01µF: More than 10MΩ • µF #Pretreatment
I.R.
CF0.01µF: More than 1,000MΩ Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
let sit for 24T2 hrs. at *room condition.
Dielectric
In accordance with item No.4
Strength
Appearance No marking defects
Capacitance Apply DC350V for 1,000 W48Y00 hrs. at maximum operating
Within T15%
Change temperature T3D. Remove and let sit for 24 T2 hrs. at *room
condition, then measure.
D.F. 0.05 max.
16 Life The charge/discharge current is less than 50mA.
CU0.01µF: More than 10MΩ • µF #Pretreatment
I.R.
CF0.01µF: More than 1,000MΩ Apply test voltage for 60T5 min. at test temperature.
Remove and let sit for 24T2 hrs. at *room condition.
Dielectric
In accordance with item No.4
Strength
18 Appearance No marking defects
Capacitance Apply the rated voltage at 40T2D and relative humidity of 90 to
Within T15%
Change 95% for 500 W24
Y00 hrs.
Remove and let sit for 24T2 hrs. at *room condition, then
Humidity D.F. 0.05 max.
17 measure.
Loading
CU0.01µF: More than 10MΩ • µF #Pretreatment
I.R.
CF0.01µF: More than 1,000MΩ Apply test voltage for 60T5 min. at test temperature.
Remove and let sit for 24T2 hrs. at *room condition.
Dielectric
In accordance with item No.4
Strength
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
120
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e g e
■ Features
1. Chip monolithic ceramic capacitor for AC lines.
2. A new monolithic structure for small, high
capacitance capable of operating at high voltage
T
levels. L W
3. Sn-plated external electrodes realizes good Dimensions (mm)
Part Number
solderability. L W T e min. g min.
4. Only for reflow soldering GA242Q 4.5 ±0.3 2.0 ±0.2 1.5 +0, -0.3
GA243D 2.0 +0, -0.3 2.5
5. Capacitance 0.01 to 0.1uF for connecting lines and 4.5 ±0.4 3.2 ±0.3 0.3
GA243Q 1.5 +0, -0.3
470 to 4700pF for connecting lines to earth. GA255D 5.7 ±0.4 5.0 ±0.4 2.0 +0, -0.3 3.2
■ Applications
Noise suppression filters for switching power supplies,
telephones, facsimiles, modems.
■ Reference standard
GA2 series obtains no safety approval.
This series is based on JIS C 5102, JIS C 5150, and
the standards of the electrical appliance and material
safety law of Japan (separated table 4).
19
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Operating
1 Y55 to W125D Y
Temperature Range
2 Appearance No defects or abnormalities Visual inspection
Fig. 1
Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified tolerance
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each 3 mutually perpendicular directions
Vibration (total of 6 hrs.).
11
Resistance
19 D.F. 0.025 max.
Solder resist
Cu
Glass Epoxy Board
* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
Continued on the following page.
122
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Solder the capacitor to the testing jig (glass epoxy board) shown
No cracking or marking defects should occur. in Fig. 2 using a eutectic solder. Then apply a force in the
direction shown in Fig. 3. The soldering should be done either
with an iron or using the reflow method and should be conducted
b
φ4.5 with care so that the soldering is uniform and free of defects such
VZ[§«¬TX¥©°±¨_¥̀\W®«ª¦]ZYU STW¤¥̈
^¯
V[§¬¢Q,¨£R d
as heat shock.
20 50 Pressurizing
40
c
speed : 1.0mm/s
12 Deflection Pressurize
a R230
t : 1.6
13
Solderability of
Termination
Y]^ª®¯ Z«
Appearance
LZW
(mm)
4.5Z2.0
4.5Z3.2
5.7Z5.0
a
3.5
3.5
4.5
100
Dimension (mm)
b
7.0
7.0
8.0
Fig. 2
c
2.4
3.7
5.6
No marking defects
d
1.0
Capacitance meter
45
Fig. 3
45
Flexure=1
Capacitance
Within T15%
Change
The capacitor should be subjected to 40T2D, relative humidity of
Humidity
14 D.F. 0.05 max. 90 to 98% for 8 hrs., and then removed in *room condition for 16
Insulation
hrs. until 5 cycles.
