TC4426/TC4427/TC4428

1.5A Dual High-Speed Power MOSFET Drivers

Features: General Description:
• High Peak Output Current: 1.5A The TC4426/TC4427/TC4428 are improved versions
• Wide Input Supply Voltage Operating Range: of the earlier TC426/TC427/TC428 family of MOSFET
- 4.5V to 18V drivers. The TC4426/TC4427/TC4428 devices have
matched rise and fall times when charging and
• High Capacitive Load Drive Capability: 1000 pF in
discharging the gate of a MOSFET.
25 ns (typical)
• Short Delay Times: 40 ns (typical) These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
• Matched Rise and Fall Times
are not subject to damage when up to 5V of noise
• Low Supply Current: spiking (of either polarity) occurs on the ground pin.
- With Logic ‘1’ Input – 4 mA They can accept, without damage or logic upset, up to
- With Logic ‘0’ Input – 400 µA 500 mA of reverse current (of either polarity) being
• Low Output Impedance: 7 forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up to
• Latch-Up Protected: Withstands 0.5A Reverse
2.0 kV.
Current
• Input Withstands Negative Inputs Up to 5V The TC4426/TC4427/TC4428 MOSFET drivers can
easily charge/discharge 1000 pF gate capacitances in
• Electrostatic Discharge (ESD) Protected: 2.0 kV
under 30 ns. These devices provide low enough
• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN-S impedances in both the On and Off states to ensure the
Packages MOSFET’s intended state is not affected, even by large
transients.
Applications:
Other compatible drivers are the TC4426A/TC4427A/
• Switch Mode Power Supplies TC4428A family of devices. The TC4426A/TC4427A/
• Line Drivers TC4428A devices have matched leading and falling
edge input-to-output delay times, in addition to the
• Pulse Transformer Drive
matched rise and fall times of the TC4426/TC4427/
TC4428 devices.

Package Types
8-Pin MSOP/
PDIP/SOIC TC4426 TC4427 TC4428 8-Pin DFN-S* TC4426 TC4427 TC4428
NC 1 8 NC NC NC
NC 1 8 NC NC NC
IN A 2 TC4426 7 OUT A OUT A OUT A
GND 3 TC4427 6 VDD VDD VDD IN A 2 EP 7 OUT A OUT A OUT A
IN B 4 TC4428 5 OUT B OUT B OUT B GND 3 9 6 VDD VDD VDD
IN B 4 5 OUT B OUT B OUT B

* Includes Exposed Thermal Pad (EP); see Table 3-1.

 2006-2014 Microchip Technology Inc. DS20001422G-page 1

TC4426/TC4427/TC4428
Functional Block Diagram
VDD
Inverting
1.5 mA
300 mV
Output

Non-Inverting
Input

Effective 4.7V
Input C = 12 pF
(Each Input)
TC4426/TC4427/TC4428
GND

Note 1: TC4426 has two inverting drivers, while the TC4427 has two non-inverting
drivers. The TC4428 has one inverting and one non-inverting driver.
2: Ground any unused driver input.

DS20001422G-page 2  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
1.0 ELECTRICAL † Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
CHARACTERISTICS are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
Absolute Maximum Ratings † operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
Supply Voltage ................................................................+22V extended periods may affect device reliability.
Input Voltage, IN A or IN B .......... (VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA +70°C)
DFN-S ..................................................................... Note 3
MSOP .....................................................................340 mW
PDIP .......................................................................730 mW
SOIC.......................................................................470 mW
Storage Temperature Range .........................-65°C to +150°C
Maximum Junction Temperature ................................. +150°C

DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25ºC with 4.5V  VDD  18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Input
Logic ‘1’, High Input Voltage VIH 2.4 — — V Note 2
Logic ‘0’, Low Input Voltage VIL — — 0.8 V
Input Current IIN -1.0 — +1.0 µA 0VVINVDD
Output
High Output Voltage VOH VDD – 0.025 — — V DC Test
Low Output Voltage VOL — — 0.025 V DC Test
Output Resistance RO — 7 10  IOUT = 10 mA, VDD = 18V
Peak Output Current IPK — 1.5 — A VDD = 18V
Latch-Up Protection IREV — > 0.5 — A Duty cycle2%, t 300 µs
Withstand Reverse Current VDD = 18V
Switching Time (Note 1)
Rise Time tR — 19 30 ns Figure 4-1
Fall Time tF — 19 30 ns Figure 4-1
Delay Time tD1 — 20 30 ns Figure 4-1
Delay Time tD2 — 40 50 ns Figure 4-1
Power Supply
Power Supply Current IS — — 4.5 mA VIN = 3V (Both inputs)
— — 0.4 VIN = 0V (Both inputs)
Note 1: Switching times ensured by design.
2: For V temperature range devices, the VIH (Min) limit is 2.0V.
3: Package power dissipation is dependent on the copper pad area on the PCB.

 2006-2014 Microchip Technology Inc. DS20001422G-page 3

TC4426/TC4427/TC4428
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V  VDD  18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Input
Logic ‘1’, High Input Voltage VIH 2.4 — — V Note 2
Logic ‘0’, Low Input Voltage VIL — — 0.8 V
Input Current IIN -10 — +10 µA 0VVINVDD
Output
High Output Voltage VOH VDD – 0.025 — — V DC Test
Low Output Voltage VOL — — 0.025 V DC Test
Output Resistance RO — 9 12  IOUT = 10 mA, VDD = 18V
Peak Output Current IPK — 1.5 — A VDD = 18V
Latch-Up Protection IREV — >0.5 — A Duty cycle2%, t 300 µs
Withstand Reverse Current VDD = 18V
Switching Time (Note 1)
Rise Time tR — — 40 ns Figure 4-1
Fall Time tF — — 40 ns Figure 4-1
Delay Time tD1 — — 40 ns Figure 4-1
Delay Time tD2 — — 60 ns Figure 4-1
Power Supply
Power Supply Current IS — — 8.0 mA VIN = 3V (Both inputs)
— — 0.6 VIN = 0V (Both inputs)
Note 1: Switching times ensured by design.
2: For V temperature range devices, the VIH (Min) limit is 2.0V.

TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Specified Temperature Range (C) TA 0 — +70 °C
Specified Temperature Range (E) TA -40 — +85 °C
Specified Temperature Range (V) TA -40 — +125 °C
Maximum Junction Temperature TJ — — +150 °C
Storage Temperature Range TA -65 — +150 °C
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN-S JA — 33.2 — °C/W
Thermal Resistance, 8L-MSOP JA — 206 — °C/W
Thermal Resistance, 8L-PDIP JA — 125 — °C/W
Thermal Resistance, 8L-SOIC JA — 155 — °C/W

DS20001422G-page 4  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, TA = +25ºC with 4.5V  VDD  18V.

100 100
2200 pF 2200 pF

80 80
1500 pF
1500 pF

tFALL (nsec)
tRISE (nsec)

60 60
1000 pF
1000 pF

40 40
470 pF
470 pF

20 20
100 pF 100 pF

0 0
4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18
VDD (V) VDD (V)

FIGURE 2-1: Rise Time vs. Supply FIGURE 2-4: Fall Time vs. Supply
Voltage. Voltage.

100 100
5V
5V

80 80
tFALL (nsec)
tRISE (nsec)

10V
60 60 10V
15V
15V
40 40

20 20

0 0
100 1000 10,000 100 1000 10,000
CLOAD (pF) CLOAD (pF)

FIGURE 2-2: Rise Time vs. Capacitive FIGURE 2-5: Fall Time vs. Capacitive
Load. Load.

60
80
C LOAD = 1000 pF CLOAD = 1000 pF
75
Propagation Delay (nsec)

VDD = 17.5V 70 VIN = 5V

50
65
60
Time (nsec)

40 55
50
tD2
45
30 40
tFALL 35 tD1
30
20 tRISE 25
20
4 6 8 10 12 14 16 18
10
–55 –35 –15 5 25 45 65 85 105 125 VDD (V)
Temperature (˚C)

FIGURE 2-3: Rise and Fall Times vs. FIGURE 2-6: Propagation Delay Time vs.
Temperature. Supply Voltage.

