6.70. In the semiconductor industry, the production of 6.71. Consider the situation described in Exercise 6.70.
A
microcircuits involves many steps. The wafer fabri- critical dimension (measured in mm) is of interest to
cation process typically builds these microcircuits on the process engineer. Suppose that five fixed posi-
silicon wafers, and there are many microcircuits per tions are used on each wafer (position 1 is the center)
wafer. Each production lot consists of between 16 and that two consecutive wafers are selected from
and 48 wafers. Some processing steps treat each each batch. The data that result from several batches
wafer separately, so that the batch size for that step is are shown in Table 6E.32.
one wafer. It is usually necessary to estimate several
(a) What can you say about overall process capa-
components of variation: within-wafer, between-
bility?
wafer, between-lot, and the total variation.
(b) Can you construct control charts that allow within-
(a) Suppose that one wafer is randomly selected
wafer variability to be evaluated?
from each lot and that a single measurement on a
(c) What control charts would you establish to eval-
critical dimension of interest is taken. Which
uate variability between wafers? Set up these
components of variation could be estimated with
charts and use them to draw conclusions about
these data? What type of control charts would
the process.
you recommend?
(d) What control charts would you use to evaluate lot-
(b) Suppose that each wafer is tested at five fixed
to-lot variability? Set up these charts and use them
locations (say, the center and four points at the
to draw conclusions about lot-to-lot variability.
circumference). The average and range of these
within-wafer measurements are xww and Rww,
respectively. What components of variability are
estimated using control charts based on these
data?
(c) Suppose that one measurement point on each
wafer is selected and that this measurement is
recorded for five consecutive wafers. The average
and range of these between-wafer measure-
ments are xBW and RBW, respectively. What com-
ponents of variability are estimated using control
charts based on these data? Would it be neces-
sary to run separate x and R charts for all five
locations on the wafer?
(d) Consider the question in part (c). How would
your answer change if the test sites on each
wafer were randomly selected and varied from
wafer to wafer?
(e) What type of control charts and rational sub-
group scheme would you recommend to control
the batch-to-batch variability?
■ TA B L E 6 E . 3 2
Data for Exercise 6.71
Position Position
Lot Wafer Lot Wafer
Number Number 1 2 3 4 5 Number Number 1 2 3 4 5
1 1 2.15 2.13 2.08 2.12 2.10 11 1 2.15 2.13 2.14 2.09 2.08
2 2.13 2.10 2.04 2.08 2.05 2 2.11 2.13 2.10 2.14 2.10
2 1 2.02 2.01 2.06 2.05 2.08 12 1 2.03 2.06 2.05 2.01 2.00
2 2.03 2.09 2.07 2.06 2.04 2 2.04 2.08 2.03 2.10 2.07
3 1 2.13 2.12 2.10 2.11 2.08 13 1 2.05 2.03 2.05 2.09 2.08
2 2.03 2.08 2.03 2.09 2.07 2 2.08 2.01 2.03 2.04 2.10
4 1 2.04 2.01 2.10 2.11 2.09 14 1 2.08 2.04 2.05 2.01 2.08
2 2.07 2.14 2.12 2.08 2.09 2 2.09 2.11 2.06 2.04 2.05
5 1 2.16 2.17 2.13 2.18 2.10 15 1 2.14 2.13 2.10 2.10 2.08
2 2.17 2.13 2.10 2.09 2.13 2 2.13 2.10 2.09 2.13 2.15
6 1 2.04 2.06 1.97 2.10 2.08 16 1 2.06 2.08 2.05 2.03 2.09
2 2.03 2.10 2.05 2.07 2.04 2 2.03 2.01 1.99 2.06 2.05
7 1 2.04 2.02 2.01 2.00 2.05 17 1 2.05 2.03 2.08 2.01 2.04
2 2.06 2.04 2.03 2.08 2.10 2 2.06 2.05 2.03 2.05 2.00
8 1 2.13 2.10 2.10 2.15 2.13 18 1 2.03 2.08 2.04 2.00 2.03
2 2.10 2.09 2.13 2.14 2.11 2 2.04 2.03 2.05 2.01 2.04
9 1 1.95 2.03 2.08 2.07 2.08 19 1 2.16 2.13 2.10 2.13 2.12
2 2.01 2.03 2.06 2.05 2.04 2 2.13 2.15 2.18 2.19 2.13
10 1 2.04 2.08 2.09 2.10 2.01 20 1 2.06 2.03 2.04 2.09 2.10
2 2.06 2.04 2.07 2.04 2.01 2 2.01 1.98 2.05 2.08 2.06