I.R. More than 1,000MΩ
Dielectric
In accordance with item No.4
Strength
Appearance No marking defects Preheat the capacitor as table.
Capacitance Immerse the capacitor in solder solution at 260T5D for 10T1
Within T10%
Change sec. Let sit at *room condition for 24T2 hrs., then measure.
#Immersing speed : 25T2.5mm/s
D.F. 0.025 max.
Resistance #Pretreatment
I.R. More than 2,000MΩ Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
15 to Soldering
Heat let sit for 24T2 hrs. at *room condition.
*Preheating
Dielectric
In accordance with item No.4 Step Temperature Time
Strength
1 100 to 120D 1 min.
2 170 to 200D 1 min.
Appearance No marking defects Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4 using a eutectic solder.
Capacitance
Within T15% Perform the 5 cycles according to the 4 heat treatments listed in
Change
the following table.
D.F. 0.05 max. Let sit for 24T2 hrs. at *room condition, then measure.
I.R. More than 2,000MΩ Step Temperature (D) Time (min.)
1 Min. Operating Temp.T3 30T3
2 Room Temp. 2 to 3
3 Max. Operating Temp.T2 30T3
4 Room Temp. 2 to 3
Temperature
16
Cycle #Pretreatment
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
Dielectric
let sit for 24T2 hrs. at *room condition. 19
In accordance with item No.4
Strength
Solder resist
Cu
Glass Epoxy Board
Fig. 4
* "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
Continued on the following page.
123
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19
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e g e
■ Features
1. Chip monolithic ceramic capacitor (certified as
conforming to safety standards) for AC lines.
2. A new monolithic structure for small, high
T
capacitance capable of operating at high voltage
levels. L W
20
125
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e g e
■ Features
1. A new monolithic structure for small, high
capacitance capable of operating at high voltage
T
levels.
L W
2. The type GD can be used as a Y3-class capacitor.
3. Available for equipment based on IEC/EN60950 Dimensions (mm)
Part Number
and UL1950. L W T e min. g min.
4. +125 degree C guaranteed GA342D 2.0 ±0.2*
4.5 ±0.3 2.0 ±0.2
GA342Q 1.5 +0, -0.3
5. Only for reflow soldering 0.3 2.5
GA343D 2.0 +0, -0.3
4.5 ±0.4 3.2 ±0.3
6. The low-profile type (thickness: 1.5mm max.) is GA343Q 1.5 +0, -0.3
* GA342D1X : 2.0±0.3
available. Fit for use on thinner type equipment.
126
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e g e
■ Features
1. A new monolithic structure for small, high
capacitance capable of operating at high voltage
T
levels.
L W
2. The type GF can be used as a Y2-class capacitor.
Dimensions (mm)
3. Available for equipment based on IEC/EN60950 Part Number
L W T e min. g min.
and UL1950. Besides, the GA352/355 types are GA342D 2.0 ±0.2*
4.5 ±0.3 2.0 ±0.2 2.5
available for equipment based on IEC/EN60065, GA342Q 1.5 +0, -0.3
GA352Q 2.8 ±0.3 1.5 +0, -0.3 0.3
UL1492, and UL6500. GA355D 5.7 ±0.4 2.0 +0, -0.3 4.0
5.0 ±0.4
4. +125 degree C guaranteed GA355Q 1.5 +0, -0.3
* GA342D1X : 2.0±0.3
5. Only for reflow soldering
6. The low-profile type (thickness: 1.5mm max.) is
available. Fit for use on thinner type equipment. ■ Standard Recognition
Status of Recognition
■ Applications Standard Type GF Rated
Class
1. Ideal for use on line filters and couplings for No.
Size : 5.7×2.8mm
Voltage
Size : 4.5×2.0mm
DAA modems without transformers and over
2. Ideal for use on line filters for information UL UL1414 X1, Y2 Y AC250V
equipment SEMKO EN132400 Y2 (r.m.s.)