 2006-2014 Microchip Technology Inc. DS20001422G-page 5

TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V  VDD  18V.

60 45
CLOAD = 1000 pF CLOAD = 1000 pF
55
Propagation Delay (nsec)

VDD = 12V 40 VIN = 5V

50

Delay Time (nsec)

VDD = 18V
45 tD2 35 tD2
40 30
35
25
30
tD1
25 20 tD1
20
15
15
10 10
0 1 2 3 4 5 6 7 8 9 10 11 12 -55 -35 -15 5 25 45 65 85 105 125
Input Amplitude (V) Temperature (ºC)

FIGURE 2-7: Propagation Delay Time vs. FIGURE 2-10: Propagation Delay Time vs.
Input Amplitude. Temperature.

4.0
V DD = 18V

3.5
IQUIESCENT (mA)

Both Inputs = 1

IQUIESCENT (mA)
1 3.0
Both Inputs = 1

2.5
Both Inputs = 0

0.1 2.0
4 6 8 10 12 14 16 18 –55 –35 –15 5 25 45 65 85 105 125
VDD TA (˚C)

FIGURE 2-8: Supply Current vs. Supply FIGURE 2-11: Supply Current vs.
Voltage. Temperature.

25 25

20 20
Worst Case @ TJ = +150˚C Worst Case @ TJ = +150˚C
RDS(ON) (Ω)
RDS(ON) (Ω)

15 15

Typical @ TA = +25˚C Typical @ TA = +25˚C

10 10

5 5
4 6 8 10 12 14 16 18 4 6 8 10 12 14 16 18
VDD VDD

FIGURE 2-9: Output Resistance (ROH) vs. FIGURE 2-12: Output Resistance (ROL) vs.
Supply Voltage. Supply Voltage.

DS20001422G-page 6  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V  VDD  18V.

60 60
2 MHz 1000 pF
VDD = 18V VDD = 18V
50 50 2200 pF
900 kHz
ISUPPLY (mA)

40

ISUPPLY (mA)
40
100 pF
30 600 kHz 30

20 20

10 200 kHz
10
20 kHz
0 0
100 1000 10,000 10 100 1000
CLOAD (pF) FREQUENCY (kHz)

FIGURE 2-13: Supply Current vs. FIGURE 2-16: Supply Current vs.
Capacitive Load. Frequency.

60 60
2200 pF
VDD = 12V 2 MHz VDD = 12V
50 50

40 40
ISUPPLY (mA)

ISUPPLY (mA)
1000 pF

30 30
900 kHz
20 20 100 pF
600 kHz

10 10
200 kHz
20 kHz
0 0
100 1000 10,000 10 100 1000
CLOAD (pF) FREQUENCY (kHz)

FIGURE 2-14: Supply Current vs. FIGURE 2-17: Supply Current vs.
Capacitive Load. Frequency.

60 60
VDD = 6V VDD = 6V
50 50
ISUPPLY (mA)

40
ISUPPLY (mA)

40

30 30 2200 pF
2 MHz

20 20 1000 pF
900 kHz
10 600 kHz 10 100 pF
200 kHz
20 kHz
0 0
100 1000 10,000 10 100 1000
CLOAD (pF) FREQUENCY (kHz)

FIGURE 2-15: Supply Current vs. FIGURE 2-18: Supply Current vs.
Capacitive Load. Frequency.

 2006-2014 Microchip Technology Inc. DS20001422G-page 7

TC4426/TC4427/TC4428
Note: Unless otherwise indicated, TA = +25ºC with 4.5V  VDD  18V.

–8
10
9
8
7
6
5
A • sec

–9
10
4 6 8 10 12 14 16 18
VDD

Note: The values on this graph represent the loss

seen by both drivers in a package during one
complete cycle. For a single driver, divide the
stated values by 2. For a single transition of a
single driver, divide the stated value by 4.

