Purpose: The solder mask design, with respect to the vias, can dramatically effect the reliability and
manufacturability of the
PWBA. This document discusses the pros and cons of the various options.
Option Primary LPI Solder Mask Vias Not Button Print Plugged Via Active Pad Plating Vias Shut
Tenting Vias Covered
Description
No apertures are supplied on Vias are Vias tented one Vias are plugged Vias are plugged Vias are specified to be
mask data layer. Mask covers exposed. side by a with mask or other with a conductive plated shut with
via pads and tents hole. No Surface finish is secondary solder non conductive or non-conductive electrolytic copper.
surface finish is applied to via applied to via mask application. media. LPI mask is media, planarized
barrel. Possible entrapment. barrel. Surface finish is applied over plug. and plated over.
applied to via barrel No surface finish is
prior to button print. applied to via barrel.
History In the past, tenting of vias with Standard This process was This process was This process Old callout.
Dry Film Soldermask was process. developed to allow developed as a allows the use of
standard offering. Due to the a rework able, modification from the via capture pads
limitations on feature size reliable via LPI tent, but to as SMT pads.
resolution and high thickness for interconnect. guarantee that 100%
SMT applications of the Dry of the vias are fully
Film Masks, this process is not tented.
readily available.
Assemblers may require
plugged vias due to vacuum
draw or to prevent paste wicking
into vias.
Pros One step application. Via barrels are Via barrels are 100% of the required Reduces routing If feasible, a copper
covered with covered with vias are tented. issues on external filled via increased
surface finish surface finish layers. Minimizes thermal conductivity of
metal. Test metal. Test access inductance. the via.
access is is available from
available from one side of card.
both sides of Rework able as
card. solder wicking is
not a concern.
Standard industry
process.
Cons Via tenting cannot be Possible wicking Perceived mask Additional process Multiple additional Reliability. Due to
guaranteed with LPI mask. of solder paste height issue at steps are required. process steps are standard plating
There are three common into the via. In assembly. Industry No surface finish is required, in chemistries deposition in
methods of applying LPI mask. the case of BGA max height of mask applied to the via. addition to dual high throw areas at a
Curtain, Spray and Screen rework, paste over copper has Via size restrictive. plating processes. greater rate than low
coating. Curtain and Spray loss due to been reduced over Control of rate of rise The extra plating throw areas (via barrel),
coating cannot ensure that the wicking into the the years from during curing is process has a the possibility of
via is tented both sides. Screen via is a result of 0.004” down to critical to ensure negative effect on plugging the surface of
coatings ability to tent is limited the localized 0.002”. 100% of volatiles are the minimum the via prior to the
by the hole size, surface tension thermal energy Required an evacuated. Failure feature size center is extremely high.
of the liquid mask, and board causing the LPI additional mask to control this can capable on the In this event, plating
thickness. mask to lift on application lead to soldermask external layers. chemistries will be
the short process, post smearing the This process is trapped in the via, and
distance surface finish surface during not advised in detrimentally effect the
between the ball application. Not assembly reflow. conjunction with long term reliability.
and via capture recommended for PTFE substrates.
pads. OSP or Tin finish.
If a via is
not tented both sides, chemical
entrapment from surface finish
preclean lines is probable. All
the finishes will be subject to a The surface copper
micro-etch process. The micro- thickness will also be
etchant that gets trapped in the exceptionally high if a
capped via will crystallize rapidly via could be reliably
This is not a
causing copper sulfate crystals. plated shut. This
concern at first
Over time, these crystals can process is not advised
pass assembly.
cause long term reliability until appropriate copper
issues. In the case on ENIG plating chemistries are
finish, the gold and small area of developed specifically
exposed copper near the cap for plating shut through
could form a galvanic cell, vias.
accelerating the etch process.
Option Primary LPI Solder Mask Vias Not Button Print Plugged Via Active Pad Plating Vias Shut
Tenting Vias Covered
Description
Cost No. No. No. Minimal High N/A
Adder
Comment NOT ADVISED for long ADVISED. ADVISED. Feasible ADVISED for NOT ADVISED
term reliability. Many board via in pad
designs are seen with vias applications only.
tented via primary mask. This
could be a result of a lack of
reliability data.
Feature Symbol 1.27mm/50mils 1.00mm/0.3937mils 0.8mm/0.031496 Discrete
BGA Pad bp 24 19 14
BGA Mask (Cu defined) bm bp+5 (4 min) bp+5 (4 min) bp+5 (4 min) pad+5 (4 min)
BGA Pad Dia. Dist. pd 70.71 55.67 44.54
Via Pad VP 22-25 22 20
Via Hole VH 10-12 10 8-10
Via Mask (Zit via) VM VH+5 (4 min) VH+5 (4 min) VH+5 (4 min)
BGA Mask Dam d 14.35-12.35 min 9.33-8.33 7.27-5.27
Via Button Print VB VH+15 (10 min) VH+15 (10 min) VH+15 (10 min)
Discrete Mask Dam d1 4 min
Via Button to Pad d2 10 min
** Based on 0.062 thick board, non solder mask defined bga pads and plastic bga packages. **
** Cu defined pad infers no mask will be present on the capture pad.**