3. Ideal for use as Y capacitor or X capacitor for Applications
various switching power supplies (GA352/355 types Switching power Communication
Size network devices
only) supplies such as a modem
4.5×2.0mm Y
5.7×2.8mm and over
127
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e g e
■ Features
1. Chip monolithic ceramic capacitor (certified as
conforming to safety standards) for AC lines.
2. A new monolithic structure for small, high
T
capacitance capable of operating at high voltage
levels. L W
23
128
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Operating
1 Y55 to W125D Y
Temperature Range
2 Appearance No defects or abnormalities Visual inspection
Char. Capacitance Change The range of capacitance change compared with the 25D (SL
X7R Within T15%
char. : 20D) value within Y55 to W125D should be within the
Capacitance Temperature characteristic guarantee is Y55 to W125D specified range.
9 Temperature
Char. Temperature Coefficient #Pretreatment for X7R char.
Characteristics
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
SL W350 to Y1000ppm/D
let sit for 24T2 hrs. at *1room condition.
Temperature characteristic guarantee is W20 to W85D
Appearance No defects or abnormalities As in Fig., discharge is made 50 times at 5 sec. intervals from
the capacitor (Cd) charged at DC voltage of specified.
I.R. More than 1,000MΩ
R3 R1
Discharge
Test
10 Ct R2
(Application: 10kV
Dielectric V
Type GC) In accordance with item No.4 Cd
Strength
Fig. 1
*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
Continued on the following page.
23
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Appearance No defects or abnormalities Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified tolerance
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each 3 mutually perpendicular directions
Vibration (total of 6 hrs.).
12 Char. Specification
Resistance
D.F. X7R D.F.V0.025
Q QU400W20C*2 (CF30pF)
SL
QU1000 (CU30pF)
Solder resist
Cu
Glass Epoxy Board
No cracking or marking defects should occur. Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder. Then apply a force in the
b
φ4.5 direction shown in Fig. 3. The soldering should be done either
VZ[§«¬TX¥©°±¨_¥̀\W®«ª¦]ZYU STW¤¥̈¢Q,§¨£VR
^¯
[¬
with an iron or using the reflow method and should be conducted
d
with care so that the soldering is uniform and free of defects such
40
c
as heat shock.
a
t : 1.6 20 50 Pressurizing
13 Deflection
Y]^ª®¯ Z« 100 speed : 1.0mm/s
Pressurize
LZW Dimension (mm) R230
(mm) a b c d
4.5Z2.0 3.5 7.0 2.4 Flexure=1
4.5Z3.2 3.5 7.0 3.7
1.0 Capacitance meter
5.7Z2.8 4.5 8.0 3.2 (in mm)
5.7Z5.0 4.5 8.0 5.6 45 45
Fig. 2 Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Solderability of Immerse in solder solution for 2T0.5 sec.
14 75% of the terminations are to be soldered evenly and continuously.
Termination Immersing speed : 25T2.5mm/s
Temp. of solder : 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects Preheat the capacitor as table. Immerse the capacitor in solder
solution at 260T5D for 10T1 sec. Let sit at *1room condition for
Char. Capacitance Change 24T2 hrs., then measure.
Capacitance X7R Within T10% #Immersing speed : 25T2.5mm/s
Change Within T2.5% or T0.25pF #Pretreatment for X7R char.
Resistance SL
(Whichever is larger) Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
15 to Soldering let sit for 24T2 hrs. at *1room condition.
Heat I.R. More than 1,000MΩ
*Preheating
Dielectric Step Temperature Time
In accordance with item No.4 1 100 to 120D 1 min.
Strength
2 170 to 200D 1 min.
*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
Continued on the following page.
23
130
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Appearance No marking defects Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4 using a eutectic solder.