FIGURE 2-19: Crossover Energy vs.

Supply Voltage.

DS20001422G-page 8  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE ( 1)

8-Pin PDIP/ 8-Pin
Symbol Description
MSOP/SOIC DFN-S
1 1 NC No connection
2 2 IN A Input A
3 3 GND Ground
4 4 IN B Input B
5 5 OUT B Output B
6 6 VDD Supply input
7 7 OUT A Output A
8 8 NC No connection
— PAD NC Exposed Metal Pad
Note 1: Duplicate pins must be connected for proper operation.

3.1 Inputs A and B 3.4 Supply Input (VDD)

MOSFET driver inputs A and B are high-impedance, The VDD input is the bias supply for the MOSFET driver
TTL/CMOS compatible inputs. These inputs also have and is rated for 4.5V to 18V with respect to the Ground
300 mV of hysteresis between the high and low pin. The VDD input should be bypassed with local
thresholds that prevents output glitching even when the ceramic capacitors. The value of these capacitors
rise and fall time of the input signal is very slow. should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2 Ground (GND)
3.5 Exposed Metal Pad
Ground is the device return pin. The Ground pin(s)
should have a low-impedance connection to the bias The exposed metal pad of the 6x5 DFN-S package is
supply source return. High peak current flows out the not internally connected to any potential. Therefore,
Ground pin(s) when the capacitive load is being this pad can be connected to a ground plane or other
discharged. copper plane on a Printed Circuit Board (PCB), to aid
in heat removal from the package.
3.3 Output A and B
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and pull-
up devices are of equal strength, making the rise and
fall times equivalent.

 2006-2014 Microchip Technology Inc. DS20001422G-page 9

TC4426/TC4427/TC4428
4.0 APPLICATIONS INFORMATION

+5V
90%
Input

VDD = 18V 10%

0V
tD1 tD2
tF tR
VDD
4.7 µF 0.1 µF 90% 90%
Output
6
10% 10%
2 7 0V
Input Output
Inverting Driver
CL = 1000 pF
4
5
+5V
90%
Input

10%
3 0V
VDD 90%
tD1 90% tD2
Input: 100 kHz, Output tR tF
square wave,
tRISE = tFALL  10 ns 0V 10% 10%

Non-Inverting Driver

FIGURE 4-1: Switching Time Test Circuit.

DS20001422G-page 10  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
5.0 PACKAGING INFORMATION

5.1 Package Marking Information

8-Lead DFN-S (6x5x0.9 mm) Example

TC4426
EMF^^

1315
256
NNN

PIN 1 PIN 1
8-Lead MSOP (3x3 mm) Example

4426C
315256

8-Lead PDIP (300 mil) Example

XXXXXXXX TC4427
XXXXXNNN CPA^^NNN
1315
YYWW

8-Lead SOIC (150 mil) Example

TC4428C
OA^^YYWW
NNN 256

Legend: XX...X Customer specific information*

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
* Standard device marking consists of Microchip part number, year code, week code and traceability code.

 2006-2014 Microchip Technology Inc. DS20001422G-page 11

TC4426/TC4427/TC4428


 

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D e
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N N

E E2

EXPOSED PAD

NOTE 1 1 NOTE 1
1 2 2
D2

TOP VIEW BOTTOM VIEW

A3 A1

NOTE 2

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DS20001422G-page 12  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428

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 2006-2014 Microchip Technology Inc. DS20001422G-page 13

TC4426/TC4427/TC4428

8$
1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

DS20001422G-page 14  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428

UA
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

 2006-2014 Microchip Technology Inc. DS20001422G-page 15

TC4426/TC4427/TC4428

8-Lead Plastic Micro Small Outline Package (UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

DS20001422G-page 16  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428

/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@

1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

D A
N B

E1

NOTE 1
1 2
TOP VIEW

C A A2

3/$1(
L c
A1

e eB
8X b1
8X b
.010 C

SIDE VIEW END VIEW

Microchip Technology Drawing No. C04-018D Sheet 1 of 2

 2006-2014 Microchip Technology Inc. DS20001422G-page 17

TC4426/TC4427/TC4428

/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@

1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

ALTERNATE LEAD DESIGN

(VENDOR DEPENDENT)

