Technical Data
INTRODUCTION
All dimensions, operating characteristics, specifications and materials shown in this catalog are for reference only and are
subject to change without notice. The data in this catalog shows nominal values; that is, they can exceed or fall short of
specified values taking into account the effect of other parameters.
C&K Components assumes no liability resulting from misapplication of its products.
AGENCY APPROVALS
Many of our products are suitable for power switching, and are available with approvals by one or more of the following listing
agencies:
UL . . . File No. E42363 Recognized under the recognized component program of Underwriters Laboratories, Inc.
Wiring harness certified under file no. E130055
Some switches are supplied with agency approvals automatically when ordered with the appropriate contact materials
(eg: E Series, 8500 Series). In some series, switches have agency approvals only when specific model numbers are selected
(eg: 7000 Series, 8020 Series). Otherwise, no approvals appear on the switches. See the appropriate switch section for
ratings, agency approvals and other specifications. Also see CONTACT MATERIAL.
Note: Switches with contact material option of ‘G’ are electrically equivalent to ‘B’ and ‘Q’ contact materials and
can be used where either dry circuit* or power conditions are encountered. When the dry circuit rating is exceeded, the gold
plating is removed from the contact interface and the switch cannot then be used in dry circuits. ‘G’ contact material
should be specified where UL approval is required on a switch used in a dry circuit application.
* Dry Circuit: Conditions where no arcing occurs during switching (i.e., 0.4 VA max. @ 20 V AC or DC max.)
ISO / QS
C&K’s design and manufacturing location in Newton, Massachusetts is certified as compliant to ISO 9001:2008. The Huizhou,
China facility is ISO 9001:2008, ISO14001:2004, and ISO/TS 16949 certified. The Dole, France facility has been certified as
compliant to ISO 9001, ISO14001, and ISO/TS 16949, AS9100B.
CONTACT MATERIAL
Many of our switches offer three contact material options: gold, silver, and gold over silver. Switch terminal plating may be gold,
silver, tin-lead or matte tin. See desired switch section for availability of specific options. Also see Agency Approvals section
included in this catalog. Figures 1 & 2 below provide contact material vs rating recommendations. For special requirements or
assistance, consult Customer . Service Center
RECOMMENDED CONTACT MATERIALS VS. VOLTAGE AND CURRENT
CONTACT MATERIAL CHARACTERISTICS + +
Technical Data
Gold (B) G
LOW LEVEL OR DRY CIRCUIT RATED: 0.4 VA
Gold with tin terminals (P) DC max. Contact material: Gold.
G/Q/S
Silver (Q)
VOLTS
POWER RATED: Ratings from 100mA to 10 AMPS @ 125 V AC are B/G/P
available. See switch sections for applicable ratings and available
Silver with tin agency approvals. Contact material: Silver. ALL
+
terminals (S) G
POWER OR LOW LEVEL/DRY CIRCUIT RATED: Electrically B/G/P ** +
Gold (G) equivalent to ‘B, Q, contact materials and can be used where
either low level/dry circuit* or power conditions are encountered.
When the dry circuit rating is exceeded, the gold plating is removed
from the contact interface and the switch cannot then be used in dry
circuits. ‘G’ contact material should be specified where agency MILLIAMPS
approvals are required on a switch used in a dry circuit application.
Contact material: Gold over silver . + To maximum switch rating.
* Dry Circuit: Conditions where no arcing occurs during switching, ** For high reliability at these low levels, extra gold plating recommended,
i.e. 0.4 VA max. @ 20 V AC or DC max. consult Customer Service Center
.
Fig. 1 Fig. 2
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Dimensions are shown: Inch (mm)
Specifications and dimensions subject to change
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Technical Data - Tact Switches
TACT SWITCHES
The choice of contact material to be used depends on what is expected of the switch in terms of electrical properties and under
consideration of the ambient condition.