Char. Capacitance Change Perform the 5 cycles according to the 4 heat treatments listed in
Capacitance X7R Within T15% the following table.
Change Within T2.5% or T0.25pF Let sit for 24T2 hrs. at *1room condition, then measure.
SL
(Whichever is larger) Step Temperature (D) Time (min.)
1 Min. Operating Temp.T3 30T3
Char. Specification 2 Room Temp. 2 to 3
D.F. X7R D.F.V0.05 3 Max. Operating Temp.T2 30T3
Q QU400W20C*2 (CF30pF) 4 Room Temp. 2 to 3
Temperature SL
16 QU1000 (CU30pF)
Cycle #Pretreatment for X7R char.
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
I.R. More than 3,000MΩ
let sit for 24T2 hrs. at *1room condition.
Dielectric
Strength In accordance with item No.4 Solder resist
Cu
Glass Epoxy Board
Fig. 4
Appearance No marking defects
State) D.F. X7R D.F.V0.05 Remove and let sit for 24T2 hrs. at *1room condition, then
Q QU275W5/2C*2 (CF30pF) measure.
SL
QU350 (CU30pF) #Pretreatment for X7R char.
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
I.R. More than 3,000MΩ let sit for 24T2 hrs. at *1room condition.
Dielectric
In accordance with item No.4
Strength
Appearance No marking defects Before this test, the test shown in the following is performed.
·Item 11 Adhesive Strength of Termination (apply force is 5N)
Char. Capacitance Change ·Item 13 Deflection
Capacitance X7R Within T20% Front time (T1)=1.2µs=1.67T
Change Within T3.0% or T0.3pF Impulse Voltage Time to half-value (T2)=50µs
SL Each individual capacitor should
(Whichever is larger) 100
(%)
be subjected to a 2.5kV (Type 90
50
GC/GF : 5kV) Impulses (the
Char. Specification 30
voltage value means zero to 0
t
D.F. X7R D.F.V0.05 T
peak) for three times. Then the
Q QU275W5/2C*2 (CF30pF) T1
SL capacitors are applied to life test. T2
QU350 (CU30pF)
Y0 D, relative
Apply voltage as Table for 1,000 hrs. at 125 W2
18 Life
I.R. More than 3,000MΩ humidity 50% max.
Type Applied Voltage
AC312.5V(r.m.s.), except that once each hour the
GB
voltage is increased to AC1,000V(r.m.s.) for 0.1 sec.
GC
AC425V(r.m.s.), except that once each hour the
GD
Dielectric voltage is increased to AC1,000V(r.m.s.) for 0.1 sec.
In accordance with item No.4 GF
Strength
Let sit for 24T2 hrs. at *1room condition, then measure.
#Pretreatment for X7R char.
Y10 D for 60T5 min. and then
Perform a heat treatment at 150 W00
let sit for 24T2 hrs. at *1room condition.
*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
Continued on the following page.