DATUM A DATUM A

b b
e e
2 2

e e

Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 - -
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB - - .430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-018D Sheet 2 of 2

DS20001422G-page 18  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

 2006-2014 Microchip Technology Inc. DS20001422G-page 19

TC4426/TC4427/TC4428

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
[Link]

DS20001422G-page 20  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428


 "

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 2006-2014 Microchip Technology Inc. DS20001422G-page 21

TC4426/TC4427/TC4428
NOTES:

DS20001422G-page 22  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
APPENDIX A: REVISION HISTORY

Revision G (July 2014)

The following is the list of modifications:
1. Updated the Functional Block Diagram.

Revision F (September 2013)

The following is the list of modifications:
2. Updated the Electrostatic Discharge (ESD)
rating to 2kV in the Features section.
3. Updated the package drawings in Section 5.0
“Packaging Information”.
4. Minor typographical and editorial corrections.

Revisions E (December 2012)

• Added a note to each package outline drawing.

 2006-2014 Microchip Technology Inc. DS20001422G-page 23

TC4426/TC4427/TC4428
NOTES:

DS20001422G-page 24  2006-2014 Microchip Technology Inc.

 TC4426/TC4427/TC4428
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X XX XXX X Examples:

a) TC4426COA: 1.5A Dual Inverting
Device Temperature Package Tape & Reel PB Free
MOSFET driver,
Range
0°C to +70°C
SOIC package.
Device: TC4426: 1.5A Dual MOSFET Driver, Inverting b) TC4426EUA: 1.5A Dual Inverting
TC4427: 1.5A Dual MOSFET Driver, Non-Inverting MOSFET driver,
TC4428: 1.5A Dual MOSFET Driver, Complementary -40°C to +85°C.
MSOP package.
Temperature Range: C = 0°C to +70°C (PDIP and SOIC only) c) TC4426EMF: 1.5A Dual Inverting
E = -40°C to +85°C MOSFET driver,
V = -40°C to +125°C -40°C to +85°C,
DFN-S package.
Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead a) TC4427CPA: 1.5A Dual Non-Inverting
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
MOSFET driver,
(Tape and Reel)
OA = Plastic SOIC, (150 mil Body), 8-lead 0°C to +70°C
OA713 = Plastic SOIC, (150 mil Body), 8-lead PDIP package.
(Tape and Reel) b) TC4427EPA: 1.5A Dual Non-Inverting
PA = Plastic DIP (300 mil Body), 8-lead
MOSFET driver,
UA = Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead -40°C to +85°C
(Tape and Reel) PDIP package.
a) TC4428COA713:1.5A Dual Complementary
MOSFET driver,
0°C to +70°C,
SOIC package,
Tape and Reel.
b) TC4428EMF: 1.5A Dual Complementary,
MOSFET driver,
-40°C to +85°C
DFN-S package.

 2006-2014 Microchip Technology Inc. DS20001422G-page 25

TC4426/TC4427/TC4428
NOTES:

DS20001422G-page 26  2006-2014 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC,
and may be superseded by updates. It is your responsibility to
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
ensure that your application meets with your specifications.
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
MICROCHIP MAKES NO REPRESENTATIONS OR
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
SST, SST Logo, SuperFlash and UNI/O are registered
IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the
OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries.
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are
FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated
arising from this information and its use. Use of Microchip in the U.S.A.
devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, [Link], ECAN, In-Circuit
hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
conveyed, implicitly or otherwise, under any Microchip MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
intellectual property rights. Generation, PICDEM, [Link], PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2006-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN:978-1-63276-371-6

QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures

== ISO/TS 16949 ==
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2006-2014 Microchip Technology Inc. DS20001422G-page 27

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03/25/14
Fax: 86-756-3210049

DS20001422G-page 28  2006-2014 Microchip Technology Inc.