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Hiperfet Power Mosfets

This document provides specifications for N-channel enhancement mode power MOSFETs. It lists maximum ratings, characteristic values, and features for the IXFH and IXFM product families. These include low RDS(on), fast switching speeds, rugged construction, and standard packaging options.
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© All Rights Reserved
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0% found this document useful (0 votes)
39 views4 pages

Hiperfet Power Mosfets

This document provides specifications for N-channel enhancement mode power MOSFETs. It lists maximum ratings, characteristic values, and features for the IXFH and IXFM product families. These include low RDS(on), fast switching speeds, rugged construction, and standard packaging options.
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

HiPerFETTM VDSS ID25 RDS(on)

Power MOSFETs IXFH/IXFM 35 N30 300 V 35 A 100 mW


IXFH 40 N30 300 V 40 A 85 mW
IXFM 40 N30 300 V 40 A 88 mW
N-Channel Enhancement Mode
High dv/dt, Low trr, HDMOSTM Family trr £ 200 ns

Symbol Test Conditions Maximum Ratings TO-247 AD (IXFH)

VDSS TJ = 25°C to 150°C 300 V


VDGR TJ = 25°C to 150°C; RGS = 1 MW 300 V (TAB)
VGS Continuous ±20 V
VGSM Transient ±30 V
ID25 TC = 25°C 35N30 35 A
40N30 40 A TO-204 AE (IXFM)

IDM TC = 25°C, pulse width limited by TJM 35N30 140 A


40N30 160 A
IAR TC = 25°C 35N30 35 A
G
40N30 40 A D

EAR TC = 25°C 30 mJ G = Gate, D = Drain,


S = Source, TAB = Drain
dv/dt IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS, 5 V/ns
TJ £ 150°C, RG = 2 W
PD TC = 25°C 300 W
Features
TJ -55 ... +150 °C
TJM 150 °C • International standard packages
• Low RDS (on) HDMOSTM process
Tstg -55 ... +150 °C • Rugged polysilicon gate cell structure
TL 1.6 mm (0.062 in.) from case for 10 s 300 °C • Unclamped Inductive Switching (UIS)
rated
Md Mounting torque 1.13/10 Nm/[Link]. • Low package inductance
- easy to drive and to protect
Weight TO-204 = 18 g, TO-247 = 6 g • Fast intrinsic Rectifier

Applications
Symbol Test Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified) • DC-DC converters
min. typ. max. • Synchronous rectification
• Battery chargers
VDSS VGS = 0 V, ID = 250 mA 300 V • Switched-mode and resonant-mode
power supplies
VGS(th) VDS = VGS, ID = 4 mA 2 4 V • DC choppers
• AC motor control
IGSS VGS = ±20 VDC, VDS = 0 ±100 nA • Temperature and lighting controls
• Low voltage relays
IDSS VDS = 0.8 • VDSS TJ = 25°C 200 mA
VGS = 0 V TJ = 125°C 1 mA Advantages
RDS(on) VGS = 10 V, ID = 0.5 ID25 35N30 0.100 W • Easy to mount with 1 screw (TO-247)
FH40N30 0.085 W (isolated mounting screw hole)
FM40N30 0.088 W • Space savings
Pulse test, t £ 300 ms, duty cycle d £ 2 % • High power density

IXYS reserves the right to change limits, test conditions, and dimensions. 91523F (07/00)

© 2000 IXYS All rights reserved 1-4


IXFH 35N30 IXFH 40N30
IXFM 35N30 IXFM 40N30

Symbol Test Conditions Characteristic Values TO-247 AD (IXFH) Outline


(TJ = 25°C, unless otherwise specified)
min. typ. max.

gfs VDS = 10 V; ID = 0.5 ID25, pulse test 22 25 S

C iss 4800 pF
Coss VGS = 0 V, VDS = 25 V, f = 1 MHz 745 pF
C rss 280 pF

td(on) 20 30 ns
tr VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 60 90 ns
td(off) RG = 2 W (External) 75 100 ns Dim. Millimeter Inches
Min. Max. Min. Max.
tf 45 90 ns A 19.81 20.32 0.780 0.800
B 20.80 21.46 0.819 0.845
Qg(on) 177 200 nC C 15.75 16.26 0.610 0.640
Qgs VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 ID25 28 50 nC D 3.55 3.65 0.140 0.144
E 4.32 5.49 0.170 0.216
Qgd 78 105 nC F 5.4 6.2 0.212 0.244
G 1.65 2.13 0.065 0.084
RthJC 0.42 K/W H - 4.5 - 0.177
RthCK 0.25 K/W J 1.0 1.4 0.040 0.055
K 10.8 11.0 0.426 0.433
L 4.7 5.3 0.185 0.209
M 0.4 0.8 0.016 0.031
Source-Drain Diode Characteristic Values N 1.5 2.49 0.087 0.102
(TJ = 25°C, unless otherwise specified)
Symbol Test Conditions min. typ. max. TO-204 AE (IXFM) Outline

IS VGS = 0 V 35N30 35 A
40N30 40 A

ISM Repetitive; 35N30 140 A


pulse width limited by TJM 40N30 160 A

VSD IF = IS, VGS = 0 V, 1.5 V


Pulse test, t £ 300 ms, duty cycle d £ 2 %

t rr IF = IS, -di/dt = 100 A/ms, TJ = 25°C 200 ns


VR = 100 V TJ = 125°C 350 ns Dim. Millimeter Inches
Min. Max. Min. Max.
A 38.61 39.12 1.520 1.540
B - 22.22 - 0.875
C 6.40 11.40 0.252 0.449
D 1.45 1.60 0.057 0.063
E 1.52 3.43 0.060 0.135
F 30.15 BSC 1.187 BSC
G 10.67 11.17 0.420 0.440
H 5.21 5.71 0.205 0.225
J 16.64 17.14 0.655 0.675
K 11.18 12.19 0.440 0.480
Q 3.84 4.19 0.151 0.165
R 25.16 26.66 0.991 1.050

IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
© 2000 IXYS All rights reserved 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 2-4
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025
IXFH 35N30 IXFH 40N30
IXFM 35N30 IXFM 40N30

© 2000 IXYS All rights reserved 3-4


IXFH 35N30 IXFH 40N30
IXFM 35N30 IXFM 40N30

Fig.7 Gate Charge Characteristic Curve Fig.8 Forward Bias Safe Operating Area

10
10µs
VDS = 150V
100 Limited by RDS(on)
8 ID = 21A
IG = 10mA
100µs

ID - Amperes
VGE - Volts

1ms
10
4

10ms
2

100ms
0 1
0 25 50 75 100 125 150 175 200 1 10 100 300

Gate Charge - nCoulombs VDS - Volts

Fig.9 Capacitance Curves Fig.10 Source Current vs. Source


80
4500 Ciss
70
4000
3500 60
Capacitance - pF

ID - Amperes

f = 1 MHz
3000 50
VDS = 25V
2500 40
TJ = 125°C
2000
30
1500 TJ = 25°C
Coss 20
1000
Crss 10
500
0 0
0 5 10 15 20 25 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

Vds - Volts VSD - Volts

Fig.11 Transient Thermal Impedance

1
Thermal Response - K/W

D=0.5
0.1
D=0.2
D=0.1
D=0.05

0.01 D=0.02
D=0.01

Single Pulse

0.001
0.00001 0.0001 0.001 0.01 0.1 1 10

Time - Seconds

© 2000 IXYS All rights reserved 4-4

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