Two different contact materials have proved themselves to be especially suitable:
CONTACT
MATERIAL CHARACTERISTICS
a) For switching levels < 12 V and < 100 mA
b) For application in corrosive atmospheres.
Gold (3) c) For applications at V and A levels including infrequent usage.
In this case, please contact us directly in order to select the
most suitable switch for your application.
Silver (1) For switching levels > 0.5 V and > 100 mA under normal ambient
conditions.
SOLDERING AND CLEANING
Most manufacturing and field problems experienced by users of unsealed switches are caused by contamination of the internal
switch contacts during soldering and cleaning processes. Switches may become intermittent, especially in low power
applications, and may become open during factory testing or later in the field. Care during soldering and cleaning can prevent
most process contamination problems encountered.
Contamination can occur in both hand soldering and machine soldering processes. Hand soldering and cleaning are
acceptable with properly trained personnel, small diameter solder (.030-.040 in.) and low wattage soldering irons (25-40 watts
max.). Solder time is approximately 3 seconds maximum. Do not immerse or spray the unsealed areas of the switches with
cleaners during flux removal.
Typical SMT Reflow Profile
Pre-heat to a maximum of 2000 C for 30 seconds.
Reflow at a maximum of 2450 C for 10 seconds. 250
245
Maximum time above 1830 C for 60 seconds.
200
183
temperature (ºC)
150
100
SMT reflow soldering profile of reference
Thermal shock resistance 50
300
0 60 120 180 240
t3
250 time (seconds)
t2
Wave soldering profile of reference
temperature (ºC)
200
t1
Thermal shock resistance
150
300
t2
100
250
50
200
temperature (ºC)
0
0 50 100 150 200 250 300 150
Technical Data
• Thermal profile done 2 times on each part tested t1
• Thermal profile in accordance with CEI 60068-2-58/ 100
EN 60068-2-58
50
LEAD FREE
PARAMETER REFERENCE SPECIFICATION
t1 90 seconds 0
Time between 150ºC and 180ºC
Time above 2200C t2 40 seconds 0 50 100 150 200 250 300
Time at/above 2500 (peak) t3 10 seconds
Peak temperature T peak 260ºC 0/+5ºC
Thermal profile done in 2 times:
• Preheat thermal profile • Thermal profile done 2 times on each part listed
• Soldering heat resistance • Thermal profile in accordance with CEI 60068-2-58/
EN 60068-2-58
LEAD FREE
PARAMETER REFERENCE SPECIFICATION
Preheat time exposure t1 Between 100s and 120s
Preheat T1 >120º C
Time at max. body temp t2 10 seconds max
NOTE: Not all of C&K Components products have been tested to this profile.
Peak board bottom temp T2 260ºC 0/+5ºC
Please refer to product section for more information.
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Dimensions are shown: Inch (mm)
Specifications and dimensions subject to change
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RoHS Definitions and Specifications Technical Data
RoHS compliant = Complies with EU directive 2002/95/EC restriction of hazardous substances.
RoHS compatible = Compatible with lead free soldering process.
REFLOW SOLDER PROFILE REQUIREMENT WAVE SOLDER REQUIREMENT
For Soldering Heat Resistance Testing
TIN/LEAD LEAD FREE TIN/LEAD LEAD FREE
PARAMETER REFERENCE SPECIFICATION SPECIFICATION PARAMETER REFERENCE SPECIFICATION SPECIFICATION
Preheat Temperature Preheat Temperature
Gradient +1-4 C/sec +1-4 C/sec Gradient +1-4 C/sec. +1-4 C/sec.
Soak Time t Soak 2 min. max 2-3 min. Soak Time t1 2 min. max 2-3 min.
Time Above 100C Not Specified 420 sec. max Preheat Temp T1 > 90º C > 100º C
Time Above 183C 60-120 sec. 120-180 sec. Solder Pot Temp T2 245º - 260º C 260º - 275º C
Time Above 217C t1 / T1 Not Specified 90 sec. max Solder Pot Contact Time t2 2 - 2.5 sec. 2 - 3.5 sec.