23
131
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F L1 L2 R
S1
C1 C2 C3 Cx Ct Ut
S2 UAC L3 L4
Tr
Oscilloscope
Active
20 The cheese-cloth should not be on fire.
Flammability C1,2 : 1µFT10% C3 : 0.033µFT5% 10kV
L1 to 4 : 1.5mHT20% 16A Rod core choke
Ct : 3µFT5% 10kV R : 100ΩT2%
Cx : Capacitor under test UAC : URT5%
F : Fuse, Rated 16A UR : Rated Voltage
Ut : Voltage applied to Ct
Ux
Type Ui
Ui GB, GD 2.5kV
GC, GF 5kV
time
200T5mm
45°
Tissue
About 10mm Thick Board
*1 "Room condition" Temperature : 15 to 35D, Relative humidity : 45 to 75%, Atmospheric pressure : 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
23
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■ Capacitance-Temperature Characteristics
C0G/U2J/SL Characteristics X7R Characteristics
20 30
15
20
U2J X7R Char. Spec.(upper)
10
10
Cap. Change (%)
−20 -30
−60 −40 −20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Temperature (°C) Temperature (°C)
GR4 Series
20
15
10
Cap. Change (%)
-5
–10
–15
–20
–60 –40 –20 0 20 40 60 80 100 120 140
Temperature (°C)
■ Impedance-Frequency Characteristics
GRM Series (X7R Char. 250V) GRM Series (X7R Char. 630V)
1k
1k
100
100
1000pF
1000pF
10
10
Z (Ω)
10000pF
Z (Ω)
100000pF 10000pF
100000pF
1 1
100m 100m
10m 10m
1M 10M 100M 1G 1M 10M 100M 1G
Frequency (Hz) Frequency [Hz]
23
133
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■ Impedance-Frequency Characteristics
GR4 Series GR7 Series
1k 1k
100 100
1000pF 100pF
10 10
10000pF
Z (Ω)
Z (Ω)
4700pF
1 1
22000pF
100m 100m
10m 10m
1M 10M 100M 1G 1M 10M 100M 1G
Frequency (Hz) Frequency (Hz)
150pF
100 100
1000pF
1000pF
10 10
Z (Ω)
Z (Ω)
1
1
100m
100m
10m
10m 1M 10M 100M 1G
1M 10M 100M 1G Frequency (Hz)
Frequency [Hz]
100 100
1000pF
10 10
Z (Ω)
Z (Ω)
2200pF
1 1
10nF
100m 0.1
33nF
10m 0.01
1M 10M 100M 1G 1 10 100 1000
Frequency (Hz) Frequency (MHz)
23
134
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40
40
20
0 0
-20 −20
-40 −40
-60
−60
0 100 200 300 400 500 0 100 200 300 400 500
AC-Voltage [V(r.m.s.)] AC-Voltage [V(r.m.s.)]
23
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Package
136
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Package
Continued from the preceding page.
8mm width 4mm pitch Tape 12mm width 8mm/4mm pitch Tape
W0.1
4.0T0.05 φ1.5 Y0
W0.1 0.25T0.1 8.0T0.1*1 2.0T0.05 0.3T0.1
4.0T0.1 φ1.5 Y0 2.0T0.05
1.75T0.1 1.75T0.1
4.0T0.1
5.5T0.05
3.5T0.05
12.0T0.3
8.0T0.3
A A
B
B
4.0T0.1
W0.1 1.1 max.
4.0T0.1 φ1.5 Y0 2.0T0.05
1.75T0.1
13.0T1.0 (Tape width 8mm)
17.0T1.0 (Tape width 12mm)
3.5T0.05
8.0T0.3
A
2.0T0.5
B
φ13T0.2
-1.5
180 +0
+1
60 -0
Direction of Feed
φ21T0.8
Part Number A* B*
GRM18 1.05 1.85
+1.0
9.0 -0 (Tape width 8mm)
GRM21 +1.0
1.45 2.25 13.0 -0 (Tape width 12 mm)
(T=1.0mm)
GRM31/GR731
2.0 3.6
(T=1.0mm)
GRM32
2.9 3.6
(T=1.0mm)
*Nominal value
(in mm) (in mm)
23
137
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Package
Continued from the preceding page.
Base Tape
23
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!Caution
■ Handling
1. Vibration and impact
Do not expose a capacitor to excessive shock or
vibration during use.
2. Do not directly touch the chip capacitor, especially
the ceramic body. Residue from hands/fingers may
create a short circuit environment.
23
139
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!Caution
Caution (Rating)
1. Operating Voltage
When DC-rated capacitors are to be used in AC or ripple
current circuits, be sure to maintain the Vp-p value of the
applied voltage or the Vo-p which contains DC bias within
the rated voltage range.
When the voltage is applied to the circuit, starting or
stopping may generate irregular voltage for a transit
period because of resonance or switching. Be sure to use
a capacitor with a rated voltage range that includes these
irregular voltages.
Voltage DC Voltage DC+AC Voltage AC Voltage Pulse Voltage (1) Pulse Voltage (2)
Positional
V0-p V0-p Vp-p Vp-p Vp-p
Measurement
140
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!Caution
Continued from the preceding page.
