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SEMICONDUCTOR TECHNICAL DATA by MPX5050/D

 

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!"  ! OPERATING OVERVIEW
 ! INTEGRATED
PRESSURE SENSOR
The MPX5050 series piezoresistive transducer is a state–of–the–art monolithic silicon 0 to 50 kPa (0 to 7.25 psi)
pressure sensor designed for a wide range of applications, but particularly those 0.2 to 4.7 Volts Output
employing a microcontroller or microprocessor with A/D inputs. This patented, single
element transducer combines advanced micromachining techniques, thin–film metalliza-
tion, and bipolar processing to provide an accurate, high level analog output signal that
is proportional to the applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Temperature Compensated Over – 40° to +125°C BASIC CHIP CARRIER
ELEMENT
• Patented Silicon Shear Stress Strain Gauge CASE 867–08, STYLE 1
• Durable Epoxy Unibody Element
• Easy–to–Use Chip Carrier Option

VS

THIN FILM GAIN STAGE #2

X–ducer TEMPERATURE AND
1
SENSING COMPENSATION GROUND Vout
ELEMENT AND REFERENCE DIFFERENTIAL PORT OPTION
GAIN STAGE #1 SHIFT CIRCUITRY CASE 867C–05, STYLE 1

2
NOTE: Pin 1 is the notched pin.
PINS 4, 5 AND 6 ARE NO CONNECTS

GND
PIN NUMBER
1 Vout 4 N/C
Figure 1. Fully Integrated Pressure Sensor Schematic
2 Grd 5 N/C
3 VS 6 N/C
NOTE: Pins 4, 5, and 6 are internal
MAXIMUM RATINGS(1) device connections. Do not connect
Parametrics Symbol Value Unit to external circuitry or ground.

Overpressure(2) (P1 > P2) Pmax 200 kPa

Burst Pressure(2) (P1 > P2) Pburst 700 kPa
Storage Temperature Tstg – 40° to +125° °C
Operating Temperature TA – 40° to +125° °C
1. TC = 25°C unless otherwise noted.
2. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Senseon and X–ducer are trademarks of Motorola, Inc.

REV 3

Motorola Sensor Device Data 1

 Motorola, Inc. 1997

 
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure Range(1) POP 0 — 50 kPa
Supply Voltage(2) VS 4.75 5.0 5.25 Vdc
Supply Current Io — 7.0 10.0 mAdc
Minimum Pressure Offset(3) (0 to 85°C) Voff 0.088 0.20 0.313 Vdc
@ VS = 5.0 Volts
Full Scale Output(4) (0 to 85°C) VFSO 4.587 4.70 4.813 Vdc
@ VS = 5.0 Volts
Full Scale Span(5) (0 to 85°C) VFSS — 4.50 — Vdc
@ VS = 5.0 Volts
Accuracy(6) — — — "2.5 %VFSS
Sensitivity V/P — 90 — mV/kPa
Response Time(7) tR — 1.0 — mS
Output Source Current at Full Scale Output Io+ — 0.1 — mAdc
Warm–Up Time(8) — — 20 — mSec
Offset Stability(9) — — "0.5 — %VFSS
Decoupling circuit shown in Figure 4 required to meet electrical specifications.

MECHANICAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
Weight, Basic Element (Case 867) — — 4.0 — Grams
Common Mode Line Pressure(10) — — — 690 kPa
NOTES:
1. 1.0kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
10. Common mode pressures beyond what is specified may result in leakage at the case–to–lead interface.

2 Motorola Sensor Device Data

 
 
Figure 3 illustrates the Differential/Gauge Sensing Chip in formation regarding media compatibility in your application.
the basic chip carrier (Case 867). A fluorosilicone gel isolates Figure 4 shows a typical decoupling circuit for interfacing
the die surface and wire bonds from the environment, while the integrated sensor to the A/D input of a microprocessor.
allowing the pressure signal to be transmitted to the sensor Proper decoupling of the power supply is recommended.
diaphragm. Figure 2 shows the sensor output signal relative to pres-
The MPX5050 series pressure sensor operating charac- sure input. Typical, minimum, and maximum output curves
teristics, and internal reliability and qualification tests are are shown for operation over a temperature range of 0° to
based on use of dry air as the pressure media. Media, other 85°C using the decoupling circuit below. (The output will sat-
than dry air, may have adverse effects on sensor perfor- urate outside of the specified pressure range.)
mance and long–term reliability. Contact the factory for in-

