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VLSI Modeling and Design Course Guide

This document provides information about a course on VLSI modeling and design. It includes: - The course staff, which lists the instructor, teaching assistant, and their contact information. - The course textbook and reference books. - An outline of the course topics, which include VLSI implementation strategies, MOSFET characteristics, delay models, power consumption, testing and verification. - Details about the course work, which includes labs, a project, midterm, final exam and the design tools to be used.

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Ashar Asif
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0% found this document useful (0 votes)
20 views27 pages

VLSI Modeling and Design Course Guide

This document provides information about a course on VLSI modeling and design. It includes: - The course staff, which lists the instructor, teaching assistant, and their contact information. - The course textbook and reference books. - An outline of the course topics, which include VLSI implementation strategies, MOSFET characteristics, delay models, power consumption, testing and verification. - Details about the course work, which includes labs, a project, midterm, final exam and the design tools to be used.

Uploaded by

Ashar Asif
Copyright
© All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

VLSI MODELING AND

DESIGN
Dr. Mohammed M. Farag
FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Course Staff
 Instructor:
 Mohammed Morsy (mmorsy@[Link])
 4th Floor ECE Building

 TA:
 Eng. Mohamed Megahed
 Office hours :
 Saturday 10:30 AM – 12:00 PM.
 Course Webpage:
 [Link]
e/EE432_VLSI_Modeling_and_Design/[Link]
EE 432 VLSI Modeling and Design 2
FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Course Text
 Textbook
 “CMOS VLSI Design 4th ed.” Harris, David, and N.
Weste., (2010).
 Reference books
 “Introduction to VLSI circuits and systems.” Uyemura,
John P. ,(2002).
 “Digital integrated circuits 2nd ed.” Rabaey, Jan M.,
Anantha P. Chandrakasan, and Borivoje Nikolic., (2002).

EE 432 VLSI Modeling and Design 3


FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Course Outline
 VLSI Implementation Strategies.
 MOSFET non ideal characteristics.
 Delay models and logical effort.
 Power consumption and low-power design
considerations.
 Interconnect modeling, impact, and engineering.
 Robustness:Variability, Reliability, and Scaling.
 Design Methodologies and Tools.
 Testing, Debugging, and Verification.

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Course Work
 4 Labs: 20
 1 Project: 15
 Midterm exam: 15
 Final Exam: 75
 Tools:
 Electric
[Link]
 Tanner L-edit [Link]

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

About the Lectures


 Lectures will make use of slides
 Slides are great !
 Nice pictures to explain concepts
 Good addition for course text
 I can annotate them with a tablet PC
 I can switch to the tools and listings mid-lecture
 Slides are horrible !
 They make me teach 30% faster (really)
 They give you the sense that this is all easy stuff (it's not)
 They make you fall a sleep
 They make me lazy
 They make me waste time looking for clipart
 Slides are a two-edged sword
 I encourage you to be active and take notes
 I may fall back to blackboard-based teaching occasionally

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

History of VLSI

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

The Integrated Circuit


 1959: Jack Kilby, working at TI, invented a monolithic
“integrated circuit”
 Components connected by hand-soldered wires and
isolated by “shaping”, PN-diodes used as resistors (U.S.
Patent 3,138,743)

Figure 0.1 Diagram from patent application

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Integrated Circuits
 1961: TI and Fairchild introduced the first logic ICs ($50 in quantity)
 1962: RCA developed the first MOS transistor

Figure 0.2 Fairchild bipolar RTL Flip-Flop Figure 0.3 RCA 16-transistor MOSFET IC

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Computer-Aided Design
 1967: Fairchild developed the “Micromosaic” IC using CAD
 Final layer of interconnect could be customized for different applications

 1968: Noyce, Moore left Fairchild, started Intel

EE 432 VLSI Modeling and Design 10


FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

RAMs
 1970: Fairchild introduced 256-bit Static RAMs
 1970: Intel started selling 1K-bit Dynamic RAMs

Figure 0.4 Fairchild 4100 256-bit SRAM Figure 0.5 Intel 1103 1K-bit DRAM

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

The Microprocessor
 1971: Intel introduced the 4004
 General purpose programmable computer instead of a custom chip for a
Japanese calculator company

Figure 0.6 Intel 4004 Microprocessor

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Moore’s Law and Transistor Count

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Moor’s Law and Frequency

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Introduction

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Outline
 Introduction
 Complexity and Design
 Basic Concepts