(630) 1,000pF
to 470pF
to 4,700pF 2,200pF
1000
(250)
10,000pF
to 100pF
150pF to 33pF
1000 220pF (3150)
47pF
100pF
100 1000
1 10 100 (500)1000 1 10 100 1000
Frequency [kHz] Frequency [kHz]
23
141
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!Caution
Continued from the preceding page.
23
142
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!Caution
Continued from the preceding page.
4. Fail-safe
Failure of a capacitor may result in a short circuit. Be sure
to provide an appropriate fail-safe function such as a fuse FUSE
23
143
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!Caution
Perforation C
Locate chip B
horizontal to the Chip arrangement
direction in which D Worst AGCGB~D Best
stress acts. A
Slit
23
144
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Notice
Flow Soldering
Chip Capacitor Slit
LgW a b c
Solder Resist
c 1.6g0.8 0.6-1.0 0.8-0.9 0.6-0.8
2.0g1.25 1.0-1.2 0.9-1.0 0.8-1.1
d L
e 3.2g1.6 2.2-2.6 1.0-1.1 1.0-1.4
W Flow soldering : 3.2g1.6 or less available.
b a Land
Reflow Soldering
LgW a b c d e
Preparing slit helps flux
cleaning and resin coating on 1.6g0.8 0.6-0.8 0.6-0.7 0.6-0.8 - -
the back of the capacitor. 2.0g1.25 1.0-1.2 0.9-1.0 0.8-1.1 - -
3.2g1.6 2.2-2.4 0.8-0.9 1.0-1.4 1.0-2.0 3.2-3.7
3.2g2.5 2.0-2.4 1.0-1.2 1.8-2.3 1.0-2.0 4.1-4.6
4.5g2.0 2.8-3.4 1.2-1.4 1.4-1.8 1.0-2.8 3.6-4.1
4.5g3.2 2.8-3.4 1.2-1.4 2.3-3.0 1.0-2.8 4.8-5.3
5.7g2.8 4.0-4.6 1.4-1.6 2.1-2.6 1.0-4.0 4.4-4.9
5.7g5.0 4.0-4.6 1.4-1.6 3.5-4.8 1.0-4.0 6.6-7.1
(in mm)
d2
d1<d2 Solder Resist Solder Resist
Examples of
Improvements Solder Resist
by the Land
Division
23
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Notice
Continued from the preceding page.
2. Mounting of Chips
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105µm or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70µm) and
the land pattern (30-35µm).
3. Soldering
(1) Limit of losing effective area of the terminations and
conditions needed for soldering.
280
270
Soldering Allowance Time
Solder : Sn-3.0Ag-0.5Cu Lead Free Solder
H63A Eutectic Solder
terminations.
260
To prevent this, be careful in soldering so that any
possible loss of the effective area on the
terminations will securely remain at a maximum of
25% on all edge length A-B-C-D-A of part with A, B,
±`ªY¯®^]
©¨§¦¤£¢XWVUSRQ,¬«ª\[ZY
°¯®_^]
250
240
230
S
X
¥
¤
©
T
C, D, shown in the Figure below. Flow Dip Soldering Reflow Soldering and
220 Soldering (Static Solder) Soldering Iron Methods
In case of repeated soldering, the accumulated 0 30 60 90
Time (sec.)
soldering time must be within the range shown at
right.
Termination
C
(2) Flux
Please use it after confirming there is no problem in the
reliability of the product beforehand with a intended
equipment. The residue of flux might cause the decrease
in nonconductivity and the corrosion of an external
electrode, etc.
146
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Notice
Continued from the preceding page.
w Reflow soldering
When soldering, confirm that the solder is placed over
0.2mm of the surface of the terminations.
4. Cleaning
Please confirm there is no problem in the reliability of the
product beforehand when cleaning it with a intended
equipment.