5.0
TRANSFER FUNCTION:
4.5 Vout = VS*(0.018*P+0.04) ± ERROR
4.0 VS = 5.0 Vdc
TEMP = 0 to 85°C
3.5
OUTPUT (V)

3.0
TYPICAL
2.5
2.0
MAX MIN
1.5
1.0
0.5
0
0 5 10 15 20 25 30 35 40 45 50 55
DIFFERENTIAL PRESSURE (kPa)

Figure 2. Output versus Pressure Differential

MPX5050
FLUORO SILICONE STAINLESS STEEL OUPUT A/D
DIE

ÉÉÉÉÉÉÉÉÉÉÉ
GEL DIE COAT METAL COVER (PIN 1)
P1

ÉÉÉÉÉÉÉÉÉÉÉ
EPOXY
WIRE BOND 50 pF 51 k
PLASTIC µ PROCESSOR

ÉÉÉÉÉÉÉÉÉÉÉ
CASE

LEAD FRAMEÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉ
DIFFERENTIAL/GAUGE ELEMENT
DIE
BOND
P2

Figure 3. Cross–Sectional Diagram Figure 4. Typical Decoupling Filter for Sensor to

(Not to Scale) Microprocessor Interface

Motorola Sensor Device Data 3


 
Transfer Function
Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04)
+/– (Pressure Error x Temp. Factor x 0.018 x VS)
VS = 5.0 V ± 0.25 Vdc

Temperature Error Band

MPX5050D Series

4.0
Temp Multiplier
3.0
– 40 3
Temperature 0 to 85 1
Error 2.0 +125 3
Factor

1.0

0.0
–40 –20 0 20 40 60 80 100 120 140

Temperature in °C

NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.

Pressure Error Band

Error Limits for Pressure

3.0

2.0
Pressure Error (kPa)

1.0

0.0 Pressure (in kPa)

0 10 20 30 40 50 60
–1.0

– 2.0

– 3.0 Pressure Error (Max)

0 to 50 kPa ± 1.25 kPa

4 Motorola Sensor Device Data

 
 
PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor pressure sensor is designed to operate with positive differen-
as the Pressure (P1) side and the Vacuum (P2) side. The tial pressure applied, P1 > P2.
Pressure (P1) side is the side containing fluorosilicone gel The Pressure (P1) side may be identified by using the
which protects the die from harsh media. The Motorola MPX table below:

Pressure (P1)
Part Number Case Type Side Identifier
MPX5050D 867–08 Stainless Steel Cap
MPX5050DP 867C–05 Side with Part Marking
MPX5050GP 867B–04 Side with Port Attached
MPX5050GVP 867D–04 Stainless Steel Cap
MPX5050GS 867E–03 Side with Port Attached
MPX5050GVS 867A–04 Stainless Steel Cap
MPX5050GSX 867F–03 Side with Port Attached
MPX5050GVSX 867G–03 Stainless Steel Cap

ORDERING INFORMATION
The MPX5050 pressure sensor is available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pressure
connections.
MPX Series
D i T
Device Type O i
Options C
Case Type
T Order Number Device Marking

Basic Element Differential 867–08 MPX5050D MPX5050D

Ported Elements Differential Dual Ports 867C–05 MPX5050DP MPX5050DP
Gauge 867B–04 MPX5050GP MPX5050GP
Gauge Vacuum Port 867D–04 MPX5050GVP MPX5050GVP
Gauge, Axial 867E–03 MPX5050GS MPX5050D
Gauge Vacuum Axial 867A–04 MPX5050GVS MPX5050D
Gauge, Axial PC Mount 867F–03 MPX5050GSX MPX5050D
Gauge Vacuum Axial PC Mount 867G–03 MPX5050GVSX MPX5050D

Motorola Sensor Device Data 5


 
PACKAGE DIMENSIONS

C
R NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
POSITIVE PRESSURE
(P1) Y14.5M, 1982.
M 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
B –A– 16.00 (0.630).