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Introduction
 IC: Integrated Circuits, many transistors on one chip
 VLSI:Very Large Scale Integration, a modern technology
of IC design flow
 MOS: Metal-Oxide-Silicon transistor (also called device)
 CMOS: Complementary Metal Oxide Semiconductor
 Fast, cheap, low power transistors
 High integration, low cost
 n-type MOS (nMOS): Majority carriers are Electrons
 p-type MOS (pMOS): Majority carriers are Holes
 First: How to build your own simple CMOS chip
 CMOS transistors
 Building logic gates from transistors
 Transistor layout and fabrication
 Rest of the course: How to build a good CMOS chip!!
EE 432 VLSI Modeling and Design 17
FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Introduction
 The term VLSI is used to collectively refer to many
fields of electrical and computer engineering that
deal with the analysis and design of very dense ICs
 A VLSI chip contains more than 106 switching
devices or logic gates
 Early in the first decade of the 21st century, the
actual number of transistors has exceeded 108 on a
silicon die of typically 1 cm2 area

EE 432 VLSI Modeling and Design 18


FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Outline
 Introduction
 Complexity and Design
 Basic Concepts

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Complexity and Design


 Creating a design team provides
a realistic approach to
approaching a VLSI project, as it
allows each person to study small
sections of the system
 VLSI project needs hundreds of
engineers, scientists, and
technicians
 Hierarchy design and many different
“Level Views” help to manage the
complexity
 Most work is conducted using
computer-Aided Design (CAD) Figure 1.1 The VLSI design funnel
tools

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Complexity and Design


 Design teams provide a realistic approach to develop
a VLSI chip
 The design hierarchy enables collaboration between
team members and partitioning the work into a
number of sub-tasks
 The chip is viewed at many abstraction levels from
the system specifications to the physical
implementation.

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Design Hierarchy (1/2)


 System specifications: is defined in both general
and specific terms, such as functions, speed, size,
etc.
 Abstract high-level model: contains information
on the behavior of each block and the
interaction among the blocks in the system
 Logic synthesis: To provide the logic design of
the network by specifying the primitive gates
and units needed to build each unit
 Circuit design: where transistors are used as
switches and Boolean variables are treated as
vary voltage signal
 Physical design: the network is built on a tiny
area on a slice of silicon
 Manufacturing: a completed design process is
moved on to the manufacturing line
Figure 1.2 General overview
of the design hierarchy

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Design Hierarchy (2/2)


 Hierarchical design
 Top-down design
 The initial work is quite abstract and theoretical
and there is no direct connection to silicon until
many steps have been completed
 Acceptable in modern digital system design
 Co-design with combining HW/SW is critical
 Similar to Cell-based Design Flow
 Bottom-up design
 Starts at the silicon or circuit level and builds
primitive units such as logic gates, adders, and
registers as the first steps
 Acceptable for small projects
 Similar to Full-custom Design Flow
 An example of a design hierarchy in Figure
1.3 Figure 1.3 A simple design
flow for a microprocessor

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

VLSI Chip Types


 At the engineering level, digital VLSI chips are classified by the
approach used to implement and build the circuit
 Full-custom Design: where every circuit is custom designed for the
project
 Extremely tedious
 Time-consuming process

 Application-Specific Integrated Circuits (ASICs): using an


extensive suite of CAD tools that portray the system design in terms of
standard digital logic constructs
 Including state diagrams, functions tables, and logic diagram
 Designer does not need any knowledge of the underlying electronics or the
physic of the silicon chip
 Major drawback is that all characteristics are set by the architectural design

 Semi-custom Design: between that of a full-custom and ASICs


 Using a group of primitive predefined cells as building blocks, called cell library

EE 432 VLSI Modeling and Design 24


FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Outline
 Introduction
 Complexity and Design
 Basic Concepts

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FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Basic Concepts
 VLSI Design is a system design discipline
 Many aspects can be taught without any reference to
the underlying silicon circuits
 System solutions can be generated using CAD tools
 Such an approach hides many details from the
designer
 However, many of the most powerful techniques and
ideas of VLSI reside at lower levels
 VLSI should be thought as a single discipline that
deals with the conception, design, and manufacture
of complex ICs
EE 432 VLSI Modeling and Design 26
FACULTY OF ENGINEERING - ALEXANDRIA UNIVERSITY

Basic Concepts: Geometrical Patterns


 Carver Mead of Caltech pioneered the field
in the 1970’s, a topic that the electronic
integrated circuits could be viewed as a set of
geometrical patterns on the surface of a silicon
chip
 Can achieve signal flow and data movement
by tracing the paths of the metallic “lines” that
carried electricity Figure 1.4 Micrograph of a section of
a digital CMOS integrated circuit
 Using the repeated patterns and ordered
placement of rectangular lines, polygons, and
groups of geometric patterns
 Most modern VLSI technology is based on this
important field
 Today, the most powerful topic is System-
on-Chip (SoC) that using bonding pad
technology as Figure 1.5 shows Figure 1.5 Bonding pad
frame for interfacing
EE 432 VLSI Modeling and Design 27

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