The residue after it cleaning it might cause the decrease
in the surface resistance of the chip and the corrosion of
the electrode part, etc. As a result might cause reliability
to deteriorate. Please confirm there is no problem with a
intended equipment in the ultrasonic cleansing
beforehand.
5. Resin Coating
Please use it after confirming there is no influence on the
product with a intended equipment beforehand when the
resin coating and molding.
The chip crack might be caused at the cool and heat
cycle by bias of the amount of spreading of the resin and
spreading thickness.
The resin for the coating and molding must use the thing
that as the stress when stiffening is small, and the
hygroscopic is as low as possible.
■ Rating
1. Capacitance change of capacitor 2. Performance check by equipment
(1) In case of X7R char. Before using a capacitor, check that there is no
Capacitors have an aging characteristic, whereby problem in the equipment's performance and the
the capacitor continually decreases its specifications.
capacitance slightly if the capacitor is left on Generally speaking, CLASS 2 (X7R char.) ceramic
for a long time. Moreover, capacitance might change capacitors have voltage dependence characteristics
greatly depending on the surrounding temperature and temperature dependence characteristics in
or an applied voltage. So, it is not likely to be capacitance. So, the capacitance value may change
suitable for use in a time constant circuit. depending on the operating condition in a equipment.
Please contact us if you need detailed information. Therefore, be sure to confirm the apparatus
(2) In case of any char. except X7R performance of receiving influence in a capacitance
Capacitance might change a little depending on the value change of a capacitor, such as leakage current
surrounding temperature or an applied voltage. and noise suppression characteristic.
Please contact us if you intend to use this product Moreover, check the surge-proof ability of a
in a strict time constant circuit. capacitor in the equipment, if needed, because the
surge voltage may exceed specific value by the
inductance of the circuit.
23
147
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■ Qualified Standards
The products listed here have been produced by ISO 9001
certified factory.
Plant
Fukui Murata Mfg. Co., Ltd.
Izumo Murata Mfg. Co., Ltd.
Okayama Murata Mfg. Co., Ltd.
Murata Electronics Singapore (Pte.) Ltd.
Murata Amazonia Industria E Comercio Ltda.
Suzhou Murata Electronics Co., Ltd.
Beijing Murata Electronics Co., Ltd.
148
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Note:
1. Export Control
<
For customers outside Japan >
No muRata products should be used or sold, through any channels, for use in the design, development, production, utilization, maintenance or operation of, or
otherwise contribution to (1) any weapons (Weapons of Mass Destruction (nuclear, chemical or biological weapons or missiles) or conventional weapons) or (2)
goods or systems specially designed or intended for military end-use or utilization by military end-users.
<
For customers in Japan >
For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required
for export.
2. Please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below, which require especially
high reliability for the prevention of defects which might directly damage a third party's life, body or property, or when one of our products is intended for use in
applications other than those specified in this catalog.
q Aircraft equipment w Aerospace equipment
e Undersea equipment r Power plant equipment
t Medical equipment y Transportation equipment (vehicles, trains, ships, etc.)
u Traffic signal equipment i Disaster prevention / crime prevention equipment
o Data-processing equipment !0 Application of similar complexity and/or reliability requirements to the applications listed above
3. Product specifications in this catalog are as of July 2005. They are subject to change or our products in it may be discontinued without advance notice. Please
check with our sales representatives or product engineers before ordering. If there are any questions, please contact our sales representatives or product
engineers.
4. Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
5. This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or
transact the approval sheet for product specifications before ordering.
6. Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect
of our and/or a third party's intellectual property rights and other related rights in consideration of your use of our products and/or information described or
contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned
above under licenses without our consent.
7. No ozone depleting substances (ODS) under the Montreal Protocol are used in our manufacturing process.
[Link]
Head Office International Division
1-10-1, Higashi Kotari, Nagaokakyo-shi, Kyoto 617-8555, Japan 3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan
Phone: 81-75-951-9111 Phone: 81-3-5469-6123 Fax: 81-3-5469-6155 E-mail: intl@[Link]