INCHES MILLIMETERS
N DIM MIN MAX MIN MAX
PIN 1
L A 0.595 0.630 15.11 16.00
1 2 3 4 5 6
B 0.514 0.534 13.06 13.56
SEATING –T–
PLANE C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
J G G 0.100 BSC 2.54 BSC
S F J 0.014 0.016 0.36 0.40
D 6 PL L 0.695 0.725 17.65 18.42
M 30 _NOM 30 _NOM
0.136 (0.005) M T A M
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66

STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
CASE 867–08 5. V2
6. VEX
ISSUE N

BASIC ELEMENT (D)

C A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
POSITIVE 2. CONTROLLING DIMENSION: INCH.
PRESSURE
(P1) INCHES MILLIMETERS
–B– V DIM MIN MAX MIN MAX
A 0.690 0.720 17.53 18.28
B 0.245 0.255 6.22 6.48
PIN 1 C 0.780 0.820 19.81 20.82
D 0.027 0.033 0.69 0.84
PORT #2 E 0.178 0.186 4.52 4.72
VACUUM 1 2 3 4 5 6 F 0.048 0.064 1.22 1.63
(P2)
K G 0.100 BSC 2.54 BSC
S J 0.014 0.016 0.36 0.41
K 0.345 0.375 8.76 9.53
N 0.300 0.310 7.62 7.87
J G S 0.220 0.240 5.59 6.10
V 0.182 0.194 4.62 4.93
N E F
D 6 PL
STYLE 1:
–T– 0.13 (0.005) M T B M PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867A–04
ISSUE E

VACUUM SIDE PORTED (GVS)

6 Motorola Sensor Device Data

 
 
PACKAGE DIMENSIONS–CONTINUED

A NOTES:
–T– SEATING
PLANE U 1. DIMENSIONING AND TOLERANCING PER ANSI
PORT #1 Y14.5M, 1982.
L POSITIVE
PRESSURE (P1) 2. CONTROLLING DIMENSION: INCH.
R
V INCHES MILLIMETERS
DIM MIN MAX MIN MAX
–Q– A 1.145 1.175 29.08 29.85
N B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
B K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
K P 0.153 0.159 3.89 4.04
1 2 3 4 5 6 Q 0.153 0.159 3.89 4.04
PIN 1 R 0.230 0.250 5.84 6.35
S S 0.220 0.240 5.59 6.10
C –P– U 0.910 BSC 23.11 BSC
G D 6 PL V 0.182 0.194 4.62 4.93
0.25 (0.010) M T Q M
F
J 0.13 (0.005) M T P S Q S STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
CASE 867B–04 5. V2
6. VEX
ISSUE E

PRESSURE SIDE PORTED (GP)

NOTES:
P 1. DIMENSIONING AND TOLERANCING PER ANSI
–A– Y14.5M, 1982.
0.25 (0.010) M T Q M 2. CONTROLLING DIMENSION: INCH.
U
X INCHES MILLIMETERS
W L DIM MIN MAX MIN MAX
R
V A 1.145 1.175 29.08 29.85
PORT #1 PORT #2 VACUUM (P2) B 0.685 0.715 17.40 18.16
POSITIVE C 0.405 0.435 10.29 11.05
PRESSURE PORT #1 POSITIVE D 0.027 0.033 0.68 0.84
(P1) N PRESSURE (P1) F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
PORT #2 –Q– J 0.014 0.016 0.36 0.41
VACUUM K 0.695 0.725 17.65 18.42
(P2)
L 0.290 0.300 7.37 7.62
B N 0.420 0.440 10.67 11.18
PIN 1 P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
1 2 3 4 5 6
K S 0.220 0.240 5.59 6.10
U 0.910 BSC 23.11 BSC
C
S V 0.182 0.194 4.62 4.93
W 0.310 0.330 7.87 8.38
SEATING –T– –T– SEATING X 0.248 0.278 6.30 7.06
PLANE PLANE G D 6 PL
J F STYLE 1:
0.13 (0.005) M A M
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
CASE 867C–05 5. V2
6. VEX
ISSUE F

PRESSURE AND VACUUM SIDES PORTED (DP)