Time Above 230C t2 / T2 10-40 sec. 20-60 sec. Lead Thermal Trans. Spike > 130º C > 130º C
Time Above 250C t3 / T3 0 10 sec. max Component Body Temp > 180º C > 200º C
Peak Temperature T Peak 235 -0/+5C 255 -0/+5C Time@ Max. Body Temp > 10 sec. > 10 sec.
Cooling Temperature -6C/sec. max -6C/sec. max Peak Temperature T Peak 235º -0º/+5ºC 255º -0º/+5ºC
Gradient Cooling Temperature -6C/sec. max -6C/sec. max
Gradient
Wave Solder Thermal Profile (TH Components)
TEMPERATURE
TEMPERATURE
T PEAK
T PEAK
T3
T2
T1
T1
TIME TIME
t SOAK t3
t1 t2
t2
t3 TIN/LEAD SPECIFICATIONS ARE TAKEN FROM:
ANSI/IPC-9504 SURFACE MOUNT TECHNOLOGY ASSOCIATION
TIN/LEAD SPECIFICATIONS ARE TAKEN FROM: COOKSON ELECTRONICS COOKSON ELECTRONICS
ANSI/IPC-9504 JUNE 1998 National Electronics National Electronics
Manufacturing Initiative, Inc. Manufacturing Initiative, Inc.
WAVE SOLDER REQUIREMENT
For Soldering Heat Resistance Testing
Diference Between SnPb and Lead-Free Wave Soldering
TEMPERATURE
EXTEND
300
CONTACT TIME
250
200 Melting Point Lead-Free Alloy
Melting Point SnPb (183º C)
150
100 Increasing Topside
Board Temperature
50
Maximum Gradient 2º C/s
Technical Data
TIME
SnPb
Lead-Free
FLUXER PREHEATER SOLDERPOT
Note: Not all of C&K Components products have been tested to these profiles. Please refer to product section for more information.
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Dimensions are shown: Inches (mm)
Specifications and dimensions subject to change
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Technical Data
WIRING FOR 3-WAY SWITCHES
3-Position toggle and rocker switches with ON-ON-ON switch functions may be externally wired for
‘3-way’ function. See wiring diagram and schematics below. Note: Jumpers are added by customer.
To make single pole, 3-position To make double pole, 3-position
Keyway C&K marking switch using X211, X213, switch using X411, X413, X415 model switches.
opposite side. X215 model switches. 12 9 6 3
POS. 3
6 3
POS. 2 11 8 5 2 These switch series have
5 2
POS. 1 10 7 4 1 one or more models that
4 1
may be wired to achieve
(OUT) 6 3 (OUT) 12 (OUT) 6
SP3T or DP3T functions:
9 3
2 (IN)
4 5 1 10 11 7
8 (IN)
4 5 1
2 (IN) 7000 Series
(including UL/CSA Models)
6
5
3 12 9 6
5
3 E Series
2 (IN) 8 (IN) 2 (IN)
(OUT) 4 1 (OUT) 10 11 7 1
ET Series
(OUT) 4
T Series
6 3 12 9 6 3
5 2 (IN) 8 (IN) 5 2 (IN)
4 10 11 7 (OUT) 4 1 (OUT)
1 (OUT)
MODE OF SWITCHING
We can deliver some switch types with non-shorting (BBM=Break-Before-Make) or shorting (bridging:
MBB=Make-Before-Break) modes of switching. In the non-shorting (BBM) mode there is no connection between two
neighboring contacts during the switching operation. The moving contact leaves its starting position before making contact in
the next position. In the shorting (MBB) mode a bridging is effected during the switching operation.
The mode of switching is non-shorting unless otherwise specified.
U=Changeover contact
A=Make contact (SPST N.O.)
R=Break contact (SPST N.C.)
Technical Data
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Dimensions are shown: Inch (mm)
Specifications and dimensions subject to change
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