Motorola Sensor Device Data 7


 
PACKAGE DIMENSIONS–CONTINUED

–P–
0.25 (0.010) M T Q M NOTES:
A 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
U 2. CONTROLLING DIMENSION: INCH.
SEATING PORT #2
–T– PLANE
L VACUUM (P2) INCHES MILLIMETERS
V DIM MIN MAX MIN MAX
R POSITIVE PRESSURE (P1) A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
–Q– C 0.305 0.325 7.75 8.26
N D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
B PIN 1
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
1 2 3 4 5 6
K R 0.230 0.250 5.84 6.35
S 0.220 0.240 5.59 6.10
S U 0.910 BSC 23.11 BSC
V 0.182 0.194 4.62 4.93
C G
D 6 PL STYLE 1:
J
F PIN 1. VOUT
0.13 (0.005) M T P S Q S 2. GROUND
3. VCC
4. V1
5. V2
CASE 867D–04 6. VEX
ISSUE F
VACUUM SIDE PORTED (GVP)

NOTES:
C A 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.690 0.720 17.53 18.28
–B– V B 0.245 0.255 6.22 6.48
PIN 1 C 0.780 0.820 19.81 20.82
D 0.027 0.033 0.69 0.84
E 0.178 0.186 4.52 4.72
F 0.048 0.064 1.22 1.63
PORT #1 6 5 4 3 2 1 G 0.100 BSC 2.54 BSC
POSITIVE J 0.014 0.016 0.36 0.41
PRESSURE
(P1) K K 0.345 0.375 8.76 9.53
S N 0.300 0.310 7.62 7.87
S 0.220 0.240 5.59 6.10
V 0.182 0.194 4.62 4.93
J G
N E F STYLE 1:
D 6 PL PIN 1. VOUT
2. GROUND
–T– 0.13 (0.005) M T B M 3. VCC
4. V1
5. V2
6. VEX

CASE 867E–03
ISSUE D

PRESSURE SIDE PORTED (AS, GS)

8 Motorola Sensor Device Data

 
 
PACKAGE DIMENSIONS–CONTINUED

–T–
NOTES:
C A 1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
E U –Q– 2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.080 1.120 27.43 28.45
B 0.740 0.760 18.80 19.30
C 0.630 0.650 16.00 16.51
N D 0.027 0.033 0.68 0.84
V B E 0.160 0.180 4.06 4.57
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
R J 0.014 0.016 0.36 0.41
PORT #1 PIN 1 K 0.220 0.240 5.59 6.10
POSITIVE N 0.070 0.080 1.78 2.03
PRESSURE –P–
(P1) P 0.150 0.160 3.81 4.06
0.25 (0.010) M T Q M 6 5 4 3 2 1
Q 0.150 0.160 3.81 4.06
S R 0.440 0.460 11.18 11.68
S 0.695 0.725 17.65 18.42
K U 0.840 0.860 21.34 21.84
V 0.182 0.194 4.62 4.93
J D 6 PL
G STYLE 1:
0.13 (0.005) M T P S Q S PIN 1. VOUT
2. GROUND
F 3. VCC
4. V1
5. V2
6. VEX

CASE 867F–03
ISSUE D

PRESSURE SIDE PORTED (GSX)

–T– NOTES:
C 1. DIMENSIONING AND TOLERANCING PER
A ANSI Y14.5M, 1982.
E U –Q– 2. CONTROLLING DIMENSION: INCH.

INCHES MILLIMETERS
DIM MIN MAX MIN MAX
POSITIVE A 1.080 1.120 27.43 28.45
PRESSURE B 0.740 0.760 18.80 19.30
(P1) C 0.630 0.650 16.00 16.51
D 0.027 0.033 0.68 0.84
N
V B
E 0.160 0.180 4.06 4.57
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
R J 0.014 0.016 0.36 0.41
K 0.220 0.240 5.59 6.10
PORT #2
VACUUM PIN 1 N 0.070 0.080 1.78 2.03
(P2) –P– P 0.150 0.160 3.81 4.06
0.25 (0.010) M T Q M 1 2 3 4 5 6 Q 0.150 0.160 3.81 4.06
S R 0.440 0.460 11.18 11.68
S 0.695 0.725 17.65 18.42
K U 0.840 0.860 21.34 21.84
V 0.182 0.194 4.62 4.93
J D 6 PL STYLE 1:
G
0.13 (0.005) M T P S Q S PIN 1. VOUT
2. GROUND
3. VCC
F 4. V1
5. V2
6. VEX

CASE 867G–03
ISSUE D

VACUUM SIDE PORTED (GVSX)

Motorola Sensor Device Data 9


 

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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10 ◊ Motorola Sensor DeviceMPX5050/D

Data